KR102167337B1 - Manufacturing method of laser direct structuring type circuit substrate with coherence and adhesion - Google Patents

Abstract

Disclosed is an LDS type circuit board having excellent adhesion and adhesion, and a method of manufacturing the same, which improves adhesion and adhesion by arranging a primer paint coating layer surface-modified by heat corrosion treatment between a metal substrate and a photoreactive paint coating layer.
The method of manufacturing an LDS type circuit board having excellent adhesion and adhesion according to the present invention includes the steps of: (a) applying a primer coating composition on a metal substrate and drying to form a primer coating layer; (b) modifying the surface of the primer coating layer by thermal corrosion treatment; (c) applying a photoreactive paint composition on the surface-modified primer paint coating layer and drying to form a photoreactive paint coating layer; And (d) performing selective laser irradiation on the photoreactive paint coating layer to elute the photoreactive filler inside the photoreactive paint coating layer, and plating the eluted photoreactive filler to form a circuit pattern. It characterized in that it includes.

Description

LDS type circuit board manufacturing method with excellent adhesion and adhesion {MANUFACTURING METHOD OF LASER DIRECT STRUCTURING TYPE CIRCUIT SUBSTRATE WITH COHERENCE AND ADHESION}

The present invention relates to an LDS type circuit board having excellent adhesion and adhesion, and to a method for manufacturing the same, and more particularly, by disposing a surface-modified primer paint coating layer between a metal substrate and a photoreactive paint coating layer by means of a thermal corrosion treatment. It relates to an LDS type circuit board having improved adhesion and adhesion, and a manufacturing method thereof.

Recently, Laser Direct Structuring (LDS), which forms accurate patterns and circuits by laser processing and plating, has been used. LDS can form patterns and circuits with a simple process including laser activation and electroless plating treatment on an injection product. Specifically, after the laser beam moves on the injection molding device (MID) to activate the plastic surface at the position where the conductive path is to be arranged, a small conductive path width (eg, 150 μm or less) is reduced by using the composition for direct laser structuring. It can be obtained, and there is an advantage that it is possible to express a detailed pattern.

However, this method requires a separate injection product in that a fine pattern is formed using the injection product. In addition, since the composition is not excellent in heat resistance and adhesion stability, there is a problem in that the substrate and the coating film are peeled off or lifted during laser processing after coating the composition on the substrate.

As a related prior document, there is Korean Laid-Open Patent Publication No. 10-2014-0091029 (published on July 18, 2014), which describes a thermoplastic composition for use in the formation of a laser direct structure substrate.

It is an object of the present invention to provide an LDS type circuit board having excellent adhesion and adhesion, and a method for manufacturing the same, which improves adhesion and adhesion by disposing a primer paint coating layer surface-modified by thermal corrosion treatment between a metal substrate and a photoreactive paint coating layer. will be.

The LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention for achieving the above object includes a metal substrate; A primer coating layer disposed on the metal substrate and having fine projections formed on an upper surface thereof; A photoreactive paint coating layer disposed on the primer paint coating layer, attached to the primer paint coating layer having the fine protrusions formed therein, and impregnated with a photoreactive filler therein; And a circuit pattern formed by selective laser irradiation on the photoreactive paint coating layer, and plating on the photoreactive filler eluting from the inside of the photoreactive paint coating layer.

At this time, the primer coating layer has a thickness of 20 ~ 40㎛.

In addition, the microprotrusions have an average thickness of 0.5 ~ 3㎛.

A method for manufacturing an LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention for achieving the above object comprises the steps of: (a) applying a primer coating composition on a metal substrate and drying to form a primer coating layer; (b) modifying the surface of the primer coating layer by thermal corrosion treatment; (c) applying a photoreactive paint composition on the surface-modified primer paint coating layer and drying to form a photoreactive paint coating layer; And (d) performing selective laser irradiation on the photoreactive paint coating layer to elute the photoreactive filler inside the photoreactive paint coating layer, and plating the eluted photoreactive filler to form a circuit pattern. It characterized in that it includes.

In the step (a), the primer coating composition includes 5 to 10% by weight of an inorganic filler, 10 to 20% by weight of a pigment, 10 to 30% by weight of an organic solvent, 0.1 to 1.0% by weight of a surface control agent, 0.05 to 1.0% by weight of a dispersant, 0.01 to 0.5% by weight of an anti-settling agent, 0.1 to 3.0% by weight of an adhesion reinforcing agent, and the rest of the binder resin are included.

In addition, in step (b), the heat corrosion treatment is performed at 200 to 300° C. for 1 to 10 sec.

In the step (c), the photoreactive paint composition includes 10 to 20% by weight of a photoreactive filler, 10 to 40% by weight of an organic solvent, 0.1 to 1.0% by weight of a surface control agent, 0.05 to 1.0% by weight of a dispersant, and 0.01 to 0.5 of an anti-settling agent. % By weight, 0.1 to 3.0% by weight of the adhesion reinforcing agent, and the remaining binder resin.

The step (d) includes: (d-1) performing selective laser irradiation on the photoreactive paint coating layer to elute the photoreactive filler impregnated into the photoreactive paint coating layer; And (d-2) performing plating using the eluted photoreactive filler as a seed, thereby forming a circuit pattern having the same shape as the eluted photoreactive filler.

The LDS type circuit board having excellent adhesion and adhesion according to the present invention and its manufacturing method are to form a primer paint coating layer and a photoreactive paint coating layer on a metal substrate by a coating method, and direct laser irradiation on the photoreactive paint coating layer to provide a photoreactive paint. Since a circuit pattern is formed by using a photoreactive filler that is activated and eluted by laser irradiation on the surface of the coating layer as a seed, it may be possible to form a circuit pattern on a side portion of a substrate where it is difficult to form a circuit pattern.

In addition, the LDS type circuit board having excellent adhesion and adhesion according to the present invention and its manufacturing method are provided by arranging a surface-modified primer paint coating layer between the metal substrate and the photoreactive paint coating layer, so that the metal substrate and the photoreactive paint By strengthening the adhesion and adhesion between the coating layers, there is an effect of preventing the occurrence of adhesion defects when evaluating the plating adhesion, and preventing short defects in the lighting test after manufacturing the LED module.

1 is a cross-sectional view showing an LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention.
2 is a cross-sectional view showing an enlarged portion A of FIG.
3 is a process flow chart showing a method of manufacturing an LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention.
4 to 8 are process cross-sectional views showing a method of manufacturing an LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention.

Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only this embodiment is to complete the disclosure of the present invention, and the general knowledge in the technical field to which the present invention pertains. It is provided to completely inform the scope of the invention to those who have it, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same elements throughout the specification.

Hereinafter, referring to the accompanying drawings, a detailed description will be given of an LDS type circuit board having excellent adhesion and adhesion and a method of manufacturing the same according to a preferred embodiment of the present invention.

1 is a cross-sectional view showing an LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing an enlarged portion A of FIG. 1.

1 and 2, the LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention includes a metal substrate 120, a primer coating layer 140, a photoreactive coating layer 160, and a circuit pattern ( 180).

The metal substrate 120 is made of a metal material having excellent rigidity and strength. One or more selected from Al, Cr, Ni, and Cu may be used as the metal substrate 120.

The primer coating layer 140 is disposed on the metal substrate 120, and fine protrusions 145 are formed on the upper surface. At this time, the primer paint coating layer 140 is disposed between the metal substrate 120 and the photoreactive paint coating layer 160, and serves to improve adhesion and adhesion between the metal substrate 120 and the photoreactive paint coating layer 160. do.

If the photoreactive paint coating layer 160 is directly disposed on the metal substrate 120 without forming the primer paint coating layer 140, the metal substrate 120 and the photoreactive paint coating layer 160 Adhesion may decrease due to poor adhesion due to lack of resistance to resistance.

Particularly, the primer coating layer 140 of the present invention has microprotrusions 145 formed on the upper surface corresponding to the adhesion surface to the photoreactive coating layer 160 () by surface modification by thermal corrosion treatment.

As described above, a part of the surface of the primer coating layer 140 is removed by etching a part of the surface of the primer coating layer 140 by heat corrosion treatment, thereby forming an irregularly shaped fine protrusion 145. As a result, it is possible to improve adhesion and adhesion with the photoreactive paint coating layer 160 attached to the primer paint coating layer 140 by expanding the surface area of the primer paint coating layer 140 by the irregularly shaped microprotrusions 145. do.

At this time, it is preferable that the microprotrusions 145 have an average thickness of 0.5 to 3 μm. If the average thickness of the fine protrusions 145 is less than 0.5 μm, the surface area expansion effect is insignificant, and it is difficult to properly exhibit the above effect. On the contrary, when the average thickness of the fine protrusions 145 exceeds 3 μm, there is a concern that the localized fine protrusions 145 have severe deviations, thereby reducing adhesion and adhesion.

The primer coating layer 140 may be formed by applying a primer coating composition on the metal substrate 120 and drying at 130 to 170° C. for 10 to 60 minutes.

At this time, the primer coating composition is 5 to 10% by weight of inorganic filler, 10 to 20% by weight of pigment, 10 to 30% by weight of organic solvent, 0.1 to 1.0% by weight of surface control agent, 0.05 to 1.0% by weight of dispersant, 0.01 to 0.5% by weight of anti-settling agent %, 0.1 to 3.0% by weight of the adhesion reinforcing agent, and the rest of the binder resin.

Inorganic fillers are added to improve adhesion and adhesion. At this time, as the inorganic filler, at least one selected from talc and calcium carbonate may be used. It is more preferable to use one having an average diameter of 1 μm or less as such an inorganic filler in order to secure dispersibility.

When the amount of the inorganic filler added is less than 5% by weight of the total weight of the primer coating composition, it may be difficult to secure adhesion and adhesion. Conversely, when the amount of the inorganic filler exceeds 10% by weight of the total weight of the primer coating composition, dispersibility may be poor due to excessive addition of the inorganic filler.

Pigments are added to improve adhesion and adhesion, like inorganic fillers. At this time, TiO ₂ may be used as the pigment.

An organic solvent is added to control the viscosity of the primer coating composition. These organic solvents include methyl ethyl ketone, methyl isobutyl ketone, dimethyl ketone, isopropyl alcohol, isobutyl alcohol, and normal butyl. At least one selected from alcohol (normal butyl alcohol), ethyl acetate, ethyl cellusolve, butyl cellusolve, and the like may be used.

When the amount of the organic solvent added is less than 10% by weight of the total weight of the primer coating composition, the viscosity of the primer coating composition is lowered and thus dispersibility is poor, and thus it may be difficult to prepare a paste. On the contrary, when the amount of the organic solvent added exceeds 30% by weight of the total weight of the primer coating composition, it may be difficult to secure the proper thickness of the coating film due to the excessive addition of the organic solvent during spray coating using a nozzle. I can.

To this end, it is preferable that the primer coating layer 140 has a thickness of 20 to 40 μm. If the thickness of the primer paint coating layer 140 is less than 20㎛, it may be difficult to properly exhibit the effect of improving adhesion and adhesion, and the thickness is too thin, so when the LED module is manufactured on the metal substrate 120 and the light is tested It may cause short circuit failure. On the contrary, when the thickness of the primer coating layer 140 exceeds 40 μm, it is not preferable because it can act as a factor of increasing only the coating film thickness without further increasing the effect.

The surface modifier is added to improve the surface modification properties of the coating film. To this end, as a surface modifier, a polymer elastomer, Polydimethyl siloxane (PDMS) may be used. PDMS is a high-molecular polymer made of silicone, has excellent durability and flexibility, and has transparent properties.

When the amount of the surface modifier added is less than 0.1% by weight of the total weight of the primer coating composition, it may be difficult to properly exhibit the surface modification effect. On the contrary, when the amount of the surface modifier added exceeds 1.0% by weight of the total weight of the primer coating composition, there is a high possibility that only the manufacturing cost is increased without further increase in effect, and thus it is not preferable.

The dispersant is added to improve the dispersibility of the base resin, the inorganic filler, and the pigment, and an acrylic copolymer may be used. The acrylic copolymer is a high-molecular polymer that evenly distributes paint, can adjust viscosity, has excellent thermal decomposition, colorlessness, transparency, weather resistance, and easy copolymerization with other components.

Anti-settling agents are added to exert an anti-settling effect. The anti-settling agent may be amidewax to prevent layer separation. The amide wax refers to a wax in which polyamide is dispersed in water, which is a water-soluble solvent.

The adhesion reinforcing agent may include a copolymer having a hydrophilic functional group. For example, the adhesion modifier may be a copolymer having an acidic functional group -COOH. The adhesion reinforcing agent having such a functional group has the effect of improving the adhesion through electrical bonding, van der Waals force, and interaction with acidic functional groups.

As the binder resin, at least one selected from acrylic polyol, ester polyol, melamine resin, and epoxy resin may be used. Acrylic polyol may be, for example, acrylic polyol (acrylic polyol) may be used, the weight average molecular weight of the acrylic polyol may be 5000 ~ 100,000.

Ester polyols are produced by the condensation reaction of polybasic acids and polyhydric alcohols. For example, polybasic acids such as isophthalic acid and phthalic anhydride, ethylene glycol, and butane are included. Polyhydric alcohols such as diol and pentanediol are reacted to produce ester-based polyols. Ester-based polyols are inexpensive and have a simple manufacturing process.

Melamine resin has excellent water resistance and heat resistance, is a thermosetting resin of a phase prepared through a dehydration condensation process after forming methylol melamine by mixing and heating melamine and formalin.

Epoxy resin is prepared by polymerizing epichlorohydrin and bisphenol A, and has excellent mechanical properties, abrasion resistance, and water resistance during curing. For example, there are bisphenol A type epoxy resin, bisphenol F type epoxy resin, and novolac type epoxy resin.

The photoreactive paint coating layer 160 is disposed on the primer paint coating layer 140 and is attached to the primer paint coating layer 140 on which the microprotrusions 145 are formed, and a photoreactive filler 165 is impregnated therein.

The photoreactive paint coating layer 160 may be formed by applying a photoreactive paint composition on the primer paint coating layer 140 on which the fine protrusions 145 are formed, and drying at 130 to 170° C. for 100 to 200 minutes. .

At this time, the photoreactive paint composition is a photoreactive filler 10 to 20% by weight, organic solvent 10 to 40% by weight, surface control agent 0.1 to 1.0% by weight, dispersant 0.05 to 1.0% by weight, anti-settling agent 0.01 to 0.5% by weight, adhesion reinforcing agent 0.1 ~ 3.0% by weight and the rest of the binder resin.

When forming the circuit pattern 180 using the LDS method, the photoreactive filler 165 selectively irradiates the photoreactive paint coating layer 160 on the metal substrate 120 to locally activate only the irradiated portion. The activated photoreactive filler 165 is eluted onto the surface of the photoreactive paint coating layer 160, and the circuit pattern 180 is formed by plating only the portion where the eluted photoreactive filler 165a is disposed.

To this end, the photoreactive filler 165 may include a metal compound that can be activated by a laser. As such photoreactive pillow 165, for example, copper nitrate (Cu (NO ₃ ) ₂ ), copper nitride (cupper nitrite Cu ₃ N), titanium dioxide (TiO ₂ ), antimony oxide (antimony oxide, Sb ₂ O ₃ ), copper phosphate (copper(II) phosphate, Cu ₃ (PO ₄ ) ₂ ) can be selected from. As the photoreactive filler 165, one having an average diameter of approximately 1 μm or less may be used.

When the amount of the photoreactive filler 165 added is less than 10% by weight of the total weight of the photoreactive paint composition, the amount of plating seeds formed during laser irradiation may be insufficient, resulting in poor plating. Conversely, when the amount of the photoreactive filler 165 added exceeds 20% by weight of the total weight of the photoreactive paint composition, it may act as a factor to lower the physical properties of the coating film.

An organic solvent is added to adjust the viscosity of the photoreactive paint composition. These organic solvents include methyl ethyl ketone, methyl isobutyl ketone, dimethyl ketone, isopropyl alcohol, isobutyl alcohol, and normal butyl. At least one selected from alcohol (normal butyl alcohol), ethyl acetate, ethyl cellusolve, butyl cellusolve, and the like may be used.

When the amount of the organic solvent added is less than 10% by weight of the total weight of the photoreactive coating composition, the viscosity of the photoreactive coating composition is lowered and thus dispersibility is poor, making it difficult to prepare a paste. Conversely, when the amount of the organic solvent added exceeds 40% by weight of the total weight of the photoreactive coating composition, it is difficult to secure the proper thickness of the coating film due to the excessive addition of the organic solvent during spray coating using a nozzle. You can follow this.

In addition, the surface control agent, dispersant, anti-settling agent, adhesion reinforcing agent and binder resin added to the photoreactive paint composition may be substantially the same as the surface control agent, dispersant, anti-settling agent, adhesion reinforcing agent and binder resin added to the primer paint composition. Therefore, the redundant description will be omitted.

The circuit pattern 180 is formed by selective laser irradiation on the photoreactive paint coating layer 160 and plating on the photoreactive filler 165a eluting from the inside of the photoreactive paint coating layer 160.

That is, by selectively irradiating the photoreactive paint coating layer 160 with a laser, the photoreactive filler 165 impregnated in the photoreactive paint coating layer 160 is eluted to the surface. Thereafter, plating is performed using the eluted photoreactive filler 165a as a seed, so that the circuit pattern 180 having substantially the same shape as the eluted photoreactive filler 165a can be formed.

In the LDS type circuit board having excellent adhesion and adhesion according to the above-described embodiment of the present invention, a primer coating layer and a photoreactive coating layer are formed by a coating method on a metal substrate, and the photoreactive coating layer is directly irradiated with a laser to provide photoreactivity. Since a circuit pattern is formed using a photoreactive filler that is activated and eluted by laser irradiation on the surface of the paint coating layer as a seed, it may be possible to form a circuit pattern on a side portion of a substrate where it is difficult to form a circuit pattern.

In addition, the LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention has a surface-modified primer paint coating layer disposed between the metal substrate and the photoreactive paint coating layer, thereby disposing the metal substrate and the photoreactive paint coating layer. By reinforcing the adhesion and adhesion between the liver, there is an effect of preventing the occurrence of adhesion defects when evaluating the plating adhesion, and preventing short defects in the lighting test after manufacturing the LED module.

Hereinafter, a method of manufacturing an LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

3 is a process flow chart showing a method of manufacturing an LDS type circuit board having excellent adhesion and adhesion according to an embodiment of the present invention, and FIGS. 4 to 8 are LDS type circuit board manufacturing having excellent adhesion and adhesion according to an embodiment of the present invention. It is a process cross-sectional view showing the method.

As shown in Figure 3, the LDS type circuit board manufacturing method having excellent adhesion and adhesion according to an embodiment of the present invention includes a primer paint coating layer forming step (S110), a surface modification treatment step (S120), a photoreactive paint coating layer forming step (S130) and a circuit pattern forming step (S140).

primer Paint coating layer formation

3 and 4, in the step of forming a primer coating layer (S110), a primer coating composition is applied on the metal substrate 120 and dried to form the primer coating layer 140.

The metal substrate 120 is made of a metal material having excellent rigidity and strength. One or more selected from Al, Cr, Ni, and Cu may be used as the metal substrate 120.

Primer paint composition is inorganic filler 5 ~ 10% by weight, pigment 10 ~ 20% by weight, organic solvent 10 ~ 30% by weight, surface control agent 0.1 ~ 1.0% by weight, dispersant 0.05 ~ 1.0% by weight, anti-settling agent 0.01 ~ 0.5% by weight, It contains 0.1 to 3.0% by weight of the adhesion reinforcing agent and the remaining binder resin.

In this step, drying is preferably performed at 130 to 170° C. for 10 to 60 minutes. At this time, when the drying temperature is less than 130°C or the drying time is less than 10 minutes, there is a fear that the primer coating composition may not be sufficiently dried and thus may not be uniformly attached to the metal substrate. Conversely, when the drying temperature exceeds 170° C. or the drying time exceeds 60 minutes, it is not preferable because it can act as a factor that increases only the manufacturing cost without further increasing the effect.

The primer coating layer 140 is preferably formed to a thickness of 20 ~ 40㎛. If the thickness of the primer coating layer 140 is less than 20㎛, it may be difficult to properly exhibit the effect of improving adhesion, and the thickness is too thin to produce an LED module on the metal substrate 120 and then a short circuit is defective during the lighting test. Can cause. On the contrary, when the thickness of the primer coating layer 140 exceeds 40 μm, it is not preferable because it can act as a factor of increasing only the coating film thickness without further increasing the effect.

Surface modification process

3 and 5, in the surface modification treatment step (S120), the surface of the primer coating layer 140 is modified by thermal corrosion treatment.

In this step, the heat corrosion treatment is preferably carried out at 200 ~ 300 ℃ for 1 ~ 10sec. When the heat corrosion treatment temperature is less than 200°C or the heat corrosion treatment time is less than 1 sec, it may be difficult to increase the specific surface area because heat corrosion is not smoothly performed. On the contrary, when the heat corrosion treatment temperature exceeds 300°C or the heat corrosion treatment time exceeds 10 sec, the primer paint coating layer 140 is excessively etched due to excessive heat corrosion treatment, and there is a concern that adhesion and adhesion may be reduced. have.

In this way, a part of the surface of the primer coating layer 140 is removed by etching a part of the surface of the primer coating layer 140 by heat corrosion treatment, thereby forming irregularly shaped fine protrusions (145 in FIG. 2). Is formed. As a result, it is possible to improve adhesion and adhesion with the photoreactive paint coating layer (160 in FIG. 6) attached to the primer paint coating layer 140 by expanding the surface area of the primer paint coating layer 140 by irregular shaped fine projections. do.

Photoreactivity Paint coating layer formation

3 and 6, in the step of forming a photoreactive paint coating layer (S130), a photoreactive paint composition is applied on the surface-modified primer paint coating layer 140 and dried to form the photoreactive paint coating layer 160 To form.

The photoreactive paint composition contains 10 to 20% by weight of a photoreactive filler, 10 to 40% by weight of an organic solvent, 0.1 to 1.0% by weight of a surface control agent, 0.05 to 1.0% by weight of a dispersant, 0.01 to 0.5% by weight of an anti-settling agent, and 0.1 to 3.0 of an adhesion reinforcing agent. % By weight and the rest of the binder resin.

At this time, the drying is preferably carried out at 130 ~ 170 ℃ for 100 ~ 200 minutes.

In this step, if the drying temperature is less than 130°C or the drying time is less than 100 minutes, the photoreactive paint composition may not be sufficiently dried and thus may not be uniformly adhered to the primer paint coating layer 140, thereby deteriorating adhesion and adhesion. . Conversely, when the drying temperature exceeds 170° C. or the drying time exceeds 200 minutes, there is a concern that the film quality properties are not good due to excessive drying.

Circuit pattern formation

3, 7 and 8, in the circuit pattern formation step (S140), the photoreactive filler inside the photoreactive paint coating layer 160 is selectively irradiated to the photoreactive paint coating layer 160 The circuit pattern 180 is formed by eluting 165 and plating the eluted photoreactive filler 165a.

That is, as shown in FIG. 7, the photoreactive filler 165 impregnated into the photoreactive paint coating layer 160 by irradiating a selective laser L from the laser beam 200 on the photoreactive paint coating layer 160 Elutes to the surface. Accordingly, on the surface of the photoreactive paint coating layer 160, the photoreactive filler 165a selectively eluted only at the portion where laser irradiation is performed by the laser beam 200 is disposed.

Next, as shown in FIG. 8, plating is performed using the eluted photoreactive filler 165a as a seed to form a circuit pattern 180 having the same shape as the eluted photoreactive filler 165a.

The LDS type circuit board having excellent adhesion and adhesion according to the embodiment of the present invention manufactured by the above process (S110 to S140) forms a primer coating layer and a photoreactive coating layer in a coating method on a metal substrate, and photoreactive Since a circuit pattern is formed using a photoreactive filler that is activated and eluted by laser irradiation on the surface of the photoreactive paint coating layer by irradiating a laser directly onto the paint coating layer, a circuit pattern is formed on the side of the substrate where it is difficult to form a circuit pattern. It may become possible to form.

In addition, the LDS type circuit board manufactured by the method according to the embodiment of the present invention has excellent adhesion and adhesion, by disposing a surface-modified primer paint coating layer between the metal substrate and the photoreactive paint coating layer. By reinforcing the adhesion and adhesion between the photoreactive paint coating layers, there is an effect of preventing the occurrence of adhesion defects when evaluating the plating adhesion, and preventing short defects in the lighting test after manufacturing the LED module.

Example

Hereinafter, preferred embodiments will be described to aid in understanding of the present invention. However, it is obvious to those skilled in the art that various changes and modifications can be made within the scope of the present invention and the scope of the technical idea only to illustrate the present invention, and it is natural that such modifications and modifications belong to the appended claims.

1. Circuit board manufacturing

Example One

On the Al substrate, Talc 8wt%, TiO ₂ 12wt%, methyl ethyl ketone 20wt%, PDMS (Polydimethyl siloxane) 0.5wt%, dispersant 0.5wt%, amidewax 0.5wt%, A primer coating composition composed of 1.5 wt% of an adhesion reinforcing agent and the rest of acrylic polyol was applied to a thickness of 30 μm, and dried at 140° C. for 40 minutes to form a primer coating layer.

Next, the surface of the primer coating layer was modified by heat corrosion treatment at 250° C. for 3 sec.

Next, copper nitride (cupper nitrite Cu ₃ N) 12wt%, methyl ethyl ketone 25wt%, PDMS (polydimethyl siloxane) 0.5wt%, dispersant 0.5wt%, amide on the surface-modified primer coating layer. A photoreactive paint composition composed of 0.4wt% of wax (amidewax), 2.5wt% of adhesion modifier, and the rest of acrylic polyol was applied to a thickness of 50㎛, and dried at 160℃ for 140 minutes to form a photoreactive paint coating layer. Was prepared.

Next, the photoreactive paint coating layer is selectively irradiated with a laser of 3W power to elute the photoreactive filler impregnated inside the photoreactive paint coating layer, and then electrolytic plating is performed on the eluted photoreactive filler to form a circuit pattern. Was prepared.

Example 2

A circuit board was manufactured in the same manner as in Example 1, except that the primer coating composition was applied to a thickness of 25 μm and dried at 150° C. for 25 minutes to prepare a primer coating layer.

Example 3

A circuit board was manufactured in the same manner as in Example 1, except that the primer coating composition was applied to a thickness of 35 μm and dried at 160° C. for 20 minutes to prepare a primer coating layer.

Example 4

A circuit board was manufactured in the same manner as in Example 1, except that the photoreactive paint composition was applied to a thickness of 60 μm and dried at 150° C. for 160 minutes to prepare a photoreactive paint coating layer.

Example 5

A circuit board was manufactured in the same manner as in Example 1, except that the surface was modified by heat corrosion treatment at 250° C. for 5 sec.

Example 6

A circuit board was manufactured in the same manner as in Example 1, except that the surface was modified by heat corrosion treatment at 220° C. for 2 sec.

Example 7

A circuit board was manufactured in the same manner as in Example 1, except that the surface was modified by heat corrosion treatment at 240°C for 8 sec.

Comparative example One

Copper nitride (cupper nitrite Cu ₃ N) 15wt%, methyl ethyl ketone 30wt%, PDMS (Polydimethyl siloxane) 0.5wt%, dispersant 0.5wt%, amidewax 0.3wt%, A photoreactive paint composition composed of 2.0wt% of adhesion reinforcing agent and remaining acrylic polyol was applied to a thickness of 50㎛, and dried at 150°C for 120 minutes to prepare a photoreactive paint coating layer.

Next, the photoreactive paint coating layer is selectively irradiated with a laser of 3W power to elute the photoreactive filler impregnated inside the photoreactive paint coating layer, and then electrolytic plating is performed on the eluted photoreactive filler to form a circuit pattern. Was prepared.

Comparative example 2

On the Al substrate, talc 9wt%, TiO ₂ 14wt%, methyl ethyl ketone 20wt%, PDMS (polydimethyl siloxane) 0.5wt%, dispersant 0.5wt%, amidewax 0.5wt%, A primer coating composition composed of 1.5 wt% of an adhesion reinforcing agent and the rest of acrylic polyol was applied to a thickness of 30 μm, and dried at 140° C. for 40 minutes to form a primer coating layer.

Next, copper nitride (cupper nitrite Cu ₃ N) 12wt%, methyl ethyl ketone 25wt%, PDMS (Polydimethyl siloxane) 0.5wt%, dispersant 0.5wt%, amidewax on the primer coating layer. A photoreactive coating composition composed of 0.4 wt%, an adhesion reinforcing agent 2.5 wt% and the remaining acrylic polyol was applied to a thickness of 50 μm and dried at 160° C. for 140 minutes to prepare a photo-reactive coating layer.

Next, the photoreactive paint coating layer is selectively irradiated with a laser of 3W power to elute the photoreactive filler impregnated inside the photoreactive paint coating layer, and then electrolytic plating is performed on the eluted photoreactive filler to form a circuit pattern. Was prepared.

2. Property evaluation

Table 1 shows the results of evaluation of physical properties for specimens prepared according to Examples 1 to 7 and Comparative Examples 1 to 2.

1) Adhesion test

The adhesion was evaluated based on the regulations of JIS K 5400. After the humidification treatment at 40° C.×92%RH for 12 hours, the humidification treatment was performed at 80°C×90%RH for 12 hours, and the result is expressed as “number of peels/100”.

Number of peels/100 evaluation: 0/100 "Excellent", 1/100~50/100 "Normal", 51/100~100/100 "Poor"

2) Alkali resistance test

It was measured after immersing a 5% aqueous sodium hydroxide solution at room temperature for 96 hours. If it is the same as the initial state, it was marked as "excellent", "normal" when cracks and discoloration occurred at 50% or less, and "bad" when cracking and discoloration occurred at 50% or more.

3) Acid resistance test

It was measured after immersing a 5% aqueous hydrochloric acid solution at room temperature for 96 hours.

If it is the same as the initial state, it was marked as "excellent", "normal" when cracks and discoloration occurred at 50% or less, and "bad" when cracking and discoloration occurred at 50% or more.

4) Coating shear force

Shear force characteristics were evaluated by conducting a shear test of the coating film based on ASTM F1044-5. More than 70N was marked as "excellent", 30~69N as "normal", and 0~29N as "bad".

[Table 1]

Referring to Table 1, in the case of Examples 1 to 7, excellent properties were exhibited in terms of adhesion, alkali resistance, and acid resistance, and in particular, the coating film shear force was measured to be 90N or more, confirming that it had excellent adhesion.

On the other hand, Comparative Example 1 exhibited excellent properties in terms of alkali resistance and acid resistance, but the adhesion was at a normal level, and the coating film shear force was only 53N.

In addition, in the case of Comparative Example 2 not subjected to the thermal corrosion treatment, it exhibited excellent properties in terms of adhesion, alkali resistance, and acid resistance, but the coating film shear force was 82N, which was improved compared to Comparative Example 1, but significantly compared to Examples 1 to 7. It was confirmed that it showed a low value.

As can be seen from the above experimental results, when a primer coating layer having fine protrusions formed by thermal corrosion treatment is placed between a metal substrate and a photoreactive paint coating layer, like the circuit board manufactured according to Examples 1 to 7, It was confirmed that adhesion and adhesion were significantly improved.

Although the above has been described based on the embodiments of the present invention, various changes or modifications can be made at the level of a person skilled in the art to which the present invention pertains. Such changes and modifications can be said to belong to the present invention as long as it does not depart from the scope of the technical idea provided by the present invention. Therefore, the scope of the present invention should be determined by the claims set forth below.

100: LDS type circuit board 120: metal substrate
140: primer coating layer 145: fine protrusions
160: photoreactive paint coating layer 165: photoreactive filler
180: circuit pattern
S110: Primer paint coating layer formation step
S120: Surface modification treatment step
S130: Photoreactive paint coating layer formation step
S140: circuit pattern formation step

Claims (8)

delete delete delete (a) applying a primer coating composition on a metal substrate and drying to form a primer coating layer;
(b) modifying the surface of the primer coating layer by thermal corrosion treatment;
(c) applying a photoreactive paint composition on the surface-modified primer paint coating layer, and drying at 130 to 170°C for 100 to 200 minutes to form a photoreactive paint coating layer; And
(d) performing selective laser irradiation on the photoreactive paint coating layer to elute the photoreactive filler inside the photoreactive paint coating layer, and plating the eluted photoreactive filler to form a circuit pattern; including; And
In the step (b), the heat corrosion treatment is performed at 220 to 250° C. for 2 to 8 sec,
In the step (b), by performing a surface modification treatment by etching a part of the surface of the primer coating layer by thermal corrosion treatment, irregularly shaped fine protrusions are formed, and the fine protrusions have an average thickness of 0.974 to 2.781 μm. ,
In the step (a), the primer coating composition includes 5 to 10% by weight of an inorganic filler, 10 to 20% by weight of a pigment, 10 to 30% by weight of an organic solvent, 0.1 to 1.0% by weight of a surface control agent, 0.05 to 1.0% by weight of a dispersant, 0.01 to 0.5% by weight of the anti-settling agent, 0.1 to 3.0% by weight of the adhesion reinforcing agent, and the remaining binder resin,
In the step (c), the photoreactive paint composition includes 10 to 20% by weight of a photoreactive filler, 10 to 40% by weight of an organic solvent, 0.1 to 1.0% by weight of a surface control agent, 0.05 to 1.0% by weight of a dispersant, and 0.01 to 0.5 of an anti-settling agent A method for manufacturing an LDS type circuit board having excellent adhesion and adhesion, characterized in that it comprises a weight%, an adhesion reinforcing agent 0.1 to 3.0% by weight, and the remaining binder resin.
delete delete delete The method of claim 4,
The step (d),
(d-1) subjecting the photoreactive paint coating layer to selective laser irradiation to elute the photoreactive filler impregnated in the photoreactive paint coating layer; And
(d-2) performing plating using the eluted photoreactive filler as a seed to form a circuit pattern having the same shape as the eluted photoreactive filler;
LDS method circuit board manufacturing method having excellent adhesion and adhesion, characterized in that it comprises a.

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