KR102626371B1 - 프린트 배선판의 제조 방법 - Google Patents
프린트 배선판의 제조 방법 Download PDFInfo
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- KR102626371B1 KR102626371B1 KR1020190002120A KR20190002120A KR102626371B1 KR 102626371 B1 KR102626371 B1 KR 102626371B1 KR 1020190002120 A KR1020190002120 A KR 1020190002120A KR 20190002120 A KR20190002120 A KR 20190002120A KR 102626371 B1 KR102626371 B1 KR 102626371B1
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- South Korea
- Prior art keywords
- resin composition
- photosensitive resin
- composition layer
- support
- meth
- Prior art date
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- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
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Abstract
[해결수단] (1) 지지체와, 당해 지지체 위에 설치된, 감광성 수지 조성물을 함유하는 감광성 수지 조성물층을 갖는 수지 시트를 준비하는 공정, (2) 기판 위에 수지 시트를 라미네이트하는 공정, (3) 감광성 수지 조성물층을 노광하는 공정, 및 (4) 현상에 의해 패턴 감광성 수지 조성물층을 형성하는 공정을 포함하고, 지지체의 헤이즈가 20% 이하이며, (4) 공정후의 패턴 감광성 수지 조성물층의 지지체측의 면의 최대 계곡 깊이의 절대값(│Rv│)이, 500㎚ 이상이며, 감광성 수지 조성물이, 소정의 조건 (I) 또는 (II)를 충족시키는, 프린트 배선판의 제조 방법.
Description
도 2는 본 발명의 수지 시트를 기판 위에 라미네이트하고, 노광했을 때의 모습의 일례를 도시하는 개략 단면도이다.
도 3은 본 발명의 수지 시트를 사용하여 현상했을 때의 모습의 일례를 도시하는 개략 단면도이다.
도 4는 종래의 수지 시트를 설명하기 위한 개략 단면도이다.
도 5는 종래의 수지 시트를 기판 위에 라미네이트하고, 노광했을 때의 모습을 도시하는 개략 단면도이다.
도 6은 종래의 수지 시트를 사용하여 현상했을 때의 모습을 도시하는 개략 단면도이다.
101 지지체
101a 감광성 수지 조성물층측의 면
102 감광성 수지 조성물층
102a 지지체와 접하는 면
102b 현상후의 패턴 감광성 수지 조성물층
102c 기판측과는 반대측의 면
103 기판
11 종래의 수지 시트
111 지지체
111a 감광성 수지 조성물층측의 면
112 감광성 수지 조성물층
112a 지지체와 접하는 면
112b 현상후의 패턴 감광성 수지 조성물층
112c 기판측과는 반대측의 면
113 기판
Claims (12)
- (1) 지지체와, 당해 지지체 위에 설치된, 감광성 수지 조성물을 함유하는 감광성 수지 조성물층을 갖는 수지 시트를 준비하는 공정,
(2) 기판 위에 수지 시트를 라미네이트하는 공정,
(3) 감광성 수지 조성물층을 노광하는 공정, 및
(4) 현상에 의해 패턴 감광성 수지 조성물층을 형성하는 공정을 포함하는 프린트 배선판의 제조 방법으로서,
지지체의 헤이즈가 20% 이하이며,
(4) 공정후의 패턴 감광성 수지 조성물층의 지지체측의 면의 최대 계곡 깊이의 절대값(│Rv│)이, 500㎚ 이상이며,
감광성 수지 조성물이, 이하의 조건 (I) 또는 (II)를 충족시키는, 프린트 배선판의 제조 방법.
(I) 감광성 수지 조성물이, (a) 평균 입자 직경 0.5㎛ 이상의 무기 충전재를 함유하고, (a) 성분의 함유량이, 감광성 수지 조성물의 불휘발 성분을 100질량%로 한 경우, 60질량% 이상.
(II) 감광성 수지 조성물이, (a) 평균 입자 직경 0.5㎛ 이상의 무기 충전재, (b) 에틸렌성 불포화기 및 카르복실기를 함유하는 수지, (c) 에폭시 수지, 및 (d) 광중합 개시제를 함유. - 제1항에 있어서, 추가로, (5) 패턴 감광성 수지 조성물층을 경화하는 공정을 포함하는, 프린트 배선판의 제조 방법.
- 제2항에 있어서, 패턴 감광성 수지 조성물층의 경화물이, 솔더레지스트인, 프린트 배선판의 제조 방법.
- 제1항에 있어서, 감광성 수지 조성물이, 네가티브형 감광성 수지 조성물인, 프린트 배선판의 제조 방법.
- 제1항에 있어서, (3) 공정후 (4) 공정전의 감광성 수지 조성물층의 지지체측의 면의 최대 계곡 깊이의 절대값(│Rv│)을 A1(㎚)로 하고, (4) 공정후의 패턴 감광성 수지 조성물층의 지지체측의 면의 최대 계곡 깊이의 절대값(│Rv│)을 A2(㎚)로 한 경우, 3<A2/A1<100의 관계를 충족시키는, 프린트 배선판의 제조 방법.
- 제1항에 있어서, 추가로, (6) 지지체를 박리하는 공정을 포함하는, 프린트 배선판의 제조 방법.
- 제6항에 있어서, (6) 공정은, (2) 공정후 (3) 공정전에 행하는, 프린트 배선판의 제조 방법.
- 지지체와, 당해 지지체 위에 설치된, 감광성 수지 조성물을 함유하는 감광성 수지 조성물층을 갖는 수지 시트로서,
지지체의 헤이즈가 20% 이하이며,
현상후의 패턴 감광성 수지 조성물층의 지지체측의 면의 최대 계곡 깊이의 절대값(│Rv│)이, 500㎚ 이상이며,
감광성 수지 조성물이, 이하의 조건 (I) 또는 (II)를 충족시키는, 수지 시트.
(I) 감광성 수지 조성물이, (a) 평균 입자 직경 0.5㎛ 이상의 무기 충전재를 함유하고, (a) 성분의 함유량이, 감광성 수지 조성물의 불휘발 성분을 100질량%로 한 경우, 60질량% 이상.
(II) 감광성 수지 조성물이, (a) 평균 입자 직경 0.5㎛ 이상의 무기 충전재, (b) 에틸렌성 불포화기 및 카르복실기를 함유하는 수지, (c) 에폭시 수지, 및 (d) 광중합 개시제를 함유. - 제8항에 있어서, (b) 성분이, 유리 전이 온도가 -20℃ 이하인 (메트)아크릴 중합체를 함유하는, 수지 시트.
- 제8항에 있어서, 감광성 수지 조성물층이, 솔더레지스트 형성용인, 수지 시트.
- 제8항에 있어서, 노광후 현상전의 감광성 수지 조성물층의 지지체측의 면의 최대 계곡 깊이의 절대값(│Rv│)을 A1(㎚)로 하고, 현상후의 패턴 감광성 수지 조성물층의 지지체측의 면의 최대 계곡 깊이의 절대값(│Rv│)을 A2(㎚)로 한 경우, 3<A2/A1<100의 관계를 충족시키는, 수지 시트.
- 제8항 내지 제11항 중의 어느 한 항에 기재된 수지 시트의 감광성 수지 조성물층을 경화시킨 경화물.
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