KR102212922B1 - Resin Composition - Google Patents

Abstract

The present application relates to a resin composition with improved curing speed. The present application also relates to a battery module having excellent heat dissipation performance after curing.

Description

Resin Composition

The present application relates to a resin composition.

The present application also includes a battery module including a cured product of the resin composition; And to a battery pack including the battery module.

The secondary battery includes a nickel cadmium battery, a nickel hydride battery, a nickel zinc battery, or a lithium secondary battery. A typical example is a rechargeable lithium battery, and a rechargeable lithium battery mainly uses lithium oxide and a carbon material as a positive electrode active material and a negative electrode active material, respectively.

A secondary battery includes an electrode assembly in which a positive electrode plate and a negative electrode plate to which a positive electrode active material and a negative electrode active material are applied, respectively, are disposed with a separator therebetween, and a packaging material for sealing and receiving the electrode assembly together with an electrolyte. Secondary batteries can be classified into can-type and pouch-type according to the shape of the exterior material.

In recent years, secondary batteries are widely used not only in small devices such as portable electronic devices, but also in mid- to large-sized devices such as automobiles and power storage devices.

When a secondary battery is used in such a medium or large-sized device, a large number of secondary batteries are electrically connected to increase capacity and output. Pouch-type secondary batteries are widely used in such medium and large-sized devices due to advantages such as low weight, low manufacturing cost, and easy shape transformation.

A structure stored in a case after electrically connecting a plurality of secondary batteries is called a battery module, and a resin composition is used to stably fix the secondary battery to the battery module. Patent Document 1 discloses a curable resin composition applied to a battery module.

After curing, the resin composition was filled with a high content filler in order to have excellent heat dissipation performance, and a dispersant was used to improve the dispersibility of the high filled filler. However, the dispersant has a problem in that the productivity of the battery module is deteriorated by lowering the curing speed of the resin composition.

Therefore, there is a need for a resin composition having an improved curing rate.

Korean Patent Publication No. 2016-0105354

An object of the present application is to provide a resin composition having an improved curing speed.

Another object of the present application is to provide a battery module having excellent heat dissipation performance after curing.

In the case where the measurement temperature affects the result among the physical properties mentioned in the present specification, the corresponding physical property is the physical property measured at room temperature, unless otherwise specified. The term room temperature is a natural temperature that is not heated or reduced, and is usually about a temperature in the range of about 10°C to 30°C, or about 23°C or about 25°C. In addition, unless specifically stated otherwise in the specification, the unit of temperature is °C.

In the case where the measured pressure affects the result among the physical properties mentioned in the present specification, the corresponding physical property is the physical property measured at normal pressure, unless otherwise specified. The term atmospheric pressure is a natural temperature that is not pressurized or depressurized, and usually about 1 atmosphere is referred to as atmospheric pressure.

In an example related to the present application, the present application relates to a resin composition used in a battery module or battery pack. Specifically, the resin composition of the present application is a composition that is injected into the case of the battery module and is used to fix the battery cell in the battery module by contacting one or more battery cells present in the battery module, as described below. I can. The resin composition of the present application may be, for example, an adhesive composition.

The resin composition is a curing agent for the main resin; A first inorganic filler; It includes an oxide and a dispersing agent, and satisfies the following General Formula 1.

[General Formula 1]

A <B

In General Formula 1, A is the adsorption energy (eV) of the oxide and the dispersant, and B is the adsorption energy (eV) of the oxide and the curing agent.

The adsorption energy can be obtained by using a plane wave-based density functional theory using a VASP code.

In one example, in the general formula 1, B has an adsorption energy of about 1.5 eV or more, 2.0 eV or more, 2.5 eV or more, 3.0 eV or more, 3.5 eV or more, 4.0 eV or more, 4.5 eV or more, or about 5.0 eV or more. It can be big. Meanwhile, although the upper limit is not particularly limited, B may have an adsorption energy of about 10.0 eV or less, 8.0 eV or less, or about 6.0 eV or less than A.

The fact that the adsorption energy of the oxide and the curing agent is greater than the adsorption energy of the oxide and the dispersant means that the oxide is better adsorbed to the dispersant than the curing agent.

The dispersant improves the dispersibility of the first inorganic filler in the resin composition, and may be adsorbed with the curing agent to lower the curing speed of the resin composition. However, when an oxide that satisfies the general formula 1 is added to the resin composition, the oxide is adsorbed with the dispersant, so that the dispersant adsorbed with the curing agent can be reduced. Therefore, when the oxide satisfying the general formula 1 is included in the resin composition, the curing speed of the resin composition can be accelerated.

In the present application, the term dispersibility means a property in which the first inorganic filler is uniformly distributed in the resin composition.

The term curing agent for the main resin may refer to only a curing agent, and may refer to a state in which the main resin and the curing agent are mixed. Accordingly, the resin composition may include a curing agent, a first inorganic filler, an oxide and a dispersant, or may include a main resin, a curing agent, a first inorganic filler, an oxide and a dispersant.

In one example, the resin composition is a curable main resin cured with a curing agent; A first inorganic filler; oxide; And a dispersing agent, and the following general formula 2 is satisfied.

[General Formula 2]

A <B

In Formula 2, A is the adsorption energy (eV) of the oxide and the dispersant, and B is the adsorption energy (eV) of the oxide and the curing agent.

The adsorption energy can be obtained by the above-described density functional theory.

The meaning of the subject resin cured with the curing agent may mean a state in which the subject resin is cured by reacting with the curing agent.

When the oxide satisfying the general formula 2 is included in the resin composition, the curing speed of the resin composition may be accelerated.

In one example, the resin composition may further satisfy the following General Formula 3.

[General Formula 3]

A <C

In General Formula 3, A is the adsorption energy (eV) of the oxide and the dispersant and C is the adsorption energy (eV) of the first inorganic filler and the dispersant.

The adsorption energy can be obtained by the above-described density functional theory.

On the other hand, in the present application, the resin composition is a resin composition containing a curing agent, a first inorganic filler, an oxide and a dispersant for the following main resin, or a resin composition including a curable main resin cured with a curing agent, a first inorganic filler, an oxide and a dispersant Can mean

In one example, C in the general formula 3 has an adsorption energy of about 0.1 eV or more, 0.5 eV or more, 1.0 eV or more, 1.5 eV or more, 2.0 eV or more, 2.5 eV or more, 3.0 eV or more, 3.5 eV or more, or about A. It may be greater than 4.0 eV, or C may have an adsorption energy of about 12.0 eV or less, 10.0 eV or less, or about 8.0 eV or less than A.

When the above general formula 3 is satisfied, the first inorganic filler is advantageous in promoting the curing speed of the resin composition while having dispersibility in the resin composition.

In one example, the adsorption energy of the oxide and the dispersant may be from about -10.0 eV to about -1.5 eV. In another example, the adsorption energy of the oxide and the dispersant may be about -9.5 eV or more, -9.0 eV or more, -8.0 eV or more, -7.5 eV or more, -7.0 eV or more, or about -6.5 eV or more, and about -2.0 eV or less, It may be -2.5 eV or less, -3.0 eV or less, -3.5 eV or less, or about -4.0 eV or less.

When the adsorption energy of the oxide and the dispersant falls within the above range, it is advantageous to satisfy General Formula 1 or Formula 2. Therefore, the resin composition can accelerate the curing speed while having dispersibility.

In one example, the oxide included in the resin composition is not particularly limited as long as it satisfies the general formula 1 or 2, and as an example, the oxide may be sodium oxide (Na ₂ O).

Oxide may be individually added to the resin composition, or may be added by being included in other components constituting the resin composition, or may be added individually and may be added by being included in other components constituting the resin composition. The other component may be a main resin, a curing agent, a first inorganic filler or a dispersant.

Incorporating individually means that it is not included in the other components constituting the resin composition, but is separately added to the resin composition.

On the other hand, being included in another component constituting the resin composition may mean that, for example, when the other component is a first inorganic filler, an oxide is included and added to the first inorganic filler. The first inorganic filler introduced into the resin composition may be an inorganic filler having a purity of 100%, and may be an inorganic filler not having a purity of 100%. When the first inorganic filler is not 100% pure, oxides may be included in components other than the first inorganic filler.

On the other hand, the purity of 100% means, for example, when alumina to be described later is added as the first inorganic filler, no components other than alumina are included, and only the alumina component is added as the first inorganic filler.

The oxide may be included in an amount of about 0.04 parts by weight to about 1 part by weight based on 100 parts by weight of the first inorganic filler. As another example, the oxide may be about 0.05 parts by weight or more, 0.07 parts by weight or more, 0.08 parts by weight or more, 0.09 parts by weight or more, 0.1 parts by weight or more, 0.2 parts by weight or more, or about 0.3 parts by weight or more, based on 100 parts by weight of the first inorganic filler, It may be about 0.9 parts by weight or less, 0.8 parts by weight or less, 0.7 parts by weight or less, or about 0.6 parts by weight or less.

If the oxide exceeds 1 part by weight relative to 100 parts by weight of the first inorganic filler, the content of the oxide may be high, thereby reducing dispersibility. On the other hand, if the oxide is less than 0.04 parts by weight relative to 100 parts by weight of the first inorganic filler, the content of the oxide is low, so that the curing rate of the resin composition due to the use of the dispersant cannot be sufficiently reduced.

Therefore, when the oxide is included in the resin composition within the above range relative to 100 parts by weight of the first inorganic filler, it is advantageous in accelerating the curing speed of the resin composition while having dispersibility.

As an example, the resin composition includes a dispersant. When an excessive amount of the first inorganic filler is applied to the resin composition, the dispersibility of the first inorganic filler is deteriorated, the viscosity of the resin composition is greatly increased, and thus the handleability of the resin composition is deteriorated. By including a dispersant, the dispersibility of the first inorganic filler is improved and the viscosity of the resin composition is lowered, thereby improving the handling properties of the resin composition.

The dispersant of the present application is not particularly limited as long as it is a dispersant that satisfies the general formula 1 or 2 above. As an example, the dispersant may be a phosphate ester anionic dispersant.

The phosphoric acid ester anionic dispersant may be a compound represented by Formula 1 below.

[Formula 1]

In Formula 1, R ₁ to R ₄ are each independently an alkyl group having 1 to 10 carbon atoms, l or m are each independently a prime number of 1.0 to 5.5, and n is a prime number of 4.5 to 15.0.

The compound represented by Chemical Formula 1 may include, for example, phosphoric acid polyester.

In the case of using the phosphate ester anionic dispersant represented by Chemical Formula 1, it is advantageous to satisfy General Formula 1 or Formula 2. Therefore, when using a resin composition containing a phosphate ester anionic dispersant represented by Formula 1, it is possible to accelerate the curing speed of the resin composition while having dispersibility.

The dispersant may contain less than about 1 part by weight based on 100 parts by weight of the first inorganic filler. As another example, the first inorganic filler may be less than about 0.9 parts by weight, less than 0.8 parts by weight, less than 0.7 parts by weight, less than 0.6 parts by weight, or less than about 0.5 parts by weight, based on 100 parts by weight of the first inorganic filler, and about 0.02 parts by weight or more, 0.05 parts by weight or more. , 0.1 parts by weight or more, or about 0.15 parts by weight or more.

If the dispersant is about 10 parts by weight or more based on 100 parts by weight of the first inorganic filler, the curing speed of the resin composition can be significantly reduced, and if it is less than about 0.01 parts by weight based on 100 parts by weight of the first inorganic filler, the first inorganic filler in the resin composition The dispersibility of is worse.

When the dispersant is included in the resin composition within the above range, it is possible to accelerate the curing speed of the resin composition while having dispersibility.

In one example, a room temperature curable composition may be used as the resin composition. The room temperature curable composition means a composition in which the curing reaction of the resin composition starts at room temperature and proceeds at room temperature. For example, immediately after the base resin and the curing agent are mixed at room temperature, curing starts at room temperature, and curing proceeds while being maintained at room temperature.

The room temperature curable resin composition may be, for example, a two-component resin composition containing a main resin and a curing agent. As the main resin, a silicone resin, a polyol resin, an epoxy resin, or an acrylic resin may be used. Meanwhile, a known curing agent suitable for the main resin may be used as the curing agent. For example, if the main resin is a silicone resin, the curing agent may use a siloxane compound, if the main resin is a polyol resin, an isocyanate compound may be used for curing, and if the main resin is an epoxy resin, the curing agent may use an amine compound. In addition, when the main resin is an acrylic resin, an isocyanate compound may be used as the curing agent.

In one example, the resin composition may be a two-component urethane resin composition. The two-component urethane resin composition may be cured by reacting at room temperature with a main resin including polyol and a curing agent including isocyanate.

The curing reaction can be aided by catalysts, for example. Accordingly, the two-part urethane-based composition may include a state in which the main resin (polyol) and the curing agent (isocyanate) are separated, mixed, or reacted.

The catalyst may be, for example, a tin-based catalyst. As an example of the tin-based catalyst, dibutyltin dilaurate (DBTDL) may be used. The catalyst may be greater than about 0.01 parts by weight to less than about 0.5 parts by weight based on 100 parts by weight of the total amount of the resin included in the resin composition, that is, the polyol resin and the isocyanate. As an example, the catalyst is more than about 0.01 parts by weight, more than 0.02 parts by weight, more than 0.03 parts by weight, more than 0.04 parts by weight, more than 0.05 parts by weight, more than 0.06 parts by weight, 0.07 parts by weight, based on 100 parts by weight of the total content of the polyol resin and isocyanate. May be greater than, greater than 0.08 parts, greater than 0.09 parts, greater than 0.1 parts, greater than 0.12 parts, or greater than about 0.14 parts, and less than about 0.5 parts, less than 0.4 parts, less than 0.3 parts, 0.25 parts Or less than about 0.20 parts by weight.

When the content of the catalyst is less than 0.01 parts by weight relative to the total content of the polyol resin and isocyanate, the curing speed of the resin composition is slow, and thus the time required to manufacture one battery module (or process tact time) Is increased, and the battery module production rate is lowered. On the other hand, when the content of the catalyst is 0.5 parts by weight or more based on 100 parts by weight of the total content of the polyol resin and isocyanate, the curing speed of the resin composition is fast, and thus the load ratio of the injection equipment of the resin composition increases.

Since the two-part urethane-based composition may contain a main resin containing at least a polyol resin and a curing agent containing at least an isocyanate, the cured product of the resin composition includes both the polyol-derived unit and the polyisocyanate-derived unit. I can. In this case, the polyol-derived unit may be a unit formed by urethane reaction of a polyol with a polyisocyanate, and the polyisocyanate-derived unit may be a unit formed by urethane reaction of a polyisocyanate and a polyol.

In one example, an ester polyol resin may be used as the polyol resin included in the subject matter. When using an ester polyol, it is advantageous in satisfying the viscosity range of the resin composition described later.

Meanwhile, the ester polyol may be amorphous or a polyol having sufficiently low crystallinity. In the present specification, “amorphous” refers to a case where the crystallization temperature (Tc) and melting temperature (Tm) are not observed in the DSC (Differential Scanning calorimetry) analysis described later. At this time, the DSC analysis can be performed within the range of -80 to 60°C at a rate of 10°C/min, for example, heating from 25°C to 60°C at the rate and then reducing the temperature to -80°C, It can be made in a manner of raising the temperature to 60 ℃ again. In addition, "sufficiently low crystallinity" in the above means that the melting point (Tm) observed in the DSC analysis is less than 15°C, about 10°C or less, 5°C or less, 0°C or less, -5°C or less, -10 It means the case of about -20℃ or less. At this time, the lower limit of the melting point is not particularly limited, but, for example, the melting point may be about -80°C or higher, -75°C or higher, or about -70°C or higher. When the polyol is crystalline or does not satisfy the melting point range (at room temperature) when crystallinity is strong, it may be difficult to satisfy the viscosity range of the resin composition to be described later because the difference in viscosity according to temperature tends to be large.

In one example, as the ester polyol, for example, a carboxylic acid polyol or caprolactone polyol may be used.

The carboxylic acid polyol may be formed by reacting a component including a carboxylic acid and a polyol (ex. diol or triol, etc.), and the caprolactone polyol includes caprolactone and a polyol (ex. diol or triol, etc.) It can be formed by reacting a component. In this case, the carboxylic acid may be a dicarboxylic acid.

In one example, the polyol may be a polyol represented by Formula 2 or 3 below.

[Formula 2]

[Formula 3]

In Formulas 2 and 3, X is a unit derived from a carboxylic acid, and Y is a unit derived from a polyol. The unit derived from the polyol may be, for example, a triol unit or a diol unit. Further, n and m may be any number, for example, n is a natural number in the range of 2 to 10, m is a natural number in the range of 1 to 10, and R ₁ and R ₂ are each independently carbon number 1 to 14 It is an alkylene within the range of.

The term “carboxylic acid-derived unit” used herein may mean a portion of a carboxylic acid compound excluding a carboxyl group. Similarly, the term “polyol-derived unit” used herein may mean a portion of the polyol compound structure excluding a hydroxy group.

That is, when the hydroxy group of the polyol and the carboxyl group of the carboxylic acid react, the water (H ₂ O) molecule is desorbed by the condensation reaction, thereby forming an ester bond. When the carboxylic acid forms an ester bond by the condensation reaction as described above, the carboxylic acid-derived unit may mean a portion of the carboxylic acid structure that does not participate in the condensation reaction. In addition, the polyol-derived unit may mean a portion of the polyol structure that does not participate in the condensation reaction.

In addition, Y in Formula 3 also represents a portion excluding the ester bond after the polyol forms an ester bond with caprolactone. That is, in Formula 3, the polyol-derived unit, Y, may mean a portion of the polyol structure that does not participate in the ester bond when the polyol and caprolactone form an ester bond. Ester bonds are represented in Formulas 2 and 3, respectively.

On the other hand, when the polyol-derived unit of Y in the above formula is a unit derived from a polyol containing three or more hydroxy groups, such as a triol unit, a branched structure may be implemented in the Y portion of the formula.

In Formula 2, the type of the carboxylic acid-derived unit of X is not particularly limited, but in order to secure the desired physical properties, a fatty acid compound, an aromatic compound having two or more carboxyl groups, an alicyclic compound having two or more carboxyl groups, and 2 It may be a unit derived from one or more compounds selected from the group consisting of aliphatic compounds having two or more carboxyl groups.

The aromatic compound having two or more carboxyl groups may be, for example, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, or tetrachlorophthalic acid.

The alicyclic compound having two or more carboxyl groups may be, for example, tetrahydrophthalic acid or hexahydrophthalic acid tetrachlorophthalic acid.

In addition, the aliphatic compound having two or more carboxyl groups, for example, oxalic acid, adipic acid, azelaic acid, sebacic acid, succinic acid, malic acid, glutaric acid, malonic acid, pimelic acid, suberic acid, 2,2-dimethyl It may be succinic acid, 3,3-dimethylglutaric acid, 2,2-dimethylglutaric acid, maleic acid, fumaric acid or itaconic acid.

In consideration of the low glass transition temperature in the range described below, units derived from aliphatic carboxylic acids may be preferable to units derived from aromatic carboxylic acids.

On the other hand, the type of the polyol-derived unit of Y in Formulas 2 and 3 is not particularly limited, but in order to secure the desired physical properties, in the group consisting of an alicyclic compound having two or more hydroxy groups and an aliphatic compound having two or more hydroxy groups It may be derived from one or more compounds of choice.

The alicyclic compound having two or more hydroxy groups may be, for example, 1,3-cyclohexanedimethanol or 1,4-cyclohexanedimethanol.

In addition, the aliphatic compound having two or more hydroxy groups is, for example, ethylene glycol, propylene glycol, 1,2-butylene glycol, 2,3-butylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, 1,2-ethylhexyldiol, 1,5-pentanediol, 1,9-nonanediol, 1,10-decanediol, glycerin or trimethylol It can be propane.

Meanwhile, in Formula 2, n is an arbitrary natural number, and the range may be selected in consideration of the desired physical properties of the resin composition or the cured resin layer. For example, n may be about 2 to 10 or 2 to 5.

In addition, in Formula 3, m is an arbitrary natural number, and the range may be selected in consideration of the desired physical properties of the resin composition or the cured resin layer. For example, m is about 1 to 10 or 1 to 5 days. I can.

When n and m in Formulas 2 and 3 are out of the above range, crystallinity expression of the polyol increases, and the injection processability of the composition may be adversely affected.

In Formula 3, R ₁ and R ₂ are each independently alkylene having 1 to 14 carbon atoms. The number of carbon atoms may be selected in consideration of the desired physical properties of the resin composition or the resin layer, which is a cured product thereof.

The molecular weight of the polyol may be adjusted in consideration of viscosity, durability, or adhesion, and may be, for example, in the range of about 300 to about 2,000. Unless otherwise specified, in the present specification, the "molecular weight" may be a weight average molecular weight (Mw) measured using a Gel Permeation Chromatograph (GPC). If it is out of the above range, the reliability of the resin layer after curing may be poor, or problems related to volatile components may occur.

In the present application, the type of isocyanate included in the curing agent is not particularly limited, but a non-aromatic isocyanate compound not containing an aromatic group may be used to secure desired physical properties. In the case of using an aromatic polyisocyanate, since the reaction rate is too fast and the glass transition temperature of the cured product may be increased, it may be difficult to satisfy the viscosity range of the resin composition described later.

Examples of the non-aromatic isocyanate compound include aliphatic polyisocyanates such as hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate methyl, ethylene diisocyanate, propylene diisocyanate or tetramethylene diisocyanate. ; Alicyclic polyisocyanates such as transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, bis(isocyanate methyl)cyclohexane diisocyanate or dicyclohexylmethane diisocyanate; Or any one or more of the above carbodiimide-modified polyisocyanate or isocyanurate-modified polyisocyanate; Etc. can be used. In addition, a mixture of two or more of the compounds listed above may be used.

Meanwhile, the resin component included in the two-part resin composition may have a glass transition temperature (Tg) of less than 0°C after curing. When the glass transition temperature range is satisfied, brittle characteristics can be secured within a relatively short time even at a low temperature in which the battery module or battery pack can be used, thereby ensuring impact resistance and vibration resistance. I can. On the other hand, when the above range is not satisfied, there is a possibility that tacky of the cured product is too high or thermal stability is deteriorated. In one example, the lower limit of the glass transition temperature of the two-part resin composition after curing may be about -70°C or more, -60°C or more, -50°C or more, -40°C or more, or about -30°C or more, and the The upper limit may be about -5°C or less, -10°C or less, -15°C or less, or about -20°C or less.

In the present application, the expression "after curing" may be used in the same meaning as that of Jinkyunghwa. The anti-hardening may mean a state in which the resin composition injected into the module in order to manufacture the battery module is sufficiently cured to perform functions such as heat dissipation. Taking a urethane resin as an example, anti-hardening is based on curing for 24 hours at room temperature and 30% to 70% relative humidity conditions, and the conversion rate based on the NCO peak in the vicinity of 2250 cm ^-1 confirmed by FT-IR analysis ( conversion) is 80% or more.

Meanwhile, the ratio of the polyol resin component and the polyisocyanate component in the resin composition is not particularly limited, and may be appropriately adjusted to enable a urethane reaction therebetween.

In one example, the resin composition may further satisfy the following General Formula 4.

[General Formula 4]

3.2 ≤ V _f /V _i ≤ 6

In the general formula 4, V _i is the viscosity measured within 1 minute at room temperature after starting the curing reaction with the curing agent by mixing the main resin, and V _f is measured at the time 30 minutes elapsed at room temperature after the start of the curing reaction. It is viscosity.

Meanwhile, the viscosity referred to in the present application is measured at a point of 2.5/s when measured in a shear rate range of 0.01 to 10.0/s using a rheological property meter (ARES) unless otherwise stated. It can be a viscosity value.

As another example, the value of Formula 4 may be about 3.3 or more, 3.4 or more, 3.5 or more, or about 3.6 or more, and may be about 5.9 or less, 5.8 or less, 5.7 or less, 5.6 or less, or about 5.5 or less.

If the value of Formula 4 is less than 3.2, the curing speed is slow and the time required to manufacture one battery module (or process tact time) is long, resulting in poor productivity, and the value of Formula 4 exceeds 6. In the case of, the curing speed is high, so that the handleability deteriorates in the step of injecting the resin composition into the battery module to be described later.

Therefore, when the resin composition satisfies the range of General Formula 4, it is possible to secure an appropriate process tact time while having excellent handleability in the injection process.

In one example, the resin composition may have a viscosity of about 350,000 cP or less, measured within 1 minute at room temperature after starting a curing reaction with a curing agent by mixing a main resin. In one embodiment, the viscosity may be a viscosity measured at about 30 seconds elapsed at room temperature after the start of the curing reaction. As another example, the viscosity may be about 340,000 cp or less, 330,000 cp or less, 320,000 cp or less, or about 310,000 cp or less, and the lower limit is about 150,000 cP or more, 160,000 cP or more, 170,000 cP or more, 180,000 cP or more, 190,000 cP or more, or about It may be 200,000 cP or more.

In one example, the resin composition may have a viscosity of about 1,500,000 cP or more, as measured at 30 minutes at room temperature after the start of the curing reaction. The 30 minutes means 28 minutes to 32 minutes, and includes an equal range. As another example, it may be about 1,600,000 cP or more, 1,700,000 cP or more, 1,600,000 cP or more, 1,700,000 cP or more, or about 1,800,000 cP or more, and about 2,200,000 cP or less, 2,100,000 cP or less, or 2,000,000 cP or less. When the viscosity measured within 1 minute at room temperature after starting the curing reaction with the curing agent by mixing the main resin and the viscosity measured at room temperature 30 minutes after the start of the curing reaction satisfy the above range, the general formula 4 It is advantageous to satisfy

In one example, the resin composition may include a thermally conductive inorganic filler. The thermally conductive inorganic filler may be the first inorganic filler. In the present application, the term thermally conductive inorganic filler may mean a material having a thermal conductivity of about 1 W/mK or more, 5 W/mK or more, 10 W/mK or more, or about 15 W/mK or more. Specifically, the thermal conductivity of the thermally conductive inorganic filler may be about 400 W/mK or less, 350 W/mK or less, or about 300 W/mK or less. The type of thermally conductive inorganic filler that can be used is not particularly limited, and for example, aluminum oxide (alumina: Al ₂ O ₃ ), aluminum nitride (AlN), boron nitride (BN), silicon nitride (Si ₃ N ₄ ), Ceramic particles such as silicon carbide (SiC) beryllium oxide (BeO), zinc oxide (ZnO), aluminum hydroxide (Al(OH) ₃ ) or boehmite may be used. In addition to the above, various types of inorganic fillers may be used as the first inorganic filler. For example, in order to secure the insulating properties of the resin layer cured with the resin composition, use of a carbon filler such as graphite may be considered. Alternatively, for example, a filler such as fumed silica, clay or calcium carbonate may be used.

In addition, in order to obtain excellent heat dissipation performance, the first inorganic filler may be used in a high content in the resin composition. For example, the first inorganic filler may be used within a range of about 100 parts by weight to 2,000 parts by weight based on 100 parts by weight of the curing agent. Specifically, relative to 100 parts by weight of the curing agent, about 100 parts by weight or more, 200 parts by weight or more, 300 parts by weight or more, 400 parts by weight or more, 500 parts by weight or more, 600 parts by weight or more, or about 700 parts by weight or more, and about It may be 1,900 parts by weight or less, 1,800 parts by weight or less, or about 1,700 parts by weight or less. It is possible to secure physical properties such as thermal conductivity and insulating properties within the range of the ratio of the first inorganic filler.

When an excessive amount of the first inorganic filler is applied as described above in order to secure thermal conductivity and insulation, the viscosity of the resin composition is greatly increased, and thus handling property is deteriorated. Accordingly, in the resin composition, at least three types of first inorganic fillers having different particle diameters may be applied in a predetermined ratio. For example, the resin composition includes an inorganic filler (A) having an average particle diameter of about 1 μm to about 3 μm, an inorganic filler (B) having an average particle diameter of about 15 μm to about 25 μm, and an inorganic filler of about 35 μm to about 45 μm ( C) may be included.

In the above, the average particle diameter is the particle diameter at the cumulative 50% based on the volume of the particle size distribution (median direct hit), the particle size distribution is calculated based on the volume, and the cumulative value at the point where the cumulative value becomes 50% in the cumulative curve with the total volume as 100%. It means the particle diameter. The average particle diameter (or D50) as described above can be measured by a laser diffraction method.

When the total weight of the first inorganic filler is 100 parts by weight, the inorganic filler (A) having an average particle diameter of about 1 µm to about 3 µm is about 15 parts by weight to about 35 parts by weight or about 20 parts by weight to about 30 Including parts by weight, the inorganic filler (B) having an average particle diameter of about 15 µm to about 25 µm includes about 25 parts by weight to about 45 parts by weight or about 30 parts by weight to about 40 parts by weight, and the average particle diameter is about The inorganic filler (C) having a size of 35 µm to about 45 µm may include about 30 parts by weight to about 50 parts by weight or about 35 parts by weight to about 45 parts by weight.

By applying the three types of first inorganic fillers having the above-described particle diameters in the above ratio, it is possible to provide a resin composition in which handling properties are secured by exhibiting an appropriate viscosity even when a high content of the first inorganic filler is filled.

The shape of the first inorganic filler is not particularly limited, and may be selected in consideration of viscosity and thixotropy of the resin composition, possibility of sedimentation in the resin composition, thermal conductivity, insulation, filling effect, or dispersibility. For example, considering the amount to be filled, it is advantageous to use a spherical first inorganic filler, but considering the formation of a network, conductivity, thixotropy, etc., a non-spherical first inorganic filler, for example, needle or plate A first inorganic filler in the form of such as may also be used.

In the present application, the term spherical particles means particles having a sphericity of about 0.95 or more, and non-spherical particles mean particles having a sphericity of less than 0.95. The sphericity can be confirmed through particle shape analysis.

In one example, in consideration of the above-described filling effect, all of the inorganic fillers (A) to (C) may use a spherical filler, that is, a filler having a sphericity of 0.95 or more. In another example, at least one of the inorganic fillers (A) to (C) may be a non-spherical filler having a sphericity of less than 0.95.

In one example, the moisture content of the first inorganic filler may be about 1,000 ppm or less. The moisture content can be measured with a karl fishcer titrator (KR831) under conditions of a relative humidity of 10% and a drift of 5.0 or less. In this case, the moisture content may be an average moisture content of all first inorganic fillers used in the resin composition. In the present application, the first inorganic filler satisfying the above conditions may be selectively used, or after drying the first inorganic filler to be used in an oven at a temperature of about 200° C., the first inorganic filler to satisfy the moisture content range You can also adjust the moisture content of the filler. In another example, the upper limit of the moisture content of the first inorganic filler may be about 800 ppm or less, 600 ppm or less, or about 400 ppm or less, and the lower limit may be about 100 ppm or more or about 200 ppm or more.

In the resin composition, a viscosity modifier such as a thixotropy imparting agent, a diluent, a surface treatment agent or a coupling agent, etc., is added to adjust the viscosity required, for example, to increase or decrease the viscosity, or to adjust the viscosity according to shear force. It may contain as.

The thixotropy imparting agent may control the viscosity according to the shear force of the resin composition so that the manufacturing process of the battery module is effectively performed. As the thixotropic imparting agent that can be used, fumed silica and the like can be exemplified.

The diluent is usually used to lower the viscosity of the resin composition, and any of various types known in the art may be used without limitation as long as it can exhibit the above-described action.

The surface treatment agent is for surface treatment of the first inorganic filler introduced into the resin layer, and various types known in the art may be used without limitation as long as it can exhibit the above-described action.

In the case of the coupling agent, for example, it can be used to improve the dispersibility of the thermally conductive first inorganic filler such as alumina, and if it can exhibit the above-described action, various types of known in the industry can be used without limitation. I can.

In addition, the resin composition may further include a flame retardant or a flame retardant auxiliary. In this case, a known flame retardant may be used without particular limitation, and for example, a solid filler type flame retardant or a liquid flame retardant may be applied. Examples of the flame retardant include organic flame retardants such as melamine cyanurate, and inorganic flame retardants such as magnesium hydroxide. When the amount of the first inorganic filler to be filled in the resin layer is large, a liquid-type flame-retardant material (TEP, Triethyl phosphate or TCPP, tris(1,3-chloro-2-propyl)phosphate, etc.) may be used. In addition, a silane coupling agent capable of acting as a flame retardant enhancing agent may be added.

The resin composition may include the configuration as described above, and may also be a solvent-type composition, an aqueous composition, or a solvent-free composition, but considering the convenience of the manufacturing process, the solvent-free type may be appropriate.

The present application also relates to a battery module. The module includes a module case and a battery cell. The battery cell may be housed in the module case. One or more battery cells may exist in the module case, and a plurality of battery cells may be accommodated in the module case. The number of battery cells accommodated in the module case is not particularly limited as it is adjusted according to the use or the like. Battery cells accommodated in the module case may be electrically connected to each other.

The module case may include at least a sidewall and a lower plate forming an inner space in which the battery cells can be accommodated. In addition, the module case may further include an upper plate sealing the inner space. The sidewall, the lower plate, and the upper plate may be integrally formed with each other, or the module case may be formed by assembling separate sidewalls, lower plates and/or upper plates respectively. The shape and size of the module case is not particularly limited, and may be appropriately selected according to the purpose or the shape and number of battery cells accommodated in the internal space.

In the above, the terms upper plate and lower plate are terms of a relative concept used to distinguish them because there are at least two plates constituting the module case. In other words, it does not mean that the upper plate must be present on the upper side and the lower plate must be present on the lower side in the actual use state.

1 is a view showing an exemplary module case 10, and is an example of a case 10 in the form of a box including one lower plate 10a and four side walls 10b. The module case 10 may further include an upper plate 10c sealing the inner space.

FIG. 2 is a schematic view of the module case 10 of FIG. 1 in which the battery cells 20 are accommodated, as viewed from above.

Holes may be formed in the lower plate, sidewall and/or upper plate of the module case. The hole may be an injection hole used to inject a material for forming the resin layer, that is, the above-described resin composition when a resin layer is formed by an injection process. The shape, number, and position of the holes may be adjusted in consideration of the injection efficiency of the resin layer-forming material. In one example, the hole may be formed in at least the lower plate and/or the upper plate.

The module case may be a thermally conductive case. The term thermally conductive case means a case including a portion having a thermal conductivity of 10 W/mk or more, or at least as described above. For example, at least one of the above-described sidewall, lower plate, and upper plate may have the thermal conductivity described above. In another example, at least one of the sidewall, the lower plate, and the upper plate may include a portion having the thermal conductivity. For example, the battery module of the present application may include a first cured resin layer in contact with the upper plate and the battery cell, and a second cured resin layer in contact with the lower plate and the battery cell, at least the second cured resin layer Silver may be a thermally conductive resin layer, and accordingly, at least the lower plate may have thermal conductivity or may include a thermally conductive portion.

In the above, the thermal conductivity of the upper plate, lower plate, sidewall, or thermally conductive portion, which is thermally conductive, is about 20 W/mk or more, 30 W/mk or more, 40 W/mk or more, 50 W/mk or more, 60 W /mk or more, 70 W/mk or more, 80 W/mk or more, 90 W/mk or more, 100 W/mk or more, 110 W/mk or more, 120 W/mk or more, 130 W/mk or more, 140 W/mk Or more, 150 W/mk or more, 160 W/mk or more, 170 W/mk or more, 180 W/mk or more, 190 W/mk or more, or about 195 W/mk or more. The higher the thermal conductivity, the higher the value is, the more advantageous it is in terms of heat dissipation characteristics of the module, and so the upper limit thereof is not particularly limited. In one example, the thermal conductivity is about 1,000 W/mK or less, 900 W/mk or less, 800 W/mk or less, 700 W/mk or less, 600 W/mk or less, 500 W/mk or less, 400 W/mk or less, It may be 300 W/mk or less than about 250 W/mK, but is not limited thereto. The type of material exhibiting the above thermal conductivity is not particularly limited, and examples include metal materials such as aluminum, gold, silver, tungsten, copper, nickel or platinum. The module case may be entirely made of the thermally conductive material as described above, or at least a portion of the module case may be made of the thermally conductive material. Accordingly, the module case may include at least one portion having a thermal conductivity of the above-mentioned range or a portion having the above-mentioned thermal conductivity.

In the module case, a portion having a thermal conductivity within the above range may be a portion in contact with the resin layer and/or the insulating layer. In addition, the portion having the thermal conductivity may be a portion in contact with a cooling medium such as cooling water. In the case of having such a structure, heat generated from the battery cell can be effectively discharged to the outside.

In the present application, the term battery cell means one unit secondary battery including an electrode assembly and an exterior material.

The type of battery cells accommodated in the battery module case is not particularly limited, and various known battery cells may be applied. In one example, the battery cell may be a pouch type.

The battery module of the present application may further include a resin layer. The resin layer is a curing agent for the main resin; A first inorganic filler; oxide; And a curable main resin which may be formed by a resin composition including a dispersant or cured with a curing agent; A first inorganic filler; oxide; And a resin composition comprising a dispersant.

The battery module may include, as a resin layer, a first cured resin layer in contact with the upper plate and battery cells, and a second cured resin layer in contact with the lower plate and battery cells. At least one of the first and second cured resin layers may include a cured product of the resin composition described above, and thus may have a predetermined adhesive strength, cold resistance, heat resistance, and insulation as described above.

In addition, the first and second cured resin layers may be thermally conductive resin layers. In this case, the thermal conductivity of the thermally conductive resin layer may be about 1.5 W/mK or more, 2 W/mK or more, 2.5 W/mK or more, 3 W/mK or more, 3.5 W/mK or more, or about 4 W/mK or more. . The thermal conductivity is about 50 W/mK or less, 45 W/mk or less, 40 W/mk or less, 35 W/mk or less, 30 W/mk or less, 25 W/mk or less, 20 W/mk or less, 15 W/ mk or less, 10 W/mK or less, 5 W/mK or less, 4.5 W/mK or less, or about 4.0 W/mK or less. When the resin layer is a thermally conductive resin layer as described above, the lower plate, the upper plate, and/or the sidewall to which the resin layer is attached may be a portion having a thermal conductivity of 10 W/mK or more. In this case, the portion of the module case indicating the thermal conductivity may be a portion in contact with a cooling medium, for example, cooling water. The thermal conductivity of the resin layer is a value measured according to, for example, ASTM D5470 standard or ISO 22007-2 standard. The thermal conductivity of the resin layer as described above can be secured by appropriately adjusting the first inorganic filler and the content ratio thereof included in the resin layer, as described above.

In addition, the resin layer may be a flame retardant resin layer. In the present application, the term flame-retardant resin layer may mean a resin layer exhibiting a V-0 rating in UL 94 V Test (Vertical Burning Test). Through this, it is possible to secure stability against fire and other accidents that may occur in the battery module.

In the battery module of the present application, at least one of the sidewall, the lower plate, and the upper plate in contact with the resin layer may be the thermally conductive sidewall, the lower plate, or the upper plate. Meanwhile, in the present specification, the term contact means, for example, the resin layer and the upper plate, the lower plate and/or the sidewall or the battery cell are in direct contact, or other elements such as an insulating layer are present therebetween. It can also mean a case. In addition, the resin layer in contact with the thermally conductive sidewall, the lower plate, or the upper plate may be in thermal contact with the object. In this case, in the thermal contact, the resin layer is in direct contact with the lower plate or the like, or another element such as an insulating layer to be described later exists between the resin layer and the lower plate. It may mean a state in which heat transfer from the battery cell to the resin layer and from the resin layer to the lower plate is not hindered. In the above, that it does not interfere with the transfer of heat, even when another element (ex. an insulating layer or a guiding part to be described later) exists between the resin layer and the lower plate, the total thermal conductivity of the other element and the resin layer. Is about 1.5 W/mK or more, 2 W/mK or more, 2.5 W/mK or more, 3 W/mK or more, 3.5 W/mK or more, or about 4 W/mK or more, or in contact with the resin layer and It means that the overall thermal conductivity of the lower plate, etc., is within the above range even when the other elements are present. The thermal conductivity of the thermal contact is about 50 W/mK or less, 45 W/mk or less, 40 W/mk or less, 35 W/mk or less, 30 W/mk or less, 25 W/mk or less, 20 W/mk or less, It may be 15 W/mk or less, 10 W/mK or less, 5 W/mK or less, 4.5 W/mK or less, or about 4.0 W/mK or less. Such thermal contact can be achieved by controlling the thermal conductivity and/or thickness of the other element, if present.

The thermally conductive resin layer may be in thermal contact with the lower plate or the like, and may also be in thermal contact with the battery cell. Through the adoption of the structure as described above, it secures heat dissipation characteristics while significantly reducing various fastening parts or cooling equipment of modules that were previously required when configuring a general battery module or a battery pack that is an assembly of such modules. A module in which more battery cells are accommodated can be implemented. Accordingly, in the present application, it is possible to provide a battery module having a smaller, lighter weight and high output.

3 is an exemplary cross-sectional view of the battery module. In FIG. 3, the module includes a case 10 including a side wall 10b and a lower plate 10a, a plurality of battery cells 20 accommodated in the case, and the battery cells 20 and the case ( 10) It may be a form including a resin layer 30 in contact with all. 3 is a view of the resin layer 30 existing on the lower plate 10a side, but the battery module of the present application may include a resin layer positioned in the shape of FIG. 3 also on the upper plate side.

In the above structure, the lower plate or the like in contact with the resin layer 30 may be a lower plate having thermal conductivity, as described above.

The contact area between the resin layer and the lower plate may be about 70% or more, 75% or more, 80% or more, 85% or more, 90% or more, or about 95% or more of the total area of the lower plate. The upper limit of the contact area is not particularly limited, and may be, for example, 100% or less or about 100% or less.

When the upper plate or the lower plate is thermally conductive, and the cured resin layer in contact therewith is also thermally conductive, the thermally conductive portion or the thermally conductive lower plate may be a portion in contact with a cooling medium such as cooling water. That is, as schematically shown in FIG. 3, heat (H) can be easily discharged to the lower plate by the above structure, and by contacting the lower plate with the cooling medium (CW), even in a more simplified structure You can make it easier to dissipate heat.

Each of the resin layers may have a thickness in the range of, for example, about 100 μm to 5 mm or about 200 μm to 5 mm. In the structure of the present application, the thickness of the resin layer may be set to an appropriate thickness in consideration of a desired heat dissipation property or durability. The thickness may be the thickness of the thinnest portion of the resin layer, the thickness of the thickest portion, or an average thickness.

As shown in FIG. 3, a guiding part capable of guiding the battery cell 20 accommodated on at least one surface of the module case 10, for example, a surface 10a in contact with the resin layer 30 ( 10d) may exist. At this time, the shape of the guiding part 10d is not particularly limited, and an appropriate shape may be employed in consideration of the shape of the applied battery cell. The guiding part 10d may be integrally formed with the lower plate or the like, or may be separately attached. The guiding part 10d may be formed of a thermally conductive material, for example, a metal material such as aluminum, gold, silver, tungsten, copper, nickel, or platinum in consideration of the aforementioned thermal contact. In addition, although not shown in the drawings, a slip sheet or an adhesive layer may be present between the battery cells 20 to be accommodated. In the above, the slipper may serve as a buffer during charging and discharging of the battery cell.

In one example, the battery module may further include an insulating layer between the module case and the battery cell or between the resin layer and the module case. FIG. 4 exemplarily shows a case in which the insulating layer 40 is formed between the guiding portion 10d formed on the lower plate 10a of the case and the resin layer 30. By adding an insulating layer, it is possible to prevent problems such as electric short-circuit phenomenon or fire occurrence due to contact between the cell and the case due to impact that may occur during use. The insulating layer may be formed using an insulating sheet having high insulating properties and thermal conductivity, or may be formed by coating or injection of an insulating material. For example, a process of forming an insulating layer may be performed before injection of the resin composition. A so-called TIM (Thermal Interface Material) or the like may be applied to the formation of the insulating layer. In another method, the insulating layer may be formed of an adhesive material, and for example, the insulating layer may be formed using a resin layer having a small or no filler content such as a thermally conductive first inorganic filler. Resin components that can be used to form the insulating layer include acrylic resin, olefin resin such as PVC (poly(vinyl chloride)), PE (polyethylene), epoxy resin, silicone, or EPDM rubber ((ethylene propylene diene monomer rubber). Rubber components such as, etc. may be exemplified, but are not limited thereto. The insulation layer has an insulation breakdown voltage of about 5 kV/mm or more, 10 kV/mm or more, and 15 kV/mm as measured in accordance with ASTM D149. Above, it may be 20 kV/mm or more, 25 kV/mm or more, or about 30 kV/mm or more The dielectric breakdown voltage is not particularly limited as it exhibits excellent insulation as the value increases. The dielectric breakdown voltage of the layer may be about 100 kV/mm or less, 90 kV/mm or less, 80 kV/mm or less, 70 kV/mm or less, or about 60 kV/mm or less. It can be set to an appropriate range in consideration of insulation and thermal conductivity, for example, about 5㎛ or more, 10㎛ or more, 20㎛ or more, 30㎛ or more, 40㎛ or more, 50㎛ or more, 60㎛ or more, 70㎛ In addition, the upper limit of the thickness is not particularly limited, for example, about 1 mm or less, 200 μm or less, 190 μm or less, 180 μm or less, 170 μm or less. , 160 μm or less or 150 μm or less.

The present application also relates to a battery pack, for example, a battery pack including two or more of the aforementioned battery modules. In the battery pack, the battery modules may be electrically connected to each other. A method of configuring a battery pack by electrically connecting two or more battery modules is not particularly limited, and all known methods may be applied.

The present application also relates to the battery module or an apparatus comprising the battery pack. An example of the device may be a vehicle such as an electric vehicle, but is not limited thereto, and all uses requiring a secondary battery as an output may be included. For example, a method of configuring the vehicle using the battery pack is not particularly limited, and a general method may be applied.

According to an example of the present application, a resin composition with improved curing speed is provided. In addition, a battery module having excellent heat dissipation performance including a cured product of the resin composition is provided.

1 shows an exemplary module case applicable in the present application.
2 schematically shows a form in which a battery cell is accommodated in a module case.
3 and 4 schematically show the structure of an exemplary battery module.

The present application will be described in detail through the following examples, but the scope of the present application is not limited by the scope presented below.

Assessment Methods

1. Adsorption energy

The adsorption energy was calculated by using a plane wave-based density functional theory using VASP code.

The exchange-correlation to simulate the electron-electron interaction in the calculation based on the density function was used as a generalized gradient approximation-PBE (Perdew-Burke-Ernzerhof).

For the pseudo-potential of each atom, the basic pseudo-potential was applied to each element included in the VASP package, the kinetic energy cut off of the electron was 400 eV, and the k-point mesh was gamma. A condition including only points was used. Meanwhile, the optimum structure was found by repeating calculations until the force acting between each atom obtained through the electronic structure calculation was less than 0.03 eV/Å.

2. Viscosity

The viscosity of the resin composition was measured under a shear rate condition of 0.01 to 10.0/s at room temperature using a rheological property analyzer (ARES). The viscosity mentioned in Examples and Comparative Examples is the viscosity at the point of a shear rate of 2.5/s.

Example

Main resin composition: As a caprolactone polyol represented by the following Formula 3, the number of repeating units (m in Formula 3) is at a level of about 1 to 3, and R ₁ and R ₂ are each alkylene having 4 carbon atoms, As the polyol-derived unit (Y in Formula 3), a polyol containing a 1,4-butanediol unit was used as the main resin, and as described below, a mixture of the first inorganic filler, an oxide and a dispersant was used as the main resin composition. .

[Formula 3]

Curing agent composition: A mixture of a first inorganic filler, an oxide, and a dispersant as described below was used for polyisocyanate (HDI, Hexamethylene diisocyanate).

First Inorganic Filler: An alumina filler was used, and a first inorganic filler in an amount of approximately 1,400 to 1,800 parts by weight relative to 100 parts by weight of a curing agent (polyisocyanate) was divided into equal amounts and mixed with the main resin and the curing agent.

Oxide: sodium oxide (Na ₂ O) was used, and an amount equal to about 0.37 parts by weight relative to 100 parts by weight of the first inorganic filler was included in each of the main resin and the curing agent in half.

Dispersant: A phosphoric acid ester anionic dispersant having an adsorption energy of about -5.0 eV to about -7.0 eV with the oxide was used, and the amount of about 0.1 parts by weight to 0.6 parts by weight relative to 100 parts by weight of the first inorganic filler The resin and the curing agent were mixed in a ratio of 1:2 (main resin: curing agent).

The main resin composition was prepared by mixing the polyol resin, the first inorganic filler, oxide, and dispersant with a planetary mixer. Meanwhile, the curing agent composition was prepared by mixing the polyisocyanate, the first inorganic filler, the oxide, and the dispersant with a planetary mixer.

Viscosity was measured using a two-part resin composition containing the main resin and a curing agent thus prepared.

oxide Adsorption energy with oxide
(eV) Adsorption energy with the first inorganic filler
(eV) Viscosity
(cP) Kinds content
(Part by weight) Dispersant Hardener Dispersant Within 1 minute
(V _i ) When 30 minutes have elapsed
(V _f ) Example Na ₂ O About 0.37 About -5.75 About -0.38 About -1.64 About 300,000 About 1.3 million

From Table 1 above, it was found that the viscosity ratio (V _f /V _i ) at the time of 30 minutes to the initial viscosity of the resin composition containing the oxide having an adsorption energy greater than that of the oxide and the dispersant was 4.3. I can confirm.

10: module case
10a: lower plate
10b: side wall
10c: top plate
10d: guiding part
20: battery cell
30: resin layer
40: insulating layer
50a: injection hole

Claims (20)

Hardener for the main resin; A first inorganic filler; Sodium oxide (Na ₂ O); And a dispersant,
A resin composition satisfying the following general formula 1.
[General Formula 1]
A <B
In the general formula 1, A is the adsorption energy (eV) of sodium oxide (Na ₂ O) and the dispersant, and B is the adsorption energy (eV) of sodium oxide (Na ₂ O) and the curing agent. The resin composition according to claim 1, further comprising a main resin. A curable main resin cured with a curing agent; A first inorganic filler; Sodium oxide (Na ₂ O); And a dispersant,
A resin composition satisfying the following general formula 2.
[General Formula 2]
A <B
In the general formula 2, A is the adsorption energy (eV) of sodium oxide (Na ₂ O) and the dispersant, and B is the adsorption energy (eV) of sodium oxide (Na ₂ O) and the curing agent. The resin composition according to claim 1 or 3, further satisfying the following general formula (3).
[General Formula 3]
A <C
In Formula 3, A is the adsorption energy (eV) of sodium oxide (Na ₂ O) and the dispersant, and C is the adsorption energy (eV) of the first inorganic filler and the dispersant. The resin composition according to claim 1 or 3, wherein the adsorption energy of sodium oxide (Na ₂ O) and the dispersant is -10.0 eV to -2.0 eV. delete The resin composition according to claim 1 or 3, wherein sodium oxide (Na ₂ O) comprises 0.04 parts by weight to 1 part by weight based on 100 parts by weight of the first inorganic filler. The resin composition according to claim 1 or 3, wherein the dispersant is a phosphoric acid ester anionic dispersant. The resin composition according to claim 1 or 3, wherein the dispersant contains less than 1 part by weight based on 100 parts by weight of the first inorganic filler. The resin composition according to claim 1 or 3, wherein the main resin is a polyol resin and the curing agent is an isocyanate. The resin composition according to claim 10, wherein the polyol resin is amorphous or an ester polyol resin having a melting point (Tm) of less than 15°C. The resin composition according to claim 10, wherein the isocyanate is a non-aromatic polyisocyanate. The resin composition according to claim 1, further satisfying the following General Formula 4.
[General Formula 4]
3.2 ≤ V _f /V _i ≤ 6
In the general formula 4, V _i is the viscosity measured within 1 minute at room temperature after starting the curing reaction with the curing agent by mixing the main resin, and V _f is measured at the time 30 minutes elapsed at room temperature after the start of the curing reaction. It is viscosity. The method of claim 1 or 3, wherein the first inorganic filler is fumed silica, clay, calcium carbonate (CaCO ₃ ), aluminum oxide (Al ₂ O ₃ ), aluminum nitride (AlN), boron nitride (BN), silicon nitride ( Si ₃ N ₄ ), silicon carbide (SiC), beryllium oxide (BeO), zinc oxide (ZnO), aluminum hydroxide (Al (OH) ₃ ), boehmite, or a resin composition that is a carbon filler. The resin composition according to claim 1 or 3, wherein the first inorganic filler comprises 100 parts by weight to 2,000 parts by weight based on 100 parts by weight of the curing agent. The resin composition according to claim 1 or 3, wherein the first inorganic filler has a thermal conductivity of 1 W/mK or more. The resin composition according to claim 1 or 3, further comprising a catalyst. A module case having an upper plate, a lower plate, and sidewalls, wherein an inner space is formed by the upper plate, the lower plate, and the sidewall;
A plurality of battery cells present in the inner space of the module case; And
A battery module comprising a resin layer comprising the resin composition of claim 1 or 3 and in contact with at least one of the plurality of battery cells and the lower plate or sidewall. A battery pack comprising two or more battery modules of claim 18 that are electrically connected to each other. A vehicle comprising the battery pack of claim 19.

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