KR102258464B1 - Robot hand and transporting robot - Google Patents

Abstract

The present invention prevents processing debris from adhering to the robot hand.
A first holding means 21 for holding the wafer by non-contact suction and suction by flowing air along one surface 211a, and a second holding means 22 for sucking and holding the wafer on the other surface 221a. and the holding means 21 includes a first plate member 211, a groove 213 formed on one surface 211a and one end of which is opened on the outer periphery of the plate member 211, and a groove 213 A supply path for connecting a jet port 214 that blows air from the other end toward one end of the unit 21 and a first connector 216 provided in the jet port 214 and the attachment part 12 formed inside the holding means 21 to communicate The holding means (22) includes a second plate member (221), a suction port (224) for communicating the other surface (221a) with the suction source (61), and the holding means (22). ) is a plate-shaped robot hand (2) provided with a suction path (223) which is formed inside and connects the suction port (224) and the second connection port (226) provided in the attachment part (12) attached to the robot (1). .

Description

Robot hand and transfer robot {ROBOT HAND AND TRANSPORTING ROBOT}

The present invention relates to a robot hand that holds a wafer on a processing apparatus or the like, and a transfer robot that holds a wafer and transports the wafer by the robot hand.

In a processing device such as a cutting device or a grinding device for processing semiconductor wafers, for example, a plate-shaped workpiece is taken out from the inside of a cassette disposed on a cassette stage and transported to a holding table, or after processing of the plate-shaped workpiece is completed, processing A later plate-shaped work is accommodated in a cassette. In the processing apparatus, a transfer robot for taking out a wafer from a cassette or accommodating a wafer in the cassette is arranged, and this transfer robot has a robot hand (for example, a patented See Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2013-198960

In the robot hand as described in Patent Document 1, a suction port is formed on the holding surface, and a communication path for communicating the holding surface with a suction source composed of a vacuum generator or the like is formed therein. have. Then, while the holding surface is in contact with the wafer, the suction force generated by the suction source is transmitted to the suction port on the holding surface, so that the robot hand can suction and hold the wafer.

Here, if the wafer has curvature or the surface is uneven, suction cannot be maintained. Therefore, there is a case where air is blown out from the holding surface of the robot hand to generate the Bernoulli effect, thereby adsorbing and holding the robot hand. However, since such a robot hand needs to blow out a large amount of air, and the thickness becomes thick to enlarge the flow path for circulating air in the robot hand, it may not be able to enter the cassette. Further, for example, in the invention of Japanese Patent No. 4299111, the holding part enters the cassette, but since the thickness of the robot hand is thick, it becomes impossible to enter the cassette when the thickness of the wafer becomes thick.

In addition, when the processing apparatus in which the transfer robot is disposed is, for example, a grinding apparatus, grinding chips generated by grinding may adhere to the processed wafer to be transferred, and the robot hand is brought into contact with the grinding surface of the wafer. When the wafer is held by suction, grinding debris may adhere to the holding surface of the robot hand. Then, when the robot hand in a state where the grinding debris adhered to the holding surface sucks and holds a new wafer before processing, grinding debris may adhere to the wafer before processing.

Therefore, in a robot hand that is provided in a transfer robot installed in a processing apparatus and holds a wafer to be transferred, it enters a cassette to enable the wafer to be loaded and unloaded, and processing debris such as grinding chips adheres to the holding surface to hold it. There is a problem in that the surface is not soiled and the wafer is conveyed so as not to adhere to the wafer to be processed newly.

The present invention for solving the above problems is a plate-shaped robot hand having one side for adsorbing and holding a wafer and an attachment part for attaching to the robot, wherein the one side is communicated with an air supply source to blow air, and the one side and holding means for adsorbing and holding the wafer by flowing air in a direction to generate a negative pressure, wherein the holding means includes a groove having one end open on one surface and an outer peripheral edge, and the other end of the groove. an air outlet for ejecting air from the side toward the one end; and an air supply path formed therein for communicating the air outlet and a connection port provided in the attachment portion, wherein the air ejected from the air outlet is supplied to the groove It is a robot hand that allows the wafer to be taken out from the cassette in which the wafer is stored in a shelf shape and to be stored in the cassette by flowing it through the air conditioner to generate a negative pressure on one side of the surface, thereby adsorbing and holding the wafer.

In this robot hand, a first air flow rate of an air flow rate for adsorbing and holding a wafer on the one surface in a non-contact manner by circulating air blown out from the air jet port through the groove, and air greater than the first air flow rate, is supplied to the groove and switching means for switching to a second air flow rate of an air flow rate that flows to and contacts the one surface and adsorbs and holds a wafer, wherein the switching means switches between the first air flow rate and the second air flow rate It is preferable to select non-contact and contact to maintain adsorption.

Further, the present invention is a plate-shaped robot hand having one surface for non-contactingly adsorbing and holding the wafer, the other surface for suctioning and holding the wafer, and an attachment portion for attaching to the robot, wherein the one surface is connected to an air supply source. a first holding means for adsorbing and holding the wafer by blowing air by blowing air to flow along the one side of the surface to generate a negative pressure, and a second holding means for suctioning and holding the wafer by communicating the other side with a suction source. wherein the first holding means includes: a plate-shaped first plate member; a groove formed on the one surface so that one end thereof opens on an outer peripheral side of the first plate member; the other of the groove an air outlet for blowing air from the end of the to the one end, and an air supply path formed inside the first holding means to communicate the air outlet and a first connector provided in the attachment portion; The second holding means includes a plate-shaped second plate member, a suction port for communicating a suction source with the other surface, and a second holding means formed inside the second holding means and provided with the suction port and the attachment portion. It is a robot hand provided with the suction path which connects the 2 connection ports.

In addition, the present invention for solving the above problems is a transport robot that includes a holder for mounting the attachment part of the robot hand to transport wafers, and selectively communicates with the suction source and the air supply source through a valve connected to one end. and a connection means connected to the other end of the communication path for switching between the first and second connection ports of the robot hand having a communication destination of the communication path attached to the holder, , the connecting means includes a branching portion for branching the communication path into two, a first pipe connecting the branching portion and the first connecting port, and a first pipe disposed in the first pipe and facing the branching portion from the first connecting port a first check valve for blocking the flow of air in the direction; a second pipe connecting the branch portion and the second connection port; a throttle valve disposed on the second pipe; and the second check valve in parallel with the throttle valve. It is a conveyance robot provided with the 2nd check valve which is arrange|positioned in piping and interrupts|blocks the flow of air in the direction toward the said 2nd connection port from the said branch part.

The robot hand according to the present invention is provided with holding means for adsorbing and holding a wafer by generating a negative pressure by blowing air by blowing air in communication with an air supply source, and the holding means includes: a groove having one end open on the outer periphery of the surface, an air outlet for blowing air from the other end of the groove toward the one end, and a connecting port formed therein and provided with the air outlet and the attachment portion It is equipped with an air supply path that communicates the wafer, and the air ejected from the air injection port is circulated through the groove to generate negative pressure on one side by the Bernoulli effect to adsorb and hold the wafer, so even wafers with warpage or irregularities can be suctioned and maintained. In addition, it becomes possible to form a thin robot hand, and it becomes possible to enter into the cassette.

In addition, the robot hand according to the present invention includes a first holding means for adsorbing and holding a wafer by generating negative pressure by blowing air along one side by communicating one side with an air supply source, and the other side of the robot hand. and a second holding means for suctioning and holding the wafer by communicating the surface thereof with a suction source, wherein the first holding means includes a plate-shaped first plate member and one end of the first plate member on one side of the outer periphery of the first plate member. a groove formed to open to the side, an air outlet for blowing air from the other end of the groove toward one end, and a first connector formed inside the first holding means and provided with the air outlet and the attachment portion; An air supply path for communicating with the second holding means includes a plate-shaped second plate member, a suction port for communicating the other surface with a suction source, and a suction port and an attachment portion formed inside the second holding means and a suction path for communicating the second connecting port provided in the . Therefore, the robot hand according to the present invention can selectively perform whether to keep the wafer in a contact state or a non-contact state in holding the wafer. For example, the wafer before processing is transported by being sucked and held in contact with the second holding means. After processing, the wafer on which grinding debris or the like has adhered can be transported while adsorbing and holding in a non-contact manner by the first holding means to prevent the grinding debris from adhering to the robot hand. In addition, since the robot hand is not soiled by the grinding chips adhering to the wafer after grinding, it is possible to prevent the robot hand from adhering the grinding chips to the wafer to be processed newly.

The transport robot according to the present invention has an optimal device configuration for effectively operating the robot hand according to the present invention, and transports it to a predetermined transport location without adhering grinding chips to the newly processed wafer. make it possible

1 is a perspective view showing an example of a transport robot.
Fig.2 (a) is a perspective view which shows an example of the 1st holding means in the state which made the bonding surface upward. Fig. 2B is a perspective view showing an example of the first holding means in a state in which one surface, which is a wafer suction surface, faces upward.
Fig.3 (a) is a perspective view which shows an example of the 2nd holding means in the state which made the bonding surface upward. Fig. 3B is a perspective view showing an example of the second holding means in a state in which the other surface, which is the wafer suction surface, faces upward.
4 is a cross-sectional view showing an example of a robot hand.
Fig. 5 is a cross-sectional view showing an example of a robot hand in which a first connecting port and a second connecting port are formed on one surface.
It is explanatory drawing which shows typically the structure of a connection means, a valve, and a communication path.
7 is a plan view showing an example of the first holding means having an external shape of a rectangular shape.
Fig. 8 is a plan view showing an example of the first holding means in which one groove is formed.

The transport robot 1 shown in Fig. 1 is disposed on, for example, a grinding device (not shown) to unload a wafer W stored in the cassette in a shelf shape from the cassette, or transfer the wafer W to a plate-shaped robot hand 2 ) and accommodated in the cassette, or conveyed on the holding table T, etc. are performed. The plate-shaped robot hand 2 provided in the transfer robot 1 carries one surface 211a for holding the wafer W in a non-contact manner and the other surface 221a for holding the wafer by suction. It has an attachment part 12 attached to the robot 1 .

The wafer W shown in FIG. 1 is, for example, a semiconductor wafer having a circular plate shape externally, and a plurality of devices are formed on the surface Wa of the wafer W. For example, the surface Wa is protected, not shown. The tape is adhesive and protected. The back surface Wb of the wafer W becomes a to-be-processed surface to which grinding processing etc. are given.

The robot hand 2 shown in FIG. 1 communicates with the air supply source 60 one side 211a facing downward in FIG. 1, blows air, and makes the air flow along the one side 211a, The first holding means 21 for generating a negative pressure and adsorbing and holding the wafer W, and the other surface 221a facing upward in FIG. 1 communicate with the suction source 61 to hold the wafer W A second holding means 22 for holding by suction is provided.

The first holding means 21 shown in FIGS. 2A and 2B can adsorb and hold the wafer W in a non-contact manner using Bernoulli's principle. The first holding means 21 is made of, for example, engineering plastics such as acrylic or polycarbonate, stainless steel, etc., and has an outer diameter approximately equal to the outer diameter of the disk-shaped wafer W shown in FIG. 1 in a substantially circular shape. The formed plate-shaped first plate member 211 is provided, and a rectangular base portion 212 is integrally formed on the outer periphery of the first plate member 211 . In addition, one surface 211a of the first plate member 211 has a smooth surface, and when the first plate member 211 comes into contact with the wafer W, the wafer W The end (ridge line) of one surface 211a of the first plate member 211 may be chamfered so as not to damage the first plate member 211 . The external shape of the 1st holding means 21 is not limited to a substantially circular shape, For example, as shown by the dashed-dotted line L2 in FIG.2(b), the triangular cross shape which cut off a part of a circle partly. may be formed from

A groove 213 is formed in one surface 211a of the first plate member 211 so that one end 213a is opened on the outer peripheral side of the first plate member 211 . One surface 211a of the first plate member 211 and the opposite surface serve as a bonding surface 211b joined to the second holding means 22 shown in FIG. 1 . The groove 213 extends radially at an equal angle (eg, 120 degrees) in three directions from the center of one surface 211a toward the radially outer side of the first plate member 211, for example, It is provided with the depth of the grade reaching the middle part of the thickness direction (Z-axis direction) of the 1st plate member 211 from the surface 211a. The width and depth of each groove 213 has a predetermined cross section of the same dimension. The number of grooves 213 to be formed is not limited to the number in the present embodiment, and four or more may be formed radially on one surface 211a at equal intervals in the circumferential direction. In addition, by narrowing only a part of the width|variety of the groove|channel 213, it is good also as the air passing through the inside of the groove|channel 213 in this narrowed part being accelerated|stimulated. The part on the -Y direction side from the imaginary line L1 of the base part 212 combines the 1st holding means 21 and the 2nd holding means 22 shown to Fig.3 (a), (b). In this case, the attachment part 12 shown in FIG. 1 which is attached to the conveyance robot 1 is formed. Further, for example, in the outer peripheral end portion of the first plate member 211, the wafer W in contact with the outer peripheral region of the wafer W moves in the plane direction of the first plate member 211 [that is, , side slip of the wafer W] may be provided with a guide portion. The guide portion is made of, for example, rubber or sponge, and is disposed at the outer peripheral end portion of the first plate member 211 at regular intervals in the circumferential direction so as to be displaced from one end 213a of the groove 213 . A plurality (for example, four at a 90 degree interval) is fixed.

The other end 213b of each groove 213 communicates with each air outlet 214 formed in the center of one surface 211a. Each air outlet 214 is opened toward the radial direction outer side of each one surface 211a, respectively, The air is horizontally directed from the other end part 213b of each groove|channel 213 toward one end part 213a. ejected with For example, the area of the air outlet 214 is formed smaller than the cross-sectional area of the air supply path 215 . In addition, instead of forming the air outlet 214 on one surface 211a as in the present embodiment, for example, by arranging a removable nozzle pad on one surface 211a of the first plate member 211 . Thus, the air jet port 214 may be formed in this nozzle pad.

As shown to Fig.2 (a), the inside of the 1st holding means 21, ie, from the inside of the 1st plate member 211 to the inside of the base part 212, the air supply through which air circulates. The furnace 215 is formed to extend in a straight line. In addition, the air supply path 215 is not opened on the bonding surface 211b of the 1st holding means 21. As shown in FIG. One end 215a of the air supply path 215 communicates with a first connector 216 formed from the inside of the base portion 212 toward one surface 211a and opened on the one surface 211a. are doing As shown in FIG.2(b), the other end part 215b of the air supply path 215 is communicating with each air outlet 214. As shown in FIG. The 1st coupler 216 communicates with the air supply source 60 shown in FIG. Moreover, on the air supply path 215, the orifice hole etc. which accelerate the air passing through the inside of the air supply path 215 may be formed.

The second holding means 22 shown in FIGS. 3A and 3B is made of, for example, engineering plastic such as acrylic or polycarbonate or stainless steel, and is approximately equal to the outer diameter of the disk-shaped wafer W. The plate-shaped second plate member 221 formed in a substantially circular shape having the same outer diameter is provided, and has the same shape as the first holding means 21 . In addition, when the second plate member 221 comes into contact with the wafer W, the end (ridge line) of the other surface 221a of the second plate member 221 is not damaged so as not to damage the wafer W. Chamfering may be performed. The 2nd plate member 221 is equipped with the joint surface 221b joined to the joint surface 211b of the 1st plate member 211 shown to Fig.2 (a), (b), The joint surface ( The surface on the opposite side of 221b becomes the other surface 221a on which the robot hand 2 attracts and holds the wafer W. As shown in FIG. The outer shape of the second holding means 22 is not limited to a substantially circular shape, and, for example, as shown by an imaginary dashed-dotted line L2 in FIG. When the shape is formed in the triangular cross shape which partially cut out a part of the circle, it is preferable if it is formed in the triangular cross shape similarly.

A rectangular base 222 is integrally formed on the outer periphery of the second plate member 221 . As shown to Fig.3 (a), the suction path 223 extends from the inside of the 2nd holding means 22, ie, the inside of the base part 222, to the inside of the 2nd plate member 221. is formed The suction path 223 extends the inside of the base part 222 in a straight line toward the inside of the second plate member 221 , and extends the inside of the second plate member 221 along the outer periphery of the second plate member 221 . It is formed to extend in an arc shape. In addition, the suction path 223 is not opened on the bonding surface 221b of the 2nd holding means 22. As shown in FIG.

In the second plate member 221 , a suction port 224 for communicating the other surface 221a of the second plate member 221 with the suction source 61 shown in FIG. 1 comprising a compressor, a vacuum generator, and the like. is formed in plurality. The suction ports 224 are, for example, in a group of 9 pieces of 3 × 3 in total, and each suction port 224 is formed penetrating from the suction path 223 toward the other surface 221a. and is in communication with the suction path 223 . For example, each of the suction ports 224 in a group of nine in total is spaced apart from the outer peripheral portion of the other surface 221a at an equal angle (for example, 120 degrees) in the circumferential direction, and is opened in three portions. . In addition, the shape of the suction path 223 and the arrangement number or arrangement of the suction ports 224 are not limited to this embodiment, and, for example, the suction path 223 is a second straight line inside the base part 222 . It may extend toward the center in the plate member 221, and may extend radially at an equal angle from the center in the 2nd plate member 221 toward the outer side in the radial direction. Further, the suction port 224 may be opened at four or more portions spaced apart from the outer peripheral portion of the other surface 221a at equal angles in the circumferential direction, and the diameter of the suction port 224 is enlarged. Therefore, 120 degrees apart in the circumferential direction may be spaced apart from the outer peripheral part of the other surface 221a, and you may open one by one in each of the three parts. Further, on each suction port 224, a ring-shaped suction pad made of an elastic member such as rubber may be disposed.

One end 223a on the side of the base 222 of the suction path 223 shown in Fig. 3A is formed from the inside of the base 222 toward the other surface 221a, and It communicates with the 2nd coupler 226 which opens on the surface 221a. The part on the -Y direction side from the imaginary line L1 of the base part 222 is attached to the conveyance robot 1 when the 2nd holding means 22 and the 1st holding means 21 are combined. The attachment part 12 shown in 1 is formed.

As shown in FIG. 4, in the state which superposed|polymerized the 1st holding means 21 shown to Fig.2 (a), (b), and the 2nd holding means 22 shown to Fig.3 (a), (b) Similarly, by bonding the bonding surface 211b of the first holding means 21 and the bonding surface 221b of the second holding means 22 with an appropriate bonding agent or the like, the first holding means 21 and the second holding means At (22), the robot hand (2) is assembled. In addition, by forming screw holes or the like in the first holding means 21 and the second holding means 22 so that the first holding means 21 and the second holding means 22 can be joined by screws or the like. may do

In addition, in this embodiment, although the robot hand 2 is comprised by joining two boards of the 1st board member 211 and the 2nd board member 221, 1 sheet is not joined but 1 board is used. The holding means 21 and the second holding means 22 may be configured.

Further, in this embodiment, the first coupler 216 is formed on one face 211a and the second coupler 226 is formed on the other face 221a. 211a) or the other surface 221a, the first coupler 216 and the second coupler 226 may be formed. For example, as shown in FIG. 5 , the first coupler 216 and the second coupler 226 may be formed on the other surface 221a.

The conveyance robot 1 shown in FIG. 1 is equipped with the drive part 3 which moves the robot hand 2 to a predetermined position. The driving unit 3 includes, for example, a first arm 30 , a second arm 31 , a robot hand turning means 32 for turning the robot hand 2 in the horizontal direction, and a first arm turning means ( 33) and the second arm turning means 34, and the operation is controlled by a control unit (not shown) composed of a CPU and a storage element such as a memory.

The upper surface of one end of the first arm 30 is connected to the axial robot hand turning means 32 . The upper surface of one end of the second arm 31 is connected to the lower surface of the other end of the first arm 30 via the first arm turning means 33 . A second arm turning means 34 is connected to the lower surface of the other end of the second arm 31 . And the 2nd arm turning means 34 is arrange|positioned on the Z-axis direction movement mechanism 9. As shown in FIG.

The robot hand turning means 32 rotates the robot hand 2 horizontally with respect to the 1st arm 30 by the rotational force generated by a turning drive source (not shown). The first arm turning means 33 rotates the first arm 30 horizontally with respect to the second arm 31 by a rotational force generated by a turning drive source (not shown). The second arm turning means 34 rotates the second arm 31 horizontally with respect to the Z-axis direction movement mechanism 9 by a rotational force generated by a turning drive source (not shown). Then, the operation of the Z-axis direction movement mechanism 9 is controlled by the control unit, and the robot hand 2 moves up and down in the Z-axis direction on a grinding device (not shown).

A housing 41 that rotatably supports a motor 40 having an axis in the Y-axis direction orthogonal to the vertical direction (Z-axis direction) is fixed to the upper end side of the robot hand turning means 32 . Inside the housing 41 , the rear end 40b of the motor 40 and the encoder 42 connected to the rear end 40b of the motor 40 to rotate the motor 40 are accommodated. The tip portion 40a of the motor 40 protrudes from the housing 41 in the -Y direction, and a holder 14 for mounting the attachment portion 12 of the robot hand 2 is connected to the tip portion 40a. has been As the encoder 42 rotates the motor 40, the robot hand 2 connected to the motor 40 via the holder 14 rotates, and one surface 211a of the robot hand 2 rotates. And the other side 221a of the robot hand 2 can be turned upside down. Further, the motor 40 may be configured to be movable from the housing 41 in the horizontal direction by, for example, an air cylinder or the like.

The first connecting port 216 of the first holding means 21 and the second connecting port 226 of the second holding means are the first connecting port 216 and the second connecting port 216 of the robot hand 2 attached to the holder 14 . It is connected to the connecting means (5) for switching the connector (226). For example, the other end 8a of the communication path 8 constituted by a flexible resin tube or metal pipe or the like is connected to the connecting means 5 disposed on the holder 14 . For example, the communication path 8 is arrange|positioned so that a tube can bend using the rotary joint etc. which do not show the inside of the drive part 3 . Alternatively, a tube is disposed on the outside of the driving unit 3 so as to be bendable, and the other end 8b of the communication path 8 is fixed to the side surface of the second arm turning means 34 of the driving unit 3 . It selectively communicates with the suction source 61 and the air supply source 60 through the valve (7).

The valve 7 shown in FIGS. 1 and 6 serves to switch the communication destination with the communication path 8 to either the suction source 61 or the air supply source 60, for example, as shown in FIG. It is the same solenoid (electromagnet) valve, generates a magnetic force by flowing a current through the electromagnet, and by using this magnetic force to pull and move the spool in the valve, the air flow path is changed to either the suction source (61) or the air supply source (60). It can be switched to communicate with one. In addition, the valve 7 is not limited to a solenoid valve.

As shown in FIG. 6 , the connecting means 5 communicating with either the suction source 61 and the air supply source 60 via the valve 7 and the communication path 8 connects the communication path 8 . The branching part 50 that branches into two, the first pipe 51 connecting the branching part 50 and the first connector 216 , and the first pipe 51 are disposed in the first connector 216 from the first connector 216 . A first check valve (53) for blocking the flow of air in the direction toward the branch (50), a second pipe (52) connecting the branch (50) and the second connection port (226), and a second pipe The throttle valve 54 disposed on the 52 and the second pipe 52 disposed in parallel with the throttle valve 54 to prevent the flow of air from the branch 50 toward the second connection port 226 . A second check valve 55 for shutting off is provided.

Hereinafter, when the wafer W is held by the robot hand 2 shown in Fig. 1 and the wafer W is transferred by the transfer robot 1, the operation of the robot hand 2 and the transfer robot ( The operation of 1) will be described.

First, the motor 40 rotates the connecting means 5, and the robot hand 2 is set with the other side 221a facing downward. Subsequently, the Z-axis direction movement mechanism 9 shown in Fig. 1 moves the transport robot 1 in the Z-axis direction, and the back surface Wb of the wafer W housed in a wafer cassette or the like not shown and the robot The conveying robot 1 is positioned so that the other side 221a of the hand 2 faces.

Then, the driving unit 3 turns the robot hand 2, for example, in a triangle connecting the suction ports 224 located in three parts on the other side 221a, the back surface of the wafer W ( The robot hand 2 is positioned so that the center of Wb) is located. Then, the robot hand 2 descends in the -Z direction, and the other surface 221a comes into contact with the back surface Wb of the wafer W.

The conveying robot 1 is set in a state in which the suction source 61 and the communication path 8 communicate with each other by the valve 7, and the suction source 61 shown in Figs. 1 and 6 performs suction, A flow path composed of the suction port 224 , the suction path 223 , the second connection port 226 , the connecting means 5 , the communication path 8 and the valve 7 is sucked from the other surface 221a A flow of air in the direction toward the circle 61 is generated. In the inside of the connection means 5, the 2nd check valve 55 arrange|positioned in the 2nd piping 52 shown in FIG. 6 is opened, The direction which goes toward the suction source 61 from the other surface 221a. of the air passes through the second check valve (55). Since the first check valve 53 is not opened in the first pipe 51 , the flow of air in the first pipe 51 does not occur. When the flow of air in the direction toward the suction source 61 is generated from the other surface 221a, a suction force is generated on the other surface 221a of the second plate member 221, and by this suction force, The wafer W is sucked and held in a contact state by the robot hand 2 .

The drive unit 3 drives the robot hand 2, and the wafer W suctioned and held by the robot hand 2 is unloaded from a wafer cassette (not shown) and transferred to the holding table T shown in FIG. 1 . . The holding table T shown in FIG. 1 has, for example, a circular external shape, a holding part T1 made of a porous member, etc., for holding the wafer W by suction, and a frame T2 for supporting the holding part T1. ) is provided. The robot hand 2 holding the back surface Wb of the wafer W by suction causes the back surface Wb of the wafer W to be on the upper side, and the wafer W is placed on the holding table T. . The holding part T1 communicates with a suction source (not shown), and the suction force generated by the suction source's suction is transmitted to the holding surface T1a, so that the holding table T holds the wafer W on the holding surface T1a. keep aspiration In addition, the suction source 61 is operated by the valve 7 so that the suction by the suction source 61 is stopped, and the communication path 8 in a state of being in communication with the suction source 61 communicates with the air supply source 60 . ) and the air source 60 are switched. Then, the air supply source 60 supplies air to the connecting means 5 through the valve 7 and the communication path 8 . The supplied air passes through the throttle valve 54 of the connecting means 5, passes through the second connection port 226, the suction path 223, and the suction port 224, to the other side of the robot hand 2 A small amount of air is ejected downward from the surface 221a. The vacuum suction force remaining between the other surface 221a and the wafer W is destroyed by the jet pressure of the air, so that the wafer W can be reliably detached from the robot hand 2 . Then, the wafer W is removed from the other surface 221a of the robot hand 2, the holding table T holds the wafer W, and the robot hand 2 is placed on the holding table T. retreat from

Further, when air is supplied from the air supply source 60 as described above, air is ejected from the other surface 221a and air is also ejected from the one surface 211a.

The wafer W held by the holding table T with the back surface Wb facing upward is ground to a predetermined thickness by grinding from the back surface Wb side by a grinding means (not shown). During grinding, the back surface Wb of the wafer W is washed with washing water, but the grinding debris that has not been completely cleaned is in a state adhering to the back surface Wb of the wafer W. The wafer W on which the grinding process has been completed is unloaded from the holding table T by the transport robot 1 .

In carrying out the wafer W from the holding table T, first, the motor 40 rotates the connecting means 5, and the robot hand 2 moves with one side 211a facing downward. is set Then, the drive part 3 makes the robot hand 2 turn, and the Z-axis direction movement mechanism 9 shown in FIG. 1 moves the conveyance robot 1 in the Z-axis direction, and the holding table T ), the transfer robot 1 is positioned so that the rear surface Wb of the wafer W held with the rear surface Wb side facing up and the one surface 211a of the robot hand 2 face each other. make it

Then, the robotic hand 2 descends in the -Z direction to a position where one side 211a of the robotic hand 2 and the back side Wb of the wafer W do not contact each other. After the robot hand 2 descends to a predetermined position in the Z-axis direction, the air supply source 60 supplies air at a predetermined pressure toward the valve 7 . Since the conveying robot 1 is set in a state in which the air supply source 60 and the communication path 8 are in communication by the valve 7, the valve 7, the communication path 8, the connecting means 5, A flow of air in a direction from the air supply source 60 toward the first holding surface 211a occurs in the flow path composed of the first connection port 216 , the groove 213 , and the air jet port 214 . Inside the connecting means 5 , the first check valve 53 disposed in the first pipe 51 is opened, and the air supplied from the air supply source 60 passes through the first check valve 53 . Goes. In the second pipe 52, the second check valve 55 is not opened, but a small amount of air reduced by the throttle valve 54 passes through the second connection port 226 and is ejected from the other surface 221a. . That is, when air is supplied from the air supply source 60, air is ejected from both surfaces of the one surface 211a and the other surface 221a.

The air jetted from the air jet port 214 flows through the inside of each groove|channel 213 formed on one surface 211a at high speed toward a radial direction. Here, for example, since the cross-sectional area of the air supply path 215 shown in Fig. 2(a) is smaller than the cross-sectional area of the air jet port 214 shown in Fig. 2(b), the air outlet ( When moving to 214 , the flow velocity of the air is accelerated, and the static pressure increases to draw in surrounding air to generate an adsorption force for adsorbing the wafer W . In addition, when air flows in the radial direction at high speed in a steady state in each of the linear grooves 213, the air around both sides of the groove 213 is drawn into the groove 213 by the Bernoulli effect, A negative pressure is generated in the vicinity of the groove 213 , thereby generating an attraction force to the wafer W. Then, the robot hand 2 adsorbs and holds the wafer W in a non-contact state on one surface 211a.

After the robot hand 2 suction-holds the wafer W in a non-contact manner, the suction-holding of the wafer W by the holding table T is released. Further, when the robot hand 2 rises in the +Z direction, the wafer W is unloaded from the holding table T. The drive unit 3 rotates the robot hand 2 holding the processed wafer W in a non-contact manner, and the processed wafer W is conveyed to a wafer cleaning apparatus or the like. The robot hand 2 carrying the wafer W after processing moves in order to transport the wafer W to be processed again.

In addition, one surface 211a of the robot hand 2 is provided with a throttle valve (not shown) between the air supply source 60 and the valve 7 to control the flow rate of air supplied to the check valve 53 side. By adjusting, the wafer W may be adsorbed and held in a non-contact state. In that case, by increasing the flow rate of the supplied air, it is also possible to make the wafer W in contact with the one surface 211a and to be held by suction. That is, the throttle valve has a first air flow rate for adsorbing and holding the wafer on one side of the throttle valve in a non-contact manner, and a second air flow rate at which air larger than the first air flow rate flows through the groove to contact one side of the throttle valve to adsorb and hold the wafer It can function as a switching means for switching to The side slip of the wafer W can be prevented by bringing the wafer W into contact with one surface 211a and adsorbing and holding the wafer W by the one surface 211a.

As described above, the robot hand 2 according to the present invention can selectively perform whether to maintain the wafer W in a contact state or a non-contact state in holding the wafer W, and as described above, the wafer W before processing. is brought into contact with the other surface 221a of the second holding means 22 so that it can be transported by suction, and the processed wafer W to which grinding chips, etc. are attached is transferred to the first holding means 21. It can be conveyed while adsorbing and holding in a non-contact manner to prevent grinding debris from adhering to the robot hand 2 . And, since the robot hand 2 is not stained by the grinding debris adhering to the wafer W after grinding, the robot hand 2 adheres the grinding debris to the wafer W to be newly processed. can be prevented from being thrown out.

The transport robot 1 according to the present invention can make the robot hand 2 efficiently perform the operation to which the grinding debris does not adhere, and without adhering grinding debris to the wafer W to be newly processed. It makes it possible to transport to a predetermined transport location.

In addition, the robot hand 2 and the conveying robot 1 which concern on this invention are not limited to the said embodiment, Moreover, each structure of the robot hand 2 and the conveying robot 1 shown in an accompanying drawing is The size, shape, etc. are also not limited thereto, and can be appropriately changed within the range in which the effect of the present invention can be exhibited. For example, about the 1st holding means 21, there exist various embodiment shown below.

For example, the 1st holding means 23 shown in FIG. 7 consists of engineering plastics, such as acrylic or polycarbonate, or stainless steel, etc., The 1st plate member 231 of a rectangular plate shape, and the 1st plate member ( 231) and a rectangular base portion 232 formed integrally with the base portion 232 is provided. In one surface 231a of the first plate member 231, a groove 233 is formed in a straight line so that one end 233a opens on the outer peripheral side of the tip of the first plate member 231, and one surface 231a serves as a surface for adsorbing and holding the wafer W in a non-contact manner. The end face of the other end 233b of the groove 233 communicates with one air outlet 234 formed in the center of the one face 231a to open toward the surface direction of the one face 231a, have. The air ejection port 234 ejects air from the other end 233b of the groove 233 toward the one end 233a. In the interior of the first holding means 23 , that is, from the air outlet 234 to the interior of the base 232 , two air supply paths 235 through which air flows are formed so as to extend linearly. As shown in FIG. 7 , the other end 235a of the two air supply passages 235 merges into one and communicates with the air outlet 234 . One end 235b of each air supply path 235 is formed from the inside of the base portion 232 toward one surface 231a, and each first connector 236 is opened on the one surface 231a. is communicating with Each of the first couplers 236 communicates with the air supply source 60 shown in FIG. 1 . Moreover, on each air supply path 235, the orifice hole etc. which accelerate the air passing through the inside of the air supply path 235 may be formed. In addition, a suction port communicating with a suction source is provided on the other surface opposite to one surface 231a, and the second holding means formed in a rectangular shape similarly to the first holding means 23 is joined. Further, the first coupler 236 and the second coupler for connecting to the suction source may be disposed on the same surface, either on the side of one face 231a or on the other face side opposite to the face 231a. .

For example, like the 1st holding means 24 shown in FIG. 8, the 1st plate member 231 of the 1st holding means 23 shown in FIG. 7 is the outer fabric of the disk-shaped wafer W shown in FIG. It may be changed to a plate-shaped first plate member 241 formed in a substantially circular shape having an outer diameter that is substantially the same as the course. About the structure except the point which changed the 1st plate member 231 to the 1st plate member 241, the 1st holding means 24 and the 1st holding means 23 are comprised similarly. The part on the -Y direction side from the imaginary line L1 of the base part 232 of the 1st plate member 231 shown in FIG. 7 and the 1st plate member 241 shown in FIG. 8 is the conveyance robot shown in FIG. (1) to form an attachment to be attached to.

1: Transport robot 12: Attachment part
14: holder 2: robot hand
21: first holding means 211: first plate member
211a: one side of the robot hand 211b: the bonding surface of the first plate member
212: base 213: groove
213a: one end of the groove 213b: the other end of the groove
214: air outlet 215: air supply path
215a: one end of the air supply path 215b: the other end of the air supply path
216: first connection port 22: second holding means
221: second plate member 221a: the other side of the robot hand
221b: bonding surface of the second plate member 222: base portion
223: suction path 223a: one end of the suction path
224: suction port 226: second connection port
3: drive unit 30: first arm
31: second arm 32: robot hand turning means
33: first arm turning means 34: second arm turning means
40: motor 40a: front end of the motor
40b: rear end of the motor 41: housing
42: Encoder 9: Z-axis direction movement mechanism
7: valve 8: communication path
5: connection means 50: branch
51: first pipe 52: second pipe
53: first check valve 54: throttle valve
55: second check valve 60: air supply
61: suction source W: wafer
Wa: the surface of the wafer Wb: the back surface of the wafer
T: holding table T1: adsorption part
T1a: Retaining surface T2: Frame

Claims (4)

A plate-shaped robot hand having one surface for sucking and holding a wafer, the other surface for sucking and holding the wafer, and an attachment portion for attaching to the robot, the robot hand comprising:
First holding means for adsorbing and holding the wafer by generating negative pressure by blowing air by blowing air by communicating the one surface with an air supply source and flowing air in the direction of the one surface, and connecting the other surface to the suction source to hold the wafer and a second holding means for holding the
The first holding means includes a plate-shaped first plate member, a groove formed on the one surface with one end opening on the outer periphery of the first plate member, and from the other end of the groove. an air jet port for blowing air toward the one end, and an air supply path formed inside the first holding means to communicate the air jet port with a first connection port provided in the attachment portion;
The second holding means includes a plate-shaped second plate member, a suction port for communicating a suction source with the other surface, and a second holding means formed inside the second holding means and provided with the suction port and the attachment portion. A robot hand comprising a suction path for communicating two connection ports. A transfer robot comprising a holder for attaching the attachment portion of the robot hand according to claim 1 to transfer a wafer,
a communication path selectively communicating with the suction source and the air supply source through a valve connected to one end thereof;
connecting means connected to the other end of the communication path to connect a communication point of the communication path to the first and second connection ports of the robot hand mounted on the holder;
The connecting means includes a branching portion for branching the communication path into two, a first pipe connecting the branching portion and the first connecting port, and a direction from the first connecting port toward the branching portion disposed in the first pipe a first check valve for blocking the flow of air, a second pipe connecting the branching portion and the second connection port, a throttle valve disposed in the second pipe, and the second pipe in parallel with the throttle valve and a second non-return valve disposed at the junction to block the flow of air in a direction from the branching portion toward the second connection port. delete delete

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