KR20030097291A - Apparatus for Cleaning Substrate in Manufacturing Process of LCD - Google Patents
Apparatus for Cleaning Substrate in Manufacturing Process of LCD Download PDFInfo
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- KR20030097291A KR20030097291A KR1020020034599A KR20020034599A KR20030097291A KR 20030097291 A KR20030097291 A KR 20030097291A KR 1020020034599 A KR1020020034599 A KR 1020020034599A KR 20020034599 A KR20020034599 A KR 20020034599A KR 20030097291 A KR20030097291 A KR 20030097291A
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- substrate
- contact angle
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- D—TEXTILES; PAPER
- D05—SEWING; EMBROIDERING; TUFTING
- D05C—EMBROIDERING; TUFTING
- D05C7/00—Special-purpose or automatic embroidering machines
- D05C7/08—Special-purpose or automatic embroidering machines for attaching cords, tapes, bands, or the like
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- D—TEXTILES; PAPER
- D05—SEWING; EMBROIDERING; TUFTING
- D05D—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES D05B AND D05C, RELATING TO SEWING, EMBROIDERING AND TUFTING
- D05D2303/00—Applied objects or articles
- D05D2303/40—Electronic or electrical components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
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- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
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Abstract
본 발명은 액정표시장치 제조용 세정장치에 관한 것으로, 액정표시장치를 제조하는 공정 중 기판에 패턴을 형성하기 전의 성막전 세정장치에서 기판 표면의 접촉각을 인라인 상에서 측정하여 세정상태를 지속적으로 모니터링할 수 있도록 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus for manufacturing a liquid crystal display device, wherein the cleaning angle can be continuously monitored by measuring the contact angle of the surface of the substrate on an in-line in a pre-film cleaning apparatus before forming a pattern on the substrate during the manufacturing process of the liquid crystal display device. It would be.
이를 위해 본 발명은, 기판에 엑시머(Excimer) UV를 조사하는 광조사부와, 상기 광조사부로 기판을 이송하여 주는 제 1컨베이어와, 상기 광조사부로부터 기판을 받아 탈이온수 세정부로 이송하는 제 2컨베이어를 포함하여 구성된 세정장치에 있어서, 상기 제 2컨베이어 상에 광조사부로부터 반출된 기판의 특정 지점에 대한 접촉각을 측정하는 접촉각 측정기가 설치된 것을 특징으로 하는 액정표시장치 제조용 세정장치를 제공한다.To this end, the present invention, a light irradiation unit for irradiating the excimer UV to the substrate, a first conveyor for transferring the substrate to the light irradiation unit, and a second receiving the substrate from the light irradiation unit to the deionized water cleaning unit A cleaning apparatus including a conveyor, the cleaning apparatus for manufacturing a liquid crystal display device, characterized in that a contact angle measuring device for measuring a contact angle with respect to a specific point of the substrate taken out from the light irradiation unit on the second conveyor.
Description
본 발명은 액정표시장치를 제조하는 공정에서 기판을 세정하는 장치에 관한 것으로, 특히 액정표시장치를 제조하는 공정 중 기판에 패턴을 형성하기 전의 성막전 세정장치에서 기판 표면의 접촉각을 인라인 상에서 측정하여 세정상태를 감지할 수 있도록 한 액정표시장치 제조용 세정장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for cleaning a substrate in a process of manufacturing a liquid crystal display, and in particular, by measuring the contact angle of the surface of the substrate on an in-line in a pre-film cleaning apparatus before forming a pattern on the substrate during the process of manufacturing a liquid crystal display. The present invention relates to a cleaning apparatus for manufacturing a liquid crystal display device capable of detecting a cleaning state.
일반적으로, 액정표시장치의 제조공정중 기판에 TFT 패턴막을 형성하기 전에 성막전 세정장치에서는 엑시머(Excimer) UV를 조사하여 기판 위의 유기막 성분의 결합을 끊은 다음, 탈이온수(DI water)를 이용한 세정에 의해 유기막을 제거하게 된다.In general, before forming the TFT pattern film on the substrate during the manufacturing process of the liquid crystal display device, the pre-film cleaning apparatus irradiates excimer UV to break the organic film components on the substrate, and then removes DI water. The organic film is removed by the used washing.
그런데, 상기와 같은 성막전 세정장치에서 엑시머 UV를 조사할 때 엑시머 UV의 조사에 이상이 발생하여 유기막 성분의 제거가 완벽히 수행되지 않을 경우, 증착막 하부로 에칭(wet etching) 공정을 진행할 때 증착막이 들떠 증착막 하부로 에칭액이 침투하여 데이터 라인(data line) 및 게이트라인(gate line)의 오픈(open) 불량 및 수율 저하를 가져오게 되는데, 종래의 세정장치는 엑시머 UV를 조사하여 처리한 후 기판에 대한 접촉각을 즉각적으로 모니터링(monitoring)할 수 있는 구성이 되어 있지 아니하므로, 일정 주기별로 작업자가 육안으로 기판의 표면 상태를 검사하거나 별도의 측정용 기판에 엑시머 UV를 조사한 후 이를 측정장치 내에 투입하여 기판의 접촉각을 측정함으로써 엑시머 UV의 접촉각 저하현상을 감지하여 왔다.However, when the excimer UV is irradiated when the excimer UV is irradiated in the pre-film cleaning apparatus as described above, when the removal of the organic film component is not completely performed, the deposition film is performed when the wet etching process is performed under the deposition film. The etching liquid penetrates into the lower portion of the deposited film, resulting in poor openness of the data line and gate line and a decrease in yield. The conventional cleaning apparatus irradiates excimer UV and then processes the substrate. Since it is not configured to immediately monitor the contact angle with respect to the operator, the operator inspects the surface state of the substrate visually at regular intervals or irradiates excimer UV on a separate measuring substrate and puts it into the measuring device. The contact angle of the excimer UV has been detected by measuring the contact angle of the substrate.
그러나, 이와 같이 일정 주기별로 육안 또는 별도 측정장비를 사용하여 엑시머 UV의 성능을 감지하는 방식으로는 지속적이고 신속한 대응이 어려워 세정불량 발생이 증가하고 수율이 저하되는 문제가 초래되었다.However, the method of detecting the excimer UV performance using the naked eye or separate measuring equipment at regular intervals as described above is difficult to continuously and quickly respond, resulting in an increase in poor cleaning and a decrease in yield.
이에 본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로, 엑시머 UV의 조사가 이루어지고 난 후 다음 처리 위치로 이송되는 라인 상에서 기판의접촉각을 지속적으로 모니터링할 수 있도록 함으로써 즉각적이고 지속적인 대응이 가능하도록 한 액정표시장치 제조용 세정장치를 제공함에 그 목적이 있다.Accordingly, the present invention has been made to solve the above problems, it is possible to immediately and continuously respond by continuously monitoring the contact angle of the substrate on the line transferred to the next processing position after the excimer UV irradiation is made It is an object of the present invention to provide a cleaning device for manufacturing a liquid crystal display device.
도 1은 본 발명에 따른 액정표시장치 제조용 세정장치의 구성을 개략적으로 나타낸 측면 구성도1 is a side configuration diagram schematically showing the configuration of a cleaning apparatus for manufacturing a liquid crystal display device according to the present invention.
도 2 내지 도 4는 도 1의 세정장치의 작동을 설명하는 개략적인 평면도2 to 4 are schematic plan views illustrating the operation of the cleaning device of FIG.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1 : 광조사부 2 : 세정부1: light irradiation unit 2: cleaning unit
3 : 버퍼부 31 : 상부 컨베이어3: buffer part 31: upper conveyor
32 : 하부 컨베이어 33 : 접촉각 측정기32: lower conveyor 33: contact angle measuring instrument
5 : 기판5: substrate
상기와 같은 목적을 달성하기 위하여 본 발명은, 기판에 엑시머(Excimer) UV를 조사하는 광조사부와, 상기 광조사부로 기판을 이송하여 주는 제 1컨베이어와, 상기 광조사부로부터 기판을 받아 탈이온수 세정부로 이송하는 제 2컨베이어를 포함하여 구성된 세정장치에 있어서, 상기 제 2컨베이어 상에 광조사부로부터 반출된 기판의 특정 지점에 대한 접촉각을 측정하는 접촉각 측정기가 설치된 것을 특징으로 하는 액정표시장치 제조용 세정장치를 제공한다.In order to achieve the above object, the present invention, the light irradiation unit for irradiating the excimer (UV) to the substrate, a first conveyor for transferring the substrate to the light irradiation unit, receiving the substrate from the light irradiation unit and deionized water A cleaning apparatus including a second conveyor to be sent to the government, wherein the contact angle measuring device for measuring a contact angle with respect to a specific point of the substrate taken out from the light irradiation unit is installed on the second conveyor. Provide the device.
이하, 본 발명에 따른 액정표시장치 제조용 세정장치의 일 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, an embodiment of a cleaning apparatus for manufacturing a liquid crystal display device according to the present invention will be described in detail with reference to the accompanying drawings.
도 1은 액정표시장치 제조용 세정장치의 구성의 일부를 나타낸 것으로, 세정장치는 기판(5)에 엑시머 UV를 조사하는 광조사부(1)와, 탈이온수(DI Water)로 기판(5)을 세정하는 세정부(2)와, 상기 광조사부(1)와 세정부(2) 사이에 설치된 버퍼부(3)로 이루어지며, 상기 버퍼부(3)에는 기판(5)을 광조사부(1)로 이송하여 주는 상부 컨베이어(31)와 광조사부(1)로부터 기판(5)을 받아 세정부(2)로 이송하여 주는 하부 컨베이어(32)가 설치되어 구성된다.FIG. 1 shows a part of the structure of a cleaning apparatus for manufacturing a liquid crystal display device, wherein the cleaning apparatus cleans the substrate 5 with a light irradiation unit 1 for irradiating excimer UV to the substrate 5 and DI water. And a buffer unit 3 disposed between the light irradiation unit 1 and the cleaning unit 2, wherein the substrate 5 is connected to the light irradiation unit 1. The upper conveyor 31 for conveying and the lower conveyor 32 which receives the board | substrate 5 from the light irradiation part 1, and conveys it to the washing | cleaning part 2 are comprised.
그리고, 상기 버퍼부(3)의 하부 컨베이어(32) 바로 상측에는 광조사부(1)로부터 반출된 기판(5)의 특정 지점에 대한 접촉각을 측정하는 접촉각 측정기(33)가설치된다.And, just above the lower conveyor 32 of the buffer unit 3, a contact angle measuring device 33 for measuring a contact angle with respect to a specific point of the substrate 5 taken out from the light irradiation unit 1 is provided.
상기 접촉각 측정기(33)는 기판(5)의 특정 지점에 마이크로미터 단위로 물방울을 떨어뜨린 다음 이를 카메라(미도시)로 촬영하여, 미리 설치된 프로그램에 의해 물방울과 기판 간의 접촉각을 계산하는 방식으로 기판의 접촉각을 측정한다.The contact angle measuring device 33 drops the water droplets at a specific point of the substrate 5 in units of micrometers, photographs them with a camera (not shown), and calculates the contact angle between the water droplets and the substrate by a pre-installed program. Measure the contact angle.
상기와 같이 구성된 본 발명의 세정장치는 다음과 같이 작동한다.The cleaning apparatus of the present invention configured as described above operates as follows.
도 2 내지 도 4에 도시된 것과 같이, 로더로봇(미도시)에 의해 상부 컨베이어(31)에 기판(5)이 투입되면 상부 컨베이어(31)는 기판(5)을 광조사부(1) 내로 이송한다.As shown in FIGS. 2 to 4, when the substrate 5 is inserted into the upper conveyor 31 by a loader robot (not shown), the upper conveyor 31 transfers the substrate 5 into the light irradiation part 1. do.
상기 광조사부(1) 내로 기판(5)이 이송되어 정렬되면, 기판(5) 위로 엑시머 UV가 2.1mm의 간격으로 17초 동안 조사되며 기판(5) 상의 유기물 간의 결합을 끊는다.When the substrate 5 is transferred and aligned into the light irradiation unit 1, excimer UV is irradiated onto the substrate 5 at a distance of 2.1 mm for 17 seconds to break the bond between the organic materials on the substrate 5.
이어서, 엑시머 UV의 조사가 완료된 기판(5)은 하부 컨베이어(32)로 반출되어 이송된 다음, 상기 접촉각 측정기(33) 위치에서 정지하여 대기하게 되고, 접촉각 측정기(33)는 정지된 기판(5) 상의 특정지점에 물방울을 떨어뜨려 접촉각을 측정하게 된다.Subsequently, the substrate 5 on which the excimer UV irradiation is completed is carried out and transported to the lower conveyor 32, and then stopped and waited at the position of the contact angle measurer 33, and the contact angle measurer 33 stops the substrate 5. The contact angle is measured by dropping water droplets at a specific point on the.
상기와 같이 접촉각 측정기(33)로부터 기판(5) 상에 물방울이 떨어졌을 때, 만약 엑시머 UV의 조사가 제대로 이루어진 경우에는 물방울이 얇게 퍼지면서 기판(5) 표면과의 접촉각이 약 2~3°정도로 작게 되지만, 엑시머 UV의 조사가 제대로 이루어지지 않게 되면 물방울이 퍼지지 않으면서 접촉각이 크게 되고, 접촉각 측정기(33)는 이를 세정장치의 콘트롤부로 전달하여 작업자가 소정의 조취를 취할수 있게 한다.When water droplets fall from the contact angle measuring device 33 onto the substrate 5 as described above, when the excimer UV irradiation is properly performed, the water droplets spread thinly and the contact angle with the surface of the substrate 5 is about 2 to 3 °. Although it becomes small, if the excimer UV irradiation is not made properly, the contact angle becomes large without the water droplets spread, and the contact angle measuring device 33 transmits it to the control unit of the cleaning device so that the operator can take a predetermined action.
상기 접촉각 측정기(33)에 의한 접촉각을 측정 작업은 광조사부(1)로부터 기판(5)이 반출되는 매회 이루어지게 되고, 이에 따라 엑시머 UV의 조사 성능에 문제가 있는 것으로 판정될 때 즉각적으로 조치를 취할 수 있게 된다.The operation of measuring the contact angle by the contact angle measuring device 33 is performed every time the substrate 5 is taken out from the light irradiation unit 1, and thus, when it is determined that there is a problem in the irradiation performance of the excimer UV, immediate action is taken. You can take it.
이상에서와 같이 본 발명에 따르면, 엑시머 UV가 조사되어 세정부로 반출되는 모든 기판에 대해 세정작업 라인 상에서 지속적으로 접촉각을 모니터링할 수 있게 되므로 엑시머 UV의 조사 성능의 이상에 따른 세정불량률 증가를 개선할 수 있게 되고, 수율을 향상시킬 수 있게 되며, 세정장치의 관리 및 유지도 효과적으로 이루어질 수 있게 된다.As described above, according to the present invention, it is possible to continuously monitor the contact angle on the cleaning work line for all the substrates irradiated with excimer UV and carried out to the cleaning unit, thereby improving the cleaning failure rate increase due to the abnormality of the excimer UV irradiation performance. It is possible to improve the yield, it is possible to effectively manage and maintain the cleaning device.
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