KR102450632B1 - Apparatus for treatment of exhaust hydrogen gas in semiconductor device fabrication process - Google Patents

Abstract

The present invention relates to an apparatus for treating exhaust hydrogen in a semiconductor fabrication hydrogen process. The present invention provides the apparatus for treating exhaust hydrogen in a semiconductor fabrication hydrogen process, comprising: a mixing chamber in which exhaust hydrogen and dry air are mixed; an exhaust hydrogen inlet pipe which is connected to the mixing chamber and through which the exhaust hydrogen flows into the mixing chamber; a dry air supply pipe connected to the mixing chamber to supply dry air to the mixing chamber; a first hydrogen treating unit connected to the mixing chamber to lower the hydrogen concentration by catalytically reacting the exhaust hydrogen mixed in the mixing chamber with oxygen in the dry air; a connection duct connected to the first hydrogen treating unit; a second hydrogen treating unit connected to the connection duct to lower the hydrogen concentration by catalytically reacting the mixed gas of the exhaust hydrogen and the dry air primarily treated in the first hydrogen treating unit; an exhaust pipe connected to the second hydrogen treating unit to exhaust the hydrogen-treated gas in the second hydrogen treating unit; and a cooling unit provided in the exhaust pipe to cool the exhaust gas. According to the present invention, the hydrogen used in the semiconductor fabrication process is treated safely and with small heat energy consumption, and the configuration is compact such that the installation space is small.

Description

DEVICE FABRICATION PROCESS

The present invention relates to an exhaust hydrogen treatment device for a semiconductor manufacturing hydrogen process.

During the semiconductor manufacturing process, the annealing process is a process of releasing the physical and chemical stress that a semiconductor wafer has received in various processes such as an etching process and an ion implantation process through heat treatment. By heating the wafer to an appropriate temperature and then slowly cooling it for a sufficient period of time, the physical properties of the original wafer are returned to the most stable state. A mixed gas of nitrogen (N2) and hydrogen (H2) is used in this process. When discharging the mixed gas used in the annealing process, hydrogen gas may be ignited at about 4 to 75%, so it may cause an explosion if discharged directly into the atmosphere. Therefore, it is essential to lower the concentration of hydrogen in the exhaust gas.

Republic of Korea Patent Publication No. 1990-0010909 (published on July 11, 1999) (hereinafter referred to as prior art) discloses a technique for treating an exhaust gas containing hydrogen using a flame. However, the combustion method such as the prior art burns hydrogen at an ultra-high temperature of 1000° C. or more to treat hydrogen, so that the treatment efficiency is good, but there is a problem in that the heat energy consumption is high and the risk generation factor is large.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process, which safely treats hydrogen gas used in a semiconductor manufacturing process with low thermal energy consumption.

Another object of the present invention is to provide an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process that not only allows efficient mixing of exhaust hydrogen and dry air, but also has a compact configuration and thus takes up less installation space.

In order to achieve the object of the present invention, a mixing chamber in which exhaust hydrogen and dry air are mixed; an exhaust hydrogen inlet pipe connected to the mixing chamber through which exhaust hydrogen is introduced into the mixing chamber; a dry air supply pipe connected to the mixing chamber to supply dry air to the mixing chamber; a first hydrotreating unit connected to the mixing chamber to catalytically react the exhaust hydrogen mixed in the mixing chamber with oxygen in the dry air to lower the hydrogen concentration; a connection duct connected to the first hydrotreating unit; a second hydroprocessing unit connected to the connection duct to catalytically react a mixed gas of exhaust hydrogen and dry air treated primarily in the first hydroprocessing unit to lower the hydrogen concentration; an exhaust pipe connected to the second hydroprocessing unit to exhaust the hydrogen-treated gas in the second hydroprocessing unit; There is provided an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process including a cooling unit provided in the exhaust pipe to cool the exhaust gas.

The cooling unit includes an expansion pipe provided at one side of the exhaust pipe, a cooling pipe provided inside the expansion pipe to cool the gas exhausted through the second hydroprocessing unit, and a plurality of cooling fins coupled to the cooling pipe; , a cooling water supply pipe connected to one end of the cooling pipe to supply cooling water, and a cooling water drain pipe connected to the other end of the cooling pipe to drain the cooling water that has passed through the cooling pipe.

Preferably, a branch dry air supply pipe is further provided by connecting one side of the dry air supply pipe and the exhaust pipe to supply a part of the dry air supplied to the dry air supply pipe to the exhaust pipe.

The dry air supply pipe and the branch dry air supply pipe are connected by a tee connector, and it is preferable that a spiral groove for generating a vortex is provided on one inner circumferential surface of the tee connector.

The connecting duct includes a square tube portion provided with a first connector to which the first hydrogen treatment unit is connected and a second connector to which a second hydrogen treatment unit is connected, and a side plate portion covering both sides of the square tube portion, respectively, It is preferable to include a fixing bracket portion respectively provided on the both side plate portion.

It is preferable that a cover network case for covering the connection duct and the first and second hydrogen treatment units is further provided.

The cooling unit includes an expansion pipe provided at one side of the exhaust pipe, a cooling pipe provided inside the expansion pipe to cool the gas exhausted through the second hydroprocessing unit, and a plurality of cooling fins coupled to the cooling pipe; , a branch connection pipe for supplying a part of the dry air to the cooling pipe by connecting one end of the dry air supply pipe and one end of the cooling pipe, and the cooling pipe by connecting the other end of the cooling pipe and one side of the exhaust pipe It may include a dilution exhaust connection pipe for supplying rough air to the exhaust pipe to dilute the gas exhausted through the exhaust pipe.

In the present invention, hydrogen is primarily treated by a catalytic reaction while the mixed gas of exhaust hydrogen and dry air mixed in the mixing chamber passes through the first hydrotreating unit, and the first hydrotreated mixed gas passes through the connecting duct. 2 As it flows into the hydrogen treatment unit and goes through the second hydrogen treatment unit, hydrogen is treated secondarily by a catalytic reaction to minimize the hydrogen concentration in the mixed gas exhaust hydrogen, so hydrogen combustion by flames is excluded and the exhaust hydrogen is reduced by the catalyst. By treating hydrogen, it not only reduces the risk factors, but also reduces the energy consumption for generating a flame.

In addition, in the present invention, the inlet side, which is one side of the first hydrotreating unit, is connected to the mixing chamber, and the outlet side, which is the other side of the first hydroprocessing unit, is connected to one side of the lower surface of the connecting duct, and the second lower surface of the connecting duct is connected to the other side. Since the inlet side, which is one side of the hydroprocessing unit, is connected and the outlet side of the second hydroprocessing unit is connected to the exhaust pipe, the configuration is compact and the installation space is minimized, and the mixed gas is effectively mixed while passing through the mixing chamber and the connecting duct. .

In addition, in the present invention, since the cooling unit includes an expansion pipe, a cooling pipe, a plurality of cooling fins, a cooling water supply pipe, and a cooling water exhaust pipe, the mixed gas exhausted through the exhaust pipe is effectively cooled.

In addition, in the present invention, a spiral groove for generating a vortex is provided on one inner circumferential surface of the tee connector connected to the dry air supply pipe, so a vortex is generated in the flow of dry air supplied to the mixing chamber through the dry air supply pipe and exhausted from the mixing chamber. The mixing of hydrogen and dry air is made efficiently.

1 is a plan view showing an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention;
2 is a front view showing an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention;
3 is a front cross-sectional view showing a portion of first and second hydrogen treatment units constituting an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention;
4 is a front cross-sectional view showing a connection duct constituting an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention;
5 is a front view showing a cover network case constituting an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention;
6 is a front cross-sectional view showing an example of a cooling unit constituting an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention;
7 is a front view showing a part of a dry air supply pipe constituting an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention;
8 is a front view showing another example of a cooling unit constituting an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention.

Hereinafter, an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention will be described with reference to the accompanying drawings.

As shown in FIGS. 1 and 2 , an embodiment of an exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process according to the present invention includes a mixing chamber 10 , an exhaust hydrogen inlet pipe 20 , a dry air supply pipe 30 , 1 includes a hydrogen treatment unit 40 , a connection duct 50 , a second hydrogen treatment unit 60 , an exhaust pipe 70 , and a cooling unit 80 .

In the mixing chamber 10, exhaust hydrogen and dry air are mixed. As an example of the mixing chamber 10, the mixing chamber 10 includes a hexahedral horizontal chamber part 11 and a hexahedral vertical chamber part 12 connected to one upper surface of the horizontal chamber part 11. do. The first and second connectors are provided on the upper surface of the vertical chamber part 12 , and the third connector is provided on one side of the upper surface of the horizontal chamber part 11 . When the horizontal chamber part 11 of the mixing chamber 10 is provided on one side, a mounting bracket 13 in the shape of a giyeok character is provided.

The exhaust hydrogen inlet pipe 20 is connected to the mixing chamber 10 to introduce exhaust hydrogen into the mixing chamber 10 . One end of the exhaust hydrogen inlet pipe 20 is connected to the first connector provided on the upper surface of the mixing chamber 10 .

The dry air supply pipe 30 is connected to the mixing chamber 10 to supply dry air to the mixing chamber 10 . One end of the dry air supply pipe 30 is connected to the second connector provided on the upper surface of the mixing chamber 10 . The dry air supplied to the mixing chamber 10 through the dry air supply pipe 30 is dry air from which foreign substances are removed and contains oxygen.

The first hydrotreating unit 40 is connected to the mixing chamber 10 to catalytically react the exhaust hydrogen mixed in the mixing chamber 10 with oxygen in the dry air to lower the hydrogen concentration. As an example of the first hydrotreating unit 40 , as shown in FIG. 3 , the first hydrotreating unit 40 includes a reaction chamber 41 having an internal space, and a vertical direction inside the reaction chamber 41 . It includes a plurality of catalyst carriers 42 arranged as The catalyst carrier 42 includes a catalyst. The catalyst of the catalyst carrier 42 promotes the reaction so that hydrogen in exhaust hydrogen and oxygen in dry air react with ionization to generate water (water vapor). As an example of the catalyst support 42 , the catalyst support 42 includes a sheet-shaped support and a catalyst metal coated on the support. The catalyst metal may be platinum (Pt), ruthenium (Ru), rhodium (Rh), iridium (Ir), osmium (Os), or the like. Catalytic metals are known techniques. It is preferable that a plurality of catalyst carriers 42 are arranged at regular intervals from each other in the vertical direction inside the reaction chamber 41 . The lower end of the reaction chamber 41 of the first hydrotreating unit 40 is connected to the third connector of the mixing chamber 10 .

The first hydrotreating unit 40 is exhausted by the catalyst carriers 42 while the mixed gas in which exhaust hydrogen and dry air are mixed passes between the catalyst carriers 42 arranged inside the reaction chamber 41 . Hydrogen in the hydrogen reacts with oxygen in the dry air to become water, reducing the hydrogen concentration in the exhaust hydrogen and treating the hydrogen in the exhaust hydrogen first.

The connection duct 50 is connected to the first hydrotreating unit 40 . As an example of the connection duct 50, as shown in FIG. 4, the connection duct 50 has a first connector 1 and a second hydrotreating unit 60 to which the first hydrotreating unit 40 is connected on the lower surface. ) is connected to the square tube portion 51 provided with the second connector 2, the both side plate portion 52 covering both sides of the square tube portion 51, respectively, and the fixed provided on the both side surface plate portion 52, respectively It includes a bracket part (53). The upper end of the reaction chamber 41 of the first hydrotreating unit 40 is connected to the first connector 1 of the connection duct 50 .

The second hydrotreating unit 60 is connected to the connection duct 50 to catalyze the mixed gas of the exhaust hydrogen and dry air, which has been primarily hydrotreated in the first hydroprocessing unit 40 , to lower the hydrogen concentration. As an example of the second hydrotreating unit 60, as shown in FIG. 3, the second hydrotreating unit 60 includes a reaction chamber 61 having an internal space, and a vertical direction inside the reaction chamber 61. It includes a plurality of catalyst carriers 62 arranged as The catalyst carrier 62 includes a catalyst. The catalyst of the catalyst carrier 62 accelerates the reaction so that hydrogen in exhaust hydrogen and oxygen in dry air react with ionization to generate water (water vapor). The catalyst carrier 62 of the second hydrotreating unit 60 is preferably the same as that of the catalyst carrier 42 of the first hydrotreating unit 40 . The upper end of the reaction chamber 61 of the second hydrotreating unit 60 is connected to the second connector 2 of the connection duct 50 .

The second hydrotreating unit 60 is a mixture of exhaust hydrogen and dry air, which has been primarily hydrotreated in the first hydrotreating unit 40, between the catalyst carriers 62 provided in the reaction chamber 61. As it passes, hydrogen of exhaust hydrogen reacts with oxygen of dry air by the catalyst carriers 62 to become water, and hydrogen in exhaust hydrogen is treated secondary to minimize the hydrogen concentration of exhaust hydrogen.

As shown in FIG. 5 , it is preferable that a cover network case 90 covering the connection duct 50 and the first and second hydrogen treatment units 40 and 60 is further provided. The cover mesh case 90 is preferably formed in a square tube shape. The connection duct 50 and the first and second hydrogen treatment units 40 and 60 are located inside the cover mesh case 90 , and the upper end of the cover mesh case 90 is fixed to the side of the connection duct 50 . . In the cover mesh case 90, the heat generated while covering the connection duct 50 and the first and second hydrogen treatment units 40 and 60 is radiated to the outside through the holes.

The exhaust pipe 70 is connected to the second hydroprocessing unit 60 to exhaust the hydrogen-treated gas in the second hydroprocessing unit 60 . One side of the exhaust pipe 70 is connected to the lower end of the reaction chamber 41 of the second hydrogen treatment unit 60 .

The cooling unit 80 is provided in the exhaust pipe 70 to cool the exhaust gas exhausted through the exhaust pipe 70 .

As a first embodiment of the cooling unit 80 , as shown in FIG. 6 , the cooling unit 80 has an expanded pipe 71 provided on one side of the exhaust pipe 70 , and is provided inside the expanded pipe 71 . A cooling pipe 81 for cooling the gas exhausted through the second hydroprocessing unit 60 , a plurality of cooling fins 82 coupled to the cooling pipe 81 , and one of the cooling pipes 81 . A cooling water supply pipe 83 connected to the end to supply cooling water to the cooling pipe 81, and a cooling water drain pipe 84 connected to the other end of the cooling pipe 81 through which the cooling water passing through the cooling pipe 81 is drained. include The cooling water supply pipe 83 and the cooling water drain pipe 84 are respectively connected to a cooling water supply unit (not shown), and a pumping unit (not shown) is provided in the cooling water supply pipe. The cooling water supply unit cools the cooling water flowing in through the cooling water drain pipe 84 and supplies it to the cooling water supply pipe 83 . The cooling pipe 81 includes a bent part 3, and both ends of the cooling pipe 81 are exposed to the outside through the expansion pipe 71, respectively, and are connected to the cooling water supply pipe 83 and the cooling water drain pipe 84, respectively. . As an example of the cooling fin 82 , the cooling fin 82 includes a rectangular-shaped thin plate part 4 , a bent part 5 in which a middle portion of the thin plate part 4 is bent in the longitudinal direction, and a thin plate part 4 . It is provided in the cooling pipe 81 includes a plurality of coupling holes (6) to be coupled through. A plurality of bent portions 5 may be provided in the longitudinal direction of the thin plate portion 4 . The cooling fin 82 is preferably provided with a plurality of embossing protrusions that are pressed in a semicircular shape to increase the heat exchange area.

In the first embodiment of the cooling unit 80 , the cooling water cools the cooling pipe 81 and the cooling fin 82 while flowing through the cooling pipe 81 , and the exhaust gas flows through the expansion pipe 71 while flowing through the cooling pipe. It is cooled while exchanging heat by the 81 and the cooling fins 82 .

A branch dry air supply pipe (31) that connects one side of the dry air supply pipe (30) and the exhaust pipe (70) to supply a part of the dry air supplied to the dry air supply pipe (30) to the exhaust pipe (70) is further provided. desirable. One end of the branch dry air supply pipe 30 has an exhaust pipe 70 adjacent to the cooling unit 80 so that the exhaust gas is diluted with dry air before the exhaust gas flows into the cooling unit 80 and introduced into the cooling unit 80 . ) is connected to A condensed water discharge pipe 72 through which condensed water is discharged is connected to the exhaust pipe 70 so as to be positioned between the cooling unit 80 and the end of the exhaust pipe 70 .

The dry air supply pipe 30 and the branch dry air supply pipe 31 are connected by a tee-shaped connection pipe 32 . 7, one side of the dry air supply pipe 30 connected to the mixing chamber 10 is connected to one port 7 of the straight part of the tee connector 32, and the other port 8 of the straight part. The branch dry air supply pipe 31 is connected to the tee, and the dry air supply pipe 30 connected to the dry air supply unit is connected to the port 9 located in the middle of the straight part of the tee connection pipe 31 . It is preferable that a spiral groove (not shown) for generating a vortex is provided on one inner circumferential surface of the tee connector 31 . The spiral groove is provided on the inner circumferential surface of the port 9 located in the middle of the straight portion of the tee connector 31 .

As a second embodiment of the cooling unit 80 , as shown in FIG. 8 , the cooling unit 80 includes an expanded pipe 71 provided on one side of the exhaust pipe 70 , and provided inside the expanded pipe 71 . A cooling pipe 81 for cooling the gas exhausted through the second hydrogen treatment unit 60 , a plurality of cooling fins 82 coupled to the cooling pipe 81 , and the dry air supply pipe 30 . A branch connection pipe 33 for supplying a part of the dry air to the cooling pipe 81 by connecting one end of the cooling pipe 81 with one end thereof, the other end of the cooling pipe 81 and one side of the exhaust pipe 70 . and a dilution exhaust connection pipe 34 for diluting the gas exhausted through the exhaust pipe 70 by supplying air that has passed through the cooling pipe 81 to the exhaust pipe 70 by connecting the . The cooling pipe 81 and the cooling fins 82 have the same configuration as the cooling pipe 81 and the cooling fins 82 of the first embodiment of the cooling unit 80 described above.

The dry air supply pipe 30 and the branch connection pipe 33 are connected by a tee connection pipe 32 (refer to FIG. 7). One side of the dry air supply pipe 30 connected to the mixing chamber 10 is connected to one port 7 of the straight part of the tee connector 32, and the branch connector 33 is connected to the other port 8 of the straight part. The dry air supply pipe 30 connected to the dry air supply unit (not shown) is connected to the port 9 located in the middle of the straight part of the tee connector 32 . It is preferable that a spiral groove (not shown) for generating a vortex is provided on one inner circumferential surface of the tee connector 32 . The spiral groove is provided on the inner circumferential surface of the port 9 located in the middle of the straight portion of the tee connector 32 .

One end of the dilution exhaust connection pipe 34 is connected to the exhaust pipe 70 so as to be located between the ends of the cooling unit 80 and the exhaust pipe 70 so that the exhaust gas that has passed through the cooling unit 80 is diluted with dry air and exhausted. do.

In the second embodiment of the cooling unit 80, the dry air supplied to the branch connection pipe 33 flows through the cooling pipe 81 while cooling the cooling pipe 81 and the cooling fins 82, and at the same time, exhaust gas is discharged. While flowing through the expansion pipe 71, it is cooled while heat-exchanged by the cooling pipe 81 and the cooling fins 82.

Hereinafter, the operation and effect of the stand-type air conditioner according to the present invention will be described.

Exhaust hydrogen generated after the hydrogen process for stabilizing the wafer during the semiconductor manufacturing process is introduced through the exhaust hydrogen inlet pipe 20 and is supplied to the mixing chamber 10 . In addition, clean dry air is supplied to the mixing chamber 10 through the dry air supply pipe 30 . Exhaust hydrogen and dry air supplied to the mixing chamber 10 are mixed in the mixing chamber 10, and the mixed gas passes through the first hydrotreating unit 40. Hydrogen of exhaust hydrogen and oxygen of dry air are catalyst It reacts to generate water (steam) while primarily reducing the hydrogen concentration of exhaust hydrogen. The primary hydrotreated mixed gas passing through the first hydrotreating unit 40 is introduced into the second hydrotreating unit 60 through the connection duct 50 . As the primary hydrotreated mixed gas passes through the second hydrotreating unit 60, the hydrogen of the exhaust hydrogen and the oxygen of the dry air catalytically react to generate water (water vapor), while the hydrogen in the exhaust hydrogen is treated secondarily to produce exhaust hydrogen to minimize the hydrogen concentration of The mixed gas in which the hydrogen concentration of exhaust hydrogen is minimized while passing through the second hydrogen treatment unit 60 flows through the exhaust pipe 70 and is cooled through the cooling unit 80 through the exhaust pipe 70 in a state where the temperature is lowered. exhausted to the outside On the other hand, when the branch dry air supply pipe 31 is provided, a part of the dry air supplied to the dry air supply pipe 30 is supplied to the exhaust pipe 70 through the branch drying supply pipe 31 and exhausted through the exhaust pipe 70 . It is mixed with the mixed gas to dilute the minimized hydrogen in the mixed gas and exhausted.

As described above, in the present invention, hydrogen is primarily treated by a catalytic reaction while the mixed gas of exhaust hydrogen and dry air mixed in the mixing chamber 10 passes through the first hydrotreating unit 40, and the primary hydrotreated The mixed gas flows through the connection duct 50 into the second hydrotreating unit 60, passes through the second hydrotreating unit 60, and the hydrogen is treated secondarily by a catalytic reaction, so that the hydrogen concentration of the mixed gas exhaust hydrogen Since hydrogen combustion by flame is excluded and the hydrogen of exhaust hydrogen is treated by a catalyst, not only the risk factors are reduced, but also the energy consumption for generating the flame is reduced.

In addition, in the present invention, one inlet side of the first hydrotreating unit 40 is connected to the mixing chamber 10 , and the outlet side, which is the other side of the first hydrotreating unit 40 , is one lower surface of the connection duct 50 . and the inlet side, which is one side of the second hydroprocessing unit 60, is connected to the other side of the lower surface of the connection duct 50, and the outlet side of the second hydroprocessing unit 60 is connected to the exhaust pipe 70, so the configuration is As it becomes compact, the installation space is minimized, and the mixed gas is effectively mixed while passing through the mixing chamber 10 and the connecting duct 50 .

In addition, in the present invention, since the cooling unit 80 includes an expansion pipe 71 , a cooling pipe 81 , a plurality of cooling fins 82 , a cooling water supply pipe 83 , and a cooling water drain pipe 84 , the exhaust pipe 70 . It effectively cools the mixed gas exhausted through the

In addition, the present invention is provided with a spiral groove for generating a vortex on one inner circumferential surface of the tee connection pipe 32 connected to the dry air supply pipe 30, so that the drying supplied to the mixing chamber 10 through the dry air supply pipe 30 is provided. By generating a vortex in the flow of air, the mixing of exhaust hydrogen and dry air in the mixing chamber 10 is performed efficiently.

10; mixing chamber 20; exhaust hydrogen inlet pipe
30; dry air supply pipe 40; first hydrotreating unit
50; connecting duct 60; 2nd hydrogen treatment unit
70; exhaust pipe 80; cooling unit

Claims (7)

a mixing chamber in which exhaust hydrogen and dry air are mixed;
an exhaust hydrogen inlet pipe connected to the mixing chamber through which exhaust hydrogen is introduced into the mixing chamber;
a dry air supply pipe connected to the mixing chamber to supply dry air to the mixing chamber;
a first hydrotreating unit connected to the mixing chamber to catalytically react the exhaust hydrogen mixed in the mixing chamber with oxygen in the dry air to lower the hydrogen concentration;
a connection duct connected to the first hydrotreating unit;
a second hydroprocessing unit connected to the connection duct to catalytically react a mixed gas of exhaust hydrogen and dry air treated primarily in the first hydroprocessing unit to lower the hydrogen concentration;
an exhaust pipe connected to the second hydroprocessing unit to exhaust the hydrogen-treated gas in the second hydroprocessing unit;
a branch dry air supply pipe connecting one side of the dry air supply pipe and the exhaust pipe to supply a part of the dry air supplied to the dry air supply pipe to the exhaust pipe; and
and a cooling unit provided in the exhaust pipe to cool the exhaust gas,
The cooling unit includes an expansion pipe provided at one side of the exhaust pipe, a cooling pipe provided inside the expansion pipe to cool the gas exhausted through the second hydroprocessing unit, and a plurality of cooling fins coupled to the cooling pipe; , Exhaust hydrogen treatment apparatus of a semiconductor manufacturing hydrogen process comprising a cooling water supply pipe connected to one end of the cooling pipe to supply cooling water, and a cooling water drain pipe connected to the other end of the cooling pipe to drain the cooling water that has passed through the cooling pipe . delete delete According to claim 1, wherein the dry air supply pipe and the branch dry air supply pipe are connected by a tee-shaped connection pipe, and a spiral groove for generating a vortex is provided on one inner circumferential surface of the tee-shaped connection pipe. Exhaust of the hydrogen process for manufacturing semiconductors Hydrogen treatment unit. According to claim 1, wherein the connection duct is a square tube portion provided with a first connector to which the first hydroprocessing unit is connected and a second connector to which the second hydrotreating unit is connected, both sides of the square tube portion, respectively An exhaust hydrogen treatment apparatus for a semiconductor manufacturing hydrogen process, comprising: both side plate parts to be covered; and fixing bracket parts respectively provided on the both side plate parts. The apparatus of claim 1, further comprising a cover network case covering the connection duct and the first and second hydrogen treatment units. a mixing chamber in which exhaust hydrogen and dry air are mixed;
an exhaust hydrogen inlet pipe connected to the mixing chamber through which exhaust hydrogen is introduced into the mixing chamber;
a dry air supply pipe connected to the mixing chamber to supply dry air to the mixing chamber;
a first hydrotreating unit connected to the mixing chamber to catalytically react the exhaust hydrogen mixed in the mixing chamber with oxygen in the dry air to lower the hydrogen concentration;
a connection duct connected to the first hydrotreating unit;
a second hydroprocessing unit connected to the connection duct to catalytically react a mixed gas of exhaust hydrogen and dry air treated primarily in the first hydroprocessing unit to lower the hydrogen concentration;
an exhaust pipe connected to the second hydroprocessing unit to exhaust the hydrogen-treated gas in the second hydroprocessing unit; and
and a cooling unit provided in the exhaust pipe to cool the exhaust gas,
The cooling unit includes an expansion pipe provided at one side of the exhaust pipe, a cooling pipe provided inside the expansion pipe to cool the gas exhausted through the second hydroprocessing unit, and a plurality of cooling fins coupled to the cooling pipe; , a branch connection pipe for supplying a part of the dry air to the cooling pipe by connecting one end of the dry air supply pipe and one end of the cooling pipe, and the cooling pipe by connecting the other end of the cooling pipe and one side of the exhaust pipe An exhaust hydrogen treatment device for a semiconductor manufacturing hydrogen process comprising a dilution exhaust connection pipe for supplying rough air to the exhaust pipe to dilute the gas exhausted through the exhaust pipe.

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