KR20030066210A - Squeeze device of wet processing equipment - Google Patents
Squeeze device of wet processing equipment Download PDFInfo
- Publication number
- KR20030066210A KR20030066210A KR1020020006547A KR20020006547A KR20030066210A KR 20030066210 A KR20030066210 A KR 20030066210A KR 1020020006547 A KR1020020006547 A KR 1020020006547A KR 20020006547 A KR20020006547 A KR 20020006547A KR 20030066210 A KR20030066210 A KR 20030066210A
- Authority
- KR
- South Korea
- Prior art keywords
- chemicals
- chamber
- wet
- inhaler
- drug
- Prior art date
Links
- 239000000126 substance Substances 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 238000012546 transfer Methods 0.000 claims abstract description 4
- 239000003814 drug Substances 0.000 claims description 29
- 229940079593 drug Drugs 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 230000037303 wrinkles Effects 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 4
- 230000035484 reaction time Effects 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 3
- 239000006096 absorbing agent Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
- C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
Abstract
Description
본 발명은 챔버에 약품을 분사하여 TFT-LCD (Thin Film Transistor-Liquid Crystal Display ; 이하 LCD) 패널을 세정, 에칭, 박리시키는 습식장치에 관한 것으로서, 상기 LCD 패널에 분사된 약품이 타 챔버로 유출되는 것을 막아주는 차단수단을 개선하여 약품의 혼합 또는 오염이 방지되고, 상기 약품의 반응시간이 지속되므로 안정되어 제품의 품질 및 수율을 증가시킬 수 있는 습식장치의 구성에 관한 것이다.The present invention relates to a wet apparatus for cleaning, etching, and peeling a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) panel by injecting a chemical into a chamber, wherein the chemical sprayed on the LCD panel is leaked to another chamber. It improves the blocking means to prevent the prevention of the mixing or contamination of the drug, and the reaction time of the drug relates to the configuration of a wet device that can be stable to increase the quality and yield of the product.
최근의 경량, 소형의 디스플레이장치에 사용되는 LCD는 글라스기판의 이물질을 제거하는 세정공정과, 상기 세정된 글라스 기판에 감광층을 형성하는 라미네이트공정과, 상기 감광층에 광원을 조사하여 패턴을 형성하는 노광공정과, 상기 조사된 패턴을 현상하는 현상공정을 거쳐, 각 공정에 적합한 화학약품을 사용하여 상기 글라스 기판에 패턴을 형성하는 에칭공정 및 박리공정과, 상기 패턴이 형성된 글라스 기판의 이물질 및 약품을 제거하는 세정공정을 통해 성형된다.LCDs used in recent lightweight and compact display devices include a cleaning process for removing foreign substances from a glass substrate, a laminating process for forming a photosensitive layer on the cleaned glass substrate, and a pattern by irradiating a light source to the photosensitive layer. An etching process and a peeling process of forming a pattern on the glass substrate using a chemical agent suitable for each process, through an exposure process, a developing process of developing the irradiated pattern, and a foreign material of the glass substrate on which the pattern is formed. It is molded through a cleaning process to remove chemicals.
상기 화학약품은 조성이 상이하여 혼용사용시 발열반응을 일으켜 기판에 손상을 주거나, 상기 화학약품의 조성비가 변화되어 제품의 품질이 떨어지고, 유지관리에 어려움이 발생되므로 되도록 상기 습식장비의 내부로 분사된 약품이 타 챔버로 유출되는 것을 차단할 필요가 있다.The chemicals are sprayed into the inside of the wet equipment so as to cause exothermic reactions due to different compositions and damage the substrate, or to change the composition ratio of the chemicals, resulting in poor product quality and difficulty in maintenance. It is necessary to prevent the chemicals from spilling into other chambers.
도 1은 종래 기술에 의한 습식장치가 도시된 실시예의 구성도이다.1 is a block diagram of an embodiment in which the wet apparatus according to the prior art is shown.
종래 기술에 의한 습식장치는 도 1에 도시된 바와 같이, 이송롤러(17)에 의해 이송되는 LCD 패널(20)에 약품을 분사하는 분사노즐(15)이 설치된 제 1, 2챔버(11)(12)와, 상기 제 2챔버(12)의 투입구 내측에 형성되어 분사된 약품이 제 1챔버(11)로 유출되는 것을 차단하는 액절롤러(A)로 구성된다.As shown in FIG. 1, the wet apparatus according to the related art includes first and second chambers 11 having spray nozzles 15 for spraying chemicals on the LCD panel 20 transferred by the transfer roller 17 ( 12) and a liquid roller (A) formed inside the inlet of the second chamber (12) to prevent the injected chemicals from leaking into the first chamber (11).
상기와 같이 구성된 종래의 습식장치의 작동을 살펴보면 다음과 같다.Looking at the operation of the conventional wet device configured as described above are as follows.
컨베이어에 연결되어 구동되는 상기 이송롤러(17)에 상기 LCD 패널(20)이 상기 제 1챔버(11)로 투입되어 진행되고, 상기 LCD 패널(20)은 각각의 공정이 수행되도록 약품이 분사되는 상기 분사노즐(15)을 통과하여, 상기 제 2챔버(12)를 통과되며 공정이 진행된다.The LCD panel 20 is introduced into the first chamber 11 to the conveying roller 17 which is connected and driven by a conveyor, and the LCD panel 20 is sprayed with chemicals so that each process is performed. Passing through the injection nozzle 15, passing through the second chamber 12, the process proceeds.
이때, 상기 제 2챔버(12)에서 상기 LCD 패널(20)에 분사된 약품은 상기 액절롤러(A)에 의해 제 1 챔버(11)로 역류되는 것이 차단된다.In this case, the chemical injected into the LCD panel 20 from the second chamber 12 is blocked from flowing back to the first chamber 11 by the liquid axle (A).
그러나, 상기와 같은 종래 기술의 습식장치는 상기 LCD 패널의 표면과 접촉되므로 긁힘이 발생되는 문제점이 있다.However, the wet apparatus of the prior art as described above is in contact with the surface of the LCD panel, so there is a problem in that scratching occurs.
도 2는 종래 기술에 의한 습식장치가 도시된 제 2실시예의 구성도이고, 도 3은 종래 기술에 의한 습식장치가 도시된 제 3실시예의 구성도이다. 여기서 앞서 도시된 도면에서와 동일한 참조부호는 동일한 부재를 가리킨다.2 is a configuration diagram of a second embodiment in which the wet apparatus according to the prior art is shown, and FIG. 3 is a configuration diagram of a third embodiment in which the wet apparatus according to the prior art is shown. Here, the same reference numerals as in the above-described drawings indicate the same members.
따라서, 종래기술에 의한 습식장치는 도 2와 도 3에 도시된 바와 같이,Therefore, the wet apparatus according to the prior art is, as shown in Figure 2 and 3,
상기 제 2챔버(12)에서 상기 LCD 패널(20)로 분사된 약품이 제 1챔버로 역류되는 것이 차단되도록 상기 약품이 흐르는 방향의 역방향으로 경사지게 탈이온수를 분사하는 아쿠아나이프(B)가 설치되거나, 고압의 공기를 분사하는 에어나이프(C)가 설치되도록 그 구조가 개선되었다.Aquaknife (B) for injecting deionized water inclined in the opposite direction of the flow direction of the chemical is installed so that the chemical injected from the second chamber 12 to the LCD panel 20 is prevented from flowing back to the first chamber or The structure has been improved so that the air knife C for injecting high pressure air is installed.
그러나, 상기 제조공정의 빠른 처리를 위해 상기 약품의 분사량을 증가시킬 경우, 상기 약품을 차단하도록 상기 아쿠아나이프(B)에서 분사되는 약품이 오히려 제 2챔버로 역류되는 문제점이 있고, 상기 에어나이프(C)를 사용하여 공기를 분사하는 경우에는 상기 LCD 패널(20)의 크기가 증가됨에 따라 그 효과가 저하되는 문제점이 있다.However, when increasing the injection amount of the drug for the rapid treatment of the manufacturing process, there is a problem that the drug injected from the aqua knife (B) to flow back to the second chamber rather to block the drug, the air knife ( In the case of spraying air using C), there is a problem in that the effect decreases as the size of the LCD panel 20 is increased.
본 발명은 상기한 종래 기술의 문제점을 해결하기 위하여 안출된 것으로서, 챔버의 약품이 타챔버 또는 외부로 유출되는 것을 막아주도록 약품차단구조를 개선하여 상기 LCD 패널의 긁힘이 감소하고, 상기 약품의 혼합 또는 오염이 방지되며, 상기 약품이 안정화되어 제품의 품질 및 수율이 증가되는 습식장치를 제공하는데 그 목적이 있다.The present invention has been made in order to solve the above problems of the prior art, improve the chemical blocking structure to prevent the chemicals in the chamber outflow to the other chamber or the outside to reduce the scratch of the LCD panel, the mixing of the chemicals Alternatively, the object of the present invention is to provide a wet apparatus in which contamination is prevented and the chemical is stabilized to increase the quality and yield of the product.
도 1은 종래 기술에 의한 습식장치가 도시된 실시예의 구성도,1 is a configuration diagram of an embodiment in which the wet apparatus according to the prior art is shown;
도 2는 종래 기술에 의한 습식장치가 도시된 제 2실시예의 구성도,2 is a block diagram of a second embodiment showing a wet apparatus according to the prior art,
도 3은 종래 기술에 의한 습식장치가 도시된 제 3실시예의 구성도,3 is a configuration diagram of a third embodiment in which a wet apparatus according to the prior art is shown;
도 4는 본 발명에 의한 습식장치가 도시된 구성도,Figure 4 is a block diagram showing a wet device according to the present invention,
도 5는 본 발명에 의한 습식장치의 요부가 확대되어 도시된 구성도이다.Figure 5 is an enlarged configuration diagram showing the main portion of the wet apparatus according to the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
31 : 제 1챔버32 : 제 2챔버31: first chamber 32: second chamber
35 : 분사노즐37 : 이송롤러35: injection nozzle 37: feed roller
40 : LCD 패널51 : 아쿠아나이프40: LCD panel 51: Aqua Knife
52 : 흡입기53 : 에어나이프52: inhaler 53: air knife
55 : 주름부56 : 브레이드55: wrinkles 56: braid
상기한 과제를 실현하기 위한 본 발명의 습식장치는 이송롤러에 의해 이송되는 LCD 패널에 약품을 분사하는 분사노즐이 설치된 챔버와, 상기 챔버의 토출구에 형성되어 상기 분사노즐에서 분사된 약품이 외부로 유출되는 것을 차단하는 액절수단을 포함하여 구성된 습식장비에 있어서, 상기 액절수단은 상기 약품이 흐르는 방향의 역방향으로 약품을 분사하여 상기 약품의 유출을 차단하는 아쿠아나이프와, 상기 아쿠아나이프로 차단되지 않은 상기 약품을 흡입하는 흡입기와, 고압의 공기를 분사하여 상기 흡입기로 흡입되지 않은 상기 약품의 유출을 차단하는 에어나이프로 구성된다.The wet apparatus of the present invention for realizing the above problem is provided with a chamber in which an injection nozzle for injecting chemicals is installed on an LCD panel conveyed by a transfer roller, and a chemical sprayed from the injection nozzle is formed in the discharge port of the chamber to the outside. In the wet equipment comprising a liquid leaking means for blocking the leakage, the liquid leaking means is sprayed with the drug in the reverse direction of the flow direction of the drug and the aqua knife to block the outflow of the drug, and not blocked by the aqua knife And an inhaler for inhaling the medicine, and an air knife for injecting high pressure air to block the outflow of the medicine that is not inhaled by the inhaler.
이하, 본 발명의 실시예를 첨부된 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 4는 본 발명에 의한 습식장치가 도시된 구성도이고, 도 5는 본 발명에 의한 습식장치의 요부가 확대되어 도시된 구성도이다.4 is a configuration diagram showing the wet apparatus according to the present invention, Figure 5 is a configuration diagram showing the enlarged main portion of the wet apparatus according to the present invention.
본 발명에 의한 습식장치는 도 4와 도 5에 도시된 바와 같이, 구동수단이 형성된 컨베이어에 연결된 이송롤러(37)에 의해 이송되는 LCD 패널(40)에 약품을 분사하는 분사노즐(35)이 설치된 제 1, 2챔버(31)(32)와, 상기 제 2챔버(32)의 투입구 내측에 형성되어 상기 분사노즐(35)에서 분사된 약품이 챔버의 외부로 유출되는 것을 차단하는 액절수단(R)을 포함하여 구성된다.4 and 5, the wet apparatus according to the present invention, the injection nozzle 35 for injecting the chemicals to the LCD panel 40 is transported by the feed roller 37 connected to the conveyor formed with the drive means Liquid storage means which are formed inside the first and second chambers 31 and 32 installed and the inlet of the second chamber 32 to block the chemicals injected from the injection nozzle 35 from flowing out of the chamber ( R).
상기 액절수단(R)은 상기 약품이 흐르는 방향의 역방향으로 약품을 분사하여 상기 약품의 유출을 차단하는 아쿠아나이프(51)와, 상기 아쿠아나이프(51)로 차단되지 않은 약품을 흡입하는 흡입기(52)와, 고압의 공기를 분사하여 상기 흡입기(52)로 흡입되지 않은 약품의 유출을 차단하는 에어나이프(53)로 구성된다.The liquid-reducing means (R) is sprayed in the direction of the drug flow in the reverse direction of the drug to block the outflow of the drug and the aqua knife 51, the inhaler 52 for sucking the drug not blocked by the aqua knife 51 And an air knife 53 for injecting high-pressure air to block the outflow of the chemicals that are not sucked into the inhaler 52.
상기 흡입기(52)는 상기 약품을 흡입하는 단부에 흡입유로가 다수개 형성되고, 상기 약품의 흡입각도를 조절할 수 있도록 일측에 주름부(55)가 형성된다.The inhaler 52 is formed with a plurality of suction passages at the end for inhaling the drug, the wrinkle portion 55 is formed on one side to adjust the suction angle of the drug.
또한, 상기 흡입기(52)는 상기 단부 외측에 설치되어 약품의 흡입을 유도하는 브레이드(56)를 더 포함하여 구성된다.In addition, the inhaler 52 is configured to further include a braid 56 installed outside the end to induce the suction of the drug.
즉, 상기 흡입기(52)는 흡입구가 다수의 작은 원형 흡입관으로 형성되어 강한 흡입력으로 상기 약품을 흡입할 수 있으며, 상기 흡입구 주변에 고무 또는 스펀지 같은 부드러운 재질로 이루어진 상기 브레이드(56)가 설치되어 상기 약품이 효율적으로 흡입된다.That is, the inhaler 52 has a suction port formed of a plurality of small circular suction tube to suck the drug with a strong suction force, the braid 56 made of a soft material such as rubber or sponge is installed around the suction port The drug is inhaled efficiently.
상기와 같이 구성된 액절수단(R)은 이송되는 상기 LCD 패널(40)의 두께에 따라 상기 챔버에 설치되는 높이를 조정할 수 있도록 장공이 형성된 브라켓에 볼트로 고정시키는 높이조절수단이 형성되는 것이 바람직하다.The liquid-reducing means (R) configured as described above is preferably formed with a height adjusting means for fixing the bolt to the bracket formed with a long hole so as to adjust the height installed in the chamber according to the thickness of the LCD panel 40 to be transferred. .
상기와 같은 구성을 갖는 본 발명에 의한 습식장치의 작동을 살펴보면 다음과 같다.Looking at the operation of the wet device according to the present invention having the configuration as described above are as follows.
구동되는 컨베이어에 연결된 이송롤러(37)에 올려져 상기 LCD 패널(40)이 상기 제 1챔버(31)로 이동되어, 상기 분사노즐(35)에서 분사된 상기 약품에 의해 세정, 에칭, 박리 등의 공정이 수행되면서 상기 제 2챔버(32)로 진행된다.The LCD panel 40 is moved to the first chamber 31 by being mounted on a conveying roller 37 connected to a driven conveyor, and cleaned, etched, peeled, etc. by the chemicals injected from the injection nozzle 35. The process of proceeds to the second chamber (32).
이때, 상기 제 2챔버(32)로 진행된 상기 LCD 패널(40)에 상기 분사노즐(35)로부터 분사된 약품이 제 1챔버(31)로 역류되면 서로 조성이 다른 약품이 혼합되어 열을 발생시켜 상기 LCD 패널(40)에 변형을 일으키거나, 제 1챔버(31)의 약품을 오염시켜 올바른 공정의 진행을 방해하므로, 상기 약품이 제 1챔버(31)로 역류되는 것을 차단하는 상기 아쿠아나이프(51), 흡입기(52), 에어나이프(53)로 구성된 액절수단(R)을 설치한다.At this time, when the chemicals injected from the injection nozzle 35 flows back to the first chamber 31 in the LCD panel 40 proceeded to the second chamber 32, the chemicals having different compositions are mixed to generate heat. Since the deformation of the LCD panel 40 or the chemicals of the first chamber 31 are contaminated to prevent the proper process from proceeding, the aqua knives may be prevented from flowing back into the first chamber 31. 51), the liquid-reducing means R comprised from the inhaler 52 and the air knife 53 is provided.
여기서, 상기 아쿠아나이프(51)는 상기 약품이 제 1챔버(31)로 역류되는 방향의 역방향으로 약품을 고압으로 경사지게 분사하여 분사된 약품을 상기 제2챔버(32) 내로 밀어낸다.Here, the aqua knife 51 injects the chemicals inclined at a high pressure in a direction opposite to the direction in which the chemicals flow back to the first chamber 31 to push the injected chemicals into the second chamber 32.
상기 아쿠아나이프(51)로 차단되지 않은 약품은 상기 흡입기(52)를 설치하여 고압으로 흡입하고, 상기 흡입기(52)로 흡입되지 않은 약품은 상기 에어나이프(53)로 공기 또는 질소가스를 고압으로 분사하여 상기 흡입기(52) 또는 상기 제 2챔버(31) 내로 밀어낸다.Chemicals that are not blocked by the aqua knife 51 are installed at the high pressure by installing the inhaler 52, and chemicals not sucked by the inhaler 52 are at high pressure by the air knife 53 at high pressure. It is sprayed and pushed into the inhaler 52 or the second chamber 31.
이상과 같이 본 발명에 의한 습식장치를 예시된 도면을 참조로 설명하였으나, 본 명세서에 개시된 실시예와 도면에 의해 본 발명은 한정되지 않으며 그 발명의 기술사상 범위 내에서 당업자에 의해 재질을 포함한 다양한 변형이 이루어질 수 있음은 물론이다.Although the wet apparatus according to the present invention has been described above with reference to the illustrated drawings, the present invention is not limited by the embodiments and drawings disclosed herein, and various materials including materials by those skilled in the art within the scope of the technical idea of the present invention. Of course, modifications can be made.
따라서, 상기와 같이 구성되는 본 발명에 의한 습식장치는 분사된 약품의 유출을 차단하는 액절장치가 다단계로 형성되어, 상기 LCD 패널의 긁힘이 감소하고, 상기 약품의 혼합 또는 오염이 방지되며, 상기 약품의 반응시간이 지속되므로 안정되어 제품의 품질 및 수율이 증가되는 효과가 있다.Therefore, the wet device according to the present invention constituted as described above is formed in a multi-stage liquid closing device for blocking the outflow of the injected drug, the scratch of the LCD panel is reduced, the mixing or contamination of the drug is prevented, Since the reaction time of the drug is stable, there is an effect of increasing the quality and yield of the product.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020006547A KR20030066210A (en) | 2002-02-05 | 2002-02-05 | Squeeze device of wet processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020006547A KR20030066210A (en) | 2002-02-05 | 2002-02-05 | Squeeze device of wet processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030066210A true KR20030066210A (en) | 2003-08-09 |
Family
ID=32220581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020006547A KR20030066210A (en) | 2002-02-05 | 2002-02-05 | Squeeze device of wet processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20030066210A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101043769B1 (en) * | 2006-07-31 | 2011-06-22 | 세메스 주식회사 | Hybrid system performing in-shower, suction and drying procedure |
| WO2013020301A1 (en) * | 2011-08-09 | 2013-02-14 | 深圳市华星光电技术有限公司 | Coating device for glass substrate and coating method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209143A (en) * | 1997-01-24 | 1998-08-07 | Tokyo Electron Ltd | Method and device for washing substrate end face |
| KR20000018711A (en) * | 1998-09-04 | 2000-04-06 | 윤종용 | Apparatus for drying lcd glass |
| JP2001050660A (en) * | 1999-05-31 | 2001-02-23 | Hitachi Electronics Eng Co Ltd | Substrate drying device and drying method |
| KR20010035506A (en) * | 2001-02-22 | 2001-05-07 | 신원호 | Device for dry of LCD panel |
| JP2001255503A (en) * | 2000-03-10 | 2001-09-21 | Matsushita Electric Ind Co Ltd | Device for drying substrate for liquid crystal display device |
| JP2001284310A (en) * | 2000-03-31 | 2001-10-12 | Shibaura Mechatronics Corp | Apparatus and method for treating substrate |
| JP2001284777A (en) * | 2000-04-04 | 2001-10-12 | Hitachi Electronics Eng Co Ltd | Apparatus and method for treatment of board |
-
2002
- 2002-02-05 KR KR1020020006547A patent/KR20030066210A/en not_active Application Discontinuation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209143A (en) * | 1997-01-24 | 1998-08-07 | Tokyo Electron Ltd | Method and device for washing substrate end face |
| KR20000018711A (en) * | 1998-09-04 | 2000-04-06 | 윤종용 | Apparatus for drying lcd glass |
| JP2001050660A (en) * | 1999-05-31 | 2001-02-23 | Hitachi Electronics Eng Co Ltd | Substrate drying device and drying method |
| JP2001255503A (en) * | 2000-03-10 | 2001-09-21 | Matsushita Electric Ind Co Ltd | Device for drying substrate for liquid crystal display device |
| JP2001284310A (en) * | 2000-03-31 | 2001-10-12 | Shibaura Mechatronics Corp | Apparatus and method for treating substrate |
| JP2001284777A (en) * | 2000-04-04 | 2001-10-12 | Hitachi Electronics Eng Co Ltd | Apparatus and method for treatment of board |
| KR20010035506A (en) * | 2001-02-22 | 2001-05-07 | 신원호 | Device for dry of LCD panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101043769B1 (en) * | 2006-07-31 | 2011-06-22 | 세메스 주식회사 | Hybrid system performing in-shower, suction and drying procedure |
| WO2013020301A1 (en) * | 2011-08-09 | 2013-02-14 | 深圳市华星光电技术有限公司 | Coating device for glass substrate and coating method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100629767B1 (en) | Substrate processing apparatus and substrate cleaning unit | |
| TWI546131B (en) | Substrate processing apparatus, nozzle and substrate processing method | |
| CN101219427A (en) | Substrate processing device | |
| KR20100059230A (en) | Spray unit and apparatus for cleaning a glass including the same | |
| TW200816354A (en) | Substrate processing apparatus | |
| KR20070119398A (en) | Air knife and substrate drying system using it | |
| CN110197802B (en) | Wet etching equipment | |
| JP4352194B2 (en) | Substrate drying apparatus and substrate drying method | |
| KR20030066210A (en) | Squeeze device of wet processing equipment | |
| JP3866856B2 (en) | Substrate processing equipment | |
| JP4789446B2 (en) | Substrate processing equipment | |
| JP2006205086A (en) | Washing device of substrate | |
| JP2011173091A (en) | Coating apparatus and method of cleaning nozzle | |
| KR101252481B1 (en) | In-line apparatus for developing having a cleaning device and method of fabricating liquid crystal display device using thereof | |
| JPH09276773A (en) | Substrate treating device | |
| KR100454637B1 (en) | A Chemical Dispense Nozzle Of A Single Semiconductor Wafer Processor Type | |
| KR20090015413A (en) | Apparatus for cleaning slit nozzle used in manufacturing flat panal display devices | |
| JP2001196345A (en) | Substrate guide device and cleaning equipment using it | |
| JP2004342886A (en) | Equipment and method of processing substrate | |
| CN110106504B (en) | Etching equipment | |
| KR200295029Y1 (en) | Apparatus for cleaning a panel | |
| KR20110082996A (en) | Apparatus and method for treating substrates | |
| JP4365192B2 (en) | Transport type substrate processing equipment | |
| KR100314225B1 (en) | An injection apparatus for processing a glass substrate or a wafer | |
| KR20040000933A (en) | Pre wetting apparatus of supersonic waves humidification type using DI-water for photoresist development progress |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| N231 | Notification of change of applicant | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |