KR20050004649A - The Manufacturing Process of Antibiotic Laminate Flooring with Nano Silver Ion and the Antibiotic Laminate Flooring Producted by This Manufacturing Process - Google Patents
The Manufacturing Process of Antibiotic Laminate Flooring with Nano Silver Ion and the Antibiotic Laminate Flooring Producted by This Manufacturing Process Download PDFInfo
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- KR20050004649A KR20050004649A KR1020030044908A KR20030044908A KR20050004649A KR 20050004649 A KR20050004649 A KR 20050004649A KR 1020030044908 A KR1020030044908 A KR 1020030044908A KR 20030044908 A KR20030044908 A KR 20030044908A KR 20050004649 A KR20050004649 A KR 20050004649A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/02—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board the layer being formed of fibres, chips, or particles, e.g. MDF, HDF, OSB, chipboard, particle board, hardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/04—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B21/06—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/028—Paper layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
- B32B2307/7145—Rot proof, resistant to bacteria, mildew, mould, fungi
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
Description
본 발명은 은이온을 첨가한 항균 치장목질 플로링보드의 제조방법과 이에 의해 제조된 플로링보드에 관한 것이다.The present invention relates to a method for producing an antimicrobial decorative wooden flooring board added with silver ions and a flooring board produced thereby.
일반적으로 은(銀)은 은에서 발생되는 은 이온에 의하여 바이러스에 대한 살균력이 뛰어나고, 전자파나 수맥파등의 인체에 유해한 파장을 흡수, 차단하는 기능이 있어서 장신구를 비롯한 여러 용도로 사용되어 오고 있다.In general, silver has excellent sterilizing power against viruses by silver ions generated from silver, and has a function of absorbing and blocking harmful wavelengths such as electromagnetic waves and water veins, and has been used for various purposes including jewelry.
근래에는 상기한 바와 같은 살균력과 함께 유해한 파장을 흡수, 차단하는 기능 때문에 바닥재로 사용되어 오고 있다.Recently, it has been used as a flooring material because of the ability to absorb and block harmful wavelengths, as well as the bactericidal power as described above.
이러한 예를 살펴보면, 대한민국 등록실용신안 제266334호에서는 은 미립자를 바닥재를 구성하는 최상층과 최하층에 첨가시키는 구조의 바닥재를 제공하고 있고, 또한 상기한 은 미립자는 페인트에 첨가하여 상기한 바닥재를 구성하는 최상층과 최하층에 페인팅하는 방법을 사용하고 있다.Looking at this example, the Republic of Korea Utility Model No. 266334 provides a flooring of the structure in which the silver particles are added to the uppermost layer and the lowermost layer constituting the flooring, and the silver particles are added to the paint to form the flooring Painting on the top and bottom is used.
그러나 이러한 고안은 은 미립자를 바닥재를 구성하는 최상층과 최하층에 어떠한 방법에 의하여 첨가시킨다는 구체적인 내용이 결여되어 있고, 또한 페인트에 은 미립자를 첨가하여 페인팅하는 방법에 대하여 설명하고는 있으나 이때 은 미립자와 페인트간에 조성되어야 하는 조성비를 비롯하여 바닥재를 구성하는 최상층, 중앙층 및 최하층이 어떠한 수단에 의하여 일체화하여 바닥재로서의 기능을 행하는지가 불분명한 문제점이 있다.However, this design lacks the specific content of adding silver fine particles to the uppermost layer and the lowest layer constituting the floor covering, and also describes a method of adding silver fine particles to the paint and painting. It is unclear whether the uppermost layer, the middle layer, and the lowermost layer constituting the floor covering, including the composition ratio to be formed in the liver, function as a floor covering by being integrated by any means.
그리고 대한민국 공개특허공보 특 2000-0072510호에서는 금분(金分) 또는 은분(銀粉)을 사용한 적층바닥재를 제공하고 있는데 이는 합성수지인 염화비닐수지를 주재료로 사용한 합성수지 바닥재에 관한 것이다.In addition, Korean Laid-Open Patent Publication No. 2000-0072510 provides a laminated flooring material using gold powder or silver powder, which relates to a synthetic resin flooring material using vinyl chloride resin as a main material.
이는 주재료에 해당하는 합성수지를 이용하여 바닥재를 구성하는 표면층의 최상층, 이면층의 이면기능성층을 제조할 시에 이들에 금분 또는 은분을 첨가하는 방법을 통하여 상기한 바와 같은 합성수지 바닥재를 제공하여 금분 또는 은분이 가지는 고유의 기능인 항균성, 전자파의 차폐기능을 도모할 수 있다는 내용이다.This method provides a synthetic resin flooring material as described above by adding gold powder or silver powder to the top layer of the surface layer constituting the flooring material and the back functional layer of the backing layer using the synthetic resin corresponding to the main material. It is the content that antimicrobial which is inherent function of silver powder and shielding function of electromagnetic wave can be aimed at.
그러나 이는 결국 상기한 바와 같이 합성수지를 원재료로 사용하는 것이여서그에 따른 독성을 비롯한 폐 자재의 환경 오염을 유발 할 수 밖에 없는 문제점이 그대로 존재하고 있다.However, this is because the use of synthetic resin as a raw material as described above, there is a problem that can cause environmental pollution of the waste material, including the toxicity accordingly.
특히나 분말상의 은은 수용액상태에 있는 은이온수에 비하여 제품에 분산되는 분산성 및 경제성에도 문제가 있을 뿐만아니라 표면 변색을 유발하는 단점이 있다.In particular, powdered silver has a problem in dispersibility and economical efficiency as well as causing surface discoloration compared to silver ionized water in aqueous solution.
본 발명은 목재형 바닥재를 제공함에 있어서, 은이 가지는 기능인 항균성등을 나타내는 플로링보드를 제공하는데 있다.The present invention provides a flooring board exhibiting antimicrobial activity, which is a function of silver in providing a wood flooring material.
이러한 목적을 달성하기 위하여 본 발명에서는 수용액상에서 초고전압으로 은을 전기분해하는 방법에 의하여 제조되는 콜로이드 상태의 은 이온수를 사용하는데 있다.In order to achieve this object, the present invention is to use the colloidal silver ion water prepared by the method of electrolyzing silver at a very high voltage in an aqueous solution.
이때 상기한 은 이온수는 열경화성수지, 경화제, 가소제 및 이형제로 조성된조성물의 일부로 사용하여 본 발명에서 사용하는 오버레이지, 모양지 및 후면지에 침투시켜서 목재, 고 밀도 화이버 보드(HIGH DENSITY FIBER BOARD) 또는 합성목에 일체로 접착함으로서 목재로 이루어지는 항균성 플로링보드를 제조하고, 또한 이러한 제조에 의하여 제조된 플로링보드를 제공하는데 그 특징이 있다.In this case, the silver ionized water is used as a part of a composition composed of a thermosetting resin, a curing agent, a plasticizer, and a release agent to penetrate the overlay paper, the shape paper, and the back paper used in the present invention, and the wood, a high density fiber board (HIGH DENSITY FIBER BOARD) or It is characterized by providing an antimicrobial flooring board made of wood by adhering integrally to the synthetic wood, and also providing a flooring board manufactured by such manufacturing.
도 1은 본 발명의 모식도.1 is a schematic diagram of the present invention.
〈도면의 주요 부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
1: 오버레이지 2: 모양지1: overlay paper 2: shape paper
3: 후면지 5: 목재, 고 밀도 화이버 보드또는 합성목3: backing paper 5: wood, high density fiber board or synthetic wood
이하 본 발명을 첨부한 도면 도 1을 참고하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to FIG. 1.
열경화성수지 1,000g당 경화제 0.5∼2wt%, 가소제 1∼5wt%, 이형제 0.1∼2wt% 및 은 이온수 2wt% 이상으로 조성한 조성물에 오버레이(OVERLAY)지(1),모양지(2) 및 후면지(3)를 완전히 함침시키는 함침공정을 행한다.Overlay paper (1), shape paper (2) and backing paper (1), shape paper (2), and backing paper (1), shape paper (2) Impregnation process to completely impregnate 3) is performed.
이러한 함침공정에 의하여 상기한 조성물에 함침된 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)를 조성물에서 꺼내어 건조를 행하여 상기한 조성물을 경화시키되 완전한 건조를 행하지 않고 반건조의 상태인 반경화상태를 유지하는 반건조공정을 행한다.By the impregnation process, the overlay paper (1), the shape paper (2), and the backing paper (3) impregnated in the composition are removed from the composition and dried to cure the composition, but not completely dry. The semi-drying process which maintains the semi-hardened state which is a dry state is performed.
이때 상기한 건조는 필요에 따라 제조과정의 신속성 및 생산성을 위하여 오븐 드라이어와 같은 건조장치를 사용한다.At this time, the drying uses a drying apparatus such as an oven dryer for the speed and productivity of the manufacturing process as needed.
이렇게 상기한 조성물의 반경화상태를 유지하는 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)의 경화를 방지하기 위하여 항온항습장치 또는 지퍼백과 같은 밀폐성용기 내에 저장하는 저장공정을 행할 수 있다.The storage is stored in a sealed container such as a thermo-hygrostat or a zipper bag to prevent the curing of the overlay paper (1), shape paper (2) and back paper (3) to maintain the semi-cured state of the composition as described above The process can be performed.
한편 상기한 조성물에 있어서, 상기한 열경화성수지 1,000g당 경화제 0.5∼2wt%로 조성하는 것은 상기한 경화제가 0.5wt%이하로 조성하는 경우에는 본 발명에서 추구하는 반경화에 상태에 장시간을 요하는 문제점과 함께 반경화의 불량을 초래하는 문제점이 있고, 2wt%이상을 조성하는 경우에는 경화가 너무 빨리 진행하여 반경화상태를 유지하는데 어려운 문제점이 있다.On the other hand, in the composition described above, the composition of 0.5 to 2 wt% of the curing agent per 1,000 g of the thermosetting resin requires a long time to the semi-cured state pursued in the present invention when the curing agent is composed of 0.5 wt% or less. Along with the problem, there is a problem that results in poor semi-curing, and when 2wt% or more is formed, there is a problem that hardening proceeds too fast to maintain a semi-cured state.
그리고 상기한 열경화성수지 1,000g당 가소제 1∼5wt%를 조성하게 되는데 이때 상기한 가소제를 1wt%이하로 조성하는 경우에는 상기한 조성물을 함침하고 있는 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)의 유연성이 떨어지는 문제점이 있는 반면에 5wt%이상을 조성하는 경우에는 표면 물성이 저하하는 문제점이 있다.And 1 to 5wt% of the plasticizer per 1,000g of the thermosetting resin is to be formed in this case, when the plasticizer to the composition of less than 1wt% overlay paper (OVERLAY) (1), the shape paper (2) impregnated with the composition On the other hand, there is a problem in that the flexibility of the back paper (3) and the other side is lowered when the composition is 5wt% or more.
또한 상기한 열경화성수지 1,000g당 이형제 0.1∼2wt%를 조성하게 되는데 이때 상기한 이형제를 0.1wt%로 조성하는 경우에는 역시 상기한 조성물을 함침하고 있는 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)의 유연성이 떨어지는 문제점이 있는 반면에 2wt%이상을 조성하는 경우에는 접착 물성이 저하되는 문제점이 있다.In addition, 0.1 to 2 wt% of the release agent is formed per 1,000 g of the thermosetting resin, and when the release agent is 0.1 wt%, the overlay paper (1) and the shape paper (impregnated with the above composition) are also impregnated. On the other hand, 2) and the back paper (3) has a problem that the flexibility is lowered, if the composition of more than 2wt% there is a problem that the adhesive properties are lowered.
그리고 은 이온수는 열경화성수지 1,000g당 2wt%이상으로 조성하게 되는데 2wt%이하로 조성하는 경우에는 은 이온수에 함유된 은이 가지는 고유의 기능을 충분히 나타나지 않는 문제점이 있으므로 적어도 2wt%이상으로 조성하여야 한다.In addition, the silver ionized water is composed of 2wt% or more per 1,000g of the thermosetting resin. If the composition is less than 2wt%, there is a problem that the inherent function of silver contained in the silver ionized water is not sufficiently exhibited.
이러한 본 발명에 있어서 상기한 바와같은 저장공정에서 상기한 조성물을 반경화상태를 유지하고 있는 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)를 이용하여 본 발명의 플로링보드(4)를 제조하게 되는데 이는 첨부한 도면 도 1에 도시되어 있는 바와 같이 목재, 고 밀도 화이버 보드(HIGH DENSITY FIBER BOARD) 또는 합성목(5)의 저면에 상기한 조성물이 함침되어 반경화상태를 유지하고 있는 후면지(3)를 적층하고, 상기 고 밀도 화이버 보드(HIGH DENSITY FIBER BOARD) 또는 합성목(5)의 상부에는 상기한 조성물이 함침되어 반경화상태를 유지하고 있는 모양지(2)를 적층한 다음, 상기 상기한 조성물이 함침되어 반경화상태를 유지하고 있는 모양지(2)의 상부에 상기한 조성물이 함침되어 반경화상태를 유지하고 있는 오버레이지(1)를 적층하는 적층공정을 행한다.In the present invention, in the storage process as described above, the flow of the present invention using the overlay paper (1), the shape paper (2) and the backing paper (3) maintaining the semi-cured state of the composition The board 4 is manufactured, which is impregnated with the above-mentioned composition on the bottom surface of wood, high density fiber board, or synthetic wood 5, as shown in FIG. Stacking the backing paper (3) holding the, and the high density fiber board (HIGH DENSITY FIBER BOARD) or the upper part of the synthetic wood (5) is impregnated with the above composition to maintain a semi-cured state (2) ), And then laminating the overlay paper (1) which is impregnated with the composition and maintained in the semi-cured state on top of the shape paper (2) where the composition is impregnated to maintain the semi-cured state. The process is performed.
이러한 적층공정을 행하기 전에 동일한 규격을 가진 완제품의 제조를 위하여 상기한 목재, 고 밀도 화이버 보드(HIGH DENSITY FIBER BOARD) 또는 합성목(5), 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)의 크기는 동일할 필요가 있다.Before carrying out this lamination process, the above-mentioned wood, high density fiber board or synthetic wood (5), overlay paper (1), and shape paper (2) are used for the manufacture of finished products with the same specifications. ) And the backing paper 3 need to be the same size.
이를 위해서는 상기한 조성물에 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)를 함침하기 이전에 동일한 크기로 제단하는 방법을 사용할 수 있다.To this end, a method of cutting into the same size before impregnating the overlay (OVERLAY) paper, the shape paper (2) and the backing paper (3) to the composition.
이러한 적층공정을 마친 상태에서 프레스기에 투입하여 압압하는 방법에 의하여 본 발명의 플로링보드(4)를 제조하게 된다.After the lamination process is completed, the flooring board 4 of the present invention is manufactured by a method of pressing and pressing the press machine.
이때 상기한 프레스는 가열프레스를 사용하여 압압시에 열이 상기한 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)에 충분히 전달되어 상기한 조성물을 구성하는 열경화성수지에 의하여 상기한 목재, 고 밀도 화이버 보드(HIGH DENSITY FIBER BOARD) 또는 합성목(5), 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)가 서로 동시에 접착되도록 한다.At this time, the press is heated to the thermosetting resin constituting the composition by the heat is sufficiently transferred to the overlay paper (1), the shape paper (2) and the back paper (3) at the time of pressing using a heating press. By the wood, high density fiber board (HIGH DENSITY FIBER BOARD) or synthetic wood (5), overlay (OVERLAY) paper (1), shape paper (2) and the back paper (3) to be bonded to each other at the same time.
이러한 본 발명은 결국 상기한 바와 같이 오버레이(OVERLAY)지(1), 모양지(2) 및 후면지(3)를 상기한 조성물에 함침시키고, 이들을 적층한 상태에서 접착하여 일체화함으로서 은이 첨가된 목질바닥재에 해당하는 본 발명의 플로링보드(4)를 제공할 수 있게 된다.In the present invention, as described above, the overlay paper 1, the shape paper 2 and the backing paper 3 are impregnated in the above-described composition, and the wood is added with silver by bonding and integrating them in a laminated state. It is possible to provide the flooring board 4 of the present invention corresponding to the flooring.
이러한 본 발명을 실시예 1에 의하여 그 구체적인 제조 및 대장균과 녹농균에 의한 항균실험에 대하여 살펴보기로 한다.The present invention by Example 1 will be described for the specific production and antimicrobial experiments by E. coli and Pseudomonas aeruginosa.
실시예 1Example 1
열경화성수지인 멜라민수지 500g, 경화제(CT235) 2.5g, 가소제(AC291) 10g, 이형제(M306) 2g 및 은 이온수 15g(20ppm)으로 조성한 조성물이 담겨있는 용기에 크기 18×24cm의 크기를 가진 오버레이(OVERLAY)지, 모양지 및 후면지를 각각 충분히 함침시킨다.Overlay of size 18 × 24cm in a container containing a composition composed of 500g of thermosetting resin melamine resin, 2.5g of hardener (CT235), 10g of plasticizer (AC291), 2g of release agent (M306) and 15g (20ppm) of silver ionized water. Fully impregnate the overlay paper, shape paper and the back paper.
이렇게 상기한 조성물이 함친된 오버레이(OVERLAY)지, 모양지 및 후면지(이하 "함침지"라함)를 용기에서 꺼내어 와이어 바를 이용하여 표면에 잔재한 상기한 조성물을 쓸어내리는 방법을 통하여 제거한다.Thus, the overlay paper, the shape paper, and the back paper (hereinafter referred to as "impregnated paper") in which the above composition is impregnated are removed from the container and removed by wiping the above composition remaining on the surface using a wire bar.
이러한 함침지를 오븐 드라이어에 투입하여 약 125℃로 약 100초 동안 건조하여 반경화상태를 유지한다.The impregnated paper is put into an oven dryer and dried at about 125 ° C. for about 100 seconds to maintain a semi-cured state.
이러한 반경화된 상태의 함침지와 동일한 규격을 가진 고밀도 화이어 보드의 하부에는 상기한 후면지를, 상기한 고밀도 화이어 보드의 상부에는 상기한 모양지를, 그리고 상기한 모양지의 상부에는 오버레이지를 적층한 다음 프레스기에 투입하여 약 125℃의 온도를 유지하면서 압압하여 플로링보드를 제조하였다.The backing paper is laminated on the lower part of the high density wire board having the same specifications as the semi-impregnated paper in the semi-cured state, the shape paper is stacked on the top of the high density wire board, and the overlay paper is formed on the top of the paper. It was pressed in while maintaining a temperature of about 125 ℃ to prepare a flooring board.
시험예 1Test Example 1
상기한 실시예 1에 의하여 제조한 플로링보드(이하 "시료"라함)와 일반시중에서 구입한 마루바닥재(이하 "종래품"이라함; 본사 제품)를 채택하여 항균시험을 행하였다.The antimicrobial test was carried out by adopting the flooring board (hereinafter referred to as "sample") prepared in Example 1 and flooring material (hereinafter referred to as "primary"; head office product) purchased in the general market.
사용균주는 Escherichia coli ATCC 25922 및 Pseudomonas aeruginosa ATCC 15442이고, 시험방법은 KICM-FIR-1003이였다.The strains used were Escherichia coli ATCC 25922 and Pseudomonas aeruginosa ATCC 15442, and the test method was KICM-FIR-1003.
시험결과는 표 1과 같았다.The test results are shown in Table 1.
표 1Table 1
*CFU : Colony Forming UnitCFU: Colony Forming Unit
40p : 0.04 mL40p: 0.04 mL
배지상의 균주는 희석배수를 곱하여 산출한 것임The strain on the medium is calculated by multiplying the dilution factor
위의 표 1에서와 같이 본 발명의 시료에서는 세균이 크게 감소하는 장점이 나타났다.As shown in Table 1 above, the sample of the present invention showed a significant decrease in bacteria.
따라서 본 발명의 플로링 보드는 살균력이 월등한 것임을 확인할 수 있다.Therefore, the flooring board of the present invention can confirm that the sterilization power is excellent.
이상 상기에서 실핀바와 같이 본 발명에서는 수용액상에서 초고전압으로 은을 전기분해하는 방법에 의하여 제조되는 콜로이드 상태의 은 이온수를 사용함에있어서, 은 이온수를 열경화성수지, 경화제, 가소제 및 이형제로 조성된 조성물의 일부로 사용하여 본 발명에서 사용하는 오버레이지, 모양지 및 후면지에 침투시켜서 목재, 고 밀도 화이버 보드(HIGH DENSITY FIBER BOARD) 또는 합성목에 일체로 접착함으로서 목재로 이루어지는 항균성 플로링보드를 제조하고, 또한 이러한 제조에 의하여 제조된 플로링보드는 종래와 같이 학교 교실의 바닥재, 가정의 거실, 음식점의 바닥재로 사용할 수 있다.In the present invention, as described above, in the present invention, in the use of colloidal silver ionized water prepared by the method of electrolytically treating silver at an extremely high voltage in an aqueous solution, the silver ionized water may be formed of a thermosetting resin, a curing agent, a plasticizer, and a release agent. It is used as a part to penetrate the overlay paper, shape paper and backing paper used in the present invention to produce an antimicrobial flooring board made of wood by integrally adhering to wood, HIGH DENSITY FIBER BOARD or synthetic wood. The manufactured flooring board may be used as a flooring material for school classrooms, a living room of a home, or a flooring material of a restaurant as in the prior art.
이상 상기에서 살핀바와 같이, 본 발명의 플로링보드는 종래와 같이 학교 교실의 바닥재, 가정의 거실, 음식점의 바닥재로 사용할 수 있고, 이러한 본 발명의 프로링보드에 의하여 항균성, 방충성 및 전자파의 차폐기능등을 제공할 수 있는 목재형 바닥재를 제공하는 매우 유용한 발명이다.As described above, as the salping bar, the flooring board of the present invention can be used as a flooring material of a school classroom, a living room of a home, a restaurant as in the prior art, and the antimicrobial, insect repellent, and shielding of electromagnetic waves by the proing board of the present invention. It is a very useful invention to provide a wooden floor covering that can provide a function and the like.
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