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KR102657517B1 - 기판 표면 검사 장치 및 방법 - Google Patents

기판 표면 검사 장치 및 방법 Download PDF

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Publication number
KR102657517B1
KR102657517B1 KR1020170184513A KR20170184513A KR102657517B1 KR 102657517 B1 KR102657517 B1 KR 102657517B1 KR 1020170184513 A KR1020170184513 A KR 1020170184513A KR 20170184513 A KR20170184513 A KR 20170184513A KR 102657517 B1 KR102657517 B1 KR 102657517B1
Authority
KR
South Korea
Prior art keywords
substrate
camera
inspection
edge portion
unit
Prior art date
Application number
KR1020170184513A
Other languages
English (en)
Korean (ko)
Other versions
KR20190081754A (ko
Inventor
최한현
Original Assignee
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020170184513A priority Critical patent/KR102657517B1/ko
Priority to CN201821892291.XU priority patent/CN210128944U/zh
Publication of KR20190081754A publication Critical patent/KR20190081754A/ko
Application granted granted Critical
Publication of KR102657517B1 publication Critical patent/KR102657517B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020170184513A 2017-12-29 2017-12-29 기판 표면 검사 장치 및 방법 KR102657517B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020170184513A KR102657517B1 (ko) 2017-12-29 2017-12-29 기판 표면 검사 장치 및 방법
CN201821892291.XU CN210128944U (zh) 2017-12-29 2018-11-16 基板表面检测装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170184513A KR102657517B1 (ko) 2017-12-29 2017-12-29 기판 표면 검사 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20190081754A KR20190081754A (ko) 2019-07-09
KR102657517B1 true KR102657517B1 (ko) 2024-04-16

Family

ID=67260934

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170184513A KR102657517B1 (ko) 2017-12-29 2017-12-29 기판 표면 검사 장치 및 방법

Country Status (2)

Country Link
KR (1) KR102657517B1 (zh)
CN (1) CN210128944U (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005208054A (ja) * 2003-12-25 2005-08-04 Showa Denko Kk 表面検査方法および同装置
JP2013093389A (ja) * 2011-10-24 2013-05-16 Hitachi High-Technologies Corp 光学式検査装置及びエッジ検査装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070050803A (ko) 2006-08-28 2007-05-16 주식회사 대우일렉트로닉스 기판의 표면 결함 검사 방법
KR101704473B1 (ko) * 2015-06-16 2017-02-09 삼익티에이치케이 주식회사 윈도우 글라스 검사장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005208054A (ja) * 2003-12-25 2005-08-04 Showa Denko Kk 表面検査方法および同装置
JP2013093389A (ja) * 2011-10-24 2013-05-16 Hitachi High-Technologies Corp 光学式検査装置及びエッジ検査装置

Also Published As

Publication number Publication date
KR20190081754A (ko) 2019-07-09
CN210128944U (zh) 2020-03-06

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