KR102232030B1 - Camera Module - Google Patents

Abstract

A camera module according to an embodiment of the present invention includes a printed circuit board on which an image sensor is mounted; A housing unit disposed on the printed circuit board; A holder module disposed spaced apart from the bottom surface of the housing unit by a predetermined distance, winding a first coil on the outer circumferential surface, and including at least one lens therein; A wiring unit disposed above the holder module and including an electronic circuit pattern layer; A plate member coupled to the bottom surface of the holder module; And a plurality of wire springs having one end connected to the wiring unit and the other end connected to the plate member.

Description

Camera Module

The present invention relates to a camera module.

Camera modules for ultra-compact and low power consumption are difficult to apply technologies such as VCM, which have been used in conventional camera modules, and related research has been actively conducted.

In the case of a camera module mounted on a small electronic product such as a smartphone, the camera module may be frequently shocked during use, and the camera module may be slightly shaken due to the user's hand shake during shooting. In view of this point, in recent years, development of a camera module in which a hand shake prevention means is additionally installed on the camera module is required.

The OIS module is usually classified into a lens shift that moves the lens in the horizontal direction according to the object to be moved in the X and Y axes, a sensor shift that moves the image sensor in the horizontal direction, and the module tilt that moves the AF module in the horizontal direction.

Korean Patent Registration No. 10-1200711 (2012.11.07.) Korean Patent Registration No. 10-0952620 (2010.04.08.)

An object of the present invention is to provide a camera module having an optical image stabilizer (OIS) function.

A camera module according to an embodiment of the present invention includes a printed circuit board on which an image sensor is mounted; A housing unit disposed on the printed circuit board; A holder module disposed spaced apart from the bottom surface of the housing unit by a predetermined distance, winding a first coil on the outer circumferential surface, and including at least one lens therein; A wiring unit disposed above the holder module and including an electronic circuit pattern layer; A plate member coupled to the bottom surface of the holder module; And a plurality of wire springs having one end connected to the wiring unit and the other end connected to the plate member.

The holder module includes an outer blade having a first coil wound on an outer circumferential surface thereof; It may include; a bobbin disposed in the center of the outer blade, the lens disposed therein, and a second coil fixed to an outer circumferential surface.

The wiring unit may be formed of an electronic circuit pattern layer integrally formed on the surface of the housing unit.

The electronic circuit pattern layer may be formed on at least one of an exposed surface and an inner surface of the housing unit.

The electronic circuit pattern layer may further include a metal layer formed of a conductive material by any one of coating and plating.

The housing unit may include a first housing disposed above the printed circuit board; A second housing disposed above the first housing; First and second permanent magnets interposed between the first and second housings; And a yoke disposed between the first and second permanent magnets or positioned on inner surfaces of the first and second housings to transmit magnetic force into the holder module, and includes, and includes, an upper surface of the first housing and the first surface of the first housing. Wall surfaces of one side of the first and second housings may be covered by the electronic circuit pattern layer.

The yoke may have a central portion facing the holder module protruding.

The electronic circuit pattern layer may be integrally formed on the first and second housing surfaces.

It may further include a shield can having a through hole at a position corresponding to the connection portion between the wiring unit and the wire spring and the lens module, and installed to surround the housing unit.

The holder module includes upper and lower elastic members respectively disposed on the upper and lower sides of the bobbin to elastically support the bobbin with respect to the outer blade, wherein the center of the first coil has a magnetic force toward the second coil. A space part can be formed so that it can be invested.

In the electronic circuit pattern layer, a terminal portion may be integrally formed at a portion connected to the printed circuit board.

The wire spring may be formed of a metal material, and may be connected to the plate member so as to be energized.

At least six wire springs may be provided, and two polarities for auto-focusing control and four polarity power supplies for OIS driving may be supplied to the holder module through a connection with a wiring unit.

The wire springs are of the same length and are disposed at a corner portion of the holder module by two, so that a total of eight wire springs may be provided.

Since the wiring unit that supplies power to the wire spring can be configured by forming an electronic circuit pattern layer instead of the conventional FPCB, it is possible to provide a highly reliable camera module with less risk of disconnection due to external impact.

In addition, although it may be formed on a separate surface of the substrate, it is also possible to form integrally with the existing housing unit 20, thereby saving space for FPCB installation, which is advantageous for miniaturization of the camera module.

1 is a schematic plan view of a camera module according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along AA in FIG. 1,
3 and 4 are side views of a camera module according to an embodiment of the present invention,
5 is a view showing an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention;
6 is a schematic plan view of a camera module having an electronic circuit pattern layer according to another embodiment of the present invention, and,
7 is a diagram illustrating an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1 is a schematic plan view of a camera module according to an embodiment of the present invention, FIG. 2 is an AA cross-sectional view of FIG. 1, and FIGS. 3 and 4 are side views of the camera module according to an embodiment of the present invention, and FIG. 5 Is a view showing an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention, Figure 6 is a schematic plan view of a camera module having an electronic circuit pattern layer according to another embodiment of the present invention, and , FIG. 7 is a diagram illustrating an example of a housing unit having an electronic circuit pattern layer according to an embodiment of the present invention.

As shown in FIG. 2 showing a schematic plan view of FIG. 1 and a schematic side view showing an AA cross section of FIG. 1, a camera module according to an embodiment of the present invention includes a printed circuit board 10 and a housing unit ( 20), a holder module 30, a plate member 40, a wiring unit 50, a wire spring 60, and an electronic circuit pattern layer 100.

In the printed circuit board 10, the image sensor 11 is mounted approximately in the vicinity of the center, and it is preferable that the printed circuit board 10 is provided as a PCB board. Components for operation of the image sensor 11 may be disposed on the printed circuit board 10, or a plurality of terminal portions may be provided to supply power and output information of the image sensor 11.

The housing unit 20 is disposed above the printed circuit board 10 and forms a skeleton of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, a first and second permanent magnets 23 and 24, and a yoke 25. Includes.

The first housing 21, as a base, is disposed on the upper surface of the printed circuit board 10 and is provided to be spaced apart from the image sensor 11 by a predetermined distance. If necessary, a filter member capable of filtering an image incident on the image sensor 11 may be further installed in the first housing 21.

The second housing 22 is disposed above the first housing 21 and is configured to cover the first housing 21. An opening is formed at a corresponding position so that an image can be transmitted to the image sensor 11 in an approximate center of the second housing 22. A wiring unit 50 to be described later may be disposed on the upper side of the second housing 22.

The first and second permanent magnets 23 and 24 are interposed between the first and second housings 21 and 22 to inject magnetic force into the holder module 30. The first and second permanent magnets 23 and 24 may have the same size. In addition, the first and second permanent magnets 23 and 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings if possible within the design tolerance.

On the other hand, if the size of the first and second permanent magnets 23 and 24 increases, the OIS drive increases even with a small current, and if the size of the first and second permanent magnets 23 and 24 is constant, In this case, as the current flowing through the first and second coils 31a and 32a disposed at positions corresponding to the first and second permanent magnets 23 and 24 increases, the OIS drive increases. In conclusion, the larger the size of the first and second permanent magnets 23, 24, the better the OIS drive, but the optimum size can be designed within other design tolerances.

The yoke 25 is interposed between the first and second permanent magnets 23 and 24. In addition, the yoke 25 is provided with a protruding shape around the center so that the magnetic force of the first and second permanent magnets 23 and 24 can be invested into the inner space of the holder module 30. Preferably, the width is provided the same as the first and second permanent magnets 23, 24, and the center protrudes to a certain size so that the permanent magnet and the yoke are formed to have an approximately "T" shape. desirable.

The holder module 30 is disposed spaced apart from the inner bottom surface of the housing unit 20 by a predetermined distance, and includes an outer blade 31 and a bobbin 32. The holder module 30 may perform a pendulum motion in the front/rear/left/right and diagonal directions while being suspended from the wire spring 60.

Elastic members 35 and 36 are provided on the upper and lower sides of the outer blade 31, and the bobbin 32 may be elastically supported in vertical movement by the elastic member 35.

As shown in FIG. 1, the outer blade 31 has a total of four first coils 31a to 31d wound around the outer circumferential surfaces of the four sides, and the central portion of the four sides on which the coils 31a to 31d are wound. It is pierced without a coil. The yoke 25 is disposed at a position corresponding to the opened space, and the yoke 25 may be partially inserted into the space.

The plate member 40 may be fixed to the bottom surface of the outer blade 31 with a fixing member 33 such as double-sided tape or an adhesive. The outer blade 31 is front, rear, left, right or left, as shown in the arrow of FIG. 2, according to the interaction between the magnetic force of the first and second permanent magnets 22, 23 and the first coils 31a to 31d. It is suspended by a plurality of wire springs 60 so as to be movable diagonally, and is spaced apart from the bottom surface of the first housing 21 by a predetermined distance.

In addition, the outer blade 31 may be provided with a plurality of spring through-holes 37 so that the wire spring 60 can pass through and be connected to the plate member 40.

The bobbin 32 is disposed so that the outer blade 31 is movable upward and downward, and at least one or more lenses 34 are installed therein. A second coil 32a is wound on the outer circumferential surface of the bobbin 32, the second coil 32a is the first coils 31a to 31d of the outer blade 31 through the yoke 25 The operation of raising and lowering the bobbin 32 is performed by interaction with the magnetic force invested through the empty space. The larger the size of the yoke 25, the better the AF driving, but this may also vary according to the optimum design value. It is possible to automatically adjust the focus of the image transmitted to the image sensor 11 by the lifting action of the bobbin 32 as described above.

The plate member 40 is preferably formed of a metal material capable of energization, and is disposed on the bottom surface of the outer blade 31 as described above, and can supply power to the first and second coils 31a and 32a. So that the wire spring 60 is connected. The connection method can be any method as long as it can be connected by soldering or other conductive material. That is, the connection portion (w') of the plate member 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, and through the wire spring 60 The supplied power is transmitted to the first and second coils 31a and 32a to form an electromagnetic force.

At this time, in the case of the second coil 32a, it may be directly connected to the plate member 40, and as shown in FIG. 2, first, after being connected to the lower spring 36, the lower spring 36 It is also possible to connect with the plate member 40.

The wiring unit 50 may be disposed above the second housing 22, and the power delivered through the terminal portion 52 of the wiring unit 50 connected to the printed circuit board 10 is the plate member It is transmitted to the plate member 40 through the wire spring 60 connected as shown in (40). The connection method can be any method as long as it can be connected by soldering or other conductive material.

The wiring unit 50 is provided to cover one side wall of the first and second housings 21 and 22, as shown in FIGS. 2 to 4, wherein the first and second permanently A window 55 is formed on a surface facing the magnets 23 and 24 and the yoke 25, so that interference with them may be avoided. This is a configuration to avoid this, since the first and second permanent magnets 23 and 24 and the yoke 25 are generally directly attached to the shield can 70 to be described later with a fixing means such as epoxy.

According to an embodiment of the present invention, the wiring unit 50 may form a wiring using a technique of forming the electronic circuit pattern layer 100 on the surface, as shown in FIGS. 2 and 5.

The above techniques can be broadly divided into three techniques.

First, the first method is a plating method through double molding, and the body part constituting the wiring unit 50 and the part constituting the externally exposed sidewall surface on which the electronic circuit pattern layer 100 are provided are made of synthetic resins of different materials. Can be injection molded. In this case, the body portion of the base 20 is ejected from an insulating material, and the sidewall portion to form the electronic circuit pattern layer 100 is ejected using a conductive synthetic resin, or the portion to form the electronic circuit pattern layer 100 is ejected. This is a method of completing the electronic circuit pattern layer 100 in a subsequent process such as electroplating after injection molding the wiring unit 50 by injection using a synthetic resin that is easy to perform metal plating.

In the second method, when the wiring unit 50 is ejected, the electronic circuit pattern layer is formed by injection molding in a state that contains impurities that react to light and heat, and through surface work such as laser exposure on the injection-molded wiring unit 50. The electronic circuit pattern layer 100 may be formed on the exposed sidewall surface on which the 100 is to be formed by performing laser exposure.

In the third method, the entire surface of the wiring unit 50 is metallized to form the electronic circuit pattern layer 100 on the exposed surface.

On the other hand, it is also possible to further form a metal layer formed by any one of coating and plating with a conductive material on the surface of the electronic circuit pattern layer 100 formed in the first to third methods.

According to another embodiment of the present invention, as shown in FIGS. 6 and 7, the electronic circuit pattern layer 100 is formed on the surfaces of the first and second housings 21 and 22 instead of the wiring unit 50. It is also possible to directly form ). In this case, the electronic circuit pattern layer 100 may replace the role of the wiring unit 50. Then, since the electronic circuit pattern layer 100 is formed directly on the surface of the first and second housings 21 and 22 to supply power to the wire spring 60, the wiring unit 50 It is possible to prevent the occurrence of a short circuit.

As described above, when wiring is formed with the electronic circuit pattern layer 100, the terminal portion 52 shown in FIGS. 2 and 6 may also be integrally formed with the electronic circuit pattern layer 100, or a separate It is also possible to be formed by attaching a terminal module made of a metal material.

According to this configuration, it is possible to minimize the occurrence of problems such as disconnection due to external impact, and since a space for separately disposing the wiring unit 50 by an FPCB or the like is not required, it is advantageous for miniaturization of the camera module.

Both ends of the wire spring 60 are connected to the plate member 40 and the wiring unit 50. At this time, one end of the wire spring 60 is connected to the wiring unit 50, as shown in FIG. 2, and the wire spring 60 connected to the wiring unit 50 connects the terminal portion 52 Power supplied through is supplied to the plate member 40 so that the first and second coils 31a and 32a can interact with the first and second permanent magnets 23 and 24. .

In addition, the other end of the wire spring 60, as shown in Figure 2, passing through the spring through hole 37 formed in the outer blade 31, a plate member installed on the bottom surface of the outer blade 31 It is connected with (40). At this time, the other end of the wire spring 60 is connected by a pad (not shown) formed on the plate member 40 like the wiring unit 50, although not shown, and the center of the pad (not shown) A through hole (not shown) through which the wire spring 60 passes is formed. The connection method can be any method as long as it can be connected by soldering or other conductive material. According to this configuration, the outer blade 31 may be suspended from the wire spring 60 and spaced apart from the bottom surface of the first housing 21 by a predetermined distance or more. Then, according to the interaction between the first coil 31a and the first and second permanent magnets 23 and 24, the outer blade 31 performs a pendulum motion, and the outer blade ( It is possible to correct the vibration of 31) by the interaction of the first coil 31a and the first and second permanent magnets 23 and 24. To this end, it is preferable that the wire spring 60 is made of a metal material that has elasticity and can conduct electricity so as to withstand an impact.

On the other hand, as the thickness of the wire spring 60 is thinner, the motion for correcting hand shake is improved even with a small current, but this may vary depending on the optimum design value. Preferably, the thickness of the wire spring 60 is several ㎛ to hundreds ㎛, preferably it is good to have a 1 to 100㎛.

In addition, it is preferable that at least six wire springs 60 are provided, and at least two polarities for auto-focusing control and four polarity power supplies for hand shake correction motion and hand shake correction are connected to the wiring unit 50. It is necessary to supply to the holder module 30 through.

According to a preferred embodiment of the present invention, as shown in Figs. 1 and 2, it is good to have a total of eight provided and balanced, each having two of the same length and arranged at the corners of the holder module 30. .

Meanwhile, as shown in FIG. 2, when a separate third housing such as a shield can 70 is further included, as described above, the wiring unit 50 includes the first and second permanent magnets 23 ) (24) and the yoke (25) are fixedly coupled to the shield can (70) with epoxy or the like, in order to avoid this coupling portion, a window (55) is formed to the first and second housings (21). Cover the side wall of (22).

The shield can 70 has a through hole at a position corresponding to the holder module 30 around the connection part w of the wiring unit 50 and the wire spring 60, and the housing units 21 and 22 It can be installed to wrap around.

Meanwhile, as shown in FIG. 2, hook units 80 may be provided on four or at least one or more surfaces to fix the shield can 70 to the first housing 21. The location may be within the range allowed by the center or edge design, and the number may be provided as one or a plurality.

The hook unit 80 may include a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shield can 70 facing the hook 81, and If necessary, the reverse can also be configured.

The embodiments of the present invention described above and illustrated in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those of ordinary skill in the technical field of the present invention can improve and change the technical idea of the present invention in various forms. Therefore, such improvements and changes will fall within the scope of the present invention as long as it is apparent to those of ordinary skill in the art.

10; Printed circuit board 20; Housing unit
21; First housing 22; Second housing
23; First permanent magnet 24; 2nd permanent magnet
25; York 30; Holder module
31; Outer blade 31a; 1st coil
32; Bobbin 32a; 2nd coil
40; Wiring unit 50; Wiring unit
52; Terminal 60; Wire spring
70; Shield can 80; Hook unit
100; Electronic circuit pattern layer

Claims (20)

Base;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and an elastic member connecting the outer blade and the bobbin;
A second coil disposed on the bobbin;
A permanent magnet for moving the bobbin through interaction with the second coil;
A first coil for moving the holder module through interaction with the permanent magnet;
A wire connected to the holder module; And
Including an electronic circuit pattern layer electrically connected to the second coil,
The wire is electrically connected to the electronic circuit pattern layer,
The wire includes 4 wires,
The base includes a first corner part, a second corner part disposed opposite the first corner part with respect to the optical axis, and a third corner part and a fourth part disposed between the first corner part and the second corner part. Including a corner,
Each of the four wires is disposed at a position corresponding to the first to fourth corner portions of the base. The method of claim 1,
The electronic circuit pattern layer is a camera shake correction device formed on the outer surface of the base. The method of claim 1,
The electronic circuit pattern layer is a camera shake correction device electrically connected to the elastic member. The method of claim 1,
The electronic circuit pattern layer includes a plurality of terminals,
The plurality of terminals includes two terminals for focusing and four terminals for camera shake correction,
The two terminals for focusing are electrically connected to the second coil,
The four terminals for correcting the camera shake are electrically connected to the first coil. The method of claim 1,
The electronic circuit pattern layer is a camera shake correction device formed through plating. The method of claim 1,
The base contains impurities,
The impurities of the base are formed into the electronic circuit pattern layer by laser exposure. The method of claim 1,
The four wires are image stabilization device that is symmetrically arranged with respect to the optical axis. The method of claim 1,
The electronic circuit pattern layer includes a first portion including a surface facing upward and a second portion including a surface facing sideways. The method of claim 1,
The elastic member includes an upper elastic member coupled to an upper portion of the bobbin and a lower elastic member coupled to a lower portion of the bobbin. The method of claim 1,
The first coil includes four coils,
The second coil is a camera shake correction device formed of a single coil. The method of claim 1,
Including a shield can covering the base,
The base is formed to protrude from the base and comprises a hook for fixing the shield can. The method of claim 1,
The wire is formed of a metal material and has a thickness of 1 to 100㎛ camera shake correction device. The method of claim 1,
An image stabilization device comprising a solder connecting an end of the wire to the outer blade of the holder module. Printed circuit board;
An image sensor disposed on the printed circuit board;
The image stabilization device of claim 1 disposed on the printed circuit board; And
A camera module including a lens coupled to the bobbin of the image stabilization device. A smartphone comprising the camera module of claim 14. Printed circuit board;
An image sensor disposed on the printed circuit board;
A base disposed on the printed circuit board;
A holder module including an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and an elastic member connecting the outer blade and the bobbin;
A second coil disposed on the bobbin;
A permanent magnet for moving the bobbin through interaction with the second coil;
A first coil for moving the holder module through interaction with the permanent magnet;
A wire connected to the holder module; And
Including an electronic circuit pattern layer electrically connected to the second coil,
The wire and the electronic circuit pattern layer electrically connect the second coil and the printed circuit board,
The wire includes 4 wires,
The base includes a first corner part, a second corner part disposed opposite the first corner part with respect to the optical axis, and a third corner part and a fourth part disposed between the first corner part and the second corner part. Including a corner,
Each of the four wires is disposed at a position corresponding to the first to fourth corner portions of the base. The method of claim 16,
The electronic circuit pattern layer is a camera module formed on an outer surface of the base. The method of claim 16,
The electronic circuit pattern layer is a camera module electrically connected to the second coil through the elastic member and the wire. The method of claim 16,
The four wires are arranged symmetrically with respect to the optical axis camera module. The method of claim 16,
Camera module including a filter member coupled to the base.

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