KR102601289B1 - Substrate for image sensor, substrate module for image sensor and actuator and camera device having the same - Google Patents

Abstract

A substrate for an image sensor according to an embodiment includes an insulating layer including a first open area; and
It includes a first lead pattern portion disposed on the insulating layer, wherein the first lead pattern portion includes: a first pattern portion disposed on the insulating layer; a connection part extending from the first pattern part; It includes a second pattern part connected to the first pattern part through the connection part, and the second pattern part and the connection part are arranged to be flown on an area that does not overlap the insulating layer in a vertical direction.

Description

Substrate for image sensor, substrate module for image sensor, image sensor actuator and camera device including the same {SUBSTRATE FOR IMAGE SENSOR, SUBSTRATE MODULE FOR IMAGE SENSOR AND ACTUATOR AND CAMERA DEVICE HAVING THE SAME}

The embodiment relates to a substrate for an image sensor, and in particular, to a substrate for an image sensor capable of relative movement around a lens barrel and a camera module including the same.

Camera devices are generally installed in portable devices such as mobile communication terminals and MP3 players, as well as electronic devices such as automobiles, endoscopes, and CCTVs. These camera devices are gradually being developed with a focus on high pixels, and miniaturization and thinning are progressing. In addition, current camera devices are changing so that various additional functions can be implemented at low production costs.

The above camera device includes a lens barrel accommodating a lens, a lens holder coupled to the lens barrel, an image sensor disposed within the lens holder, and a driving substrate on which the image sensor is mounted. At this time, the lens transmits the image signal of the subject to the image sensor. And the image sensor converts the image signal into an electrical signal.

Here, the accuracy of the image signal from the camera device is determined according to the focal length, which is defined as the distance between the lens and the image sensor.

Accordingly, the camera device provided focus compensation or shake compensation by moving the lens barrel relative to the image sensor. That is, the camera device moved the lens barrel containing the lens relative to the image sensor in the X-axis, Y-axis, and Z-axis. At this time, the camera device required at least six elastic members such as springs to relatively move the lens barrel. And, each of the elastic members was coupled to the lens barrel by a method such as bonding.

However, the camera device according to the prior art as described above includes an upper spring plate disposed on the upper portion of the lens barrel as the lens barrel moves relative to the lens barrel, a lower spring plate disposed on the lower portion of the lens barrel, and an elastic wire for fixing the Z axis. It is composed of a structure such as an elastic wire, and as a result, the module structure of the camera device is complex.

In addition, the camera device according to the prior art requires a plurality of elastic members to move the lens barrel, and there is a problem that the number of assembly steps for the plurality of elastic members increases.

The embodiment provides a substrate for an image sensor with a new structure and a camera module including the same.

In addition, the embodiment provides a substrate for an image sensor that allows the image sensor to move relative to the lens barrel, and a camera module including the same.

In addition, the embodiment provides a substrate for an image sensor capable of not only movement in the X-axis, Y-axis, and Z-axis, but also tilt correction, and a camera module including the same.

Additionally, the embodiment provides a substrate for an image sensor that can simplify a spring structure for providing an autofocus function or a camera shake compensation function, and a camera module including the same.

The technical challenges to be achieved in the proposed embodiment are not limited to the technical challenges mentioned above, and other technical challenges not mentioned are clear to those skilled in the art from the description below. It will be understandable.

A substrate for an image sensor according to an embodiment includes an insulating layer including a first open area; and a first lead pattern portion disposed on the insulating layer, wherein the first lead pattern portion includes: a first pattern portion disposed on the insulating layer; a connection part extending from the first pattern part; It includes a second pattern part connected to the first pattern part through the connection part, and the second pattern part and the connection part are arranged to be flown on an area that does not overlap the insulating layer in a vertical direction.

Additionally, the connecting portion is bent a plurality of times between the first pattern portion and the second pattern portion.

Additionally, the center of the first pattern portion is aligned with the center of the second pattern portion on the same vertical or horizontal extension line.

In addition, the first pattern part includes a mounting part disposed on the insulating layer and on which an image sensor is mounted; and an extension part disposed on the insulating layer and bent and extending from the mounting part.

Additionally, the first extension line crossing the center of the mounting unit is spaced apart from the second extension line crossing the center of the extension unit by a third distance.

Additionally, the extension portion has one end connected to the mounting portion, the other end connected to the connection portion, and includes a region whose width gradually decreases from the one end to the other end.

Additionally, the first lead pattern portion may include a plurality of 1-1 lead pattern portions disposed on a first region of the insulating layer; and a plurality of 1-2 lead pattern portions disposed on a second region facing the first region of the insulating layer, and a 1-2 lead pattern portion disposed on the outermost side of the plurality of 1-1 lead pattern portions. The center of the first lead pattern portion is spaced apart by a first distance from the center of the 1-2 lead pattern portion disposed on the outermost side among the plurality of 1-2 lead pattern portions.

In addition, the plurality of 1-1 lead pattern portions are disposed biased in a first direction with respect to the center of the first region, and the plurality of 1-2 lead pattern portions are disposed with the center of the second region as the reference. It is arranged to be biased in a second direction opposite to the first direction.

Additionally, the second pattern portion includes a first insertion hole through which a wire passes.

A substrate module for an image sensor according to an embodiment includes: a substrate for an image sensor on which an image sensor is mounted; and a substrate holder disposed on the image sensor substrate, wherein the image sensor substrate includes: an insulating layer including a first open area; and a first lead pattern portion disposed on the insulating layer, wherein the substrate holder includes a third open region that overlaps the first open region in a vertical direction, and the first lead pattern portion includes the insulating layer. A first pattern portion disposed on the layer; a connection part extending from the first pattern part; and a second pattern portion connected to the first pattern portion through the connection portion, wherein the second pattern portion and the connection portion are arranged to be flown on an area that does not overlap the insulating layer in a vertical direction.

Additionally, the substrate holder is formed in a corner area of the upper surface and includes a receiving groove into which a magnet or coil is inserted.

Additionally, it includes a reinforcing member disposed between the substrate holder and the insulating layer of the image sensor substrate and including a second open area that overlaps the first and second open areas in a vertical direction.

Additionally, the second pattern portion includes a first insertion hole through which a wire passes, and the substrate holder includes a second insertion hole aligned in a vertical direction with the first insertion hole.

An image sensor actuator according to an embodiment includes a driving substrate including a second lead pattern portion; a substrate module for an image sensor disposed at a predetermined distance from the driving substrate and including a first lead pattern portion; an image sensor coupled to the image sensor substrate module and connected to the first lead pattern portion; and a wire having one end connected to the first lead pattern portion and the other end connected to the second lead pattern portion, wherein the image sensor substrate module includes: a substrate holder; and an image sensor substrate coupled to a lower portion of the substrate holder, wherein the image sensor substrate includes an insulating layer including a first open area; and a first lead pattern portion disposed on the insulating layer, wherein the first lead pattern portion includes: a first pattern portion disposed on the insulating layer and connected to the image sensor; a connecting portion bent and extending from the first pattern portion; and a second pattern portion extending from the connection portion and connected to the other end of the wire, wherein the second pattern portion and the connection portion are arranged to be flown on an area that does not overlap the insulating layer in a vertical direction.

Additionally, the first lead pattern portion may include a plurality of 1-1 lead pattern portions disposed on a first region of the insulating layer; and a plurality of 1-2 lead pattern portions disposed on a second region facing the first region of the insulating layer and facing the 1-1 lead pattern portion, wherein the plurality of 1-1 leads The pattern portion is disposed biased in a first direction based on the center of the first region, and the plurality of first-second lead pattern portions are disposed in a second direction opposite to the first direction with respect to the center of the second region. It is placed biased toward .

Additionally, the first lead pattern portion, the substrate holder, the second lead pattern portion, and the driving substrate are aligned with each other in a vertical direction, and insertion holes through which the wire passes are formed, respectively.

Additionally, a coil disposed in a corner area of the lower surface of the driving substrate; and a magnet disposed in a corner area of the upper surface of the substrate holder and facing the coil.

According to an embodiment, in order to implement the OIS and AF functions of the camera module, the image sensor is moved relative to the lens barrel in the X-axis, Y-axis, and Z-axis directions instead of moving the conventional lens barrel. Accordingly, the camera module according to the embodiment can eliminate the complicated spring structure for implementing OIS and AF functions and simplify the structure accordingly. Additionally, by moving the image sensor according to the embodiment relative to the lens barrel, a more stable structure can be formed compared to the existing one.

In addition, according to the embodiment, the terminal portion electrically connected to the image sensor has a spring structure and is arranged to float in a position that does not overlap the insulating layer in a vertical direction. Accordingly, the camera module can move the image sensor relative to the lens barrel while stably and elastically supporting the image sensor.

According to the above-mentioned embodiment, the Hand shake correction can be performed together, and through this, a more improved hand shake correction function can be provided.

1 is a diagram showing a camera module according to a comparative example.
Figure 2 is a perspective view of a camera device according to this embodiment.
Figure 3 is a cross-sectional view viewed from AA in Figure 2.
Figure 4 is a cross-sectional view viewed from BB in Figure 2.
Figure 5 is an exploded perspective view of a portion of the camera device according to this embodiment.
Figure 6 is an exploded perspective view of a portion of the camera device according to this embodiment.
Figure 7 is a bottom perspective view of a partial configuration of the camera device according to this embodiment.
Figure 8 is a perspective view of a partial configuration of a camera device according to this embodiment.
Figure 9a is an exploded perspective view of a substrate module for an image sensor of a camera device according to this embodiment.
FIG. 9B is a cross-sectional view viewed from CC in a state in which the image sensor substrate module of the camera device of FIG. 9A is combined.
FIG. 9C is a cross-sectional view viewed from DD of the image sensor substrate module of the camera device of FIG. 9A combined.
FIGS. 10 and 11 are exploded perspective views of some components of the camera device according to this embodiment, as seen from a direction different from that of FIG. 9A.
Figure 12 is an exploded perspective view of the image sensor module of the camera device according to this embodiment.
FIG. 13 is an exploded perspective view of the image sensor module of the camera device according to this embodiment, viewed from a direction different from that of FIG. 12.
Figure 14 is a diagram explaining x-axis direction shift driving through some configurations of the camera device according to this embodiment.
Figure 15 is a diagram explaining y-axis direction shift driving through some configurations of the camera device according to this embodiment.
FIG. 16 is a diagram illustrating rotational driving around the z-axis through some configurations of the camera device according to this embodiment.
Figure 17 (a) is a diagram showing a magnet placed on a substrate holder along with the x-axis and y-axis.
Figure 17 (b) is a diagram showing the substrate holder, magnet, and coil along with rotational drive in the z-axis direction.
Figure 18 is a diagram showing the magnetic flow and Lorentz Force between the magnet and coil of the camera device according to this embodiment.
Figure 19 is a perspective view of an optical device according to this embodiment.
FIG. 20 is a configuration diagram of the optical device shown in FIG. 19.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology. Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as “at least one (or more than one) of A, B, and C,” it can be combined with A, B, and C. It may contain one or more of all possible combinations. Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, combined or connected to that other component, but also is connected to that component. Also includes cases where other components are ‘connected’, ‘combined’ or ‘connected’ by another component between them?? You can.

In addition, when described as being formed or disposed "on top or bottom" of each component, top or bottom refers not only to cases where two components are in direct contact with each other, but also to one component. This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as "top (above) or bottom (bottom)", it may include not only the upward direction but also the downward direction based on one component.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

1 is a diagram showing a camera module according to a comparative example.

A camera module equipped with OIS (Optical Image Stabilizer) function and AF (Auto Focusing) function requires at least two spring plates.

The camera module according to the comparative example may have two spring plates. The camera module according to the comparative example requires at least six spring-like elastic members in the spring plate.

Referring to FIG. 1, the camera module according to the comparative example includes an optical system including a lens assembly, an infrared filter unit, and a sensor unit. That is, the camera module according to the comparison includes a lens barrel 10, a lens assembly 20, a first elastic member 31, a second elastic member 32, a first housing 41, a second housing 42, It includes an infrared blocking filter unit 50, a sensor unit 60, a circuit board 80, and a driving unit 71, 72, 73, and 74.

At this time, the lens barrel 10 is connected to the first housing 41. That is, the lens barrel 10 is connected to the first housing 41 through the first elastic member 31. That is, the lens barrel 10 is movably connected to the first housing 41 by the first elastic member 31. At this time, the first elastic member 31 includes a plurality of springs (not shown). For example, the first elastic member 31 connects the lens barrel 10 and the first housing 41 at a plurality of points on the lens barrel 10.

The second elastic member 32 is connected to the first housing 41 and the second housing 42 accommodating the first housing 41. The second elastic member 32 movably fixes the first housing 41 to the second housing 42 . The second elastic member 32 includes a plurality of springs. In detail, the second elastic member 32 includes a leaf spring.

At this time, the first elastic member 31 supports the lens barrel 10 and moves the lens barrel 10 relative to the sensor unit 60 in the vertical direction (Z-axis direction). For this purpose, the first elastic member 31 includes at least four springs.

Additionally, the second elastic member 32 supports the lens barrel 10 and moves the lens barrel 10 relative to the sensor unit 60 in the horizontal direction (X-axis direction and Y-axis direction). For this purpose, the second elastic member 32 includes at least two springs.

As described above, in the camera module according to the comparative example, OIS and AF are achieved as the lens barrel 10 moves in the X-axis, Y-axis, and Z-axis directions. To this end, the camera module according to the comparative example requires at least six elastic members such as springs. Additionally, the camera module according to the comparative example requires two spring plates to support the above elastic members. Additionally, the camera module according to the comparative example requires an additional member such as an elastic wire to secure the Z-axis of the lens barrel 10. Therefore, the camera module according to the comparative example has a complex spring structure for moving the lens barrel to the X-axis, Y-axis, and Z-axis.

Additionally, in the camera module according to the comparative example, in order to couple the elastic members to the lens barrel 10, the work of bonding each elastic member manually is required. Accordingly, the camera module according to the comparative example has a complicated manufacturing process and takes a long time to manufacture.

In addition, although the camera module according to the comparative example provides a tilt function of the lens barrel 10, it has a structure that makes tilt correction for the image difficult in practice. In other words, even if the lens barrel 10 rotates with respect to the sensor unit 60, there is no change in the image incident on the sensor unit 60, so tilt correction for the image is difficult, and furthermore, the tilt function itself is unnecessary. .

Hereinafter, a substrate for an image sensor, a camera module, and a camera device including the same according to an embodiment will be described.

The 'Optical Axis (see OA in FIG. 5) direction' used below is defined as the optical axis direction of the lens and/or image sensor coupled to the lens driving device.

The 'vertical direction' used below may be a direction parallel to the optical axis direction. The vertical direction may correspond to the 'z-axis direction (see FIG. 5).' The 'horizontal direction' used below may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Accordingly, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction' (see Figure 5).

The 'autofocus function' used below automatically focuses on the subject by adjusting the distance to the image sensor by moving the lens in the direction of the optical axis according to the distance to the subject so that a clear image of the subject can be obtained on the image sensor. Defined as a function. Meanwhile, 'Auto Focus' can correspond to 'AF (Auto Focus)'.

The 'image shake correction function' used below is defined as a function that moves the lens and/or the image sensor to offset vibration (movement) generated in the image sensor by external force. Meanwhile, 'image stabilization' can correspond to 'OIS (Optical Image Stabilization)'.

FIG. 2 is a perspective view of a camera device according to this embodiment, FIG. 3 is a cross-sectional view viewed from A-A in FIG. 2, FIG. 4 is a cross-sectional view viewed from B-B of FIG. 2, and FIG. 5 is a part of the camera device according to this embodiment. It is an exploded perspective view of the configuration, FIG. 6 is an exploded perspective view of a partial configuration of the camera device according to this embodiment, FIG. 7 is a bottom perspective view of a partial configuration of the camera device according to the present embodiment, and FIG. 8 is an exploded perspective view of a partial configuration of the camera device according to the present embodiment. It is a perspective view of a part of the configuration of the camera device, and FIG. 9A is an exploded perspective view of the substrate module for the image sensor of the camera device according to the present embodiment, and FIG. 9B shows the combined state of the substrate module for the image sensor of the camera device of FIG. 9A C-C. It is a cross-sectional view as seen from , FIG. 9C is a cross-sectional view viewed from D-D of the state in which the substrate module for the image sensor of the camera device of FIG. 9A is combined, and FIGS. 10 and 11 are FIG. 9A and FIG. 9C of a partial configuration of the camera device according to the present embodiment. FIG. 12 is an exploded perspective view of the image sensor module of the camera device according to this embodiment, and FIG. 13 is an exploded perspective view of the image sensor module of the camera device according to this embodiment, viewed from a different direction than FIG. 12. It is a perspective view, and Figure 14 is a diagram explaining the x-axis direction shift driving through some configurations of the camera device according to this embodiment, and Figure 15 is a diagram explaining the y-axis direction shift driving through some configurations of the camera device according to this embodiment. It is an illustrative diagram, and FIG. 16 is a diagram illustrating rotational driving around the z-axis through some configurations of the camera device according to this embodiment, and FIG. 17 (a) shows the magnet disposed on the substrate holder in the x- and y-axes. 17 (b) is a diagram showing the substrate holder, magnet, and coil with rotational drive in the z-axis direction, and FIG. 18 is a diagram showing the magnetic force between the magnet and coil of the camera device according to this embodiment. This is a diagram showing magnetic flow and Lorentz Force.

The camera device 100A may include a camera module. The camera device 100A may include a lens driving device. The lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens driving motor. The lens driving device may be a lens driving actuator. The lens driving device may include an AF module. The lens driving device may include an OIS module.

Camera device 100A may include an actuator. The actuator may drive the image sensor 444. The actuator may tilt the image sensor 444. The actuator may move the image sensor 444. The actuator may rotate the image sensor 444. The actuator may move the image sensor 444 in a first direction perpendicular to the optical axis, move it in a second direction perpendicular to the optical axis and the first direction, and rotate it based on the optical axis. At this time, the first direction may be the x-axis direction, the second direction may be the y-axis direction, and the optical axis may be the z-axis direction. The actuator may include a coil 310 and a magnet 320. The actuator can move the image sensor 444 through electromagnetic force.

That is, the actuator of the camera device 100A can move the image sensor 444 relative to the lens barrel. The actuator will be described in more detail below.

Camera device 100A may include a holder 110. The holder 110 may be placed on the lower surface of the flexible printed circuit board 150. The holder 110 may include a protrusion for fitting into the groove of the flexible printed circuit board 150 . The holder 110 may be placed on the upper surface of the driving substrate 120 . The holder 110 may be disposed between the flexible printed circuit board 150 and the driving board 120. A lens module 210 may be placed in the holder 110. An optical module may be placed in the holder 110. Holder 110 may be combined with housing 600. At this time, the driving board 120 may be a component of an image sensor actuator that is electrically connected to the image sensor 444. One end of the driving substrate 120 is connected to the image sensor substrate 430 and thus can receive an image signal transmitted from the image sensor 444 coupled to the image sensor substrate 430. Additionally, the other end of the driving board 120 is connected to the flexible printed circuit board 150, and thus the image signal provided from the image sensor 444 can be transmitted to the outside. That is, the driving board 120 can transmit the image signal obtained from the image sensor 444 to the main board.

To this end, the flexible circuit board 150 can connect the camera module and the main board of the external device. Specifically, the flexible circuit board 150 may connect the image sensor board of the camera module and the main board of the optical device (eg, a portable terminal).

To this end, the flexible circuit board 150 may be placed inside the camera device and connected to the driving board 120 of the image sensor actuator, and the remaining part may be placed outside the camera device and connected to the main board of the optical device.

The holder 110 may include a step 111 . The step 111 may be formed around the insertion portion 112 of the holder 110. A lens module 210 may be disposed on the step 111. The step 111 may support a portion of the lower surface of the lens module 210. Through this, it is possible to prevent the lens module 210 from deviating downward while seated on the step 111.

Holder 110 may include an insertion portion 112. The insertion portion 112 may be a hollow hole. The insertion portion 112 may be an opening. A lens module 210 may be placed in the insertion portion 112. A portion of the lens module 210 may extend below the step 111 through the insertion portion 112.

The holder 110 may include a first hole 113. The first hole 113 may be formed to expose a portion of the driving substrate 120 to be coupled to the wire 510. There may be a plurality of first holes 113. For example, there may be two first holes 113.

The holder 110 may include a second hole 114. The second hole 114 may be formed to expose the sensor 520 coupled to the driving substrate 120. There may be a plurality of second holes 114. For example, there may be four second holes 114.

The holder 110 may include a first groove 115. The first groove 115 may be formed to expose a portion of the driving substrate 120 to be coupled to the wire 510. The first groove 115 may be formed on the side of the holder 110. The first groove 115 may be formed on both sides of the holder 110, respectively. There may be a plurality of first grooves 115. For example, the first groove 115 may include two grooves respectively disposed on both sides of the holder 110 facing each other.

The holder 110 may include a second groove 116. The second groove 116 is formed in a shape corresponding to the protrusion of the housing 600 and can be fitted with the protrusion of the housing 600. However, the second groove 116 may not be provided in a shape corresponding to the protrusion of the housing 600. The second groove 116 may be formed on the side of the holder 110. The second groove 116 may be formed on both sides of the holder 110. There may be a plurality of second grooves 116. For example, there may be three second grooves 116. The second groove 116 includes two grooves disposed on one side of the holder 110, and may be formed on the other side as one groove in which the two grooves are connected into one.

The camera device 100A may include a driving substrate 120. The driving substrate 120 may be placed on the holder 110 . The driving substrate 120 may be disposed on the lower surface of the holder 110 . The upper surface of the driving substrate 120 may be in contact with the lower surface of the holder 110.

The driving board 120 may be disposed below the flexible printed circuit board 150 . The driving substrate 120 may be coupled to the wire 510 . The driving board 120 may be a rigid flexible PCB (RFPCB). The driving substrate 120 may include first to fourth corners. At this time, the driving substrate 120 is coupled to the image sensor substrate 430 on which the image sensor 444 is disposed, and may be a component of an image sensor actuator that moves the image sensor substrate 430.

The driving substrate 120 may include a fourth open area 121 . The fourth open area 121 may be formed at the center of the driving substrate 120. The fourth open area 121 may be a hollow hole penetrating the upper and lower surfaces of the driving substrate 120. The fourth open area 121 may be an opening. The fourth open area 121 of the driving substrate 120 may be aligned with the image sensor 444 disposed at the lower portion and the lens module 210 disposed at the upper portion on the optical axis OA.

Preferably, the fourth open area 121 includes the image sensor 444 disposed below, the first open area 433 of the image sensor substrate 430, and the second open area 424 of the reinforcement member 420. ), may be aligned with the third open area 411 of the substrate holder 410 and the optical axis OA. The lens module 210 may be disposed in the fourth open area 121. The fourth open area 121 of the driving substrate 120 may be formed to have a larger width than the insertion portion 112 of the holder 110.

The driving substrate 120 may include a coupling portion. The driving substrate 120 may be coupled to the wire 510 at a coupling portion. That is, the driving substrate 120 may include a lead pattern portion coupled to the wire 510. For example, the driving substrate 120 may include a second lead pattern portion 122 electrically connected to one end of the wire 510 . The second lead pattern portion 122 of the driving substrate 120 and the wire 510 may be joined through soldering. The second lead pattern portion 122 may be a portion where the solder resist is opened to be electrically connected to the wire 510. A third insertion hole 123 into which a wire is inserted may be formed in the second lead pattern portion 122 and the driving substrate 120. Accordingly, one end of the wire 510 may be inserted into the second lead pattern portion 122 and the third insertion hole 123 of the driving substrate 120. Preferably, one end of the wire 510 may penetrate the second lead pattern portion 122 and the driving substrate 120 and protrude onto the surface of the second lead pattern portion 122, and may be soldered (not shown). It may be electrically connected to the second lead pattern portion 122 by (not included).

That is, part of the third insertion hole 123 may be formed on the driving substrate 120, and the remaining part may be formed on the second lead pattern portion 122. Additionally, a portion of the third insertion hole formed on the second lead pattern portion 122 may be filled with solder by soldering the wire 510 protruding above the surface of the second lead pattern portion 122.

The driving substrate 120 may include a connector 124. The connector 124 may be electrically connected to the flexible circuit board 150. A connector corresponding to the connector 124 of the driving board 120 may be disposed on the flexible printed circuit board 150 . The connector 124 may include a port for electrical connection to an external device.

The driving substrate 120 may include a terminal 125. The terminal 125 may be formed on the lower surface of the driving substrate 120. Terminal 125 may be electrically connected to coil 310. The terminal 125 may be connected to a pair of lead wires of the coil 310 by soldering or Ag epoxy. Terminal 125 may include a plurality of terminals. The terminal 125 may include a total of eight terminals, two for each of the four coils. The driving substrate 120 generates a magnetic field in the image sensor substrate 430 using the coil 310, and allows the position of the image sensor substrate 430 to be moved by the generated magnetic field. .

That is, the driving substrate 120 is electrically connected to the lower image sensor substrate 430 through a wire 510, and the image sensor substrate 430 can be moved using the wire 510. there is. In other words, the driving substrate 120 is fixedly coupled to the holder 110, and the image sensor substrate 430 can move relative to the driving substrate 120. Movement of the image sensor substrate 430 may be achieved by magnetic force generated from the coil 310 connected to the terminal 125. This will be explained below.

The camera device 100A may include a lens module 210. The lens module 210 may be placed on the holder 110. The lens may be placed in a position corresponding to the image sensor 444. Lens module 210 may include at least one lens. The lens module 210 may include a plurality of lenses. The lens module 210 may include 5 lenses. The lens module 210 may include first to fifth lenses 211, 212, 213, 214, and 215. Lens module 210 may include a barrel 216. A plurality of lenses may be disposed within barrel 216. The lens module 210 may include a hole 217. An optical module may be placed in the hole 217 of the lens module 210. The hole 217 of the lens module 210 may be formed to penetrate the lens module 210 in the horizontal direction between the plurality of lenses. Through this, the optical axes of the plurality of lenses and the optical axes of the optical module can be aligned. The hole 217 of the lens module 210 may be formed between the second lens 212 and the third lens 213.

The camera device 100A may include an optical module. The optical module can perform an image stabilization (OIS) function. The optical module can perform an autofocus (AF) function. The optical module may be arranged in alignment with a plurality of lenses and image sensors 444. The optical module may be disposed between a plurality of lenses. The optical module may be disposed between the second lens 212 and the third lens 213. The optical module may include a MEMS actuator 220.

As shown in FIG. 8, the camera device 100A may include a MEMS actuator 220. The MEMS actuator 220 can perform an autofocus function and/or a shake correction function by moving a moving lens using a silicon wafer.

The MEMS actuator 220 may be connected to the lens substrate 221. The lens substrate 221 may include a terminal 222. Terminal 222 may include a plurality of terminals. Terminal 222 may include six terminals. The terminal 222 of the lens substrate 221 may be connected to the terminal 150a of the flexible circuit board 150.

Camera device 100A may include a coil 310. That is, the actuator that moves the image sensor 444 may include the coil 310.

The coil 310 may be disposed on the driving substrate 120 .

The coil 310 may be electrically connected to the driving substrate 120. The coil 310 may be arranged to face the magnet 320 disposed below. When current is applied to the coil 310, an electric field may be formed around the coil 310. When current is applied to the coil 310, one of the coil 310 and the magnet 320 may move relative to the other through electromagnetic interaction between the coil 310 and the magnet 320.

Coil 310 may include four coils. Current can be applied independently to at least three of the four coils. In the first embodiment, the coil 310 can be controlled with three channels. Alternatively, in the second embodiment, the coil 310 can be controlled through four channels. The four coils 310 may be electrically separated from each other. Either forward current or reverse current may be selectively applied to each of the four coils 310. In this embodiment, only three of the four coils are electrically separated and one coil may be electrically connected to the other coil. Alternatively, all four coils can be electrically isolated. If only 3 of the 4 coils are electrically separated, a total of 6 lead wires in 3 pairs will come out from the coil 310. If all 4 coils are electrically separated, a total of 8 lead wires in 4 pairs will come out from the coil 310. You can.

When controlling 4 coils through 3 channels as in the first embodiment of this embodiment, a pair of coils 310 and magnets 320 must be used to rotate the z-axis, but when controlling 4 coils through 3 channels as in the second embodiment, When controlling four coils, two pairs of coils 310 and magnets 320 can be driven in z-axis rotation.

The coil 310 may include first to fourth coils 311, 312, 313, and 314. The first coil 311 may be disposed to face the first magnet 321. The second coil 312 may be disposed to face the second magnet 322. The third coil 313 may be disposed to face the third magnet 323. The fourth coil 314 may be disposed to face the fourth magnet 324. The first coil 311 may be disposed at the first corner of the driving substrate 120. The second coil 312 may be disposed at the second corner of the driving substrate 120. The third coil 313 may be disposed at the third corner of the driving substrate 120. The fourth coil 314 may be disposed at the fourth corner of the driving substrate 120. The first coil 311 and the third coil 313 are disposed on the first diagonal direction of the driving substrate 120, and the second coil 312 and the fourth coil 314 are disposed on the second diagonal direction of the driving substrate 120. It may be placed diagonally.

In this embodiment, the first coil 311 and the third coil 313 may be arranged long in the first direction, and the second coil 312 and the fourth coil 314 may be arranged long in the second direction. At this time, the first direction and the second direction may be perpendicular. The long side of the first coil 311 and the long side of the third coil 313 may be arranged parallel to each other. The long side of the second coil 312 and the long side of the fourth coil 314 may be arranged parallel to each other. The long side of the first coil 311 and the long side of the second coil 312 may be arranged not parallel to each other. At this time, the long side of the first coil 311 and the long side of the second coil 312 may be arranged so that virtual extension lines are perpendicular to each other. The arrangement direction of the first coil 311 and the arrangement direction of the second coil 312 may be perpendicular to each other.

In this embodiment, current may be applied independently to at least three of the first to fourth coils 311, 312, 313, and 314. The first to fourth coils 311, 312, 313, and 314 may be electrically separated from each other.

The camera device 100A may include a magnet 320. The magnet 320 may be placed on the substrate holder 410. The magnet 320 may be placed at a corner of the substrate holder 410. The magnets 320 may be placed at each of the four corners of the substrate holder 410. The magnet 320 may face the coil 310. The magnet 320 may interact electromagnetically with the coil 310. The magnet 320 can move through electromagnetic interaction with the coil 310. That is, when current is applied to the coil 310, the magnet 320 can move. The magnet 320 may be a flat magnet having a flat plate shape. In this embodiment, the coil 310 is fixed and the magnet 320 can move. However, as a modified example, the arrangement positions of the coil 310 and the magnet 320 may be changed.

The magnet 320 may include a plurality of magnets. The magnet 320 may include four magnets. The magnet 320 may include first to fourth magnets 321, 322, 323, and 324. The first magnet 321 may face the first coil 311. The first magnet 321 may be placed in the first corner 410e of the substrate holder 410. The second magnet 322 may face the second coil 312. The second magnet 322 may be placed at the second corner 410f of the substrate holder 410. The third magnet 323 may face the third coil 313. The third magnet 323 may be placed in the third corner 410g of the substrate holder 410. The fourth magnet 324 may face the fourth coil 314. The fourth magnet 324 may be placed at the fourth corner 410h of the substrate holder 410. Each of the plurality of magnets may be arranged perpendicularly to adjacent magnets and parallel to magnets arranged diagonally.

The polarity of the surface of the first magnet 321 facing the coil 310 may be different between the part close to the first side and the part close to the second side. The polarity of the surface of the second magnet 322 facing the coil 310 may be different between the part close to the third side and the part close to the fourth side. The polarity of the surface of the third magnet 323 facing the coil 310 may be different between the part close to the first side and the part close to the second side. The polarity of the surface of the fourth magnet 324 facing the coil 310 may be different between the part close to the third side and the part close to the fourth side. That is, the first magnet 321 and the third magnet 323 may be arranged in the same direction, and the second magnet 322 and the fourth magnet 324 may be arranged in the same direction. The first magnet 321 may be arranged perpendicular to the second magnet 322. The polarity of the first to fourth magnets 321, 322, 323, and 324 may be the same in their inner portions. The polarity of the first to fourth magnets 321, 322, 323, and 324 may be the same at their outer portions. The polarity of each of the first to fourth magnets 321, 322, 323, and 324 may be formed such that the inner portion is N-pole. The polarity of each of the first to fourth magnets 321, 322, 323, and 324 may be formed such that the outer portion has an S pole. However, as a modified example, the polarity of each of the first to fourth magnets 321, 322, 323, and 324 may be formed such that the inner portion is formed as an S pole and the outer portion is formed as an N pole.

As shown in FIG. 14, in this embodiment, when current in the same direction is applied to the second coil 312 and the fourth coil 314, electromagnetic interaction with the second magnet 322 and the fourth magnet 324 occurs, respectively. Through this action, the image sensor 444 coupled to the substrate holder 410 may be moved (shifted) in the x-axis direction. That is, the second coil 312 and the second magnet 322 and the fourth coil 314 and the fourth magnet 324 can be used to shift the image sensor 444 in the x-axis direction. At this time, the second coil 312 and the second magnet 322 may be the 1st x-axis shift driver (X2), and the fourth coil 314 and the fourth magnet 324 may be the 2x-axis shift driver (X1). .

As shown in FIG. 15, in this embodiment, when current in the same direction is applied to the first coil 311 and the third coil 313, electromagnetic interaction with the first magnet 321 and the third magnet 323, respectively, occurs. Through this action, the image sensor 444 coupled to the substrate holder 410 may be moved (shifted) in the y-axis direction. That is, the first coil 311 and the first magnet 321 and the third coil 313 and the third magnet 323 can be used to shift the image sensor 444 in the y-axis direction. At this time, the first coil 311 and the first magnet 321 may be the first y-axis shift driver (Y1), and the third coil 313 and the third magnet 323 may be the second y-axis shift driver (Y2). .

As shown in FIG. 16, in this embodiment, currents in opposite directions are applied to the first coil 311 and the third coil 313, and currents in opposite directions are applied to the second coil 312 and the fourth coil 314. is applied, and at this time, if the direction in which the magnet 320 is rotated by the current applied to the first coil 311 and the current applied to the second coil 312 is the same, the image sensor 444 coupled to the substrate holder 410 ) can be rotated (rolled) around the z-axis. The embodiment shown in FIG. 17 shows a case where the coil 310 is controlled in 4 channels. If the coil 310 is controlled in 3 channels, the first coil 311 and the third coil 313 or The image sensor 444 can be rolled through the second coil 312 and the fourth coil 314. This is because if there is a coil tied to one channel among the first coil 311, third coil 313, second coil 312, and fourth coil 314, current cannot be applied in the opposite direction.

As shown in (b) of FIG. 17, in this embodiment, a forward current is applied to the first coil 311, and through this, the first coil 311 moves the first magnet 321 in the first direction (see FIG. 17). a) and a forward current is applied to the second coil 312, through which the second coil 312 pushes the second magnet 322 in the second direction (see b in Figure 17) and the third coil A reverse current is applied to 313, through which the third coil 313 pushes the third magnet 323 in the third direction (see c in FIG. 17), and a reverse current is applied to the fourth coil 314. Through this, the fourth coil 314 pushes the fourth magnet 324 in the fourth direction (see d in Figure 17), causing the image sensor 444 coupled to the substrate holder 410 to rotate around the z-axis (see Figure 17). (see e in 17). At this time, the first to fourth directions may correspond to a clockwise direction based on the center of the substrate holder 410.

In this embodiment, the magnetic flow of the magnet 320 is as shown in FIG. 18. Referring to FIG. 18, it can be seen that there is a magnetic force line passing perpendicular to the coil 310, and in this state, when a current is applied to the coil 310, the coil 310 becomes a magnet according to Lorentz Force. You can move about (320).

The camera device 100A may include a substrate holder 410, which is a component of a substrate module. The substrate holder 410 may be arranged to be spaced apart from the holder 110 . The substrate holder 410 is a part that moves together with the magnet 320 when current is applied to the coil 310 and may be a mover. Additionally, the substrate holder 410 may be a sensor PCB holder. The substrate holder 410 may be shifted in the x-axis direction. The substrate holder 410 may be shifted in the y-axis direction. The substrate holder 410 may be rotated about the z-axis (optical axis).

The substrate holder 410 may include a third open area 411. The third open area 411 may be a hollow hole. The third open area 411 may be an opening. Preferably, the third open area 411 includes the fourth open area 121 of the driving substrate 120, the image sensor 444, the first open area 433 of the image sensor substrate 430, and the reinforcement member ( It may be aligned with the second open area 424 of 420 and the optical axis OA.

The substrate holder 410 may include a magnet receiving groove 412. The groove 412 may be formed on the upper surface of the substrate holder 410. The magnet receiving groove 412 may accommodate at least a portion of the magnet 320.

The magnet 320 may be placed in the magnet receiving groove 412 of the substrate holder 410. The magnet receiving groove 412 may be formed in a shape corresponding to the magnet 320. However, the depth of the magnet receiving groove 412 may be smaller than the thickness of the magnet 320 in the corresponding direction. In this case, a portion of the magnet 320 disposed in the magnet receiving groove 412 may protrude from the substrate holder 410. The magnet receiving groove 412 may include a plurality of grooves. The magnet receiving grooves 412 may be formed in a number corresponding to the number of magnets 320 . The magnet receiving groove 412 may include four grooves. However, the magnet receiving groove 412 of the substrate holder 410 may be replaced with a coil receiving groove, and thus a coil may be placed in place of the magnet. At this time, a magnet may be placed on the driving substrate facing the coil placed on the substrate holder 410.

The substrate holder 410 may include a second insertion hole 413 through which a wire passes. The second insertion hole 413 may be formed through the substrate holder 410 in a direction parallel to the optical axis. The wire 510 may be inserted into the second insertion hole 413. The wire 510 may pass through the second insertion hole 413. The second insertion hole 413 may include a plurality of holes. The second insertion hole holes 413 may be formed in a number corresponding to the number of wires 510 . The second insertion hole 413 may include 24 holes. The second insertion hole 413 of the substrate holder 410 may be aligned with the third insertion hole 123 of the driving substrate 120 in a vertical direction. That is, the wire 510 may commonly pass through the third insertion hole 123 of the driving substrate 120 and the second insertion hole 413 of the substrate holder 410.

The substrate holder 410 may include a first protrusion 414 . The first protrusion 414 may be formed on the lower surface of the substrate holder 410. The first protrusion 414 may be inserted into the first hole 421 of the reinforcing member 420 and the hole 431-1 of the image sensor substrate 430. The first protrusion 414 may be formed in a shape corresponding to the first hole 421 of the reinforcing member 420 and the hole 431-1 of the image sensor substrate 430. The first protrusion 414 may include a plurality of protrusions. The first protrusion 414 may include four protrusions. Four protrusions may be formed at each of the four corners of the substrate holder 410.

The substrate holder 410 may include a second protrusion 415 . The second protrusion 415 may be formed on the lower surface of the substrate holder 410. The second protrusion 415 may be spaced apart from the first protrusion 414. The second protrusion 415 may extend from the side of the substrate holder 410 . The lower surface of the second protrusion 415 may be disposed lower than the lower surface of the reinforcement plate 445 of the image sensor module 440. The second protrusion 415 may include a plurality of protrusions. The second protrusion 415 may include four protrusions. Four protrusions may be formed at each of the four corners of the substrate holder 410.

The substrate holder 410 may include a guide protrusion 416. The guide protrusion 416 may be formed on the lower surface of the substrate holder 410. The guide protrusion 416 may guide the assembly position of the image sensor module 440. The guide protrusion 416 may contact the cover 441 of the image sensor module 440. The guide protrusion 416 may contact four sides of the cover 441 of the image sensor module 440.

The substrate holder 410 may include multiple sides. Substrate holder 410 may include four sides. The substrate holder 410 may include first to fourth sides. The substrate holder 410 may include first and second sides disposed on opposite sides of each other, and third and fourth sides disposed on opposite sides between the first side and the second side.

The substrate holder 410 may include corners formed between a plurality of side surfaces. The substrate holder 410 may include a plurality of corners. The substrate holder 410 may include four corners. The substrate holder 410 may include first to fourth corners. The first corner of the substrate holder 410 may be disposed between the first side and the third side. The second corner of the substrate holder 410 may be disposed between the third side and the second side. The third corner of the substrate holder 410 may be disposed between the second side and the fourth side. The fourth corner of the substrate holder 410 may be disposed between the fourth side and the first side. That is, the substrate holder 410 may include four sides and four corners respectively disposed between the four sides. In addition, second insertion holes 413 through which the wire 510 passes may be formed on the four sides, and grooves 412 into which the magnets may be inserted may be formed on the four corners.

The camera device 100A may include a reinforcing member 420. The reinforcing member 420 may be formed of SUS. The reinforcing member 420 may reinforce the image sensor substrate 430. The reinforcing member 420 may be combined with the image sensor substrate 430. The reinforcing member 420 may be bonded to the image sensor substrate 430 using an adhesive. The reinforcing member 420 may be disposed on the lower surface of the substrate holder 410.

The reinforcing member 420 may include a first coupling hole 421. The first coupling hole 421 may be coupled to the first protrusion 414 of the substrate holder 410. The reinforcing member 420 may include a second coupling hole 422. Adhesive may be applied to the second coupling hole 422. The second coupling hole 422 may be formed in a protruding portion of the reinforcing member 420. The second coupling hole 422 may include a plurality of holes. The second coupling holes 422 may be formed in a total of 16, two at each of the four corners of the reinforcing member 420 and two at each of the eight protruding portions.

The reinforcing member 420 may include a protrusion 423. The protrusion 423 may be formed to protrude inward from a corner of the reinforcing member 420. A space in which the first coupling hole 421 is formed can be secured in the reinforcing member 420 through the protrusion 423. A first coupling hole 421 may be formed in the protrusion 423.

The reinforcing member 420 may include a second open area 424. The second open area 424 includes the fourth open area 121 of the driving substrate 120, the image sensor 444, the first open area 433 of the image sensor substrate 430, and the substrate holder 410. may be aligned with the third open area 411 and the optical axis OA.

The camera device 100A may include a substrate 430 for an image sensor. The image sensor substrate 430 may be placed on the lower surface of the substrate holder 410. The image sensor substrate 430 may be combined with the reinforcing member 420. The image sensor substrate 430 may be combined with the image sensor module 440. The image sensor substrate 430 may be an image sensor mounting substrate on which an image sensor is mounted. The image sensor substrate 430 is suspended below the driving substrate 120 by a wire, and can be moved relative to the driving substrate 120 by the coil and magnet.

That is, a substrate holder 410, an image sensor substrate 430, and an image sensor module 440 are disposed under the driving substrate 120.

Here, the structure in which the driving substrate 120, the substrate holder 410, the image sensor substrate 430, and the image sensor module 440 are combined may be referred to as an image sensor actuator.

At this time, the driving substrate 120 and the image sensor substrate 430 are electrically connected to each other by a wire 510. Here, the length of the wire 510 is greater than the sum of the thickness of the driving substrate 120, the thickness of the substrate holder 410, the thickness of the reinforcing member 420, and the thickness of the image sensor substrate 430. You can. Accordingly, the substrate holder 410 disposed below the driving substrate 120 is placed at a certain distance from the driving substrate 120. In addition, the substrate holder 410, the image sensor substrate 430, and the image sensor module 440 may be fixed by a wire 510 at a predetermined distance from the driving substrate 120. That is, the substrate holder 410, the image sensor substrate 430, and the image sensor module 440 are supported by the wire 510 and may be arranged in a flying structure below the driving substrate 120.

The image sensor substrate 430 may include an insulating layer 431. The insulating layer 431 may be coupled to the lower surface of the substrate holder 410. The insulating layer 431 may be coupled to the reinforcing member 420. The insulating layer 431 may be combined with the image sensor module 440. The insulating layer 431 may include a coupling hole 431-1. The coupling hole 431-1 may be coupled to the first protrusion 414 of the substrate holder 410. The insulating layer 431 may include a protrusion 431-2. The protrusion 431-2 may be formed to protrude inward from a corner of the insulating layer 431. A space in which the coupling hole 431-1 is formed can be secured through the protrusion 431-2. A coupling hole 431-1 may be formed in the protrusion 431-2.

Additionally, the insulating layer 431 may include a first open area 433.

Preferably, the first open area 433 includes the fourth open area 121 of the driving substrate 120, the image sensor 444 disposed below, the second open area 424 of the reinforcement member 420, and It may be aligned with the third open area 411 of the substrate holder 410 and the optical axis OA.

The image sensor substrate 430 may include an insulating layer 431 and a first lead pattern portion 432 disposed on the insulating layer 431.

The first lead pattern portion 432 may be electrically connected to a terminal of the image sensor 444. The first lead pattern portion 432 may be composed of multiple pieces. For example, the first lead pattern portion 432 may include a total of 24 terminal portions.

At this time, the first lead pattern portion 432 includes a 1-1 lead pattern portion 432a disposed in the first region of the insulating layer 431 and a second region facing the first region of the insulating layer 431. A 1-2 lead pattern portion 432b disposed in, a 1-3 lead pattern portion 432c disposed in the third region between the first and second regions of the insulating layer 431, and an insulating layer ( It may include 1-4 lead pattern portions 432d disposed in the fourth region facing the third region of 431).

In addition, the 1-1st to 1-4th lead pattern portions 432a, 432b, 432c, and 432d each include a first pattern portion 432-1 disposed on the insulating layer 431, a wire 510, and It may include a second pattern portion 432-2 that is coupled, and a connection portion 432-3 connecting the first pattern portion 432-1 and the second pattern portion 432-2. A hole through which the wire 510 passes may be formed in the second pattern portion 432-2. The second pattern portion 432-2 may be coupled to the wire 510 by soldering. The connection portion 432-3 may include a bent portion. The connection portion 432-3 may be bent multiple times in one direction. The connection portion 432-3 may have elasticity. The first lead pattern portion 432 may have elasticity.

The first pattern portion 432-1 may be electrically connected to the image sensor module. That is, the first pattern portion 432 may be a mounting pad for mounting the image sensor 444 or an image sensor module.

The second pattern portion 432-2 may be a bonding pad electrically connected to the wire 510. That is, the second pattern portion 432-2 may be a soldering pad that is soldered to the wire 510. To this end, the second pattern portion 432-2 may include a first insertion hole through which the wire 510 passes. Additionally, the first insertion hole may be aligned in a vertical direction with a second insertion hole formed in the substrate holder and a third insertion hole formed in the driving substrate.

The connecting portion 432-3 may connect the first pattern portion 432-1 and the second pattern portion 432-2 to each other. To this end, the connection part 432-3 may include a plurality of bent parts. At this time, the connection portions 432-3 of each of the first lead pattern portions 432a, 432b, 432c, and 432d may be bent in the same direction. For example, as shown in FIG. 12B, the connection portion 432-3 of each of the first lead pattern portions 432a, 432b, 432c, and 432d may include a bent portion that rotates clockwise. That is, the connection portion 432-3 may be bent in a direction corresponding to the rotation direction in the z-axis direction of the image sensor module. Accordingly, the connection portion 432-3 can minimize damage applied to the first lead pattern portion 432 when rotating in the z-axis direction, and accordingly, damage generated on the first lead pattern portion 432 It can prevent cracks or separation from the insulating layer. Meanwhile, in an embodiment, an adhesive member (not shown) may be disposed between the insulating layer 431 and the first lead pattern portion 432. An adhesive member may be interposed between the insulating layer 431 and the first lead pattern portion 432 to prevent the first lead pattern portion 432 from being separated from the insulating layer 431 . The adhesive member may include a curing adhesive or the like.

Meanwhile, the first lead pattern portion 432 is a wire that transmits electrical signals, and may be formed of a metal material with high electrical conductivity. To this end, the first lead pattern portion 432 is selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). It may be formed of at least one metallic material. In addition, the first lead pattern portion 432 is made of gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which have excellent bonding strength. It may be formed of a paste or solder paste containing at least one selected metal material.

Preferably, the first lead pattern portion 432 serves as a wire for transmitting electrical signals and moves the image sensor substrate 430 in the X-axis, Y-axis, and Z-axis directions with respect to the driving substrate 120. It can be formed of a metal material with possible elasticity. To this end, the first lead pattern portion 432 may be formed of a metal material having a tensile strength of 1000 MPa or more. For example, the first lead pattern portion 432 may be a binary alloy or ternary alloy containing copper. For example, the first lead pattern portion 432 may be a binary alloy of copper (Cu) and nickel (Ni). For example, the first lead pattern portion 432 may be a binary alloy of copper (Cu) and tin (Sn). For example, the first lead pattern portion 432 may be a binary alloy of copper (Cu) and beryllium (Be). For example, the first lead pattern portion 432 may be a binary alloy of copper (Cu) and cobalt (Co). For example, the first lead pattern portion 432 may be a ternary alloy of copper (Cu), nickel (Ni), and tin (Sn). For example, the first lead pattern portion 432 may be a ternary alloy of copper (Cu)-beryllium (Be)-cobalt (Co). Additionally, in addition to the metal material, the first lead pattern portion 432 may be formed of an alloy such as iron (Fe), nickel (Ni), or zinc, which has elasticity capable of acting as a spring and good electrical properties. Additionally, the first lead pattern portion 432 may be surface treated with a plating layer containing a metal material such as gold (Au), silver (Ag), palladium (Pd), etc., thereby improving electrical conductivity.

Meanwhile, the first lead pattern portion 432 is manufactured using typical printed circuit board manufacturing processes such as additive process, subtractive process, MSAP (Modified Semi Additive Process), and SAP (Semi Additive Process). ) It is possible through engineering methods, etc.

Referring to FIGS. 11B, 11C, and 11D, the image sensor substrate 430 will be described in more detail.

As shown in FIG. 11B, first lead pattern portions 432a, 432b, 432c, and 432d are disposed in each region of the insulating layer 431.

At this time, the arrangement positions of the first lead pattern portions 432a, 432b, 432c, and 432d may not be aligned on the same vertical or horizontal extension line, but may be shifted at regular intervals.

For example, the 1-1 lead pattern portion 432a and the 1-2 lead pattern portion 432b may be respectively disposed on first and second regions of the insulating layer 431 facing each other. The arrangement positions of the 1-1st lead pattern portion 432a and the 1-2nd lead pattern portion 432b may not be aligned on the same horizontal extension line, but may be shifted by a first distance d1. For example, the center (X1) of the 1-1 lead pattern portion disposed on the uppermost side of the 1-1 lead pattern portion 432a is the center -2 It may be spaced apart from the center (X2) of the lead pattern portion by a first distance (d1).

Additionally, the 1-3 lead pattern portion 432c and the 1-4 lead pattern portion 432d may be respectively disposed on third and fourth regions of the insulating layer 431 facing each other. The arrangement positions of the 1-3rd lead pattern portion 432c and the 1-4th lead pattern portion 432d may not be aligned on the same vertical extension line, but may be shifted by a second distance d2. For example, the center (Y1) of the 1-3rd lead pattern part 432c disposed on the leftmost side is the center Y1 of the 1st-3rd lead pattern part 432c disposed on the leftmost side of the 1-4th lead pattern part 432d. -4 It may be spaced apart from the center (Y2) of the lead pattern portion by a second distance (d2).

That is, the first lead pattern portion 432 in the embodiment is disposed in a plurality of regions of the insulating layer 431, and in this case, for ease of rotation about the z-axis, the first lead pattern portion 432 is disposed in one direction from the center of each region. It can be placed in a biased position. For example, the 1-1 lead pattern portion 432a may be disposed deviated from the center of the first region of the insulating layer 431 in the first direction. That is, the 1-1 lead pattern portion 432a may be disposed slanted downward from the first region of the insulating layer 431. For example, the 1-2 lead pattern portion 432b may be disposed deviated from the center of the second area in a second direction opposite to the first direction. That is, the 1-2 lead pattern portion 432b may be disposed shifted upward from the center of the second area. The first-third lead pattern portion 432c may be disposed deviated from the center of the third region of the insulating layer 431 in a third direction. For example, the first-third lead pattern portion 432c may be disposed shifted to the left from the center of the third area. The 1-4th lead pattern portions 432d may be disposed deviated from the center of the fourth region of the insulating layer 431 in a fourth direction opposite to the third direction. For example, the 1-4th lead pattern portion 432d may be arranged shifted to the right from the center of the fourth region.

Meanwhile, the first pattern part 432-1 includes a mounting part 432-11 on which the image sensor 444 or the image sensor module 440 is mounted, and an extension part extending from the mounting part 432-11 ( 432-12) may be included. At this time, the mounting unit 432 - 11 may have a square pad shape so that the image sensor 444 or the image sensor module 440 is stably mounted. The extension part 432-12 may extend from the mounting part 432-11 and be connected to the connection part 432-3.

At this time, the extension portion 432-12 may be bent from the mounting portion 432-11. Accordingly, the center line of the extension portion 432-12 may be spaced apart from the center line of the mounting portion 432-11 by a third distance d3.

Additionally, the extension portion 432-12 may include a buffer pattern portion for a buffering role in the area A connected to the connection portion 432-3. The buffer pattern portion may have a shape whose width gradually decreases in the direction in which the connection portion 432-3 is disposed. That is, the extension portion 432-12 includes a bent portion that is bent and extended from the mounting portion 432-11, and a buffer portion in an area that extends from the bent portion and whose width gradually decreases as the distance from the bent portion increases. It can be included. The buffer unit can solve problems such as pattern breakage caused by the difference in pattern width between the first pattern part 432-1 and the connection part 432-3, and stably connect the connection part 432-3 and the mounting part ( 432-11) can be connected.

Additionally, the buffer portion may not overlap the insulating layer in a vertical direction. Through this, when the substrate is tilted as well as moved in the Pattern breaks caused by negative width differences can be efficiently reduced.

Meanwhile, the center of the second pattern portion 432-2 and the center of the first pattern portion 432-1 may be disposed on the same vertical or horizontal extension line. That is, the center of the second pattern portion 432-2 and the center of the first pattern portion 432-1 may be aligned on the same vertical or horizontal line. To this end, the first pattern portion 432-1 may include an extension part 432-12 bent from the mounting part 432-11. According to this, the terminals of the wire 510 connected to the second pattern portion 432-2 and the image sensor 444 disposed on the first pattern portion 432-1 are aligned on the same vertical or horizontal line. This can improve the accuracy of the moving position of the image sensor 444.

Meanwhile, of the first lead pattern portions 432, the first pattern portion 432-1 is disposed on the insulating layer 431, and the second pattern portion 432-2 and the connection portion 432-3 are insulated from the insulating layer 431. It is a flying lead pattern portion extending horizontally from the layer 431. That is, the first pattern portion 432-1 is disposed at a position that overlaps the insulating layer 431 in the vertical direction. Additionally, the second pattern portion 432-2 and the connection portion 432-3 are disposed at positions that do not overlap the insulating layer 431 in the vertical direction. That is, the insulating layer 431 may be disposed under the first pattern portion 432-1, and the insulating layer 431 may be disposed under the second pattern portion 432-2 and the connection portion 432-3. It may not work.

The manufacturing process for the first lead pattern portion 432 to have a flying structure as described above will be briefly described as follows.

As shown in FIG. 11D, the insulating layer 431, which is the basic material of the image sensor substrate 430, can be prepared. At this time, the insulating layer 431 includes a main insulating part 431a, a dummy insulating part 431b, and a connection insulating part between the main insulating part 431a and the dummy insulating part 431b to form a flying structure pattern. It may include (431c).

That is, when the insulating layer 431 is prepared, the insulating layer 431 is punched or etched to remove the area excluding the dummy insulating portion 431b and the connection insulating portion 431c. The dummy insulating part 431b and the connection insulating part 431c may serve to support a metal layer (not shown) disposed to form the first lead pattern part 432.

When the area excluding the dummy insulating part 431b and the connection insulating part 431c is removed, a metal layer (not shown) is placed on the insulating layer 431. At this time, the metal layer may include a region disposed on the dummy insulating portion 431b, a region disposed on the connection insulating portion 431c, and a region disposed on the main insulating portion 431a. Then, the disposed metal layer may be etched to form the first lead pattern portion 432 so that the first lead pattern portion 432 has a flying structure. At this time, when manufacturing of the first lead pattern portion 432 is completed, dicing is performed between the main insulating portion 431a and the connection insulating portion 431c, and the dummy insulating portion ( 431b) can be separated.

Meanwhile, the camera device 100A may include an image sensor module 440. The image sensor module 440 may be coupled to the substrate holder 410. The image sensor module 440 may be fixed to the substrate holder 410. The image sensor module 440 can be moved integrally with the substrate holder 410. The image sensor module 440 may include a cover 441, a filter 442, a substrate 443, an image sensor 444, and a reinforcement plate 445. However, one or more of the cover 441, filter 442, package substrate 443, image sensor 444, and reinforcement plate 445 of the image sensor module 440 may be omitted.

The image sensor module 440 may include a cover 441. The cover 441 may cover the filter 442 and the image sensor 444. The cover 441 may include a top portion and a side wall portion. Cover 441 may include a hole 441a. The hole 441a may be a hollow hole. The hole 441a may be an opening. The cover 441 may include a protrusion 441b. The protrusion 441b may protrude from the lower surface of the cover 441. The protrusion 441b may be inserted into the second hole 443b of the substrate 4430 and the hole 445a of the reinforcement plate 445.

The image sensor module 440 may include a filter 442. The filter 442 may serve to block light in a specific frequency band from light passing through the lens module 210 from entering the image sensor 444. Filter 442 may be arranged parallel to the x-y plane. The filter 442 may be disposed between the lens module 210 and the image sensor 444. The filter 442 may be disposed between the cover 441 and the package substrate 443. As a modified example, the filter 442 may be placed in the hole 441a of the cover 441. Filter 442 may include an infrared filter. An infrared filter can absorb or reflect infrared rays incident on the infrared filter.

The image sensor module 440 may include a package substrate 443. The package substrate 443 may be a substrate for mounting the image sensor 444 in a package form. The package substrate 443 may include a printed circuit board (PCB). The package substrate 443 may include a circuit board. An image sensor 444 may be disposed on the package substrate 443. The package substrate 443 may be coupled to the image sensor substrate 430. The package substrate 443 may include a first hole 443a of a shape and size corresponding to the image sensor 444. The image sensor 444 may be inserted into the first hole 443a of the package substrate 443. The package substrate 443 may include a second hole 443b. The protrusion 441b of the cover 441 may be inserted into the second hole 443b of the package substrate 443. The package substrate 443 may include a terminal 443c. The terminal 443c of the package substrate 443 may be disposed at each of four side ends on the lower surface of the package substrate 443. The terminal 443c of the package substrate 443 may be connected to the first lead pattern portion 432 of the image sensor substrate 430. More clearly, the terminal 443c of the package substrate 443 may be connected to the first pattern portion 432-1 of the first lead pattern portion 432 of the image sensor substrate 430.

The package substrate 443 may include a groove 443d. The grooves 443d of the package substrate 443 may be formed at each of the four corners of the package substrate 443. The first protrusion 414 of the substrate holder 410 may be avoided by the groove 443d of the package substrate 443.

The image sensor module 440 may include an image sensor 444. The image sensor 444 may be coupled to the substrate holder 410. The image sensor 444 can move integrally with the substrate holder 410. However, the image sensor 444 may not be directly coupled to the substrate holder 410, but the package substrate 443 to which the image sensor 444 is coupled may be coupled to the substrate holder 410. In a variation, the image sensor 444 may be directly coupled to the substrate holder 410. The image sensor 444 may be arranged in alignment with the optical module. The image sensor 444 may be configured to form an image by entering light that has passed through a lens and a filter 442. The image sensor 444 may be mounted on the package substrate 443. The image sensor 444 may be electrically connected to the package substrate 443. For example, the image sensor 444 may be coupled to the package substrate 443 using surface mounting technology (SMT). As another example, the image sensor 444 may be coupled to the substrate 443 using flip chip technology. The image sensor 444 may be arranged so that its optical axis coincides with that of the lens. That is, the optical axis of the image sensor 444 and the optical axis of the lens may be aligned. The image sensor 444 may convert light irradiated to the effective image area of the image sensor 444 into an electrical signal. The image sensor 444 may be one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID.

In this embodiment, the image sensor 444 may be rotated around the x-axis, y-axis, and z-axis. The image sensor 444 may be moved around the x-axis, y-axis, and z-axis. The image sensor 444 may be tilted about the x-axis, y-axis, and z-axis.

The image sensor module 440 may include a reinforcement plate 445. The reinforcement plate 445 may be disposed on the lower surface of the image sensor 444 and the package substrate 443. The reinforcement plate 445 may be formed of SUS. The reinforcement plate 445 can reinforce the image sensor 444 and the package substrate 443. The reinforcement plate 445 may include a hole 445a. The hole 445a may be coupled to the protrusion 441b of the cover 441. The reinforcement plate 445 may include a groove 445b. Grooves 445b may be formed at each of the four corners of the reinforcement plate 445. The groove 445b may be formed by the corners of the reinforcement plate 445 being depressed inward.

Camera device 100A may include a wire 510. The wire 510 may connect the driving substrate 120 and the image sensor substrate 430. The wire 510 may have elasticity. The wire 510 may be an elastic member. Wire 510 may be a wire spring. At this time, the wire 510 is connected to the second lead pattern portion 122 of the driving substrate 120 and the image sensor substrate at a predetermined distance between the driving substrate 120 and the image sensor substrate 430. The first lead pattern portion 432 of 430 may be electrically connected.

The wire 510 may be formed of metal. The wire 510 may be electrically connected to the image sensor 444. The wire 510 may be used as a conductive line of the image sensor 444. One end of the wire 510 may be coupled to the driving substrate 120 and the other end of the wire 510 may be coupled to the first lead pattern portion 432 . The wire 510 may elastically support the movement of the substrate holder 410.

Wire 510 may include a plurality of wires. The plurality of wires may include a number of wires corresponding to the number of terminals of the image sensor 444. The plurality of wires may include a total of 24 wires, 6 wires between adjacent corners of the 4 corners of the substrate holder.

Camera device 100A may include a sensor 520. The sensor 520 may be placed on the upper surface of the driving substrate 120. The sensor 520 may include a Hall sensor (Hall IC). The sensor 520 can detect the magnetic force of the magnet 320. The movement of the image sensor 444 can be detected in real time through the magnetic force of the magnet 320 detected by the sensor 520. Through this, OIS feedback control may be possible.

Sensor 520 may include a plurality of sensors. Sensor 520 may include three sensors. Movement in the x-axis direction, movement in the y-axis direction, and rotation around the z-axis of the image sensor 444 can all be detected through the three sensors. The sensor 520 may include first to third sensors. The first sensor may face the first magnet 321, the second sensor may face the second magnet 322, and the third sensor may face the third magnet 323.

Camera device 100A may include a housing 600. Housing 600 may be combined with holder 110. The housing 600 may provide space inside the housing 600 through combination with the holder 110. The exterior of the camera device 100A may be formed by the housing 600 and the holder 110. The housing 600 can accommodate components such as a coil 310, a magnet 320, etc. therein. The housing 600 may include a shield can.

Housing 600 may include a side wall 610 . Side wall 610 may include a plurality of side walls. Side wall 610 may include four side walls. Housing 600 may include a lower portion 620. The lower part 620 may extend inward from the bottom of the side wall 610. The lower part 620 may include a hole. The lower surface of the housing 600 may be formed by a separate lower plate 630. The lower plate 630 may be understood as one component of the housing 600 or as a separate component. The lower plate 630 may include a groove 631 that is aligned with the protrusion 622 protruding from the lower surface 620 of the housing 600.

The camera device 100A may include a flexible circuit board 150. The flexible circuit board 150 may be electrically connected to the coil 310. The flexible circuit board 150 may include a terminal 150a coupled to the terminal 222 of the MEMS actuator 220. The flexible circuit board 150 may include a hole through which the lens module 210 passes.

Camera device 100A may include a connector 190. The connector 190 may be electrically connected to the flexible circuit board 150. The connector 190 may include a port for electrical connection to an external device.

The camera device 100A may include a motion sensor. The motion sensor may be mounted on the flexible circuit board 150. The motion sensor may be electrically connected to the control unit through a circuit pattern provided on the flexible circuit board 150. The motion sensor may output rotational angular velocity information resulting from the movement of the camera device 100A. The motion sensor may include one or more of a 2-axis gyro sensor, a 3-axis gyro sensor, and an angular velocity sensor.

The camera device 100A may include a control unit. The control unit may be placed on the flexible circuit board 150. The control unit may be electrically connected to the coil 310. The control unit can individually control the direction, intensity, and amplitude of the current supplied to the first to fourth coils 311, 312, 313, and 314. The control unit may control the current applied to the coil 310 and the current applied to the MEMS actuator 220 to perform an autofocus function and/or a shake correction function. Furthermore, the control unit may perform autofocus feedback control and/or image stabilization feedback control.

The camera device 100A according to this embodiment may be for mobile camera application. In other words, it can be distinguished from a camera device for digital camera application. When miniaturizing for mobile camera application, the driving force of the VCM is relatively reduced, so there is a problem that the current consumed to implement the three movements (X-Shift, Y-Shift, Z-Rotation (Roll)) increases. .

The magnet 320 and the coil 310 are rotated 90 degrees at each corner of the substrate holder 410 so that the diagonally positioned magnets 320 and coil 310 can be assembled in the same direction. In this case, when driving the image sensor 444 in a shift, a Lorentz force in the same direction can be generated, and when driving the z-axis rotation, two pairs of rotational forces can be generated in opposite directions.

In this embodiment, the four coils located at the corners require independent current input, so it is possible to have a system that separates the power terminals of the coils 310 and controls them into four channels. That is, this embodiment may include a diagonal arrangement structure of magnets in the same magnetic flux direction and a four-coil individual current input structure.

This embodiment may include two pairs of turning force generating structures (increasing rotational moment). With a structure that generates two pairs of turning forces, it can generate a higher rotation moment than before, and can reduce total current consumption when operating in three modes: X-Shift, Y-Shift, and Z-Rotation (Roll). there is.

The simulation results for the camera device according to this embodiment are as follows. When ‘rotational moment = rotational force It was confirmed that when applied, a rotation moment of {(0.094mN/mA x 50mA) x 12.14mm} x 2 = 114.1 mN.mm is generated.

In this embodiment, hand shake correction for the image sensor 444 and hand shake correction for the corresponding lens may be performed together. For example, when hand shake correction is performed using only the MEMS actuator 220, positive (+) distortion may occur at the edges of the image obtained from the image sensor 444. Meanwhile, when hand shake correction is performed by moving only the image sensor 444, negative distortion may occur at the edges of the image obtained from the image sensor 444. In this embodiment, distortion occurring at the edges of the image can be minimized by performing hand shake correction on the image sensor 444 and hand shake correction on the MEMS actuator 220 together. In this embodiment, the camera shake correction function is performed on the lens side through the MEMS actuator 220, and the image sensor 444 can also be moved to correspond. Through this, it is possible to provide a level of image stabilization equivalent to the module movement method in which the lens and the image sensor 444 move as one unit. However, in this embodiment as well, the MEMS actuator 220 provides only the AF function and may also perform the OIS function by moving the image sensor 444.

Hereinafter, the optical device according to this embodiment will be described with reference to the drawings.

FIG. 19 is a perspective view of an optical device according to this embodiment, and FIG. 20 is a configuration diagram of the optical device shown in FIG. 19.

Optical devices (100B) include mobile phones, mobile phones, smart phones, portable smart devices, digital cameras, laptop computers, digital broadcasting terminals, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), and navigation devices. It can be any one of them. However, the type of optical device 100B is not limited to this, and any device for taking images or photos may be included in the optical device 100B.

The optical device 100B may include a main body 850. The main body 850 may have a bar shape. Alternatively, the main body 850 may have various structures such as a slide type, folder type, swing type, or swirl type in which two or more sub-bodies are coupled to enable relative movement. The main body 850 may include a case (casing, housing, cover) that forms the exterior. For example, the main body 850 may include a front case 851 and a rear case 852. Various electronic components of the optical device 100B may be built into the space formed between the front case 851 and the rear case 852. A display 751 may be placed on one side of the main body 850. A camera 721 may be disposed on one or more of the one side of the main body 850 and the other side disposed opposite to the first side.

The optical device 100B may include a wireless communication unit 710. The wireless communication unit 710 may include one or more modules that enable wireless communication between the optical device 100B and a wireless communication system or between the optical device 100B and the network where the optical device 100B is located. For example, the wireless communication unit 710 includes one or more of a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-range communication module 714, and a location information module 715. can do.

The optical device 100B may include an A/V input unit 720. The A/V (Audio/Video) input unit 720 is for inputting audio signals or video signals and may include one or more of a camera 721 and a microphone 722. At this time, the camera 721 may include the camera device 100A according to this embodiment.

The optical device 100B may include a sensing unit 740. The sensing unit 740 measures the optical device 100B, such as the open/closed state of the optical device 100B, the location of the optical device 100B, the presence or absence of user contact, the orientation of the optical device 100B, and the acceleration/deceleration of the optical device 100B. ) can detect the current state and generate a sensing signal to control the operation of the optical device (100B). For example, if the optical device 100B is in the form of a slide phone, it can sense whether the slide phone is opened or closed. In addition, it may be responsible for sensing functions related to whether the power supply unit 790 supplies power and whether the interface unit 770 is connected to an external device.

The optical device 100B may include an input/output unit 750. The input/output unit 750 may be configured to generate input or output related to vision, hearing, or tactile senses. The input/output unit 750 may generate input data for controlling the operation of the optical device 100B, and may also output information processed by the optical device 100B.

The input/output unit 750 may include one or more of a key pad unit 730, a display 751, an audio output module 752, and a touch screen panel 753. The key pad unit 730 can generate input data through key pad input. The display 751 can output an image captured by the camera 721. The display 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a three-dimensional display. It may include at least one of (3D display). The audio output module 752 outputs audio data received from the wireless communication unit 710 in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or stored in the memory unit 760. Audio data can be output. The touch screen panel 753 can convert the change in capacitance that occurs due to the user's touch to a specific area of the touch screen into an electrical input signal.

The optical device 100B may include a memory unit 760. A program for processing and controlling the control unit 780 may be stored in the memory unit 760. Additionally, the memory unit 760 may store one or more of input/output data, such as phone books, messages, audio, still images, photos, and videos. The memory unit 760 may store images captured by the camera 721, for example, photos or videos.

The optical device 100B may include an interface unit 770. The interface unit 770 serves as a passage connecting an external device connected to the optical device 100B. The interface unit 770 can receive data from an external device, receive power and transmit it to each component inside the optical device 100B, or transmit data inside the optical device 100B to an external device. The interface unit 770 includes a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connecting a device equipped with an identification module, and an audio I/O (Input/Output). It may include one or more of a port, a video I/O (Input/Output) port, and an earphone port.

The optical device 100B may include a control unit 780. The controller 780 can control the overall operation of the optical device 100B. The control unit 780 can perform related control and processing for voice calls, data communications, video calls, etc. The control unit 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be provided within the control unit 180 or may be provided separately from the control unit 780. The control unit 780 can perform pattern recognition processing to recognize handwriting or drawing input on the touch screen as text and images, respectively.

The optical device 100B may include a power supply unit 790. The power supply unit 790 can receive external power or internal power under the control of the control unit 780 and supply power necessary for the operation of each component.

Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical idea or essential features. You will be able to understand it. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

According to an embodiment, in order to implement the OIS and AF functions of the camera module, the image sensor is moved relative to the lens barrel in the X-axis, Y-axis, and Z-axis directions instead of moving the conventional lens barrel. Accordingly, the camera module according to the embodiment can eliminate the complicated spring structure for implementing OIS and AF functions and simplify the structure accordingly. Additionally, by moving the image sensor according to the embodiment relative to the lens barrel, a more stable structure can be formed compared to the existing one.

In addition, according to the embodiment, the terminal portion electrically connected to the image sensor has a spring structure and is arranged to float in a position that does not overlap the insulating layer in a vertical direction. Accordingly, the camera module can move the image sensor relative to the lens barrel while stably and elastically supporting the image sensor.

According to the above-mentioned embodiment, the Hand shake correction can be performed together, and through this, a more improved hand shake correction function can be provided.

Claims (18)

an insulating layer including a first open area; and
A first lead pattern portion disposed on the insulating layer,
The first lead pattern portion,
a first pattern portion disposed on the insulating layer;
a connection portion extending from the first pattern portion and including a bent portion;
A second pattern portion connected to the first pattern portion through the connection portion,
The first pattern portion overlaps the insulating layer in the optical axis direction,
The connection portion does not overlap the insulating layer in the optical axis direction,
The second pattern portion does not overlap the insulating layer in the optical axis direction and includes a hole through which a wire passes, and the first pattern portion includes,
A mounting portion disposed on the insulating layer and on which an image sensor is mounted, and
A substrate for an image sensor, which is disposed on the insulating layer and includes an extension part bent and extended from the mounting part. According to paragraph 1,
The bent portion of the connection part is,
A substrate for an image sensor bent multiple times in one direction between the first pattern portion and the second pattern portion. According to paragraph 1,
The center of the mounting portion of the first pattern portion and the center of the second pattern portion are
Aligned on an extension line extending in a first direction perpendicular to the optical axis direction,
The center of the extension portion of the first pattern portion is,
A substrate for an image sensor, spaced apart from the center of the second pattern portion in a second direction perpendicular to the optical axis direction and the first direction. According to any one of claims 1 to 3,
The first lead pattern portion,
A substrate for an image sensor including a region whose width is reduced and disposed between the extension portion and the connection portion in a region that does not overlap the insulating layer in the optical axis direction. According to paragraph 3,
The first lead pattern portion,
a plurality of first-1 lead pattern portions disposed on a first region of the insulating layer; and
A plurality of first-second lead pattern portions disposed on a second region of the insulating layer facing the first region with the first open region interposed therebetween,
The plurality of first-1 lead pattern units,
It is arranged deviated in one direction from the center of the first area,
The plurality of first-second lead pattern units,
It is disposed in a direction opposite to the one direction in the center of the second area,
A substrate for an image sensor wherein the 1-1 lead pattern portion and the 1-2 lead pattern portion are arranged not to be aligned around the extension line. A substrate for an image sensor according to any one of claims 1 to 3;
an image sensor disposed on the image sensor substrate and connected to the first lead pattern portion;
a driving substrate disposed on the image sensor substrate and including a second lead pattern portion; and
A camera device comprising a wire that has one end connected to the first lead pattern portion, the other end connected to the second lead pattern portion, and elastically supports the image sensor substrate at a position spaced apart from the driving substrate by a predetermined distance. . According to clause 6,
It includes a holder disposed on the image sensor substrate,
The driving substrate includes a coil,
The holder includes a magnet corresponding to the coil,
The image sensor is a camera device that moves relative to the driving substrate based on driving force provided from the coil and the magnet. delete delete delete delete delete delete delete delete delete delete delete

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