KR20060099448A - Curable silicone rubber composition and method for producing composite molded product of liquid crystal polymer and silicone rubber - Google Patents
Curable silicone rubber composition and method for producing composite molded product of liquid crystal polymer and silicone rubber Download PDFInfo
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- KR20060099448A KR20060099448A KR1020060022514A KR20060022514A KR20060099448A KR 20060099448 A KR20060099448 A KR 20060099448A KR 1020060022514 A KR1020060022514 A KR 1020060022514A KR 20060022514 A KR20060022514 A KR 20060022514A KR 20060099448 A KR20060099448 A KR 20060099448A
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- silicone rubber
- rubber composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 229920002379 silicone rubber Polymers 0.000 title claims abstract description 42
- 239000004945 silicone rubber Substances 0.000 title claims abstract description 39
- 229920000106 Liquid crystal polymer Polymers 0.000 title claims abstract description 37
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 title claims abstract description 37
- 239000002131 composite material Substances 0.000 title claims description 5
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000004944 Liquid Silicone Rubber Substances 0.000 title claims description 3
- -1 acrylate compound Chemical class 0.000 claims abstract description 41
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 26
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 11
- 239000003054 catalyst Substances 0.000 claims abstract description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 7
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 19
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 16
- 125000003342 alkenyl group Chemical group 0.000 claims description 15
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 125000000962 organic group Chemical group 0.000 claims description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000006460 hydrolysis reaction Methods 0.000 claims description 3
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 claims description 3
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 230000007062 hydrolysis Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- HXEWWQYSYQOUSD-UHFFFAOYSA-N 2-[5-ethyl-5-(hydroxymethyl)-1,3-dioxan-2-yl]-2-methylpropan-1-ol Chemical compound CCC1(CO)COC(C(C)(C)CO)OC1 HXEWWQYSYQOUSD-UHFFFAOYSA-N 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 21
- 230000003287 optical effect Effects 0.000 abstract description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- 239000002671 adjuvant Substances 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000006038 hexenyl group Chemical group 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000003961 organosilicon compounds Chemical class 0.000 description 2
- 125000005375 organosiloxane group Chemical group 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
- JNFLTROQFYUPMK-UHFFFAOYSA-N 2-[2-ethyl-5-(hydroxymethyl)-1,3-dioxan-2-yl]-2-methylpropan-1-ol Chemical compound OCC(C)(C)C1(CC)OCC(CO)CO1 JNFLTROQFYUPMK-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 241000282472 Canis lupus familiaris Species 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical group [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical group FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- ZZAGLMPBQOKGGT-UHFFFAOYSA-N [4-[4-(4-prop-2-enoyloxybutoxy)benzoyl]oxyphenyl] 4-(4-prop-2-enoyloxybutoxy)benzoate Chemical class C1=CC(OCCCCOC(=O)C=C)=CC=C1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=C(OCCCCOC(=O)C=C)C=C1 ZZAGLMPBQOKGGT-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical group BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- 238000001444 catalytic combustion detection Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910052801 chlorine Chemical group 0.000 description 1
- 239000000460 chlorine Chemical group 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical class OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D15/00—Printed matter of special format or style not otherwise provided for
- B42D15/02—Postcards; Greeting, menu, business or like cards; Letter cards or letter-sheets
- B42D15/04—Foldable or multi-part cards or sheets
- B42D15/042—Foldable cards or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D15/00—Printed matter of special format or style not otherwise provided for
- B42D15/0073—Printed matter of special format or style not otherwise provided for characterised by shape or material of the sheets
- B42D15/008—Foldable or folded sheets
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
본 발명은The present invention
(A) 지방족 불포화 결합 함유 오르가노폴리실록산, (A) aliphatic unsaturated bond-containing organopolysiloxane,
(B) 오르가노히드로젠폴리실록산, (B) organohydrogenpolysiloxanes,
(C) 아크릴로일기 또는 메타크릴로일기를 1개 이상 함유하고, 상기 (A) 성분과 상용성인 (메트)아크릴레이트 화합물, (C) (meth) acrylate compound which contains one or more acryloyl group or methacryloyl group, and is compatible with the said (A) component,
(D) 백금족 금속계 촉매(D) Platinum Group Metal-Based Catalysts
를 함유하여 이루어지는 것을 특징으로 하는, 액정 중합체에 대한 접착용의 경화성 실리콘 고무 조성물에 관한 것이다. It contains the curable silicone rubber composition for adhesion | attachment to a liquid crystal polymer characterized by including.
본 발명의 실리콘 고무 조성물에 따르면, 지금까지 매우 접착 곤란하였던 액정 중합체(LCP)의 기판에 대하여 효과적인 접착성을 부여하는 경화물을 얻을 수 있다. 특히 본 발명의 실리콘 고무 조성물은 투명성이 우수한 경화물을 제공할 수 있기 때문에, 각종 광 디스플레이 패키지에 사용되는 액정 중합체 기판의 접착에 효과적이고, 각종 광 관련 디바이스용 기판에 대한 응용에 유용하다.According to the silicone rubber composition of this invention, the hardened | cured material which provides effective adhesiveness with respect to the board | substrate of the liquid crystal polymer (LCP) which was very difficult to adhere | attach until now can be obtained. Since the silicone rubber composition of this invention can provide the hardened | cured material excellent in transparency especially, it is effective for the adhesion of the liquid crystal polymer substrate used for various optical display packages, and is useful for the application to the board | substrates for various light related devices.
경화성 실리콘 고무 조성물, 액정 중합체, 실리콘 고무 Curable Silicone Rubber Composition, Liquid Crystal Polymer, Silicone Rubber
Description
[특허 문헌 1] 일본 특허 제3241338호 공보[Patent Document 1] Japanese Patent No. 3313238
[특허 문헌 2] 일본 특허 공개 (평)7-25987호 공보[Patent Document 2] Japanese Patent Application Laid-Open No. 7-25987
[특허 문헌 3] 일본 특허 공개 제2002-327126호 공보[Patent Document 3] Japanese Unexamined Patent Publication No. 2002-327126
[특허 문헌 4] 일본 특허 공개 제2002-338833호 공보[Patent Document 4] Japanese Patent Application Laid-Open No. 2002-338833
본 발명은, 특히 액정 중합체에 대한 접착에 이용되는 부가 경화형의 경화성 실리콘 고무 조성물에 관한 것이며, 열가소성 플라스틱인 액정 중합체(LCP)에 대한 접착성이 양호한 경화성 실리콘 고무 조성물에 관한 것이다. 본 발명은 또한 액정 중합체와 실리콘 고무와의 복합 성형체의 제조 방법에 관한 것이다. TECHNICAL FIELD This invention relates to the curable silicone rubber composition of the addition curing type especially used for adhesion | attachment to a liquid crystal polymer, and relates to the curable silicone rubber composition with favorable adhesiveness with respect to the liquid crystal polymer (LCP) which is a thermoplastic plastic. The present invention also relates to a method for producing a composite molded body of a liquid crystal polymer and a silicone rubber.
실리콘 고무 조성물은, 내후성, 내열성 등의 특성이나, 경도, 신도 등의 고무적 성질이 우수한 경화물을 형성하기 때문에 다양한 용도에 사용되고 있다. The silicone rubber composition is used in various applications because it forms a cured product having excellent properties such as weather resistance and heat resistance and rubber properties such as hardness and elongation.
또한, 최근 내열성이 우수한 열가소성 플라스틱으로서 LCP(액정 중합체)가 각종 패키지의 재료로서 검토되고 있다. 이것은 땜납 리플로우 온도가 높아졌기 때문에, 종래 많이 사용되었던 나일론계 수지는 충분한 내열성이 없고, 변색 등의 문제를 해결할 수 없기 때문이다. In recent years, LCP (liquid crystal polymer) has been considered as a material for various packages as a thermoplastic having excellent heat resistance. This is because the nylon resin, which has been used a lot since the solder reflow temperature is high, does not have sufficient heat resistance and cannot solve problems such as discoloration.
그러나, 종래의 실리콘 고무 조성물로는 LCP로 제조된 패키지에 견고하게 접착시킬 수 없고, 온도 사이클이나 고온 고습에서의 보존에서 쉽게 패키지와 실리콘 고무의 계면에서 박리가 발생하는 결점이 다수 발생하고 있다. However, the conventional silicone rubber composition cannot firmly adhere to a package made of LCP, and many defects occur in that peeling occurs at the interface between the package and the silicone rubber easily in a temperature cycle or storage at high temperature and high humidity.
일반적으로, 부가 경화형의 실리콘 고무 조성물에 있어서는, 각종 실란 커플링제의 첨가에 의해 접착의 향상을 도모하고 있지만, LCP는 종래의 접착 부여제로는 효과가 없고, 일부 첨가제의 배합에 의해 어느 정도의 접착성을 향상시킨 실리콘 고무 재료가 있지만, 실용상 접착성이 충분하다고는 말할 수 없으며, 더구나 투명하게 되지 않기 때문에 광 장치용의 용도 등에는 사용할 수 없었다. In general, in the addition-curable silicone rubber composition, the adhesion is improved by the addition of various silane coupling agents, but LCP has no effect as a conventional tackifier, and the adhesion to some extent by the addition of some additives. Although there is a silicone rubber material having improved properties, it cannot be said that adhesiveness is sufficient in practical use, and furthermore, since it is not transparent, it cannot be used for applications for optical devices.
또한, 본 발명에 관련된 종래 기술로서, 하기 문헌을 들 수 있다. Moreover, the following literature is mentioned as a prior art concerning this invention.
[특허 문헌 1] 일본 특허 제3241338호 공보[Patent Document 1] Japanese Patent No. 3313238
[특허 문헌 2] 일본 특허 공개 (평)7-25987호 공보[Patent Document 2] Japanese Patent Application Laid-Open No. 7-25987
[특허 문헌 3] 일본 특허 공개 제2002-327126호 공보[Patent Document 3] Japanese Unexamined Patent Publication No. 2002-327126
[특허 문헌 4] 일본 특허 공개 제2002-338833호 공보.[Patent Document 4] Japanese Unexamined Patent Application Publication No. 2002-338833.
본 발명은 상기 사정을 감안하여 이루어진 것이며, LCP에 대하여 충분한 접착 강도와 투명성을 갖는 경화물을 제공하는, 액정 중합체에 대한 접착용의 부가 경화형의 실리콘 고무 조성물, 및 액정 중합체와 실리콘 고무와의 복합 성형체의 제조 방법을 제공하는 것을 목적으로 한다. This invention is made | formed in view of the said situation, and the addition hardening type silicone rubber composition for adhesion | attachment to a liquid crystal polymer which provides the hardened | cured material which has sufficient adhesive strength and transparency with respect to LCP, and a composite of a liquid crystal polymer and a silicone rubber It aims at providing the manufacturing method of a molded object.
본 발명자들은 상기 목적을 달성하기 위해서 예의 검토한 결과, (A) 알케닐기 등의 지방족 불포화 결합 함유 오르가노폴리실록산, (B) 오르가노히드로젠폴리실록산, (C) 아크릴로일기 또는 메타크릴로일기를 1개 이상 함유하고, 상기 (A) 성분과 상용성인 (메트)아크릴레이트 화합물 및 (D) 백금족 금속계 촉매를 함유하여 이루어지는 실리콘 고무 조성물이, 매우 접착이 곤란한 열가소성 플라스틱인 액정 중합체(LCP)의 기판에 대하여 효과적인 접착성을 부여할 수 있고, 그의 경화물이 충분한 투명성을 갖는 것을 발견하여, 본 발명을 완성하기에 이르렀다. MEANS TO SOLVE THE PROBLEM As a result of earnestly examining in order to achieve the said objective, (A) aliphatic unsaturated bond containing organopolysiloxane, such as an alkenyl group, (B) organohydrogenpolysiloxane, (C) acryloyl group, or methacryloyl group The board | substrate of the liquid crystal polymer (LCP) which is a thermoplastic plastic which contains one or more, and the silicone rubber composition which contains the (meth) acrylate compound compatible with the said (A) component, and (D) platinum group metal type catalyst is very difficult to adhere | attach. Effective adhesiveness can be provided, and the hardened | cured material was found to have sufficient transparency, and came to complete this invention.
따라서, 본 발명은 Therefore, the present invention
(A) 지방족 불포화 결합 함유 오르가노폴리실록산, (A) aliphatic unsaturated bond-containing organopolysiloxane,
(B) 오르가노히드로젠폴리실록산, (B) organohydrogenpolysiloxanes,
(C) 아크릴로일기 또는 메타크릴로일기를 1개 이상 함유하고, 상기 (A) 성분과 상용성인 (메트)아크릴레이트 화합물, (C) (meth) acrylate compound which contains one or more acryloyl group or methacryloyl group, and is compatible with the said (A) component,
(D) 백금족 금속계 촉매(D) Platinum Group Metal-Based Catalysts
를 함유하여 이루어지는 것을 특징으로 하는, 액정 중합체에 대한 접착용의 경화성 실리콘 고무 조성물, 및 액정 중합체 기판 상에 상기 실리콘 고무 조성물을 적층하여 경화시키는 것에 의한 액정 중합체와 실리콘 고무와의 복합 성형체의 제조 방법을 제공한다. A curable silicone rubber composition for adhesion to a liquid crystal polymer, and a method for producing a composite molded body of a liquid crystal polymer and silicone rubber by laminating and curing the silicone rubber composition on a liquid crystal polymer substrate, comprising To provide.
<발명을 실시하기 위한 최선의 형태>Best Mode for Carrying Out the Invention
본 발명의 베이스 중합체 성분인 지방족 불포화 결합 함유 오르가노폴리실록산(A)는, 1 분자 중에 2개 이상의 비닐기, 알릴기 등의 탄소수 2 내지 8, 특히 2 내지 6의 알케닐기로 대표되는 지방족 불포화 결합을 바람직하게는 분자 중에 2개 이상 갖는 것이 바람직하다. 이 경우, (A) 성분으로서는, (A-1) 분자 중에 알케닐기를 2개 이상 가지고, 주쇄가 디오르가노실록산 단위의 반복을 포함하며, 분자쇄 양쪽 말단이 트리오르가노실록시기로 봉쇄된 직쇄상 오르가노폴리실록산과, (A-2) 분자 중에 알케닐기를 2개 이상 갖는 레진 구조(즉, 삼차원 메쉬상 구조)의 오르가노폴리실록산을 들 수 있고, (A-1) 성분, (A-2) 성분을 각각 단독으로 사용할 수도 있지만, 특히 (A-1) 성분과 (A-2) 성분을 병용하는 것이 바람직하다. The aliphatic unsaturated bond-containing organopolysiloxane (A) which is the base polymer component of the present invention is an aliphatic unsaturated bond represented by an alkenyl group having 2 to 8 carbon atoms, particularly 2 to 6 carbon atoms such as two or more vinyl groups and allyl groups in one molecule. It is preferable to have two or more in the molecule preferably. In this case, as the component (A), a molecule having two or more alkenyl groups in the molecule (A-1), the main chain including repetitions of diorganosiloxane units, and both ends of the molecular chain sealed with a triorganosiloxy group Organopolysiloxanes of a chain organopolysiloxane and a resin structure having two or more alkenyl groups in the (A-2) molecule (that is, a three-dimensional mesh-like structure), and include (A-1) component and (A-2 The component) may be used alone, but it is particularly preferable to use the component (A-1) and the component (A-2) together.
여기서, (A-1) 성분으로서는, 점도가 23 ℃에서 10 내지 1,000,000 mPaㆍs, 특히 100 내지 100,000 mPaㆍs인 오르가노폴리실록산인 것이 바람직하고, 그 중에서도 하기 화학식 1로 표시되는 분자쇄 양쪽 말단의 규소 원자 상에 각각 1개 이상의 알케닐기를 갖는 직쇄상 오르가노폴리실록산이며, 상기에서도 서술한 바와 같이, 23 ℃에 있어서의 점도가 10 내지 1,000,000 mPaㆍs인 것이 작업성, 경화성 등에서 바람직한 것이다. 또한, 점도는 회전 점도계에 의한 측정값이다. 또한, 상기 직쇄상 오르가노폴리실록산은 소량의 분지상 구조(삼관능성 실록산 단위)를 분자쇄 중에 함유하는 것일 수도 있다. The component (A-1) is preferably an organopolysiloxane having a viscosity of 10 to 1,000,000 mPa · s, particularly 100 to 100,000 mPa · s, at 23 ° C., and above all, both ends of the molecular chain represented by the following general formula (1). It is a linear organopolysiloxane which has 1 or more alkenyl groups on the silicon atom of each, and as mentioned above, it is preferable at workability, sclerosis | hardenability, etc. as the viscosity in 23 degreeC is 10-1,000,000 mPa * s. In addition, a viscosity is a measured value by a rotational viscometer. The linear organopolysiloxane may also contain a small amount of branched structure (trifunctional siloxane units) in the molecular chain.
(식 중, R1은 서로 동일하거나 또는 상이하며 비치환 또는 치환 1가 탄화수소기이고, R2는 서로 동일하거나 또는 상이하며 지방족 불포화 결합을 갖지 않는 비치환 또는 치환 1가 탄화수소기이고, k, m은 0 또는 양의 정수이며, k+m은 이 오르가노폴리실록산의 23 ℃에서의 점도를 10 내지 1,000,000 mPaㆍs로 하는 수이다.)(Wherein R 1 is the same or different from each other and is an unsubstituted or substituted monovalent hydrocarbon group, R 2 is the same or different from each other and is an unsubstituted or substituted monovalent hydrocarbon group having no aliphatic unsaturated bonds, k, m is 0 or a positive integer and k + m is the number which makes the viscosity in this organopolysiloxane at 23 degreeC from 10 to 1,000,000 mPa * s.)
여기서, R1의 1가 탄화수소기로서는, 탄소수 1 내지 10, 특히 1 내지 6의 것이 바람직하고, 구체적으로는 메틸기, 에틸기, 프로필기, 이소프로필기, 부틸기, 이소부틸기, tert-부틸기, 펜틸기, 네오펜틸기, 헥실기, 시클로헥실기, 옥틸기, 노닐기, 데실기 등의 알킬기, 페닐기, 톨릴기, 크실릴기, 나프틸기 등의 아릴기, 벤질기, 페닐에틸기, 페닐프로필기 등의 아랄킬기, 비닐기, 알릴기, 프로페닐기, 이소프로페닐기, 부테닐기, 헥세닐기, 시클로헥세닐기, 옥테닐기 등의 알케닐기나, 이들 기의 수소 원자의 일부 또는 전부를 불소, 브롬, 염소 등의 할로겐 원자, 시아노기 등으로 치환한 것, 예를 들면 클로로메틸기, 클로로프로필기, 브로모에틸기, 트리플루오로프로필기 등의 할로겐 치환 알킬기나 시아노에틸기 등을 들 수 있다. Here, as the monovalent hydrocarbon group of R 1 , those having 1 to 10 carbon atoms, particularly 1 to 6 carbon atoms, are preferable, and specifically methyl, ethyl, propyl, isopropyl, butyl, isobutyl and tert-butyl groups Aryl groups such as phenyl, tolyl, xylyl and naphthyl groups, benzyl, phenylethyl and phenyl, such as alkyl groups such as pentyl, neopentyl, hexyl, cyclohexyl, octyl, nonyl and decyl groups Aralkyl groups such as aralkyl groups such as propyl groups, vinyl groups, allyl groups, propenyl groups, isopropenyl groups, butenyl groups, hexenyl groups, cyclohexenyl groups and octenyl groups, and some or all of the hydrogen atoms of these groups Substituted by halogen atoms, such as fluorine, bromine, and chlorine, and a cyano group, For example, halogen substituted alkyl groups, such as a chloromethyl group, a chloropropyl group, a bromoethyl group, and a trifluoropropyl group, cyanoethyl group, etc. are mentioned. have.
또한, R2의 1가 탄화수소기로서도, 탄소수 1 내지 10, 특히 1 내지 6의 것이 바람직하고, 상기 R1의 구체예와 동일한 것을 예시할 수 있지만, 단, 알케닐기는 포함되지 않는다. Moreover, as a monovalent hydrocarbon group of R <2> , a C1-C10, especially 1-6 are preferable, and the same thing as the specific example of said R <1> can be illustrated, but an alkenyl group is not contained.
k, m은 일반적으로는 0<k+m≤10,000을 만족시키는 0 또는 양의 정수이고, 바람직하게는 5≤k+m≤2,000, 보다 바람직하게는 10≤k+m≤1,200이며, 0<k/(k+m)≤0.2, 바람직하게는 0<k/(k+m)≤0.1을 만족시키는 정수이다. k and m are generally 0 or a positive integer satisfying 0 <k + m≤10,000, preferably 5≤k + m≤2,000, more preferably 10≤k + m≤1,200, and 0 < k / (k + m) ≦ 0.2, preferably an integer satisfying 0 <k / (k + m) ≦ 0.1.
(A-1) 성분으로서 구체적으로는, 하기의 것을 예시할 수 있다. Specific examples of the component (A-1) include the following.
(식 중, t는 8 내지 2,000의 정수이다.)(Wherein t is an integer of 8 to 2,000.)
(식 중, k, m은 상술한 바와 같다.)(Wherein k and m are as described above.)
(A-2) 성분의 레진 구조의 오르가노폴리실록산(실리콘 레진)도 (A) 성분으로서 그 자체 단독으로 또는 상기 (A-1) 성분의 직쇄상 오르가노폴리실록산과 병용하여 사용할 수 있다. The organopolysiloxane (silicone resin) of the resin structure of the component (A-2) can also be used alone or in combination with the linear organopolysiloxane of the component (A-1) as the component (A).
이 레진 구조(즉, 삼차원 메쉬상 구조)의 오르가노폴리실록산(A-2)는, SiO2 단위, R3 nR4 pSiO0 .5 단위 및 R3 qR4 rSiO0 .5 단위로 이루어지는 레진 구조의 오르가노폴리실록산(단, 상기 화학식에 있어서, R3은 비닐기 또는 알릴기이고, R4는 지방족 불포화 결합을 포함하지 않는 1가 탄화수소기이고, n은 2 또는 3이고, p는 0 또는 1이 며, n+p=3이고, q는 0 또는 1이고, r은 2 또는 3이며, q+r=3임)인 것이 바람직하다. The organopolysiloxane (A-2) of the resin structure (namely, three-dimensional mesh-like structure), with SiO 2 units, R 3 n R 4 p SiO 0 .5 units and R 3 q R 4 r SiO 0 .5 units Organopolysiloxane having a resin structure, provided that R 3 is a vinyl group or an allyl group, R 4 is a monovalent hydrocarbon group containing no aliphatic unsaturated bonds, n is 2 or 3, and p is 0 or 1, n + p = 3, q is 0 or 1, r is 2 or 3, and q + r = 3.
또한, R4의 1가 탄화수소기로서는, 상기 R2와 동일한 탄소수 1 내지 10, 특히 1 내지 6의 것을 들 수 있다. Moreover, as a monovalent hydrocarbon group of R <4> , the C1-C10 same thing as said R <2> , especially the thing of 1-6 are mentioned.
여기서, SiO2 단위를 a 단위, R3 nR4 pSiO0 .5 단위를 b 단위, R3 qR4 rSiO0 .5 단위를 c 단위라 할 경우, 몰비로서 Here, the SiO 2 unit as a unit, R 3 n R 4 p SiO 0 .5 when considered in units of b units, R 3 q R 4 r SiO 0 .5 units of the unit c, the molar ratio
(b+c)/a=0.3 내지 3, 특히 0.7 내지 1(b + c) /a=0.3 to 3, in particular 0.7 to 1
c/a=0.01 내지 1, 특히 0.07 내지 0.15c / a = 0.01 to 1, in particular 0.07 to 0.15
인 것이 바람직하고, 또한 이 오르가노폴리실록산은, 중량 평균 분자량이 500 내지 10,000의 범위인 것이 바람직하다. 또한, 중량 평균 분자량은 겔 투과 크로마토그래피(GPC)를 이용한 폴리스티렌 환산에 의한 측정값이다. It is preferable that it is, and it is preferable that this organopolysiloxane has a weight average molecular weight of 500-10,000. In addition, a weight average molecular weight is the measured value by polystyrene conversion using gel permeation chromatography (GPC).
또한, 이 레진 구조의 오르가노폴리실록산은, 상기 a 단위, b 단위, c 단위에 부가하여, 이관능성 실록산 단위나 삼관능성 실록산 단위(즉, 오르가노실세스퀴옥산 단위)를 본 발명의 목적을 손상시키지 않는 범위에서 소량 더 함유하는 것일 수도 있다. In addition, the organopolysiloxane of the resin structure, in addition to the a unit, b unit, and c unit, difunctional siloxane unit or trifunctional siloxane unit (that is, organosilsesquioxane unit) impairs the object of the present invention It may contain a small amount further in the range which does not make it.
이러한 레진 구조의 오르가노폴리실록산은, 각 단위원이 되는 실란 또는 실록산 화합물을 상기 몰비율이 되도록 조합, 예를 들면 산의 존재하에 공가수분해를 행함으로써 용이하게 합성할 수 있다. The organopolysiloxane of such a resin structure can be synthesize | combined easily by combining silane or siloxane compound which becomes each unit member so that the said molar ratio may be carried out by co-hydrolysis in presence of an acid, for example.
여기서, 상기 a 단위원으로서는, 규산소다, 알킬실리케이트, 폴리알킬실리케 이트, 사염화규소 등을 예시할 수 있다. Here, as said a unit member, a sodium silicate, an alkyl silicate, a polyalkyl silicate, silicon tetrachloride, etc. can be illustrated.
또한, b 단위원으로서는, 하기의 것을 예시할 수 있다. In addition, the following can be illustrated as a b unit member.
또한, c 단위원으로서는, 하기의 것을 예시할 수 있다. In addition, the following can be illustrated as a c unit member.
상기 레진 구조의 오르가노폴리실록산(A-2)는 경화물의 물리적 강도 및 표면의 점착성을 개선하기 위해서 배합되는 것이고, 상기 (A) 성분의 합계량에 대하여 20 내지 70 질량%, 특히 30 내지 60 질량% 함유하도록 배합하는 것이 바람직하고, 레진 구조의 오르가노폴리실록산의 배합량이 너무 적으면, 상기 효과가 충분히 달성되지 않고, 너무 많으면 조성물의 점도가 현저히 높아지거나, 경화물에 균열이 발생하기 쉬워지는 등의 불리함이 생길 우려가 있다. The organopolysiloxane (A-2) of the said resin structure is mix | blended in order to improve the physical strength of the hardened | cured material, and the adhesiveness of a surface, It is 20-70 mass% with respect to the total amount of the said (A) component, Especially 30-60 mass% It is preferable to mix | blend so that it may contain, and when the compounding quantity of organopolysiloxane of resin structure is too small, the said effect is not fully achieved, when too much, the viscosity of a composition will become high remarkably, or a crack will be easy to generate | occur | produce in hardened | cured material, etc. There is a risk of disadvantage.
(B) 성분인 오르가노히드로젠폴리실록산은 가교제로서 작용하는 것이고, 상기 성분 중의 SiH기와 (A) 성분 중의 비닐기 등의 알케닐기가 부가 반응함으로써 경화물을 형성하는 것이다. 이러한 오르가노히드로젠폴리실록산은, 1 분자 중에, 규소 원자에 결합된 수소 원자(즉, SiH기)를 2개 이상, 특히 3개 이상 갖는 것이면 어느 것일 수도 있지만, 특히 하기 평균 조성 화학식 2로 표시되고, 1 분자 중에, 규소 원자에 결합된 수소 원자(SiH기)를 2개 이상(통상 2 내지 300개), 바람직하게는 3개 이상(예를 들면 3 내지 300개, 보다 바람직하게는 3 내지 150개 정도) 갖는 것을 들 수 있다. The organohydrogenpolysiloxane which is (B) component acts as a crosslinking agent, and hardened | cured material is formed by addition reaction of the SiH group in the said component, and alkenyl groups, such as the vinyl group in (A) component. Such organohydrogenpolysiloxane may be any one having two or more, in particular three or more, hydrogen atoms (ie, SiH groups) bonded to silicon atoms in one molecule, and in particular, represented by the following average compositional formula (2) In one molecule, two or more hydrogen atoms (SiH groups) bonded to silicon atoms (usually 2 to 300), preferably 3 or more (for example, 3 to 300, more preferably 3 to 150) Dogs).
(식 중, R5는 지방족 불포화 결합을 함유하지 않는 동일하거나 또는 상이하며 비치환 또는 치환의 1가 탄화수소기이고, a 및 b는 0.001≤a<2, 0.7≤b≤2, 또한 0.8≤a+b≤3을 만족시키는 수이다.)(Wherein R 5 is the same or different and does not contain an aliphatic unsaturated bond and is an unsubstituted or substituted monovalent hydrocarbon group, a and b are 0.001 ≦ a <2, 0.7 ≦ b ≦ 2, and 0.8 ≦ a A number satisfying + b≤3.)
여기서, 상기 화학식 2 중의 R5는, 지방족 불포화 결합을 함유하지 않는 동일하거나 또는 상이하며 비치환 또는 치환의 탄소수 1 내지 10, 특히 탄소수 1 내지 7의 1가 탄화수소기인 것이 바람직하고, 예를 들면 메틸기 등의 저급 알킬기, 페닐기 등의 아릴기, 상술한 화학식 1의 치환기 R2로 예시된 것을 들 수 있다. 또한, a 및 b는 0.001≤a<2, 0.7≤b≤2, 또한 0.8≤a+b≤3을 만족시키는 수이고, 바람직하게는 0.05≤a≤1, 0.8≤b≤2, 또한 1≤a+b≤2.7이 되는 수이다. 규소 원자에 결합된 수소 원자의 위치는 특별히 제약은 없고, 분자의 말단일 수도 있고 도중일 수도 있다. Herein, R 5 in the general formula (2) is the same or different and does not contain an aliphatic unsaturated bond, and is preferably an unsubstituted or substituted C1-C10 monovalent hydrocarbon group having 1 to 7 carbon atoms, for example, a methyl group. an aryl group of a lower alkyl group, a phenyl group and the like, such as, those illustrated as substituents R 2 in the above formula (I). A and b are numbers satisfying 0.001 ≦ a <2, 0.7 ≦ b ≦ 2, and 0.8 ≦ a + b ≦ 3, preferably 0.05 ≦ a ≦ 1, 0.8 ≦ b ≦ 2, and 1 ≦ It is a number which becomes a + b <2.7. There is no restriction | limiting in particular in the position of the hydrogen atom couple | bonded with the silicon atom, It may be the terminal of a molecule | numerator, or may be halfway.
상기 오르가노히드로젠폴리실록산으로서는, 트리스(디메틸히드로젠실록시)메틸실란, 트리스(디메틸히드로젠실록시)페닐실란, 1,1,3,3-테트라메틸디실록산, 1,3,5,7-테트라메틸시클로테트라실록산, 양쪽 말단 트리메틸실록시기 봉쇄 메틸히드로젠폴리실록산, 양쪽 말단 트리메틸실록시기 봉쇄 디메틸실록산ㆍ메틸히드로젠실록산 공중합체, 양쪽 말단 디메틸히드로젠실록시기 봉쇄 디메틸폴리실록산, 양쪽 말단 디메틸히드로젠실록시기 봉쇄 디메틸실록산ㆍ메틸히드로젠실록산 공중합체, 양쪽 말단 트리메틸실록시기 봉쇄 메틸히드로젠실록산ㆍ디페닐실록산 공중합체, 양쪽 말단 트리메틸실록시기 봉쇄 메틸히드로젠실록산ㆍ디페닐실록산ㆍ디메틸실록산 공중합체, (CH3)2HSiO1 /2 단위와 SiO4 /2 단위로 이루어지는 공중합체, (CH3)2HSiO1 /2 단위와 SiO4 /2 단위와 (C6H5)SiO3 /2 단위로 이루어지는 공중합체 등을 들 수 있다. Examples of the organohydrogenpolysiloxane include tris (dimethylhydrogensiloxy) methylsilane, tris (dimethylhydrogensiloxy) phenylsilane, 1,1,3,3-tetramethyldisiloxane, 1,3,5,7 Tetramethylcyclotetrasiloxane, both terminal trimethylsiloxy group blocking methylhydrogenpolysiloxane, both terminal trimethylsiloxy group blocking dimethylsiloxane and methylhydrogensiloxane copolymer, both terminal dimethylhydrogensiloxy group blocking dimethylpolysiloxane, both terminal dimethylhydrogen Siloxy group blocking dimethylsiloxane, methyl hydrogen siloxane copolymer, both terminal trimethylsiloxy group blocking methyl hydrogen siloxane, diphenyl siloxane copolymer, both terminal trimethylsiloxy group blocking methyl hydrogen siloxane, diphenyl siloxane, dimethylsiloxane copolymer, (CH 3) 2 HSiO 1/2 units and copolymers composed of SiO 4/2 units, (CH 3) 2 HSiO 1 /2 units and SiO 4/2 units and (C 6 H 5) there may be mentioned copolymers consisting of SiO 3/2 units.
또한, 하기 구조로 표시되는 것과 같은 화합물도 사용할 수 있다. Moreover, the compound like what is represented by the following structure can also be used.
이 오르가노히드로젠폴리실록산의 분자 구조는 직쇄상, 환상, 분지상, 삼차원 메쉬상 구조 중 어느 것이어도 좋지만, 1 분자 중의 규소 원자의 수(또는 중합도)는 3 내지 1,000, 특히 3 내지 300 정도의 것을 사용할 수 있다. The molecular structure of the organohydrogenpolysiloxane may be any of linear, cyclic, branched and three-dimensional mesh structures, but the number (or degree of polymerization) of silicon atoms in one molecule is 3 to 1,000, especially about 3 to 300. Can be used.
이러한 오르가노히드로젠폴리실록산은 통상 R5SiHCl2, (R5)3SiCl, (R5)2SiCl2, (R5)2SiHCl(R5은 상기와 같음)과 같은 클로로실란을 가수분해하고, 가수분해하여 얻어진 실록산을 평형화함으로써 얻을 수 있다. Such organohydrogenpolysiloxanes typically hydrolyze chlorosilanes such as R 5 SiHCl 2 , (R 5 ) 3 SiCl, (R 5 ) 2 SiCl 2 , (R 5 ) 2 SiHCl (R 5 is as above) and Can be obtained by equilibrating the siloxane obtained by hydrolysis.
또한, 이 오르가노히드로젠폴리실록산의 배합량은 상기 (A) 성분의 경화 유효량이고, 특히 그의 SiH기가 (A) 성분 중의 알케닐기(예를 들면 비닐기)의 합계량당 0.1 내지 4.0, 특히 바람직하게는 1.0 내지 3.0, 더욱 바람직하게는 1.2 내지 2.8의 몰비로 사용되는 것이 바람직하다. 0.1 미만이면 경화 반응이 진행되지 않 아 실리콘 고무 경화물을 얻는 것이 곤란하고, 4.0을 초과하면, 미반응의 SiH기가 경화물 중에 다량으로 잔존하기 때문에, 고무 물성이 경시적으로 변화하는 원인이 되는 경우가 생긴다. Moreover, the compounding quantity of this organohydrogenpolysiloxane is the hardening effective amount of the said (A) component, Especially its SiH group is 0.1-4.0 per total amount of the alkenyl group (for example, vinyl group) in (A) component, Especially preferably, It is preferably used in a molar ratio of 1.0 to 3.0, more preferably 1.2 to 2.8. If it is less than 0.1, hardening reaction does not advance and it is difficult to obtain a silicone rubber hardened | cured material, and when it exceeds 4.0, since unreacted SiH group remains in a large quantity in hardened | cured material, rubber property becomes a cause which changes with time. There is a case.
(C) 성분은 아크릴로일기(CH2=CH-CO-) 또는 메타크릴로일기(CH2=C(CH3)-CO-)를 1개 이상 함유하고, 상기 (A) 성분과 상용성인 (메트)아크릴 화합물이다. 또한, 이 (메트)아크릴 화합물은 단량체일 수도 있고, 또는 분자 중에 1개 또는 2개 이상의 잔존 (메트)아크릴로일기를 갖는, 상기 (메트)아크릴 화합물의 올리고머, 중합체일 수도 있고, 또한 폴리에스테르, 폴리에테르, 폴리카르보네이트 화합물 등의 한쪽 말단 및(또는) 양쪽 말단이 (메트)아크릴로일기로 봉쇄된 것일 수도 있지만, (A) 성분인 지방족 불포화 결합 함유 오르가노폴리실록산과 상용하여 투명해질 수 있어야 한다. 여기서, (메트)아크릴 화합물이란, 아크릴 화합물 또는 메타크릴 화합물인 것을 나타낸다. Component (C) acryloyl group (CH 2 = CH-CO-) or meta group in methacrylate (CH 2 = C (CH 3 ) -CO-) containing at least one, and said component (A) are compatible with It is a (meth) acryl compound. In addition, the (meth) acryl compound may be a monomer or may be an oligomer or polymer of the (meth) acryl compound having one or two or more remaining (meth) acryloyl groups in a molecule, or may be a polyester. Although one terminal and / or both ends of a polyether, polycarbonate compound, etc. may be sealed with a (meth) acryloyl group, it becomes compatible with the aliphatic unsaturated bond containing organopolysiloxane which is (A) component, and becomes transparent. It should be possible. Here, a (meth) acryl compound represents an acryl compound or a methacryl compound.
상기 (C) 성분으로서는, 특히 하기의 것을 예시할 수 있다. Especially as said (C) component, the following can be illustrated.
예를 들면, 라우릴(메트)아크릴레이트, 2-히드록시-3-페녹시프로필(메트)아크릴레이트, 디에틸렌글리콜 모노(메트)아크릴레이트, 트리에틸렌글리콜 모노(메트)아크릴레이트, 테트라에틸렌글리콜 모노(메트)아크릴레이트 등의 1 관능성 (메트)아크릴레이트, 디에틸렌글리콜 디(메트)아크릴레이트, 트리에틸렌글리콜 디(메트)아크릴레이트, 테트라에틸렌글리콜 디(메트)아크릴레이트, 5-에틸-2-(2-히드록시-1,1-디메틸에틸)-5-(히드록시메틸)-1,3-디옥산의 디아크릴산에스테르(상표명: 카야랏드 R-604, 닛본 가야꾸 제조) 또는 그의 대응 메타크릴산에스테르, 2-프로페노익산(옥타히드로-4,7-메탄-1H-인데니딜)비스(메틸렌)에스테르(상표명: 카야랏드 R-684, 닛본 가야꾸 제조) 또는 그의 대응 메타크릴산에스테르 등의 2 관능성 (메트)아크릴레이트 등의, 분자 중에 규소 원자를 함유하지 않고, 또한 에스테르 부분이, 히드록실기 및(또는) 에테르 결합 산소 원자를 함유할 수도 있고, 탄소수 4 내지 30, 바람직하게는 8 내지 20 정도의 1가 또는 2가 탄화수소기이고, 1 관능성 또는 2 관능성이며, 상기 (A) 성분 및(또는) (B) 성분과 상용 가능하고, 투명한 조성물을 제공할 수 있는 (메트)아크릴레이트 화합물이 적합한 것이다. For example, lauryl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, diethylene glycol mono (meth) acrylate, triethylene glycol mono (meth) acrylate, tetraethylene Monofunctional (meth) acrylates such as glycol mono (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, 5- Diacrylic acid ester of ethyl-2- (2-hydroxy-1,1-dimethylethyl) -5- (hydroxymethyl) -1,3-dioxane (trade name: Kayarard R-604, manufactured by Nippon Kayaku) Or its corresponding methacrylic acid ester, 2-propenoic acid (octahydro-4,7-methane-1H-indenylyl) bis (methylene) ester (trade name: Kayarard R-684, manufactured by Nippon Kayaku) or its corresponding In the molecule, such as bifunctional (meth) acrylates, such as methacrylic acid ester, It does not contain an atom, and the ester part may also contain a hydroxyl group and / or an ether bond oxygen atom, and is a monovalent or divalent hydrocarbon group having 4 to 30 carbon atoms, preferably about 8 to 20 carbon atoms, The (meth) acrylate compound which is monofunctional or bifunctional, is compatible with the said (A) component and / or (B) component, and can provide a transparent composition is suitable.
(C) 성분의 배합량은 (A) 성분과 (B) 성분의 합계 100 질량부에 대하여 바람직하게는 0.01 내지 10 질량부, 보다 바람직하게는 0.1 내지 5 질량부 정도로 배합할 수 있다. (C) 성분의 배합량이 너무 적으면 기재, 특히 액정 중합체에 대한 접착성이 열악해지는 경우가 있고, 너무 많으면 경화물의 경도나 표면 점착성에 악영향을 주는 경우가 있다. The blending amount of the component (C) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass based on 100 parts by mass in total of the component (A) and the component (B). When the compounding quantity of (C) component is too small, adhesiveness with respect to a base material, especially a liquid crystal polymer may become inferior, and when too large, it may adversely affect the hardness and surface adhesiveness of hardened | cured material.
본 발명의 조성물의 경화 촉매인 (D) 성분의 백금족 금속계 촉매는 하기에 나타내는 것과 같은 것이다. The platinum group metal catalyst of (D) component which is a hardening catalyst of the composition of this invention is as showing below.
이 촉매 성분은, 본 발명의 조성물의 부가 경화 반응을 일으키기 위해서 배합되는 것이고, 백금계, 팔라듐계, 로듐계의 것이 있지만, 비용 등의 견지로부터 백금, 백금흑, 염화백금산 등의 백금계의 것, 예를 들면 H2PtCl6ㆍmH2O, K2PtCl6, KHPtCl6ㆍmH2O, K2PtCl4, K2PtCl4ㆍmH2O, PtO2ㆍmH2O(m은 양의 정수) 등이나, 이들과 올레핀 등의 탄화수소, 알코올 또는 비닐기 함유 오르가노폴리실록산과의 착체 등을 예시할 수 있고, 이들은 단독으로 또는 2종 이상의 조합으로 사용할 수 있다. 이들 촉매 성분의 배합량은 소위 촉매량일 수 있고, 통상 상기 (A) 내지 (C) 성분의 합계량에 대하여 백금족 금속 환산(질량)으로 0.1 내지 1,000 ppm, 바람직하게는 0.5 내지 200 ppm의 범위에서 사용된다. This catalyst component is mix | blended in order to produce the addition hardening reaction of the composition of this invention, Although it is a platinum type, a palladium type, a rhodium type thing, it is platinum type, such as platinum, platinum black, chloroplatinic acid, etc. from a viewpoint of cost, etc., for example, H 2 PtCl 6 and mH 2 O, K 2 PtCl 6 , KHPtCl 6 and mH 2 O, K 2 PtCl 4 , K 2 PtCl 4 and mH 2 O, PtO 2 and mH 2 O (m is a positive integer And the like, and a complex of these and hydrocarbons such as olefins, alcohols or vinyl group-containing organopolysiloxanes, and the like, and these can be used alone or in combination of two or more thereof. The blending amount of these catalyst components may be a so-called catalytic amount, and is usually used in the range of 0.1 to 1,000 ppm, preferably 0.5 to 200 ppm, in terms of platinum group metal (mass) relative to the total amount of the components (A) to (C). .
본 발명의 조성물에는, 접착성을 더욱 부여하기 위해서, (E) 성분으로서 접착 보조제를 배합할 수 있다. 이러한 접착 보조제로서, 1 분자 중에, 규소 원자에 결합된 수소 원자(SiH기), 규소 원자에 결합된 알케닐기(예를 들면 Si-CH=CH2기), 알콕시실릴기(예를 들면 트리메톡시실릴기), 에폭시기(예를 들면 글리시독시프로필기, 3,4-에폭시시클로헥실에틸기)로부터 선택되는 관능성기를 2종 이상, 바람직하게는 2 또는 3종 함유하는 직쇄상 또는 환상의 규소 원자수 4 내지 50개, 바람직하게는 4 내지 20개 정도의 오르가노실록산 올리고머 또는 하기 화학식 3으로 표시되는 오르가노옥시실릴 변성 이소시아누레이트 화합물 및(또는) 그의 가수분해 축합물(오르가노실록산 변성 이소시아누레이트 화합물) 등의 접착 보조제를 임의 성분으로서 필요에 따라서 배합하는 것이 바람직하다. In order to provide adhesiveness further, the composition of this invention can mix | blend an adhesion | attachment adjuvant as (E) component. As such an adhesion aid, in one molecule, a hydrogen atom (SiH group) bonded to a silicon atom, an alkenyl group (for example, Si-CH = CH 2 group) bonded to a silicon atom, an alkoxysilyl group (for example, trimeth) Linear or cyclic silicon containing two or more, preferably two or three, functional groups selected from oxysilyl groups) and epoxy groups (e.g., glycidoxypropyl groups, 3,4-epoxycyclohexylethyl groups) Organosiloxane oligomers having 4 to 50 atoms, preferably 4 to 20 atoms, or organooxysilyl-modified isocyanurate compounds represented by the following general formula (3) and / or hydrolyzed condensates thereof (organosiloxanes: It is preferable to mix | blend adhesion | attachment adjuvant, such as a modified isocyanurate compound) as an arbitrary component as needed.
<화학식 3><Formula 3>
(식 중, R6은 하기 화학식 4로 표시되는 유기기 또는 지방족 불포화 결합을 함유하는 1가 탄화수소기이지만, 적어도 1개는 화학식 4의 유기기이다.) (Wherein, R 6 is a monovalent hydrocarbon group containing an organic group or an aliphatic unsaturated bond represented by the following general formula (4), at least one is an organic group of the general formula (4).
<화학식 4><Formula 4>
(식 중, R7은 수소 원자 또는 탄소수 1 내지 6의 1가 탄화수소기이고, s는 1 내지 6, 특히 1 내지 4의 정수이다.)(In formula, R <7> is a hydrogen atom or a C1-C6 monovalent hydrocarbon group, s is an integer of 1-6, especially 1-4.)
이 경우, R6의 지방족 불포화 결합을 함유하는 1가 탄화수소기로서는, 비닐기, 알릴기, 프로페닐기, 이소프로페닐기, 부테닐기, 이소부테닐기, 펜테닐기, 헥세닐기, 시클로헥세닐기 등의 탄소수 2 내지 8, 특히 2 내지 6의 알케닐기를 들 수 있다. 또한, R7의 1가 탄화수소기로서는, 메틸기, 에틸기, 프로필기, 이소프로필기, 부틸기, 이소부틸기, tert-부틸기, 펜틸기, 헥실기, 시클로헥실기 등의 알킬기, 비닐기, 알릴기, 프로페닐기, 이소프로페닐기 등의 상기 R6으로서 예시한 것과 동일한 알케닐기, 페닐기 등의 아릴기 등의 탄소수 1 내지 8, 특히 1 내지 6의 1가 탄화수소기를 들 수 있고, 바람직하게는 알킬기이다. In this case, as the monovalent hydrocarbon group containing an aliphatic unsaturated bond of R 6 , a vinyl group, allyl group, propenyl group, isopropenyl group, butenyl group, isobutenyl group, pentenyl group, hexenyl group, cyclohexenyl group or the like And alkenyl groups having 2 to 8, particularly 2 to 6, carbon atoms. Examples of the monovalent hydrocarbon group for R 7 include an alkyl group such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group, pentyl group, hexyl group and cyclohexyl group, vinyl group, C1-C8, especially 1-6 monovalent hydrocarbon groups, such as the same alkenyl group and the same aryl group which were illustrated as said R <6> , such as an allyl group, a propenyl group, and an isopropenyl group, are mentioned preferably, It is an alkyl group.
(E) 성분인 접착 보조제로서, 하기 화학식으로 표시되는 화합물이 예시된다. As an adhesion | attachment adjuvant which is (E) component, the compound represented by a following formula is illustrated.
(식 중, m, n은 각각 m+n이 2 내지 50, 바람직하게는 4 내지 20을 만족시키는 양의 정수이다.)(Wherein m and n are each positive integers in which m + n satisfies 2 to 50, preferably 4 to 20).
이러한 유기 규소 화합물 중, 얻어지는 경화물의 접착성이 특히 우수한 화합물로서는, 1 분자 중에 규소 원자 결합 알콕시기와 알케닐기 또는 규소 원자 결합 수소 원자(SiH기)를 갖는 유기 규소 화합물인 것이 바람직하다. In such an organosilicon compound, as a compound which is especially excellent in the adhesiveness of the hardened | cured material obtained, it is preferable that it is an organosilicon compound which has a silicon atom bond alkoxy group, an alkenyl group, or a silicon atom bond hydrogen atom (SiH group) in 1 molecule.
본 발명에 있어서, 상기 (E) 성분(임의 성분)인 접착 보조제의 배합량은 (A) 성분과 (B) 성분과의 합계 100 질량부에 대하여 통상 10 질량부 이하(즉, 0 내지 10 질량부), 바람직하게는 0.01 내지 5 질량부, 보다 바람직하게는 0.1 내지 1 질 량부 정도로 배합할 수 있다. (E) 성분의 배합량이 너무 적으면 기재에 대한 접착성이 열악해지는 경우가 있고, 너무 많으면 경화물의 경도나 표면 점착성에 악영향을 주는 경우가 있다. In this invention, the compounding quantity of the adhesion | attachment adjuvant which is said (E) component (optional component) is 10 mass parts or less normally (that is, 0-10 mass parts) with respect to a total of 100 mass parts of (A) component and (B) component. ), Preferably 0.01 to 5 parts by mass, more preferably 0.1 to 1 part by mass. If the amount of the component (E) is too small, the adhesiveness to the substrate may be poor. If the amount of the component (E) is too small, the hardness and the surface adhesion of the cured product may be adversely affected.
본 발명의 실리콘 고무 조성물은 상술한 각 성분을 균일하게 혼합함으로써 제조되지만, 물론, 아세틸렌알코올 등의 경화 억제제를 소량 첨가하여 1액형의 조성물로서 이용할 수도 있다. 이 조성물은, 필요에 따라서 가열함으로써 즉시 경화하여 높은 투명성을 가지고, 또한 LCP 등의 패키지 재료나 금속 기판에 매우 잘 접착하기 때문에 LED, 포토다이오드, CCD, CMOS 등의 반도체 패키지에 범용 용도로서 널리 사용할 수 있다. Although the silicone rubber composition of this invention is manufactured by mixing each component mentioned above uniformly, of course, it can also use as a one-component composition by adding a small amount of hardening inhibitors, such as acetylene alcohol. This composition is instantly cured by heating if necessary, has high transparency, and adheres very well to package materials such as LCP and metal substrates, and thus is widely used as a general purpose application in semiconductor packages such as LEDs, photodiodes, CCDs and CMOS. Can be.
본 발명의 실리콘 고무 조성물은, 이와 같이 액정 중합체(LCP)에 대한 접착 용도에 효과적이지만, 여기서 액정 중합체로서는, 특별히 제한되지 않고, 폴리에스테르계의 액정 중합체를 비롯하여 종래부터 공지된 어느 액정 중합체에 대해서도 적용할 수 있다. Although the silicone rubber composition of this invention is effective for the adhesive use with respect to a liquid crystal polymer (LCP) in this way, it does not restrict | limit especially as a liquid crystal polymer here, It is not limited to any liquid crystal polymer conventionally known, including a polyester-type liquid crystal polymer. Applicable
<실시예><Example>
이하, 실시예와 비교예를 나타내어 본 발명을 구체적으로 설명하지만, 본 발명은 하기의 실시예로 제한되지 않는다. 또한, 하기 예에서 부는 질량부를 나타내고, 점도는 23 ℃에서의 값이다. 또한, Vi는 비닐기를 나타낸다. Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not limited to the following Example. In addition, in a following example, a part shows a mass part and a viscosity is a value in 23 degreeC. In addition, Vi represents a vinyl group.
[실시예 1]Example 1
하기 화학식 (i)Formula (i)
(i) (i)
로 표시되는 폴리실록산(VF) 50 부에, SiO2 단위 50 몰%, (CH3)3SiO0 .5 단위 42.5 몰% 및 Vi3SiO0 .5 단위 7.5 몰%로 이루어지는 레진 구조의 비닐메틸실록산(VMQ) 50 부, SiH기의 양이 상기 (VF) 및 (VMQ) 성분 중의 비닐기의 합계량에 대하여 1.5배 몰이 되는 양의 하기 화학식 (ii)Polysiloxane (VF) in 50 parts, SiO 2 units of 50 mol% represented by, (CH 3) 3 SiO 0 .5 units 42.5 of methyl vinyl resin structure comprising in mol% and Vi 3 SiO 0 .5 7.5% mole units of the siloxane (VMQ) 50 parts by volume of the amount of SiH group is 1.5 times mole with respect to the total amount of vinyl groups in said (VF) and (VMQ) component (ii)
(ii) (ii)
로 표시되는 오르가노히드로젠폴리실록산 및 염화백금산의 옥틸알코올 변성 용액0.05 부, 5-에틸-2-(2-히드록시-1,1-디메틸에틸)-5-(히드록시메틸)-1,3-디옥산의 디아크릴산에스테르(상표명: 카야랏드 R-604, 닛본 가야꾸 제조) 1.0 부를 첨가하여 실리콘 고무 조성물을 제조하였다. 이 조성물을 150 ℃/4 hr에서 가열 성형하여 경화물을 형성하고, JIS K 6301에 준하여 인장 강도, 경도(A형 스프링 시험기를 이용하여 측정) 및 신장률을 측정하였다. 또한, 폴리에스테르계 액정 중합체(상표명: 스미카, 스미또모 가가꾸(주) 제조) 기판에 실리콘 고무 조성물을 도포하고, 그 위에 동일 액정 중합체 기판을 배치하고, 조성물을 경화시켜, 상기 액정 중합체 기판에 끼워진 경화물의 기판에 대한 전단 접착력을 측정하였다. 각 측정 결과를 표 1에 나타내었다. 0.05 parts of an octyl alcohol-modified solution of organohydrogenpolysiloxane and chloroplatinic acid represented by 0,5-ethyl-2- (2-hydroxy-1,1-dimethylethyl) -5- (hydroxymethyl) -1,3 1.0 parts of diacrylic acid esters of dioxane (trade name: Kayarard R-604, manufactured by Nippon Kayaku) were added to prepare a silicone rubber composition. The composition was heat-molded at 150 ° C./4 hr to form a cured product, and tensile strength, hardness (measured using a type A spring tester) and elongation rate were measured according to JIS K 6301. Further, a silicone rubber composition is applied to a polyester-based liquid crystal polymer (trade name: Sumika, Sumitomo Chemical Co., Ltd.) substrate, the same liquid crystal polymer substrate is disposed thereon, the composition is cured, and the liquid crystal polymer substrate Shear adhesion to the substrate of the cured product sandwiched was measured. Each measurement result is shown in Table 1.
[실시예 2]Example 2
실시예 1에서 이용한 R-604를 2-프로페노익산(옥타히드로-4,7-메탄-1H-인데니딜)비스(메틸렌)에스테르(상표명: 카야랏드 R-684, 닛본 가야꾸 제조)로 변경한 것 이외에는 실시예 1과 동일 조성으로써 실리콘 고무 조성물을 제조하고, 경화물을 형성하여 실시예 1과 동일하게 측정한 결과를 표 1에 나타내었다. R-604 used in Example 1 was changed to 2-propenoic acid (octahydro-4,7-methane-1H-indenylyl) bis (methylene) ester (trade name: Kayarard R-684, manufactured by Nippon Kayaku) A silicone rubber composition was produced with the same composition as in Example 1 except that the cured product was formed, and the results obtained in the same manner as in Example 1 are shown in Table 1.
[실시예 3] Example 3
실시예 1에서 이용한 R-604를 라우릴아크릴레이트로 변경한 것 이외에는 실시예 1과 동일 조성으로써 실리콘 고무 조성물을 제조하고, 경화물을 형성하여 실시예 1과 동일하게 측정한 결과를 표 1에 나타내었다. Except for changing the R-604 used in Example 1 to lauryl acrylate, a silicone rubber composition was prepared by the same composition as in Example 1, the cured product was formed, and the results measured in the same manner as in Example 1 are shown in Table 1. Indicated.
[실시예 4] Example 4
실시예 1에서 이용한 조성에 하기 화학식 (iii)Formula (iii) to the composition used in Example 1
(iii) (iii)
로 표시되는 접착 보조제 0.5 부를 첨가한 것 이외에는, 실시예 1과 동일 조성으로써 실리콘 고무 조성물을 제조하고, 경화물을 형성하여 실시예 1과 동일하게 측정한 결과를 표 1에 나타내었다. Except having added 0.5 part of the adhesion | attachment adjuvant shown by the following, the silicone rubber composition was manufactured by the same composition as Example 1, the hardened | cured material was formed, and the result measured similarly to Example 1 is shown in Table 1.
[실시예 5]Example 5
실시예 1에서 이용한 조성에 하기 화학식 (iv)Formula (iv) to the composition used in Example 1
(iv) (iv)
로 표시되는 접착 보조제 1.0 부를 첨가한 것 이외에는, 실시예 1과 동일 조성으로써 실리콘 고무 조성물을 제조하고, 경화물을 형성하여 실시예 1과 동일하게 측정한 결과를 표 1에 나타내었다. Except having added 1.0 part of the adhesion | attachment adjuvant shown by the following, the silicone rubber composition was manufactured with the composition similar to Example 1, the hardened | cured material was formed, and the result measured similarly to Example 1 is shown in Table 1.
[비교예 1] Comparative Example 1
실시예 1의 R-604를 첨가하지 않는 것 이외에는 실시예 1과 동일 조성으로써 실리콘 고무 조성물을 제조하고, 경화물을 형성하여 실시예 1과 동일하게 측정한 결과를 표 1에 나타내었다. Except not adding R-604 of Example 1, the silicone rubber composition was manufactured by the same composition as Example 1, the hardened | cured material was formed, and the result measured similarly to Example 1 is shown in Table 1.
[비교예 2]Comparative Example 2
실시예 1의 R-604를 첨가하지 않는 것 이외에는 실시예 4와 동일 조성으로써 실리콘 고무 조성물을 제조하고, 경화물을 형성하여 실시예 1과 동일하게 측정한 결과를 표 1에 나타내었다. Except not adding R-604 of Example 1, the silicone rubber composition was manufactured by the same composition as Example 4, the hardened | cured material was formed, and the result measured similarly to Example 1 is shown in Table 1.
[실시예 6 내지 9] [Examples 6 to 9]
실시예 1의 R-604, 실시예 3의 라우릴아크릴레이트 및 실시예 5에서 사용한 접착 보조제(iv)를 표 2에서 표시되는 양으로 변경한 것 이외에는, 실시예 1과 완전히 동일한 조성의 것을 실시예 1과 동일하게 측정한 결과를 표 2에 나타내었다. Except having changed the R-604 of Example 1, the lauryl acrylate of Example 3, and the adhesion | attachment adjuvant (iv) used in Example 5 to the quantity shown in Table 2, the thing of the same composition as Example 1 is implemented. Table 2 shows the results measured in the same manner as in Example 1.
본 발명의 실리콘 고무 조성물에 따르면, 지금까지 매우 접착 곤란하였던 LCP의 기판에 대하여 효과적인 접착성을 부여하는 경화물을 얻을 수 있다. 특히 본 발명의 실리콘 고무 조성물은 투명성이 우수한 경화물을 제공할 수 있기 때문에, 각종 광 디스플레이의 패키지에 사용되는 액정 중합체 기판의 접착에 효과적이고, 각종 광 관련 디바이스용 기판에 대한 응용에 유용하다.According to the silicone rubber composition of this invention, the hardened | cured material which provides effective adhesiveness with respect to the board | substrate of LCP which was very difficult to adhere | attach until now can be obtained. Since the silicone rubber composition of this invention can provide the hardened | cured material excellent in transparency especially, it is effective for the adhesion of the liquid crystal polymer substrate used for the package of various optical displays, and is useful for the application to the substrate for various light related devices.
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