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KR19990012192A - Resin Composition for Electromagnetic Shielding - Google Patents

Resin Composition for Electromagnetic Shielding Download PDF

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Publication number
KR19990012192A
KR19990012192A KR1019970035514A KR19970035514A KR19990012192A KR 19990012192 A KR19990012192 A KR 19990012192A KR 1019970035514 A KR1019970035514 A KR 1019970035514A KR 19970035514 A KR19970035514 A KR 19970035514A KR 19990012192 A KR19990012192 A KR 19990012192A
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resin composition
thermoplastic resin
conductive
electromagnetic shielding
added
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KR1019970035514A
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Korean (ko)
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KR100466134B1 (en
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홍명호
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김윤
주식회사 삼양사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/22—Thermoplastic resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 매트릭스 수지에 전도성 충전재, 보강제 및 전도성 금속분말에 의해 제조된 3층 또는 그 이상의 총을 가진 스템퍼블 시트 열가소성 수지 조성물의 제조방법에 관한 것으로 전도성 충전재는 황동, 구리, 스테인레스 스틸, 니켈, 알루미늄 중에서 선택된 1종 이상으로서, 10~50 중량부가 첨가되어 있는 것을 특징으로 하는 전자파 차폐용 열가소성 수지 조성물이다.The present invention relates to a method for producing a stampable sheet thermoplastic resin composition having three or more guns prepared by a conductive filler, a reinforcing agent and a conductive metal powder in a matrix resin, wherein the conductive filler is brass, copper, stainless steel, nickel, 10-50 weight part is added as 1 or more types chosen from aluminum, The thermoplastic resin composition for electromagnetic wave shielding characterized by the above-mentioned.

보강제로는 유리섬유, 탄소섬유, 아라미드 섬유, 탈크, 마이카 중에서 선택된 1종 이상을 10~50 중량부로 첨가하였으며, 매트릭스 수지는 폴리에틸렌, 폴리프로필렌, 폴리아마이드, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리카보네이트 등의 열가소성 수지 조성물이 사용되며, 절연효과와 전도성 섬유를 결합하는 역할을 한다.As a reinforcing agent, one or more selected from glass fiber, carbon fiber, aramid fiber, talc and mica was added in 10 to 50 parts by weight, and the matrix resin was polyethylene, polypropylene, polyamide, polyethylene terephthalate, polybutylene terephthalate, Thermoplastic resin compositions such as polycarbonate are used and serve to bond the insulating effect and the conductive fibers.

Description

전자파 차폐용 수지조성물Resin Composition for Electromagnetic Shielding

본 발명은 열가소성 수지조성물에 관한 것으로서, 상세하게는 충격강도가 향상되고, 성형이 간편하며, 절연성과 전자파 차폐성이 탁월한 스템퍼블 시트 열가소성 수지조성물에 관한 것이다.The present invention relates to a thermoplastic resin composition, and more particularly, to a stampable sheet thermoplastic resin composition having improved impact strength, easy molding, and excellent insulation and electromagnetic shielding properties.

일반적인 플라스틱 재료들은 전기 절연성이 우수한 반면, 전자기파를 투과시키는 성질이 있다. 따라서 인체에 안좋은 영향을 미치고, 전자제품들의 오동작을 일으키는 경우가 있다. 실예로 핸드폰에서 발생되는 전자기파는 뇌암을 일으킨다는 보고가 있었고, 항공기 내에서 전자제품의 사용을 금지하는 것도 전자기파에 의한 비행기긱의 오동작을 막기위함이다. 이러한 전자기파를 EMI(Electomagnetic Wave Interference)라고 하며, 이에 대한 문제가 심각해짐에 따라 이에 대한 규제법안이 제정되고 있으며, 이를 막기 위한 방법도 여러 각도에서 진행되고 있다.General plastic materials have excellent electrical insulation, but have a property of transmitting electromagnetic waves. Therefore, it may adversely affect the human body and cause malfunction of electronic products. For example, there have been reports that electromagnetic waves generated from cell phones cause brain cancer, and banning the use of electronic products in aircrafts is to prevent the malfunction of airplanes by electromagnetic waves. Electromagnetic waves are called EMI (Electromagnetic Wave Interference), and as the problem becomes serious, regulatory legislation is enacted, and methods for preventing this are being progressed from various angles.

종래의 기술은 수지 자체에 탄소섬유 또는 금속섬유와 금속 플레이크 등을 혼입하여 수지 자체가 전도성을 가지게 함으로써 전자파 차폐의 효과를 갖게 하는 것으로, 그 방법은 대한민국 특허공고번호 95-11909에서 제시하고 있으며, 가공방법인 스탬퍼블 시트의 제조방법은 미국특허 5,540,986 나 5,165,990에서 볼 수 있다.The prior art is to mix the carbon fiber or metal fiber and metal flakes in the resin itself so that the resin itself has conductivity, so that the effect of electromagnetic shielding is proposed in Korean Patent Publication No. 95-11909, A method of manufacturing a stampable sheet, which is a processing method, can be found in US Patent 5,540,986 or 5,165,990.

전자파를 막는 방법으로는 일반적으로 전자기기 자체로부터 전자파의 방사를 억제하는 방법이 가장 효과적이다. 플라스틱 케이스내의 차폐방법은 크게 표면의 금속화, 금속판의 라미네이팅, 도전성 필러를 플라스틱에 직접 혼입하여 사출하는 것으로 나뉜다. 이들 방법 중 실제로 사용되고 있는 것은 도전성 도료, 아연 용사법, 플라스틱에 도전성 필러 혼입 사출법이며, 그 외의 방법은 가격, 양산성, 차폐효과 등의 문제로 거의 사용되고 있지 않다.In general, as a method of preventing electromagnetic waves, a method of suppressing radiation of electromagnetic waves from the electronic device itself is most effective. Shielding methods in plastic cases are largely divided into metallization of surfaces, lamination of metal plates, and injection of conductive fillers directly into plastics. Among these methods, those used in practice are conductive paints, zinc spraying methods, and injection molding of conductive fillers into plastics, and other methods are rarely used due to problems such as cost, mass productivity, and shielding effect.

도전성 도료의 경우, 은이나 니켈, 구리의 금속 미립자를 아크릴 등의 바인더와 함께 도료화 한 것으로, 은이나 니켈은 가격이 비싸고, 구리의 경우 산화되는 문제점이 있다.In the case of conductive paints, fine particles of silver, nickel, and copper are painted together with a binder such as acryl, and silver and nickel are expensive, and copper has a problem of being oxidized.

수지자체에 도전성 물질을 첨가하는 경우는 플라스틱에 알미늄, 카본, 금속, 탄소섬유, 플레이크 등의 도전성 필러를 혼입하여 성형하는 방법으로 2차 가공이 필요없고, 코팅시 나타나는 크랙, 박리의 염겨가 없으나, 균일한 보호효과를 위해서는 다량의 필러를 사용해야 하므로 하우징의 두께가 증가되고 플레이크의 경우 플라스틱 자체의 효과를 저하시키는 단점이 있다. 또한 카본블랙, 탄소섬유 등의 흑색 필러를 사용하게 되면 표면이 흑색이 되어 2차 도장이 필요하고 도전성이 높은 플라스틱은 양도체이므로 감전의 위험성을 갖는 것도 문제시 되고 있다.When the conductive material is added to the resin itself, it is a method of incorporating conductive fillers such as aluminum, carbon, metal, carbon fiber, and flake into the plastic, so that secondary processing is not necessary, and there are no cracks or peeling marks that appear during coating. In order to achieve a uniform protective effect, a large amount of filler must be used to increase the thickness of the housing and to reduce the effect of the plastic itself. In addition, when black fillers such as carbon black and carbon fiber are used, the surface becomes black and requires secondary coating, and since the high-conductivity plastic is a good conductor, there is a problem of risk of electric shock.

본 발명은 상기와 같은 문제점들을 해소함은 물론 플라스틱의 특징인 절기절연성을 그대로 유지하면서 전자파 차폐성이 우수한 열가소성 수지조성물을 얻기 위해 전도성 섬유 강화 스탬퍼블 열가소성 수지 시트를 이용하였다.The present invention used a conductive fiber-reinforced stampable thermoplastic resin sheet to solve the above problems as well as to obtain a thermoplastic resin composition excellent in electromagnetic shielding properties while maintaining the seasonal insulation characteristics of the plastic as it is.

스탬퍼블 시트의 제조 방법을 이용함으로써, 플라스틱 고유의 절연성을 잃지 않으면서, 전자파의 차단효과를 가지는 열가소성 수지 조성물을 얻을 수 있었다.By using the manufacturing method of a stampable sheet, the thermoplastic resin composition which has the electromagnetic wave shielding effect, without losing the insulation intrinsic to plastic was obtained.

제 1 도는 전자파 차폐용 스탬퍼블 시트의 개략도1 is a schematic view of a stampable sheet for shielding electromagnetic waves

본 발명은 섬유강화 플라스틱 성형기술 중 복합재의 성형기술의 일종으로, 플라스틱에 도전성을 가하여 전자파를 차단시키는 역할을 하도록 하는 열가소성 수지조성물에 관한 것으로 더욱 상세하게는 충격강도가 향상되고, 성형이 간편하며, 절연성과 전자파 차폐성이 탁월한 스탬퍼블 시트 열가소성 수지조성물에 관한 것이다.The present invention relates to a thermoplastic resin composition which serves to block electromagnetic waves by applying conductivity to plastics, and more particularly, to improve the strength of impact and to simplify molding. The present invention relates to a stampable sheet thermoplastic resin composition having excellent insulation and electromagnetic shielding properties.

본 발명으로 제조된 스탬퍼블 시트 열가소성 수지조성물은 매트릭스 수지와 전도성 충전재, 보강제 및 전도성 금속분말에 의해 제조된 3층 또는 그 이상의 층을 가진 전자파 차폐용 열가소성 수지조성물이다.The stampable sheet thermoplastic resin composition produced by the present invention is a thermoplastic resin composition for electromagnetic wave shielding having three or more layers made of a matrix resin, a conductive filler, a reinforcing agent, and a conductive metal powder.

본 발명에서 사용되는 매트릭스 수지는 폴리에틸렌, 폴리프로필렌, 폴리아마이드, 폴리에틸렌테레프탈레이트, 폴리부틸렌테레프탈레이트, 폴리카보네이트 등의 열가소성 수지 조성물이 사용되며, 절연효과와 전도성 섬유를 결합하는 역할을 한다.As the matrix resin used in the present invention, thermoplastic resin compositions such as polyethylene, polypropylene, polyamide, polyethylene terephthalate, polybutylene terephthalate, and polycarbonate are used, and serve to bond insulating effects and conductive fibers.

전도성 충전재는 황동, 구리, 스테인레스 스틸, 니켈, 알루미늄 중에서 선택된 1종 이상으로서 전체 수지조성물에 대해 10~50 중량부가 첨가하였으며, 보강제로는 유리섬유, 탄소섬유, 아라미드 섬유, 탈크, 마이카 중에서 선택된 1종 이상을 10~50 중량부가 첨가하였다.The conductive filler is at least one selected from brass, copper, stainless steel, nickel, and aluminum, and 10 to 50 parts by weight is added to the total resin composition, and the reinforcing agent is selected from glass fiber, carbon fiber, aramid fiber, talc, and mica. 10-50 weight part or more of species was added.

전도성 금속분말은 전도성 충전재의 도전성 향상을 위하여 사용되며 구리, 알루미늄 등의 파우더가 사용된다.The conductive metal powder is used to improve the conductivity of the conductive filler, and powders such as copper and aluminum are used.

상기 조성물 외에 목적에 따라, 수지의 열안정제 및 이형제, 증점제, 안료 등이 첨가될 수 있다.In addition to the composition, depending on the purpose, a heat stabilizer and a release agent, a thickener, a pigment and the like of the resin may be added.

제 1 도는 전자파 차폐용 스탬퍼블 시트의 개략도로, 매트릭스 수지 사이에 전도성 충전재와 보강재가 삽입되어 있는 형태로, 이용되는 제품에 따라 다양하게 시트의 두께를 바꿀 수 있으며, 필요에 따라 도전성 섬유와 보강섬유의 양을 조절함으로써 전자파 차폐의 효과와 시트의 강도를 조절할 수 있다.1 is a schematic diagram of a stampable sheet for shielding electromagnetic waves, in which a conductive filler and a reinforcing material are inserted between matrix resins, and the thickness of the sheet can be changed in various ways depending on the product used. By controlling the amount of fibers, the effect of electromagnetic shielding and the strength of the sheet can be controlled.

본 발명에서 각각의 시트와 보강제, 전도성 충전제 및 전도성 금속분말은 가공온도 260℃에서 폴리프로필렌 시트 사이에 랜덤하게 뿌린 후 두 개의 롤러 사이에서 라미네이트 시킨다. 2분 동안 100psi의 압력으로 접촉시키고, 3분동안 100psi의 압력을 가하면서 상온까지 식힌다.In the present invention, each sheet, reinforcing agent, conductive filler and conductive metal powder are randomly sprinkled between polypropylene sheets at a processing temperature of 260 ° C. and then laminated between two rollers. It is contacted at 100 psi pressure for 2 minutes, and cooled to room temperature while applying 100 psi pressure for 3 minutes.

얻어진 시트는 ASTM D 256에 의하여 충격강도를 측정하였다. 전자파의 차폐효과는 오하이오주의 Battelle 연구소에서 개발된 것으로, 전기 전도도와 자기투과도의 함수로 계산되며 10dB은 90%의 전자파 차폐효과를, 20dB은 99% 전자파 차폐효과를 나타낸다.The obtained sheet was measured for impact strength according to ASTM D 256. The shielding effect of electromagnetic waves was developed by Battelle Laboratories, Ohio. It is calculated as a function of electrical conductivity and magnetic permeability, with 10dB of 90% electromagnetic shielding and 20dB of 99% electromagnetic shielding.

[실시예 1]Example 1

폴리프로필렌을 매트릭스 수지로 사용하였고 전도성 충전재로 알루미늄을 15 중량부, 보강제로 유리섬유를 30 중량부, 전도성 금속분말로 알루미늄 분말을 5 중량부로 사용하여 제조하였으며, 그 결과를 표 1에 나타내었다.Polypropylene was used as a matrix resin, and 15 parts by weight of aluminum was used as a conductive filler, 30 parts by weight of glass fiber as a reinforcing agent, and 5 parts by weight of aluminum powder as a conductive metal powder. The results are shown in Table 1 below.

[실시예 2]Example 2

매트릭스 수지로 폴리에틸렌테레프탈레이트를 사용하고 그 조성물 함량을 표 1과 같이 한 것을 제외하고는 실시예 1과 동일하게 실시하였다.Polyethylene terephthalate was used as the matrix resin, and the composition was carried out in the same manner as in Example 1 except that the content of the composition was as shown in Table 1.

[비교예 1]Comparative Example 1

조성물 함량을 표 1과 같이 한 것을 제외하고는 실시예 1과 동일하게 실시하였다.The composition was carried out in the same manner as in Example 1 except that the content was as shown in Table 1.

[비교예 2]Comparative Example 2

조성물 함량을 표 1과 같이 한 것을 제외하고는 실시예 2과 동일하게 실시하였다.The composition was carried out in the same manner as in Example 2, except that the content was as shown in Table 1.

[표 1]TABLE 1

본 발명으로 제조된 열가소성 수지조성물은 우수한 절연효과와 전자파 차폐효과를 동시에 가지며, 필러의 이용으로 표면이 흑색이 되어 2차 도장에 필요한 기존의 전자파 차폐용 수지에 비해 외부시트의 색깔을 조절함에 따라 제품의 색깔이 결정될 수 있으므로 도장이 필요없는 효과를 갖는다.The thermoplastic resin composition produced by the present invention has excellent insulation effect and electromagnetic shielding effect at the same time, and the surface becomes black by use of a filler, so that the color of the outer sheet is adjusted as compared to the conventional electromagnetic shielding resin required for secondary coating. Since the color of the product can be determined, it has an effect that does not require painting.

적용될 수 있는 제품으로는 시트의 스탬핑 성형으로 제조될 수 있는 모든 제품, 예로 컴퓨터 케이스, 노트북 케이스, 전자파를 발생시킬 수 있는 각종 전자제품의 외장 케이스 등에 사용될 수 있다.The applicable product may be used for all products that can be manufactured by stamping molding of sheets, for example, computer cases, laptop cases, exterior cases of various electronic products that can generate electromagnetic waves, and the like.

Claims (3)

매트릭스 수지를 기본수지로 하고 전도성 충전재와 보강제 및 전도성 금속분말을 사용하여 제조된 3층 또는 그 이상의 층을 가진 스탬퍼블 시트 열가소성 수지조성물의 제조방법.A method for producing a stampable sheet thermoplastic resin composition having a matrix resin as a base resin and having three or more layers prepared by using a conductive filler, a reinforcing agent and a conductive metal powder. 제 1 항에 있어서, 전도성 충전재는 황동, 구리, 스테인레스 스틸, 니켈, 알루미늄 중에서 선택된 1종 이상으로서, 10~50 중량부가 첨가되어 있는 것을 특징으로 하는 전자파 차폐용 수지조성물.The resin composition for electromagnetic shielding according to claim 1, wherein the conductive filler is at least one selected from brass, copper, stainless steel, nickel, and aluminum, and 10 to 50 parts by weight is added. 제 1 항에 있어서, 보강제는 유리섬유, 탄소섬유, 아라미드 섬유, 탈크, 마이카 중에서 선택된 1종 이상으로서, 10~50 중량부로 첨가되어 있는 것을 특징으로 하는 전자파 차폐용 수지조성물.The resin composition for electromagnetic shielding according to claim 1, wherein the reinforcing agent is at least one selected from glass fibers, carbon fibers, aramid fibers, talc, and mica, and is added at 10 to 50 parts by weight.
KR1019970035514A 1997-07-23 1997-07-23 Electromagnetic Shielding Resin Composition KR100466134B1 (en)

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KR19990078700A (en) * 1999-07-30 1999-11-05 김재원 Compound, manufacturing method and product there of floor board for clean room
KR20010044739A (en) * 2001-03-21 2001-06-05 신용우 Electromagnetic waves exclusion nine
KR20030023899A (en) * 2001-09-14 2003-03-26 김성수 Thin microwave absorbers used in frequency range of mobile telecommunication
KR20050093235A (en) * 2004-03-18 2005-09-23 주식회사 우성기업 Manufacturing method of housings of cases with effects of emi shielding
CN113121972A (en) * 2019-12-30 2021-07-16 江苏派锐电子有限公司 Novel easy-heat-dissipation anti-aging electronic component plastic shell material
CN114228275A (en) * 2021-11-24 2022-03-25 广西南宁都宁通风防护设备有限公司 Composite explosion door with electromagnetic shielding function
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JPS6166755A (en) * 1984-09-11 1986-04-05 Mitsubishi Rayon Co Ltd Electromagnetic wave-shielding resin composition
JPS61149337A (en) * 1984-12-25 1986-07-08 Oji Yuka Gouseishi Kk Manufacture of electromagnetic wave shielding sheet
KR930007589B1 (en) * 1989-10-25 1993-08-13 금성마이크로닉스 주식회사 Method of making shadow mask
US5625150A (en) * 1994-08-18 1997-04-29 General Electric Company Integrated acoustic leak detection sensor subsystem

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KR19990078700A (en) * 1999-07-30 1999-11-05 김재원 Compound, manufacturing method and product there of floor board for clean room
KR20010044739A (en) * 2001-03-21 2001-06-05 신용우 Electromagnetic waves exclusion nine
KR20030023899A (en) * 2001-09-14 2003-03-26 김성수 Thin microwave absorbers used in frequency range of mobile telecommunication
KR20050093235A (en) * 2004-03-18 2005-09-23 주식회사 우성기업 Manufacturing method of housings of cases with effects of emi shielding
CN113121972A (en) * 2019-12-30 2021-07-16 江苏派锐电子有限公司 Novel easy-heat-dissipation anti-aging electronic component plastic shell material
CN114228275A (en) * 2021-11-24 2022-03-25 广西南宁都宁通风防护设备有限公司 Composite explosion door with electromagnetic shielding function
CN114228275B (en) * 2021-11-24 2024-04-09 广西南宁都宁通风防护设备有限公司 Composite explosion door with electromagnetic shielding function
CN118107229A (en) * 2024-01-12 2024-05-31 宝都国际新材料有限公司 Wear-resistant electromagnetic shielding integrated light honeycomb aluminum composite board

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