KR102679830B1 - Tube and substrate processing apparatus using the same - Google Patents

Abstract

The present invention discloses a tube capable of cooling the edge forming an inlet and a substrate processing device using the same, and by forming a cooling passage on the edge in contact with the manifold, damage to the O-ring between the manifold and the edge of the tube can be prevented. .

Description

Tube and substrate processing device using the same {TUBE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME}

The present invention relates to a substrate processing apparatus, and more specifically, to a tube capable of cooling an edge forming an inlet and a substrate processing apparatus using the same.

A substrate processing device is a device for depositing an insulating film, protective film, oxide film, metal film, etc. on a substrate such as a wafer.

An example of a substrate processing device may be a reactor.

The reactor is a device that deposits a thin film on a wafer through high-temperature heat treatment, and is configured to use a boat to process a large number of wafers at once.

The boat is configured to charge wafers in multiple layers in a certain number of units (for example, 180 sheets), and the reactor has a structure to vertically load or unload the boat charging the wafers.

An insulating section is formed at the bottom of the boat. The insulation part is intended to separate the temperature environment of the space where the boat where the wafer process is performed is located from the outside.

To proceed with the process, the boat and the insulation part are vertically brought into the reactor, and the brought boat and the insulation part are accommodated within the tube of the reactor.

The tube serves to separate the space where the boat where the wafer process is located from the outside.

Reactors are generally designed with a double tube structure including an inner tube and an outer tube. The inner tube accommodates the boat and the insulation part and forms a process environment, and the outer tube accommodates the inner tube and protects the inner tube.

A heating block is formed on the outside of the outer tube, and the heating block generates heat so that the inner space of the inner tube has a temperature environment for the process.

A manifold is formed at the lower part of the inner tube and outer tube. And, a cap flange is formed at the lower part of the insulation part.

The cap flange mounts the boat and insulation and can be raised or lowered.

When the cap flange is raised and lowered, the boat and the insulation part are brought into the inner tube, and the rim of the cap flange is assembled with the lower part of the manifold to maintain airtightness.

When the cap flange is lowered, the boat and the insulation are taken out of the inner tube, and the assembled state of the cap flange and manifold is released.

To maintain airtightness, O-rings are formed between the cap flange and the manifold and between the manifold and the outer tube, respectively.

The outer tube is heated by the heat generated by the heating block. The heating block continues to generate heat even when the cap flange is lowered and the boat and insulation are removed from the inner tube, so the outer tube is also continuously heated.

Thermal damage may occur in the O-ring between the manifold and the outer tube due to the heated outer tube as described above. If the O-ring is thermally damaged, it is difficult to maintain confidentiality.

In order to prevent thermal damage to the O-ring, the manifold may be configured to circulate process cooling water (PCW) inside the lower side of the position where the O-ring is formed. The position where the O-ring of the manifold is configured can be cooled by circulation of cooling water, and thermal damage to the O-ring can be prevented by the cooled manifold.

However, because process cooling water is a liquid refrigerant with high specific heat, there are limits to temperature control for the O-ring.

Additionally, when the manifold maintains a low temperature, there is a problem in that powder is formed on the inner wall of the manifold depending on the process.

The present invention is intended to solve the above-described problem, and provides a tube of a substrate processing apparatus that can protect the O-ring of the manifold contacting the lower part from thermal damage by cooling the rim in contact with the O-ring by a refrigerant such as a circulating gas. The purpose.

In addition, the present invention provides a substrate processing device that can suppress the heat of the outer tube from being transferred to the lower manifold by cooling the edge of the outer tube in contact with the manifold by a refrigerant such as a circulating gas. do.

The tube of the substrate processing apparatus of the present invention for achieving the above technical problem has a rim forming an inlet at the bottom, and a cooling passage for the flow of refrigerant is formed inside the rim, and the refrigerant generates heat at the top. It is characterized by suppressing transmission to the lower part of the border.

Additionally, the substrate processing apparatus of the present invention includes an inner tube; an outer tube that forms an inlet at the bottom and has a rim with a cooling passage for the flow of refrigerant therein, and accommodates the inner tube; and a manifold assembled to the lower portion of the edge of the outer tube.

According to the present invention, the rim forming the inlet at the bottom of the tube is cooled by a gas-like refrigerant, thereby suppressing the transfer of upper heat to the O-ring of the lower manifold, and as a result, protecting the O-ring from thermal damage. can do.

In addition, according to the present invention, the rim of the outer tube among the inner tube and the outer tube is cooled by a refrigerant such as gas circulating inside, thereby suppressing transfer of upper heat to the lower manifold.

Therefore, the O-ring configured for sealing between the manifold and the outer tube can be protected from thermal damage, and the reliability of the substrate processing apparatus can be improved.

Additionally, because there is no need to cool the manifold itself to protect the O-ring from thermal damage, the manifold can be prevented from maintaining an excessively low temperature. Therefore, there is an advantage in that powder can be prevented from being generated on the inner wall of the manifold depending on the process, and as a result, process reliability can be improved.

1 is a cross-sectional view showing a preferred embodiment of the substrate processing apparatus of the present invention.
Figure 2 is an enlarged cross-sectional view of portion A of Figure 1.
Figure 3 is a transverse cross-sectional view taken along part 3-3 of Figure 2;
Figure 4 is a partially exploded perspective view of the rim, coupling cover and ports.
Figure 5 is a diagram for explaining a refrigerant supply device and a monitoring device.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Terms used in this specification and patent claims should not be construed as limited to their ordinary or dictionary meanings, but should be construed with meanings and concepts consistent with the technical details of the present invention.

The embodiments described in this specification and the configurations shown in the drawings are preferred embodiments of the present invention, and do not represent the entire technical idea of the present invention, so various equivalents and modifications that can replace them at the time of filing the present application are available. There may be.

The embodiment of the substrate processing apparatus in FIG. 1 illustrates a reactor having a double tube structure having an outer tube 10 and an inner tube 20. And, FIG. 2 is an enlarged cross-sectional view of portion A of FIG. 1, and FIG. 3 is a transverse cross-sectional view of portion 3-3 of FIG. 2. Additionally, Figure 4 is a partially exploded perspective view of the edge 14, the coupling cover 16, and the ports.

An embodiment of the substrate processing apparatus of the present invention will be described with reference to FIGS. 1 to 4.

The embodiment of Figure 1 includes an outer tube 10, an inner tube 20, a manifold 30, a cap flange 40, an insulator 50, a boat 60, a gas injection nozzle 70, and a drive unit ( 80) and an assembly ring 35.

The outer tube 10 is used to form a buffer space, that is, a spaced space, to prevent the inner tube 20 from being damaged by internal and external environmental differences (pressure difference and temperature difference).

Illustratively, the outer tube 10 has a cylindrical shape, and an exhaust port 12 for exhausting gas exhausted from the inner tube 20 is formed at the lower part of the side wall, and a border forming an open inlet at the lower part ( 14) is provided. The outer tube 10 may be illustratively made of a quartz material.

The body of the outer tube 10 at the top of the rim 14 is illustrated as a cylindrical shape larger than the diameter of the inner tube 20, and the outer tube 10 has a volume that can accommodate the inner tube 20 therein. have

Additionally, the edge 14 of the outer tube 10 protrudes from the outer wall by a predetermined width and is formed to have a predetermined thickness. Additionally, a cooling passage CL is formed inside the rim 14, and the cooling passage CL is formed to allow refrigerant to circulate along the rim 14.

As shown in FIG. 3, an inlet port (IP) is configured at the inlet position of the cooling flow path (CL), and an outlet port (OP) is formed at the outlet position of the cooling flow path (CL).

The inlet port (IP) provides a path to supply refrigerant from the outside to the cooling flow path (CL), and the outlet port (OP) provides a path to discharge the refrigerant from the cooling flow path (CL) to the outside. The inlet port (IP) and outlet port (OP) described above can be configured at the inlet and outlet positions of the edge 14 using the combined cover 16. A description of the specific configuration of the inlet port (IP) and outlet port (OP) will be described later with reference to FIGS. 3 and 4.

Meanwhile, the inner tube 20 formed inside the outer tube 10 is intended to form a reaction space in which a thin film is formed on the wafer WF, which is a substrate, and the boat 60 is brought in through the lower inlet. and an insulation portion 50. When brought in, the boat 60 is located at the upper center of the inner tube 20, and the insulating part 50 is located below the center of the inner tube 20 when brought in.

A gas injection nozzle 70 installed vertically is located on one side of the inner space of the inner tube 20.

Injection holes 24 and 26 are formed on the side wall of the inner tube 20 opposite to where the gas injection nozzle 70 is located.

Among these, the injection ports 24 are formed in a vertical line at a position facing the boat 60, and the injection port 26 is formed at a position where at least a part of the injection port 12 of the outer tube 10 faces each other. .

The nozzles 24 are for exhausting the process gas inside the inner tube 20 used in the wafer process through the boat 60 to the outer tube 10, and the nozzles 26 are used to exhaust the process gas inside the inner tube 20 used in the wafer process through the boat 60. This is to exhaust the purge gas into the outer tube (10).

The manifold 30 is formed below the outer tube 10 and the inner tube 20 described above.

The manifold 30 may be coupled to the rim 14 of the outer tube 10 using the coupling cover 16 in contact with the rim 16. The manifold 30 can be assembled using the coupling cover 16 and bolts and nuts (not shown) or by using separate clamps (not shown), which can be easily performed by a person skilled in the art. Examples and descriptions of specific methods are omitted.

Here, the coupling cover 16 may be configured in the form of a ring bent into an “L” shape that covers the upper and side surfaces of the edge 14 and is in contact with the inlet port (IP) and the outlet port (OP). It can be configured for The specific configuration of the above-mentioned coupling cover 16 will be described in detail with reference to FIGS. 3 and 4 described later.

Then, an assembly ring 35 is assembled on the inner upper part of the manifold 30, and the assembly ring 35 supports the lower end of the inner tube 20 forming the inlet. It can be understood that the assembly ring 35 is illustratively configured to seal the gap between the entrance of the outer tube 10 and the entrance of the inner tube 20.

The above-described manifold 30 is configured on the upper portion of the rim of the cap flange 40 and is configured to supply gas between the cap flange 40 and the inner tube 20. For this purpose, an inlet 74 for supplying gas is installed on the side wall of the manifold 30, and the inlet 74 is coupled to the lower part of the gas injection nozzle 70.

An outer tube 10 is formed on the upper surface of the manifold 30. The bottom of the edge 14 of the outer tube 10 is in contact with the top of the manifold 30, and an O-ring (OR) is formed between them to maintain airtightness. The O-ring (OR) may be illustrated as being inserted into a channel formed along the edge 14 of the outer tube 10 on the upper surface of the manifold 30.

Additionally, the lower side of the manifold 30 is preferably in contact with the cap flange 40, and an O-ring (OR) is preferably formed between them to maintain airtightness.

The cap flange 40 supports the boat 60 and the insulation unit 50 formed at the top, and may be configured to be raised or lowered.

The raising or lowering of the cap flange 40 may be controlled by a raising/lowering module (not shown) configured at the bottom.

The boat 60 and the insulation unit 50 can be brought into the inner tube 20 by lifting the cap flange 40. At this time, the edge of the cap flange 40 is in contact with the lower side of the manifold 30 to maintain sealing.

Conversely, the boat 60 and the insulation unit 50 may be carried out of the inner tube 20 by lowering the cap flange 40. At this time, the edge of the cap flange 40 is separated from the lower side of the manifold 30.

Figure 1 illustrates a state in which the boat 60 and the insulation portion 50 are positioned within the inner tube 20 by raising and lowering the cap flange 40.

The driving unit 80 is configured at the lower part of the cap flange 40 and includes a driving shaft that penetrates the cap flange 40 and is coupled to the internal insulating part 52 of the insulating part 50.

The drive unit 80 transmits rotational force to the upper internal insulation unit 52 by rotating the drive shaft.

Meanwhile, the insulation portion 50 is formed at the lower part of the boat 60 and the upper part of the cap flange 40. The insulation unit 50 includes an internal insulation unit 52 and an external insulation unit 54. The internal insulating part 52 and the external insulating part 54 are made of insulating material.

The external insulation unit 54 has a longitudinal long hole at the center and has side walls of uniform thickness, and the internal insulation unit 52 has a circular pillar shape inserted into the long hole of the external insulation unit 54. The external insulation portion 54 may be configured to be fixed while contacting the upper surface of the cap flange 40.

The internal insulation unit 52 can transmit the rotational force transmitted from the driving unit 80 to the boat 60 at the top.

The boat 60 is configured to charge substrates, that is, wafers (WF). The boat 60 includes an upper support plate 62, a lower support plate 64, and a plurality of rods (Rod, 66). The upper support plate 62 and the lower support plate 64 are arranged in parallel and spaced apart from each other and are fixed by a plurality of rods 66 installed vertically between them. In addition, slots for occupying the wafer WF are formed in each of the plurality of rods 66 to form a plurality of layers. The wafer WF of each layer may be positioned between the plurality of rods 36 and then seated in slots of the same layer of the rods 66.

The boat 60 is configured to be coupled to the upper part of the internal insulation unit 52 of the insulation units 50 described above.

With the above-described configuration, the boat 60 can be rotated by rotational force transmitted through the internal insulation portion 52 during wafer processing. By the above-described rotation, the process gas can be evenly supplied to the entire surface of the wafers WF occupied in the boat 60.

A gas injection nozzle 70 is installed vertically on one side of the boat 60 and the insulation unit 50. The gas injection nozzle 70 is installed in the nozzle area of the inner tube 20 and can be configured to have various shapes. The gas injection nozzle 70 has injection nozzles 72 .

According to the embodiment of the present invention configured as described above, the process gas flows into the gas injection nozzle 70 and is activated in the process of moving upward, and the wafers (WF) of the boat 60 pass through the injection nozzles 72. ) can be sprayed.

In addition, the process gas injected into the wafers WF of the boat 60 flows through the wafers WF of the boat 60 or along the inner wall of the inner tube 20 and then flows through the exhaust ports of the inner tube 20 ( 24) can be exhausted. Most of the process gas exhausted from the exhaust ports 24 of the inner tube 20 is discharged to the outside through the exhaust port 12 of the outer tube 10.

In addition, an inlet structure (not shown) for purge gas may be formed on the cap flange 40 or the manifold 30, through which the purge gas can be supplied to the lower part of the insulation portion 50 and the inner tube. It can be exhausted through the exhaust port 26 of (20) and the exhaust port 12 of the outer tube 10.

In the substrate processing apparatus configured as shown in FIG. 1 above, a heating block (not shown) is configured outside the outer tube 10.

The heating block may be configured to surround the side wall and upper surface of the outer tube 10, and generates heat to heat the reaction space inside the inner tube 20.

The outer tube 10 is heated by the heat generated by the heating block. The heating block continues to generate heat even when the cap flange 40 is lowered and the boat 60 and the insulation portion 50 are taken out of the inner tube 10. Therefore, the outer tube 10 is continuously heated for the process regardless of whether the boat 60 and the insulation unit 50 are brought in or out.

Heat from the outer tube 10 may be transferred toward the manifold 30 through the rim 14. At this time, thermal damage due to heat may occur in the O-ring (OR) between the manifold 30 and the outer tube 10.

In order to prevent thermal damage to the O-ring (OR), a cooling passage (CL) is formed on the edge 14 of the outer tube 10 as described above in the embodiment of the present invention.

The cooling passage CL is formed in the upper part overlapping with the O-ring (OR) for sealing between the manifold 30 and the edge 14 of the outer tube 10.

The refrigerant is supplied to the cooling flow path CL at the inlet position, circulates within the rim 14 of the outer tube 10, and is discharged from the cooling flow path CL at the outlet position. At this time, the inlet position and the outlet position may be formed adjacent to each other, and the cooling passage CL starts circulation at the inlet position, is formed along the edge 14, and is formed to end circulation at the outlet position.

When the refrigerant circulates in the cooling passage CL, transfer of heat from the upper part of the outer tube 10 to the lower part of the rim 14 by the refrigerant may be suppressed. That is, transfer of heat from the upper part of the outer tube 10 to the O-ring (OR) can be suppressed, and thermal damage to the O-ring (OR) can be prevented.

In particular, in an embodiment of the present invention, the cooling passage CL is formed at an overlapped position above the O-ring OR. Therefore, it is possible to more effectively prevent heat from being transferred to the O-ring (OR).

Also, it is preferable that gas is supplied as a refrigerant to the cooling passage CL. Gas has a lower specific heat than liquid, so it has the advantage of being easier to control the temperature of the edge 14 than liquid.

An embodiment of the present invention includes an inlet port (IP), an outlet port (OP), and a combination cover 16 to circulate the refrigerant along the cooling passage (CL).

The inlet port (IP) penetrates the side of the rim (14) at the above-mentioned inlet position and is configured to supply refrigerant to the cooling passage (CL) from the outside.

The outlet port OP penetrates the side of the rim 14 at the outlet position close to the inlet position, and is configured to discharge the refrigerant circulating in the cooling passage CL.

The coupling cover 16 covers the side and top surfaces of the edge 14 and has through-holes 18 corresponding to the inlet and outlet positions.

The inlet port (IO) and outlet port (OP) described above are each configured to include a nozzle 100 and a support body 102.

The nozzle 100 is configured so that one end penetrates the inlet position or outlet position on the side of the edge 14 to reach the cooling passage (CL), and the other end penetrates the side wall of the coupling cover 16 and has a length that can be exposed. It may be composed of a pipe through which refrigerant flows.

The support 102 may be configured in a plate shape that protrudes from the outer wall of the nozzle 100 and is in close contact with the side of the edge 14. The support 102 serves to fix the positions of the inlet port (IO) and the outlet port (OP) by being interposed between the side of the edge 14 and the side wall of the coupling cover 16.

The coupling cover 16 has a receiving space 19 for inserting the support, that is, receiving the support, and the receiving space 19 is formed on the inner surface of the position where the through hole 18 of the coupling cover 16 is formed, and the support 102 ) is formed to have a volume that can accommodate.

The state in which the rim 14 is assembled with the manifold 30 can be supported by the combination of the coupling cover 16 and the manifold 30, and the manifold 30 has the coupling cover 16 as described above. It can be coupled together using bolts and nuts (not shown) or separate clamps (not shown).

By the above-described configuration, in the embodiment of the present invention, the edge 14 of the outer tube 10 is cooled by a refrigerant such as gas flowing along the cooling passage CL, and the heat in the upper part of the outer tube 10 is cooled. Transmission to the O-ring (OR) of the manifold 30 via the rim 14 can be suppressed. Therefore, the O-ring (OR) formed between the manifold 30 and the edge 14 of the outer tube 10 can be protected from thermal damage.

Additionally, due to the above-described configuration, transfer of heat from the outer tube 10 to the manifold 30 is suppressed. That is, the embodiment of the present invention does not need to cool the manifold 30 to maintain a low temperature. Therefore, the manifold 30 can be prevented from maintaining an excessively low temperature. Accordingly, the low temperature of the manifold 30 can prevent powder from being generated on the inner wall of the manifold 30 depending on the process.

Additionally, an embodiment of the present invention may be implemented as shown in FIG. 5 to supply refrigerant at different flow rates in response to different temperature environments.

The embodiment of Figure 5 is configured to be equipped with a refrigerant supply device and a temperature monitor 300.

The temperature monitor 300 can be understood as a monitoring facility that measures the temperature of the O-ring (OR) through a temperature detection chip (RC).

The refrigerant supply device is configured to include two or more supply switches for switching the supply of the refrigerant at different flow rates in response to different temperature environments, and supplies the refrigerant at the flow rate corresponding to the temperature environment to the inlet position through the selected supply switch. It can be configured to do so.

More specifically, the refrigerant supply device may exemplarily include a first refrigerant source 200 and a second refrigerant source 202, and the first refrigerant source 200 corresponds to the normal process of the first temperature environment. It is configured to include a supply regulator 210 that adjusts the supply speed of the refrigerant at a first flow rate and a first supply switch 220 that supplies the refrigerant at the first flow rate to the cooling passage (CL) when selected, and a second refrigerant source (202) is a supply regulator 212 that adjusts the supply rate of the refrigerant at a second flow rate corresponding to the high temperature process in the second temperature environment higher than the first temperature environment, and a cooling passage (CL) for supplying the refrigerant at the second flow rate when selected. ) is configured to include a second supply switch 222 that supplies to.

Accordingly, the refrigerant supply device can supply refrigerant at a flow rate corresponding to the temperature environment to the inlet position of the edge 14 through the selected supply switch (first supply switch 220 or second supply switch 222).

For example, when a wafer process is in progress or on standby, the heating block may be heated to 600°C, and if a cleaning process is in progress, the heating block may be heated to 800°C.

Embodiments of the present invention can be operated by dividing into a first temperature environment when the heating block is heated to 600°C and a second temperature environment when the heating block is heated to 800°C, and in the first temperature environment, the first temperature environment is 1 The supply switch 220 can supply refrigerant, and in the case of a second temperature environment, the second supply switch 222 can supply refrigerant.

Control of the first supply switch 220 and the second supply switch 222 can be implemented in various ways, such as automatic control by receiving a control signal from the temperature monitor 300 or manual control by an operator.

In addition, the symbol 400, which is not explained in FIG. 5, can be understood as a cartridge block heater that can be used auxiliary, and the cartridge block heater 400 operates when the manifold 30 is above a certain temperature (for example, above 180°C). It can be installed if there is a need to maintain it and is intended to control the temperature of the manifold 30.

As described above, the present invention can suppress high temperature from being transmitted to the O-ring (OR) of the manifold (30) by the edge of the outer tube (10) on which the cooling passage (CL) is formed, and as a result, the O-ring (OR) This can be protected from thermal damage, and the reliability of the substrate processing device can be improved.

Additionally, the manifold can be prevented from maintaining an excessively low temperature, and as a result, powder can be prevented from being generated on the inner wall of the manifold depending on the process, and process reliability can be improved as a result.

Claims (14)

It has a border forming an entrance at the bottom,
A cooling passage for the flow of refrigerant is formed inside the rim,
The transfer of heat from the upper part to the manifold assembled in contact with the lower part of the rim is suppressed by the refrigerant,
an inlet port that penetrates a side of the rim, supplies the refrigerant from the outside to the cooling passage through a nozzle, and includes a support that protrudes from an outer wall of the nozzle and is in close contact with the side of the rim;
an outlet port that penetrates a side of the rim at a position close to the inlet port, discharges the refrigerant circulating in the cooling passage through a nozzle, and includes a support that protrudes from an outer wall of the nozzle and is in close contact with a side of the rim; and
It includes a coupling cover that covers at least a side of the edge and has through-holes through which the inlet port and the outlet port are drawn out,
The tube of the substrate processing apparatus, wherein the inlet port and the outlet port are coupled to the edge while being supported by the coupling cover. According to claim 1,
A tube of a substrate processing apparatus wherein the cooling passage is formed at an upper portion overlapping with an O-ring for sealing between the manifold and the tube. delete According to claim 1,
The inlet port and the outlet port are,
A receiving space for accommodating the support is formed on the inner surface of the coupling cover at a position where the through hole is formed,
A tube of a substrate processing apparatus in which the inlet port and the outlet port are supported by the coupling cover by inserting the support into the receiving space. According to claim 1,
The combined cover is composed of a ring shape in which the side of the cover in contact with the side of the rim and the upper surface of the cover in contact with the upper surface of the rim are integrally formed,
A tube of a substrate processing apparatus in which the edge is assembled with the manifold is supported by a combination of the coupling cover and the manifold. According to claim 1,
A tube of a substrate processing apparatus through which gas is supplied as the refrigerant. inner tube;
an outer tube forming an inlet at the bottom, having a rim with a cooling passage for the flow of refrigerant therein, and accommodating the inner tube; and
A manifold assembled to the lower portion of the edge of the outer tube,
an inlet port that penetrates a side of the rim, supplies the refrigerant from the outside to the cooling passage through a nozzle, and includes a support that protrudes from the outer wall of the nozzle and is in close contact with the side of the rim;
an outlet port that penetrates a side of the rim at a position close to the inlet port, discharges the refrigerant circulating in the cooling passage through a nozzle, and includes a supporter that protrudes from an outer wall of the nozzle and is in close contact with a side of the rim; and
It further includes a coupling cover that covers at least a side of the edge and has through-holes through which the inlet port and the outlet port are drawn out,
A substrate processing apparatus, wherein the inlet port and the outlet port are coupled to the edge while being supported by the coupling cover. According to clause 7,
The cooling passage is formed in an upper part overlapping with an O-ring for sealing between the manifold and the outer tube. delete According to clause 7,
The inlet port and the outlet port are,
A receiving space for accommodating the support is formed on the inner surface of the coupling cover at a position where the through hole is formed,
A substrate processing apparatus in which the inlet port and the outlet port are supported by the coupling cover by inserting the support into the receiving space. According to clause 7,
The combined cover is composed of a ring shape in which the side of the cover in contact with the side of the rim and the upper surface of the cover in contact with the upper surface of the rim are integrally formed,
A substrate processing apparatus in which the state in which the edge is assembled with the manifold is supported by a combination of the coupling cover and the manifold. According to clause 7,
A substrate processing device in which gas is supplied as the refrigerant. According to clause 7,
It further includes a refrigerant supply device including two or more supply switches for switching the supply of the refrigerant at different flow rates in response to different temperature environments, wherein the refrigerant supply device has a flow rate corresponding to the temperature environment through the selected supply switch. A substrate processing device that supplies the refrigerant to the inlet port. According to claim 13,
The refrigerant supply device is
a first supply switch for supplying the refrigerant at a first flow rate corresponding to a normal process in a first temperature environment; and
A substrate processing apparatus comprising a second supply switch for supplying the refrigerant at a second flow rate faster than the first flow rate in response to a high temperature process in a second temperature environment higher than the first temperature environment.

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