KR102243530B1 - Antenna package and image display device including the same - Google Patents

Abstract

An antenna package of the embodiments of the present invention includes an antenna element, a first printed circuit board electrically connected to the antenna element, and a second printed circuit board which has lower ductility than the first printed circuit board and is integrated with the first printed circuit board. The combination of the first and second printed circuit boards may shorten the antenna signal path and improve circuit connection reliability and signal efficiency.

Description

Antenna package and image display device including the same TECHNICAL FIELD [ANTENNA PACKAGE AND IMAGE DISPLAY DEVICE INCLUDING THE SAME}

The present invention relates to an antenna package and an image display device including the same. More specifically, it relates to an antenna package including an antenna element and a driving integrated circuit, and an image display device including the same.

With the recent development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are combined with an image display device and implemented in the form of, for example, a smartphone. In this case, an antenna may be coupled to the image display device to perform a communication function.

With the recent evolution of mobile communication technology, an antenna for performing communication in an ultra-high frequency band corresponding to, for example, 3G to 5G needs to be coupled to the image display device.

However, when the driving frequency of the antenna increases, signal loss may increase, and as the length of the transmission path increases, the degree of signal loss may further increase.

In addition, when an intermediate circuit structure such as a flexible printed circuit board (FPCB) is used to electrically connect the driving integrated circuit chip and the antenna for antenna feeding/driving control, additional signal loss may occur. .

In addition to the FPCB, an additional circuit board may be added to mount the driving integrated circuit chip. In this case, a signal path between the antenna and the driving integrated circuit chip may be additionally increased, so that signal loss may be further increased.

In addition, as the image display device becomes thinner and the display area increases, a space in which an antenna can be mounted may decrease.

For example, Korean Patent Laid-Open No. 2003-0095557 discloses an antenna structure embedded in a portable terminal, but therefore, an antenna design capable of implementing high-frequency driving while preventing signal loss within a limited space is required.

Korean Patent Application Publication No. 2003-0095557

An object of the present invention is to provide an antenna package having improved operational reliability and signal efficiency.

An object of the present invention is to provide an image display device including an antenna package having improved operational reliability and signal efficiency.

1. Antenna element; A first printed circuit board electrically connected to the antenna element; And a second printed circuit board having a lower ductility than the first printed circuit board and integrated with the first printed circuit board.

2. The antenna package according to the above 1, wherein the first printed circuit board is a flexible printed circuit board, and the second printed circuit board is a rigid printed circuit board.

3. In the above 1, the first printed circuit board includes a core layer and an antenna circuit wiring layer formed on the core layer, and the second printed circuit board includes insulating layers and internal wiring layers that are alternately and repeatedly stacked. Including, antenna package.

4. The antenna package according to 3 above, wherein the first printed circuit board is inserted into an intermediate layer of the second printed circuit board.

5. The antenna package according to the above 4, wherein an outermost insulating layer among insulating layers of the second printed circuit board is stacked on the first printed circuit board.

6. The antenna package of the above 5, further comprising a driving integrated circuit (IC) chip disposed on the outermost insulating layer.

7. The method of claim 6, further comprising: a first via structure electrically connecting the driving IC chip and the antenna circuit wiring layer of the first printed circuit board; And

The antenna package further comprising a second via structure electrically connecting at least one of the internal wiring layers of the driving IC chip and the second printed circuit board to each other.

8. The antenna package of the above 7, wherein the first via structure penetrates the outermost insulating layer, and the second via structure penetrates the outermost insulating layer and the first printed circuit board.

9. The antenna package according to 3 above, wherein the first printed circuit board is stacked on the outermost insulating layer of the second printed circuit board.

10. The antenna package of the above 9, further comprising a photo solder resist (PSR) layer formed on the first printed circuit board.

11. The antenna package of the above 10, further comprising a driving integrated circuit (IC) chip stacked on the PSR layer,

12. The antenna package of the above 3, wherein the first printed circuit board further includes a ground layer facing the antenna circuit wiring layer with the core layer interposed therebetween.

13. The antenna package according to the above 3, wherein the core layer includes a soft resin, and the insulating layer includes a resin impregnated with inorganic fibers.

14. In the above 3, the antenna element includes a radiation electrode, a transmission line extending from the radiation electrode, and a signal pad connected to one end of the transmission line, wherein the signal pad and the antenna circuit wiring layer are electrically connected, Antenna package.

15. The method of 1 above, wherein the first printed circuit board includes a circuit wiring layer, the second printed circuit board includes an inner wiring layer,

The antenna package further comprising a third via structure electrically connecting the circuit wiring layer and the inner wiring layer to each other.

16. An image display device comprising the antenna package according to the above-described embodiments.

In the antenna package according to embodiments of the present invention, a flexible printed circuit board (FPCB) connected to an antenna element is integrated on a rigid printed circuit board, and a driving integrated circuit chip is mounted on the rigid printed circuit board. I can make it.

Accordingly, while shortening the signal path between the flexible printed circuit board and the antenna element, heat resistance and mechanical stability required during the driving integrated circuit chip mounting process can be secured.

In addition, while the flexible printed circuit board is integrated with the rigid printed circuit board, an electronic device such as an RLC circuit device may be packaged together in an antenna package, and space utilization of an image display device to which the antenna package is applied may be improved.

1 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments.
2 is a schematic plan view illustrating an antenna element included in an antenna package according to exemplary embodiments.
3 is a schematic plan view illustrating an antenna element included in an antenna package according to some exemplary embodiments.
4 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.
5 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.
6 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments.
7 is a schematic plan view illustrating an image display device according to exemplary embodiments.

Embodiments of the present invention provide an antenna package in which a first printed circuit board and a second printed circuit board having different ductility are integrated, and an antenna element and a driving integrated circuit chip are included together. In addition, an image display device including the antenna package is provided.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to the present specification illustrate preferred embodiments of the present invention, and serve to further understand the technical idea of the present invention together with the contents of the present invention, so that the present invention is described in such drawings. It is limited to the matters and should not be interpreted.

The terms “first”, “second”, “upper”, “lower”, “top”, and “bottom” used in this application do not designate an absolute position, but distinguish between different configurations or It is used to distinguish relative positions.

1 is a schematic cross-sectional view illustrating an antenna package according to exemplary embodiments.

Referring to FIG. 1, the antenna package may include a first printed circuit board 180, an antenna element 100, a second printed circuit board 200, and a driving integrated circuit (IC) chip 260.

The first printed circuit board 180 may have a higher ductility than the second printed circuit board 200. According to example embodiments, the first printed circuit board 180 may be a flexible printed circuit board (FPCB).

The first printed circuit board 180 may include a core layer 160 including a flexible resin and an antenna circuit wiring layer 170 formed on the core layer 160.

For example, the core layer 160 may include a flexible resin such as polyimide resin, Modified Polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), and the like. In a preferred embodiment, the core layer 160 may include polyimide resin or MPI.

The antenna circuit wiring layer 170 may include a feed wiring for supplying power from the driving IC chip 260 to the antenna element 100. An end of the antenna circuit wiring layer 170 may be electrically connected to a signal pad 132 (see FIG. 2) included in the antenna element 100.

The second printed circuit board 200 may have higher hardness or lower ductility than the first printed circuit board 180. According to example embodiments, the second printed circuit board 200 may be a rigid printed circuit board.

The second printed circuit board 200 may include insulating layers 210 and internal wiring layers 220. The insulating layer 210 may include inorganic fibers such as glass fibers or a resin (eg, epoxy resin) impregnated with inorganic particles. For example, the insulating layer 210 may be manufactured from a prepreg. For example, the insulating layer 210 may have a higher glass transition temperature Tg than the core layer 160 of the first printed circuit board 180.

The insulating layers 210 and the internal wiring layers 220 may be alternately and repeatedly stacked. For example, a first inner wiring layer 220a is disposed on the first insulating layer 210a, and a second insulating layer 210b covering the first inner wiring layer 220a is disposed on the first insulating layer 210a. Can be stacked. A second inner wiring layer 220b may be disposed on the second insulating layer 210b, and a third insulating layer 210c covering the second inner wiring layer 220b may be stacked on the second insulating layer 210b.

For example, the second printed circuit board 200 may be manufactured from a copper clad laminate (CCL).

According to example embodiments, the first printed circuit board 180 may be inserted as an intermediate layer of the second printed circuit board 200. For example, the first printed circuit board 180 may be disposed between the inner insulating layers 210 included in the second printed circuit board 200.

For example, as shown in FIG. 1, a first printed circuit board 180 is disposed on a third insulating layer 210c, and a fourth insulating layer 210d is disposed on the first printed circuit board 180 Can be placed.

In some embodiments, a part of the first printed circuit board 180 is inserted into the second printed circuit board 210 as described above, and the first printed circuit board 180 is a second printed circuit board 210. ) Can be electrically connected to the antenna element 100 by extending to the outside.

In some embodiments, the fourth insulating layer 210d stacked on the first printed circuit board 180 may be the outermost insulating layer of the second printed circuit board 200. The outermost insulating layer may refer to an uppermost insulating layer of the second printed circuit board 200. According to example embodiments, the fourth insulating layer 210d may be disposed directly on the first printed circuit board 180.

A driving IC chip 260 may be disposed on the second printed circuit board 200. According to example embodiments, the driving IC chip 260 may be mounted on the fourth insulating layer 210d of the second printed circuit board 200. The driving IC chip 260 may be directly mounted on the fourth insulating layer 210d through a surface mounting technology, or may be mounted using conductive balls, solder, resist, or the like.

The driving IC chip 260 may include a via structure for connecting to wirings of the first printed circuit board 180 and the second printed circuit board 200.

The via structure may include, for example, a first via structure 230 electrically connecting the antenna pad of the driving IC chip 260 and the antenna circuit wiring layer 170 of the first printed circuit board 180. . For example, the first via structure 230 may pass through the fourth insulating layer 210d and may be in contact with or electrically connected to the antenna circuit wiring layer 170.

The via structure may include, for example, a second via structure 240 electrically connecting the logic pad of the driving IC chip 260 and the inner wiring layer 220 of the second printed circuit board 200. For example, the second via structure 240 may pass through the fourth insulating layer 210d and the first printed circuit board 180 to be electrically connected to the inner wiring layer 220.

As described above, the first and second printed circuit boards 180 and 200 having different ductility may be combined into one package. While securing the flexibility of the antenna package through the first printed circuit board 180 connected to the antenna element 100, the second printed circuit board 200 prevents a high-temperature process included in the mounting of the driving IC chip 260. Sufficient heat resistance and mechanical stability can be secured.

In addition, by inserting the first printed circuit board 180 to the upper portion of the second printed circuit board 200 so as to be adjacent to the driving IC chip 260, a signal path between the driving IC chip 260 and the antenna element 100 is formed. It can shorten and improve antenna feeding efficiency. Accordingly, it is possible to secure antenna radiation characteristics with a sufficient gain amount with reduced signal loss.

For example, the package may be bent through a portion of the first printed circuit board 180 that is exposed to the outside of the second printed circuit board 200. In this case, the driving IC chip 260 may be bent together with the second printed circuit board 200 to be disposed, for example, on the rear or side of the image display device. Accordingly, it is possible to efficiently connect, for example, to the main board of the image display device without affecting the image realization of the image display device.

2 is a schematic plan view illustrating an antenna element included in an antenna package according to exemplary embodiments.

Referring to FIG. 2, the antenna element 100 may include an antenna pattern disposed on the dielectric layer 90. The antenna pattern may include a radiation electrode 110, a transmission line 120, and a pad 130.

The dielectric layer 90 includes polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; Cellulose resins such as diacetyl cellulose and triacetyl cellulose; Polycarbonate resin; Acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; Styrene resins such as polystyrene and acrylonitrile-styrene copolymer; Polyolefin resins such as polyethylene, polypropylene, polyolefin having a cyclo-based or norbornene structure, and ethylene-propylene copolymer; Vinyl chloride resin; Amide resins such as nylon and aromatic polyamide; Imide resin; Polyethersulfone resin; Sulfone resin; Polyether ether ketone resin; Sulfide polyphenylene resin; Vinyl alcohol resin; Vinylidene chloride resin; Vinyl butyral resin; Allylate resin; Polyoxymethylene resin; It may contain a thermoplastic resin such as an epoxy resin. These may be used alone or in combination of two or more.

The dielectric layer 90 may include a thermosetting resin such as (meth)acrylic, urethane, acrylic urethane, epoxy, silicone, or an ultraviolet curable resin. In some embodiments, the dielectric layer 90 may include an adhesive material such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

In some embodiments, the dielectric layer 90 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

In some embodiments, the dielectric constant of the dielectric layer 90 may be adjusted in the range of about 1.5 to 12. When the dielectric constant exceeds about 12, the driving frequency is excessively reduced, so that driving in a desired high frequency band may not be implemented.

The radiation electrode 110 has, for example, a polygonal plate shape, and the transmission line 120 extends from one side of the radiation electrode 110 to be electrically connected to the signal pad 130. The transmission line 120 may be formed as a single member substantially integral with the radiation electrode 110.

In some embodiments, the pad 130 includes a signal pad 132 and may further include a ground pad 134. For example, a pair of ground pads 134 may be disposed with the signal pad 132 interposed therebetween. The ground pads 134 may be electrically separated from the signal pad 132 and the transmission line 120.

In one embodiment, the ground pad 134 may be omitted. Further, the signal pad 132 may be provided as an integral member at the end of the transmission line 120.

The signal pad 132 may be electrically connected to the driving IC chip 260 through the antenna circuit wiring layer 170 of the first printed circuit board 180. Accordingly, power supply and driving control to the radiation electrode 110 may be performed through the antenna driving IC chip.

In some embodiments, the signal pad 132 and the antenna circuit wiring layer 170 may be bonded to each other through a conductive intermediate structure such as an anisotropic conductive film (ACF).

The antenna pattern is silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium. (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca) or an alloy thereof. These may be used alone or in combination of two or more.

For example, the antenna pattern may include silver (Ag) or a silver alloy to implement low resistance, and for example, may include a silver-palladium-copper (APC) alloy.

The antenna pattern may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), cadmium tin oxide (CTO), and the like.

In some embodiments, the radiation electrode 110 and/or the transmission line 120 is, for example, a two-layer structure of a metal layer-a transparent conductive oxide layer or a three-layer structure of a transparent conductive oxide layer-a metal layer-a transparent conductive oxide layer. It can also have a structure. In this case, while the flexible property is improved by the metal layer, resistance may be lowered, and corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

In some embodiments, the antenna element 100 may further include a ground layer facing the radiation electrode 110 with the dielectric layer 90 interposed therebetween. In this case, the radiation directivity (eg, vertical radiation) of the radiation electrode 110 may be further promoted.

3 is a schematic plan view illustrating an antenna element included in an antenna package according to some exemplary embodiments.

Referring to FIG. 3, the radiation electrode 110 may have a mesh structure. In some embodiments, the transmission line 120 connected to the radiation electrode 110 may also have a mesh structure.

As the radiation electrode 110 includes a mesh structure, even when the radiation electrode 110 is disposed in the display area of the image display device, the transmittance is improved, thereby preventing electrode visibility and image quality from deteriorating.

A dummy mesh electrode 140 may be disposed around the radiation electrode 110 and the transmission line 120. The dummy mesh electrode 140 may be electrically and physically spaced apart from the radiation electrode 110 and the transmission line 120 and the separation region 145.

For example, a mesh conductive layer may be formed on the dielectric layer 90. Thereafter, the mesh conductive layer may be partially etched along the profiles of the radiation electrode 110 and the transmission line 120 to form the separation region 145. Accordingly, a part of the mesh conductive layer may be converted into a dummy mesh electrode 140.

In some embodiments, the pad 130 may be formed in a solid structure to reduce the power supply resistance. For example, the pad 130 may be disposed in a non-display area or a light blocking area of the image display device. Accordingly, the pad 130 may be disposed outside the user's viewing area.

4 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments. Detailed descriptions of configurations and structures that are substantially the same as or similar to those described with reference to FIG. 1 are omitted.

Referring to FIG. 4, the first printed circuit board 180 may further include a ground layer 172. For example, the antenna circuit wiring layer 170 may be formed on the upper surface of the core layer 160, and the ground layer 172 may be formed on the lower surface of the core layer 160.

For example, as the ground layer 172 faces the antenna circuit wiring layer 170 and the core layer 160 therebetween, noise around the antenna circuit wiring layer 170 may be absorbed or shielded. Accordingly, the reliability of power supply/signal transmission between the driving IC chip 260 and the antenna element 100 may be further improved.

The second via structure 240 may be electrically connected to the inner wiring layer 220 by passing through the antenna circuit wiring layer 170, the core layer 160, and the ground layer 172 together, for example.

5 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments. Detailed descriptions of configurations and structures that are substantially the same as or similar to those described with reference to FIG. 1 are omitted.

Referring to FIG. 5, the first printed circuit board 180 may be stacked on the second printed circuit board 200. For example, the first printed circuit board 180 may be stacked on the outermost insulating layer (eg, the third insulating layer 210c) of the second printed circuit board 200.

A photo solder resist (PSR) layer 250 may be formed on the first printed circuit board 180. The photo solder resist layer 250 may include a photosensitive organic polymer commonly used in the field of circuit board packaging.

Since the photo solder resist layer 250 having excellent high temperature heat resistance is laminated on the first printed circuit board 180, it is possible to more effectively prevent thermal damage to the first printed circuit board 180 when the driving IC chip 260 is mounted. I can.

In addition, since the photo solder resist layer 250 capable of fine etching through a photo process is used, more conductive pads for connection to the internal wirings 220 may be included in the driving IC chip 260, for example. .

The first via structure 230 and the second via structure 240 pass through the photo solder resist layer 250 and are electrically connected to a wiring layer included in the first printed circuit board 180 and the second printed circuit board 200, respectively. Can be connected to.

6 is a schematic cross-sectional view illustrating an antenna package according to some exemplary embodiments. Detailed descriptions of configurations and structures that are substantially the same as or similar to those described with reference to FIG. 1 are omitted.

Referring to FIG. 6, the antenna package includes a circuit wiring layer (for example, an antenna circuit wiring layer 170) included in a first printed circuit board 180 and an inner wiring layer 220 of the second printed circuit board 200. A third via structure 245 may be further included to electrically connect the cells to each other. For example, the third via structure 245 may penetrate the core layer 160 and at least one insulating layer 210 of the plurality of insulating layers 210.

In some embodiments, the second printed circuit board 200 may further include a fourth via structure 247 electrically connecting the inner wiring layers 220 to each other in the insulating layer 210.

7 is a schematic plan view illustrating an image display device according to exemplary embodiments.

Referring to FIG. 7, the image display device 300 may be implemented in the form of, for example, a smart phone, and FIG. 6 shows a front portion or a window surface of the image display device 300. The front portion of the image display device may include a display area 310 and a peripheral area 320. The peripheral area 320 may correspond to, for example, a light blocking portion or a bezel portion of an image display device.

The antenna element 100 included in the above-described antenna package may be disposed under the front portion of the image display device, and may be disposed on, for example, a display panel. In an embodiment, the radiation electrode 110 may at least partially overlap the display area 310. In this case, the radiation electrode 110 may include a mesh structure, and a decrease in transmittance due to the radiation electrode 110 may be prevented. The driving IC chip 260 included in the antenna package may be disposed in the peripheral area 320 to prevent image quality deterioration in the display area 310.

In some embodiments, the antenna package may be disposed toward the rear surface of the image display device 300. The antenna package is bent through the first printed circuit board 180 so that, for example, the second printed circuit board 200 and the driving IC chip 260 are interposed between the main board and the rear cover of the image display device 300. Can be placed.

As described above, the first and second printed circuit boards 180 and 200 are integrated to package the driving IC chip 260 and the antenna element 100 into a single device structure. Accordingly, an image display device equipped with a thin, high-reliability communication function can be implemented using the antenna package.

90: dielectric layer 100: antenna element
110: radiation electrode 120: transmission line
130: pad 132: signal pad
134: ground pad 160: core layer
170: antenna circuit wiring layer 172: ground layer
180: first printed circuit board 200: second printed circuit board
210: insulating layer 220: inner wiring layer
250: photo solder resist layer 260: driving integrated circuit chip

Claims (13)

Antenna element;
A first printed circuit board comprising a core layer and an antenna circuit wiring layer formed on an upper surface of the core layer, and electrically connected to the antenna element through the antenna circuit wiring layer;
A second printed circuit board integrated with the first printed circuit board; And
A driving integrated circuit (IC) chip stacked on an upper surface of the second printed circuit board positioned on the upper surface of the core layer,
The first printed circuit board is inserted into the intermediate layer of the second printed circuit board and extends to the outside of the second printed circuit board to be electrically connected to the antenna element. The antenna package of claim 1, wherein the first printed circuit board is a flexible printed circuit board, and the second printed circuit board is a rigid printed circuit board. The antenna package of claim 1, wherein the second printed circuit board includes insulating layers and internal wiring layers that are alternately and repeatedly stacked. The antenna package of claim 3, wherein an uppermost insulating layer among the insulating layers of the second printed circuit board is stacked on the first printed circuit board. The antenna package according to claim 4, wherein the driving integrated circuit (IC) chip is disposed on the uppermost insulating layer. The method of claim 5, wherein the second printed circuit board
A first via structure electrically connecting the driving IC chip and the antenna circuit wiring layer of the first printed circuit board; And
The antenna package further comprising a second via structure electrically connecting at least one of the internal wiring layers of the driving IC chip and the second printed circuit board to each other. The antenna package of claim 6, wherein the second printed circuit board further comprises a third via structure electrically connecting the circuit wiring layer and the inner wiring layer to each other. The antenna package of claim 6, wherein a first via structure penetrates the uppermost insulating layer, and the second via structure penetrates the uppermost insulating layer and the first printed circuit board. The antenna package of claim 4, wherein the top insulating layer is a photo solder resist (PSR) layer. The antenna package of claim 3, wherein the first printed circuit board further comprises a ground layer facing the antenna circuit wiring layer with the core layer interposed therebetween. The antenna package of claim 3, wherein the core layer includes a soft resin, and the insulating layer includes a resin impregnated with inorganic fibers. The method according to claim 3, wherein the antenna element comprises a radiation electrode, a transmission line extending from the radiation electrode, and a signal pad connected to one end of the transmission line,
The antenna package, wherein the signal pad and the antenna circuit wiring layer are electrically connected. An image display device comprising the antenna package of claim 1.

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