KR102302588B1 - Probe card for calibrating contact position, probe test apparatus, method for setting the probe card and method aligning the probe test apparatus using the probe card for calibration contact position - Google Patents

Abstract

A probe card for calibration according to the present technology includes a probe card PCB and a plurality of probe needles installed on the probe card PCB, wherein the plurality of probe needles include a first needle pin provided to enable position correction, and the first needle pin A second needle pin is spaced apart from each other by a predetermined interval to be a reference point when the position of the first needle pin is corrected, and the first needle pin is spaced apart from the first needle pin by a predetermined interval, and when the position of the first needle pin is corrected, the second needle pin is the reference point. It may include a third needle pin aligned with the position correcting the first needle pin.

Description

How to set up a probe card for calibration, a probe test device, a probe card for compensation, and an alignment method for a probe test device using a probe card for compensation TEST APPARATUS USING THE PROBE CARD FOR CALIBRATION CONTACT POSITION}

The present invention relates to a probe test apparatus used in a probe test process for inspecting electrical characteristics of each die formed on a semiconductor substrate, and a method for aligning the probe test apparatus.

In general, a semiconductor device forms a predetermined film on a silicon wafer used as a semiconductor substrate, a Fab process for forming the film in a pattern having electrical characteristics, and electrically inspects each die on which the pattern is formed. A probe test process, a cutting process for cutting each die, a bonding process for welding gold or aluminum wires to the semiconductor substrate divided by the cutting process, and a ceramic or plastic substrate after the bonding process It is manufactured through a packaging process that is sealed with

Among the above processes, the probe test process is a process of inspecting electrical characteristics of each die formed on the semiconductor substrate, and is also called an EDS (Electric Die Sorting) process. In other words, the probe test process is a process of determining whether each die formed on the semiconductor substrate is in an electrically good or bad state. This is to reduce the effort and cost consumed in the packaging process by removing the die having a bad state through the probe test process before performing the packaging process, and to find and regenerate the die having the bad state at an early stage. .

As shown in FIG. 1 , the probe test apparatus in which the probe test process is performed as described above generates a predetermined electrical signal (test signal) for testing each die (not shown) of the wafer W as a test target, and generates the generated A tester 10 that transmits a signal to each die, a wafer chuck 21 that holds the wafer W so that the tester 10 can test each die of the wafer W, and the wafer chuck ( A prober 20 including a chuck transfer device 22 for aligning the position 21 to the test position, and a signal generated from the tester 10 are transmitted to each die of the wafer W, acting as an intermediate medium It may include a probe card (Probe card) (30) that does.

Here, the prober 20 may further include a probe card aligning device 23 for positioning and aligning the probe card 30 to the test position. In addition, pads (not shown) are formed on each die of the wafer W, and the probe card 30 may include a plurality of probe needles 33 contacting the pads of each die during testing. have.

Meanwhile, it is important to align the wafer W and the probe card 30 to the test position in order to perform the probe test using the probe test apparatus having the above configuration.

This is because when the wafer W and the probe card 30 are not aligned at the test position, the probe needle 33 of the probe card 30 does not contact the correct position of the pad of each die of the wafer W, so that each die This is to prevent in advance from being judged to be in a bad state. Here, the proper position at which the probe needle 33 is in contact with the pad of each die may be the center of each pad.

Therefore, in order to perform the probe test, it is determined whether the probe card 30 and the wafer W are properly aligned at the test position, and based on the determination result, the probe card 30 or the wafer W on which the wafer W is seated is determined. A process of adjusting the position of the chuck 21 is necessary.

A process of determining whether the conventional probe card 30 and the wafer W are aligned at the test position will be described with reference to FIGS. 2 and 3 . Here, in FIGS. 2 and 3 , the size of each pad of the wafer is exaggerated for convenience of understanding.

Referring to FIG. 2 , the pad P1 of the die installed near the edge of one side of the wafer W is brought into contact with the probe needle 33 (refer to FIG. 1 ) of any one of the probe cards 30 corresponding thereto.

After moving the wafer chuck 21 in one direction by a predetermined distance in a state in which the probe card 30 is fixed, the probe needle 33 and the pad spaced apart by a predetermined distance from the pad contacted in the previous process are brought into contact with each other. Repeat the process. Here, the wafer chuck 21 is moved in a state in which the contact between the probe needle 33 and the wafer is released.

In the above process, the movement of the wafer chuck 21 may be repeated by a predetermined distance along the line A. Line A is a line passing through a point on one side of the wafer chuck 21 and a point on the other side of the wafer chuck 21 opposite to the point on one side of the wafer chuck based on the center of the wafer chuck 21 and the center of the wafer chuck.

In other words, any one of the probe needles 33 comes into contact with the pad P1 positioned at one point of the wafer chuck 21 and then along line A, the pad at the other point opposite to the one point of the wafer chuck 21 . A plurality of pads may be sequentially contacted until contacted with (P2). However, only the positions of the probe card 30 in contact with the pad P1 at one side and the pad P2 at the other side of the wafer chuck 21 are illustrated in FIG. 2 .

On the other hand, if the probe card 30 and the wafer W are properly aligned at the test position, as shown in FIG. 3 , a contact portion between any one probe needle 33 (refer to FIG. 1 ) and the pads of the wafer W A line connecting them may be formed like line B. Line B may be substantially the same as line A (see FIG. 2 ).

On the other hand, if the probe card 30 and the wafer W are not properly aligned at the test position, the line connecting the contact portions of the probe needle 33 and the pads of the wafer W may be formed like the C line. can Line C may be a line shifted by a predetermined angle from line B.

As described above, if it is determined that the probe card 30 and the wafer W are not properly aligned at the test position, the probe card 30 is rotated by an angle between the B line and the C line to correct the position of the probe card 30 . do.

Conventionally, as described above, when it is determined that the probe card 30 and the wafer W are not aligned at the test position, the probe card 30 and the wafer W are adjusted through the process of adjusting the position of the probe card 30 . align to the test position. In this case, it is not easy to check which member of the probe card 30 and the wafer W is not aligned with the test position.

In particular, when the probe card 30 adjusted as described above is used in another probe test apparatus, it is inconvenient to repeat the process of aligning the probe card 30 and the wafer W to the test position again.

In an embodiment of the present invention, when the probe card and the wafer are not aligned in the test position, it is easy to check which member is not aligned in the test position. A method for setting and an alignment method of a probe test apparatus using a probe card for calibration are provided.

In addition, an embodiment of the present invention provides a calibration probe card capable of facilitating alignment of a probe card and a wafer to a test position, a probe test apparatus having a probe card for calibration, a method of setting a probe card for calibration, and a calibration probe card using the calibration probe card. A method for aligning a probe test apparatus is provided.

A probe card for calibration according to an embodiment of the present invention includes a probe card PCB and a plurality of probe needles installed on the probe card PCB, wherein the plurality of probe needles include a first needle pin provided to enable position correction, and The second needle pin is spaced apart from the first needle pin by a predetermined interval to be a reference point when the position of the first needle pin is corrected, and the second needle pin is spaced apart from the first needle pin by a predetermined interval, and when the position of the first needle pin is corrected, the second needle pin It may include a third needle pin aligned with the reference to correct the position of the first needle pin.

A probe test apparatus having a calibration probe card according to an embodiment of the present invention includes a prober for fixing and moving a wafer, a tester for generating a signal for testing a wafer fixed to the prober, and a test generated by the tester and a probe card for transmitting a signal to the wafer, wherein the probe test apparatus includes a calibration probe card for changing a position of a prober to which the wafer is fixed in order to align the probe card and the wafer to a test position. The calibration probe card further includes a probe card PCB, and a plurality of probe needles installed on the probe card PCB and in contact with the pad of the wafer, wherein the plurality of probe needles are contact points formed when in contact with the wafer. A first needle pin that is position-corrected based on to align the calibration probe card and the wafer at a test position, and a second needle pin spaced apart from the first needle pin at a predetermined distance to be a reference point when correcting the position of the first needle pin A needle pin and a third needle pin spaced apart from the first needle pin by a predetermined distance, aligned with the second needle pin when the position of the first needle pin is corrected, and comprising a third needle pin for correcting the position of the first needle pin can

The method of setting the probe card for calibration according to an embodiment of the present invention includes the steps of: placing a predetermined probe card for forming the calibration probe card and the wafer in a test position; a plurality of probe needles of the predetermined probe card; The predetermined probe card and the wafer are formed through the steps of contacting a plurality of probe needles with the corresponding pads of the wafer to form contact points on the respective pads, and confirming whether the contact points are formed at a set position on the respective pads. It may include determining whether is aligned with the test position, and correcting the position of the probe needle to the set position when the predetermined probe card and the wafer are not aligned with the test position.

An alignment method using a calibration probe card according to an embodiment of the present invention comprises the steps of placing the calibration probe card and the wafer at a test position, and contacting a probe needle of the calibration probe card with a pad of the wafer to form a contact point. Determining whether the calibration probe card and the wafer are aligned at the test position through the forming step and the process of confirming whether the contact point is formed at the set position on each pad, and the contact point at the set position on each pad It may include changing the position at which the wafer is fixed when it is not formed on the .

According to the present technology, after forming a calibration probe card that can be used in common by a plurality of probe test devices, if the calibration probe card and the wafer are not aligned at the test position, the calibration probe card is used to remove the wafer chuck of each probe test device. location can be changed.

Through this, the process of aligning the probe card and the wafer to the test position is easy as the probe test process is performed after the position of the wafer chuck of each probe test apparatus is changed.

In addition, in the embodiment of the present invention, since the position of the wafer chuck of each probe test apparatus is changed using the probe card for calibration, if the probe card and the wafer are not aligned at the test position, only the probe card needs to be aligned. During the probe test process of the used wafer, the probe card and the wafer can be easily aligned at the test position.

1 is a diagram schematically illustrating a conventional probe test apparatus.
2 is a diagram illustrating a probe test process in a conventional probe test apparatus.
FIG. 3 is a diagram illustrating a process of determining whether a probe card and a wafer are aligned at a test position during a conventional probe test process.
4 is a side view schematically illustrating a probe test apparatus of the present invention.
5 is a plan view showing a conventional wafer.
FIG. 6 is a bottom view illustrating the calibration probe card shown in FIG. 4 .
FIG. 7 is an enlarged view of the needle part of the probe card for calibration shown in FIG. 6 .
8 is a flowchart of a method for setting a probe card for correction according to the present invention.
FIG. 9 is a diagram schematically illustrating the flowchart shown in FIG. 8 .
10 is a flowchart of an alignment method using the calibration probe card of the present invention.
FIG. 11 is a diagram schematically illustrating the flowchart shown in FIG. 10 .

Advantages and features of the present invention, and a method for achieving the same, will be described with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. However, these embodiments are provided to explain in detail enough to be able to easily implement the technical idea of the present invention to those of ordinary skill in the art to which the present invention pertains.

In addition, well-known structures irrelevant to the gist of the present invention may be omitted. In adding reference numbers to the components of each drawing, it should be noted that only the same components are given the same number as possible even though they are indicated on different drawings.

Referring to FIG. 4 , the probe test apparatus generates a predetermined electrical signal (test signal) for testing the wafer W as a test target, and transmits the generated signal to each die 5 formed on the wafer W (refer to FIG. 5 ). The tester 110 that transmits, the prober 120 that fixes and moves the wafer W so that the tester 110 can perform the test, and the signal generated by the tester 110 are formed on the wafer W A probe card (not shown) serving as an intermediate to be transferred to the die 5, and commonly used in various probe test devices to facilitate aligning the wafer W and the probe card of each probe test device to the test position It may include a probe card 130 for correction.

The tester 110 may include a test body 111 and a test head 113 that is lifted from the test body 111 .

The test body 111 controls the overall probe test process, and serves to determine whether each die 5 is good or bad. For example, the test body 111 generates a test signal for testing each die 5 and transmits the generated signal to the test head 113 , and detects a signal to be checked from the transmitted signal, It serves to determine whether the dies 5 to be tested are good or bad based on the sensed signals.

The test head 113 is lifted from the test body 111 and may be selectively docked to the probe card or the calibration probe card 130 . Therefore, the test signal transmitted from the test body 111 is transmitted to the probe card or the calibration probe card 130 via the test head 113 .

In this process, the test head 113 includes a test board 114 made to fit the characteristics of the wafer (W) die 5 to be tested, and a pogo block 115 coupled to the lower portion of the test board 114 . This may be provided. A plurality of pogo pins (not shown) electrically connected to signal lines formed on the probe card or the calibration probe card 130 may be provided on the bottom of the pogo block 115 .

And a ZIF pin (not shown) may be provided on the lower part of the test board 114 instead of the pogo block, and the ZIF pin ( not shown) may be provided.

Accordingly, the test signal generated from the test body 111 and transferred to the test head 113 sequentially passes through the test board 114 of the test head 113 and the pogo pin or zip pin to the probe card or the probe card 130 for calibration. ) is transferred to

The prober 120 may be disposed under the test head 113 to receive a test signal from the tester 110 . The prober 120 includes a wafer chuck 121 on which the wafer W is seated, and a chuck transfer device 123 for transferring the wafer W seated on the wafer chuck 121 to a position where a test is to be performed. can do.

The wafer chuck 121 fixes the wafer W on its upper surface by a method such as vacuum suction. A camera unit 125 for checking the position of the probe needle 133 of the probe card or the probe card 130 for calibration may be installed on one side of the wafer chuck 121 .

In this case, a plurality of dies 5 may be formed on the wafer W, and each die 5 may be separated by a scribe lane SL. A plurality of pads P are formed along edges of each die 5 (see FIG. 5 ).

The chuck transfer device 123 includes a first transfer unit 123a that moves the wafer chuck 121 on which the wafer W is seated in the X-axis direction, and a second transfer unit 123a that moves the wafer chuck 121 in the Y-axis direction ( 123b), a third transfer unit 123c for moving the wafer chuck 121 in the Z-axis direction, and a fourth transfer unit 123d for moving the wafer chuck 121 in the θ-axis direction may be included. Since the configuration of the chuck transfer device 123 is a known technique, a detailed description thereof will be omitted.

The calibration probe card 130 may include a probe card PCB 131 and a probe needle 133 .

The probe card PCB 131 may be formed in a shape that can be seated on the card receiving part 131a, for example, a disc shape having a step difference.

The probe needle 133 may be formed in a needle shape having a thin thickness such that one end thereof is in contact with a terminal formed on each die 5 formed on the wafer W, that is, the pad P. One end of the probe needle 133 may be bent at a predetermined angle to contact the pads P of each die, but is not limited thereto. The other end of the probe needle 133 may be connected to the lower end of the probe card PCB 131 by soldering or the like.

The probe card may also include the probe card PCB and the probe needle, and since it is similar to the configuration of the probe card for calibration, a detailed description thereof will be omitted.

On the other hand, as shown in FIG. 6 , the probe needle 133 of the probe card 130 for calibration includes a first needle part 1331 installed at a first point of the probe card PCB 131 and a first point. A second needle part 1332 installed at a second point opposite to the 1334) may be included.

In other words, the first point may be an edge region of one side of the probe card PCB 131 , and the second point is the other side of the probe card PCB 131 opposite to the first point with respect to the center of the probe card PCB 131 . It may be an edge region.

The third point may be an edge region different from the first and second points. Preferably, the third point may be an edge region of the probe card PCB that is perpendicular to a line connecting the first point and the second point but meets a line passing through the center of the probe card PCB 131 . The fourth point may be an edge region of the probe card PCB 131 opposite to the third point with respect to the center of the probe card PCB 131 .

For example, the first needle part 1331 may be formed in a left edge region of the probe card PCB 131 , and the second needle part 1332 may be formed in a right edge region of the probe card PCB 131 . In addition, the third needle part 1333 may be formed in a lower edge region of the probe card PCB 131 , and the fourth needle part 1334 may be formed in an upper edge region of the probe card PCB 131 .

As shown in FIGS. 6 and 7, each of the needle parts 1331, 1332, 1333, and 1334 is a first needle pin 1331a, 1332a, 1333a, 1334a, and a second needle pin 1331b, 1332b, 1333b, 1334b. ) and third needle pins 1331c, 1332c, 1333c, and 1334c. That is, the first, second, third, and fourth points of the probe card PCB 131 may have the first, second, and third needle pins modularized needle parts 1331 , 1332 , 1333 and 1334 , respectively. Here, it should be noted that each needle pin of the probe card PCB 131 shown in FIGS. 6 and 7 is exaggerated for convenience of understanding.

The first needle pins 1331a, 1332a, 1333a, and 1334a may be calibration pins. These first needle pins 1331a, 1332a, 1333a, 1334a check the contact points formed when they come into contact with the respective pads (P, see FIG. 5) of the corresponding wafers (W, see FIG. 5), and the contact points are located at the alignment positions. It may be a pin whose position is corrected when it is determined that there is not. Here, the alignment position will be described later.

The second needle pins 1331b, 1332b, 1333b, and 1334b may be reference pins. These second needle pins 1331b, 1332b, 1333b, and 1334b may be reference pins when correcting the positions of the first needle pins 1331a, 1332a, 1333a, and 1334a. In other words, the second needle pin (1331b, 1332b, 1333b, 1334b) moves the first needle pin (1331a, 1332a, 1333a, 1334a) when the position of the first needle pin (1331a, 1332a, 1333a, 1334a) is corrected. The third needle pin (1331c, 1332c, 1333c, 1334c) is a reference for determining whether the movement to the correct position.

The third needle pins 1331c, 1332c, 1333c, and 1334c may be needle align pins. The third needle pins 1331c, 1332c, 1333c, and 1334c may be aligned through the camera unit 125 installed on one side of the wafer chuck 121 .

In other words, the third needle pins 1331c, 1332c, 1333c, and 1334c may be aligned with respect to the second needle pins 1331b, 1332b, 1333b, and 1334b using the camera unit 125, and in this way, the first When the three needle pins 1331c, 1332c, 1333c, and 1334c are aligned, the positions of the first needle pins 1331a, 1332a, 1333a, and 1334a may be corrected.

Meanwhile, a method of setting a calibration probe card according to an embodiment of the present invention will be described with reference to FIGS. 4, 6, 8 and 9 .

4, 6, and 8, a predetermined probe card 130 is seated on the card seat portion 131a, and the wafer chuck 121 on which the wafer W is seated is placed on the card seat portion 131a. It is placed in a position corresponding to the seated predetermined probe card (130). In other words, the predetermined probe card 130 and the wafer W are placed at a test position where the probe test process is performed ( S110 ).

In this case, the predetermined probe card 130 may include first, second, third, and fourth needle portions 1331, 1332, 1333, and 1334 as described above, and each of the needle portions 1331, 1332, 1333, 1334) is a first needle pin (1331a, 1332a, 1333a, 1334a) serving as a contact pin, second needle pin (1331b, 1332b, 1333b, 1334b) serving as a reference pin, and a needle aligning pin 3 needle pins 1331c, 1332c, 1333c, and 1334c may be included.

Next, it is determined whether the probe needle 133 of the predetermined probe card 130 is aligned through the camera unit 125 disposed on one side of the wafer chuck 121 disposed as described above (S120). Whether the probe needle 133 is aligned may be determined through the positions of the third needle pins 1331c, 1332c, 1333c, and 1334c of each of the needle parts 1331 , 1332 , 1333 and 1334 .

At this time, if it is determined that the probe needle 133 is not aligned, the probe needle 133 is aligned using the probe card alignment device 127 ( S130 ). And when it is determined that the probe needle 133 is aligned, the following process is performed.

Next, the wafer chuck 121 is raised to bring the probe needle 133 of the probe card 130 into contact with the pad P of each die 5 formed on the wafer W. After that, when the tester 110 generates a test signal, the test signal is transmitted to the pad P of each die 5 via the probe card 130 . As described above, when a test signal is generated after the probe needle 133 and the corresponding pad P of each die 5 are brought into contact, a plurality of contact points may be formed on the pad P (S140).

Next, it is determined whether the probe card 130 and the wafer W are properly aligned at the test position (S150). The process of determining whether the probe card 130 and the wafer W are aligned at the test position as described above is as follows.

First, it is checked whether the first contact point CP1 and the second contact point CP2 are positioned on the line D of FIG. 9 .

Here, the first contact point CP1 is a contact point at which the first needle pin 1331a of the first needle part 1331 is in contact with the first pad P11 corresponding to the first needle pin 1331a, and the second The contact point CP2 is a contact point at which the first needle pin 1332a of the second needle part 1332 contacts the second pad P12 corresponding to the first needle pin 1332a.

And line D is a line connected to pass through the center of the first pad P11 and the center of the second pad P12.

At this time, when the probe card 130 and the wafer W are aligned at the test position, the first contact point CP1 may be formed at the center of the first pad P11 , and the second contact point CP2 may be the second contact point CP2 . It may be formed in the center of the pad P12.

However, even if the first contact point CP1 is disposed on the line D other than the center of the first pad P11 , it can be said that the probe card 130 and the wafer W are aligned at the test position. Similarly, even if the second contact point CP2 is disposed on the line D other than the center of the second pad P12 , it can be said that the probe card 130 and the wafer W are aligned at the test position.

Then, it is checked whether the third contact point CP3 and the fourth contact point CP4 are positioned on the E line.

Here, the third contact point CP3 is a contact point at which the first needle pin 1333a of the third needle part 1333 comes into contact with the third pad P13 corresponding to the first needle pin 1333a, and the fourth The contact point CP4 is a contact point at which the first needle pin 1334a of the fourth needle part 1334 contacts the fourth pad P14 corresponding to the first needle pin 1334a.

And line E is a line connected to pass through the center of the third pad P13 and the center of the fourth pad P14. The E line may be a line orthogonal to the D line but passing through the center of the wafer W.

At this time, when the probe card 130 and the wafer W are aligned at the test position, the third contact point CP3 may be formed at the center of the third pad P13 , and the fourth contact point CP4 may be the fourth contact point CP4 . It may be formed in the center of the pad P14.

However, even if the third contact point CP3 is disposed on the line E other than the center of the third pad P13 , it can be said that the probe card 130 and the wafer W are aligned at the test position. Similarly, even if the fourth contact point CP4 is disposed on the E line other than the center of the fourth pad P14 , it can be said that the probe card 130 and the wafer W are aligned at the test position.

Next, if it is determined that the probe card 130 and the wafer W are not aligned at the test position, the position of the probe needle 133 is corrected to match the test position ( S160 ). In other words, if at least one of the first, second, third, and fourth contact points CP1, CP2, CP3, CP4 is not disposed on the D line or the E line in the above process, the position of the corresponding first needle pin is corrected. can do.

For example, as shown in FIG. 9 , the second contact point CP12 may not be disposed on the D line. In this case, the first needle pin 1332a of the second needle part 1332 may be corrected to be disposed on the D line.

Specifically, the position of the first needle pin 1332a of the second needle unit 1332 may be corrected while the region including the second needle unit 1332 is observed through the camera unit 125 . In this case, the correction of the position of the first needle pin 1332a may align the third needle pin 1332c of the second needle part 1332 to move the first needle pin 1332a a predetermined distance.

If, in the above process, the second needle pin 1332b serving as a reference pin is not disposed, it may not be easy to move the third needle pin 1332c in the observation area of the camera unit 125 . In other words, it is not easy to check whether the third needle pin 1332c is moved by a desired distance as it is performed within a small range such as the observation area of the camera unit 125 .

However, in the embodiment of the present invention, the coordinate value of the first needle pin 1332a is obtained by using the second needle pin 1332b as a reference pin within the observation area of the camera unit 125, and then the third needle pin 1332c. It is easy to move the coordinates spaced apart by a desired distance, for example, on the D line. Accordingly, the position of the first needle pin 1332a may be corrected by aligning the third needle pin 1332c using the camera unit 125 .

Meanwhile, in the field, the probe test process may be performed in a plurality of probe test apparatuses, rather than in one probe test apparatus. However, in the embodiment of the present invention, each probe test apparatus can be easily aligned using the calibration probe card 130 corrected through the above-described method.

In other words, in the prior art, it was necessary to align the probe card and the wafer for each probe test device. However, in the embodiment of the present invention, only the wafer W needs to be aligned using the calibration probe card 130, so the probe card and the wafer are placed in the test position. It is easy to sort.

A process of aligning the probe card 130 for calibration and the wafer W at the test position in the probe test apparatus as described above with reference to FIGS. 4, 5, 10 and 11 will be described below.

First, the calibration probe card 130 is seated on the card receiving part 131a. Subsequently, the wafer W to be subjected to the probe test is placed on the wafer chuck 121 , and the wafer chuck 121 is placed at a position (test position) corresponding to the calibration probe card 130 ( S210 ).

Next, when the wafer chuck 121 is raised to bring the probe needle 133 of the calibration probe card 130 into contact with the pads P11, P12, P13, and P14 of each die formed on the wafer W, the pads P11 A plurality of contact points CP1 , CP2 , CP3 , and CP4 may be formed on , P12 , P13 , and P14 ( S220 ).

Next, it is determined whether the calibration probe card 130 and the wafer W are properly aligned at the test position (S230). The process of determining whether the probe card 130 and the wafer W are aligned at the test position as described above is as follows.

First, it is checked whether the first contact point CP1 and the second contact point CP2 are located on the first line, that is, the D line, and the third contact point CP3 and the fourth contact point are located on the second line, that is, the E line. Check that (CP4) is positioned.

Here, the first contact point CP1 is a contact point at which the first needle pin 1331a of the first needle part 1331 contacts the first pad P11 corresponding to the first needle pin 1331a. The second contact point CP2 is a contact point at which the first needle pin 1332a of the second needle part 1332 contacts the second pad P12 corresponding to the first needle pin 1332a. The third contact point CP3 is a contact point at which the first needle pin 1333a of the third needle part 1333 contacts the third pad P13 corresponding to the first needle pin 1333a. The fourth contact point CP4 is a contact point at which the first needle pin 1334a of the fourth needle part 1334 contacts the fourth pad P14 corresponding to the first needle pin 1334a.

And line D is a line connecting the center of the first pad P11 and the center of the second pad P12 to pass through. Line E is a line connecting the center of the third pad P13 and the center of the fourth pad P14 to pass through. The E line may be a line orthogonal to the D line but passing through the center of the wafer W.

At this time, when the calibration probe card 130 and the wafer W are aligned at the test position, the first contact point CP1 and the second contact point CP2 may be formed at least on the D line, and the third contact point CP3 ) and the fourth contact point CP4 may be formed on the E line.

In the above process, if it is determined that the calibration probe card 130 and the wafer W are not aligned with the test position, the position of the wafer chuck 121 is changed to match the test position. That is, since the calibration probe card 130 is already aligned at the test position, only the wafer chuck 121 is changed to match the test position.

For example, as shown in FIG. 11 , the first, second, third, and fourth contact points CP21, CP22, CP23, and CP24 may be disposed in a rotated state at a predetermined angle. In this case, each of the contact points CP21 , CP22 , CP23 , and CP24 may be disposed on the D line or the E line by rotating the wafer chuck 121 .

As described above, in the embodiment of the present invention, after a calibration probe card that can be commonly used in a plurality of probe test devices is formed, if the calibration probe card and the wafer are not aligned at the test position, each calibration probe card is used to The position of the wafer chuck of the probe test apparatus may be changed.

Through this, the process of aligning the probe card and the wafer to the test position is easy as the probe test process is performed after the position of the wafer chuck of each probe test apparatus is changed.

In particular, in the related art, it is difficult to determine which member of the probe card and the wafer is disposed at the wrong position even when the probe card and the wafer are aligned at the test position in one probe test apparatus. However, in the embodiment of the present invention, as the position of the wafer chuck of each probe test apparatus is changed using the probe card for calibration, if the probe card and the wafer are not aligned at the test position, it can be easily recognized that the probe card is in the wrong position. .

In addition, in the embodiment of the present invention, since the position of the wafer chuck of each probe test apparatus is changed using the probe card for calibration, if the probe card and the wafer are not aligned at the test position, only the probe card needs to be aligned. During the probe test process of the used wafer, the probe card and the wafer can be easily aligned at the test position.

Those skilled in the art to which the present invention pertains should understand that the present invention may be embodied in other specific forms without changing the technical spirit or essential characteristics thereof, so the embodiments described above are illustrative in all respects and not restrictive. only do The scope of the present invention is indicated by the following claims rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. do.

W: Wafer P: Pad
5: die 110: tester
111: tester body 113: tester head
120: prober 121: wafer chuck
123: chuck transfer device 125: camera member
127: probe card alignment device 130: probe card
131: probe card PCB 133: probe needle
1331: first needle part 1332: second needle part
1333: third needle part 1334: fourth needle part
1331a, 1332a, 1333a, 1334a: first needle pin
1331b, 1332b, 1333b, 1334b: second needle pin
1331c, 1332c, 1333c, 1334c: 3rd needle pin

Claims (20)

A probe card PCB and a plurality of probe needles installed on the probe card PCB,
The plurality of probe needles,
A first needle pin provided so that the position can be corrected;
a second needle pin spaced apart from the first needle pin by a predetermined distance to become a reference point when correcting the position of the first needle pin;
Compensation probe card including a third needle pin spaced apart from the first needle pin by a predetermined interval and aligned with the second needle pin to correct the position of the first needle pin when the position of the first needle pin is corrected . ◈Claim 2 was abandoned when paying the registration fee.◈ According to claim 1,
The plurality of probe needles,
a first needle part installed at a first point disposed on one side area of the probe card PCB;
a second needle part installed at a second point in an area opposite to the first point with respect to the center of the probe card PCB;
and a third needle part installed at a third point that is a different area from the first and second points;
and a fourth needle part installed at a fourth point that is an area opposite to the third point with respect to the center of the probe card PCB. ◈Claim 3 was abandoned when paying the registration fee.◈ 3. The method of claim 2,
Each of the needle parts is a calibration probe card including the first needle pin, the second needle pin, and the third needle pin. ◈Claim 4 was abandoned when paying the registration fee.◈ 3. The method of claim 2,
The line connecting the first needle pin of the first needle part and the first needle pin of the second needle part and the line connecting the first needle pin of the third needle part and the first needle pin of the fourth needle part are orthogonal for correction probe card. A probe test apparatus comprising: a prober for fixing and moving a wafer; a tester for generating a signal for testing the wafer fixed to the prober; and a probe card for transferring the test signal generated by the tester to the wafer in,
The probe test apparatus further includes a calibration probe card for changing a position of a prober to which the wafer is fixed in order to align the probe card and the wafer to a test position,
The calibration probe card includes a probe card PCB, and a plurality of probe needles installed on the probe card PCB and in contact with the pad of the wafer,
The plurality of probe needles,
a first needle pin that is position-corrected based on a contact point formed when it comes into contact with the wafer to align the calibration probe card and the wafer to a test position;
a second needle pin spaced apart from the first needle pin by a predetermined distance to become a reference point when correcting the position of the first needle pin;
A probe test apparatus including a third needle pin spaced apart from the first needle pin by a predetermined interval and aligned with the second needle pin to correct the position of the first needle pin when the position of the first needle pin is corrected . ◈Claim 6 was abandoned when paying the registration fee.◈ 6. The method of claim 5,
The plurality of probe needles,
a first needle part installed at a first point disposed on one side area of the probe card PCB;
a second needle part installed at a second point in an area opposite to the first point with respect to the center of the probe card PCB;
and a third needle part installed at a third point that is a different area from the first and second points;
and a fourth needle part installed at a fourth point that is an area opposite to the third point based on the center of the probe card PCB. ◈Claim 7 was abandoned when paying the registration fee.◈ 7. The method of claim 6,
Each of the needle parts includes the first needle pin, the second needle pin, and the third needle pin, respectively. ◈Claim 8 was abandoned when paying the registration fee.◈ 8. The method of claim 7,
A first contact point formed on the first pad of the wafer in contact with the first needle pin of the first needle portion, and a second contact point formed on the second pad of the wafer in contact with the first needle pin of the second needle portion silver,
When the calibration probe card and the wafer are aligned at the test position, they are disposed on a first line passing through the center of the first pad and the center of the second pad,
A third contact point formed on the third pad of the wafer in contact with the first needle pin of the third needle portion, and a fourth contact point formed on the fourth pad of the wafer in contact with the first needle pin of the fourth needle portion silver,
The probe test apparatus is disposed on a second line passing through the center of the third pad and the center of the fourth pad when the calibration probe card and the wafer are aligned at the test position. ◈Claim 9 was abandoned at the time of payment of the registration fee.◈ 9. The method of claim 8,
The first line and the second line pass through the center of the wafer. ◈Claim 10 was abandoned when paying the registration fee.◈ 10. The method of claim 9,
The first line and the second line are perpendicular to the center of the wafer. ◈Claim 11 was abandoned when paying the registration fee.◈ 6. The method of claim 5,
The prober includes a wafer chuck to which the wafer is fixed, and a chuck transfer device for moving the wafer chuck. a prober for fixing and moving a wafer; a tester for generating a signal for testing the wafer fixed to the prober; a probe card for transferring a test signal generated from the tester to the wafer; A calibration probe card comprising a plurality of probe needles including a first needle pin, a second needle pin, and a third needle pin to change the position of the prober to which the wafer is fixed in order to align the wafer to the test position As a method of setting the probe card for calibration of a probe test apparatus comprising:
placing a predetermined probe card for forming the calibration probe card and the wafer in a test position;
forming contact points on the respective pads by contacting the plurality of probe needles including the first needle pin of the predetermined probe card and the pads of the wafer corresponding to the plurality of probe needles;
determining whether the predetermined probe card and the wafer are aligned at the test position through the process of confirming whether the contact point is formed at the set position on the respective pad; and
When the predetermined probe card and the wafer are not aligned in the test position, the first needle pin capable of position correction, and the first needle pin spaced apart from the first needle pin by a predetermined distance to serve as a reference point when correcting the position of the first needle pin The second needle pin and the third needle pin spaced apart from the first needle pin by a predetermined interval and aligned with respect to the second needle pin to correct the position of the first needle pin when the position of the first needle pin is corrected. Compensating the position of the probe needle including the set position to the set position of the calibration probe card setting method. ◈Claim 13 was abandoned when paying the registration fee.◈ 13. The method of claim 12,
The probe needle of the predetermined probe card includes a first needle part installed at a first point disposed on one area of the probe card PCB, and a second point that is an area opposite to the first point with respect to the center of the probe card PCB. A second needle part installed in the , a third needle part installed in a third point that is a different area from the first and second points, and a third needle part that is an area opposite to the third point with respect to the center of the probe card PCB Including a fourth needle part installed at 4 points,
Each of the needle parts includes the first needle pin, the second needle pin, and the third needle pin,
The setting position is
On a first line passing through the center of the first pad of the wafer in contact with the first needle pin of the first needle part and the center of the second pad of the wafer in contact with the first needle pin of the second needle part;
Located on a second line passing through the center of the third pad of the wafer in contact with the first needle pin of the third needle part and the center of the fourth pad of the wafer in contact with the first needle pin of the fourth needle part How to set the probe card for calibration. ◈Claim 14 was abandoned at the time of payment of the registration fee.◈ 14. The method of claim 13,
Compensating the position of the probe needle to the set position comprises:
When at least one of the contact points formed by the first needle pin of each needle part does not come into contact with the first line or the second line, the first needle pin is positioned so that the contact point is formed on the first line or the second line How to set the probe card for compensation to be compensated. ◈Claim 15 was abandoned when paying the registration fee.◈ 15. The method of claim 14,
Correcting the position of the first needle pin so that a contact point is formed on the first line or the second line,
Using the second needle pin as a reference point, the coordinate values of the first needle pin are obtained, and then the third needle pin is aligned using the camera unit, and the first needle pin is moved by a predetermined distance by the movement of the third needle pin. How to set the probe card for moving compensation. ◈Claim 16 was abandoned at the time of payment of the registration fee.◈ 13. The method of claim 12,
After placing the predetermined probe card and the wafer in a test position,
determining whether the probe needles of the predetermined probe card are aligned; and
and aligning the probe card when it is determined that the probe needles are not aligned. In the alignment method using the calibration probe card set through the 12,
placing the calibration probe card and the wafer at a test position;
forming a contact point by contacting a probe needle of the calibration probe card with a pad of the wafer;
determining whether the calibration probe card and the wafer are aligned at the test position through the process of confirming whether the contact point is formed at the set position on each of the pads; and
and changing a position at which the wafer is fixed when the contact point is not formed at a set position on each of the pads. ◈Claim 18 was abandoned when paying the registration fee.◈ 18. The method of claim 17,
The probe needle of the probe card for calibration includes a first needle part installed at a first point disposed on one area of the probe card PCB, and a second point that is an area opposite to the first point with respect to the center of the probe card PCB. A second needle part installed in the , a third needle part installed in a third point that is a different area from the first and second points, and a third needle part that is an area opposite to the third point with respect to the center of the probe card PCB Including a fourth needle part installed at 4 points,
Each of the needle parts includes a first needle pin provided so as to be capable of position correction, a second needle pin spaced apart from the first needle pin, and a reference point when the position of the first needle pin is corrected, and a predetermined distance from the first needle pin. and a third needle pin spaced apart and aligned with respect to the second needle pin to correct the position of the first needle pin when the position of the first needle pin is corrected,
The setting position is
a first line passing through the center of the first pad of the wafer in contact with the first needle pin of the first needle part and the center of the second pad of the wafer in contact with the first needle pin of the second needle part;
A calibration probe card that is a second line passing through the center of the third pad of the wafer in contact with the first needle pin of the third needle part and the center of the fourth pad of the wafer in contact with the first needle pin of the fourth needle part alignment method used. ◈Claim 19 was abandoned when paying the registration fee.◈ 19. The method of claim 18,
Changing the position at which the wafer is fixed comprises:
When the contact point formed by the first needle pin of each needle part does not contact the first line and the second line, the position of the prober is changed so that the contact point is formed on the first line and the second line Alignment method using a probe card for calibration. ◈Claim 20 was abandoned at the time of payment of the registration fee.◈ 20. The method of claim 19,
The process of changing the position of the prober is an alignment method using a calibration probe card using a chuck transfer device for a wafer chuck on which the wafer is seated.

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