KR102130668B1 - Illuminating device - Google Patents

Abstract

Examples include a substrate; A plurality of light sources disposed on the substrate; A resin layer disposed on the substrate to cover the plurality of light sources; A reflective unit disposed between the substrate and the resin layer; And an indirect light emitting part disposed on one side of the resin layer, wherein the plurality of light sources penetrates the reflection unit and is a side light emitting device that emits light toward the side of the resin layer, and the reflection unit is on the substrate. And a reflective sheet disposed on the reflective sheet, and a spacer disposed between the reflective sheet and the transparent sheet, wherein the indirect light-emitting unit is a light reflecting member disposed on one side of the resin layer and the resin. Disclosed is a lighting device including a gap formed between a side surface of a layer and the light reflection member.

Description

Lighting equipment {ILLUMINATING DEVICE}

The present invention relates to the technical field of lighting devices.

LED (Light Emitted Diode) device is a device that converts an electric signal into infrared light or light by using compound semiconductor characteristics. Unlike fluorescent lamps, it does not use harmful substances such as mercury, and has less cause of environmental stigma, compared to conventional light sources. It has the advantage of long life. In addition, compared to conventional light sources, it consumes low power and has excellent visibility and low glare due to its high color temperature.

Therefore, the current lighting device has developed from a conventional light source using a conventional light source such as an incandescent lamp or a fluorescent lamp to a form using the above-described LED element as a light source, and in particular, as disclosed in Korean Patent Publication No. 10-2012-0009209, a light guide plate A lighting device that performs a surface emission function by using is provided.

The above-described conventional lighting device has a structure in which a flat light guide plate is disposed on a substrate, and a plurality of side type LEDs are arranged in an array form on side surfaces of the light guide plate. Here, the light guide plate is a type of plastic molded lens that performs a function of supplying uniform light to the light emitted from the LED. Therefore, such a light guide plate is used as an essential part in a conventional lighting device. Due to the thickness of the light guide plate itself, there is a limit in reducing the thickness of the entire product, and it is difficult to apply to the curved portion as the material of the light guide plate itself is not flexible. Accordingly, product design and design modification are not easy. Was implied.

In addition, there was also a problem that light efficiency is reduced due to light loss due to the emission of some light to the side of the light guide plate, and the characteristics of the LED (for example, changes in light intensity and wavelength) change as the temperature of the LED increases during light emission. There were also problems.

Patent Publication No. 10-2012-0009209

The present invention has been proposed to solve the above-described problems, it is possible to reduce the thickness, improve the freedom of product design, improve the heat dissipation efficiency, and provide a lighting device capable of suppressing wavelength shift and light intensity reduction It is for that purpose.

In addition, an object of the present invention is to maximize the luminance improvement of the lighting device without adding a light source by forming a reflection unit having an air area on a printed circuit board to improve light reflectivity.

In addition, the present invention aims to differentiate the design of the lighting device without adding a separate light source by implementing an indirect light emitting unit using lossy light.

The lighting device of the present invention for solving the above-described problems, at least one light source disposed on a printed circuit board and a resin layer disposed on the printed circuit board to fill the light source, and the printed circuit board and the resin layer A light source module including a reflection unit formed therebetween and having an air area therein; An indirect light-emitting unit formed on at least one of the one side and the other side of the light source module and reflecting light emitted from the light source; A diffusion plate formed integrally with the upper surface formed on the light source module and the upper surface and extending in a downward direction to have a side wall in close contact with the outer surface of the indirect light emitting unit; Including, a first air gap may be formed between the light source module and the upper surface of the diffusion plate.

In the lighting device of the present invention, the printed circuit board may be made of a flexible printed circuit board.

In the lighting device of the present invention, the thickness of the first air gap may be formed in a range of 0 to 30 mm or less.

In the lighting apparatus of the present invention, the reflective unit, a first reflective sheet in close contact with the surface of the printed circuit board; A second reflective sheet of transparent material spaced apart from the first reflective sheet to form the air region; It may include.

In the lighting device of the present invention, the reflection unit may further include a separation member formed between the first reflection sheet and the second reflection sheet to separate the first reflection sheet and the second reflection sheet. have.

In the lighting device of the present invention, the spacer member may include at least one unit spacer member formed of an adhesive material forming a cavity portion therein and forming a first air unit.

In the lighting device of the present invention, the spacer member may be formed of at least one of a thermosetting PSA, a thermosetting adhesive, and a UV curing PSA type material.

In the lighting device of the present invention, a plurality of unit spacers are spaced apart from each other, and a second air portion may be formed in a space spaced apart from each other.

In the lighting device of the present invention, the first reflective sheet may include a first base material laminated on a base substrate and a metal layer deposited on the first base material.

In the lighting device of the present invention, the first reflective sheet may be made of white PET (white polyethylen terephthalate) or Ag film.

In the lighting device of the present invention, the reflective unit may further include a reflective pattern formed on the surface of the second reflective sheet.

In the lighting device of the present invention, the reflection pattern may include any one of TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , Silicon, and PS (Polystyrene).

In the lighting apparatus of the present invention, the indirect light emitting unit, the light reflection member formed on at least one of the light source module one side and the other side; An indirect emitting air gap formed between the light source module and the light reflecting member; It may include.

In the lighting device of the present invention, the light reflection member may be formed on the inner side surface of the side wall of the diffusion plate.

In the lighting device of the present invention, the thickness of the indirect light emission air gap may be formed in a range of more than 0 to 20 mm or less.

In the lighting device of the present invention, the light reflection member may be formed of a white pigment or metal.

In the lighting device of the present invention, the resin layer, urethane acrylate (Urethane Acrylate), epoxy acrylate (Epoxy Acrylate), polyester acrylate (Polyester Acrylate), polyether acrylate (Polyether Acrylate), polybutadiene acrylic It may be made of an ultraviolet curing resin comprising at least one of a rate (Polybutadiene Acrylate), silicone acrylate (Silicon Acrylate).

In the lighting device of the present invention, the resin layer, a polyester polyol (Polyester Polyol) resin, acrylic polyol (Acryl Polyol) resin, may be made of a thermosetting resin comprising at least one of a hydrocarbon-based or ester-based solvent. .

In the lighting device of the present invention, the resin layer, silicon (sillicon), silica (silica), glass bubble (glass bubble), PMMA, urethane (urethane), Zn, Zr, Al ₂ O ₃ , acrylic (acryl) It may further include a diffusing material for diffusing light consisting of at least one selected from.

In the lighting device of the present invention, the refractive index of the resin layer may be formed in the range of 1.4 to 1.8.

In the lighting device of the present invention, the thickness of the diffusion plate may be formed in the range of 0.5 to 5mm.

In the lighting device of the present invention, the light source module may further include a first optical sheet formed on the resin layer and dispersing light emitted from the resin layer.

In the lighting apparatus of the present invention, the light source module may further include an optical pattern formed on the first optical sheet and blocking or reflecting light emitted from the resin layer.

In the lighting device of the present invention, the light source module may further include a second optical sheet disposed on the first optical sheet.

In the lighting device of the present invention, the light source module may further include an adhesive layer formed between the first optical sheet and the second optical sheet, and an air gap may be further formed in the adhesive layer.

In the lighting device of the present invention, the light source may be made of a side view type light emitting device package.

In the lighting device of the present invention, the light source, the package body having a cavity; A first lead frame including one end exposed to the cavity and the other end penetrated through the package body and exposed to one surface of the package body; A second lead frame including one end exposed on one side of the one side of the package body, the other end exposed on the other side of the one side of the package body, and an intermediate portion exposed on the cavity; It may be made of a light source package including a first semiconductor layer, an active layer, a second semiconductor layer, and at least one light emitting chip disposed on the first lead frame.

In the lighting device of the present invention, the intermediate portion of the second lead frame may electrically connect the one end and the other end of the second lead frame to each other.

In the lighting apparatus of the present invention, the first lead frame, a first upper surface portion exposed to the cavity; It may include a first side portion bent from the first side portion of the first upper surface portion and exposed to the one surface of the package body.

In the lighting device of the present invention, at least one of the first upper surface portion or the first side portion may include one or more first through holes.

In the lighting device of the present invention, the first lead frame may include at least one first through hole formed adjacent to a boundary portion of the first upper surface portion and the first side portion.

In the lighting device of the present invention, a portion of the package body may be filled in the at least one first through hole.

In the lighting device of the present invention, the first lead frame includes connection portions connecting the first upper surface portion and the first side portion to each other, and the first through hole is located between the connection portions, and the connection portion The length of at least one of the fields may be different from the others.

In the lighting device of the present invention, the at least one light emitting chip may be disposed on the first upper surface portion.

In the lighting device of the present invention, the length of the first connection portion of the connection portion aligned with the light emitting chip is greater than the length of the second connection portion not aligned with the light emitting chip in the first direction, The first direction may be an x-axis direction in the xyz coordinate system.

In the lighting device of the present invention, at least one of the connection parts may be formed with a second through hole having a smaller diameter than the first through hole.

In the lighting apparatus of the present invention, the second lead frame is disposed around at least one side of the first upper surface portion, the second upper surface portion exposed to the cavity of the package body; And a second side portion bent from the second upper surface portion and exposed to each of the one side and the other side of the one side of the package body.

In the lighting device of the present invention, at least one groove portion is provided on the second side portion of the first upper surface portion, and the first side portion and the second side portion of the first upper surface portion may be side portions facing each other.

In the lighting device of the present invention, at least one protrusion corresponding to the groove portion may be formed on the second upper surface portion.

In the lighting device of the present invention, the second upper surface portion may include first to third portions disposed corresponding to the remaining side portions other than the first side portion of the first upper surface portion.

In the lighting apparatus of the present invention, the second side portion, the first portion bent in the first portion of the second upper surface portion; And a second portion bent in the third portion of the second upper surface portion, wherein the first portion and the second portion may be symmetrical with respect to the first side portion.

In the lighting device of the present invention, the first side portion is divided into an upper portion including the connecting portions, and a lower portion located below the upper portion, and the lower portion may protrude laterally from the upper portion.

In the lighting device of the present invention, the ratio of the length of the second connection portion and the first connection portion in the first direction may be 1: 1.2 to 1.8.

In the lighting apparatus of the present invention, the ratio of the length of the first direction of the first through hole to the length of the first side portion of the upper end portion is 1: 3.8 to 6.3, and the first direction is in the xyz coordinate system. It may be in the x-axis direction.

In the lighting device of the present invention, the length of the first through hole in the second direction may be 0.19 mm to 0.29 mm.

In the lighting device of the present invention, the light emitting chip, a first electrode layer disposed on the first semiconductor layer; A reflective layer disposed under the second semiconductor layer; And a second electrode layer disposed under the reflective layer.

In the lighting device of the present invention, the light emitting chip may be a device that emits red light having a wavelength range of 600 nm to 690 nm.

In the lighting device of the present invention, the light source module is disposed on the flexible printed circuit board, and may further include at least one connector for electrical connection with the outside.

In the lighting device of the present invention, the flexible printed circuit board may further include a fastening fixing part for fastening with the outside.

According to the present invention, by providing an indirect light-emitting portion including a light reflecting member has the advantage of realizing various lighting effects using a flare phenomenon and the effect of realizing various designs of lighting.

In addition, according to the present invention, a lighting effect is realized by using light emitted to the side of the resin layer, and it has an advantage of implementing a double lighting effect without adding a separate light source.

And according to the present invention, by providing a reflecting unit having an air area on the surface of the printed circuit board, the light reflectance is improved and the brightness is maximized, and the effect of increasing the brightness without increasing the thickness of the lighting device or the number of light sources and air There is also an effect of maximizing the control and reflection effect of light due to the pattern design of the spacer (spacer) forming the region.

Further, according to the present invention, by removing the light guide plate and inducing light using a resin layer, it has an effect of reducing the number of light emitting device packages and an effect of reducing the overall thickness of the lighting device.

In addition, according to the present invention, the resin layer can be formed of a highly heat-resistant resin, and thus has the effect of providing a stable luminance and a reliable lighting device despite the heat generated in the light emitting device package.

In addition, according to the present invention, it is possible to secure flexibility by forming a lighting device using a flexible printed circuit board and a resin layer, thereby increasing the degree of freedom in product design.

And according to the present invention, by allowing the diffusion plate itself to surround the side of the light source module, the diffusion plate itself can simultaneously perform the housing function, thereby improving the manufacturing process efficiency by not using a separate structure and the product itself. It has the effect of improving the durability and reliability. In addition, according to the present invention, heat dissipation efficiency can be improved, and wavelength shift and light intensity reduction can be suppressed.

1 shows a lighting device according to an embodiment of the present invention.
FIG. 2 shows a first embodiment of the light source module shown in FIG. 1.
3 and 4 show an embodiment of the spacer member constituting the above-described reflection unit in FIG.
5 to 19 show the second to sixteenth embodiments of the light source module shown in FIG. 1.
20 illustrates an embodiment of the reflective pattern shown in FIG. 1.
21 is a plan view of a seventeenth embodiment of the light source module shown in FIG. 1.
22 is a cross-sectional view of AA' direction of the light source module illustrated in FIG. 21.
23 is a sectional view of the light source module shown in FIG. 21 in the BB' direction.
24 is a cross-sectional view of the light source module illustrated in FIG. 21 in the CC' direction.
25 shows a head lamp for a vehicle according to an embodiment of the present invention.
26 is a perspective view of a light emitting device package according to an embodiment of the present invention.
27 is a top view of a light emitting device package according to an embodiment of the present invention.
28 is a front view of a light emitting device package according to an embodiment of the present invention.
29 is a side view of a light emitting device package according to an embodiment of the present invention.
30 is a perspective view of the first lead frame and the second lead frame shown in FIG. 26.
31 is a view for explaining the dimensions of each part of the first lead frame and the second lead frame shown in FIG. 30.
FIG. 32 shows an enlarged view of the connection parts shown in FIG. 31.
33 to 38 show modified examples of the first lead frame and the second lead frame.
39 is a perspective view of a light emitting device package according to another embodiment of the present invention.
40 is a top view of the light emitting device package illustrated in FIG. 39.
41 is a front view of the light emitting device package illustrated in FIG. 39.
42 is a cross-sectional view of the light emitting device package illustrated in FIG. 39 in the cd direction.
FIG. 43 shows the first lead frame and the second lead frame shown in FIG. 39.
44 shows measurement temperatures of a light emitting device package according to an embodiment of the present invention.
FIG. 45 shows an embodiment of the light emitting chip shown in FIG. 26.
46 shows a lighting device according to another embodiment.
Fig. 47 shows a head lamp for a general vehicle which is a point light source.
48 shows a tail light for a vehicle according to an embodiment of the present invention.
49 shows a general vehicle tail light.
50A and 50B show the spacing of the light emitting device package of the light source module used in the tail light for a vehicle according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail preferred embodiments that can be easily carried out by the person of ordinary skill in the art. However, it should be understood that the configurations illustrated in the embodiments and drawings described in this specification are only preferred embodiments of the present invention, and that there may be various equivalents and modifications that can replace them at the time of application. In addition, in the detailed description of the operating principle for the preferred embodiment of the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. Terms to be described later are terms defined in consideration of functions in the present invention, and the meaning of each term should be interpreted based on the contents throughout the present specification. The same reference numerals are used for parts having similar functions and functions throughout the drawings.

The present invention relates to a lighting device, the light guide plate is removed, and this is replaced with a resin layer, but by forming an indirect light-emitting portion on the resin layer side, a variety of lighting effects are realized using the light leakage effect, and the overall thickness of the lighting device is reduced. The object of the present invention is to provide a lighting device structure capable of reducing flexibility, and reducing the number of light sources, while reducing it innovatively.

In addition, the lighting device according to the present invention can be applied to various lamp devices that require lighting, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, when applied to a vehicle lamp, it can also be applied to a headlight, vehicle interior lighting, door scarf, rear light, and the like. In addition, the lighting device of the present invention can be applied to the field of backlight units that are applied to liquid crystal displays, and in addition, it will be said to be applicable to all lighting-related fields that are currently developed and commercialized or can be implemented according to future technological development.

Hereinafter, the light source module means collectively the components except for the diffuser plate and the indirect light emitting unit.

1 shows a lighting device 1 according to an embodiment of the present invention. Referring to FIG. 1, the lighting device 1 includes a light source module 100 that is a surface light source, and may further include a housing 150 that houses the light source module 100.

The light source module 100 includes at least one light source 20 that generates light, and the light source 20 may be formed of a light emitting device package including a light emitting chip. The light source module 100 can implement a surface light source by diffusing and dispersing light generated from the light source 20, which is a point light source, and can be bent due to its flexibility.

The housing 150 protects the light source module 100 from impact, and may be made of a material (for example, acrylic) through which light emitted from the light source module 100 can be transmitted. In addition, the housing 150 may include a curved portion in terms of design, and since the light source module 100 has flexibility, it can be easily accommodated in the curved housing 150. Of course, since the housing 150 itself has a certain flexibility, it is also possible that the assembly structure of the entire lighting device 1 has a certain flexibility.

FIG. 2 shows a first embodiment 100-1 of the light source module shown in FIG. 1, and more specifically, shows a cross-sectional view in the AB direction of the lighting device shown in FIG. 1. 2, the light source module 100-1 is a flexible printed circuit board (Flexible Printed Circuit Board, 10), a light source 20, and a light guide plate (Light Guide Plate) to perform the function of the resin layer 40, It includes a reflective unit 30 formed between the printed circuit board 10 and the resin layer 40 and penetrated by the light source 20. In addition, an indirect light-emitting portion P is formed on at least one of one side and the other side of the resin layer 40, and a diffusion plate 70 is formed on the light source module 100-1.

The printed circuit board 10 may be a printed circuit board using a flexible insulating substrate, that is, a flexible printed circuit board (10).

For example, the flexible printed circuit board 10 may include a base member (eg, 5) and a circuit pattern (eg, 6, 7) disposed on at least one surface of the base member (eg, 5), and the base member (eg, , 5) may be made of a film having flexibility and insulation, such as polyimide or epoxy (eg FR-4).

More specifically, the flexible printed circuit board 10 includes an insulating film 5 (eg, polyimide or FR-4), a first copper foil pattern 6, a second copper foil pattern 7, and a via contact, 8 ). The first copper foil pattern 6 is formed on one surface (eg, the upper surface) of the insulating film 5, and the second copper foil pattern 7 is formed on the other surface (eg, the lower surface) of the insulating film 5, and is insulating The first copper foil pattern 6 and the second copper foil pattern 7 may be connected through the via contact 8 formed through the film 5.

Hereinafter, a case where the printed circuit board 10 is made of the flexible printed circuit board as described above will be described as an example, and the terms printed circuit board and flexible printed circuit board are used interchangeably, but this is only an example, and various types of It will be said that the substrate can be used as the printed circuit board 10 of the present invention.

The light source 20 is disposed on the flexible printed circuit board 10 in one or more numbers, and emits light. For example, the light source 20 may be a side view type light emitting device package that is disposed so that the emitted light proceeds in a direction 3 toward the side of the resin layer 40. In this case, the light emitting chip mounted on the light emitting device package may be a vertical light emitting chip, for example, a red light emitting chip shown in FIG. 45, but embodiments are not limited thereto.

The resin layer 40 is disposed on the flexible printed circuit board 10 and the light source 20 to embed the light source 20 and is emitted from the light source 20 in the lateral direction 3 of the resin layer 40. Light may be diffused and guided in a direction toward one surface (eg, an upper surface) of the resin layer 40.

The resin layer 40 may be made of a resin that can diffuse light, and its refractive index may be formed in the range of 1.4 to 1.8, but is not limited thereto.

For example, the resin layer 40 may be made of a highly heat-resistant ultraviolet curing resin including an oligomer. At this time, the content of the oligomer may be 40 to 50 parts by weight. In addition, urethane acrylate (Urethane Acrylate) may be used as the UV curable resin, but is not limited thereto, and in addition, epoxy acrylate (Epoxy Acrylate), polyester acrylate (Polyester Acrylate), polyether acrylate (Polyether Acrylate), Polybutadiene acrylate (Polybutadiene Acrylate), silicone acrylate (Silicon Acrylate) at least one material may be used.

In particular, when urethane acrylate is used as an oligomer, different physical properties can be simultaneously realized by mixing and using two types of urethane acrylate.

For example, isocyanate is used in the process of synthesizing urethane acrylate, and the physical properties (yellowing, weathering, chemical resistance, etc.) of urethane acrylate are determined by isocyanate. At this time, a certain type of urethane acrylate (Urethane Acrylate) is implemented as Urethane Acrylate type-Isocyanate, and the NCO% of isophorone diisocyanate (PDI) or isophorone diisocyanate (IPDI) is 37% (hereinafter referred to as'first oligomer'). ), another type of urethane acrylate (Urethane Acrylate) is implemented as Urethane Acrylate type-Isocyanate, but the NCO% of isophorone diisocyanate (PDI) or isophorone diisocyanate (IPDI) is 30-50% or 25-35%. (Hereinafter, referred to as the'second oligomer') to form the oligomer according to the embodiment. According to this, it is possible to obtain a first oligomer and a second oligomer having different properties according to NCO% control, and it is possible to implement an oligomer forming the resin layer 40 by mixing them. At this time, the weight ratio of the first oligomer in the oligomer may be implemented in a range of 15 to 20, and the weight ratio of the second oligomer in the range of 25 to 35.

Meanwhile, the resin layer 40 may additionally include at least one of a monomer and a photo initiator. At this time, the content of the monomer may be 65 to 90 parts by weight, more specifically, IBOA (isobornyl acrylate) 35 to 45 parts by weight, 2-HEMA (2-Hydroxyethyl Methacrylate) 10 to 15 parts by weight, 2-HBA (2-Hydroxybutyl Acrylate) may be made of a mixture containing 15 to 20 parts by weight. In addition, in the case of a photoinitiator (eg, 1-hydroxycyclohexyl phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide, etc.) may be 0.5 to 1 parts by weight.

In addition, the resin layer 40 may be made of a thermosetting resin having high heat resistance. Specifically, the resin layer 40 may be made of a thermosetting resin including at least one of a polyester polyol resin, an acryl polyol resin, a hydrocarbon-based and/or an ester-based solvent. The thermosetting resin may further include a thermosetting agent to improve coating film strength.

In the case of polyester polyol resin, the content of the polyester polyol resin may be 9 to 30% of the total weight of the thermosetting resin. In addition, in the case of acrylic polyol (Acryl Polyol) resin, the content of the acrylic polyol may be made of 20 to 40% by weight of the total weight of the thermosetting resin.

In the case of a hydrocarbon-based or ester-based solvent, the content may be 30 to 70% of the total weight of the thermosetting resin. In the case of a thermosetting agent, the content of the thermosetting resin may be 1 to 10% of the total weight. When the resin layer 40 is formed of the above-described material, the heat resistance is enhanced, so that even when used in a lighting device that emits high-temperature heat, it is possible to minimize luminance degradation due to heat, thereby providing a reliable lighting device. have.

In addition, according to the present invention, the thickness of the resin layer 40 can be innovatively reduced by using the material as described above for realizing the surface light source, so that the entire product can be thinned. In addition, according to the present invention, a lighting device is formed using a flexible printed circuit board and a resin layer made of a flexible material, which can be easily applied to a curved surface, thereby improving the degree of freedom of design, and other flexible displays. There are advantages that can be applied and applied.

The resin layer 40 may include a diffusion material 41 having a hollow (or void) formed therein, and the diffusion material 41 may be in the form of mixed or diffused with the resin constituting the resin layer 40, It can serve to improve the reflection and diffusion characteristics of light.

For example, light emitted from the light source 20 to the resin layer 40 is reflected and transmitted by the hollow of the diffusion material 41 so that light is diffused and condensed in the resin layer 40 and diffused and condensed. Light may be emitted to one surface (eg, an upper surface) of the resin layer 40. At this time, the reflectance and diffusivity of light is increased by the diffusion material 41 to improve the light amount and uniformity of the emitted light supplied to the upper surface of the resin layer 40, and as a result, to improve the brightness of the light source module 100-1. Can.

The content of the diffusion material 41 can be appropriately adjusted to obtain a desired light diffusion effect. Specifically, it can be adjusted in the range of 0.01 to 0.3% by weight of the entire resin layer 40, but is not limited thereto. The diffusion material 41 may be composed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al2O3, and acryl. The particle size of the diffusion material 41 may be 1 μm to 20 μm, but is not limited thereto.

A reflective unit 30 is formed between the flexible printed circuit board 10 and the resin layer 40, and a reflective pattern 31 may be further formed on the reflective unit 30. The reflective unit 30 and the reflective pattern 31 serve to improve the reflectance of light emitted from the light source 20, and more details will be described later in the description of FIGS. 3 and 4.

An indirect light-emitting portion P may be formed on at least one of one side and the other side of the resin layer 40. The indirect light-emitting part P is a part of the light component emitted from the light source 20 to implement an additional light-emitting part by using the lost light emitted to the side of the resin layer 40. 2, the configuration of the indirect light emitting part P is formed between the light reflection member 90 and the resin layer 40 side and the light reflection member 90 formed on the side of the resin layer 40, as shown in FIG. It comprises an indirect emitting air gap (91).

When the light emitted from the light source 20 is emitted through the side of the resin layer 40, the light reflection member 90 reflects the emitted light to form reflected light (or indirect light). Accordingly, the light lost in the lighting device is re-reflected by the light reflection member 90 to cause a flare or light blurring phenomenon in which light is lightly spread, and by using this, indoor and outdoor interiors and vehicles without additional light sources Various lighting effects applicable to lighting can be realized.

The light reflection member 90 may be made of a material having excellent light reflectivity, for example, a white resist, and additionally, a synthetic resin containing white pigment dispersed or a synthetic resin in which metal particles having excellent light reflection properties are dispersed. It might be. At this time, as the white pigment, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. may be used, and when the metal powder is included, Ag powder having excellent reflectance may be included. In addition, it will be possible to further include a separate fluorescent brightener. That is, the light reflection member 90 of the present invention may be formed using all materials having excellent light reflectivity, which are currently developed or can be implemented according to future technological development. Meanwhile, the light reflection member 90 is directly molded and coupled inside the side wall 73 of the diffusion plate 70, or attached through a separate adhesive material (for example, an adhesive tape or a thermosetting PSA), or a side wall ( 73) It can also be combined with the diffusion plate 70 by being printed directly on the inside.

In addition, although the light reflecting member 90 is illustrated as being formed over the entire inner surface of the side wall 73 of the diffusion plate 70, this is only an example and there is no limitation in the range of formation of the light reflecting member 90. It will not be said.

On the other hand, in order to maximize the above-described flare phenomenon, an indirect light-emitting air gap 91 may be formed between the light reflection member 90 and the resin layer 40, so that light emitted to the side of the resin layer 40 is It is scattered in the indirect light emission air gap 91 due to the difference in refractive index, and the scattered light is re-reflected by the light reflection member 90 to maximize flare. The width of the indirect light emission air gap 91 may be formed in a range of more than 0 to 20 mm or less, but is not limited thereto, and may be appropriately changed in design according to the specifications of the lighting device and the degree of indirect light emission to be implemented.

The diffuser plate 70 may be disposed above the light source module 100-1, more specifically on the resin layer 40, and serves to uniformly diffuse light emitted through the resin layer 40 over the entire surface. Do it. The thickness of the diffusion plate 70 may be basically formed in the range of 0.5 to 5mm, but is not limited thereto, and may be appropriately changed in design according to the specifications of the lighting device. In particular, the diffusion plate 70 of the present invention is made of a structure having a top surface 71 and a side wall 73 integrally formed with the top surface 71, as shown in Figure 2, wherein the side wall 73 is The outer surface of the indirect light emitting portion P is wrapped. The diffusion plate 70 may be generally formed of an acrylic resin, but is not limited thereto, and in addition, polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), polyethylene terephthalate (PET) ), high-permeability plastics such as resin, and the like, and may be made of a material capable of performing a light diffusion function.

A first air gap 80 may exist between the upper surface 71 of the diffusion plate 70 and the resin layer 40. Due to the presence of the first air gap 80, it is possible to generate a difference in refractive index from the resin layer 40, thereby increasing the uniformity of the light supplied to the diffusion plate 70, and consequently, the diffusion plate ( Through 70), uniformity of light diffused and emitted may be improved. At this time, in order to minimize the deviation of light transmitted through the resin layer 40, the thickness of the first air gap 80 may be in the range of more than 0 to 30 mm, but is not limited thereto, and the design can be changed as necessary.

The side wall 73 of the diffusion plate 70 surrounds the outer surface of the indirect light-emitting portion P, in particular, the outer surface of the light reflection member 90, and the side wall 73 is a light reflection member 90 as described above ) To serve as a supporting part and a housing to protect the light source module 100-1. That is, the diffusion plate 70 according to the present invention can perform the role of the housing 150 shown in FIG. 1 as necessary. According to this, the diffusion plate 70 itself covers not only the upper portion but also the side portion of the light source module 100-1, so that the diffusion plate 70 itself can simultaneously perform a housing function, and does not use a separate structure. It has the effect of improving the manufacturing process efficiency and the durability and reliability of the product itself.

3 is a view showing an embodiment of the spacer member constituting the configuration of the reflection unit 30 and the reflection unit 30 of the lighting device of the present invention described above in the description of FIG.

2 to 3(a), the reflective unit 30 formed on the flexible printed circuit board (10 in FIG. 2) has an air area 36 therein, and an air area ( 26) serves to maximize the luminance by enhancing the reflection efficiency of light emitted from the light source (20 in FIG. 2).

In particular, the reflective unit 30 is spaced apart from the first reflective sheet 33 and the first reflective sheet 33 that are in close contact with the surface of the flexible printed circuit board (10 in FIG. 2) to form an air region 36. It may be configured to include a second reflective sheet 35 of a transparent material. The first and second reflective sheets 33 and 35 are stacked on the flexible printed circuit board (10 in FIG. 2), and penetrate the holes formed on the reflective unit 30 so that the light source (20 in FIG. 2) is outward. Will protrude.

The formation of the air region 36 may be performed by integrally pressing the first and second reflective sheets 33 and 35 without using a separate adhesive or other member, and further, as illustrated in the drawing, It is also possible to implement an air region 36 in which air is received through a spacer 37 such as a separate adhesive member between the first reflective sheet 33 and the second reflective sheet 35.

The first reflective sheet 33 may be formed using a reflective material that reflects light, for example, a film formed of a metal layer such as Ag on the base substrate. Alternatively, it is also possible to implement the first reflective sheet 33 with a synthetic resin containing a white pigment, for example, white polyethylen terephthalate (PET), in order to realize properties that promote light reflection and dispersion. At this time, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate, etc. may be used as the white pigment, and polyethylene terephthalate, polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin as synthetic resin , Cellulose acetate, weather-resistant vinyl chloride, and the like may be used, but is not limited thereto.

The second reflective sheet 35 may be implemented with a transparent material film, for example, PET, so that light emitted from the light source (20 of FIG. 2) is transmitted to the surface of the first reflective sheet 33 and reflected again.

On the other hand, the reflective pattern 31 may be further formed on the second reflective sheet 33 so as to further promote the dispersion of light to improve luminance. The reflection pattern 31 is a structure that serves to scatter and disperse the incident light, and the second reflective sheet 35 includes a reflective ink containing any one of TiO2, CaCo3, BaSo4, Al2O3, Silicon, and PS (Polystyrene) The reflective pattern 31 described above may be formed by printing on the surface, but is not limited thereto.

The structure of the reflective pattern 31 may be a plurality of protruding patterns, and may be regular or irregular. The reflection pattern 31 may be formed in a prism shape, a lenticular shape, a lens shape, or a combination shape thereof to increase the scattering effect of light, but is not limited thereto. In addition, although the cross-sectional shape of the reflective pattern 31 is shown as a square in FIGS. 2 and 3 (a), this is only an example, and in addition, the cross-sectional shape of the reflective pattern 31 is triangular, pentagonal, etc. It may be made of a structure having a variety of shapes, such as polygonal, semi-circular, sine wave, and the shape of the reflective pattern 31 viewed from above may be polygonal (eg, hexagonal), circular, elliptical, or semicircular.

20 shows an embodiment of the reflective pattern 31 shown in FIGS. 2 and 3A. Referring to FIG. 20, the reflective patterns 31 may have different diameters according to a separation distance from the light source 20. For example, the closer the reflective pattern 31 is to the light source 20, the larger the diameter. Specifically, the diameter may be large in the order of the first reflective pattern 71, the second reflective pattern 72, the third reflective pattern 73, and the fourth reflective pattern 74. However, the embodiment is not limited thereto, and in addition, it may be said that the reflective pattern 31 of the present invention can be formed in various configurations, such as a configuration that changes the density according to the distance from the light source, and a configuration that changes both the size and the density. .

FIG. 3(b) shows an embodiment of the spacer member constituting the reflective unit 30 described in FIG. 3(a). The spacer member 37 according to the present invention performs only a general spacer function such as a spacer member that simply spaces the first reflection sheet 33 and the second reflection sheet 35 or a spacer member having adhesive properties, and thus the air area 36. It is also possible to implement, but more preferably, in order to improve the efficiency of the arrangement of the air region and at the same time to improve the adhesion efficiency, in implementing the spacer member, the patterning structure shown in FIG. 3(b) is uniformly and randomly formed. can do.

The separation member 37 shown in (b) of FIG. 3 is provided with a plurality of unit spacer members 37a in which a cavity portion is implemented inside, and is made of an empty structure inside the unit spacer member 37a. It can be implemented in a two-dimensional or three-dimensional structure in which one air unit 37b is implemented. At this time, the cross section of the unit spacing member 37a may be implemented in various shapes such as a polygon, a circle, and an ellipse. In particular, as shown, in addition to the structure in which a plurality of each of the unit spacer members 37a are disposed in close contact with each other, the first air unit 37b inside the unit spacer member 37a is disposed in an irregular structure with each other. In addition, it is also possible to further form a second air portion 37c made of an empty space between each unit spacer 37a. According to this, the lighting device of the present invention including the above-described reflection unit 30 is provided with a reflection unit 30 having an air area to improve the reflectance of light and maximize the luminance improvement, the thickness of the lighting device or the number of light sources The effect of increasing the luminance without increasing and the pattern design of the spacer (spacer) forming the air region have the effect of maximizing the control and reflection of light.

FIG. 4 shows a specific implementation of the reflection unit described above in FIG. 3.

As described above, the reflective unit 30 according to the present invention includes a first reflective sheet 33 and a second reflective sheet spaced apart so as to face the first reflective sheet 33, which is in close contact with the flexible printed circuit board. 35).

In particular, the second reflective sheet 35 can be applied to a film of a transparent material such as PET, and is provided with a spacer 37 that separates the first and second reflective sheets 33 and 35 by patterning an adhesive material Thus, an air region is formed.

In particular, in order to maximize reflection efficiency, the first reflection sheet 33 includes a film 331 to which the metal reflection layer 38 is bonded via an adhesive, and the film 331 is also on the release film 335. The adhesive material (PSA; 333) may be implemented in a structure that is laminated through a medium. However, this is only an example, and in addition, the first reflective sheet 33 of the present invention may be implemented with white PET or the like as described above in the description of FIG. 3.

5 shows a second embodiment 100-2 of the light source module shown in FIG. 1. The same reference numerals as in FIG. 2 indicate the same configuration, and overlapping contents with those described above are omitted or briefly described.

Referring to FIG. 5, in order to improve heat dissipation efficiency, the second embodiment may be a structure that further includes a heat dissipation member 110 in the first embodiment 100-1.

The heat dissipation member 110 is disposed on the lower surface of the flexible printed circuit board 10 and serves to discharge heat generated from the light source 20 to the outside. That is, the heat dissipation member 110 can improve the efficiency of dissipating heat generated from the light source 20 as a heat source to the outside.

For example, the heat dissipation member 110 may be disposed on a portion of the lower surface of the flexible printed circuit board 10. The heat dissipation member 110 may include a plurality of heat dissipation layers (eg, 110-1 and 110-2) spaced apart. The heat dissipation layers 110-1 and 110-2 may overlap at least a portion of the light source 20 in the vertical direction to improve the heat dissipation effect. Here, the vertical direction may be a direction from the flexible printed circuit board 10 to the resin layer 40.

The heat dissipation member 110 may be a material having high thermal conductivity, such as aluminum, aluminum alloy, copper, or copper alloy. Alternatively, the heat dissipation member 110 may be a Metal Core Printed Circuit Board (MCPCB). The heat dissipation member 110 may be attached to the lower surface of the flexible printed circuit board 10 by an acrylic adhesive (not shown).

In general, when the temperature of the light emitting device increases due to heat generated from the light emitting device, the light intensity of the light emitting device decreases and a wavelength shift of the generated light may occur. In particular, when the light emitting device is a red light emitting diode, the degree of wavelength shift and light intensity reduction is severe.

However, the light source module 100-2 is provided with a heat radiating member 110 on the lower surface of the flexible printed circuit board 10 to effectively discharge heat generated from the light source 20 to the outside, thereby suppressing the temperature rise of the light source. , Due to this, the light intensity of the light source module 100-2 may be reduced or the wavelength shift of the light source module 100-2 may be suppressed.

6 shows a third embodiment 100-3 of the light source module shown in FIG. The same reference numerals as in FIG. 5 indicate the same configuration, and overlapping contents with those described above will be omitted or briefly described.

Referring to FIG. 6, the light source module 100-3 may have a structure in which the first optical sheet 52 is added to the second embodiment.

The first optical sheet 52 is disposed on the resin layer 40 and transmits light emitted from one surface (eg, an upper surface) of the resin layer 40. The first optical sheet 52 may be formed using a material having excellent light transmittance, and for example, PET (Polyethylene Telephthalate) may be used.

On the other hand, when the first optical sheet 52 is formed, the first air gap 80 described in the description of FIG. 2 includes the upper surface 71 of the diffusion plate 70 and the first optical sheet 52 ). Due to the presence of the first air gap 80, the uniformity of light supplied to the diffusion plate 70 can be increased, and as a result, the uniformity of light diffused and emitted through the diffusion plate 70 can be improved. Yes, as described above in the description of FIG. 2.

In addition, although the light reflecting member 90 is illustrated as being formed over the entire inner surface of the side wall 73 of the diffusion plate 70, this is only an example and there is no limitation in the range of formation of the light reflecting member 90. None is as described above in the description of FIG. 2.

7 shows a fourth embodiment 100-4 of the light source module shown in FIG. 1.

Referring to FIG. 7, the light source module 100-4 may have a structure in which the adhesive layer 56, the light blocking pattern 60, and the second optical sheet 54 are added to the third embodiment 100-3. .

The second optical sheet 54 is disposed on the first optical sheet 52. The second optical sheet 54 may be formed using a material having excellent light transmittance, and PET may be used as an example.

In addition, the adhesive layer 56 is disposed between the first optical sheet 52 and the second optical sheet 54 to adhere the first optical sheet 52 and the second optical sheet 54.

The optical pattern 60 may be disposed on at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54. The optical pattern 60 may be attached to at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 by the adhesive layer 56. Other embodiments may further include one or more optical sheets (not shown) on the second optical sheet 56. At this time, the structure including the first optical sheet 52, the second optical sheet 54, the adhesive layer 56 and the optical pattern 60 may be defined as the optical pattern layer 50.

The optical pattern 60 may be a light blocking pattern for preventing concentration of light emitted from the light source 20. The optical pattern 60 is aligned to the light source 20 and may be formed in a manner that is adhered to the first optical sheet 52 and the second optical sheet 54 by the adhesive layer 56, or It may be formed by printing directly on at least one of the first optical sheet 52 and the second optical sheet 54.

The first optical sheet 52 and the second optical sheet 54 may be formed using a material having excellent light transmittance, and PET, for example, may be used.

The optical pattern 60 basically functions to prevent light emitted from the light source 20 from being concentrated. That is, the optical pattern 60 in addition to the reflective pattern 31 described above serves to realize uniform surface emission.

The optical pattern 60 may be a blocking pattern that shields a part of the light emitted from the light source 20, and the intensity of the light is excessively strong, thereby preventing deterioration in optical characteristics or yellowish light. For example, the optical pattern 60 may prevent light from being concentrated in an area adjacent to the light source 20 and may serve to disperse the light.

The optical pattern 60 may be formed by performing a printing process on the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 using light blocking ink. The optical pattern 60 is not a function of completely blocking the light, but the light pattern or the diffusivity of the light can be adjusted by adjusting the density and/or size of the optical pattern to perform a function of partially blocking and diffusing the light. For example, in order to improve light efficiency, the optical pattern 60 may be adjusted such that the density of the optical pattern decreases as it moves away from the light source 20, but is not limited thereto.

Specifically, the optical pattern 60 may be implemented as a superimposed printing structure of a complex pattern. The structure of overlapping printing refers to a structure formed by forming one pattern and printing another pattern shape on the top.

For example, the optical pattern 60 may include a diffusion pattern and a light blocking pattern, and may have a structure in which the diffusion pattern and the light blocking pattern overlap. For _{example, TiO 2, CaCO 3, BaSO} 4, Al 2 O 3, Silicon, PS (polystyrene) any polymer film (e.g., the second optical member to the light emission direction by using the light-blocking ink comprising at least one material selected from ( A diffusion pattern may be formed on the lower surface of 54)). In addition, a light blocking pattern may be formed on the surface of the polymer film by using a light blocking ink containing Al or a mixture of Al and TiO ₂ .

That is, after the diffusion pattern is formed by white printing on the surface of the polymer film, a light-shielding pattern may be formed thereon, or it may be formed in a double structure in the reverse order. Of course, it will be apparent that the pattern design can be variously modified in consideration of light efficiency, intensity, and shading rate.

Alternatively, in another embodiment, the optical pattern 60 may be a triple structure including a first diffusion pattern, a second diffusion pattern, and a light blocking pattern disposed therebetween. In such a triple structure, it is possible to select and implement the above-described materials. As an example, the first diffusion pattern may include TiO ₂ having excellent refractive index, the second diffusion pattern may include CaCO ₃ and TiO ₂ excellent in light stability and color, and the light-shielding pattern includes Al excellent in hiding. can do. Through the optical pattern of the triple structure, the embodiment can secure light efficiency and uniformity. In particular, CaCO ₃ has a function of subtracting the exposure of yellow light to finally implement white light, so that light with more stable efficiency can be realized. In addition to CaCO ₃ , BaSO ₄ , Al ₂ Inorganic materials having a large particle size and similar structures, such as O ₃ and Silicon, can be used.

The adhesive layer 56 may surround the peripheral portion of the optical pattern 60 and fix the optical pattern 60 to at least one of the first optical sheet 52 and the second optical sheet 54. At this time, the adhesive layer 56 may use a thermosetting PSA, a thermosetting adhesive, or a UV cured PSA type material, but is not limited thereto.

Meanwhile, when the second optical sheet 54 is formed on the first optical sheet 52, the first air gap 80 described in the description of FIG. 2 is the upper surface of the diffusion plate 70 ( 71) and the first optical sheet 52. At this time, a description of the thickness of the first air gap 80 and its function is omitted as described above in the description of FIG. 2.

In addition, the range including the side surface of the resin layer 40 is not limited to the formation range of the light reflection member 90, as described above in the description of FIG.

8 shows a fifth embodiment (100-5) of the light source module shown in FIG.

*147 Referring to Figure 8, the light source module 100-5 may be a structure in which the second air gap 81 is added to the fourth embodiment 100-4. That is, the fifth embodiment 100-5 may include a second air gap 81 between the first optical sheet 52 and the second optical sheet 54.

For example, a second air gap 81 may be formed on the adhesive layer 56. The adhesive layer 56 forms a space (second air gap 81) spaced around the optical pattern 60, and the first optical sheet 52 and the second optical sheet ( 54) can be implemented in a structure that adheres to each other.

The adhesive layer 56 may be formed of a structure in which the second air gap 81 is located at the periphery of the optical pattern 60. Alternatively, the adhesive layer 56 may have a structure surrounding the peripheral portion of the optical pattern 60 and the second air gap 81 positioned at a portion other than the peripheral portion. The adhesive structure of the first optical sheet 52 and the second optical sheet 54 may also implement a function of fixing the printed optical pattern 60. The structure including the first optical sheet 52, the second optical sheet 54, the second air gap 81, the adhesive layer 56, and the optical pattern 60 may be defined as the optical pattern layer 50. have.

Since the second air gap 81 and the adhesive layer 56 have different refractive indices, the second air gap 81 diffuses light traveling from the first optical sheet 52 toward the second optical sheet 56 and Dispersion can be improved. And because of this, the embodiment can implement a uniform surface light source.

9 shows a sixth embodiment (100-6) of the light source module shown in FIG. Referring to FIG. 9, the light source module 100-6 may have a structure in which via holes 212 and 214 for improving heat dissipation are provided on the flexible printed circuit board 10 of the first embodiment.

The via holes 212 and 214 may penetrate the flexible printed circuit board 110 and expose a portion of the light source 20 or a portion of the resin layer 40. For example, the via holes 212 and 214 may include a first via hole 212 exposing a portion of the light source 20 and a second via hole 214 exposing a portion of the lower surface of the resin layer 40.

Heat generated from the light source 20 as a heat source may be directly discharged to the outside through the first via hole 212, and heat conducted from the light source 20 to the resin layer 40 may be the second via hole 214. It can be directly discharged through. In the sixth embodiment, since heat generated from the light source 20 is discharged to the outside through the via holes 212 and 214, heat dissipation efficiency can be improved. The shapes of the first via hole 212 and the second via hole 214 may be various shapes such as polygonal, circular, and elliptical shapes.

10 shows a seventh embodiment (100-7) of the light source module shown in FIG. Referring to FIG. 10, the light source module 100-7 may have a structure in which the first optical sheet 52 is added to the sixth embodiment. The seventh embodiment 100-7 may improve heat dissipation efficiency by the first and second via holes 212 and 214. Descriptions of the components 30, 31, and 52 added in this embodiment are the same as described above in FIG. 6, and are omitted.

11 shows an eighth embodiment (100-8) of the light source module shown in FIG. 1. Referring to FIG. 11, the light source module 100-8 has a structure in which the second optical sheet 52, the adhesive layer 56, the light blocking pattern 60, and the second optical sheet 54 are added to the seventh embodiment Can have The configurations 52, 54, 56, and 60 added in this embodiment are the same as described above in FIG. 7, and are omitted.

12 shows a ninth embodiment (100-9) of the light source module shown in FIG. Referring to FIG. 12, the light source module 100-9 includes a second optical sheet 52, an adhesive layer 56, a light blocking pattern 60, a second optical sheet 54, and a second air in the seventh embodiment The gap 81 may have an added structure. A second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the tenth embodiment 100-10, and the second air gap 81 is shown in FIG. 8. It may be the same as described.

13 shows a tenth embodiment (100-10) of the light source module shown in FIG. 1. The same reference numerals as in FIG. 1 denote the same configuration, and overlapping contents with those described above will be omitted or briefly described.

13, unlike the heat dissipation member 110 of the second embodiment (100-2), the heat dissipation member 310 of the light source module 100-10 is disposed on the lower surface of the flexible printed circuit board 10 The lower heat dissipation layer 310-1 and a portion of the lower heat dissipation layer 310-1 may have a through portion 310-1 penetrating the flexible printed circuit board 10 to contact the light source 20.

For example, the through portion 310-1 may contact the first side portion 714 of the first lead frames 620 and 620 ′ of the light emitting device packages 200-1 and 200-2 described later.

According to the tenth embodiment, since heat generated from the light source 20 is directly transmitted to the heat dissipation member 310 by the through portion 310-1, the heat dissipation efficiency can be improved.

14 shows an eleventh embodiment (100-11) of the light source module shown in FIG. 1. Referring to FIG. 14, the light source module 100-11 may be a structure in which the first optical sheet 52 is added to the tenth embodiment, and the added components 30, 31 and 52 are described in FIG. 6. It can be the same as the bar.

15 shows a twelfth embodiment (100-12) of the light source module shown in FIG. 1. 13, the light source module 100-12 is the second optical sheet 52, the adhesive layer 56, the light-shielding pattern 60, and the second optical sheet 54 in the eleventh embodiment (100-11) ) May be added. The added components 52,54, 56,60 may be the same as described in FIG. 7.

16 shows a thirteenth embodiment (100-13) of the light source module shown in FIG. 1. Referring to FIG. 16, the light source module 100-13 may have a structure in which the second air gap 81 is added to the twelfth embodiment 100-12. That is, a second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the thirteenth embodiment 100-13, and the second air gap 81 is shown in FIG. 8. It may be the same as described in.

17 shows a fourteenth embodiment of the light source module shown in FIG. 1, FIG. 18 shows a fifteenth embodiment of the light source module shown in FIG. 1, and FIG. 19 shows a sixteenth embodiment of the light source module shown in FIG. It shows an example.

The reflective unit 30-1, the second optical sheet 54-1, and the diffuser plate 70-1 shown in FIGS. 17 to 19 are reflective units shown in FIGS. 8, 12, and 16 ( 30), the second optical sheet 54, and the diffusion plate 70 may be modified examples.

Irregularities R1, R2, and R3 may be formed on one or both surfaces of at least one of the reflective unit 30-1, the second optical sheet 54-1, and the diffusion plate 70-1. The unevenness R1, R2, R3 reflects and diffuses the incident light so that the light emitted to the outside forms a geometric pattern.

For example, a first unevenness R1 may be formed on one surface (eg, an upper surface) of the reflective unit 30-1, and a second unevenness R2 may be formed on one surface (eg, an upper surface) of the second optical sheet 54-1. ) May be formed, and a third unevenness R3 may be formed on one surface (eg, a lower surface) of the diffusion plate 70. These unevennesses R1, R2, and R3 may include a plurality of regular or irregular patterns. It may be made of a structure, and may be formed in a prism shape, a lenticular shape, a concave lens shape, a convex lens shape, or a combination shape thereof to increase the reflection and diffusion effects of light, but is not limited thereto.

In addition, the cross-sectional shape of the unevenness (R1, R2, R3) may be made of a structure having various shapes such as a triangle, a square, a semicircle, a sine wave. In addition, the size or density of each pattern may be changed according to the distance from the light source 20.

The unevenness (R1, R2, R3) may be formed by directly processing the reflective unit 30-1, the second optical sheet 54-1, and the diffusion plate 70, but there is no limitation and a certain pattern is formed. It can be formed in any way that is currently developed and commercialized, such as the method of attaching a film, or that can be implemented according to future technological development.

The embodiment can easily implement a geometric light pattern through a combination of patterns of the first to third irregularities R1, R2, and R3. In another embodiment, irregularities may be formed on one surface or both surfaces of the second optical sheet 52.

However, the embodiment in which the unevenness R1, R2, or R3 is formed is not limited to FIGS. 17 to 19, and the reflective unit 30, the first optical sheet 52, and the second optical included in other embodiments At least one surface or both surfaces of the sheet 54 and the diffusion plate 70 may be formed with irregularities for increasing light reflection and diffusion effects.

21 is a plan view of a seventeenth embodiment (100-17) of the light source module shown in FIG. 1, and FIG. 22 is a cross-sectional view of AA' direction of the light source module 100-17 shown in FIG. 23 shows a cross-sectional view in the BB' direction of the light source module 100-17 shown in FIG. 19, and FIG. 24 shows a cross-sectional view in the CC' direction of the light source module 100-17 shown in FIG.

21 to 24, the light source module 100-17 includes a plurality of sub light source modules (sub-light source modules, 101-1 to 101-n, n>1 is a natural number), and includes a plurality of The sub light source modules 101-1 to 101-n may be separated or combined with each other. In addition, the combined plurality of sub light source modules 101-1 to 101-n may be electrically connected to each other. At this time, the formation of the diffuser plate 70 and the light reflection member 90 is performed by combining the sub light source modules 101-1 to 101-n with each other, and then the light reflection member 90 has a sidewall ( 73) can be made by combining the diffusion plate 70 formed inside.

Each of the sub light source modules 101-1 to 101-n includes at least one connector (eg, 510, 520, 530) that can be connected to the outside. For example, the first sub light source module 101-1 may include a first connector 510 including at least one terminal (eg, S1, S2). Each of the second sub light source modules 101-2 includes a first connector 520 and a second connector 530 for connection with the outside, and the first connector 520 includes at least one terminal (eg, P1, P2), and the second connector 530 may include at least one terminal (eg, Q1, Q2). In this case, the first terminals S1, P1, and Q1 may be positive (+) terminals, and the second terminals S2, P2, and Q2 may be negative (-) terminals. Although FIG. 23 illustrates that each connector (eg, 510,520, 530) includes two terminals, the number of terminals is not limited thereto.

22 to 24 illustrate a structure in which a connector 510, 520, or 530 is added to the fifth embodiment 100-5, but is not limited thereto, and the sub light source modules 101-1 to 101- n) Each of the connectors (for example, 510, 520, or 530) and connection fixing parts (for example, 410-1, 420-1) to the light source modules 100-1 to 100-20 according to any one of the above-described embodiments , 410-2) may be added.

22 and 23, each of the sub light source modules 101-1 to 101-n is a flexible printed circuit board 10, a light source 20, a reflection unit 30, a reflection pattern 31, resin Layer 40, first optical sheet 52, second optical sheet 54, adhesive layer 56, optical pattern 60, heat dissipation member 110, at least one connector (connector, 510, 520, or 530), and at least one connection fixing part (410, and 420). The same reference numerals as in FIG. 1 denote the same configuration, and overlapping contents with those described above will be omitted or briefly described. Compared with other embodiments, each of the sub light source modules 101-1 to 101-n of the seventeenth embodiment may have a difference in size or the number of light sources, but its configuration except for the connector and the connection fixing part It can be the same.

The first sub light source module 101-1 is electrically connected to the light source 20 and may include a first connector 510 provided on the flexible printed circuit board 10 for electrical connection with the outside. For example, the first connector 510 may be implemented in a patterned form on the flexible printed circuit board 10.

In addition, the second sub light source module 101-2 may include a first connector 520 and a second connector 530 electrically connected to the light source 20. The first connector 520 is provided on one side of the flexible printed circuit board 10 to electrically connect with the outside (eg, the first connector 510 of the first sub light source module 101-1). 2 The connector 530 may be provided on the other side of the flexible printed circuit board 10 to electrically connect with another external (eg, a connector (not shown) of the third sub light source module 101-3).

The connection fixing parts (for example, 410-1, 420-1, 410-2) are combined with other external sub light source modules, and serve to fix the combined two sub light source modules to each other. The connection fixing part (for example, 410-1, 420-1, 410-2) is a protrusion in which a part of the side of the resin layer 40 protrudes, or a groove in which a part of the side of the resin layer 40 is recessed. It can be wealth.

Referring to FIG. 24, the first sub light source module 101-1 may include a first connection fixing part 410-1 having a structure in which a portion of the side of the resin layer 40 protrudes. In addition, the second sub light source module 101-2 has a structure in which a portion of the resin layer 40 is partially recessed, and the first connection fixing portion 420-1 and the other portion of the resin layer 40 are protruded. It may include a second connection fixing portion (410-2).

The first connection fixing part 410-1 of the first sub light source module 101-1 and the first connection fixing part 420-1 of the second sub light source module 101-2 are fixed to each other by male and female coupling. Can.

The embodiment shows that the connection fixing portion (eg, 410-1, 420-1, 410-2) is implemented as part of the resin layer 40, but is not limited thereto, and a separate connection fixing portion may be provided. In addition, the connection fixing part can be modified to other forms that can be connected.

The shape of the sub light source modules 101-1 to 101-n (n>1 is a natural number) may be a shape in which a certain portion protrudes, but is not limited thereto, and may be implemented in various forms. For example, the shape of the sub light source modules 101-1 to 101-n (n>1 is a natural number) as viewed from above may be circular, elliptical, or polygonal, and may be partially protruding in the lateral direction.

For example, one end of the first sub light source module 101-1 includes a protrusion 540 in the center, and a first connector 510 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 540, , A first connection fixing part 410-1 may be provided on the resin layer 40 of the other end of the first sub light source module 101-1 other than the protrusion 540.

In addition, one end of the second sub light source module 101-2 has a groove 545 in the center, and a first connector 520 may be provided on the flexible printed circuit board 10 corresponding to the groove 545, and the groove portion A first connection fixing part 420-1 may be provided on the resin layer 40 of the other end of the second sub light source module 101-2 other than 545. And the other end of the second sub light source module 101-2 includes a protrusion 560 in the center, and a second connector 530 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 560, A second connection fixing part 410-2 may be provided on the resin layer 40 of the other end of the second sub light source module 101-2 other than the protrusion 560.

Each of the sub light source modules 101-1 to 101-n can be an independent light source by itself, can be variously modified in shape, and two or more sub light source modules are assembled to each other and independently connected by a connection fixing part. Since it can be used as a phosphorus light source, the embodiment can improve the degree of freedom in product design. In addition, the embodiment may be used by replacing only the damaged sub-light source module when some of the assembled sub-light source modules are damaged or damaged.

The above-described light source module may be used in a display device, an indicator device, and a lighting system that require a surface light source. In particular, although lighting is required, the light source module according to the embodiment may be easily installed even in a place where the installation of the lighting is not easy (for example, a ceiling or a floor having bending) because the portion to be mounted has a curve. There is an advantage. For example, the lighting system may include a lamp or a street light, and the lamp may be a head lamp for a vehicle, but is not limited thereto.

25 shows a vehicle head lamp 900-1 according to an embodiment, and FIG. 47 shows a general vehicle head lamp that is a point light source. Referring to FIG. 25, the vehicle head lamp 900-1 includes a light source module 910 and a light housing 920.

The light source module 910 may be the above-described embodiments (100-1 to 100-17). The light housing 920 accommodates the light source module 910 and may be made of a light-transmitting material. The vehicle light housing 920 may include bends depending on the vehicle portion and the design to be mounted. Meanwhile, as described above, as described above, the diffusion plate itself may serve as a vehicle light housing 920, and may have a separate vehicle light housing 920 in addition to the diffusion plate. Since the light source module 910 uses the flexible printed circuit board 10 and the resin layer 40, it has flexibility in itself, and thus it can be easily mounted on the vehicle housing 920 having curvature. In addition, since the light source modules 100-1 to 100-21 have a structure in which heat emission efficiency is improved, the head lamp 900-1 for a vehicle according to the embodiment can prevent the occurrence of wavelength shift and decrease in light intensity. In addition, as described above, since a separate light reflecting member is formed on the side of the resin layer, there is an effect of reducing light loss and improving luminance compared to the same power.

Since the general vehicle head lamp shown in FIG. 47 is a point light source, partial spots 930 may appear on the light emitting surface when light is emitted, but the vehicle head lamp 900-1 according to the embodiment is a surface light source. Spots do not occur and uniform luminance and illuminance can be realized on the entire light emitting surface.

26 shows a perspective view of a light emitting device package 200-1 according to the first embodiment, FIG. 27 shows a top view of the light emitting device package 200-1 according to the first embodiment, and FIG. 28 shows the first A front view of the light emitting device package 200-1 according to the embodiment is shown, and FIG. 29 shows a side view of the light emitting device package 200-1 according to the first embodiment.

The light emitting device package 200-1 illustrated in FIG. 26 may be a light emitting device package included in the light source modules 100-1 to 100-17 according to the above-described embodiments, but is not limited thereto.

26 to 29, the light emitting device package 200-1 includes a package body 610, a first lead frame 620, a second lead frame 630, a light emitting chip 640, and a zener diode 645 ), and wires 650-1.

The package body 610 may be formed of a substrate having good insulation or thermal conductivity, such as a silicon-based wafer level package, a silicon substrate, silicon carbide (SiC), aluminum nitride (AlN), and the like. It may be a structure in which a plurality of substrates are stacked. However, the embodiment is not limited to the above-described material, structure, and shape of the body.

For example, the length (X1) of the first direction (eg, X-axis direction) of the package body 610 is 5.95 mm to 6.05 mm, and the length (Y1) of the second direction (eg, Y-axis direction) is 1.35 mm to It can be 1.45mm. The length Y2 in the third direction (eg, Z-axis direction) of the package body 610 may be 1.6 mm to 1.7 mm. For example, the first direction may be a direction parallel to the long side of the package body 610.

The package body 610 may have a cavity (601) having an open top and a side wall (602) and a bottom (603). The cavity 601 may be formed in a cup shape, a concave container shape, or the like, and the sidewall 602 of the cavity 601 may be vertical or inclined with respect to the floor 603. The shape of the cavity 601 viewed from above may be circular, elliptical, or polygonal (eg, square). The corner portion of the polygonal cavity 601 may be curved. For example, the length (X3) of the first direction (eg, X-axis direction) of the cavity 601 is 4.15 mm to 4.25 mm, and the length (X4) of the second direction (eg, Y-axis direction) is 0.64 mm to 0.9 mm, and the depth of the cavity 601 (eg, the length in the Z-axis direction, Y3) may be 0.33 mm to 0.53 mm.

The first lead frame 620 and the second lead frame 630 may be disposed on the surface of the package body 610 to be electrically separated from each other in consideration of heat dissipation or mounting of the light emitting chip 640. The light emitting chip 640 is electrically connected to the first lead frame 620 and the second lead frame 630. The number of light emitting chips 640 may be one or more.

A reflective member (not shown) may be provided on the side wall of the package body 610 to reflect light emitted from the light emitting chip 640 in a predetermined direction.

The first lead frame 620 and the second lead frame 630 may be disposed spaced apart from each other in the upper surface of the package body 610. A portion of the package body 610 (eg, the bottom 603 of the cavity 601) is positioned between the first lead frame 620 and the second lead frame 630 to electrically separate both.

The first lead frame 620 may include one end (eg, 712) exposed to the cavity 601 and the other end (eg, 714) exposed through one side of the package body 610 through the package body 610. have. In addition, the second lead frame 630 is exposed to one side of one side of the package body 610 (eg, 744-1), and the other end exposed to the other side of the package body 610 (eg, 744-). 2) and an intermediate portion exposed to the cavity 601 (eg, 742-2).

The separation distance X2 between the first lead frame 620 and the second lead frame 630 may be 0.1 mm to 0.2 mm. The top surface of the first lead frame 620 and the top surface of the second lead frame 630 may be located in the same plane as the bottom 603 of the cavity 601.

FIG. 30 shows a perspective view of the first lead frame 620 and the second lead frame 630 shown in FIG. 26, and FIG. 31 is an angle of the first lead frame 620 and the second lead frame shown in FIG. 30. FIG. 32 is a view for explaining the dimension of the part, and FIG. 32 is a connection between the first upper surface part 712 and the first lead frame 620 adjacent to the boundary part 801 of the first side part 714 shown in FIG. 31. It shows an enlarged view of the parts 732,734,736.

30 to 32, the first lead frame 620 includes a first upper surface portion 712 and a first side portion 714 bent from a first side portion of the first upper surface portion 712.

The first upper surface portion 712 is located on the same plane as the bottom of the cavity 601, is exposed by the cavity 601, and light emitting chips 642 and 644 may be disposed.

As illustrated in FIG. 31, both ends of the first upper surface portion 712 may have a portion S3 protruding in a first direction (x-axis direction) based on the first side portion 714. The protruding portion S3 of the first upper surface portion 712 may be a portion supporting the first lead frame in the lead frame array. The length in the first direction of the protruding portion S3 of the first upper surface portion 712 may be 0.4 mm to 0.5 mm. The length K of the first upper surface portion 712 in the first direction may be 3.45 mm to 3.55 mm, and the length J1 in the second direction may be 0.6 mm to 0.7 mm. The first direction may be an x-axis direction in the xyz coordinate system, and the second direction may be a y-axis direction.

The second side portion of the first upper surface portion 712 may have at least one groove portion 701. At this time, the second side of the first upper surface portion 712 may face each other with the first side of the first upper surface portion 712. For example, the second side portion of the first upper surface portion 712 may have one groove portion 701 in the center, but is not limited thereto, and the number of groove portions formed on the second side portion may be two or more. The groove 701 may have a shape corresponding to the protrusion 702 provided in the second lead frame 630, which will be described later.

The groove portion 701 shown in FIG. 31 is a trapezoidal shape, but is not limited thereto, and may be implemented in various forms such as a circle, a polygon, and an oval. The length S2 in the first direction of the groove portion 701 may be 1.15 mm to 1.25 mm, and the length S1 in the second direction of the groove portion 701 may be 0.4 mm to 0.5 mm.

In addition, the angle θ1 between the bottom 701-1 and the side 701-2 of the groove 701 may be greater than or equal to 90° and less than 180°. The light emitting chips 642 and 644 may be disposed on the first upper surface portions 712 on both sides of the groove portion 701.

The first side portion 714 may be bent at a constant angle downward from the first side portion of the first upper surface portion 712, and the first side portion 714 may be exposed from one side of the package body 610. . For example, the angle formed by the first upper surface portion 712 and the first side portion 714 may be greater than or equal to 90° and less than 180°.

The first lead frame 620 may have one or more through holes 720 in at least one of the first upper surface portion 712 and the first side portion 714. For example, the first lead frame 620 may have one or more through holes 720 adjacent to a boundary portion between the first upper surface portion 712 and the first side portion 714. In FIG. 28, two through holes 722 and 724 spaced apart from each other adjacent to the boundary between the first upper surface portion 712 and the first side portion 714 are illustrated, but embodiments are not limited thereto.

The one or more through holes 720 may be formed in one region of each of the first upper surface portion 712 and the first side surface portion 714 adjacent to the boundary portion of the first upper surface portion 712 and the first side surface portion 714. have. At this time, the through-hole (eg, 722-1) formed in one region of the first upper surface portion 712 and the through-hole (eg, 722-2) formed in one region of the first side portion 714 may be connected to each other. .

A portion of the package body 610 is filled in the through hole 720 to serve to improve the degree of coupling between the first lead frame 620 and the package body. In addition, the through hole 720 serves to easily form a bend between the first upper surface portion 712 and the first side portion 714. However, if the size of the through hole 720 is too large or the number of through holes 720 is too large, the first upper surface portion 712 and the first side portion 714 may be cut off when the first lead frame 620 is bent. Therefore, the size and number of through holes 720 must be appropriately adjusted. In addition, the size of the through hole 720 is also related to the size of the connection parts 732,734,736, which will be described later, and thus is related to heat dissipation of the light emitting device package.

An embodiment according to the size of each of the first lead frame 620 and the second lead frame 630 having through holes described below may achieve optimal heat dissipation efficiency in consideration of the degree of coupling and ease of bending.

The first through-hole 722 and the second through-hole 724 in order to improve the degree of coupling with the package body 610, facilitate the bending of the first lead frame 620, and prevent damage during bending. ), the length (D11) in the first direction of the first through hole 722 and the length (D12) in the first direction of the second through hole 724 may be 0.58 mm to 0.68 mm, The length D2 in the second direction may be 0.19 mm to 0.29 mm. The area of the first through hole 722 may be the same as the area of the second through hole 724, but is not limited thereto, and both may be different.

Referring to FIG. 32, the first lead frame 620 is positioned adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side surface portion 714, and is spaced apart from each other by the through hole 720, The first upper surface portion 712 and the first side portion 714 may have connection parts 732, 734 and 736 that connect to each other. For example, the connecting portions 732, 734, 736 of the first portion 732-1, 734-1, or 736-1, respectively, corresponding to a portion of the first upper surface portion 712 and the first side portion 714 It may consist of a second portion (732-2, 734-2, or 736-2) corresponding to a part. A through hole 720 may be positioned between the connection parts 732,734,736.

The first lead frame 620 may have at least one connecting portion corresponding to or aligned with the light emitting chip 642 or 644.

Specifically, the first lead frame 620 may include first to third connection parts 732,734,736. The first connection portion 732 may be positioned corresponding to or aligned with the first light emitting chip 642, and the second connection portion 734 may be positioned corresponding to or aligned with the second light emitting chip 644. have. In addition, the third connection portion 736 may be located between the first connection portion 732 and the second connection portion 734 and is unaligned with the first light emitting chip 642 or the second light emitting chip 644. It can be part. For example, the third connection portion 736 may be positioned corresponding to or aligned with the groove portion 701 of the first lead frame 620, but is not limited thereto.

The length C11 of the first connection portion 732 in the first direction and the length C2 of the second connection portion 734 in the first direction are the length E of the third connection portion 736. Can be greater. For example, the length C11 in the first direction of the first connection portion 732 and the length C2 in the first direction of the second connection portion 734 may be 0.45 mm to 0.55 mm, and the third connection portion ( The length E of the first direction of 736) may be 0.3 mm to 0.4 mm. The reason for positioning the third connection portion 736 between the first through hole 722 and the second through hole 724 is to prevent the break between the first top surface portion 712 and the first side surface portion 714 when bending. It is for sake.

The ratio of the length E in the first direction of the third connection portion 736 to the length C11 in the first direction of the first connection portion 732 may be 1: 1.2 to 1.8. The ratio of the length (D11 or D12) in the first direction of the through hole 722 and the length (B1) in the first direction of the upper end portion 714-1 of the first side portion 714 may be 1: 3.8 to 6.3. .

Since the first connection portion 732 is aligned with the first light emitting chip 642 and the second connection portion 734 is aligned with the second light emitting chip 644, heat generated from the first light emitting chip 642 is It is mainly emitted to the outside through the first connecting portion 732, and heat generated from the second light emitting chip 644 can be mainly emitted to the outside through the second connecting portion 734.

In the embodiment, the lengths C11 and C2 in the first direction of each of the first connection portion 732 and the second connection portion 734 are larger than the length E in the first direction of the third connection portion 736. , The areas of the first connecting portion 732 and the second connecting portion 734 are larger than the areas of the third connecting portion 736. Therefore, by increasing the area of the connecting portions 732 and 734 disposed adjacent to the light source 20, the embodiment improves the efficiency of dissipating heat generated from the first light emitting chip 642 and the second light emitting chip 644 to the outside. Can be improved.

The first side portion 714 may be divided into an upper portion 714-1 connected to the first upper surface portion 712 and a lower portion 714-2 connected to the upper portion 714-1. That is, the upper portion 714-1 includes a portion of the first to third connecting portions 732,734,736, and the lower portion 714-2 may be located below the upper portion 714-1.

The length F1 in the third direction of the upper portion 714-1 may be 0.6 mm to 0.7 mm, and the length F2 in the third direction of the lower portion 714-2 may be 0.4 mm to 0.5 mm. The third direction may be a z-axis direction in the xyz coordinate system.

The side of the upper portion 714-1 and the side of the lower portion 714-2 may have a step in order to improve the degree of bonding with the package body 620 and airtightness to prevent moisture infiltration. For example, both side ends of the lower end portion 714-2 may have a shape protruding in the lateral direction based on the side surface of the upper end portion 714-1. The length B1 in the first direction of the upper portion 714-1 may be 2.56 mm to 2.66 mm, and the length B2 in the first direction of the lower portion 714-2 may be 2.7 mm to 3.7 mm. The thickness t1 of the first lead frame 620 may be 0.1 mm to 0.2 mm.

The second lead frame 630 may be disposed to surround around at least one side of the first lead frame 620. For example, the second lead frame 630 may be disposed around the other side portions except for the first side portion 714 of the first lead frame 630.

The second lead frame 630 may include a second upper surface portion 742 and a second side portion 744. The second upper surface portion 742 may be disposed to surround the other side portions except for the first side portion of the first upper surface portion 712. 26 and 30, the second upper surface portion 742 is coplanar with the bottom of the cavity 601 and the first upper surface portion 712, and may be exposed by the cavity 601. The thickness t2 of the second lead frame 630 may be 0.1 mm to 0.2 mm.

The second upper surface portion 742 is the first portion 742-1, the second portion 742-2, and the third portion 742-3 according to the position surrounding the first upper surface portion 712 It can be divided into. The second portion 742-2 of the second upper surface portion 742 may be a portion corresponding to or facing the second side of the first upper surface portion 712. The first portion 742-1 of the second upper surface portion 742 is connected to one end of the second portion 742-2 and corresponds to or faces any one of the remaining sides of the first upper surface portion 712. Can. The third portion 742-3 of the second upper surface portion 742 is connected to the other end of the second portion 742-2, and corresponds to or faces any other of the remaining sides of the first upper surface portion 712 can see.

The length H1 in the second direction of the first portion 742-1 and the third portion 742-3 may be 0.65 mm to 0.75 mm, and the length H2 in the first direction may be 0.78 mm to 0.88 mm. Can be The length I in the first direction of the second portion 742-2 may be 4.8 mm to 4.9 mm.

The second portion 742-2 of the second upper surface portion 742 may have a protrusion 702 corresponding to the groove portion 701 of the first upper surface portion 712. For example, the shape of the protrusion 702 may match the shape of the groove 701, and the protrusion 702 may be positioned to be aligned with the groove 701. The protrusion 702 may be located in the groove 701. The number of protrusions 702 may be the same as the number of grooves 701. The protrusion 702 and the groove 701 are separated from each other, and a part of the package body 610 may be positioned between them. The protrusion 702 is an area for wire bonding between the first light-emitting chip 642 and the second light-emitting chip 644, and is positioned in alignment between the first light-emitting chip 642 and the second light-emitting chip 644. Wire bonding can be facilitated.

The length S5 of the first direction of the protrusion 702 may be 0.85 mm to 0.95 mm, the length S4 of the second direction may be 0.3 mm to 0.4 mm, and the protrusion 702 has a second portion ( 742-2) and the angle (θ2) formed is greater than or equal to 90°, and may be less than 180°.

The second side surface portion 744 may be bent from at least one side portion of the second top surface portion 742. The second side surface portion 744 may be bent at a constant angle (eg, 90°) from the second top surface portion 742 downward.

For example, the second side portion 744 includes a first portion 744-1 bent at one side of the first portion 742-1 of the second upper surface portion 742 and a third portion of the second upper surface portion 742. It may include a second portion (744-2) bent at one side of the portion (742-3).

The first portion 744-1 and the second portion 744-2 of the second side portion 744 may be bent to be located on the same side of the second lead frame 630. The first portion 744-1 of the second side portion 744 may be spaced apart from the first side portion 714 and located on one side (eg, the left side) of the first side portion 714. The second portion 744-2 of the second side portion 744 may be spaced apart from the first side portion 714 and located on the other side (eg, the right side) of the first side portion 714. The first side portion 714 and the second side portion 744 may be located on the same plane. As a result, as shown in FIG. 26, the first side portion 714 and the second side portion 744 may be exposed to the same side of the package body 610. The length A in the first direction of the second side portion 744 may be 0.4 mm to 0.5 mm, and the length G in the third direction may be 1.05 mm to 1.15 mm.

One side of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g1. For example, the bent step g1 is a portion where one side of the first portion 742-1 of the second upper surface portion 742 and one side of the first portion 744-1 of the second side portion 744 meet. It may be located adjacent to. Since the areas of the first upper surface portion 712 and the first side surface portion 714 positioned corresponding to the bent step g1 can be designed to be wide, the embodiment increases the heating area to improve the heating efficiency. . This is because the area of the first lead frame 620 is related to the heat emission of the light emitting chips 642 and 644.

The other side surfaces of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g2. The reason for forming the bent step g2 is to allow the bonding material (eg, solder) to be easily observed with the naked eye when bonding the light emitting device package 200-1 to the flexible printed circuit board 10. to be.

The first side portion 714 of the first lead frame 620 and the second side portion 744 of the second lead frame 630 are flexible printed circuits of the light source modules 100-1 to 100-21 according to the embodiment. It may be mounted to contact the substrate 10, whereby the light emitting chip 640 can irradiate light in the direction (3) toward the side of the resin layer 40. That is, the light emitting device package 200-1 may have a side view type structure.

The Zener diode 645 may be disposed on the second lead frame 630 to improve the withstand voltage of the light emitting device package 200-1. For example, the Zener diode 645 may be disposed on the second upper surface portion 742 of the second lead frame 630.

The first light emitting chip 642 may be electrically connected to the second lead frame 630 by the first wire 652, and the second light emitting chip 644 may be connected to the second lead by the second wire 654. The frame 630 may be electrically connected, and the Zener diode 645 may be electrically connected to the first lead frame 620 by the third wire 656.

For example, one end of the first wire 652 may be connected to the first light emitting chip 642 and the other end may be connected to the protrusion 702. In addition, one end of the second wire 654 may be connected to the second light emitting chip 644 and the other end may be connected to the protrusion 702.

The light emitting device package 200-1 may further include a resin layer (not shown) filled in the cavity 601 to surround the light emitting chip. The resin layer may be made of a colorless transparent polymer resin material such as epoxy or silicone.

The light emitting device package 200-1 does not use a phosphor and may implement red light using only a red light emitting chip, but embodiments are not limited thereto. The resin layer may include a phosphor to change the wavelength of light emitted from the light emitting chip 640. For example, even if a light emitting chip having a color other than red is used, a light emitting device package that emits light of a desired color by using a phosphor may be implemented by changing a wavelength of light.

33 illustrates a first lead frame 620-1 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and overlapping contents with those described above will be omitted or briefly described.

Referring to FIG. 33, the first lead frame 620-1 is a structure in which the third connection part 736 is removed from the first lead frame 620 illustrated in FIG. 30. That is, the first lead frame 620-1 may have one through hole 720-1 adjacent to the boundary between the first upper surface portion 712 and the first side portion 714 ′. In addition, the first connection portion 732 may be located on one side of the through hole 720-1, and the second connection portion 734 may be located on the other side of the through hole 720-1.

34 illustrates a first lead frame 620-2 and a second lead frame 630-1 according to another embodiment. The same reference numerals as in FIG. 30 denote the same configuration, and overlapping contents with those described above will be omitted or briefly described.

Referring to FIG. 34, the first upper surface portion 712 ′ of the first lead frame 620-2 is a groove 701 in the first upper surface portion 712 of the first lead frame 620 illustrated in FIG. 30. May be omitted. And the second portion 742-2' of the second upper surface portion 742' of the second lead frame 630-1 is the second upper surface portion 742 of the second lead frame 630 shown in FIG. In the second portion 742-2, the protrusion 702 may be omitted. Other components may be the same as those described in FIG. 28.

35 illustrates a first lead frame 620-3 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 30 denote the same configuration, and overlapping contents with those described above will be omitted or briefly described.

Referring to FIG. 35, the first lead frame 620-3 is fine through at least one of the connection parts 732,734,736 of the first lead frame 620 shown in FIG. 30 through the first lead frame 620 The through holes h1, h2, and h3 may be formed.

At least one of the connection portions 732-1,734-1,736-1 of the first lead frame 620-3 is formed through a fine through hole formed in a boundary portion between the first upper surface portion 712 and the first side portion 714 ( h1, h2, h3). At this time, the diameters of the fine through holes h1, h2, and h3 may be smaller than the lengths D11 and D12 in the first direction of the through holes 722 and 724 or the length D2 in the second direction. Also, the number of fine through holes h1 and h2 formed in the first connection portion 732-1 and the second connection portion 734-1 is formed through the fine through holes formed in the third connection portion 736-1 ( h3), but is not limited thereto. In addition, the shape of the fine through holes h1, h2, h3 may be circular, elliptical, or polygonal. The fine through holes h1, h2, and h3 not only facilitate the bending of the first lead frame 620-3, but also improve the bonding force between the first lead frame 620-3 and the package body 610.

36 illustrates a first lead frame 620-4 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 30 denote the same configuration, and overlapping contents with those described above will be omitted or briefly described.

Referring to FIG. 36, the first lead frame 620-4 includes a first upper surface portion 712" and a first side surface portion 714". The first top surface portion 712" and the first side surface portion 714" are modified examples of the first top surface portion 712 and the first side surface portion 714 illustrated in FIG. 32. That is, in the first lead frame 620-4, through holes 722 and 724 are omitted from the first upper surface portion 712 and the first side portion 714 of the first lead frame 620 illustrated in FIG. 26, and the through hole A structure in which a plurality of fine through holes h4 spaced apart from each other is provided in a region Q2 of the boundary portion Q of the first upper surface portion 712" and the first side surface portion 714" from which 722,724 is omitted. to be.

The boundary portion Q of the first upper surface portion 712" and the first side portion 714" may be divided into a first boundary region Q1, a second boundary region Q2, and a third boundary region Q3. Can. The first boundary area Q1 may be an area corresponding to or aligned with the first light emitting chip 642, and the second boundary area Q2 may be an area corresponding to or aligned with the first light emitting chip 642. The third boundary area Q3 may be an area between the first boundary area Q1 and the second boundary area Q2. For example, the first boundary region Q1 may be an area corresponding to the first connection portion 732 illustrated in FIG. 30, and the second boundary region Q2 may be the second connection portion 734 illustrated in FIG. 30. It may be a region corresponding to.

The first boundary area Q1 and the second boundary area Q2 serve as a passage for transferring heat generated from the first light emitting chip 642 and the second light emitting chip 644, and a plurality of fine through holes h4 ) May serve to facilitate bending between the first upper surface portion 712" and the first side portion 714". Although the diameters of the plurality of fine through holes h4 are the same and the separation distance is the same in FIG. 36, the embodiment is not limited thereto, and in another embodiment, at least one of the plurality of fine through holes h4 is The diameters may be different, or the separation distances may be different.

37 illustrates a first lead frame 620 and a second lead frame 630-2 according to another embodiment. The second lead frame 630-2 of FIG. 37 may be a modification of the second lead frame 630 shown in FIG. 30. The same reference numerals as in FIG. 30 denote the same configuration, and overlapping contents with those described above will be omitted or briefly described.

Referring to FIG. 37, unlike the second portion 742-2 of the second upper surface portion 742 illustrated in FIG. 30, the second portion 742-of the second upper surface portion 742 ″ illustrated in FIG. 37 2") has a broken structure, and does not connect the first portion 742-1 and the third portion 742-3.

The second upper surface portion 742" of the second lead frame 630-2 may include a first portion 742-1, a second portion 742-2", and a third portion 742-3. Can. Each of the first to third portions 742-1,742-2", 742-3 will be positioned around a corresponding one of the sides of the first top surface 712 of the first lead frame 620. Can.

The second portion 742-2" of the second upper surface portion 742" is connected to the first region 704 connected to the first portion 742-1, and to the third portion 742-3. It may be formed of a second region 705 spaced apart from one region 704. Since the package body 610 is filled in the space 706 spaced between the first region 704 and the second region 705, the coupling force between the package body 610 and the second lead frame 630-2 is applied. Can be improved. The second lead frame 630-2 illustrated in FIG. 37 may be divided into first sub frames 744-1, 742-1, and 704, and second sub frames 744-2, 742-3, and 705. And both can be electrically separated from each other.

38 illustrates a first lead frame 810 and a second lead frame 820 according to another embodiment.

Referring to FIG. 38, the first lead frame 810 includes a first side surface portion 814 and a second side surface portion 816 that are bent from a first side surface of the first top surface portion 812 and the first top surface portion 812. It can contain. Light emitting chips 642 and 644 may be disposed on the first upper surface portion 812.

The second side portion of the first upper surface portion 812 may have one or more first groove portions 803 and 804 and a first protrusion portion 805. At this time, the second side of the first upper surface portion 812 may be an opposite side of the first side of the first upper surface portion 812. For example, the second side portion of the first upper surface portion 812 may have two first groove portions 803 and 804 and one first protrusion portion 805 positioned between the first groove portions 803 and 804, but is not limited thereto. It does not work. The first groove parts 803 and 804 have a shape corresponding to the second protrusion parts 813 and 814 provided on the second lead frame 820 to be described later, and the first protrusion parts 805 are provided on the second lead frame 820. It may have a shape corresponding to the second groove portion 815. The first grooves 803 and 804 and the first protrusions 805 illustrated in FIG. 38 are in a rectangular shape, but are not limited thereto, and may be implemented in various forms such as circular, polygonal, and elliptical shapes. The light emitting chips 642 and 644 may be disposed on the first upper surface portions 812 on both sides of the first groove portions 803 and 804.

The first side portion 814 is connected to one region of the first side portion of the first upper surface portion 712, and the second side portion 816 is connected to another region of the first side portion of the first upper surface portion 712, The first side portion 814 and the second side portion 816 may be spaced apart from each other. The first side portion 814 and the second side portion 816 may be exposed from any one of the same side of the package body 610.

The first lead frame 610 may have one or more through holes 820 in at least one of the first upper surface portion 812 and the first side portion 814. For example, the first lead frame 810 may have one or more through holes 840 adjacent to a boundary portion between the first upper surface portion 812 and the first side portion 814. The through hole 820 may have the same structure as described with reference to FIGS. 30 and 32, and the function thereof may be the same.

The first lead frame 810 is located adjacent to the boundary portion 801 of the first upper surface portion 812 and the first side portion 814, and is spaced apart from each other by the through hole 720, and the first upper surface portion 712 ) And the first side portions 714 may be connected to each other (852, 854, 856). The structure and function of the connecting portions 852, 854, and 856 may be the same as described in FIGS. 30 and 32. The first lead frame 810 may have at least one connecting portion corresponding to or adjacent to the light emitting chip 642 or 644.

The first direction length of the connecting portion (eg, 852, 854) corresponding to or adjacent to the light emitting chips 642,644 is the first of the connecting portions (eg, 856) that do not correspond to or not adjacent to the light emitting chips 642,644. It can be larger than the length of the direction.

In order to improve the degree of bonding with the package body 620 and the airtightness to prevent moisture penetration, the lower side portion of the second side portion 814 may have a structure protruding in the lateral direction.

The second lead frame 820 may be disposed around at least one side of the first lead frame 810. The second lead frame 820 may include a second upper surface portion 822 and a third side surface portion 824. The second upper surface portion 822 may be divided into a first portion 832 and a second portion 834 according to positions disposed around the first upper surface portion 812.

The second portion 834 of the second upper surface portion 822 may be a portion corresponding to or facing the second side of the first upper surface portion 812. The first portion 832 of the second upper surface portion 822 may be connected to one end of the second portion 834 and may correspond to or face the third side of the first upper surface portion 712. The third side may be a side perpendicular to the first side or the second side.

The second portion 834 of the second upper surface portion 822 may have second protrusions 813 and 814 corresponding to the first groove portions 803 and 804 of the first upper surface portion 812. The second protrusions 813 and 814 are regions for wire bonding between the first light emitting chip 642 and the second light emitting chip 644, between the first light emitting chip 642 and the second light emitting chip 644. By positioning, wire bonding can be facilitated.

The third side portion 824 may be bent at a constant angle (eg, 90°) downward from the second upper surface portion 822. For example, the third side portion 824 may be bent at one side of the first portion 832 of the second upper surface portion 822. The second side portion 816 and the third side portion 824 based on the first side portion 814 may have a symmetrical shape. In order to improve the degree of bonding with the package body 620 and airtightness for preventing water penetration, the lower side of the third side portion 824 may have a structure protruding laterally. The first side portion 814, the second side portion 816 and the third side portion 824 may be exposed to the same side of the package body 610.

39 is a perspective view of a light emitting device package 200-2 according to another embodiment, FIG. 40 is a top view of the light emitting device package 200-2 shown in FIG. 39, and FIG. 41 is shown in FIG. 39 42 shows a front view of the light emitting device package 200-2, FIG. 42 shows a sectional view in the cd direction of the light emitting device package 200-2 shown in FIG. 39, and FIG. 43 shows a first lead frame shown in FIG. 620' and the second lead frame 630'. The same reference numerals as in FIGS. 26 to 30 indicate the same configuration, and overlapping contents with those described above will be omitted or briefly described.

39 to 43, the first lead frame 620 ′ of the light emitting device package 200-2 may include a first top surface portion 932 and a first side surface portion 934. Unlike the first upper surface portion 712 illustrated in FIG. 30, a groove portion is not formed in the first upper surface portion 932 illustrated in FIG. 43. In addition, the second upper surface portion 942 of the second lead frame 630 ′ may be similar to a structure in which the second portion 742-2 of the second upper surface portion 742 illustrated in FIG. 34 is omitted.

The first side portion 934 may have the same structure as the first side portion 714 illustrated in FIG. 34. The length P1 in the first direction of the first upper surface portion 932 may be smaller than the length of the first upper surface portion 712 illustrated in FIG. 30, and the length in the second direction of the first upper surface portion 932 ( J2) may be greater than the length J1 in the second direction of the first upper surface portion 712. For example, the length P1 in the first direction of the first upper surface portion 932 may be 4.8 mm to 4.9 mm, and the length J2 in the second direction may be 0.67 mm to 0.77 mm. Therefore, since the area of the first upper surface portion 932 illustrated in FIG. 39 is larger than the area of the first upper surface portion 712 illustrated in FIG. 34, the embodiment of FIG. 39 can mount a light emitting chip having a larger size. have. The sizes of the first side portions 944, the through holes 722 and 724 and the connecting portions may be the same as described in FIG. 31.

The second lead frame 630 ′ may include a second upper surface portion 942 and a second side portion 944. The second upper surface portion 942 may include a first portion 942-1 disposed around the third side of the first upper surface portion 932 and a second portion 942-2 disposed around the fourth side. Can. The third side of the first upper surface portion 932 is a side perpendicular to the first side of the first upper surface portion 932, and the fourth side of the first upper surface portion 932 is the first side of the first upper surface portion 932. It can be a side that faces the 3 side.

The first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 are spaced apart from each other and may be electrically separated from each other.

The second side portion 944 includes a first portion 944-1 connected to the first portion 942-1 of the second upper surface portion 942 and a second portion 942-2 of the second upper surface portion 942. It may include a second portion (944-2) connected to. However, the length P2 in the first direction of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 is the second upper surface portion 742 shown in FIG. It may be larger than the length H2 in the first direction of the first portion 742-1 and the third portion 742-3.

For example, the length P2 in the first direction of the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 is 1.04 mm to 1.14 mm, and the length in the second direction ( P3) may be 0.45mm to 0.55mm.

The length of the first direction of the protruding portion S22 of the first upper surface portion 932 protruding to support the first lead frame 620 ′ in the lead frame array may be 0.14 mm to 0.24 mm.

The first light emitting chip 642 may be electrically connected to the first portion 942-1 of the second upper surface portion 942 by the first wire 653, and the second light emitting chip 644 may be connected to the second wire By (655) it can be electrically connected to the first portion (942-2) of the second upper surface portion (942).

Both the first light emitting chip 642 and the second light emitting chip 644 may generate light having the same wavelength. For example, the first light emitting chip 642 and the second light emitting chip 644 may be red light emitting chips that generate red light.

Also, the first light emitting chip 642 may generate light having different wavelengths. For example, the first light emitting chip 642 may be a red light emitting chip, the second light emitting chip 644 may be a yellow light emitting chip, and the first light emitting chip mounted on the light source package 200-2 according to the second embodiment ( 642) and the second light emitting chip 644 may operate individually.

The first lead frame 620' may be supplied with a first power (eg, negative (-) power), and the second lead frame 630' may be supplied with a second power (eg, positive (+) power). have. Since the second lead frame 630' is divided into two parts (942-1 and 944-1, and 942-2 and 944-2) that are electrically separated, the first lead frame 620' is common By using as an electrode and separately supplying a second power to the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 of the second lead frame 630', the first The light emitting chip 642 and the second light emitting chip 644 may be operated separately.

Therefore, when the light emitting device package 200-2 shown in FIG. 39 is mounted on the light source modules 100-1 to 100-21 according to the embodiment, the light source modules 100-1 to 100-21 may have various colors. Can generate a surface light source. For example, when operating only the first light emitting chip 642, the embodiment may generate a red surface light source, and when operating the second light emitting chip 644, the embodiment may generate a yellow surface light source.

44 shows measurement temperatures of the light emitting device packages 200-1 and 200-2 according to the embodiment. The measurement temperature shown in FIG. 44 represents the temperature of the light emitting chip during light emission of the light emitting device package.

Case 1 (case 1) represents the measurement temperature of the light emitting chip when the lengths of the first portion and the second portion of the side portion of the first lead frame are equal to the length of the third portion, and case 2 (case2) ) Indicates the measurement temperature of the light emitting chip shown in FIG. 26, and case 3 indicates the measurement temperature of the light emitting chip shown in FIG. 37.

Referring to FIG. 44, the measurement temperature t1 of case 1 is 44.54°C, the measurement temperature t2 of case 2 is 43.66°C, and the measurement temperature t3 of case 3 is 43.58°C.

Therefore, by changing the design of the connecting portions 732,734,736 of the first side portion 714 of the first lead frame 620, the embodiment can improve the heat dissipation effect, the light emitting device packages 200-1, 200 during light emission Since the temperature rise of the light-emitting chip 640 mounted on -2) can be alleviated, it is possible to prevent the decrease in light intensity and the occurrence of wavelength shift.

45 shows an embodiment of the light emitting chip 640 shown in FIG. 26. The light emitting chip 640 illustrated in FIG. 45 may be, for example, a vertical chip emitting red light having a wavelength range of 600 nm to 690 nm.

Referring to FIG. 45, the light emitting chip 640 includes a second electrode layer 1801, a reflective layer 1825, a light emitting structure 1840, a passivation layer 1850, and a first electrode layer 1860.

The second electrode layer 1801 provides power to the light emitting structure 1840 together with the first electrode layer 1860. The second electrode layer 1801 may include an electrode material layer 1810 for current injection, a support layer 1815 positioned on the electrode material layer 1810, and a bonding layer 1820 positioned on the support layer 1815. have. The second electrode layer 1801 may be bonded to the first lead frame 620 of the light emitting device package 200-1 illustrated in FIG. 30, for example, the first upper surface portion 712.

The electrode material layer 1810 may be Ti/Au, and the support layer 1815 may be a metal or semiconductor material. In addition, the support layer 1815 may be a material having high electrical conductivity and thermal conductivity. For example, the support layer 1815 is a metal including at least one of copper (Cu), copper alloy (Cu alloy), gold (Au), nickel (Ni), molybdenum (Mo), and copper-tungsten (Cu-W) It may be a material or a semiconductor including at least one of Si, Ge, GaAs, ZnO, and SiC.

The bonding layer 1820 is disposed between the support layer 1815 and the reflective layer 1825, and the bonding layer 1820 serves to bond the support layer 1815 to the reflective layer 1825. The bonding layer 1820 may include at least one of a bonding metal material, for example, In, Sn, Ag, Nb, Pd, Ni, Au, and Cu. Since the bonding layer 1820 is formed to bond the support layer 815 by a bonding method, the bonding layer 1820 may be omitted when the support layer 1815 is formed by a plating or vapor deposition method.

The reflective layer 1825 is disposed on the bonding layer 820. The reflective layer 1825 reflects light incident from the light emitting structure 1840, thereby improving light extraction efficiency. The reflective layer 825 may be formed of a reflective metal material, for example, a metal or alloy including at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf.

In addition, the reflective layer 1825 is a conductive oxide layer, for example, indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO) , Aluminum zinc oxide (AZO), antimony tin oxide (ATO), or the like may be used to form a single layer or multiple layers. In addition, the reflective layer 825 may be formed of a metal and a conductive oxide in multiple layers, such as IZO/Ni, AZO/Ag, IZO/Ag/Ni, and AZO/Ag/Ni.

An ohmic region 1830 may be positioned between the reflective layer 1825 and the light emitting structure 1840. The ohmic area 1830 serves as an area that is in ohmic contact with the light emitting structure 1840 to smoothly supply power to the light emitting structure 1840.

A material that is in ohmic contact with the light emitting structure 1840, for example, a material including at least one of Be, Au, Ag, Ni, Cr, Ti, Pd, Ir, Sn, Ru, Pt, Hf, the light emitting structure 1840 The ohmic region 1830 can be formed by ohmic contact with. For example, the material forming the ohmic region 1830 may include AuBe, and may be in the form of dots.

The light emitting structure 1840 may include a window layer 1842, a second semiconductor layer 1844, an active layer 1846, and a first semiconductor layer 1848. The window layer 1842 is a semiconductor layer disposed on the reflective layer 1825, and the composition may be GaP.

The second semiconductor layer 1844 is disposed on the window layer 1842. The second semiconductor layer 1844 may be formed of a compound semiconductor such as Group 3-5, Group 2-6, and the like, and a second conductivity type dopant may be doped. For example, the first semiconductor layer 1844 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and p-type dopants (for example, Mg, Zn, Ca, Sr, Ba) can be doped.

The active layer 1846 is disposed between the second semiconductor layer 1844 and the first semiconductor layer 848, and electrons and holes provided from the second semiconductor layer 1844 and the first semiconductor layer 1848 ( Light can be generated by energy generated in the process of recombination of holes.

The active layer 1846 may be a compound semiconductor of group 3-5, group 2-6, and has a single well structure, a multi well structure, a quantum-wire structure, or a quantum dot structure. Can be formed.

For example, the active layer 1846 may have a single or multi-quantum well structure having a well layer and a barrier layer. The well layer may be a material having a band gap lower than the energy band gap of the barrier layer. For example, the active layer 1846 may be AlGaInP or GaInP.

The first semiconductor layer 1848 may be formed of a semiconductor compound. The first semiconductor layer 1848 may be formed of a compound semiconductor such as Group 3-5, Group 2-6, and the like, and the first conductivity type dopant may be doped. For example, the first semiconductor layer 1848 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and n-type dopants (for example, Si, Ge, Sn, etc.) may be doped.

The light emitting structure 1840 may generate red light having a wavelength range of 600 nm to 690 nm, and the first semiconductor layer 1848, the active layer 1846, and the second semiconductor layer 1844 may have a composition capable of generating red light. have. In order to increase light extraction efficiency, a roughness (1870) may be formed on an upper surface of the first semiconductor layer 848.

The passivation layer 1850 is disposed on the side surface of the light emitting structure 1840. The passivation layer 1850 serves to electrically protect the light emitting structure 1840. The passivation layer 1850 is an insulating material, such as SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , or Al ₂ O ₃ You can. The passivation layer 1850 may be disposed on at least a portion of the top surface of the first semiconductor layer 1848.

The first electrode layer 1860 may be disposed on the first semiconductor layer 1848 and may have a predetermined pattern. The first electrode layer 1860 may be a single layer or a plurality of layers. For example, the first electrode layer 1860 may include a first layer 1862, a second layer 1864, and a third layer 1866 sequentially stacked. The first layer 1862 is in ohmic contact with the first semiconductor layer 1848, and may be formed of GaAs. The second layer 1864 may be formed of AuGe/Ni/Au alloy. The third layer 1866 may be formed of a Ti/Au alloy.

26 and 39, the first electrode layer 860 may be electrically bonded to the second lead frame 630 or 630' by wires 652,654, 653, or 655.

In general, as the temperature of the light-emitting chip increases, wavelength shift occurs, and luminosity decreases. However, compared to a blue light emitting chip (Blue LED) generating blue light and a light emitting chip (Amber LED) generating yellow light, a red light emitting chip (Red LED) generating red light has a degree of wavelength shift and a decrease in luminosity due to an increase in temperature. Is worse. Therefore, in the light emitting device package and the light source module using the red light emitting chip, it is very important to prevent heat radiation to suppress the temperature increase of the light emitting chip.

However, the light source modules 100-1 to 100-21 and the light emitting device packages 200-1 to 200-2 included in the lighting device 1 according to the embodiment may improve heat dissipation efficiency as described above. Therefore, even if a red light emitting chip is used, it is possible to suppress an increase in the temperature of the light emitting chip, thereby suppressing a wavelength shift and a decrease in light intensity.

46 shows a lighting device 2 according to another embodiment. Referring to FIG. 46, the lighting device 2 includes a housing 1310, a light source module 1320, a diffuser plate 1330, and a micro lens array 1340.

The housing 1310 accommodates the light source module 1320, the diffuser plate 1330, and the micro lens array 1340, and may be made of a translucent material.

The light source module 1320 may be any one of the above-described embodiments 100-1 to 100-17.

The diffusion plate 1330 may serve to uniformly diffuse light emitted through the light source module 1320 over the entire surface. The diffusion plate 1330 may be made of the same material as the diffusion plate 70 described above, but is not limited thereto. In another embodiment, the diffusion plate 1330 may be omitted.

The micro lens array 1340 may have a structure in which a plurality of micro lenses 1344 are disposed on the base film 1342. Each micro-lens 1344 may be spaced apart from each other by a predetermined interval. Each micro-lens 1344 may be planar, and each micro-lens 1344 may be spaced apart from each other with a pitch of 50-500 micrometers.

In FIG. 46, the diffuser plate 1330 and the micro lens array 1340 are made of separate components, but in another embodiment, the diffuser plate 1330 and the micro lens array 1340 may be integrally formed.

48 shows a tail light for a vehicle (900-2) according to an embodiment, and FIG. 49 shows a tail light for a general vehicle.

Referring to FIG. 48, the vehicle tail light 900-2 may include a first light source module 952, a second light source module 954, a third light source module 956, and a housing 970.

The first light source module 952 may be a light source for the role of a direction indicator light, the second light source module 954 may be a light source for the role of a vehicle lamp, and the third light source module 956 for the stop light role It may be a light source, but is not limited thereto, and its roles may be interchanged.

The housing 970 accommodates the first to third light source modules 952,954,956, and may be made of a translucent material. The housing 970 may have a bend depending on the design of the vehicle body. At least one of the first to third light source modules 952,954,956 may be implemented as any one of the above-described embodiments 100-1 to 100-17.

In the case of a taillight, when the light stops, the light intensity must be 110 candelas (cd) or higher to allow viewing from a distance, and usually requires a light intensity of 30% or more. In addition, for the light output of 30% or more, the number of light emitting device packages applied to the light source module (for example, 952,954 or 956) should be increased by 25% to 35%, or the output of the individual light emitting device package should be increased by 25% to 35%. .

If the number of light emitting device packages is increased, production may be difficult due to the limitation of the arrangement space. Therefore, by increasing the output of the individual light emitting device packages mounted on the light source module, desired light intensity can be achieved with a small number (for example, 110 candelas or more). ). Since the value multiplied by the output (W) of the light emitting device package and the number (N) becomes the total output of the light source module, it is possible to determine the appropriate output and number of light emitting device packages according to the area of the light source module to obtain the desired light intensity. have.

For example, in the case of a light emitting device package having a power consumption of 0.2 watts and an output of 13 lumens (lm), light intensity of about 100 candelas can be achieved by arranging 37 to 42 pieces in a certain area. However, in the case of a light emitting device package having a power consumption of 0.5 watts and a luminous flux of 30 lumens (lm), light of similar intensity can be obtained even if only 13 to 15 pieces are arranged in the same area. The number of light emitting device packages that must be disposed in a light source module having a constant area in order to obtain a constant output may be determined according to a placement pitch, a content of a light diffusion material in a resin layer, and a pattern shape of a reflective layer. Here, the distance may be a distance from one intermediate point of two neighboring light emitting device packages to the other intermediate point.

When the light emitting device package is disposed in the light source module, it is arranged at regular intervals. In the case of the high power light emitting device package, the number of arrangements can be relatively reduced, and the space can be efficiently used because it can be arranged at a wide interval. In addition, when the high power light emitting device package is arranged at a narrow interval, it is possible to produce a higher light intensity than when the light emitting device package is arranged at a wide interval.

50A and 50B show the spacing of the light emitting device package of the light source module used in the tail light for a vehicle according to the embodiment. For example, FIG. 50A may be the first light source module 952 illustrated in FIG. 48, and FIG. 50B may be the second light source module 954 illustrated in FIG. 48.

50A and 50B, the light emitting device packages 99-1 to 99-n, or 98-1 to 98-m may be disposed spaced apart on the substrate 10-1 or 10-2. have. It can be a natural number with n>1 and a natural number with m>1.

The distance between two neighboring light emitting device packages (for example, ph1, ph2, ph3 or pc1,pc2,pc3) may be different from each other, but the range of the distance is 8 to 30 mm.

Because the light emitting device package (99-1 to 99-n, or 98-1 to 98-m) may vary depending on the power consumption, the placement interval (eg, ph1, ph2, ph3 or pc1,pc2,pc3) This is because, in the case of 8 mm or less, light of neighboring light emitting device packages (for example, 99-3 to 99-4) may interfere with each other to generate a recognizable list. Also, when the placement interval (for example, ph1, ph2, ph3 or pc1,pc2,pc3) is 30 mm or more, a dark region may be generated due to an area where light does not reach.

As described above, since the light source modules 100-1 to 100-17 have flexibility in themselves, they can be easily mounted on the housing 970 having a bend, so the rear light 900-2 for a vehicle according to the embodiment is a digital design. The degree of freedom can be improved.

In addition, since the light source modules 100-1 to 100-17 have a structure in which heat emission efficiency is improved, the vehicle taillight 900-2 according to the embodiment can prevent the occurrence of wavelength shift and decrease in light intensity.

Since the general vehicle tail light shown in FIG. 49 is a point light source, partial spots 962 and 964 may appear on the light emitting surface during light emission, but the vehicle tail light 900-2 according to the embodiment is a surface light source, so Uniform brightness and illuminance can be realized throughout.

As described above, the present invention has been described and illustrated in connection with a preferred embodiment for illustrating the technical idea of the present invention, but the present invention is not limited to the configuration and operation as illustrated and described, without departing from the scope of the technical idea. Those skilled in the art to which the present invention pertains will appreciate that many suitable modifications and variations of the present invention are possible. Accordingly, all such suitable modifications and modifications and equivalents should be considered as falling within the scope of the present invention.

10: Printed circuit board 20: Light source
30: reflective unit 31: reflective pattern
33: first reflection sheet 35: second reflection sheet
36: air area 37: spacer
40: resin layer 50: optical pattern layer
52: first optical sheet 54: second optical sheet
56: adhesive layer 60: optical pattern
70: diffuser plate
80: first air gap 81: second air gap
90: light reflection member 91: indirect light emission air gap
110: heat dissipation member 101-1 to 101-n: sub light source module
410-1, 420-1, 410-2: connection fixture 510, 520, 530, 540: connector
610: package body 620: first lead frame
630: second lead frame 640: light emitting chip
645 Zener diode 650: wire
712: first top portion 714: first side portion
722,724: Through hole 742: Second upper surface
744: second side portion 801: second electrode layer
810: electrode material layer 815: support layer
820: bonding layer 825: reflective layer
830: ohmic area 840: light emitting structure
850: passivation layer 860: first electrode layer
900: Vehicle light 910: Light source module
920: light housing

Claims (14)

Board;
A plurality of light sources disposed on the substrate;
A resin layer disposed on the substrate to cover the plurality of light sources;
A reflective unit disposed between the substrate and the resin layer; And
It includes an indirect light-emitting portion disposed on one side of the resin layer,
The plurality of light sources includes a side light emitting device that emits light toward the indirect light emitting unit,
The reflective unit includes a reflective sheet disposed on the substrate, a transparent sheet disposed on the reflective sheet, and a spacer disposed between the reflective sheet and the transparent sheet,
One region of the plurality of light sources penetrates the reflective sheet, the spacer, and the transparent sheet and is embedded in the resin layer,
The light transmittance of the transparent sheet is higher than the light transmittance of the reflective sheet,
The indirect light emitting unit is a lighting device including a light reflection member disposed on one side of the resin layer and a gap formed between the side of the resin layer and the light reflection member.
According to claim 1,
It includes an optical pattern layer disposed on the resin layer,
The optical pattern layer includes a first optical sheet disposed on an upper surface of the resin layer, a second optical sheet disposed on the first optical sheet, and a plurality of optics disposed between the first optical sheet and the second optical sheet Lighting device comprising a pattern.
Board;
A plurality of light sources disposed on the substrate;
A resin layer disposed on the substrate to cover the plurality of light sources;
A reflective unit disposed between the substrate and the resin layer;
An optical pattern layer disposed on the resin layer; And
It includes an indirect light-emitting portion disposed on one side of the resin layer,
The plurality of light sources are side light emitting elements penetrating the reflection unit and emitting light toward the side of the resin layer,
The optical pattern layer may include a first optical sheet adhered to the resin layer, a second optical sheet disposed on the first optical sheet, and a plurality of optical patterns disposed between the first optical sheet and the second optical sheet. Including,
The indirect light emitting portion includes a light reflection member disposed on one side of the resin layer and a gap formed between a side surface of the resin layer and the light reflection member,
Each of the plurality of optical patterns overlaps each of the plurality of light sources in a vertical direction, and the lighting device blocks a part of light emitted to the upper side of the side light emitting element.
According to claim 3,
The reflecting unit is a lighting device including a reflective sheet disposed on the substrate, a transparent sheet disposed on the reflective sheet, and a spacer disposed between the reflective sheet and the transparent sheet.
The method according to claim 1 or 4,
The spacer member is a lighting device including a plurality of unit spacers and an air region formed inside each of the plurality of unit spacers.
The method of claim 5,
A lighting device having a hexagonal shape has a cross section of the unit spacer or a cross section of the air region.
The method of claim 5,
Each of the plurality of unit spacer members are disposed in close contact with each other to form a honeycomb shape.
The method of claim 2 or 3,
The optical pattern is a lighting device that prevents hot spots formed on the plurality of light sources.
The method of claim 2 or 3,
The optical pattern layer is an illumination layer including an adhesive layer disposed between the first optical sheet and the second optical sheet and a second air gap disposed around each of the plurality of optical patterns to separate the adhesive layer from the optical pattern Device.
The method of claim 9,
The optical pattern is an illumination device disposed on the lower surface of the second optical sheet.
Board;
A plurality of light emitting elements disposed on the substrate;
A resin layer disposed on the substrate to cover the plurality of light sources;
A reflective unit disposed between the substrate and the resin layer;
An optical pattern layer disposed on the resin layer; And
It includes an indirect light-emitting portion disposed on one side of the resin layer,
The reflective unit includes a reflective sheet disposed on the substrate, a transparent sheet disposed on the reflective sheet, and a spacer disposed between the reflective sheet and the transparent sheet,
The optical pattern layer is disposed between the first optical sheet disposed on the resin layer, the second optical sheet disposed on the first optical sheet, and the first optical sheet and the second optical sheet, and the plurality of It includes a plurality of optical patterns overlapping the light emitting element in the vertical direction,
The indirect light emitting unit is a lighting device including a light reflection member disposed on one side of the resin layer and a gap formed between the side of the resin layer and the light reflection member.
The method of claim 11,
The plurality of light sources are side light emitting elements penetrating the reflection unit and emitting light toward the side of the resin layer,
The optical pattern is a lighting device for preventing a hot spot formed on the side light emitting element.
The method of any one of claims 1, 3, or 11,
The gap is an air area lighting device.
The method of any one of claims 1, 3, or 12,
The light reflection member is a lighting device that reflects a part of light leaking to the side of the resin layer facing the light emitting surface of the side light emitting element.

Images