KR20060059560A - Sample holder for semiconductor device fabrication - Google Patents

Abstract

The present invention relates to a sample holder for semiconductor manufacturing that can be mounted in an impurity implantation facility by mounting small pieces of bare silicon wafers. The sample holder for manufacturing a semiconductor of the present invention has a plurality of sample storage grooves for accommodating a sample on its upper surface, and has a disc of the same size as a bare silicon wafer that can be used for an impurity implantation facility, and is installed on the disc. Including a fixing clip for fixing the sample placed in the groove, it is possible to reduce the usage of the bare silicon wafer used in the test of the impurity implantation process.

Description

Sample Holder for Semiconductor Manufacturing {SAMPLE HOLDER FOR SEMICONDUCTOR DEVICE FABRICATION}

1 is a perspective view of a sample holder for manufacturing a semiconductor, which is an embodiment of the present invention;

2 is a plan view of a sample holder for manufacturing a semiconductor, which is an embodiment of the present invention;

3 and 4 are views illustrating a process in which a sample is mounted on a sample holder for manufacturing a semiconductor.

Explanation of symbols on the main parts of the drawings

110: negative

112: top plate

114: bottom plate

116: sample storage groove

120: fixed clip

122: set screw

124: Clip Bar

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sample holder for semiconductor manufacturing used for testing an impurity implantation process, and more particularly to a sample holder for semiconductor manufacturing that can be used in a semiconductor facility by mounting small pieces of bare silicon wafers.

There is an impurity implantation process in the semiconductor manufacturing process. In this process, several process conditions are set according to the characteristics of various products and the conditions are determined according to the required process. These conditions are the purpose of this bare silicon wafer (Bare-Si Wafer) after the process to the bare silicon wafer (Bare-Si Wafer) for each condition whenever the process of the product changes, there is a previous installation of equipment and the installation of new equipment. According to the analysis equipment, the evaluation is performed and the abnormality is confirmed and restarted.

As such, the number of bare silicon wafers required for each process change and facility transfer according to the product change of the impurity implantation facility is about 20-30 pieces per item. Given the semiconductor equipment of impurity implantation processes used around the world, the bare silicon wafers used for this purpose will be immeasurable.

SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and an object thereof is to provide a new type of semiconductor manufacturing sample holder capable of reducing the usage of bare silicon wafers used in testing impurity implantation processes.

The sample holder for manufacturing a semiconductor of the present invention for achieving the above object is a disk having a plurality of sample receiving grooves for receiving a sample on the upper surface; A fixing clip installed on the disc to fix the sample placed in the sample receiving groove; The disc is of the same size as the bare silicon wafer used in the semiconductor manufacturing process.

According to an embodiment of the present invention, the original plate is made of a double structure of the upper plate and the lower plate, the sample receiving grooves are formed in the upper plate.

According to an embodiment of the present invention, the fixing clip is made of a fixing screw fixed to the disc, and a clip bar installed on the fixing screw to press the upper surface of the sample; The clip bar is made of copper to prevent facility contamination.

According to an embodiment of the invention, the clip is coated on the surface with a thermosetting resin material or silicone material.

For example, the embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. These examples are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 4. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

1 is a perspective view of a sample holder for manufacturing a semiconductor according to an embodiment of the present invention, FIG. 2 is a plan view of a sample holder for manufacturing a semiconductor according to an embodiment of the present invention, and FIGS. 3 and 4 illustrate a process in which a sample is mounted on a sample holder for manufacturing a semiconductor. The drawings.                     

As shown in FIGS. 1 and 2, a sample holder 100 for manufacturing a semiconductor according to an embodiment of the present invention includes a disc 110 having a wafer size compatible with each impurity injection facility, and a small piece placed on the disc 110. Fixing clips 120 for fixing the samples 10 of the.

The disc 110 has sample receiving grooves 116 for receiving the sample 10 on the upper surface. The sample accommodating groove 116 is formed at the center and four edges of the upper surface of the disc 110. Of course, the number of the sample receiving grooves 116 can be changed as necessary. The size of the sample receiving groove 116 can be determined as needed, but in this embodiment has a size of 25mm * 30mm. In general, the size of the sample required for the evaluation of the analytical equipment should be 1cm * 1cm-2cm * 2cm. Therefore, the size of the sample receiving groove 116 for accommodating the small sample 10 is preferably formed slightly larger than the size of the sample. The sample 10 accommodated in the sample storage groove 116 is used to cut a general bare silicon wafer into 2 cm * 2 cm size pieces and make more than 20 pieces of samples.

The disc 110 may be made of 6 inches, 8 inches, 12 inches of the same size as the bare silicon wafer used in the semiconductor process in order to maximize the efficiency of use.

The disc 110 is formed of a double structure of the upper plate 112 and the lower plate 114, the upper plate 112 and the lower plate 114 is made of a silicon (Si) material, they are attached by an adhesive. For example, the upper plate 112 and the lower plate 114 are made of a silicon material to minimize the possibility of back contamination in the impurity injection facility. If there is no problem of contamination, the material of the lower plate 114 is convenient for manufacturing a measuring device. For this reason it can be made of metal. However, the surface exposed by the sample receiving groove 116 in the lower plate 114 of the metal material may be coated with a thermosetting resin to prevent reverse contamination of the facility.

3 and 4, the fixing clip 120 is for fixing the sample 10 placed in the sample receiving groove 116, a fixing screw fixed to the upper plate 112 of the disc ( 122 and a clip bar 124 installed on the fixing screw 112 to press the upper surface of the sample 10. The clip bar 124 is preferably made of copper (Cu) to prevent facility contamination, and the surface of the clip bar 124 may be coated with a thermosetting resin material or a silicon material.

In the above, the configuration and operation of the sample holder for manufacturing a semiconductor according to the present invention is shown according to the above description and drawings, but this is only described for example, and various changes and modifications can be made without departing from the technical spirit of the present invention. Of course.

According to the present invention as described above, the usage amount of the bare silicon wafer used in the test of the impurity implantation step can be reduced.

Claims (4)

In the sample holder for semiconductor manufacturing: A disc having a plurality of sample receiving grooves for receiving a sample on the upper surface; A fixing clip installed on the disc to fix the sample placed in the sample receiving groove; The original plate is a sample holder for manufacturing a semiconductor, characterized in that the same size as the bare silicon wafer used in the semiconductor manufacturing process. The method of claim 1, The original plate is made of a dual structure of the upper plate and the lower plate, the sample holder grooves for manufacturing a semiconductor, characterized in that formed in the upper plate. The method of claim 1, The fixing clip is made of a fixing screw fixed to the disc, and a clip bar installed on the fixing screw to press the upper surface of the sample; The clip bar is a sample holder for manufacturing a semiconductor, characterized in that made of copper to prevent contamination of the equipment. The method of claim 3, The clip is a sample holder for manufacturing a semiconductor, characterized in that the surface is coated with a thermosetting resin material or silicon material.

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