KR102414772B1 - A module including an antenna and a radio frequency device and base station including the module - Google Patents

Abstract

The present disclosure relates to a communication technique that converges a 5G communication system for supporting a higher data rate after a 4G system with IoT technology, and a system thereof. The present disclosure provides intelligent services (eg, smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail business, security and safety related services, etc.) based on 5G communication technology and IoT-related technology. ) can be applied to The antenna module according to the present invention includes a first substrate layer on which at least one substrate is stacked, an antenna coupled to an upper surface of the first substrate layer, an upper surface coupled to a lower surface of the first substrate layer, and at least one It may include a second substrate layer on which the substrate is stacked, and a radio frequency (RF) device coupled to a lower surface of the second substrate layer.

Description

A module including an antenna and an RF element, and a base station including the same

The present invention relates to a structure of a module that can be mounted in a base station and a mobile device, including an antenna and an RF element.

Efforts are being made to develop an improved 5G communication system or pre-5G communication system in order to meet the increasing demand for wireless data traffic after commercialization of the 4G communication system. For this reason, the 5G communication system or the pre-5G communication system is called a system after the 4G network (Beyond 4G Network) communication system or the LTE system after (Post LTE). In order to achieve a high data rate, the 5G communication system is being considered for implementation in a very high frequency (mmWave) band (eg, a 28 gigabyte (28 GHz) band). In order to alleviate the path loss of radio waves and increase the propagation distance of radio waves in the ultra-high frequency band, in the 5G communication system, beamforming, massive MIMO, and Full Dimensional MIMO (FD-MIMO) are used. ), array antenna, analog beam-forming, and large scale antenna technologies are being discussed. In addition, for network improvement of the system, in the 5G communication system, an evolved small cell, an advanced small cell, a cloud radio access network (cloud RAN), and an ultra-dense network (ultra-dense network) , Device to Device communication (D2D), wireless backhaul, moving network, cooperative communication, Coordinated Multi-Points (CoMP), and interference cancellation Technology development is underway. In addition, in the 5G system, advanced coding modulation (ACM) methods such as FQAM (Hybrid FSK and QAM Modulation) and SWSC (Sliding Window Superposition Coding), and advanced access technologies such as Filter Bank Multi Carrier (FBMC), NOMA (non orthogonal multiple access), and sparse code multiple access (SCMA) are being developed.

On the other hand, the Internet is evolving from a human-centered connection network where humans create and consume information to an Internet of Things (IoT) network that exchanges and processes information between distributed components such as objects. Internet of Everything (IoE) technology, which combines big data processing technology through connection with cloud servers, etc. with IoT technology, is also emerging. In order to implement IoT, technology elements such as sensing technology, wired and wireless communication and network infrastructure, service interface technology, and security technology are required. , M2M), and MTC (Machine Type Communication) are being studied. In the IoT environment, an intelligent IT (Internet Technology) service that collects and analyzes data generated from connected objects and creates new values in human life can be provided. IoT is a field of smart home, smart building, smart city, smart car or connected car, smart grid, health care, smart home appliance, advanced medical service, etc. can be applied to

Accordingly, various attempts are being made to apply the 5G communication system to the IoT network. For example, technologies such as sensor network, machine to machine (M2M), and MTC (Machine Type Communication) are implemented by 5G communication technologies such as beamforming, MIMO, and array antenna. will be. The application of cloud radio access network (cloud RAN) as the big data processing technology described above can be said to be an example of convergence of 5G technology and IoT technology.

A base station applied to the 5G communication system as described above is equipped with a plurality of antennas and RF elements. The antenna and the RF element may be coupled to a substrate, and circuit wirings for connecting the antenna, the RF element, and other circuit components may be formed inside the substrate.

That is, the number of required substrates varies depending on how the antenna, the RF element, and the substrate are combined and configured, and circuit stability of the antenna module may be determined based on this.

Accordingly, the present invention provides an apparatus capable of miniaturizing an antenna module by minimizing the use of a substrate while improving circuit stability of the antenna module.

An antenna module according to the present invention includes a first substrate layer on which at least one substrate is stacked, an antenna coupled to an upper surface of the first substrate layer, an upper surface coupled to a lower surface of the first substrate layer, and at least one It may include a second substrate layer on which the substrate is stacked, and a radio frequency (RF) device coupled to a lower surface of the second substrate layer.

The antenna may be a patch antenna.

The antenna module may further include at least one capacitor coupled to a lower surface of the second substrate layer.

The antenna module may further include a first cover coupled to a lower surface of the first substrate layer to surround the second substrate layer and the RF device.

The first cover may include a shield can, and the first cover and the first substrate layer may be coupled through a shield can clip.

The RF element and the first cover may be coupled through a thermal interface material (TIM).

The antenna module may further include a heat sink coupled to a lower surface of the first substrate layer and a lower surface of the first cover to absorb heat emitted from the first substrate layer and the first cover.

A grid array may be formed on a lower surface of the first substrate layer, and the first substrate layer and the second substrate layer may be electrically connected through the grid array.

The antenna module may further include a second cover surrounding the antenna on an upper surface of the first substrate layer.

In the base station including the packaged module according to the present invention, the packaged module includes a first substrate layer on which at least one substrate is stacked, an antenna coupled to an upper surface of the first substrate layer, and an upper surface of the first substrate layer. It may include a second substrate layer coupled to the lower surface of the first substrate layer, on which at least one substrate is stacked, and a radio frequency (RF) device coupled to the lower surface of the second substrate layer.

The antenna may be a patch antenna.

The base station may further include at least one capacitor coupled to a lower surface of the second substrate layer.

The base station may further include a first cover coupled to the lower surface of the first substrate layer to surround the second substrate layer and the RF device.

The first cover may include a shield can, and the first cover and the first substrate layer may be coupled through a shield can clip.

The RF element and the first cover may be coupled through a thermal interface material (TIM).

The base station may further include a heat sink coupled to a lower surface of the first substrate layer and a lower surface of the first cover to absorb heat emitted from the first substrate layer and the first cover.

A grid array may be formed on a lower surface of the first substrate layer, and the first substrate layer and the second substrate layer may be electrically connected through the grid array.

The base station may further include a second cover surrounding the antenna on an upper surface of the first substrate layer.

According to one embodiment disclosed in the present invention, the number of substrates constituting the antenna module may be reduced, and thus advantages may occur in terms of miniaturization and price competitiveness of the antenna module.

In addition, the antenna module structure according to the present invention can be more advantageous in terms of mass productivity and reliability because the probability of a failure in progress due to a force transmitted in only one direction is reduced compared to the conventional antenna module structure.

In addition, since heat generated from elements constituting the antenna module can be effectively discharged to the outside, durability of the antenna module can be improved.

1 is a diagram illustrating an embodiment of a packaged module mounted on a base station.
2 is a diagram showing the configuration of an antenna module according to the present invention.
3 is a view showing the internal configuration of the antenna module substrate layer according to the present invention.

In describing the embodiments, descriptions of technical contents that are well known in the technical field to which the present invention pertains and are not directly related to the present invention will be omitted. This is to more clearly convey the gist of the present invention without obscuring the gist of the present invention by omitting unnecessary description.

For the same reason, some components are exaggerated, omitted, or schematically illustrated in the accompanying drawings. In addition, the size of each component does not fully reflect the actual size. In each figure, the same or corresponding elements are assigned the same reference numerals.

Advantages and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

At this time, it will be understood that each block of the flowchart diagrams and combinations of the flowchart diagrams may be performed by computer program instructions. These computer program instructions may be embodied in a processor of a general purpose computer, special purpose computer, or other programmable data processing equipment, such that the instructions performed by the processor of the computer or other programmable data processing equipment are not described in the flowchart block(s). It creates a means to perform functions. These computer program instructions may also be stored in a computer-usable or computer-readable memory that may direct a computer or other programmable data processing equipment to implement a function in a particular manner, and thus the computer-usable or computer-readable memory. It is also possible that the instructions stored in the flow chart block(s) produce an article of manufacture containing instruction means for performing the function described in the flowchart block(s). The computer program instructions may also be mounted on a computer or other programmable data processing equipment, such that a series of operational steps are performed on the computer or other programmable data processing equipment to create a computer-executed process to create a computer or other programmable data processing equipment. It is also possible that instructions for performing the processing equipment provide steps for performing the functions described in the flowchart block(s).

Additionally, each block may represent a module, segment, or portion of code that includes one or more executable instructions for executing specified logical function(s). It should also be noted that in some alternative implementations it is also possible for the functions recited in blocks to occur out of order. For example, two blocks shown one after another may be performed substantially simultaneously, or the blocks may sometimes be performed in the reverse order according to a corresponding function.

At this time, the term '~ unit' used in this embodiment means software or hardware components such as FPGA or ASIC, and '~ unit' performs certain roles. However, '-part' is not limited to software or hardware. '~' may be configured to reside on an addressable storage medium or may be configured to refresh one or more processors. Accordingly, as an example, '~' indicates components such as software components, object-oriented software components, class components, and task components, and processes, functions, properties, and procedures. , subroutines, segments of program code, drivers, firmware, microcode, circuitry, data, databases, data structures, tables, arrays, and variables. A function provided in components '~units' may be combined into a smaller number of components and '~units' or may be further divided into additional components and '~units'. In addition, components and '~ units' may be implemented to play one or more CPUs in a device or secure multimedia card. Also, in an embodiment, '~ unit' may include one or more processors.

1 is a diagram illustrating an embodiment of a packaged module mounted on a base station.

The base station according to the present invention may be equipped with the packaged module 100 shown in FIG. 1 .

Specifically, the base station according to the present invention may include a plurality of antenna modules (110). As an example, FIG. 1 discloses a packaged module 100 including 64 antenna modules 110 .

In addition, the antenna module 110 may include a connector for providing power to the antenna module 110 and a DC/DC converter for converting a voltage of the power source. In addition, the packaged module 100 according to the present invention may include a field programmable gate array (FPGA).

The FPGA is a semiconductor device including a designable logic device and a programmable inner line. The above enabled logic elements can be programmed by duplicating logic gates such as AND, OR, XOR, NOT, and more complex decoder functions. In addition, the FPGA may further include a flip-flop or memory.

The antenna module 110 may include a plurality of low dropout (LDO) regulators as shown in FIG. 1 . The LDO regulator has an output voltage lower than an input voltage and a high efficiency regulator when a voltage difference between the input voltage and the output voltage is small, and may remove noise from the input power. In addition, the LDO regulator has a low output impedance, and by locating a dominant pole in the circuit, it can also function to stabilize the circuit.

1 discloses only a form in which 64 antenna modules 110 are mounted on one packaged module 100 as an embodiment according to the present invention, but an antenna module mounted on one packaged module 100 . The number of can be changed. Therefore, the scope of the present invention should not be determined based on the number of antenna modules disclosed in FIG. 1 .

In addition, since DC/DC FPGA, LDO, etc. constituting the packaged module 100 in addition to the antenna module 110 can be added or deleted as needed, the scope of the present invention should not be limited by the above configurations. will be

2 is a diagram showing the configuration of an antenna module according to the present invention.

The antenna module according to the present invention includes a first substrate layer 200 on which at least one substrate is stacked, an antenna 220 coupled to an upper surface of the first substrate layer, and an upper surface of the first substrate layer 200 . may include a second substrate layer 240 on which at least one substrate is laminated, and a radio frequency (RF) device 260 coupled to the lower surface of the second substrate layer 240 . have.

The first substrate layer 200 and the second substrate layer 240 refer to a substrate on which a circuit is formed, and in general, a printed circuit board (PCB) substrate and a printed wiring board (PWB) may be included therein. The first substrate layer 200 and the second substrate layer 240 may form a circuit for connecting each circuit component on the surface or inside of a substrate based on a designed circuit.

The first substrate layer 200 to which the antenna 220 is coupled may be the main board of the antenna module according to the present invention. As shown in FIG. 1 , the antenna 220 and other circuit components (for example, LDO, DC/DC, etc. may be included therein) are electrically connected through the wiring formed on the first substrate layer 200 . can be conducted to

The first substrate layer 200 may be configured by stacking at least one substrate, and the first substrate layer 200 according to the present invention may constitute only circuit wiring for connecting the antenna and each circuit component, The second substrate layer 240 may constitute only circuit wiring for connecting the RF element and each circuit component.

Therefore, according to the present invention, the number of substrates constituting the first substrate layer 200 can be reduced compared to the prior art, thereby reducing the thickness and material cost of the first substrate layer, and circuit wiring inside the first substrate layer It becomes simpler and the loss due to the internal resistance of the substrate can be reduced.

A plurality of antennas 220 may be disposed on the first substrate layer 200 according to the present invention. For example, as shown in FIG. 1 , four antennas 220 are spaced apart from each other at regular intervals to form the first substrate layer. It may be disposed on the top surface of 200 .

According to the present invention, the antenna 220 may be configured as a patch antenna. The patch antenna can be formed by a method of forming a specific metal shape on the circuit board. According to the present invention, the antenna 220 is configured by forming a metal shape on the upper surface of the first substrate layer 200 . can do.

The second substrate layer 240 is a substrate layer for circuit wiring between the RF device 260 and other circuit components as described above. The second substrate layer 240 may also be configured by stacking a plurality of substrates like the first substrate layer 200 . However, since the second substrate layer 240 does not correspond to the main board, the number of substrates stacked on the second substrate layer 240 may be less than the number of substrates stacked on the first substrate layer 200 .

The upper surface of the second substrate layer 240 may be coupled to the lower surface of the first substrate layer 200 in various ways. In FIG. 1 , a sealing ring 245 is attached to the second substrate layer 240 . Disclosed is a method of bonding the first substrate layer 200 and the second substrate layer 240 by disposing at both side ends of the .

Meanwhile, in order to electrically connect the antenna 220 or other circuit components to the RF element 260 , the first substrate layer 200 and the second substrate layer 240 must be electrically connected. Therefore, in the present invention, a grid array is formed on the lower surface of the first substrate layer 200 so that the first substrate layer 200 and the second substrate layer 240 can be electrically connected through the grid array. .

The grid array may include a Land Grid Array (LGA) and a Ball Grid Array (BGA). LGA is a method in which chip electrodes are arranged in an array form on the lower surface of the substrate, and since the inductance of the leads is small, it is suitable for modules that require high processing speed. On the other hand, BGA is a method that arranges solder on the bottom surface of the board in an array form and is suitable for a module that requires a large number of pins.

The grid array should not be formed by biasing only a portion of the lower surface of the first substrate layer 200 . When heat is generated in the antenna module, force may be applied to the first substrate layer 200 and the second substrate layer 240 in relative directions.

In this case, if the grid array is not uniformly distributed, the grid array may be damaged by the force, which may break the electrical connection between the first substrate layer 200 and the second substrate layer 240 . .

Accordingly, in order to prevent such loss in advance, a grid array can be uniformly formed on the lower surface of the first substrate layer 200 , and in FIG. 2 , as an example, the first substrate layer 200 and the second substrate layer 240 are A case in which the grid array is uniformly formed at both ends of the contacting surfaces is shown.

A plurality of capacitors 250 may be included on the lower surface of the second substrate layer 240 as shown in FIG. 1 . Through the capacitor 250 , noise generated in the internal circuit of the second substrate layer may be removed and circuit stability may be secured.

Since the capacitor 250 is also disposed on the substrate layer like the antenna 220 described above, the capacitor 250 may be configured as a SMD (Surface Mount Device) type capacitor.

On the other hand, in the case of the present invention, as shown in FIG. 2 , a first cover ( 280) may be further included.

The first cover 280 may be configured as a shield can. That is, it is possible to shield electromagnetic waves generated from the second substrate layer 240 and the RF element 260 existing inside the first cover, and to remove noise generated from the flexible circuit board of the second substrate layer 240 . It is possible to minimize the influence of the surrounding components from electromagnetic waves.

The first cover 280 may be coupled to the lower surface of the first substrate layer 200 through a shield can clip 285 having the same electromagnetic wave shielding properties as the first cover 280, The shield can clip may be disposed at both ends to which the first cover 280 and the first substrate layer 200 are coupled.

The RF device 260 coupled to the lower surface of the second substrate layer 240 means a high-frequency chip for wireless communication. can Accordingly, the RF device may include an amplifier, a transmitter, a receiver, a synthesizer, and the like.

Since the RF element 260 includes a plurality of electrical elements as described above, heat may be generated due to the operation of the element, and the element may be damaged by the heat, as well as the second second as described above. A pressure may be applied to the substrate layer 240 .

Therefore, it is necessary to dissipate the heat generated by the RF device 260 to the outside. In the present invention, a thermal interface material (270, TIM, Thermal Interface Material) is disposed between the RF device and the first cover to dissipate the heat generated from the RF device. An object of the present invention is to disclose a method of dissipating heat generated from an RF device to the outside of an antenna module.

That is, heat generated in the RF element 260 may be transferred to the first cover 280 through the heat transfer material, and the heat transferred to the first cover 280 may be transferred to the first substrate layer 200 . It may be transmitted to a heat sink 290 overlapping the bottom surface and the bottom surface of the first cover 280 and be emitted to the outside of the antenna module.

A second cover 210 formed to cover the antenna 220 may be disposed on the upper surface of the first substrate layer 200 . As shown in FIG. 2 , the second cover may be disposed in a direction in which the antenna 220 emits a beam.

Therefore, unlike the first cover (the first cover is for the main purpose of electromagnetic wave shielding, it will generally be preferable to form the first cover with metal.) It does not affect the beam radiated through the antenna 220 like plastic. It would be desirable to form the second cover 210 from a material.

Meanwhile, FIG. 2 only discloses an embodiment of the antenna module according to the present invention, and the scope of the present invention should not be limited to the form and configuration shown in FIG. 2 .

3 is a view showing the internal configuration of the antenna module substrate layer according to the present invention.

As described above, the RF element 260 and the antenna 220 may be electrically connected through the first substrate layer 200 and the second substrate layer 240 . In FIG. 3 , for example, four antennas 220 are disposed on the upper surface of the first substrate layer 200 , and the first substrate layer 200 and the second substrate layer 240 are coupled by a BGA method. have.

In this case, a signal transmitted through the antenna 220 may be transmitted to the RF element 260 through wiring formed in a pattern shape inside the first substrate layer 200 and the second substrate layer 240 , and the RF element 260 . ) may be radiated to the outside through the antenna 220 .

Meanwhile, in the base station including the packaged module according to the present invention, the packaged module includes a first substrate layer on which at least one substrate is stacked, an antenna coupled to an upper surface of the first substrate layer, and an upper surface of the first substrate layer. It may include a second substrate layer coupled to the lower surface of the substrate layer, on which at least one substrate is stacked, and a radio frequency (RF) device coupled to the lower surface of the second substrate layer.

The antenna may be a patch antenna, and the base station may further include at least one capacitor coupled to a lower surface of the second substrate layer.

In addition, the base station may further include a first cover coupled to the lower surface of the first substrate layer to surround the second substrate layer and the RF device, wherein the first cover is composed of a shield can. and the first cover and the first substrate layer may be coupled through a shield can clip.

The RF device and the first cover may be coupled to each other through a thermal interface material (TIM), and the base station may be coupled to a bottom surface of the first substrate layer and a bottom surface of the first cover to provide the first cover. It may further include a heat sink for absorbing heat emitted from the substrate layer and the first cover.

A grid array is formed on a lower surface of the first substrate layer, the first substrate layer and the second substrate layer may be electrically connected through the grid array, and the base station is the first substrate layer. It may further include a second cover surrounding the antenna on the top surface.

On the other hand, the embodiments of the present invention disclosed in the present specification and drawings are merely presented as specific examples to easily explain the technical contents of the present invention and help the understanding of the present invention, and are not intended to limit the scope of the present invention. That is, it will be apparent to those of ordinary skill in the art to which the present invention pertains that other modifications are possible based on the technical spirit of the present invention. In addition, each of the above embodiments may be operated in combination with each other as needed. For example, a base station and a terminal may be operated by combining parts of Embodiments 1, 2, and 3 of the present invention with each other. In addition, although the above embodiments have been presented based on the LTE system, other modifications based on the technical idea of the embodiment may be implemented in other systems such as 5G or NR systems.

Claims (24)

In a module used in a wireless communication device to communicate with a terminal,
one first printed circuit board (PCB) including a plurality of layers;
a plurality of antenna sets formed in an area corresponding to a first surface of the one first PCB;
a plurality of radio frequency integrated circuit (RFIC) chips; and
comprising a plurality of second PCBs;
Each of the plurality of second PCBs includes a plurality of layers,
each of the plurality of second PCBs is configured to electrically connect a corresponding one of the plurality of RFIC chips to the one first PCB;
a first side of each of the plurality of second PCBs is coupled to a second side of the one first PCB opposite to the first side of the one first PCB through a grid array;
a second surface opposite to the first surface of each of the plurality of second PCBs is configured to electrically connect a corresponding one of the plurality of RFIC chips and a corresponding one of the plurality of antenna sets module.
The method of claim 1,
Some of the plurality of second PCBs form a group, and each of the second PCBs included in the group is spaced apart from an adjacent second PCB by a predetermined distance.
According to claim 1,
Each of the plurality of second PCBs has a smaller surface area than the one first PCB, and the plurality of second PCBs are spaced apart from each other.
The module of claim 1 , wherein each of the plurality of second PCBs corresponds to a different antenna set among the plurality of antenna sets.
According to claim 1,
The grid array module includes a land grid array (LGA) or a ball grid array (BGA).
The module of claim 1 , wherein the plurality of antenna sets comprise patch antennas.
The module of claim 1, wherein the signal formed by each antenna set of the plurality of antenna sets of the first PCB is transmitted from the corresponding RFIC chip through a conductive line formed on the corresponding second PCB.
According to claim 1,
a plurality of first covers for the plurality of RFIC chips; and
For each of the plurality of first covers, the module further comprising a thermal interface material (thermal interface material, TIM) disposed between the first cover and the RFIC chip.
9. The method of claim 8,
The module further comprising a shield can (shield can) disposed on each of the plurality of first covers.
According to claim 1,
The module further comprising a capacitor for removing noise, which is disposed on a second surface of each of the plurality of second PCBs.
According to claim 1,
A module further comprising a second cover for enclosing an area of the plurality of antenna sets.
A wireless communication device for communicating with a terminal, comprising:
power;
DC/DC converter for converting voltage of power;
a field programmable gate array (FPGA) having programmable logic circuitry; and
contains a module;
The module is
one first printed circuit board (PCB) including a plurality of layers;
a plurality of antennas formed on an area corresponding to the first surface of the one first PCB;
a plurality of radio frequency integrated circuit (RFIC) chips; and
including a plurality of second PCBs;
Each of the plurality of second PCBs includes a plurality of layers,
each of the plurality of second PCBs is configured to electrically connect a corresponding one of the plurality of RFIC chips to the one first PCB;
a first side of each of the plurality of second PCBs is coupled to a second side of the one first PCB opposite to the first side of the one first PCB through a grid array;
a second surface opposite to the first surface of each of the plurality of second PCBs is configured to electrically connect a corresponding one of the plurality of RFIC chips and a corresponding one of the plurality of antenna sets wireless communication device.
13. The method of claim 12,
Some of the plurality of second PCBs form a group, and each of the second PCBs included in the group is spaced apart from an adjacent second PCB by a predetermined distance.
13. The method of claim 12,
Each of the plurality of second PCBs has a smaller surface area than the one first PCB, and the plurality of second PCBs are spaced apart from each other.
The wireless communication apparatus of claim 12 , wherein each of the plurality of second PCBs corresponds to a different antenna set among the plurality of antenna sets.
13. The method of claim 12,
The grid array is a wireless communication device including a land grid array (LGA) or a ball grid array (BGA).
The wireless communication device of claim 12 , wherein the signal formed by each antenna set of the plurality of antenna sets of the first PCB is transmitted from the corresponding RFIC chip through a conductive line formed on the corresponding second PCB. .
13. The method of claim 12,
The plurality of antenna sets includes a plurality of patch antennas.
13. The method of claim 12,
a plurality of first covers for the plurality of RFIC chips; and
and for each of the plurality of RFIC chips, a thermal interface material (TIM) disposed between the first cover and the RFIC chip.
20. The method of claim 19,
The wireless communication device further comprising a shield can (shield can) disposed on each of the plurality of first covers.
13. The method of claim 12,
The wireless communication device further comprising a capacitor for removing noise, which is disposed on a second surface of each of the plurality of RFIC chips.
13. The method of claim 12,
and a second cover for enclosing an area of the plurality of antenna sets.
13. The method of claim 12,
The wireless communication device further comprises a low dropout regulator (LDO).
13. The method of claim 12,
The wireless communication device further comprises a connector for supplying power to the module.

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