KR102167534B1 - Apparatus and vacuum system for carrier alignment in vacuum chamber, and method of alignment of carriers - Google Patents

Abstract

An apparatus 100 for aligning carriers in a vacuum chamber 101 is described. The device comprises a first carrier conveying system 120 configured to convey the first carrier 10 in a first direction X along a first conveying path, and an alignment system 130. The alignment system includes a first mount 152 for mounting the first carrier 10 to the alignment system 130, an alignment device 151 configured to move the first mount 152 in at least one alignment direction, and And a first shifting device 141 configured to move the alignment device 151 together with the first mount 152 in a second direction Z crossing the first direction X. In addition, a method and vacuum system for aligning the carriers are described.

Description

Apparatus and vacuum system for carrier alignment in vacuum chamber, and method of alignment of carriers

[0001] Embodiments of the present disclosure relate to an apparatus and a vacuum system for aligning a carrier in a vacuum chamber, and a method for aligning a carrier in a vacuum chamber. More specifically, a method of transferring, positioning and aligning a substrate carrier carrying a substrate in a vacuum chamber is described. Embodiments of the present disclosure particularly relate to a vacuum deposition system for depositing material on a substrate carried by a carrier, wherein the substrate is aligned with a mask prior to deposition. The methods and apparatuses described herein can be used in the manufacture of organic light-emitting diode (OLED) devices.

[0002] Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD) and chemical vapor deposition (CVD). Coated substrates can be used in several applications and in several technical fields. For example, coated substrates can be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, etc., for displaying information, for example. . An OLED device, such as an OLED display, can include one or more layers of organic material positioned between two electrodes both deposited on a substrate.

[0003] During deposition of the coating material on the substrate, the substrate may be held by a substrate carrier, and the mask may be held by a mask carrier in front of the substrate. A material pattern corresponding to the opening pattern of the mask, for example a plurality of pixels, may be deposited on the substrate, for example by evaporation.

[0004] The function of an OLED device typically depends on the accuracy of the coating pattern and the thickness of the organic material that must be within a predetermined range. In order to obtain high-resolution OLED devices, technical challenges to the deposition of evaporated materials need to be overcome. In particular, it is a challenge to accurately and smoothly transfer a substrate carrier carrying a substrate and/or a mask carrier carrying a mask through a vacuum system. In addition, the correct alignment of the substrate to the mask is crucial for achieving high quality deposition results, for example manufacturing high resolution OLED devices. Moreover, efficient use of the coating material is beneficial, and the idle times of the system should be kept as short as possible.

[0005] In view of the above, it is beneficial to provide devices, systems and methods for accurately and reliably transporting, positioning and/or aligning carriers for transporting substrates and/or masks in a vacuum chamber. something to do.

[0006] In view of the above, an apparatus and a vacuum system for carrier alignment in a vacuum chamber, and a method for aligning carriers in a vacuum chamber are provided. Other aspects, benefits, and features of the present disclosure are apparent from the claims, detailed description, and accompanying drawings.

[0007] According to an aspect of the present disclosure, an apparatus for alignment of carriers in a vacuum chamber is provided. The apparatus includes a first carrier transport system configured to transport a first carrier in a first direction along a first transport path, and an alignment system. The alignment system comprises a first mount for mounting the first carrier to the alignment system, an alignment device configured to move the first mount in at least one alignment direction, and a second direction transverse to the first direction. And a first shifting device configured to move the alignment device with the first mount.

[0008] In embodiments, the first carrier is a substrate carrier configured to carry a substrate. In some embodiments, the alignment system is configured to align a first carrier, e.g., a substrate carrier, relative to a second carrier, e.g., a mask carrier, to deposit material on a substrate carried by the first carrier. .

[0009] According to another aspect of the present disclosure, a vacuum system for carrier alignment in a vacuum chamber is provided. The vacuum system includes a vacuum chamber with side walls, and an alignment system. The alignment system includes a first mount for mounting the first carrier to the alignment system, an alignment device configured to move the first mount in at least one alignment direction, and an alignment device in a second direction transverse to the first direction. And a first shifting device configured to move with the mount. The alignment system extends through the sidewall, for example via at least one vibration damping element or vibration isolation element, in particular reducing or preventing the transmission of deformations of the sidewall to the alignment system. It is flexibly connected to the sidewall through an elastic or flexible sealing element, such as a bellows element.

In some embodiments, the vacuum system is a vacuum deposition system that includes a deposition source for depositing a material on a substrate carried by a first carrier in a vacuum chamber.

[0011] According to another aspect of the present disclosure, a method of aligning a carrier in a vacuum chamber is provided. The method includes transporting the first carrier in a first direction along a first transport path, and mounting the first carrier to a first mount of the alignment system, wherein the alignment system includes a first carrier in at least one alignment direction. An alignment device configured to move the mount, and a first shifting device configured to move the alignment device with the first mount in a second direction transverse to the first direction. The method further includes moving the first carrier mounted on the first mount in a second direction by the first shifting device, and aligning the first carrier in at least one alignment direction by the alignment device.

[0012] In some embodiments, the first carrier is a substrate carrier holding the substrate, and aligning the first carrier includes aligning the substrate carrier with a second carrier holding the mask. .

[0013] In some embodiments, the alignment system extends through the sidewall of the vacuum chamber and is flexibly connected to the sidewall, for example through at least one vibration damping element or vibration isolation element. Thus, vibrations or other deformations of the sidewall are not transmitted directly to the alignment system. Alignment accuracy can be improved.

[0014] Embodiments also relate to apparatuses for performing the disclosed methods, including apparatus portions for performing each described method aspect. These method aspects may be performed by hardware components, a computer programmed by suitable software, any combination thereof, or in any other manner. Moreover, embodiments according to the present disclosure also relate to methods for operating the described apparatus. Methods for operating the described apparatus include method aspects for performing all functions of the apparatus.

[0015] In a way that the above-mentioned features of the present disclosure can be understood in detail, a more specific description of the present disclosure briefly summarized above may be made with reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below:
1 shows a schematic cross-sectional view of an apparatus for aligning a carrier, according to embodiments described herein;
2 shows a schematic cross-sectional view of a vacuum system for aligning a carrier, according to embodiments described herein;
3 shows a schematic cross-sectional view of an apparatus for aligning a carrier, according to embodiments described herein, in a transport position;
Figure 4a shows the embodiment of Figure 3 in a second position;
Figure 4b shows the embodiment of Figure 3 in a third position;
5 shows an exploded view of an alignment system of an apparatus according to embodiments described herein;
Figure 6 shows a perspective view of the alignment system of Figure 5;
7 is a flow diagram illustrating a method of aligning a carrier in a vacuum chamber, according to embodiments described herein.

[0016] Reference will now be made in detail to various embodiments of the present disclosure, and examples of one or more of these embodiments are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. In general, only the differences for individual embodiments are described. Each example is provided as a description of the present disclosure and is not meant as a limitation of the present disclosure.

In addition, features illustrated or described as part of one embodiment may be used in or in conjunction with another embodiment to create another embodiment. The detailed description is intended to include such modifications and variations.

1 is a schematic cross-sectional view of an apparatus 100 for aligning a first carrier 10 in a vacuum chamber 101, according to embodiments described herein. The term “aligning” refers to accurately positioning the carrier at a predetermined position within the vacuum chamber, in particular at a predetermined position relative to the second carrier. The first carrier is aligned in at least one alignment direction, in particular two or three alignment directions which may be essentially perpendicular to each other.

In the following description, the term “first carrier” is used to designate a substrate carrier configured to carry the substrate 11, as schematically shown in FIG. 1. The term "second carrier" is used to designate a mask carrier configured to carry the mask 21 (see Fig. 3). However, alternatively, it will be appreciated that the first carrier 10 may be a carrier configured to hold a different object, for example a mask or shield.

"Substrate carrier" relates to a carrier device configured to transport the substrate 11 along a first transport path in the vacuum chamber 101. The substrate carrier can hold the substrate 11 during deposition of the coating material on the substrate 11. In some embodiments, the substrate 11 may be held on the substrate carrier in a non-horizontal orientation, particularly an essentially vertical orientation, for example during transport, alignment and/or deposition. In the embodiment shown in FIG. 1, the substrate 11 is held on the first carrier 10 in an essentially vertical orientation. For example, the angle between the substrate surface and the gravity vector may be less than 10°, in particular less than 5°.

[0021] For example, the substrate 11 may be transferred through the vacuum chamber 101, during alignment in the vacuum chamber 101, and/or during deposition of a coating material on the substrate, the first carrier 10 ) Can be maintained on the holding surface. In particular, the substrate 11 can be held on the first carrier 10 by a chucking device, for example by an electrostatic chuck (ESC) or a magnetic chuck (magnetic chuck). The chucking device can be integrated in the first carrier 10, for example an atmospheric enclosure provided in the first carrier.

[0022] The first carrier 10 may comprise a carrier body having a holding surface configured to hold the substrate 11, in particular in a non-horizontal orientation, and more particularly in an essentially vertical orientation. The first carrier may be movable along the first transport path by the first carrier transport system 120. In some embodiments, the first carrier 10 may be held contactless during transport, for example by a magnetic levitation system. In particular, the first carrier transfer system 120 may be a magnetic levitation system configured to non-contactly transfer the first carrier 10 along a first transfer path in a vacuum chamber. The first carrier transfer system 120 may be configured to transfer the first carrier into a deposition region of a vacuum chamber in which an alignment system and a deposition source are arranged.

[0023] A “mask carrier” as used herein relates to a carrier device configured to carry a mask, for transferring the mask along the mask transfer path in a vacuum chamber. The mask carrier may carry the mask during transport, during alignment, and/or during deposition on the substrate through the mask. In some embodiments, the mask may be held on the mask carrier in a non-horizontal orientation, particularly an essentially vertical orientation, during transport and/or alignment. The mask may be held on the mask carrier by a chucking device, for example a mechanical chuck such as a clamp, an electrostatic chuck or a magnetic chuck. Other types of chucking devices may be used that may be connected or integrated with the mask carrier.

[0024] For example, the mask may be an edge exclusion mask or a shadow mask. The edge exclusion mask is a mask configured to mask one or more edge regions of the substrate such that no material is deposited on the one or more edge regions during coating of the substrate. The shadow mask is a mask configured to mask a plurality of features to be deposited on a substrate. For example, the shadow mask may comprise an opening pattern having a plurality of small openings, for example 10,000 or more openings, especially 1,000,000 or more openings.

"Essentially vertical orientation" as used herein can be understood as an orientation with a deviation of 10° or less, in particular 5° or less, from the vertical orientation, ie from the gravity vector. For example, the angle between the main surface of the substrate (or mask) and the gravity vector may be +10° to -10°, in particular 0° to -5°. In some embodiments, the orientation of the substrate (or mask) is not exactly perpendicular during transfer and/or deposition, but with respect to the vertical axis, for example between 0° and -5°, in particular between -1° and -5°. It may be slightly inclined by the angle of inclination. The negative angle refers to the orientation of the substrate (or mask) with the substrate (or mask) inclined downward. Deviation of the substrate orientation from the gravity vector during deposition may be beneficial and may result in a more stable deposition process, or the downward orientation may be suitable to reduce particles on the substrate during deposition. However, precise vertical orientation (±1°) during transfer and/or during deposition is also possible. In other embodiments, the substrates and masks may be transferred in a non-vertical orientation, and/or the substrates may be coated in a non-vertical orientation, eg, an essentially horizontal orientation.

[0026] The apparatus 100 according to the embodiments described herein comprises a first carrier transport system 120 configured to transport the first carrier 10 in a first direction X along a first transport path, in particular Includes a magnetic levitation system. The first direction X may be essentially a horizontal direction. In FIG. 1, the first direction X is perpendicular to the paper plane.

The apparatus 100 further includes an alignment system 130 configured to align the first carrier 10 in the vacuum chamber 101. The alignment system 130 may be configured to accurately position the first carrier 10 in the vacuum chamber. In some embodiments, a deposition source 105 is provided within the vacuum chamber 101. The deposition source 105 is configured to deposit a coating material on the substrate 11 held by the first carrier 10.

[0028] Alignment system 130 is an alignment configured to move the first mount 152 in at least one alignment direction and a first mount 152 for mounting the first carrier 10 on the alignment system 130 It includes a device 151. The alignment system 130 is configured to move the alignment device 151 together with the first mount 152 in a second direction (Z) transverse to the first direction (X), in particular essentially perpendicular to the first direction. It further includes a first shifting device 141.

Thus, the first mount 152, for example, to perform coarse positioning of the first carrier mounted on the first mount, the second direction by the first shifting device 141 It can be moved to (Z), the first mount 152 is additionally by the alignment device 151, for example to perform fine positioning of the first carrier mounted on the first mount. Can be moved.

[0030] The second direction Z may be essentially a horizontal direction. The second direction Z may be essentially perpendicular to the first direction X in which the first carrier is conveyed by the first carrier conveying system 120. After transfer of the first carrier in the first direction (X), the first carrier is mounted on the first mount 152 and away from the first transfer path in the second direction (Z), for example the deposition source 105 ) Or towards the second carrier carrying the mask.

[0031] In some embodiments, the at least one alignment direction may essentially correspond to the second direction Z. Accordingly, the first carrier may be moved in the second direction Z by the first shifting device 141 and the alignment device 151. The first shifting device 141 may be configured to carry out the displacement of the first carrier in the second direction Z, and the alignment device 151 may be in a first direction X, which may be essentially vertical, It may be configured to perform fine alignment of the first carrier in at least one of the second direction Z and the third direction Y.

[0032] In some embodiments, the alignment device 151 may be in the second direction (Z), and optionally in the first direction (X), and in the third direction (Y) traversing the first and second directions. It is configured to move the first mount 152 in at least one direction. The third direction Y may be essentially a vertical direction. Accordingly, the first carrier may be accurately positioned in the first direction X, the second direction Z and/or the third direction Y by the alignment device 151. In other embodiments, the alignment device 151 may move the first mount only in two directions, for example, in the second direction (Z) and in the third direction (Y). In still other embodiments, the alignment device 151 may move the first mount only in one direction, particularly in the second direction Z.

[0033] The alignment device 151 and the first mount 152 may be fixed to the driven part 143 of the first shifting device 141, so that the alignment device 151 and the first mount ( The 152 may be moved in the second direction Z by the first shifting device 141. In some embodiments that may be combined with other embodiments described herein, the first shifting device 141 is driven by a driving unit 142 and a second direction ( It includes a driven portion 143 that can be moved to Z). The alignment device 151 is provided at the front end of the driven part 143, for example, the driven part 143 together with the first mount 152, and moves together with the driven part 143 in the second direction (Z). It can be possible. The driven part 143 may include a linear extension bar or arm extending in the second direction Z from the outside of the vacuum chamber into the vacuum chamber, and may be moved by the driving unit 142 .

[0034] In some embodiments that may be combined with other embodiments described herein, the driving unit 142 of the first shifting device 141 is the driven unit 143 in the second direction (Z). It may comprise a linear actuator configured to move a distance of 10 mm or more, in particular 20 mm or more, more particularly 30 mm or more. For example, the drive unit 142 is a mechanical actuator configured to move the driven part 143 by a distance of 10 mm or more in the second direction Z, an electro-mechanical actuator such as a stepper motor, an electric motor. , Hydraulic actuators and/or pneumatic actuators.

[0035] In some embodiments that may be combined with other embodiments described herein, the alignment device 151 includes at least one precision actuator configured to move the first mount in at least one alignment direction, eg For example, it may include at least one piezoelectric actuator. In particular, the alignment device 151 comprises two or three piezoelectric actuators configured to move the first mount in two or three alignment directions. The piezoelectric actuator of the alignment device 151 may be configured to move the first mount 152 in a second direction (Z) and optionally in a first direction (X) and/or a third direction (Y). . The alignment device 151 may be configured to fine-position (or fine-align) the first mount 152 on which the first carrier is mounted in at least one alignment direction. For example, the alignment device can be configured to position the first carrier with an accuracy of less than 5 μm, in particular with an accuracy of less than μm. Accordingly, the alignment device 151 is provided to the driven portion 143 of the first shifting device together with the first mount 152, so that the rough positioning of the first mount is performed by the first shifting device 141. And fine positioning of the first mount may be provided by the alignment device 151.

[0036] In some embodiments that may be combined with other embodiments described herein, the first mount 152 is configured to magnetically hold the first carrier 10 to the first mount 152. Includes Chuck. For example, the first mount 152 may include an electropermanent magnet device configured to magnetically hold a first carrier to the first mount. The electropermanent magnet device can be switched between a held state and a released state by applying an electric pulse to a coil of the electropermanent magnet device. In particular, the magnetization of at least one magnet of the electropermanent magnet device can be changed by applying an electric pulse.

[0037] The method of aligning the first carrier 10 in the vacuum chamber is (i) transferring the first carrier 10 into the deposition area of the vacuum chamber 101 in the first direction X along the first transfer path. It may include the step of. The first carrier 10 can be conveyed contactlessly by means of a first carrier conveying system 120, in particular by means of a magnetic levitation system with at least one magnet unit 121. The at least one magnet unit 121 may be an actively controlled magnet unit configured to hold the first carrier 10 in a non-contact manner to a guiding rail. (Ii) Mounting the first carrier to the first mount 152 of the alignment system 130 in the deposition area. The alignment system 130 includes an alignment device 151 configured to move the first mount in at least one alignment direction, and a first shifting configuration configured to move the alignment device together with the first mount in a second direction Z It includes a device 141. Mounting the first carrier to the first mount 152 includes the first carrier 10 positioned on the first transport path until the first mount 152 contacts the first carrier and attaches to the first carrier. It may include moving the first mount 152 toward. For example, the first mount 152 is magnetically attached to the first carrier.

(Iii) moving the first carrier together with the alignment device 151 in the second direction Z by the first shifting device 141. For example, the driven portion 143 of the first shifting device 141 has a distance of 10 mm or more toward the deposition source 105 or toward the second carrier 10 in the second direction Z You can move as much. (Iv) aligning the first carrier in at least one alignment direction by the alignment device 151. The step of aligning the first carrier 10 is in the second direction (Z), and optionally in at least one of the first direction (X) and the third direction (Y), in particular in the interior of the vacuum chamber 101. It may include fine positioning of the first carrier 10 through at least one piezoelectric actuator provided to the driven portion 143 of the first shifting device 141. Thus, precise alignment of the first carrier 10 can be provided by the device 100 described herein.

FIG. 2 shows in a schematic cross-sectional view an apparatus 200 for carrier alignment in a vacuum chamber 101, according to some embodiments described herein. The device 200 is similar to the device 100 shown in FIG. 1, so that the above descriptions may be referred to, and these descriptions are not repeated here.

The device 200 comprises a first carrier transport system 120 configured to transport the first carrier 10 in a first direction X. The first carrier transfer system 120 may comprise a magnetic levitation system having at least one magnet unit 121, in particular at least one actively controlled magnet unit configured to non-contact holding the first carrier 10 to the guide structure. have.

[0041] The device 200 further includes an alignment system 130, wherein the alignment system 130 includes a first mount 152 configured to mount the first carrier 10 to the alignment system 130, at least one Alignment device 151 configured to move the first mount 152 in the alignment direction, and moving the alignment device with the first mount in a second direction Z, which may be essentially perpendicular to the first direction X It has a first shifting device 141 that is configured to allow.

The first shifting device 141 includes a drive unit 142 and a driven part 143 that can be moved in the second direction Z by the drive unit 142. The alignment device 151 and the first mount 152 are provided on the driven portion 143 of the first shifting device 141 so as to be movable together with the driven portion 143.

[0043] In some embodiments that may be combined with other embodiments described herein, the drive unit 142 of the first shifting device 141 is provided to be arranged outside the vacuum chamber 101, And/or the driven part 143 is provided so as to extend from the drive unit 142 into the vacuum chamber 101, in particular through the opening of the side wall 102 of the vacuum chamber 101.

When the drive unit 142 is arranged outside the vacuum chamber, that is, under atmospheric pressure, a non-vacuum compatible drive unit that is typically more cost effective and easier to handle than a vacuum compatible drive unit can be used. In addition, any type of drive unit 142 may be provided, including for example an electric motor or a stepper motor. Generation of particles inside the vacuum chamber by a drive unit, which may include mechanical bearings, can be avoided. For example, a linear Z-actuator can be used. The maintenance of the drive unit can be facilitated.

[0045] In some embodiments, which may be combined with other embodiments described herein, the device 200 is vibration damping or vibration isolation between the alignment system and the wall of the vacuum chamber 101, in particular the sidewall 102. It further includes a vibration damping element 103 or a vibration insulating element for providing a. For example, the alignment system 130 can extend through the wall of the vacuum chamber 101 and can be flexibly connected to the wall through the vibration damping element 103. The term "flexibly connected" as used herein relates to the connection between the alignment system 130 and the sidewall 102 of the vacuum chamber 101, which connection is the sidewall 102 And relative movement between the alignment system 130, for example deformation or vibration. In other words, the entire alignment system (including the drive unit arranged outside the vacuum chamber) is movably mounted relative to the side wall so that vibrations and other deformations of the side wall are not substantially transmitted from the side wall to the alignment system. This is in contrast to conventional bellow-sealed motion feedthroughs that allow movement of the positioner in the vacuum chamber while securing the positioner's drive unit to the sidewall of the vacuum chamber. Accordingly, conventional motion feedthroughs are rigidly fixed to the sidewall of the vacuum chamber through which they extend, and there is no vibration damping on the sidewall.

[0046] The vibration damping element 103 may seal the opening of the sidewall of the vacuum chamber through which the alignment system 130 extends in a vacuum-tight manner.

[0047] The vibration damping element 103 or the vibration isolation element may comprise at least one flexible or resilient element, in particular at least one inflatable element, for example an axially expandable element such as a bellows element. For example, the vibration damping element 103 may include an elastic and vacuum-tight seal that acts between the sidewall 102 of the vacuum chamber and the alignment system 130. In some embodiments, the longitudinal axis of the axially expandable element may extend in the second direction Z. For example, a resilient and/or expandable element, such as a bellows element, connects the alignment system 130 to the sidewall of the vacuum chamber such that the opening of the sidewall 102 through which the alignment system 130 extends is closed in a vacuum-tight manner. 102). Thus, because the vibration damping element allows relative movement between the sidewall 102 and the alignment system 130, vibrations and other deformations of the sidewall 102 are not transmitted directly to the alignment system 130. In particular, the (fixed) body 131 of the alignment system 130 extends through the sidewall and is mounted movably relative to the sidewall via a vibration damping element 103.

The sidewall 102 of the vacuum chamber 101 through which the alignment system 130 extends may be a different wall than the top and bottom walls of the vacuum chamber 101, such as a sidewall extending essentially vertically. The sidewall 102 of the vacuum chamber is typically less stable than the top wall, which may be reinforced by stabilizing elements such as reinforcing beams or reinforcing ribs. Thus, for example, when the pressure inside the vacuum chamber changes, the sidewall 102 may at least partially deform or vibrate. Accordingly, it is advantageous to mechanically insulate the alignment system 130 from the sidewall 102 so that deformations and other movements of the sidewall are not transmitted (directly) onto the alignment system. Rather, the alignment system 130 can be rigidly fixed to a separate support 110 that can be fixed to the top wall of the vacuum chamber. Accordingly, alignment accuracy may be improved, and the position of the alignment system 130 may be maintained even when the sidewall 102 moves during a pressure change inside the vacuum chamber.

[0049] In some embodiments, at least one additional flexible element 104, for example an axially expandable element such as a bellows element, first shifts the body 131 of the alignment system 130 It can be flexibly connected to the driven part 143 of the device 141. The additional flexible element 104 can allow movement of the driven part 143 in the second direction Z within the vacuum chamber 101, while the drive unit 142 is outside the vacuum chamber 101. Can be placed on For example, the drive unit 142 may be (rigidly) fixed to the body 131 of the alignment system 130 outside the vacuum chamber. The additional flexible element 104 can separate the vacuum environment surrounding the additional flexible element from the atmospheric environment inside the additional flexible element. The movable bar or arm of the driven portion 143 may extend axially through an additional flexible element.

According to the embodiments described herein, the first mount 152 may be moved in the second direction Z by the first shifting device 141 together with the alignment device 151. In particular, the first mount 152 is a first shifting device toward the first carrier 10 positioned on the first transport path until the first mount 152 contacts and attaches to the first carrier 10. Can be moved by (141). Next, the first mount-the first carrier is mounted thereon-can be moved by the first shifting device 141 toward the deposition source 105 or toward the second carrier in the second direction (Z). have. After that, fine alignment of the first carrier through the alignment device 151 may follow.

[0051] The drive unit 142 (eg, provided as a linear Z-actuator) of the first shifting device 141 may be arranged outside the vacuum chamber 101. The front portion of the driven portion 143 of the first shifting device 141 carrying the alignment device 151 and the first mount 152 may be arranged inside the vacuum chamber. Since the alignment system 130 is connected to the sidewall through the vibration damping element 103, movements of the sidewall 102 of the vacuum chamber 101 through which the driven part 143 extends are not transmitted to the alignment system 130. Does not. Even when the pressure in the vacuum chamber changes, or when the vacuum chamber is flooded and/or evacuated, an accurate and reproducible alignment of the first carrier can be provided.

[0052] Figure 2 shows a vacuum system for carrier alignment in a vacuum chamber, according to embodiments described herein. The vacuum system includes a vacuum chamber 101 having a side wall 102, which side wall may extend in an essentially vertical direction (±20°). The alignment system 130 as described herein extends through the sidewall 102 and through the vibration damping element 103, in particular through a flexible and/or expandable element such as a bellows element, to the sidewall 102. Connected flexibly. The drive unit 142 of the alignment system 130 can be arranged outside the vacuum chamber, and the alignment device 151 of the alignment system 130, which can be moved by the drive unit 142, will be arranged inside the vacuum chamber. I can. The first mount 152 of the alignment system 130 can be moved by the alignment device 151 and is configured to be attached with the first carrier 10.

[0053] The alignment system 130 may be (firmly) fixed to a support 110 provided within the vacuum chamber, for example attached to the top wall of the vacuum chamber. In some embodiments that may be combined with other embodiments described herein, the support 110 extends in a first direction (X), and at least one magnet unit 121 of the first carrier transfer system 120 ) To carry or support. Thus, at least one magnet unit 121 and both of the alignment system 130 are fixed to the same mechanical support inside the vacuum chamber, so that vibrations or other movements of the vacuum chamber can cause the alignment system 130 and the magnetic levitation system to float It is transmitted to the magnets to the same degree. Alignment accuracy can be further improved, and carrier transport can be facilitated.

[0054] The vacuum system may be a vacuum deposition system configured to deposit one or more materials on a substrate carried by the first carrier 10. A deposition source 105, in particular a vapor source configured to evaporate organic materials, may be provided in the vacuum chamber. The deposition source 105 may be arranged such that material can be directed from the deposition source 105 towards a first carrier mounted to the first mount 152 of the alignment system.

[0055] The deposition source 105 may be a movable deposition source. In particular, the deposition source 105 may be movable in the first direction X past the substrate carried by the first carrier. A drive may be provided for providing translational movement of the deposition source 105 in the first direction X.

[0056] Alternatively or additionally, the deposition source may comprise a rotatable distribution pipe provided with vapor outlets. The distribution pipe may extend in an essentially vertical direction and may be rotatable about an essentially vertical axis of rotation. The deposition material can be evaporated in a crucible of the evaporation source and can be directed towards the substrate through vapor outlets provided in the distribution pipe.

[0057] In particular, the deposition source 105 may be provided as a line source extending in an essentially vertical direction. The height in the vertical direction of the deposition source 105 may be adapted to the height of the vertically oriented substrate, so that the substrate can be coated by moving the deposition source 105 past the substrate in the first direction X.

[0058] In some embodiments, the first carrier transfer system 120 transfers the first carrier 10 into the deposition area in the vacuum chamber 101 where the substrate 11 faces the deposition source 105 to coat the coating. It can be configured to allow the material to be deposited on the substrate. After depositing the coating material on the substrate, the first carrier transfer system 120 may, for example, unload the coated substrate from the vacuum chamber, or deposit another coating material on the substrate in a different deposition area. For this purpose, the first carrier 10 may be transferred outside the deposition area.

[0059] The deposition source 105 may include a distribution pipe having a plurality of vapor openings or nozzles for directing the coating material into the deposition area. Additionally, the deposition source may include a crucible configured to heat and evaporate the coating material. The crucible may, for example, be connected to the distribution pipe in fluid communication with the distribution pipe.

[0060] In some embodiments that may be combined with other embodiments described herein, the deposition source may be rotatable. For example, the deposition source may be rotatable from a first orientation in which the vapor openings of the deposition source are oriented toward the deposition region to a second orientation in which the vapor openings are oriented toward the second deposition region. The deposition area and the second deposition area may be located on opposite sides of the deposition source, and the deposition source may be rotatable by an angle of about 180° between the deposition area and the second deposition area.

[0061] The first carrier transfer system 120 may be configured to transfer the first carrier 10 in the vacuum chamber 101 in a non-contact manner. For example, the first carrier transport system 120 may hold and transport the first carrier 10 by magnetic forces. In particular, the first carrier transport system 120 may comprise a magnetic levitation system.

[0062] In the exemplary embodiment of FIG. 2, the first carrier transport system 120 is at least partially arranged over the first carrier 10 and configured to carry at least a portion of the weight of the first carrier 10. It includes a magnet unit 121. At least one magnet unit 121 may include an active controlled magnet unit configured to hold the first carrier 10 in a non-contact manner. The first carrier transport system 120 may further comprise a drive device configured to non-contactly move the first carrier 10 in the first direction X. In some embodiments, the drive device can be arranged at least partially below the first carrier 10. The drive device may include a drive device such as a linear motor configured to move the first carrier by applying a magnetic force on the first carrier (not shown).

3 shows an apparatus 300 for carrier alignment in a vacuum chamber 101 according to embodiments described herein. The device 300 is similar to the device 200 shown in FIG. 2, so that the above descriptions may be referred to, and these descriptions are not repeated here.

The alignment system 130 of the device 300 includes a first mount 152 for mounting the first carrier 10 to the alignment system, a second mount for mounting the second carrier 20 to the alignment system (153), the first shifting device 141 configured to move the first mount together with the alignment device 151 in the second direction Z, and to move the second mount in the second direction Z And a configured second shifting device 144.

The first carrier 10 is typically a substrate carrier carrying the substrate 11 to be coated, and the second carrier 20 typically carries a mask 21 to be arranged in front of the substrate 11 during deposition. It is a mask carrier to carry. The first carrier 10 and the second carrier 20 can be aligned relative to each other by the alignment system 130 so that the evaporated material can be accurately deposited on the substrate in a predetermined pattern as defined by the mask. have.

In particular, the second carrier 20 mounted on the second mount 153 may be moved to a predetermined position in the second direction Z by the second shifting device 144. The first carrier 10 may be moved to a predetermined position adjacent to the second carrier 20 in the second direction Z by the first shifting device 141. The first carrier 10 can then be aligned by means of the alignment device 151 in an alignment direction, in particular in a second direction Z, and/or optionally in one or more other alignment directions.

[0067] In some embodiments that may be combined with other embodiments described herein, the alignment system 130 extends through the sidewall 102 of the vacuum chamber 101, for example at least one vibration It is flexibly connected to the side wall 102 via a damping element 103 or a vibration insulating element. The vibration damping element may be an axially expandable element such as a bellows element. The vibration damping element can be a flexible or resilient sealing element that reduces the transfer of deformations of the sidewall to the alignment system. The flexible or resilient sealing element can act as a vacuum-tight seal between the sidewall and the alignment system. Reference is made to the above descriptions, and these descriptions are not repeated here.

[0068] In some embodiments, the second shifting device 144 is in a second direction (Z) by a second drive unit 145, for example a linear actuator or motor, and a second drive unit 145. It includes a second driven part 146 that is moved to. The second mount 153 is provided on the second driven part 146 to be movable together with the second driven part 146.

[0069] The second driving unit 145 may be arranged outside the vacuum chamber 101, and the second driven part 146 is, in particular, through an opening provided in the side wall 102 of the vacuum chamber, the vacuum chamber 101 ) Can be extended within. The second mount 153 is provided inside the vacuum chamber 101 at the front end of the second driven part 146. Accordingly, the second carrier 20 may be mounted on the second mount 153 provided inside the vacuum chamber. In addition, the second carrier 20 may be moved in the second direction Z inside the vacuum chamber 101 by the second shifting device 144 having the second driving unit 145 arranged outside the vacuum chamber. I can.

In some embodiments, the alignment system 130 includes a body 131 fixed to a support 110 provided inside the vacuum chamber. The drive unit 142 of the first shifting device 141 and the second drive unit 145 of the second shifting device 144 may be fixed to the body 131 of the alignment system 130. The body 131 of the alignment system 130 may provide a feedthrough through the sidewall 102 for the driven portion 143 of the first shifting device and the second driven portion 146 of the second shifting device. have. The body 131 of the alignment system 130 can be flexibly connected to the sidewall 102 of the vacuum chamber 101 via a vibration damping element 103.

The body 131 of the alignment system 130 may be fixed to the support 110. The support 110 may be fixed (directly or indirectly) to the uppermost wall of the vacuum chamber and/or provided as a support rail or support girder that may extend in a first direction (X). have. The top wall of the vacuum chamber is typically more strongly reinforced and less movable than the vertically extending sidewalls.

[0072] In some embodiments that may be combined with other embodiments described herein, the first carrier transport system 120 is configured to transport the first carrier in the first direction X along the first transport path. The second carrier transport system 122 may be provided to transport the second carrier 20 in a first direction X along a second transport path parallel to the first transport path. The first carrier transport system 120 and/or the second carrier transport system 122 may be configured with magnetic levitation systems for non-contact carrier transport. In particular, the first carrier transport system 120 may comprise at least one magnet unit 121 for holding the first carrier 10 in a contactless manner, in particular an active controlled magnet unit. The second carrier transfer system 122 may comprise at least one second magnet unit 123, in particular an active controlled magnet unit, for holding the second carrier 20 contactless. Typically, each magnetic levitation system comprises a plurality of actively controlled magnetic units which can be arranged along the first direction X at essentially equal spacing. For example, the active controlled magnet unit may be fixed to the support 110.

[0073] In the schematic cross-sectional view of FIG. 3, the first carrier 10 and the second carrier 20 are formed by active controlled magnetic units of the first carrier transfer system 120 and the second carrier transfer system 122. It remains contactless. The first mount 152 is provided at a predetermined distance from the first carrier 10 in the second direction (Z), and the second mount 153 is provided at a predetermined distance from the second carrier 20 in the second direction (Z). Is provided in.

4A shows the device 300 of FIG. 3 in a second position. The second carrier 20 moves the second mount to the second carrier 20 in the second direction (Z) and magnetically attaches the second carrier 20 to the second mount 153, thereby It is mounted on the mount 153. Next, the second carrier 20 is moved by the second shifting device 144 to a predetermined position in the second direction Z, for example by a distance of 20 mm or more. In particular, the mask 21 carried by the second carrier 20 is positioned at a predetermined position facing the deposition source 105.

As further shown in FIG. 4A, the first carrier 10 carrying the substrate 11 is transferred into the deposition area by the first carrier transfer system 120, and the first mount 152 is It is mounted on the first carrier by moving the first mount 152 to the first carrier 10 by the first shifting device 141.

As schematically shown in FIG. 4B, next, the first carrier 10 is removed by the first shifting device 141 until the substrate 11 is positioned close to the mask 21. It is moved toward the second carrier 20 in two directions (Z). The first carrier 10 is then aligned by means of an alignment device 151 in at least one alignment direction, in particular in a second direction Z. The first carrier 10 can be accurately positioned in a predetermined position by an alignment device 151 that can include one or more piezo actuators.

One or more materials may be deposited on the substrate 11 by the deposition source 105 through the openings of the mask 21. The correct material pattern can be deposited on the substrate.

[0078] Figure 5 is an exploded view of an alignment system 130 of an apparatus according to embodiments described herein. The alignment system 130 is similar to the alignment system of the apparatus shown in FIG. 3, and the above descriptions may be referenced accordingly, and these descriptions are not repeated here.

[0079] The alignment system 130 is a body that can be flexibly connected to the side wall 102 of the vacuum chamber 101 (not shown in FIG. 5) through a vibration damping element 103, for example a bellows element It includes (131). The drive unit 142 (for example, a first Z-actuator) and a second drive unit 145 (for example, a second Z-actuator) are fixed to the main body 131 outside the vacuum chamber 101 . In some embodiments, the body 131 is rigidly fixed to the support inside a vacuum chamber (not shown in FIG. 5), for example via screws or bolts 108 , It is flexibly connected to the sidewall 102.

The driving unit 142 is configured to move the first driven part 143 extending into the vacuum chamber through the main body 131 in the second direction (Z), and the second driving unit 145 It is configured to move the second driven portion 146 extending into the vacuum chamber through the main body 131 in two directions (Z). A first mount 152 for mounting the first carrier to the alignment system is provided at the front end of the first driven portion 143, and a second mount 153 for mounting the second carrier to the alignment system is provided as a second mount. It is provided at the front end of the driven portion 146. Thus, the first mount 152 and the second mount 153 are provided by each shifting device to position the first and second carriers at respective predetermined positions in the second direction (Z). They can be moved independently of each other in two directions (Z).

[0081] The second driven part 146 protrudes more into the vacuum chamber than the first driven part 143, so that the first carrier and the second carrier are provided at the front ends of the driven parts in the second mount and the first mount. It allows them to be kept adjacent to each other.

[0082] The first mount 152 is connected to the first driven part 143 through an alignment device 151, in particular comprising at least one piezoelectric actuator. Thus, by accurately positioning the first mount 152 to a predetermined position by the alignment device 151, fine positioning (or fine alignment) of the first carrier with respect to the second carrier can be performed.

6 shows a perspective view of the alignment system 130 of FIG. 5. A small gap is provided between the body 131 of the alignment system 130 and the side wall 102 of the vacuum chamber, for example when the side wall vibrates due to a pressure change inside the vacuum chamber or when the side wall moves. , The main body 131 does not move together with the side wall 102.

[0084] In some embodiments, the apparatus includes two or more alignment systems within the deposition area, spaced apart from each other in a first direction (X). Each alignment system may be configured according to the alignment system 130 according to the embodiments described herein. For example, a first mount of a first alignment system can be configured to hold an upper front portion of a first carrier, and a first mount of a second alignment system can be configured to hold an upper rear portion of a first carrier. have. Each alignment system may extend through the sidewall 102 of the vacuum chamber such that the respective drive units of the respective shifting devices are positioned outside the vacuum chamber. In addition, each alignment system can be flexibly connected to the sidewall of the vacuum system through a respective vibration isolation element. In some embodiments, each alignment system is mechanically fixed to the same support provided inside the vacuum chamber, for example fixed to the top wall of the vacuum chamber.

[0085] The alignment device of the first alignment system may be configured to align the first carrier in a first direction (X), a second direction (Z) and a third direction (Y), and the alignment of the second alignment system The device may be configured to align the first carrier in a first direction (Z) and a third direction (Y). Additional alignment systems may be provided with additional alignment devices. Thus, the first carrier, which is a three-dimensional object, can be accurately positioned and rotated at a predetermined translation and rotation position within the deposition area relative to the second carrier.

[0086] In some embodiments that may be combined with other embodiments described herein, the driven portion 143 of the first shifting device includes a supply element such as a cable as a component arranged inside the vacuum chamber 101. It is configured to feed to. In particular, the driven unit 143 includes a hollow tube element consisting of a cable passage for cables extending from the outside of the vacuum chamber to the components arranged at the front end of the driven unit 143 inside the vacuum chamber 101. Include. For example, at least one cable connected to at least one of the alignment device 151 and the first mount 152 may extend through the hollow tube element of the driven part 143. Accordingly, power may be supplied to a component that can move in the second direction Z inside the vacuum chamber. For example, the piezoelectric actuator of the alignment device 151 and/or the magnetic chuck of the first mount 152 may be supplied with electric power from the outside of the vacuum chamber through the driven portion 143.

[0087] In some embodiments, the second driven portion 145 of the second shifting device also provides a supply element such as a cable to a component arranged inside the vacuum chamber, for example a second driven portion ( 145). For example, power may be supplied to the second mount 153 through the driven unit 145 from outside the vacuum chamber.

7 is a flow chart illustrating a method of aligning a first carrier in a vacuum chamber, according to embodiments described herein.

In the box 830, a first carrier capable of carrying a substrate to be coated is transferred in a first direction X along a first transfer path in the vacuum chamber 101. The first carrier may be transported into the deposition area where the deposition source 105 and alignment system 130 are arranged. In some embodiments, the first carrier 10 is conveyed contactlessly by a magnetic levitation system comprising a plurality of actively controlled magnetic units.

In box 840, the first carrier is mounted to the first mount of the alignment system 130. The alignment system includes an alignment device configured to move the first mount in at least one alignment direction, and a first shifting device configured to move the alignment device with the first mount in a second direction transverse to the first direction. do. The second direction can be a horizontal direction essentially perpendicular to the first direction.

[0091] In box 850, the first carrier is moved (with the alignment device) in a second direction by the first shifting device, in particular towards the previously positioned mask carried by the second carrier.

[0092] In box 860, the first carrier is aligned by the alignment device in at least one alignment direction, in particular in a second direction, and optionally in at least one of the first and third directions. In particular, the substrate carried by the first carrier 10 is moved to contact the mask carried by the second carrier.

[0093] In optional box 870, material is deposited on the substrate carried by the first carrier. In particular, the evaporated organic material is deposited on the substrate by a vapor source that can move past the substrate.

[0094] In embodiments that may be combined with other embodiments described herein, the first carrier is a substrate carrier carrying a substrate, and aligning the first carrier is a first mounted to a second mount of the alignment system. Aligning the first carrier with respect to the two carriers. In particular, the second carrier is a mask carrier that carries the mask.

[0095] In the optional box 810, the second carrier 20 carrying the mask 21 is into the deposition area in the first direction X along a second transfer path extending parallel to the first transfer path. Is transported. The second carrier 20 can be conveyed in a non-contact manner by a magnetic levitation system comprising a plurality of actively controlled magnetic units.

[0096] In optional box 820, the second carrier 20 is mounted to a second mount of the alignment system 130, the second carrier being second by a second shifting device of the alignment system 130. It is moved in the direction Z, in particular towards the deposition source. Next, the method may proceed to box 830.

[0097] The apparatus described herein may be configured to evaporate an organic material, for example for the manufacture of OLED devices. For example, the deposition source can be an evaporation source, in particular an evaporation source for depositing one or more organic materials on a substrate to form a layer of an OLED device.

[0098] The embodiments described herein can be used for evaporation onto large area substrates for manufacturing an OLED display, for example. Specifically, substrates on which structures and methods according to embodiments described herein are provided are, for example, large area substrates having a surface area of 0.5 m 2 or more, in particular 1 m 2 or more. For example, a large area substrate or carrier is GEN 4.5 corresponding to a surface area of about 0.67 m 2 (0.73 m × 0.92 m), GEN 5 corresponding to a surface area of about 1.4 m 2 (1.1 m × 1.3 m), about 4.29 m 2 ( GEN 7.5, corresponding to a surface area of 1.95 m × 2.2 m), GEN 8.5 corresponding to a surface area of about 5.7 m (2.2 m × 2.5 m), or even GEN corresponding to a surface area of about 8.7 m (2.85 m × 3.05 m) May be 10. Larger generations such as GEN 11 and GEN 12 and corresponding surface areas can similarly be implemented. Half the sizes of GEN generations can also be provided for OLED display manufacturing.

[0099] According to some embodiments that may be combined with other embodiments described herein, the substrate thickness may be 0.1 to 1.8 mm. The substrate thickness can be about 0.9 mm or less, such as 0.5 mm. The term "substrate" as used herein may encompass, in particular, substantially inflexible substrates, for example slices of transparent crystals such as wafers, sapphire, or the like, or a glass plate. However, the present disclosure is not limited thereto, and the term “substrate” may also encompass flexible substrates such as a web or foil. The term “substantially inflexible” is understood to be distinct for “flexible”. Specifically, a substantially non-flexible substrate may have a glass plate having a certain degree of flexibility, for example a thickness of 0.9 mm or less, such as 0.5 mm or less, and the flexibility of the substantially non-flexible substrate is the flexible substrates. It is small compared to

[00100] According to the embodiments described herein, the substrate can be made of any material suitable for material deposition. For example, the substrate may be coated by glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, carbon fiber materials or any other materials, or a deposition process. It can be made of a material selected from the group consisting of possible combinations of materials.

[00101] According to embodiments described herein, a method for transferring and aligning a substrate carrier and a mask carrier in a vacuum chamber communicates with computer programs, software, computer software products, and corresponding components of the apparatus. This can be accomplished using interrelated controllers that can have CPU, memory, user interface, and input and output devices.

[00102] The present disclosure provides a first carrier transport system for a first carrier and a second carrier transport system for a second carrier, which may be equally sized to at least one dimension. In other words, the second carrier can fit within the first carrier transfer system, and the first carrier can fit within the second carrier transfer system. The first carrier transport system and the second carrier transport system can be used flexibly while providing accurate and smooth transport of carriers through the vacuum system. The alignment system allows precise alignment of the substrate to the mask, and vice versa. High quality processing results can be achieved, for example for the production of high-resolution OLED devices.

[00103] In other embodiments, the mask carriers and the substrate carriers may be sized differently. For example, the mask carriers can be larger than the substrate carriers, especially in the vertical direction, as schematically shown in FIG. 3.

[00104] The above description relates to embodiments of the present disclosure, but other embodiments and additional embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope thereof is as follows. Is determined by the claims of.

Claims (16)

As an apparatus for carrier alignment in the vacuum chamber 101,
A first carrier transport system 120 configured to transport a first carrier 10 along a first transport path in a first direction X; And
Including an alignment system 130,
The alignment system 130,
A first mount (152) for mounting the first carrier (10) to the alignment system (130);
An alignment device 151 configured to move the first mount 152 in at least one alignment direction; And
A first shifting device configured to move the alignment device 151 together with the first mount 152 in a second direction Z transverse to the first direction X ( 141), including,
Device for alignment of carriers in the vacuum chamber 101. The method of claim 1,
The first shifting device 141 includes a driving unit 142 and a driven part 143, and the alignment device 151 and the first mount 152 are Provided to the driven part to be movable together with the eastern part 143,
Device for alignment of carriers in the vacuum chamber 101. The method of claim 2,
The drive unit 142 includes a linear actuator configured to move the driven part 143 in the second direction Z by a distance of 10 mm or more,
Device for alignment of carriers in the vacuum chamber 101. The method of claim 2,
The driving unit 142 is arranged outside the vacuum chamber 101, and the driven part 143 extends from outside the vacuum chamber into the vacuum chamber,
Device for alignment of carriers in the vacuum chamber 101. The method of claim 2,
The driven part 143 includes a hollow tube element configured to feed a cable to a component arranged inside the vacuum chamber 101,
Device for alignment of carriers in the vacuum chamber 101. The method according to any one of claims 1 to 5,
The alignment system 130 extends through the wall of the vacuum chamber, and is flexibly connected to the wall via at least one vibration damping element 103,
Device for alignment of carriers in the vacuum chamber 101. The method of claim 6,
The vibration damping element 103 includes at least one sealing element having at least one of flexibility or elasticity,
Device for alignment of carriers in the vacuum chamber 101. The method according to any one of claims 1 to 5,
The alignment device 151 comprises at least one piezo actuator,
Device for alignment of carriers in the vacuum chamber 101. The method according to any one of claims 1 to 5,
The alignment device 151 is configured to move the first mount 152 in the second direction (Z) and in at least one of the first direction (X) and the third direction (Y), , The third direction (Y) crosses the first and second directions,
Device for alignment of carriers in the vacuum chamber 101. The method according to any one of claims 1 to 5,
The first mount 152 comprises a magnetic chuck configured to magnetically hold the first carrier to the first mount,
Device for alignment of carriers in the vacuum chamber 101. The method according to any one of claims 1 to 5,
The alignment system 130,
A second mount (153) for mounting a second carrier to the alignment system (130); And
Further comprising a second shifting device (144) configured to move the second mount (153) in the second direction (Z),
Device for alignment of carriers in the vacuum chamber 101. The method according to any one of claims 1 to 5,
The first carrier transfer system 120 is configured to non-contactly transfer the first carrier 10 in the first direction X and includes a plurality of actively controlled magnet units. A magnetic levitation system,
Device for alignment of carriers in the vacuum chamber 101. A vacuum system for carrier alignment in a vacuum chamber, comprising:
A vacuum chamber 101 having a side wall 102; And
Including an alignment system 130,
The alignment system 130,
A first mount (152) for mounting a first carrier (10) to the alignment system (130);
An alignment device 151 configured to move the first mount 152 in at least one alignment direction; And
A first shifting device 141 configured to move the alignment device 151 together with the first mount 152 in a second direction Z transverse to the first direction X,
The alignment system 130 extends through the sidewall 102 and is flexibly connected to the sidewall 102,
Vacuum system for carrier alignment in vacuum chambers. A method of aligning carriers in a vacuum chamber, comprising:
Conveying the first carrier 10 in the first direction X along the first conveying path;
Mounting the first carrier to the first mount 152 of the alignment system 130-the alignment system is an alignment device 151 configured to move the first mount in at least one alignment direction, and the first Comprising a first shifting device (141) configured to move the alignment device with the first mount in a second direction (Z) transverse to one direction;
Moving the first carrier in the second direction (Z) by the first shifting device (141); And
Aligning the first carrier in at least one alignment direction by means of the alignment device (151),
How to align the carrier in a vacuum chamber. The method of claim 14,
The first carrier 10 is a substrate carrier carrying the substrate 11,
Aligning the first carrier comprises aligning the first carrier with respect to a second carrier (20) mounted to a second mount of the alignment system.
How to align the carrier in a vacuum chamber. delete

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