KR200213106Y1 - Surface mounting device mounter for multi-function - Google Patents

Abstract

The present invention relates to a multi-function surface mount component mounter, and more particularly, it detects the force at the moment of contact between the SMD and the PCB, which is a feature of the present invention, in a SMD mounter that performs only general mounting or detachment functions. It has a load cell that controls the abnormal load that is set and checked in units, a bottom heater that heats the bottom of the PCB, and a temperature sensor that senses and controls the heating temperature above the set temperature. In the case of detaching the SMD, an adsorption port is closely adhered to the upper surface of the SMD by the load cell, and heated to a temperature suitable for detaching the mounted SMD by heating of a bottom heater. It is precisely controlled by the sensor to provide the best conditions for removal.

In addition, the mounting and remounting work is performed by the operation of the above devices, and the mounting and remounting are performed by appropriate heating and control of the load cell, the bottom heater and the temperature sensor, which closely contact the SMD and the PCB for the most suitable mounting. It is a very useful design that can be carried out by detachment, mounting, remounting in one device.

Description

Multi-Functional Surface Mount Component Mounter {SURFACE MOUNTING DEVICE MOUNTER FOR MULTI-FUNCTION}

The present invention relates to a mounter of a surface mounting component (SMD; SURFACE MOUNTING DEVICE), and more specifically, to a micro electronic component, a chip chip (CSP), a chip chip, a ball gray array (BGA), μ -It is a multifunctional surface mount component mounter that performs various tasks such as mounting, remounting, and removing work of BGA (μ-BALL GRAY ARRAY) with one machine.

Recently, with the rapid development of electronic engineering, the trend of miniaturization of electric and electronic products is leading to high density, ultra miniaturization, and diversification of electronic components.

For this reason, SURFACE MOUNTING TECHNOLOGY mounts the ultra-miniaturized and diversified electronic components (surface mounting parts, hereinafter referred to as SMD) on a printed circuit board (hereinafter referred to as PCB). It is under pressure to accelerate new developments and enhancements of SMT).

In addition, the SMT improves the mounting density due to the miniaturization and high integration of SMD, the cost reduction due to the miniaturization of the PCB, the electrical characteristics due to the reduction of the lead and wiring, and the combination with the automation line. You can expect to improve productivity.

In addition, the equipment for performing the above operation is a surface mounter (SMD MOUNTER).

In general, the configuration of the SMD mounter is a component feeder (FEEDER) for supplying the SMD to the PCB, an XY transfer unit for determining the working position of the SMD, a vacuum pipe for supplying air to adsorb the SMD, The vacuum nozzle which makes the air supplied to adsorb | suck the SMD to a vacuum, the vacuum pipe and the nozzle are integrally provided, and the head which operates up and down and the direction of the SMD moved by the head are checked and checked. After that, it is divided into VISION.

The function of the general SMD mounter configured as described above is to pick up the SMD by suction of the nozzle in which the vacuum pressure is formed, and to replace the SMD picked up by the vision. After confirming the direction by using the XY transfer unit is moved to the mounting position on the PCB.

At this time, the position of the SMD is fixed in the direction for mounting by the direction value of the SMD checked by the vision.

In addition, when the head reaches the mounting position, the head is lowered to mount the SMD on the PCB.

However, the above-mentioned general SMD mounter is a lever structure using a cam and a clutch to drive the head, and the height is determined by the rotation angle of the actuator rather than the optimal distance due to the drive of the actuator. According to the height of the component when checking the direction of the part and the surface of the PCB and the distance between the vision to check the accuracy of the constraints are quite a lot of the following problems occur.

First, it is difficult to accurately measure the distance between the component to be mounted and the surface of the PCB on which the component is mounted;

Secondly, due to the drive of the lever structure and the problem of having to manually move the nozzle mounted parts,

Third, the badness of adhesion due to the observation of the fingertips and eyes when mounting the nozzle mounted on the PCB,

Fourth, the badness of the mounting state due to the difference between the temperature of the upper surface and the lower surface of the component to be mounted at the time of mounting, the lower surface of the PCB,

Fifth, there is a problem that can not take out the dust or smoke generated during the mounting work is always exposed to the risk of industrial accidents.

Accordingly, the present invention is to overcome the problems of the prior art described above, the object of the present invention is to check the data of the laser sensor (LASER SENSOR) according to the present invention the distance between the SMD and the PCB surface according to the present invention After collecting and collecting the program controller (hereinafter referred to as PLC), the data is retransmitted to the head for precise transfer by the driving unit mounted on the head, and when the precisely transferred SMD is mounted or detached. The load cell is installed in g unit after the load cell that measures and detects the physical force generated precisely, not by the sense of the back of the hand or the naked eye. The temperature sensor is contacted to keep the temperature of the upper surface of the SMD and the surface of the PCB the same and removes dust and soot generated during mounting. The purpose is to provide a separate outlet and cover to prevent the occurrence of scattering.

1 (a) is a front view showing the appearance of the multifunction surface mount component mounter according to the present invention, (b) is a side view showing the appearance of the multifunction surface mount component mounter according to the present invention.

2 is a working state diagram showing a schematic operation of the multi-function surface mount component mounter according to the present invention.

Figure 3 is a process diagram showing the automatic mounting of parts of the multi-function surface mount component mounter according to the present invention.

Figure 4 is a detailed process of the mounting and detachment operation applied to the multi-function surface mount component mounter according to the present invention.

5 (a) is a state diagram showing that the hot air is supplied through the nozzle to which the temperature sensor of the multi-function surface mount component mounter according to the present invention, (b) is a temperature sensor and the nozzle of the conventional surface mount component mounter It is a state diagram showing that the hot air is supplied through.

Figure 6 shows a case for receiving the multi-function surface mount component mounter according to the present invention Timed perspective view.

Explanation of symbols on the main parts of the drawings

10; Floor table 20; Central axis

30; Head 32; Servo motor

34; Vacuum pipe 36; Vacuum nozzle

38; Vacuum bit 39; Load cell

40; SMD (Surface Mount Components) 42; PCB (Printed Circuit Board)

50; XY transfer part 60; vision

70; Temperature sensor 72; Elastic member

80; Laser sensor 82; PLC

86; Monitor 88; Touch panel

The present invention for the above object relates to a multi-function surface mount component mounter, and more particularly, a laser sensor mounted on the side end of the vision to measure the surface height of the printed circuit board and the surface height of the surface mount component, and By laser sensor And a PLC (PROGRAMMABLE LOGIC CONTROLLER) for receiving and collecting the measured height of the PCB and the height of the SMD, and a servo motor for fine operation by receiving the output of the collected data transferred to the PLC. The vacuum pipe, which is integrally provided in the head operated by the driving force of the servo motor, has a temperature sensor vertically formed in the center through a circular interior.

In addition, the load cell is formed on the top of the vacuum nozzle for absorbing the SMD, load cell for detecting the force at the moment of contact with each other when the SMD is mounted on the PCB and converts and checks it in gram units to control the set load or more (LOAD CELL) ).

Preferred embodiments of the present invention as described above will be described in detail by the accompanying drawings.

1 (a) is a front view showing the appearance of the multifunction surface mount component mounter according to the present invention, (b) is a side view showing the appearance of the multifunction surface mount component mounter according to the present invention.

2 is a working state diagram showing a schematic operation of the multi-function surface mount component mounter according to the present invention.

Figure 3 is a process diagram showing the automatic mounting of parts of the multi-function surface mount component mounter according to the present invention.

Figure 4 is a detailed process of the mounting and detachment operation applied to the multi-function surface mount component mounter according to the present invention.

5 (a) is a temperature sensor of the multi-function surface mount component mounter according to the present invention It is a state diagram showing that the hot air is supplied through the applied nozzle, (b) is a state diagram showing that the hot air is supplied through the nozzle and the temperature sensor of the conventional surface mount component mounter.

6 is a perspective view illustrating a case for accommodating a multifunctional surface mount component mounter according to the present invention.

First, the configuration of the present invention with reference to Figures 1 to 2 as follows.

Installed on the bottom of the present invention is provided with a rectangular bottom table 10 to support the various devices and the like according to the present invention.

In addition, a central axis 20 is provided at one end of the upper surface of the floor table 10 and is formed perpendicular to the floor table 10.

In addition, the head 30 is provided on the front surface of the central axis 20, and is movable to the upper and lower ends of the central axis 20.

In addition, the rear surface of the head 30 and the front surface of the central shaft are guided to each other and precisely guided and operated by a transfer device such as a ball screw.

In addition, the servo motor 32 is provided on the upper side of the head 30 to provide power for fast and accurate movement in the up and down movement of the head 30.

The servo motor 32 has a high power rate density (output per unit weight per unit weight; KW / SEC / KG) of the servo motor 32 with high speed response, high accuracy, and high reliability.

That is, since the servo motor 32 itself is also a load, it is as light as possible It can produce a big output at the moment.

As described above, the servo motor 32 operates under the control of the PLC 40, which is a program controller.

In addition, a vacuum pipe 34 formed vertically inside the head 30 is provided, a lower end of the vacuum pipe 34 is provided with a vacuum nozzle 36, and the vacuum nozzle 36 has a vacuum bit ( 38 is provided so that the SMD is attracted to the vacuum bit 38 by the vacuum pressure formed in the vacuum nozzle 36.

In addition, a load cell 39 is provided at the upper end of the vacuum pipe 34 to minutely recognize the load applied to the vacuum bit 38 and send an instant response.

In addition, a vertical temperature sensor 70 is also provided at the inner center of the vacuum pipe 34 to abut the center of the upper surface 40a of the SMD 40 adsorbed to the vacuum bit 38. The temperature of (40) can be measured accurately.

In addition, as described above, the elastic member 72 capable of withstanding the minute shock generated when the SMD 40 adsorbed to the vacuum bit 38 and the PCB 42 are in contact with each other may be formed in the temperature sensor 70. It is provided at the top.

In addition, an XY transfer unit 50 provided on the same surface as the central axis 20 on the top surface of the bottom table 10 and formed in the horizontal direction on the front surface of the central axis 20 is installed.

In addition, the XY transfer unit 50 is to place the PCB 42 on the upper side to fix and support.

In addition, a vision (DUAL SIGHT VISION CAMERA SYSTEM) 60 is provided at the side end of the central axis 20 to operate in the center direction.

The vision 60 generates an image of the PCB 42 supported by the XY transfer unit 50, and projects and teaches the correct position correction and correction of the SMD 40 to be mounted on the image. TEACHING).

In addition, a laser sensor 80 is provided on the side of the vision 60 to check the upper surface 40a of the SMD 40 and the upper surface 42a of the PCB 42 to the PLC 82 which is a central computing device. It transmits and controls to be able to work at precise distance during mounting and dismounting work.

In this way, due to the configuration described above, the SMD 40 mounting work is in progress, and the work progress as described above and the incomplete portion of the configuration will be described as follows.

First, in FIG. 2 to FIG. 3 and FIG. 3, the SOLDERING and REWORK operations, which are one of the features of the present invention, will be described by a pro chart and a configuration process diagram.

Basically, as described above, the laser sensor 80 measures the value of the basic position of the SMD 40 to which the work is performed, and generates a vacuum pressure in the vacuum nozzle 36 to generate the SMD 40. Is adsorbed to the vacuum bit 38 (90).

Further, the measured value is transmitted to the PLC 86 to store the position (91).

If the measured value is the mounting process, the working height is measured by the laser sensor 80 (93), the position is transmitted to and stored in the PLC 86 (94), and the vision 60 capable of enlarging and reducing is possible. Observe the surface of the PCB 42 to be mounted () (95).

In addition, the upper surface 84 of the PCB 42 is observed 95, and then the lower surface 40b of the SMD 40 is observed 96.

At this time, the reference position is stored and then moved to the Z axis using a fine manual adjustment device (hereinafter referred to as JOG).

In this way, the vision 60 in which the above operation is completed is retracted and stored in the storage position (97) and stopped (98).

Further, after the servo motor 32 is turned on (99) to start the head 30 including the vacuum bit 38 to which the SMD 40 is adsorbed and the vacuum nozzle 36 for preheating (99) Move the Z axis to the primary position for heating (100) and stop (101).

In addition, the PCB 42 coated with the solder cream (SOLDER CREAM) mounted on the XY transfer unit 50 is transferred to a working position (102), and then immediately transferred to a low speed (103) immediately before the final working position. (104).

In addition, the bottom surface 42b of the moved PCB 42 is preheated 106 by the bottom heater 84, which is one of technical features of the present invention, and is completed (107).

In this way, the vacuum nozzle 36 to which the SMD 40 is adsorbed on the Z-axis is finally lowered at a low speed to the PCB 42 where the mounting preparation is completed as described above (108).

In addition, when the lead of the SMD 40 mounted on the vacuum bit 38 and the upper surface 42a of the PCB 42 contact, the load cell 39 applied to the present invention checks the contact pressure. And, when the set '0' point value is reached, the value transmitted to the PLC 82 is retransmitted to the servo motor 32, which is also a feature of the present invention, to the most suitable mounting position. The absorbed SMD 40 is raised and lowered (110).

In addition, the load cell 39 previously sets the allowable pressure between the SMD 40 and the vacuum bit 38 as the reference for mounting at a zero point, and then installs the PCB 42 installed in the XY transfer unit 50. After checking the pressure, the pressure is checked and compared with the measured value and the set value and transmitted to the PLC 82 until the preset '0' point value is reached or risen or lowered as described above. The servo motor 32 stores the position.

In this way, the heating is performed to mount the SMD 40 transferred to the mounting position 110 as described above (111).

Further, after the mounting operation for mounting the SMD 40 is completed 112 through the above process, the vacuum state of the vacuum nozzle 36 is terminated, and the head 30 is raised again at a low speed ( 113) The operation is completed by returning to the reference position value set at the beginning of the operation at high speed (118) (120).

However, the present invention will be described below the process of desorption as the equipment characterized by performing not only the process of mounting, but also the process of desorption.

The PCB 42 mounted with the SMD 40 is transferred to the working position (102), and the vacuum nozzle 36 and the vacuum bit (28) are carried out on the PCB 42 in the Z axis to perform the detachment operation. After finally lowering the head 30 with the lower speed (108), the vacuum bit 38 provided in the vacuum nozzle 36 is placed on the upper surface (40a) of the mounted SMD (40) After close contact, the heating work 111 for detachment is completed.

In addition, the contact pressure of the vacuum bit 38 in close contact with the upper surface 40a of the SMD 40 As described above in the mounting process, the head 30 is stopped at the value set by the zero point by transmitting a comparison value having the point set to '0' in advance to the PLC 82 (110).

In addition, after the heating operation 111 is completed, the SMD 40 detached after the head 30 is finely raised at a low speed (113), and the weight and the adsorption of the predetermined SMD 40 are set in advance. After comparing the measured weight of the SMD 40 and reaching the set value (114), the SMD 40 adsorbed to the vacuum bit 38 is a distance 113 of the head 30 which is slightly elevated at the low speed. Automatically slow down as much as 115.

In addition, by setting the operation to time to contribute to the stabilization of the equipment (116).

After the desorption operation is completed, the head 30 returns to the process of rising again at a low speed (113) and the rising continues (117), and returns to the reference value of the head 30 (118). It is complete (120).

As described above, the mounting and detachment of the SMD 40 according to the present invention has been described above, and in the following, the measurement of the component and PCB position displacement and the temperature sensor 70 in mounting the SMD 40 according to the present invention are described. And the load cell 39, the supply of hot air through the nozzle in mounting, etc. will be described in detail with reference to Figs. 4 and 2, 5 to 6.

First, the displacement for the pick-up setting of the PCB 42 and the SMD 40 which are pick-up (PICK-UP) operation is measured.

In this way, the vision 60 for measuring the displacement is moved to the storage position for the above operation. Position (200).

In addition, the PCB 42 is mounted on the XY transfer unit 50 (201), and after confirming the storage position of the vision 60 (202), the setting time is turned ON (203).

The current position of the PCB 42 mounted on the XY transfer unit 50 is set to a '0' point to input the data value set to the '0' point to the PLC 82 (204).

The set '0' point data value is checked (205).

The SMD 40 to be picked up is set in a pickup table at the side end of the vision 60 (206).

The SMD 40 set on the pickup table is set on the monitor 86 with an IC displacement meter (207).

Further, after storing the displacement meter values of the set SMD 40 in the PLC 82 (208), the vision 60 is moved to the position of the set SMD 40 (209). An intermediate sensing of the position of the SMD 40 is performed by the vision 60 (210).

The intermediate sensing 210 re-checks the position of the SMD 40 on the table (211).

Also, in operation 212, a vacuum nozzle 36 for adsorbing the SMD 40 is originated at a position of the SMD 40 on the table provided as described above.

In addition, the setting of the origin setting is reconfirmed (213).

Thus, when the operation switch of the head 30 equipped with the vacuum nozzle 36 is turned on on the monitor 86 to pick up the SMD 40 set as described above (214), the vacuum nozzle of the head 30 ( After 36 is located at the origin of the SMD 40 (215), the speed of 7000PPS in the Z axis As the speed is lowered to high, the transfer is completed (216) is stopped 2217 in the upper surface (40a) of the set SMD 40 is stopped (217).

The head 30 of the 2MM high transfer completion 216 is a device that is measured so that the load is more accurately measured when the vacuum nozzle 36 contacts the upper surface 40a of the SMD 40 ( An appropriate amount of time is set so that 39) is stabilized (218).

In order to measure the load cell 39 using the stable load cell 39, the load cell 39 is set to '0' point (219), and then an appropriate time period is set to allow the load cell 39 to be stabilized (220). .

After the load cell 39 is stabilized (220), the head 30 is lowered at a low speed of 200PPS (221) to set the '0' point set value of the load cell 39 and the SMD (40) The load is contacted with the upper surface 40a of the to be transferred to the PLC 82 and then stopped at the suction position set to '0' (223).

In addition, when the air supplied from the vacuum pipe 34 to the stationary vacuum nozzle 36 is turned on (225), a vacuum pressure is generated at the vacuum nozzle 36 (226), and then the vacuum nozzle 36 is After the vacuum bit 38 installed at the lower end and the upper surface 40a of the SMD 40 are adsorbed, a margin is set in order to stabilize the vacuum pressure (227).

Thus, after setting the vacuum pressure (227), the head 30 adsorbing the SMD 40 is slowly raised on the Z axis (228), and the head 30 is also stabilized (229). ).

In addition, after completion of the return through the home return process 230, the head (231) 30 stops (232).

In this way, the SMD 40 to be mounted through the above-described process is adsorbed and fixed, transferred to the origin of the Z axis, and then the PCB 38 mounted on the XY table 50 and the adsorbed SMD 40. TEACHING through the vision (60).

This, the teachings after moving the vision (60) to the teaching position (233) selects the teaching button formed in various ways on the front outer side of the cover 300 for receiving the subject innovation (234).

In addition, the above teaching first shows the lower surface 42b of the PCB 42 through the monitor 86 (235).

As described above, the PCB shown through the monitor 86 is adjusted through the touch panel 88 on the monitor 86 to adjust zoom, focus, illuminance, and the like (236). The next button formed at 86 is pressed (237) to observe the lower surface 40b of the SMD 40 adsorbed to the vacuum bit 38 (238).

In addition, after observing the lower surface of the SMD 40 as described above (238), the servo motor 32 is finely transferred to the Z-axis to move the lower surface 40b of the SMD 40 on the monitor 86. After focusing (239) and the adjustment is complete, press the next button to proceed to the next operation (240).

In addition, after the bottom surface 40b and the PCB top surface 40a of the SMD 40 are simultaneously generated on the monitor 86 (241), the brightness of the screen is adjusted (242).

In this way, the lower surface 40a and the PCB on the SMD 40 generated in the monitor 86 After the surface 40a is accurately adjusted (243) by using the dual screen 241, the angle of inclination and mutual inclination of the X and Y are accurately adjusted (243), and the adjustment is completed (244).

In addition, after the adjustment is completed, the SMD 40 and the PCB upper surface 40a are automatically matched (245), and then the vision 60 is moved to the storage position and waits (246).

Thus, after completing the basic work for mounting the SMD 40 as described above, a process for setting the appropriate temperature in the mounting and mounting according to the present invention through the following process will be described as follows.

As described above, when the run button displayed on the monitor 86 is turned on in the state in which preparation for mounting is completed (247), the head including the vacuum nozzle 36 and the vacuum nozzle 36 which adsorb the SMD 40 is adsorbed. (30) is rapidly lowered to the Z axis (248).

In addition, the high speed descent is to prepare the mounting on the PCB upper surface 40a at a speed of 70000PPS.

In addition, the bottom heater 84 is moved to a preheating position for preheating the PCB lower surface 42b (249).

In addition, is a shade for preheating the lower surface 42b of the PCB 42 is provided with a high-density hot air nozzle and IR-ceramic heater for effective implementation of the preheating.

In addition, the head 30 moved in the Z-axis is to stop (250).

Thus, after setting the time for preheating (251), after setting the temperature and the preparation of the control according to the work parts, preheating is started (252).

In addition, after starting the preheating (252), and compared with the current temperature (253), the preheating is the bottom heater simultaneously or separately with the hot air supplied through the vacuum nozzle (36) Preheat with 84 to control the temperature.

After setting the value of the load cell 39 to the '0' point (254), it is confirmed (255).

After the check (255), the Z-axis is lowered (256).

In addition, after setting the load of the SMD 40 on which the load cell 39 is to be mounted (257), it is lowered to the Z-axis (258) to check and set the value of the set load cell 39 in close contact.

In addition, as shown in (a) of FIG. 5, the temperature sensor 70 is vertically formed at the center of the vacuum nozzle 36 and lowered to the Z-axis (258) to be in close contact with the upper surface of the SMD 40. The bottom surface of the temperature sensor 70 is also in close contact with the center portion 40a to compare the set temperature 252 according to the work part with the actual temperature (259).

However, as shown in FIG. 5B, the conventional temperature sensor 70 punctures the PCB 42 to insert the temperature sensor 70 to check the temperature or to vacuum the temperature sensor 70. The temperature was checked by installing outside the nozzle 36.

As described above, the conventional temperature sensing method discards after measuring the PCB 42 to be measured or the temperature sensor 70 is fixed by the temperature sensor 70 by fixing the temperature sensor 70 using epoxy (EPOXY). 70) is a disadvantage that can not be used only once and the occurrence of defects due to the thermal shock (Shock) of the SMD 40 to be mounted is remarkably high.

However, since the temperature sensor 70 according to the present invention is put into the center of the vacuum pipe 34 as described above, there is no damage of the PCB 42 or the temperature sensor 70, and the temperature sensor ( When the elastic member 72 is mounted on the upper end of the 70, and the temperature sensor 70 is in close contact with the upper surface of the SMD 40, the SMD 40 may be damaged due to the close contact with the temperature sensor 70. In addition, it prevents damage of the temperature sensor 70 due to tension of the elastic member 72 provided at the upper end of the temperature sensor 70, and can be completely mounted and detached by checking the temperature rise in real time. .

In this way, after the comparatively confirmed heating temperature (259) as described above is stabilized (260), the heating is stopped (261).

In addition, after comparing the set temperature with the present temperature, the temperature of the SMD 40 and the PCB 42 becomes 150 ° C. or lower (262), and the vacuum generator is turned off (263).

After the vacuum is released as described above (263), the cooling air for cooling the SMD 40 and the PCB 42 is supplied (264), and then the time for supplying the cooling air is set (265).

When the set time 265 is finished, the supply of cooling air is stopped (266), and the origin return command is transmitted to the Z axis (267), and the Z axis rises (268) to complete the return to the origin (269). 270.

In this way, when the temperature between the SMD 40 and the PCB 42 is finally checked and compared to 60 ° C. or less (271), the supply of all heaters or air is stopped (272) and the operation is completed (273).

In addition, as shown in Figure 6 is provided with a case 300 for accommodating the multi-function surface mount component mounter according to the present invention is a blowout port 310 for taking out the dust or smoke generated during the mounting or detachment operation to the outside It is equipped with a function to protect the worker from the risk of industrial accidents.

As described above, the multi-function surface mount component mounter according to the present invention can be mounted, remounted, and detached with a single machine, and equipped with a laser sensor to measure the height of a work part to accurately move vertically. It has a load cell that responds to minute loads and sets or mounts the most appropriate contact with the PCB that is in contact with the component when it is mounted. Setting it up also has the effect of making it a perfect implementation.

In addition, it is equipped with a heater that preheats or heats at the same time or separately to achieve a more dazzling effect in the perfect mounting and to take out dust generated during installation or detachment work to the outside for the safety of the operator. To become an effective equipment.

Claims (6)

FEEDER for supplying SURFACE MOUNTING DEVICE 40 to a printed circuit board 42, and the work of the PCB 42. An XY transfer unit 50 for determining a position, a vacuum pipe 34 for supplying air to adsorb the SMD 40, and a vacuum nozzle for vacuuming the supplied air for adsorbing the SMD 40 ( 36, the vacuum pipe and the nozzles (34, 36) integrally provided, the head 30 to operate up and down, and the direction of the SMD 40 to check, check and correct the vision (VISION) 60 and a PLC 82 for receiving and collecting data checked and calibrated by the vision 60 and outputting the same to control the lowering and mounting of the head 30. In the SMD mounter for soldering the SMD (40), The distance for detaching and detaching the upper surface 42a of the PCB 42 and the upper surface 40a of the SMD 40 mounted on the PCB 42 is measured, and works with the upper surface 42a of the PCB 42. A laser sensor 80 for measuring a distance for mounting and remounting the upper surface 40a of the SMD 40 set in a table; The contact pressure of the PCB 42 and the SMD 40 adhered to the working position for the detachment, mounting, and remounting is detected by comparing with the preset pressure, and the PCB 42 and the SMD at the set pressure. A load cell 39 for stopping the close contact of the 40; Detach, mount, and remount the SMD 40 that is in close contact with the load cell 39 under a set pressure. Hot air supplied from the vacuum nozzle 36 that heats the SMD 40 for mounting, and a bottom heater 84 supplied from the bottom surface of the PCB 42, It is formed perpendicular to the center of the vacuum pipe 34 to control the temperature of the PCB 42 and SMD 40 heated by the hot air and bottom heater 84 supplied from the vacuum nozzle 36 A temperature sensor 70 which is in close contact with the center of the upper surface 40a of the SMD 40 to sense a heating temperature and controls the temperature; The upper surface 40a of the SMD 40 picked up or detached by the heating sensor sensed and controlled by the temperature sensor 70 or adsorbed by the vacuum nozzle 36 to be mounted and remounted. Multi-function surface mounting component mounter, characterized in that to release the vacuum to the head (30) to return to the home position to perform the removal, mounting, remounting. The method of claim 1, Mounted on the side end of the vision 60, and transmits the distance between the PCB 42 and the SMD 40 measured by the laser sensor 80 to the PLC 82, the received PCB (42) And a distance of the SMD (40) by outputting the multi-function surface mount component mounter, characterized in that for controlling the lowering of the head (30). The method of claim 1, The load cell 39 sets the physical force that is in close contact and detachment between the measured PCB 42 and the SMD 40 in grams (g), and transmits the control to the PLC 82 and is controlled. Multi-functional surface mount component mounter, characterized in that the component is not physically damaged. The method of claim 1, The bottom heater (BOTTOM HEATER) 84 is a multi-functional surface mount component mounter, characterized in that composed of a high-density hot air nozzle (84a) and IR-ceramic heater (84b) for effective preheating. The method of claim 1, And a monitor (86) for real-time viewing of the contact distance between the PCB (42) and the SMD (40), the heating temperature of the heater, or the control of the PLC (82). The method of claim 1, Multi-function surface mounting component mounter comprising a blowout port 310 for taking out dust and soot generated during the mounting and desorption operation.