KR102405774B1 - Film type carrier - Google Patents

Abstract

A carrier device is provided. The carrier device may include a pocket portion having an insertion hole into which a semiconductor package is inserted; a support portion formed on the first opening side when a film for aligning the plurality of terminals formed on the first surface of the semiconductor package to the socket portion is disposed on the first opening side of the insertion hole; It is formed to escape from the film, and may support the edge of the first surface of the semiconductor package.

Description

FILM TYPE CARRIER

The present invention relates to a film type carrier device for aligning a semiconductor package to a socket portion using a film.

A semiconductor device (semiconductor package) is one of electronic components having a structure in which a chip is connected on a substrate. The semiconductor device may include, for example, a memory device such as a DRAM or SRAM.

A semiconductor device is manufactured based on a wafer made of a thin single-crystal substrate made of silicon. Specifically, a semiconductor device includes a fab process of forming a plurality of chips having a circuit pattern patterned on a wafer, a bonding process of electrically connecting each of the chips formed in the fab process to each of the substrates, and protecting the chip connected to the substrate from the outside It is manufactured by performing a molding process, etc. for The semiconductor devices manufactured in this way undergo a separate test process to examine their electrical functions.

The test process is performed through a test device that substantially tests the semiconductor devices and a test handler that connects the semiconductor devices to the test device.

Korean Patent Publication No. 1228207 discloses a pushing mechanism for testing semiconductor devices.

Korean Patent Publication No. 1228207

An object of the present invention is to provide a carrier device that prevents damage to a terminal of a semiconductor package or a film for aligning a corresponding terminal with respect to a socket.

The carrier device of the present invention includes a pocket portion having an insertion hole into which a semiconductor package is inserted; and a support part formed on the first opening side when the film for aligning the plurality of terminals formed on the first surface of the semiconductor package to the socket part is disposed on the first opening side of the insertion hole.

The support part may be formed to escape from the film, and may support an edge of the first surface of the semiconductor package.

The carrier device of the present invention may include a support for supporting the edge of the semiconductor package instead of the film.

According to the present invention having the support part, damage to the terminal of the semiconductor package can be prevented or damage to the film for aligning the terminal with respect to the socket part can be prevented.

According to the present invention, since damage to the film, the terminal, and the socket is prevented, the production yield of the semiconductor package normally completed up to the test process can be improved.

According to the present invention, the coupling distance between the semiconductor package and the socket part may be limited to a set distance by using the support part disposed between the semiconductor package and the socket part. The control precision of the pusher that presses the semiconductor package against the socket portion through the so-called support portion functioning as a stopper can be relaxed.

1 is a schematic diagram showing a carrier device of the present invention;
Figure 2 is an exploded perspective view showing the pocket portion and the film of the present invention.
Figure 3 is a perspective view showing the bonding state of the pocket portion and the film of the present invention.
Figure 4 is a schematic view showing the support of the present invention.
5 is a schematic view showing another support part of the present invention.
6 is a schematic diagram showing the operation of the carrier device of the present invention.
7 is a schematic view of a pressing unit formed on one surface of the pusher facing the film viewed from the film side.
8 is a schematic view of a pressing part inserted into an insertion hole as viewed from the side of the second opening.
9 is a schematic view showing a support portion of the first embodiment.
10 is a schematic view showing a support portion of the second embodiment.
11 is a schematic diagram showing a test handler of a comparative example.

Hereinafter, with reference to the accompanying drawings, the embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. However, the present invention may be embodied in several different forms and is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

In the present specification, duplicate descriptions of the same components will be omitted.

Also, in this specification, when it is said that a certain element is 'connected' or 'connected' to another element, it may be directly connected or connected to the other element, but other elements in the middle It should be understood that there may be On the other hand, in this specification, when it is mentioned that a certain element is 'directly connected' or 'directly connected' to another element, it should be understood that another element does not exist in the middle.

In addition, the terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention.

Also, in this specification, the singular expression may include the plural expression unless the context clearly dictates otherwise.

Also, in this specification, terms such as 'include' or 'have' are only intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, and one or more It is to be understood that the existence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof, is not precluded in advance.

Also in this specification, the term 'and/or' includes a combination of a plurality of described items or any item of a plurality of described items. In this specification, 'A or B' may include 'A', 'B', or 'both A and B'.

Also, in this specification, detailed descriptions of well-known functions and configurations that may obscure the gist of the present invention will be omitted.

1 is a schematic diagram showing a carrier device of the present invention;

The carrier device shown in FIG. 1 may be included in a test handler that electrically connects the terminal 99 formed on the semiconductor package 90 to the test device.

A socket portion 70 electrically connected to each of a large number of terminals 99 may be provided. The socket 70 includes a socket having a connecting end 79 to which the terminal 99 is electrically connected or in contact, a guide 76 for supporting the socket or electrically connecting a connector provided on the connecting end 79 to the test device. can be provided.

In order to accurately insert the fine-sized terminal 99 into the connecting end 79 , a means for aligning the semiconductor package 90 or the terminal 99 with respect to the socket part 70 is required.

The carrier device of the present invention may use the film 200 as a means for aligning the semiconductor package 90 or the terminal 99 with respect to the socket unit 70 .

A first through hole 290 through which the ball-shaped terminal 99 protruding from the first surface 91 of the semiconductor package 90 is inserted may be provided in the film 200 .

The film 200 in which the first through-holes 290 are formed may be useful for aligning the semiconductor package 90 having a small pitch of the terminals 99 to the socket unit 70 . For example, the terminal 99 having a diameter of about 0.15 mm and a height protruding from the semiconductor package 90 of about 0.1 mm is preferably aligned using the film 200 type.

On the other hand, in the case of the film 200 type, there is a problem in that it is easy to deform when used for a long period of time. In addition, the film 200 has a high possibility of being deformed by a small external force due to a thin thickness, for example, a thickness of about 0.015 mm to 0.035 mm. The deformed film 200 may align the semiconductor package 90 with respect to the socket part 70 in an incorrect position. The semiconductor package 90 , in which the socket part 70 is misaligned with the reference, may be determined to be defective even though it is a normal product due to an abnormal test.

11 is a schematic diagram showing a test handler of a comparative example.

The semiconductor package 90 has a finely curved shape, and may tend to contact the socket part 70 from the edge when pressed by the pusher 50 . For this reason, the ball-shaped terminal 99 located at the edge of the semiconductor package 90 comes into contact with the socket unit 70 , and the contact portion is a force that flattens the semiconductor package 90 by the pusher 50 . can also be received together. As a result, the ball-shaped terminal 99 , the connecting end 79 , and the film 200 may be damaged, which may directly or indirectly affect the yield of the test process.

In addition, according to the comparative embodiment, the object receiving the pressure applied to the semiconductor package 90 by the pusher 50 may be the film 200 . On the other hand, in the present invention, the object receiving the pressure applied to the semiconductor package 90 by the pusher 50 may not be the film 200 but the support 130 .

In order to prevent damage to the terminal 99 , the connecting end 79 , and the film 200 , the carrier device of the present invention includes the cover part 300 , the pocket part 100 , the pusher 50 , and the support part 130 . may include

Returning to FIG. 1 again, the cover part 300 may be fixedly installed on the socket part 70 . The cover part 300 is formed in a hollow structure, and the pocket part 100 may be movably installed in the hollow in the middle along the axial direction of the hollow.

A latch unit for preventing the semiconductor package 90 accommodated in the pocket unit 100 from being separated from the film 200 may be provided in the cover unit 300 . The latch part may elastically press the edge of the second surface of the semiconductor package 90 . A long hole may be formed in the rod-shaped latch part having one side connected to the rotation shaft. The long hole may be formed in a cam structure that rotates the latch unit when the pocket unit 100 moves in a straight line with respect to the cover unit 300 .

The pocket part 100 may move with respect to the cover part 300 while the terminal 99 of the semiconductor package 90 is in contact with the socket part 70 . Alternatively, the terminal 99 of the semiconductor package 90 may be in contact with the socket part 70 by the movement of the pocket part 100 with respect to the cover part 300 .

The pocket part 100 may have a hollow structure in which an insertion hole 109 into which the semiconductor package 90 is inserted is formed.

The cross-sectional shape of the insertion hole 109 may follow the improvement of the plane of the semiconductor package 90 .

One opening of the insertion hole 109 may be defined as the first opening 101 , and the other opening of the insertion hole 109 may be defined as the second opening 102 .

The first opening 101 may face the socket unit 70 . In this case, the semiconductor package 90 or the pusher 50 may be input through the opposite second opening 102 and slide along the insertion hole 109 toward the first opening 101 .

The second opening 102 may be formed to be larger than the semiconductor package 90 so that the semiconductor package 90 is easily inserted into the insertion hole 109 . On the other hand, in order to induce alignment between the socket part 70 and the semiconductor package 90 , the first opening 101 may be formed to match the size and shape of the semiconductor package 90 .

The semiconductor package 90 advances toward the film 200 by pressing by the pusher 50 , and the terminal 99 of the semiconductor package 90 moves toward the film 200 by the advance of the semiconductor package 90 . ) may be inserted into the first through hole 290 of the.

The pusher 50 may be inserted into the insertion hole 109 through the second opening 102 , and may press the semiconductor package 90 toward the film 200 while moving toward the first opening 101 .

The film 200 may align the plurality of terminals 99 formed on the first surface 91 of the semiconductor package 90 to the socket unit 70 . The film 200 may be disposed on the side of the first opening 101 of the insertion hole 109 . In this case, the support 130 may also be formed on the side of the first opening 101 .

The support part 130 is formed to escape from the film 200 , and may support the edge of the first surface 91 of the semiconductor package 90 . According to the support part 130 , the semiconductor package 90 may be supported by the support part 130 instead of the film 200 . Since the support 130 instead of the film 200 receives the pressure of the pusher 50 , damage to the film 200 due to the pressure of the pusher 50 can be prevented. Looking from another point of view, in the case of the comparative embodiment in which the support 130 is excluded, the pressure of the pusher 50 is applied to the film 200 , and precise control of the pusher 50 to prevent damage to the film 200 . may be requested. According to the present embodiment, since the pressure of the pusher 50 is applied to the support part 130 with a low possibility of damage, the control precision of the pusher 50 can be significantly relaxed.

2 is an exploded perspective view showing the pocket portion 100 and the film 200 of the present invention. 3 is a perspective view showing the coupling state of the pocket portion 100 and the film 200 of the present invention.

The film 200 may be formed in a plate shape covering the first opening 101 .

An alignment protrusion 110 for aligning the film 200 to the socket portion 70 may be formed on one surface of the pocket portion 100 .

The film 200 has an alignment hole 210 fitted to the alignment protrusion 110 , a first through hole 290 through which the plurality of terminals 99 are inserted, and a second through hole through which the support unit 130 is inserted ( 230) may be provided. A hole may be formed in the center of the film 200 .

The film 200 may be aligned with the socket unit 70 by the alignment protrusion 110 and the alignment hole 210 . This is because the alignment protrusion 110 and the alignment hole 210 may be respectively formed at positions for aligning the film 200 to the socket unit 70 .

The semiconductor package 90 or the terminal 99 may be aligned with the film 200 by the first through hole 290 . This is because the terminal 99 fixed to the semiconductor package 90 is inserted into the first through hole 290 .

The semiconductor package 90 or the terminal 99 may be aligned with the socket unit 70 by the alignment protrusion 110 , the alignment hole 210 , and the first through hole 290 .

When the alignment hole 210 is fitted to the alignment protrusion 110 , the second through hole 230 may be formed at a position naturally aligned with the support unit 130 . Due to the second through hole 230 , the supporting part 130 may directly face-to-face contact with the edge of the first surface 91 of the semiconductor package 90 while avoiding the film 200 .

A plurality of support portions 130 may be formed along the inner periphery of the first opening 101 . As an example, the plurality of support portions 130 may be formed at positions symmetrical to the center of the first opening 101 .

The support portion 130 may be formed such that the support surfaces 133 supporting the edges of the first surface 91 in the plurality of support portions 130 all have the same specific position in the central axis direction of the insertion hole 109 . . The central axis of the insertion hole 109 may include an imaginary line connecting the center of the first opening 101 and the center of the second opening 102 .

When the semiconductor package 90 is pressed toward the first opening 101 by the pusher 50 inserted through the insertion hole 109, one edge and the other edge of the first surface 91 are provided with a plurality of support parts ( 130) may be aligned to a specific position. The semiconductor package 90 may have a finely curved shape. According to the support part 130 and the pusher 50 of the present embodiment, the semiconductor package 90 that is slightly bent may be flattened. At least the entire edge section of the semiconductor package 90 may be aligned at the same position in the forward direction of the pusher 50 . As a result, all terminals 99 of the semiconductor package 90 may pass through the first through hole 290 of the film 200 at approximately the same time. According to the present exemplary embodiment, damage to the terminal 99 or damage to the first through hole 290 generated while some of the terminals 99 pass through the first through hole 290 can be prevented.

In addition, after all the terminals 99 of the semiconductor package 90 are inserted into the film 200 , all of the corresponding terminals 99 may contact the connecting end 79 of the socket at the same time. Accordingly, damage to the terminal 99 due to the coupling between the terminal 99 and the connecting end 79 can be minimized.

4 is a schematic diagram showing the support portion 130 of the present invention, Figure 5 is a schematic diagram showing another support portion 130 of the present invention.

A support surface ( The support part 130 may be formed so that the 133 is in face-to-face contact with the edge of the first surface 91 . In other words, one surface of the film 200 facing the semiconductor package and the support surface 133 of the support unit 130 may be formed at the same height.

According to this embodiment, at least a situation in which all the pressure of the pusher 50 is applied to the film 200 rather than the support 130 can be prevented.

On the other hand, when the distance between the outermost terminals 99 from the edge of the first surface 91 is short, as shown in FIG. 4 , only the support part 130 extending parallel to the edge of the first surface 91 is the first surface (91) It can be difficult to support the edges. In this case, the penetrating part 134 of FIG. 5 may be used.

The support surface 133 supporting the first surface 91 of the support 130 may extend from the outside toward the center of the first surface 91 based on the outer boundary of the first surface 91 .

The distal end of the support part 130 extending toward the center of the first surface 91 may extend to a specific position spaced apart from the terminal 99 . This state may correspond to FIG. 4 .

A penetrating part 134 extending toward the empty space 95 between the plurality of terminals 99 from a specific position may be formed at the distal end of the support part 130 . The penetrating portion may have a pointed shape extending toward the empty space 95 without contacting the terminal. This state corresponds to FIG. 5 , and in this case, the shape of the penetrating part 134 may take the shape of an animal's claw or web.

The first surface 91 may be supported by at least one of the support surface 133 and the penetrating part 134 .

6 is a schematic diagram showing the operation of the carrier device of the present invention.

The cover part 300 may be in a state in which it is fixedly installed in the socket part. The pocket part 100 movably installed in the cover part 300 may be in a state accommodated in the hollow of the cover part 300 in a state restored to its initial position by an elastic means.

A film 200 for aligning the semiconductor package 90 to the socket part 70 may be mounted on one surface of the pocket part 100 facing the socket part 70 .

The semiconductor package 90 may be inserted into the insertion hole 109 of the pocket part 100 , and the pusher 50 may be inserted into the insertion hole 109 again. The terminal 99 of the semiconductor package 90 inserted into the insertion hole 109 is inserted into the first through hole 290 of the film 200 by its own weight, or the first through hole 290 by the pusher 50 . can be inserted into

The pusher 50 may press the second surface of the semiconductor package 90 that is opposite to the first surface 91 . The pressure of the pusher 50 applied through the second surface is applied to the support portion 130 supporting the first surface 91 of the semiconductor package 90 , and the pocket portion 100 is a socket in which the connecting end 79 is formed. It can move toward the part 70 .

Before reaching the socket portion 70 , all edges of the semiconductor package 90 are aligned at the same position by the plurality of support portions 130 , and all terminals 99 of the semiconductor package are aligned with the central axis of the insertion hole 109 . It may be disposed at approximately the same position in the direction. The corresponding terminal 99 may be directly inserted into the connecting end 79 of the socket unit 70 by pressing the pusher 50 , and may be electrically connected to the socket unit 70 .

Meanwhile, the support part 130 provided between the semiconductor package 90 and the socket part 70 may also function as a stopper.

For example, the pusher 50 may be set to press the semiconductor package 90 toward the socket unit 70 to the set position h1 . In this case, the support unit 130 may be formed to have a thickness or height extending from one surface of the socket unit 70 facing the semiconductor package 90 to the set position h1 .

The support part 130 provided between the semiconductor package 90 and the socket part 70 may forcibly stop the semiconductor package 90 approaching the socket part 70 by the pusher 50 at a set position. . According to the present embodiment, the pusher 50 may press the semiconductor package 90 only to a set position. In addition, the pusher 50 can easily and accurately press the semiconductor package 90 to a set position without precise control.

Meanwhile, in order for all edges of the semiconductor package 90 to be aligned at the same position by the pusher 50 and the support part 130 , it is preferable that the edge of the semiconductor package 90 is pressed toward the support part 130 .

7 is a schematic view of the pressing unit 59 formed on one surface of the pusher 50 facing the film 200 viewed from the film 200 side. 8 is a schematic view of the pressing part 59 inserted into the insertion hole 109 as viewed from the second opening 102 side.

A means for pressing the edge of the semiconductor package 90 may be added.

For example, the insertion hole 109 may be formed in a funnel structure in which the cross-sectional area decreases as it advances toward the first opening 101 . On the other hand, the cross-sectional area of the set section at the end of the insertion hole 109 may be kept constant. In cross-section, the inner wall surface 105 of the pocket portion facing the insertion hole 109 may be formed to be inclined in the longitudinal direction of the insertion hole 109 . The setting section of the distal end of the inner wall surface 105 may be formed parallel to the longitudinal direction of the insertion hole 109 .

A groove-shaped slit 106 may be formed in the middle of the upper side, the lower side, the left side, and the right side of the set section in plan view.

A wing portion 51 inserted into the slit 106 may protrude from the edge of the pusher 50 or the pressing unit 59 facing the slit 106 . The wing part 51 may press the edge of the second surface of the semiconductor package 90 while sliding along the slit 106 .

The pressing part 59 may be formed to be replaceable in the pusher 50 . A hot air hole 58 may be formed in the center of the pressing part 59 . Externally heated air may be applied to the semiconductor package through the hot air hole 58 .

On one surface of the pressing part 59 facing the semiconductor package 90 , a plurality of first trenches 56 extending from the hot air hole 58 to the edge are formed at positions symmetrical to the hot air hole 58 . can In addition, a recessed incision section 54 may be provided in the center of the rim of the pressing part 59 .

The hot air input through the hot air hole 58 may propagate to every corner of the semiconductor package along the hot air hole 58 .

According to the cutout section 54 , the pressing part 59 may be in contact with the entire area of the second surface evenly and adaptively regardless of the flatness of the second surface of the semiconductor package 90 .

The support 130 may be formed in various ways. For example, the support 130 may be integrally formed with the pocket portion 100 or integrally formed with the socket portion 70 . Alternatively, the support part 130 may be formed separately from the pocket part 100 and the socket part 70 .

An avoiding hole 104 for avoiding interference with the vertex portion of the pressing part 59 may be formed on the inner wall surface of the pocket portion 100 facing the distal vertex of the insertion hole 109 .

9 is a schematic diagram showing the support 130 of the first embodiment.

The support part 130 shown in FIG. 9 represents the support part 130 integrally formed with the pocket part 100 .

The support part 130 of FIG. 9 may include a support protrusion 131 formed to protrude toward the socket part 70 on one surface of the pocket part 100 facing the socket part 70 .

At one side of the support protrusion 131 , a locking protrusion that spans the edge of the first surface 91 of the semiconductor package 90 disposed in the first opening 101 may be formed. One surface of the locking protrusion in face-to-face contact with the edge of the first surface 91 may correspond to the support surface 133 of the support unit 130 .

The support protrusion 131 is a socket portion by a length that functions as a stopper forcibly stopping the semiconductor package 90 approaching the socket portion 70 for insertion and electrical connection to the socket of the socket portion 70 at the set position h1. It may protrude toward (70).

When defining one surface of the support part 130 facing the socket part 70 as the stop surface 132 , the distance between the stop surface 132 and the support surface 133 , that is, the thickness of the support part 130 is set above. It may be formed to match the position.

10 is a schematic diagram showing a support part 130 of the second embodiment.

The support part 130 shown in FIG. 10 may be integrally formed with the socket part 70 . Alternatively, the support unit 130 may include a separate ring-shaped attachment installed or mounted on the socket unit 70 .

A protrusion 137 protruding toward the pocket 100 from one surface of the socket 70 facing the pocket 100 may be provided.

One surface 138 of the protruding protrusion 137 facing the pocket portion 100 may be formed to support the edges of the pocket portion 100 and the first surface 91 together at a set height. According to the present embodiment, the protruding protrusion 137 supports the edge of the first surface of the semiconductor package 90 and at the same time functions as a stopper preventing excessive access of the pocket part 100 to the socket part 70 . have.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims are also presented. It belongs to the scope of the invention.

50...pusher 51...wing
54...Incision section 56...First trench
58...Hot air hole 59...Pressing part
70...socket part 76...guide
79...connecting end 90...semiconductor package
91...1st side 95...blank space between multiple terminals
99...Terminal 100...Pocket
101...first opening 102...second opening
104...Escape hole 105...Inner wall surface
106...slit 109...insertion hole
110...alignment projection 130...support
131...support projection 132...stop surface
133...support surface 134...penetrate
137...Protrusion 138...One side of the protrusion
200...Film 210...Align holes
230...Second through hole 290...First through hole
300...cover part

Claims (10)

a pocket portion having an insertion hole into which the semiconductor package is inserted;
a support portion formed on the first opening side when the film for aligning the plurality of terminals formed on the first surface of the semiconductor package to the socket portion is disposed on the first opening side of the insertion hole;
The support unit supports a side portion excluding a vertex from an edge of the first surface of the semiconductor package instead of the film.
According to claim 1,
The film covering the first opening is provided,
An alignment protrusion for aligning the film to the socket part is formed on one surface of the pocket part,
The film is provided with an alignment hole fitted to the alignment protrusion, a first through hole through which the plurality of terminals are inserted, and a second through hole through which the support part is inserted;
The film is aligned with the socket part by the alignment protrusion and the alignment hole,
The semiconductor package or the terminal is aligned with the film by the first through hole,
The semiconductor package or the terminal is aligned with the socket unit by the alignment protrusion, the alignment hole, and the first through hole,
When the alignment hole is fitted to the alignment protrusion, the second through hole is aligned with the support unit.
According to claim 1,
The support portion is formed in plurality along the inner periphery of the first opening,
The support part is formed so that the support surfaces supporting the edge of the first surface in the plurality of support parts have the same specific position in the central axis direction of the insertion hole,
When the semiconductor package is pressed toward the first opening by a pusher inserted through the insertion hole, one edge and the other edge of the first surface are aligned at the specific position by the plurality of support parts.
According to claim 1,
A pusher is provided which is put into the insertion hole and presses the semiconductor package toward the film while moving toward the first opening,
The insertion hole is formed in a funnel structure in which the cross-sectional area decreases as it advances toward the first opening,
The cross-sectional area of the set section at the end of the insertion hole is kept constant,
A groove-shaped slit is formed in the middle of the upper, lower, left, and right sides of the set section in plan view,
On the edge of the pusher facing the slit, a wing portion inserted into the slit is formed to protrude,
The wing portion slides along the slit, and the carrier device presses the edge of the second surface of the semiconductor package.
According to claim 1,
The support surface for supporting the first surface in the support portion extends from the end of the pocket portion toward the insertion hole,
The carrier device having a plurality of support portions having the support surface for each side portion of the edge of the first surface.
According to claim 1,
The support surface for supporting the first surface in the support part extends from the outside toward the center of the first surface based on the outer boundary of the first surface,
An end of the support portion extending toward the center of the first surface extends to a specific position spaced apart from the terminal,
A penetrating portion extending from the specific position toward the empty space between the plurality of terminals is formed at the end of the support portion,
The first surface is supported on at least one of the support surface and the penetrating part.
According to claim 1,
The support part is provided between the semiconductor package and the socket part,
When a pusher set to press the semiconductor package toward the socket part to a set position is provided, the support part is formed to have a thickness or height extending from one surface of the socket part facing the semiconductor package to the set position, ,
The support portion provided between the semiconductor package and the socket portion forcibly stops the semiconductor package approaching the socket portion by the pusher at the set position.
According to claim 1,
A support protrusion protruding toward the socket portion is provided on one surface of the pocket portion facing the socket portion,
A carrier device having a locking protrusion on one side of the support protrusion that spans an edge of the first surface of the semiconductor package disposed in the first opening.
9. The method of claim 8,
The support protrusion protrudes toward the socket portion by a length serving as a stopper for forcibly stopping the semiconductor package approaching the socket portion at a set position for insertion and electrical connection to the socket portion of the socket portion.
According to claim 1,
A protrusion protruding from one surface of the socket portion facing the pocket portion toward the pocket portion is provided,
One surface of the protruding protrusion facing the pocket portion is formed to support the pocket portion and the edge of the first surface together at a set height.

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