KR20060022964A - Sawing/sorting apparatus - Google Patents

Abstract

The present invention relates to a sawing / sorting system for separating strips in which a plurality of unit semiconductor chip packages are arranged in a matrix, and classifying the strips into unit semiconductor chip packages according to their appearance inspection and quality. And a picker unit for picking up and fixing the strip placed on the mounting unit and a picker unit for fixing the rotary chuck table to the bottom and rotating the rotary chuck table at a predetermined angle, wherein the picker unit is rotated in the X-axis direction and Z A plurality of transfer / sawing robots moving in an axial direction; A plurality of sawing spindle units installed below the picker unit at a predetermined position on a movement path of the picker unit in the transfer / sawing robot, having a blade for rotating movement, and moving the blade in the X-axis direction; A cleaning unit for cleaning the unit semiconductor chip packages on which the sawing is completed by the sawing spindle on the movement path of the picker unit in the transfer / sawing robot; And an appearance inspection means for inspecting appearance quality of the unit semiconductor chip package separated from the strip by the sawing spindle unit. According to this, the time required for operations other than sawing and sorting can be greatly reduced, thereby greatly reducing the working time. In particular, the efficiency of the cleaning operation performed after completion of the sawing operation can be improved and the time required can be shortened, and the amount of cleaning liquid and air consumed in the operation can also be reduced. In addition, the work of changing the work material can be made easier than before.

Sawing / Sorting, Singulation, Sawing, Sorting, Strips, Handlers

Description

Sawing / Sorting Apparatus}

1 is a plan view showing a schematic configuration of a sawing / sorting system according to the prior art.

2 is a schematic cross-sectional view showing a state in which cutting is performed by a sawing device of a sawing / sorting system according to the prior art.

3 is a perspective view showing a schematic configuration of one embodiment of a sawing / sorting system according to the present invention.

4 is a plan view showing a schematic configuration of one embodiment of a sawing / sorting system according to the present invention.

Figure 5 is a schematic block diagram showing a transfer / sawing robot in one embodiment of the sawing / sorting system according to the present invention.

6 is a schematic structural diagram showing a sawing spindle unit in one embodiment of a sawing / sorting system according to the present invention.

7 is an operational state diagram illustrating a state in which sawing is performed according to an embodiment of the sawing / sorting system according to the present invention.

8 is a timing chart for the operation of one embodiment of a sawing / sorting system according to the present invention.

Explanation of symbols on the main parts of the drawings

One; Strip 3; magazine

5; Unit package 6; Solder ball

7,8,9; Tray 10; Loader

15; Elevator 21; Guide rail

30,40; Transfer / sawing robots 31,41; Picker Unit

33,43; Axis of rotation 35; Chuck table

37; Alignment table 39; Tool station

51,55,57; Vision camera 61,62; Spindle unit

63,64; Blade 65; Nozzle unit

71,72; Cleaning 79; Carrier box

81,82; Sorting table 83,84; Sorting Table Drive Rail

85; Sorting robot 86; Sorting Picker Unit

91; Tray guide rail 93; Unloader

95; Tray transfer unit 100; Sawing / Sorting System

The present invention relates to a semiconductor chip package manufacturing apparatus, and more particularly, a strip in which a plurality of unit semiconductor chip packages are arranged in a matrix, separated into unit semiconductor chip packages, and classified according to appearance inspection and the quality state thereof. To a sawing / sorting system.

Recently used semiconductor chip packages such as fine pitch ball grid array (FBGA) and tape ball grid array (TBGA) packages are used for die attach, wire bonding, and resin molding. In this case, the unit substrate is treated as a matrix stripped substrate strip (hereinafter referred to as a "strip") state. In the sawing / sorting process, the strip is separated into a unit semiconductor chip package (hereinafter referred to as a "unit package"), inspected for its quality, and sorted into a tray, which is a final container according to good or bad condition. do.

The sawing / sorting system is a device for performing the sawing / sorting process as described above, and is a vision inspection that performs a cleaning process for the unit package in which the sawing is completed and an appearance inspection for the unit package in which the sawing is completed. It is configured to carry out the process. After sawing is completed in a unit package, scrap and water are removed by a cleaning process, and appearance inspection is performed by a vision inspection process to inspect a good / bad state of a semiconductor chip package. A conventional sawing / sorting system will be described with reference to FIGS. 1 and 2.

1 is a plan view showing a schematic configuration of a sawing / sorting system according to the prior art, and FIG. 2 is a schematic cross-sectional view showing a state in which a sawing device of the sawing / sorting system according to the prior art is made.

1 and 2, a conventional sawing / sorting system 300 includes a sawing device 303 which separates a strip 1 having completed resin molding into a unit package 5 and a unit package 5 having completed sawing. Sorting device 301 sorting and stacking according to the quality of the state is installed to be adjacent to each other is configured so that the sawing and sorting is made in association.

The sawing device 303 comprises a sawing spindle unit 361 comprising a rotary chuck table 335 on which the strip 1 is mounted and fixed, and a blade 363 for cutting the strip 1. And a nozzle unit 365 for spraying the cleaning liquid onto the blades 363 and the strip 1.

The sorting device 301 is a transfer robot that is responsible for transferring the loader 310 supplied with the strip 1 mounted on the magazine 3 and the strip 1 or the separated unit package 5. (330) 385, a vision camera (335, 357) for inspecting the appearance quality of the unit package (5), a cleaning unit (373) for cleaning the sawing completed unit package (5), and drying Drying unit 376 for turning, turn table 375 for changing the work direction of the unit package 5, sorting table 381 on which the unit packages 5 for sorting are mounted, sorting A buffer table in which the unit packages 5 are temporarily placed before being transferred to the table 381, and trays 7, 8 and 9 in which the unit packages 5 are classified and stored according to inspection quality are loaded. An unloader 393.

On the linear movement path of the picker unit 331 of the transfer robot 330, the rotary chuck table 335 and the cleaning unit 373 of the sawing device 301, the turntable 375, the drying unit 376 and The buffer table 377 and the sorting table 381 are provided. The transfer robot 330 moves the strip 1 or the unit package 5 while moving the sawing device 303 and the sorting device 301.

Looking at the operation of the conventional sawing / sorting system 100, the pusher (317) and the gripper with the magazine (3) containing the strip (1) mounted on the loader 310 of the sorting device (301) It is conveyed to the pick-up position on the picker unit 331 movement path | route of the pick-up and transfer robot 330 by the gripper 317 one by one in the guide rail 321 one by one.

When transfer to the guide rail 321 is completed, the transfer robot 330 picks up the strip 1 and places it on the rotary chuck table 375 of the sawing device 303. The strip 1 is vacuum sucked from the rotary chuck table 375 and fixed. In this state, after sawing in one direction of the strip 1 is performed by the blade 363 of the sawing spindle unit 361 driven above the rotary chuck table 375 as shown in FIG. 2, the rotary chuck table 375. This 90 ° rotation causes sawing in the other direction of the strip 1 so that the strip 1 is separated into each unit package 5. The picker unit 331 installed in the transfer robot 330 is configured to suck and fix each unit package 5 in which sawing is completed, so that the sawing may be fixed in a completed state.

When the blade 363 cuts the strip 1 which is being fixed by vacuum to the rotary chuck table 335, scraps separated from the strip 1 remain on the rotary chuck table 335. Since an operation error may occur in the work and it is difficult to secure the stability of the cutting work, the cleaning liquid is injected at a high pressure from the nozzle unit 365 installed adjacent to the blade 363 during the sawing process and occurs during the sawing work. The scrap is removed.

When the sawing operation is completed, the picker unit 331 of the transfer robot 330 is in contact with the cleaning unit 373 installed in the sorting apparatus 301 in a state where the picker units 331 adsorb the unit packages 5, thereby scraping them by the cleaning liquid and air. Cleaning is done to remove excess water. At this time, the cleaning operation is performed on one surface portion of the upper surface portion and the lower surface portion of the unit package 5. In general, cleaning is performed on the opposite side of the surface on which the solder balls 6 are formed.

When cleaning is completed in the cleaning unit 373, the unit packages 5 are transferred to the turntable 375 and mounted. The turntable 375 is rotated 180 ° with the unit packages 5 fixed. In this state, air is injected to the other surface portion of the drying unit 376 which is not cleaned, and appropriate heat is applied to remove the scrap and to dry.

Upon completion of the drying operation, the unit packages 5 are visually inspected on one surface by the upper vision camera 335 and transferred to the buffer table 377. The unit packages 5 mounted on the buffer table 377 are transferred to the sorting table 381 by the transfer robot 330 and visually inspected on the other side by the lower vision camera 357. According to the quality condition according to the inspection information, the unit packages 5 are sorted and stored in the good storage tray 7 and the defective storage tray 8 by the sorting transfer robot 385 and transferred to the unloader 393.

However, since the sawing / sorting system according to the prior art as described above is configured independently of the sawing device and the sorting device, when a workpiece is changed, a tool replacement for a new workpiece and a facility parameter setting work are performed. The setup work and maintenance were cumbersome, requiring a separate set-up for each and sorting device.

In addition, the sawing / sorting system according to the prior art as described above consumes a large amount of water and air for the cleaning operation and the cleaning operation time is very long because the removal of the scrap is completely dependent on the injection of water and air. In addition, productivity is lowered due to the double operation in which the cleaning and drying operations of the unit package in which the sawing is completed are performed first in the sawing apparatus and again in the second sorting apparatus. That is, the cleaning work performed after the sawing work is completed is very inefficient.

In addition, the sawing / sorting system according to the prior art can be used in addition to the actual sawing operation, in addition to the auxiliary operations substantially independent of the sawing operation, for example, transport and fixation of strips or unit packages by vacuum adsorption, vision inspection, cleaning and drying operations. There was a problem that the time consumption is increased due to the performance.

It is therefore an object of the present invention to provide a sawing / sorting system that facilitates tool replacement and maintenance and setting operations due to the separate configuration of the sawing device and the sorting device.

Another object of the present invention is to provide a sawing / sorting system capable of minimizing the amount of water and air required for the cleaning operation while minimizing the cleaning time.                         

It is still another object of the present invention to provide a sawing / sorting system which can improve productivity by minimizing the time required for operations other than sawing and sorting.

A sawing / sorting system according to the present invention for achieving the above object, the loader is mounted with a magazine containing a plurality of strips to load the individual strip; A mounting unit on which a strip conveyed from a magazine mounted on the loader is placed; And a picker unit configured to pick up and fix the strip placed on the mounting unit, and a picker unit to fix the rotary chuck table to a lower portion and to rotate the rotary chuck table at a predetermined angle. A plurality of transfer / sawing robots moving in a direction; A plurality of sawing spindle units installed below the picker unit at a predetermined position on a movement path of the picker unit in the transfer / sawing robot, having a blade for rotating movement, and moving the blade in the X-axis direction; A cleaning unit for cleaning the unit semiconductor chip packages on which the sawing is completed by the sawing spindle on the movement path of the picker unit in the transfer / sawing robot; Appearance inspection means for inspecting appearance quality of the unit semiconductor chip package separated from the strip by the sawing spindle unit; A sorting table mounted on a movement path of the picker unit of the transfer / sawing robot and mounted with a unit semiconductor chip package on which cleaning by the cleaning unit is completed; An unloader to which the tray is fed; And a sorting transfer robot configured to sort and store the unit package in the tray according to the inspection information by the appearance inspection means in the sorting table.

In the sawing / sorting system according to the present invention, it is preferable that the sawing spindle unit, the cleaning unit, and the sorting table are provided in this order from the mounting unit. In addition, the transfer / sawing robots are preferably two. The transfer / sawing robots are preferably coupled so that the picker units face in opposite directions.

In the sawing / sorting system according to the invention, the sawing spindle units are preferably two and configured to move in a direction transverse to the direction of movement of the picker unit, maintaining a predetermined interval, wherein each sawing spindle unit is X It is preferable to be configured to move in the axial direction, the Y-axis direction and the Z-axis direction.

In the sawing / sorting system according to the present invention, the sorting table is preferably plural.

In the sawing / sorting system according to the invention, it is preferred to further comprise a vision camera and an alignment table for inspecting and correcting the alignment of the strip between the mounting unit and the sawing spindle unit.

In the sawing / sorting system according to the present invention, the mounting unit may be a guide rail on which a strip supplied from the magazine of the loader is mounted to guide movement thereof, but is not limited thereto.

In the sawing / sorting system according to the present invention, the first and second transfer / sawing robots and the sawing spindle units are unit packages in which sawing is completed when any one of the transfer / sawing robots performs sawing on a strip. It is preferable that the cleaning and drying operations on the fields are carried out and transferred to the sorting table, the new strip is picked up from the mounting unit, and the alignment operation by the vision camera and the alignment table is performed.

Hereinafter, a sawing / sorting system according to the present invention will be described in detail with reference to the accompanying drawings. In describing the embodiments, descriptions of technical contents which are well known in the technical field to which the present invention belongs and are not directly related to the present invention will be omitted. This is to more clearly communicate without obscure the subject matter of the present invention by omitting unnecessary description. For the same reason, some components in the accompanying drawings are exaggerated, omitted, or schematically illustrated, and the size of each component does not entirely reflect the actual size.

Example

Figure 3 is a perspective view showing a schematic configuration of an embodiment of the sawing / sorting system according to the present invention, Figure 4 is a plan view showing a schematic configuration of an embodiment of a sawing / sorting system according to the present invention, Figure 5 6 is a schematic block diagram showing a transfer / sawing robot in one embodiment of a sawing / sorting system according to the invention, FIG. 6 is a schematic block diagram showing a sawing spindle unit in an embodiment of a sawing / sorting system according to the present invention, and FIG. Is an operational state diagram showing a state in which sawing is performed according to an embodiment of the sawing / sorting system according to the present invention, and FIG. 8 is a timing chart for the operation of one embodiment of the sawing / sorting system according to the present invention.

The sawing / sorting system 100 according to the present invention illustrated in FIGS. 3 and 4 is a semiconductor package manufacturing apparatus implemented in such a manner that the sawing process and the sorting process may be performed differently from each other. Transfer / sawing robots 30 and 40 and two sawing spindle units 61 and 62 and cleaning units 71 and 72 which integrate the cleaning process and the drying process. And a loader 10 for loading the strip 1, a guide rail 21 and a unit package 5 for guiding the strip 1 from the loader 10 to a pickup position by a transfer / sawing robot. And the unloader 93 in which the trays 7 and 8 are unloaded and the empty tray 9 is loaded, and the vision cameras 55 and 57 for inspecting package appearance defects.

In the left front part of the sawing / sorting system 100, the loader 10 in which the magazine 3 in which the strip 1 was accommodated is mounted is provided. And the guide rail 21 in which the strip | belt supplied from the magazine 3 of the loader 10 is mounted to the back, and guide is moved is provided. The loader 10 includes an elevator 15 for vertically moving the magazine 3 and a pusher 17 for pushing the strip 1 housed in the magazine 3 onto the guide rail 21. The transfer of the strip 1 mounted on the guide rail 21 may be made by using a known pneumatic cylinder or by a motor and a belt moved by it.

The side of the guide rail 21 is provided with a vision camera 51 and an alignment table 37 for aligning the position of the strip 1. The vision camera 51 and the alignment table are placed on the rails 52 and 38 installed in the Y-axis direction to allow movement between the movement paths by the first transfer / sawing unit 30 and the second transfer / sawing unit 40. It is configured to be coupled and exercised.

The transfer / sawing robots 30 and 40 are formed long in the transverse direction of the sawing / sorting system 100, that is, in the X-axis direction. Each transfer / sawing robot (30, 40) is provided with picker units (31, 41) for fixing the strip (1) or unit package (5) by vacuum adsorption, respectively, the picker units (31, 41 is configured to be movable in the X-axis direction (left and right directions) and the Z-axis direction (up and down directions), respectively. The transfer / sawing robots 30 and 40 are installed side by side adjacent to each other with the picker units 31 and 41 facing in opposite directions so that independent operations can be performed. Each of the picker units 61, 62 includes a rotational axis 33, 43 which can be rotated by 90 ° for turning the sawing direction with respect to the strip 1 and at an angle of rotation for accurate sawing operation and position correction. It is configured as in FIG.

In the movement path of the picker units 31 and 41, two sawing spindle units 61 and 62 are installed under the picker units 31 and 41 so that two cuttings can be made simultaneously. have. Since it is necessary to adjust the height and width between the two sawing spindle units 61 and 62 for accurate cutting operation and setting, the sawing spindle units 61 and 62 are X, Y and Z axes as shown in FIG. It is configured to allow movement in the direction. If necessary, the sawing spindle units 61 and 62 can be set in a proper direction of movement. For example, one sawing spindle unit 61 may be configured to move in the Z-axis direction (up and down direction), and the other sawing spindle unit 62 may move in the left and right direction (X-axis direction).

The two sawing spindle units 61, 62 are configured to work in the movement paths of the picker units 31, 41 of the first transfer / sawing robot 30 and the second transfer / sawing robot 40. For this purpose, each sawing spindle unit (61, 62) is installed on the guide shaft (65, 66) to be movable in the Y-axis direction (front and rear) as shown in FIG. Here, the guide shafts 65 and 66 are not limited thereto, and may be replaced with various forms such as a rail.

Adjacent to sawing spindle units 61, 62 are cleaning units 71, 72. The sawing spindle units 71 and 72 have a structure that is isolated from other neighboring units, and with respect to the top surface of the strip 1 with the strip 5 adsorbed and fixed to the picker units 41 and 43. It is configured such that cleaning and heat drying of the lower surface and the lower surface can be performed integrally. If necessary, the cleaning and drying processes may be sequentially performed on the upper and lower surfaces.

Adjacent to the cleaning units 71 and 72, two sorting tables 81 and 82 are provided to be movable in the Y-axis direction. An upper vision camera for visual inspection of one surface of the unit package 5 mounted on the sorting table 81, 82 and moving on the rail 56 at the top thereof on the path of the cleaning units 71, 72 ( 55) is installed.

A rail 91 is installed adjacent to the sorting table 81 and 82 to guide the mounting and movement of the trays 7, 8 and moves between the sorting table 81 and 82 and the rail 91, and is a unit package. The sorting transfer robot 85 which sorts and stacks (5) according to the inspection information is provided. And between the rails 91, the lower vision camera 57 for inspecting the appearance of the other surface portion of the unit package 5 is provided on the rail 91 so as to be movable in the Y-axis direction.

Here, the first and second transfer / sawing robots 30 and 40, the first transfer and sawing robot 30, and the sawing spindle units 61 and 62 are the first transfer / sawing robot 30 and the sawing spindle unit. While the fields 61 and 62 perform the sawing operation on the strip 1, the second transfer / sawing robot 40 performs cleaning and drying operations on the unit packages 5 for which sawing is completed. It is configured to transfer to the tables 81 and 82, pick up a new strip 1 from the guide rail 21, and perform the alignment operation by the vision camera 37 and the alignment table 39 for vision alignment. . In addition, when the second transfer / sawing robot 40 and the sawing spindle units 61 and 62 perform the sawing operation on the strip 1, the first transfer / sawing robot 30 has the sawing completed unit packages. (5) cleaning and drying operations are carried out to the sorting tables (81, 82), and a new strip (1) is picked up from the guide rail (21) to the vision camera (51) and the alignment table (39). Position alignment operation is configured to be performed. That is, basically two transfer / sawing robots 30 and 40 intersect each other and perform sawing operation, while the other sawing / feeding robot performs other operations other than sawing while one transfer / sawing robot proceeds sawing. do. This operation process is shown in FIG.

Referring to the operation of the sawing / sorting system according to the present invention, the magazine 3 containing the strip 1 is supplied to the loader 10 and mounted on the guide rails 21 one by one, and the first and second transporting / sawing one by one. It is transferred to the pick-up position of the robots 30 and 40. When the transfer is completed, the picker units 31 and 41 mounted on the first and second transfer / sawing robots 30 and 40 pick up the strip 1 by vacuum suction method, and then the upper part of the alignment vision camera 51. It is transferred to and the inspection of the strip alignment state in the picker unit 37 is made. If the alignment is not correct, the picker units 31 and 41 place the strip 1 on the alignment table 37 and correct the error according to the alignment state information by driving the rotary shafts 33 and 43, so that the pickup is performed again. Is done. If the alignment is correct, the picker units 31, 41 move the strip 1 to the top of the sawing spindle units 61, 62.

The picker unit 61, 62 is lowered (or raised in the sawing spindle unit) and sawing is performed by the blade 63 which is rotated by the movement in the Y axis direction of the sawing spindle units 61, 62. Then, the picker units 31 and 41 are lowered again while the picker units 31 and 41 are rotated 90 ° according to the rotation of the rotation shafts 33 and 43 while the strip 1 and the blade 63 are separated. (Or the raising of the sawing spindle unit) and the cutting in the Y-axis direction of the sawing spindle units 61,62. At this time, since the cutting is performed by the two sawing spindle units 61 and 62, the sawing operation is performed on the two strips 1 by one movement of the picker units 31 and 41. FIG. The time required for the sawing operation is reduced by 1/2 compared to the conventional one.

Sawing to the unit package is as shown in FIG. 7 in which the blade 63 is below the strip 1 and the rotary chuck table 35 with the strip 1 fixed in a vacuum to the bottom of the rotary chuck table 35. The sawing operation is performed by moving. During the sawing operation, the cleaning liquid and air are sprayed toward the strip 1 from the nozzle unit 65 provided around the blade 63 to remove the scrap generated during the sawing operation. Here, the strip carrier holding and holding the strip 1 is accommodated in the carrier box 79.

When the sawing operation is completed, the picker units 31 and 41 of the first and second transfer / sawing robots 30 and 40 are moved to the cleaning units 71 and 72 while picking up the unit package 5 for which the sawing is completed. . In the cleaning units (71, 72), the removal and drying of scrap and water are carried out all over the upper and lower surfaces of the unit package adsorbed. The cleaning units 71 and 72 are blocked from the outside to prevent the cleaning liquid from splashing to the outside during the cleaning process.

When the cleaning is completed, the picker units 31 and 41 transfer the unit packages to the sorting tables 81 and 82. The visual inspection of the unit package 5 is performed by the vision camera 55 located above the sorting tables 81 and 82 and the vision camera 57 located below. The unit packages 5 mounted on the sorting tables 81 and 82 are sorted and stored in the good storage tray 7 and the defective storage tray 8 according to the quality state by the package transfer robot 85 according to the inspection result. And are transferred to the unloader 93.

As in the above-described embodiment, the sawing / sorting system according to the present invention is integrated rather than a separate combination of independent sawing and sorting devices as in the prior art. As a result, unnecessary time spent during sawing and sorting is greatly reduced, and facility parameters can be managed all at once, thereby making it easy to change the work object.

And a sawing spindle unit of twin blade type. Therefore, the time required for the sawing operation can be reduced by 1/2 because the chuck table holding the strip is in contact with the sawing blade and two cutting operations are performed in one movement.

In addition, since the sawing blade is sawed from below while the strip is fixed under vacuum using a vacuum underneath the chuck table, the scrap generated by sawing operation is naturally downward due to gravity Can be easily removed with a small amount of cleaning liquid, and a small amount of air spraying will result in the removal of moisture from the package.

On the other hand, in the present specification and drawings have been described with respect to preferred embodiments of the present invention, although specific terms are used, it is merely used in a general sense to easily explain the technical details of the present invention and to help the understanding of the invention, It is not intended to limit the scope of the invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention can be carried out in addition to the embodiments disclosed herein.

According to the sawing / sorting system according to the present invention as described above, it is possible to greatly reduce the time required for operations other than sawing and sorting, thereby greatly reducing the working time. For example, the time taken to transport, clean and dry the strip can be significantly reduced compared to the prior art. In particular, the efficiency of the cleaning operation performed after completion of the sawing operation can be improved and the time required can be shortened, and the amount of cleaning liquid and air consumed in the operation can also be reduced.

In addition, according to the sawing / sorting system according to the present invention, since the sawing device and the sorting device is integrated to manage various equipment parameters at once, the work of changing the working material can be made easier than before. That is, maintenance and setting work can be easily made.

Claims (9)

A loader mounted with a magazine containing a plurality of strips to load individual strips; A mounting unit on which a strip conveyed from a magazine mounted on the loader is placed; And a picker unit configured to pick up and fix the strip placed on the mounting unit, and a picker unit to fix the rotary chuck table to a lower portion and to rotate the rotary chuck table at a predetermined angle. A plurality of transfer / sawing robots moving in a direction; A plurality of sawing spindle units installed below the picker unit at a predetermined position on a movement path of the picker unit in the transfer / sawing robot, having a blade for rotating movement, and moving the blade in the X-axis direction; A cleaning unit for cleaning the unit semiconductor chip packages on which the sawing is completed by the sawing spindle on the movement path of the picker unit in the transfer / sawing robot; Appearance inspection means for inspecting appearance quality of the unit semiconductor chip package separated from the strip by the sawing spindle unit; A sorting table mounted on a movement path of the picker unit of the transfer / sawing robot and mounted with a unit semiconductor chip package on which cleaning by the cleaning unit is completed; An unloader to which the tray is fed; And a sorting transfer robot for sorting and storing the unit package in a tray according to the inspection information by the appearance inspection means in the sorting table. The sawing / sorting system according to claim 1, wherein the sawing spindle unit, the cleaning unit, and the sorting table are provided in order from the mounting unit. 2. The sawing / sorting system of claim 1, wherein said transfer / sawing robots are two. The sawing / sorting system of claim 1, wherein the transfer / sawing robots are coupled with the picker units facing in opposite directions. 2. The sawing / sorting system of claim 1, wherein said sawing spindle units are two and configured to move in a direction transverse to said direction of movement of said picker unit at a predetermined interval. 2. The sawing / sorting system of claim 1, wherein each sawing spindle unit is configured to move in an X-axis direction, a Y-axis direction, and a Z-axis direction. 2. The sawing / sorting system of claim 1, wherein the sorting table is plural. 2. The sawing / sorting system of claim 1, wherein a vision camera and an alignment table are installed between the mounting unit and the sawing spindle unit to inspect and correct the alignment of the strips. The sawing machine according to claim 1 or 3 or 8, wherein the first and second transfer / sawing robots and the sawing spindle units are sawed when one of the transfer / sawing robots performs sawing operation on the strip. Cleaning and drying of the completed unit packages are carried out to the sorting table, picking up a new strip from the mounting unit is arranged to perform the sorting operation by the vision camera and the alignment table, characterized in that system.

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