KR200472122Y1 - Face to face type working equipment for electronic unit - Google Patents

Abstract

The present invention relates to a replacement type electronic work equipment, the test handler is to control and integrate the operation of the material supply device, material collection device, work device, transport device and each device on the machine equipment to perform the automation work The central control unit is installed, the material supply device to load the electronic components waiting to perform at least one operation, the material collection device to load the electronic components of at least one work is completed, the transport device is supplied with material At least one pick-and-place equipment for the transport of electronic components between the device, the material collection device and the work device is installed, wherein the work device is provided in plural at least two sides of the machine. There are work sections installed facing each other in front of each other, and each work section supports electronic parts and performs work. A support is provided for carrying out the operation, and by using a method of installing the work sections facing each other, it is possible to effectively shorten the transport stroke of the transport apparatus and to effectively reduce the space that the mechanical equipment finds on the mechanical equipment. A practical effect can be achieved by easily expanding the work interval under the premise.

Description

FACE TO FACE TYPE WORKING EQUIPMENT FOR ELECTRONIC UNIT}

The present invention relates to a replacement type electronic work equipment that can easily shorten the transport stroke of the transportation device and expand the work interval on the premise that it can effectively reduce the space occupied on the mechanical equipment.

Referring to Figures 1 and 2, these figures are Taiwan Patent Application No. 91105851 'IC Test Handler' patent agenda, the test handler is a material supply box / elevator 11, the empty box in front of the hardware (10) The elevator 12 and the output box 13 are respectively installed, the material supply box / elevator 11 is equipped with a test standby IC, and the empty box / elevator 12 is a material supply box / elevator 11 A blank material supply box, which has been used, is delivered from and can be taken out with the support of the output box as needed so that the tested IC can be placed, and the output box 13 is divided into different grades of the tested IC. Can be subdivided into different grade output boxes 13a, 13b, 13c, 13d so as to store the plurality of test ports, and a plurality of test ports 14a, 14b, 14c, 14d are installed at the rear end of the machine 10. , Each test port 14a, 14b, 14c, 14d) is provided with test panels 16a, 16b, 16c, and 16d arranged in parallel and having test sockets 15a, 15b, 15c, and 15d therein, and test panels 16a, 16b, 16c, and 16d. ), A pair of test standby IC rotational buffers 17a, 17b, 17c, and 17d and test IC rotational buffers 18a, 18b, 18c, and 18d, respectively, are provided at the front end. 19) between the material supply box / lift 11, each test port 14a, 14b, 14c, 14d and the output box 13a, 13b, 13c so that the test standby IC can be preheated before testing. By roaming, the preheating box 20 can be further installed so as to be dedicated to IC transportation work between the apparatuses, and to perform preheating work before the test on the IC waiting to be tested. Accordingly, during the IC test operation, the IC arrangement direction of the test sockets 15a, 15b, 15c, and 15d of the test panels 16a, 16b, 16c, and 16d, and the IC arrangement direction of the inside of the material supply box / lift 11 In this case, first, the test standby IC on the material supply box / lift 11 is directly taken out by the IC transport mechanism 19 to be transported to each test socket 15a, 15b, 15c, and 15d, and then placed. After completion, the IC transporter 19 again extracts the tested ICs in the test sockets 15a, 15b, 15c, and 15d, respectively, and returns the tested ICs to the respective output boxes 13a, 13b, 13c, 13d, and the CI placement direction of the test sockets 15a, 15b, 15c, and 15d of the test panels 16a, 16b, 16c, and 16d and the IC placement direction in the material supply box / elevator 11 are different. In this case, the test standby IC on the material supply box / lift 11 is first taken out to the IC transport mechanism 19, Transport and place on the test standby IC rotary buffers 17a, 17b, 17c, and 17d, and rotate the direction of the test standby IC rotary buffers 17a, 17b, 17c, and 17d so that the respective IC positions are Make the same as the test sockets 15a, 15b, 15c and 15d, and then put the IC back into the respective test sockets 15a, 15b, 15c and 15d with the IC transporter 19 and again after the test is completed. The IC transport mechanism 19 extracts the tested ICs inside the respective test sockets 15a, 15b, 15c, and 15d and arranges them on the tested IC rotation buffers 18a, 18b, 18c, and 18d, respectively. The position is the same as that of the output boxes 13a, 13b, 13c, and 13d, and then the IC transport mechanism 19 again transfers the tested ICs to the respective output boxes 13a, 13b, 13c, and 13d according to the test results. Transport and place. However, the design and structure of the test handler has the following problems.

1. Each of the test ports 14a, 14b, 14c, and 14d according to the test handler is provided with test panels 16a, 16b, 16c, and 16d arranged in parallel at the rear end of the machine 10. Therefore, if additional test ports are installed as necessary, the machine body must be continuously extended to both sides, so that the use of factory space becomes insufficient as the machine body grows.

2. When the test port is additionally installed as the machine body of the test handler extends steadily toward both sides, the IC transport mechanism 19 must ensure that the respective test sockets 15a, 15b, 15c, 15d) and between the material supply box / elevator 11 and the output box 13a, 13b, 13c, 13d, so that the IC transport mechanism 19 generates a load according to the work and As a result, the IC operation cannot be performed smoothly, which may cause some test ports to wait, which may reduce the production efficiency of the test operation.

Therefore, the design theme of the present invention is based on the research and development and production experiences of the inventors for a long time in the relevant industry, and the researcher has been studying and contemplating the problems that are currently faced. By presenting a work facility to increase the speed, thereby to effectively improve the problems of the prior art.

The present invention is to solve the above-mentioned problems of the prior art, the object of the present invention is a material supply device, a material collection device, a work device and a transport device is disposed on the machine, wherein the work device is a machine At least two side ends of the facility are provided with a work section installed so that a plurality of pieces face each other, and each work section is provided with at least one support for supporting the electronic parts and performing the work. By providing a work section facing each other at the side end, it is possible to provide a replacement electronic parts work equipment that can obtain practical efficacies that can be easily expanded on the premise of effectively reducing the space occupied by the mechanical equipment. have.

Another object of the present invention is a material feeder, a material collecting device, a work device and a transport device are arranged on a machine, wherein the work device is installed so that a plurality of the machine tools face each other on at least two side ends of the machine. Work sections are installed, and each work section is provided with at least one support for supporting electronic parts and performing work. Accordingly, the work sections are installed on two sides of the machine to face each other. The present invention provides a replacement-type electronic component working facility that can effectively shorten a transport stroke of a transportation device so as to secure production efficiency according to work.

The present invention for solving the above object, the material supply device for loading an electronic component waiting to perform at least one test operation; A material collection device for loading an electronic component having at least one work completed; A work device having a plurality of work sections installed on the first side end and the second side end of the mechanical facility, the working device having a support for loading electronic components and performing work; A first pick-and-place equipment, a second pick-and-place equipment, a third pick-and-place equipment, and at least one transshipment rack; 1 Pick-and-Place (Pick-and-Place) equipment transfers the electronic parts waiting to perform work in the material supply device to the transhipment, and transfers the electronic components completed work in the transit rack to the material collection device is classified. And the second pick-and-place equipment transfers the electronic parts waiting to be carried out by the transit stand into each of the supports of the first side work zone and completes the work. An electronic component waiting to carry out the work transferred from the transit stand, and the third pick-and-place equipment is transferred from the support stand to each of the supports on the first side work zone. The transport device consisting of a structure for transporting as transshipment the electronic components as well as completion of the job and also sent to the inside of the support of each side end of the second work section in each of the support side end of the second work area; And a central control unit for controlling and integrating operation of each device to perform an automated operation.

The present invention can effectively shorten the transport stroke of the transport device by using a work section in which two side ends face each other on a machine, and work on the premise of effectively reducing the space occupied by the machine. By easily expanding the intervals, it is possible to increase the production capacity according to the test work.

Figure 1 is a perspective view showing the arrangement status of the Taiwan Patent Application No. 91105851 'IC test handler' patent agenda.
Figure 2 is a perspective view showing a part of the appearance of the Taiwan Patent Application No. 91105851 'IC test handler' patent agenda.
Figure 3 is a perspective view showing the structure of the replacement electronic unit work facility according to the present invention.
4 is a perspective view showing the first and second transshipment band according to the present invention.
5 is a perspective view showing a test section and pick-and-place equipment of two side ends according to the present invention.
Figure 6 is a first perspective view showing the operation of the present invention.
7 is a second perspective view showing the operation of the present invention.
8 is a third perspective view showing the operation of the present invention.
9 is a fourth perspective view showing the operation of the present invention.
10 is a fifth perspective view showing the operation of the present invention.
11 is a first perspective view showing a composite material collection device according to the present invention.
12 is a second perspective view showing a composite material collection device according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to Figure 3, the replacement electronic component work equipment according to the present invention, the material supply device 31, plate device 32, material collection device 33, work device 34, It comprises a transport device 35 and a central control unit (not shown) for controlling and integrating the operation of each device to perform automated tasks.

The material supply device 31 may lift and lift a plurality of trays 311, and each tray 311 may load at least one electronic component waiting to perform a task.

The plate device 32 can lift and lift a plurality of hollow trays 321, and transfer the hollow trays of the material supply device 31 to the plate device 32 by the tray feeder 322. Alternatively, the hollow tray on the plate device 32 is transferred to the material collection device 33.

The material collecting device 33 loads electronic products having at least one work completed. In the present embodiment, the material collecting device 33 includes a first-class material collecting device 331, a second-class material collecting device 332, and The composite material collection device 333 of grades 3-16 (see below) is installed.

The work device 34 is provided with a work section installed on two side ends of the machine 30 to face each other. In the present embodiment, each of the first and second side ends of the machine 30 is installed. Six working periods (34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34j, 34k, 34l) are installed, and each working period (34a, 34b, 34c, 34d, 34e, 34f) , 34g, 34h, 34i, 34j, 34k, 34l) are provided with a support for supporting electronic components. In the present embodiment, the respective working sections 34a, 34b, 34c, 34d, 34e, 34f, 34g , 34h, 34i, 34j, 34k, 34l) perform test work on electronic components, and each work section 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34j, 34k, 34l ) Is provided with a test circuit board 342 of at least one test socket 341 for inserting an electronic component and performing a test operation.

The present invention can effectively reduce the space found in the mechanical equipment by installing the work sections facing each other on the first side and the second side of the mechanical equipment, and increase the test production capacity by easily expanding the working zone. It is.

In addition, the test sockets 341 in each of the work sections 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34j, 34k, and 34l consist of normally open test sockets or normally closed test sockets. In this embodiment, each test socket 341 is the open test socket, and each test socket 341 is used to maintain excellent electrical contact between the electronic component waiting to be tested and each test socket 341. ), A press head 323 capable of raising and lowering the pressure of the electronic component that is waiting for testing is provided.

However, when each test socket 341 is the closed test socket, the press head 343 causes the open test socket to be opened by a pressure lift so that an electronic component waiting to perform a test operation can be inserted.

The transport device 35 transports the electronic parts waiting to perform the test work or the electronic parts in which the test work is completed between the material supply device 31, the material collection device 33, and the work device 34. As the work section is installed to face each other at the first side end and the second side end of the transport device 35, the material supply device 31, the material collection device 33 and the work device ( 34) Ship the electronic parts waiting for the test work or the electronic parts that have been tested.

In the present embodiment, the transport device 35 includes a first pick-and-place equipment 351, a second pick-and-place equipment 352, and a third pick-and-place equipment -and-place equipment 353, the first transit stand 354 and the second transit stand 355 is installed, the first pick-and-place equipment (351) is a machine (30) ), Which is installed at the front end and is movable in three axes, and which is waiting for a test operation in the tray 311 of the material supply device 31, the first transshipment rack 354 or the second transshipment rack 355. A first suction nozzle 3511 for transferring and sorting the electronic components, which have been tested in the first transit post 354 or the second transit post 355, to the material collection device 33 for sorting. A second suction nozzle 3512 is provided.

3 and 4, according to the present invention, the first transit post 354 and the second transhipment post 355 may include working sections 34a, 34b, 34c, 34d, and two side ends of the machine 30. 34e, 34f, 34g, 34h, 34i, 34j, 34k, 34l, respectively, are installed at the front side ends, and the first transit stand 354 is the first material supply stand 3651 and the first material collection stand 3542 ), The first material supply stand 3551 is loaded with electronic components waiting to perform a test operation transferred from the first pick-and-place equipment 351, and the first material collection stand 3542. ) Is loaded with the electronic component in which the test work transferred from the second pick-and-place equipment 352 is completed.

The second transit stand 355 is the same as the first transit stand 354, and includes a second material supply stand 3551 and a second material collection stand 3652, and the second material supply stand 3551 is provided with a second material supply stand 3551. The electronic component waiting to perform the test operation transferred from the first pick-and-place equipment 351 is loaded, and the second pick-and-place equipment ( The electronic component in which the test operation transferred in 352 is completed is loaded.

In this embodiment, in the first transshipment stand 354 or the second transit stand 355 according to the present invention, the first material supply stand 3551 and the first material collection stand 3542 (second material supply stand (3551) and the second material collection stand (3552)) when the electronic component arrangement direction of the test socket 341 and the arrangement direction of the electronic components waiting to perform the test work inside the material supply device 31 is different from each position It slides in a straight line according to the movement of the first drive source (3543) (3553), and rotates in accordance with the movement of the second drive source (3544) (3554), so as to be used in the electronic component placement direction of the test socket (341) When the arrangement direction of the electronic parts waiting to perform the test work inside the material supply device 31 is the same, the first material supply stand 3551 and the first material collection stand 3542) (the second material supply stand 3551) And second material collection stand 3652).

3 and 5, the second pick-and-place equipment 352 and the third pick-and-place equipment 353 are the first side ends of the hardware 30. And side ends corresponding to the work sections 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, 34i, 34j, 34k, and 34l of the second side ends, respectively, and are movable in three axes.

The second pick-and-place equipment 352 moves between the first end work sections 34a, 34b, 34c, 34d, 34e, 34f and the second transit stage 354, and the third suction A first monitor 3523 capable of being composed of a nozzle 3151, a fourth suction nozzle 3352, and a CCD is provided, and the first monitor 3523 has an electronic component in which test work is completed in each test socket 341. The first suction nozzle 3251 and the fourth suction nozzle 3352 to monitor whether the electronic component, which is waiting to perform a test operation, is placed in the correct position. ) Transfers the electronic components waiting for the test work in the first transit stand 354 into the respective test sorts 341 and transfers the electronic parts in which the test work is completed to the first transit inside the respective test sockets 341. Transfer to table 354.

The third pick-and-place equipment 353 moves between the work sections 34g, 34h, 34i, 34j, 34k, 34l and the second transit stage 355 and the fifth suction at the second side end. And a second monitor 353 that can be configured as a nozzle 3531, a sixth suction nozzle 3532, and a CCD, and the second monitor 3333 is an electronic component in which test work is completed in each test socket 341. Whether the electronic component, which is waiting to perform a test operation, is placed in the correct position in each test socket 341, and the fifth suction nozzle 3531 and the sixth suction nozzle 3532 are monitored. ) Transfers the electronic component, which is waiting for a test operation, in the second transit zone 355 into each test sortet 341, and transfers the electronic component in which the test operation is completed to the second transit inside each test socket 341. Transfer to the stage (355).

In addition, a first heating tray 36 and a second heating tray 37 are installed at a suitable position of the mechanical equipment 30 to perform a preheating operation on the electronic components that are waiting to perform a test operation.

Referring to FIG. 6, the present invention uses the first pick-and-place equipment 351 to wait for a test operation to be performed inside a tray 311 of a material supply device 31. Is transferred to the first material supply stand 3551 of the first transshipment stand 354 or the second material supply stand 3551 of the second transshipment stand 355, respectively.

Referring to Fig. 7, the first transit post 354 and the second transit post 355 are then tested at a slight distance through the linear slide (the electronic component placement direction of the test socket 341 and the material supply device 31 inside). When the arrangement direction of the electronic parts waiting to be performed is the same, the first material supply stand 2551 and the first material collection stand 3542 of the first transit stand 354 and the second of the second transit stand 355 may be used. Moving the material supply stand 3551 and the second material collection stand 3652, and the second pick-and-place equipment 352 is moved to the first transit post 354. Move to the position of the first material supply stand (3541) to take out the electronic component (40a) waiting to perform the test work, and move again to the work section 34a of the first side end, the third pick-and-place The equipment 353 moves to the position of the second material supply stand 3551 of the second transshipment stand 355 and is ready to perform another test work. The electronic component 40a was taken out and moved back to the work section 34g at the second side end.

Referring to FIG. 8, inside the work section 34a of the first side end, there are electronic components that have already been tested, and the second pick-and-place equipment 352 firstly uses the fourth suction nozzle ( 3522, the test part 341 is sucked into the electronic component 41a in which the test work is completed, and the first monitor 3523 checks whether the electronic component in which the test work is completed is removed from the test socket 341. In addition, the third suction nozzle 3351 inserts the electronic component 41a waiting to perform the test operation into the test socket 341 of the work section 34a, and the test socket 341 by the first monitor 3523. When it is confirmed whether the electronic component 40a waiting to perform an internal test operation is placed in the correct position, the press head 343 descends and the electronic component 40a waiting to perform a test operation inside the test socket 341 is checked. Pressing test can be To be, and to maintain the test socket 341 and the excellent electrical contact, wherein the third pick & place (pick-and-place) device 353 proceeds the same action on the work section (34g) of the second side end.

Referring to FIG. 9, when the second pick-and-place equipment 352 moves to the position of the first transit zone 354, the first pick-and-place equipment 351 may be used. Second pick-and-place equipment 352 as the electronic component 40a already waiting to perform another test operation is moved onto the first material supply stand 3551 of the first transit stand 354. ), The fourth suction nozzle 3352 is placed on the first material collection stand (3542) of the first transit stage 354, the electronic component (41a) completed the test operation, and at the same time to the third suction nozzle (3521) The electronic component 40a waiting to perform another test work on the first material supply stand 3551 is taken out and transferred back to the work section 34b of the first side end, and at this time, a third pick-and-place equipment 353 proceeds with the same operation at the second transit zone 355.

Referring to FIG. 10, the first pick-and-place equipment 351 again moves the electronic component 40a waiting to perform another test operation to the first material supply stand of the first transshipment stand 354. 3541), and at the same time, the electronic component 41a of which the test work is completed is taken out on the first material collection stand 3542 of the first transshipment stand 354, and the electronic component 41a of which the test work is completed is tested. Classified according to the results are placed in the first grade material collection device 331 or the second grade material collection device 32 or the composite material collection device 333 of 3 to 16 grades.

Referring to FIG. 11, in the case where it is desired to collect electronic parts classified into different grades ranging from the first to tenth grades as the test grades of the electronic components are subdivided and added to ten or more grades, there are ten or more materials on the machine equipment. The collection device should be extended horizontally. In this case, a problem arises in that the machine main body is continuously expanded to both sides, and as the machine main body is enlarged enormously, a lot of space is found and a problem of insufficient factory utilization space is caused. However, if ten or more material collecting devices are not added, the test grades are not able to cope with the expanded test grades, and thus the test grades are limited and thus the test quality cannot be provided. Thus, the present invention is attributed to some of the relatively low test grade composite material collection device 333 housed.

The composite material collection device 333 includes a storage box 3331 composed of an upright multi-layered box body, a material collection tray 3334 for mounting and supporting electronic components that have been tested by a plurality of different grades, and a storage box 3331. Tray feeder 3332 for supporting each material collecting tray 3332 output from the tray and tray feeder for transferring each material collecting tray 3332 in the storage box 3331 onto the tray loader 3332. 3333.

Since the storage box 3331 is an upright multi-layered box body, each material collection tray 3334 of the storage box 3331 is carried out so that the electronic parts for which each test operation is completed can be sorted and arranged. Using the manner in which the 3331 moves up or down, and the tray loading unit 3332 lifts up and down, the corresponding material collection tray 3332 is taken out from the storage box 3331. In this embodiment, the tray loader 3332 moves up and down. The corresponding material collection tray 3334 is carried out through the process.

The tray loader 3332 is elevated by driving of the first power set 3335, a tray feeder 3333 is mounted on the tray loader 3332, and the tray feeder 3333 is a second drive set 3336. To move the position in the horizontal direction by the driving of the sheet), to transfer the respective material collection trays 3332 of the storage box 3331 onto the tray feeder 3332, and to rise to an appropriate position on the tray stacker 3332 again. As a result, the first pick-and-place equipment 351 classifies the electronic component 41a on which the test work is completed according to the test result, and arranges the electronic component 41a on the composite material collection device 333.

Although the present invention has been described in detail through specific embodiments, it is for explaining the present invention in detail, and the printed circuit board according to the present invention is not limited thereto, and the general knowledge in the art within the technical spirit of the present invention. It is obvious that modifications and improvements are possible by those who have.

All simple modifications and variations of the present invention belong to the scope of the present invention, the specific scope of protection of the present invention will be apparent by the appended claims.

Prior art part:
10: Hardware
11: material supply box / elevator
12: empty box / lift
13, 13a, 13b, 13c: output box
14a, 14b, 14c, 14d: test port
15a, 15b, 15c, 15d: test stand
16a, 16b, 16c, 16d: test panel
17a, 17b, 17c, 17d: test standby IC rotating buffer
18a, 18b, 18c, 18d: Tested IC Swivel Band
19: IC transport mechanism
20: preheat box

Part of the present invention:
30: machinery 31: material supply device
311 tray 32 plate device
321 tray 322 tray feeder
33: Material collection device 331: Class 1 material collection device
332: class 2 material collection device 333: composite material collection device
34: work equipment
34a, 34b, 34c, 34d, 34e, 34f: working period
34g, 34h, 34i, 34j, 34k, 34l: Work section
341 test socket 342 test circuit board
343: press head 35: transportation device
351: first pick-and-place equipment
3511: first suction nozzle 3512: second suction nozzle
352: second pick-and-place equipment
3521: third suction nozzle 3522: fourth suction nozzle
3523: first monitor
353: third pick-and-place device
3531: fifth suction nozzle 3532: sixth suction nozzle
3533: second monitor 354: first transshipment band
3541: 1st material supply stand 3542: 1st material collection stand
355: Second transhipment
3551: second material supply stand 3 552: second material collection stand
36: 1st heating tray 37: 2nd heating tray

Claims (10)

A material supply device for loading an electronic component waiting to perform at least one test operation;
A material collection device for loading an electronic component having at least one work completed;
A work device having a plurality of work sections installed on the first side end and the second side end of the mechanical facility, the working device having a support for loading electronic components and performing work;
A first pick-and-place equipment, a second pick-and-place equipment, a third pick-and-place equipment, and at least one transshipment rack; 1 Pick-and-Place (Pick-and-Place) equipment transfers the electronic parts waiting to perform work in the material supply device to the transhipment, and transfers the electronic components completed work in the transit rack to the material collection device is classified. And the second pick-and-place equipment transfers the electronic parts waiting to be carried out by the transit stand into each of the supports of the first side work zone and completes the work. An electronic component waiting to carry out the work transferred from the transit stand, and the third pick-and-place equipment is transferred from the support stand to each of the supports on the first side work zone. The transport device consisting of a structure for transporting as transshipment the electronic components as well as completion of the job and also sent to the inside of the support of each side end of the second work section in each of the support side end of the second work area;
A central control unit that controls and integrates the operation of each device to perform automated tasks; And
A plate device,
The plate device loads the empty tray and transfers the empty tray of the material supply device to the plate device by a tray transferer, or replaces the empty tray on the plate device to the material collection device. Parts work equipment.
delete The method according to claim 1,
The material collection device is provided with a composite material collection device, the composite material collection device is a storage box consisting of an upright multi-layered box, the material collection for mounting and holding the electronic components that have been tested by a plurality of different grades Replaceable electronic components including a tray and a tray loader for supporting each of the material collection trays output from the storage box, and a tray feeder for transferring each of the material collection trays in the storage box onto the tray loader. Work equipment.
The method of claim 3,
The tray loader is lifted by the driving of the first power set, and the tray conveyor is mounted on the tray loader, and the tray conveyor is moved in the horizontal direction by the drive of the second power set to move the position of the storage box. And discharging each of the material collection trays to the tray loader, and causing the transportation device to classify and arrange the finished electronic parts according to the work result.
The method according to claim 1,
Each support of the first side end and the second side end of the work device is a test socket, which is used to support the electronic parts and to carry out the test work.
The method of claim 5,
A replacement electronic component having a press head for pressing an electronic component waiting to perform a test operation or pressing the test socket to be opened at an upper end of each test socket of the first side end and the second side end of the work device. Work equipment.
The method according to claim 1,
The transport apparatus is provided with a first transshipment rack and a second transshipment rack, and the first pick-and-place equipment includes the first transponder and the electronic component waiting to perform work in the material supply device. In addition to transferring to a second transshipment, the electronic parts that have been completed in the first transshipment and the second transit zone are transferred to the material collection device, sorted and placed, and the second pick-and-place equipment The electronic component, which is waiting to perform the work transferred from the first transit stand, is transferred to the support inside the first side work zone, and the electronic parts of which work is completed within the respective support stands of the first side work zone are The third pick-and-place equipment is transferred to the first transit stand, and the third pick-and-place equipment transfers the electronic parts waiting to be performed from the second transit stand to each of the supporting sections of the second side work section. And an electronic component work facility for transferring the finished electronic component to the second transshipment in each of the supports of the second side work section. The method of claim 7,
The first transit stand is provided with a first material supply stand and a first material collection stand, and the first material supply stand is an electron waiting to perform a job transferred from the first pick-and-place equipment. A component is disposed, and the first material collection stand is disposed with an electronic component having completed work transferred from the second pick-and-place equipment, and the second transit stand is provided with a second material supply stand and a second material. A material collection stand is installed, and the second material supply stand is arranged with an electronic component waiting to perform a job transferred from the first pick-and-place equipment, and the second material collection stand is disposed with the second material supply stand. 3 Pick-and-place equipment that replaces electronic components that have been transferred from pick-and-place equipment. The method according to claim 8,
The first material supply stand, the first material collection stand, the second material supply stand and the second material supply stand and the second material collection stand of the first transit stand are performed in the electronic component arrangement direction of the support and inside the material supply device. When the arrangement direction of the electronic components in the standby is different, used for switching the angular position is a batch type electronic component work equipment that slides in a straight line according to the movement of the first drive source and rotates according to the movement of the second drive source.
The method according to claim 1,
On the second pick-and-place equipment and the third pick-and-place equipment of the transport apparatus, whether or not the completed electronic components are removed from the inside of each support, or each And a monitor for monitoring whether the electronic component waiting to perform work in the support is correctly disposed.

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