KR102065364B1 - Organic light emitting diode display device and fabricating method of the same - Google Patents

Abstract

The present invention discloses an organic light emitting diode display. The disclosed organic light emitting diode display and a method of manufacturing the same include: an element substrate including a plurality of pixel regions; A first protective layer formed on the device substrate; An organic light emitting diode first electrode formed on the first protective layer, a first insulating film formed on the first electrode and defining a light emitting region, an organic film layer and an organic light emitting diode second electrode formed on the first insulating film An organic light emitting diode comprising a; A first pinned layer formed on the first passivation layer at the end of the first insulating layer, and preventing the end of the first insulating layer from directly contacting the first passivation layer; It characterized in that it comprises a second protective layer formed on the organic light emitting diode.
Therefore, the organic light emitting diode display and the manufacturing method thereof according to the present invention, by forming a fixed layer on the lower end of the insulating film on the first protective layer to prevent curling of the insulating film to prevent cracking of the second protective layer, It improves the contraction reliability of the light emitting diode display, blocks the penetration path of external moisture and prevents the penetration of moisture into the display device.

Description

Organic light emitting diode display device and method for manufacturing the same {Organic light emitting diode display device and fabricating method of the same}

The present invention relates to an organic light emitting diode display, and more particularly, to an organic light emitting diode display that blocks an external moisture penetration path.

The organic light emitting diode display device is a self-light emitting device, and because it does not need a separate light source used in the liquid crystal display device which is a non-light emitting device, it is possible to have a light weight. In addition, it has better viewing angle and contrast ratio than liquid crystal display, and is advantageous in terms of power consumption. It is also possible to drive DC low voltage, fast response speed, and strong internal shock due to solid internal components, and wide use temperature range. It has an advantage.

The organic light emitting diode display described above may have a problem in that the pixel area does not emit light due to external electrode damage caused by oxygen and moisture, and the external oxygen and moisture have a fatal effect on the lifespan of the organic light emitting diode display. Packaging technology for sealing organic light emitting diode displays is very important.

In the packaging technology of the organic light emitting diode display device, the front encapsulation technology protects the organic light emitting diode device from external moisture by joining the two substrates by forming an entire surface of the organic light emitting diode formed device substrate and the entire area of the encapsulation substrate. . The basic structure of the organic light emitting diode display will be described with reference to FIGS. 1 and 2 as follows.

1 is a plan view of a conventional organic light emitting diode display.

Referring to FIG. 1, an organic light emitting diode 20 is formed on an element substrate 10. The organic light emitting diode 20 includes a first electrode, an organic layer including at least a light emitting layer, and a second electrode. The semiconductor device may further include a thin film transistor including a semiconductor layer, a gate electrode, a source electrode, and a drain electrode. Subsequently, an encapsulation layer is formed between the device substrate 10 and the encapsulation substrate 18 and bonded. The encapsulation layer is formed of a second protective layer and an adhesive layer, which will be described below with reference to a cross-sectional view of the outer portion A of the substrate.

2 is a cross-sectional view of a conventional organic light emitting diode display.

Referring to FIG. 2, a first protective layer 11 is formed on the device substrate 10 to protect a thin film transistor or the like formed on the device substrate 10, and the organic material may be formed on the first protection layer 11. The first electrode 12 of the light emitting diode is formed. An insulating layer 13 is formed on the first electrode 12 to define the emission area by exposing the first electrode 12 on a pixel area basis. The exposed first electrode 12 and the insulating layer 13 are formed on the first electrode 12. The organic layer 14 including the light emitting layer and the second electrode 15 are stacked on the substrate. On the organic light emitting diode consisting of the first electrode 12, the insulating film 13, the organic film layer 14 and the second electrode 15, a second protective layer 16 to protect and seal the display elements from moisture, gas, etc. Is formed. An adhesive layer 17 is formed on the second protective layer 16, and the encapsulation substrate 18 is bonded to the organic light emitting diode display device.

6A is a diagram illustrating a curling test result of a conventional organic light emitting diode display.

2 and 6A, the insulating layer 13 of the organic light emitting diode has a poor interfacial adhesive force with the first protective layer 11, resulting in curling. When the curling occurs in the insulating layer 13, the second protective layer 16 formed in contact with the side surface of the insulating layer 13 also cracks, and the crack generated in the second protective layer 16 is exposed to moisture and gas from the outside. The light may be a path that easily penetrates to the light emitting area, which causes a problem of shrinkage defects.

SUMMARY OF THE INVENTION An object of the present invention is to provide an organic light emitting diode display and a method of manufacturing the same, forming a pinned layer under the outer region of the insulating film to prevent curling of the insulating film.

Another object of the present invention is to provide an organic light emitting diode display and a method of manufacturing the same, which prevents the occurrence of cracking of the insulating layer to prevent cracking of the second protective layer and improves the shrinkage reliability of the organic light emitting diode display. .

Another object of the present invention is to provide an organic light emitting diode display and a method of manufacturing the same, forming a fixed layer under the edge of the insulating layer and blocking the penetration of external moisture and preventing moisture from penetrating into the display device. .

The organic light emitting diode display device of the present invention for solving the above problems of the prior art comprises: a device substrate including a plurality of pixel areas; A first protective layer formed on the device substrate; An organic light emitting diode first electrode formed on the first protective layer, a first insulating film formed on the first electrode and defining a light emitting region, an organic film layer and an organic light emitting diode second electrode formed on the first insulating film An organic light emitting diode comprising a; A first pinned layer formed on the first passivation layer at the end of the first insulating layer, the first pinning layer preventing direct contact between the end of the first insulating layer and the first passivation layer; It characterized in that it comprises a second protective layer formed on the organic light emitting diode.

In addition, the organic light emitting diode display device manufacturing method of the present invention comprises the steps of forming a device substrate including a plurality of pixel regions; Forming a first passivation layer on the device substrate; Forming an organic light emitting diode first electrode on the first protective layer; Forming a first pinned layer on the first protective layer; Forming a first insulating film on the first electrode and the first pinned layer; Forming an organic film layer formed on the first insulating film; Forming an organic light emitting diode second electrode on the organic layer; And forming a second passivation layer on the substrate on which the second electrode is formed, wherein the first pinned layer is formed at the end of the first insulating layer so that the end of the first insulating layer is in direct contact with the first passivation layer. It is characterized by preventing that.

The organic light emitting diode display and the method of manufacturing the same according to the present invention have a first effect of forming a fixed layer under the edge of the outer region of the insulating film to prevent the insulating film from curling.

In addition, the organic light emitting diode display device and the manufacturing method thereof according to the present invention have a second effect of preventing the occurrence of cracking of the insulating layer to prevent cracking of the second protective layer and improving shrinkage reliability of the organic light emitting diode display device. have.

In addition, the organic light emitting diode display and the method of manufacturing the same according to the present invention have a third effect of forming a fixed layer under the edge of the insulating film outer region, thereby blocking the penetration path of external moisture and preventing the penetration of moisture into the display device. .

1 is a plan view of a conventional organic light emitting diode display.
2 is a cross-sectional view of a conventional organic light emitting diode display.
3 is a plan view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.
4 is a cross-sectional view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.
5 is a cross-sectional view of an organic light emitting diode display according to a second exemplary embodiment of the present invention.
6 is a cross-sectional view of an organic light emitting diode display according to a third exemplary embodiment of the present invention.
7 is a cross-sectional view of an organic light emitting diode display according to a fourth exemplary embodiment of the present invention.
8 is a cross-sectional view of an organic light emitting diode display according to a fifth exemplary embodiment of the present invention.
9 is a cross-sectional view of an organic light emitting diode display according to a sixth exemplary embodiment of the present invention.
10 is a plan view of an organic light emitting diode display according to a seventh exemplary embodiment of the present invention.
11 is a cross-sectional view of an organic light emitting diode display according to a seventh exemplary embodiment of the present invention.
12A to 12C illustrate a method of manufacturing a fixed layer of an organic light emitting diode display according to a first embodiment of the present invention.
13A to 13D illustrate a method of manufacturing a fixed layer of an organic light emitting diode display according to a second exemplary embodiment of the present invention.
14A and 14B illustrate a curling test result of an organic light emitting diode display and an organic light emitting diode display of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

3 is a plan view of an organic light emitting diode display according to a first exemplary embodiment of the present invention. Referring to FIG. 3, in the organic light emitting diode display of the present invention, the device substrate 100 and the encapsulation substrate 118 are bonded to each other with the adhesive layer 117 interposed therebetween. The device substrate 100 includes a plurality of pixel regions P, and an insulating layer 113 is formed on the device substrate 100. The insulating layer 113 may expose the organic light emitting diode first electrode to define a pixel area P. Referring to FIG.

An area including the plurality of pixel areas P and in which the insulating layer 113 is formed is defined as a display area DA. Also, an area formed around the display area DA and defined as the non-display area NA is formed outside the display area DA.

The pinned layer 200 is formed under the insulating layer 113. The pinned layer 200 is formed in direct contact with the insulating layer 113. In addition, the pinned layer 200 may be formed at a lower end of the insulating layer 113. An end of the insulating film 113 is a boundary between the display area DA and the non-display area NA. That is, the pinned layer 200 formed below the end of the insulating layer 113 may be formed in the form of a closed curve surrounding the display area DA.

In this case, a portion of the pinned layer 200 may be formed to overlap the insulating layer 113, and a portion of the pinned layer 200 may extend from the end of the insulating layer 113 to the outside. That is, the pinned layer 200 may be formed inside or outside the end of the insulating layer 113 to be formed in the display area DA and the non-display area NA.

The second passivation layer 116 is formed on the insulating layer 113 on which the pinned layer 200 is formed. The second passivation layer 116 may extend to overlap the pinned layer 200 formed in the non-display area NA. The organic light emitting diode display of the present invention will be described in detail with reference to the cross-sectional view.

4 is a cross-sectional view of an organic light emitting diode display according to a first exemplary embodiment of the present invention. Referring to FIG. 4, the organic light emitting diode display of the present invention includes a first passivation layer 111 on a device substrate 100 including a display area DA and a non-display area NA partitioned into a plurality of pixel areas. ) Is formed. The device substrate 100 includes a thin film transistor including a gate electrode, a semiconductor layer, and a source / drain electrode formed on an insulating substrate formed of insulating glass, metal, plastic, or polyimide (PI), and a drain electrode of the thin film transistor. It may include a pixel electrode electrically connected to the.

An organic light emitting diode is formed on the first passivation layer 111. The organic light emitting diode includes a first electrode 112, at least an organic layer 114 including a light emitting layer, and a second electrode 115. The first electrode 112 may be formed as an anode, and the second electrode 115 may be formed as a cathode. The organic light emitting diode may be defined as the first electrode 112 and the second electrode 115 according to a selected color signal. When a voltage of is applied, holes provided from the anode and electrons injected from the cathode are transported to the organic film layer 114 to form an exciton, and when such exciton transitions from the excited state to the ground state, light is generated to display visible light. Emitted in the form of lines. In this case, the first electrode may include any one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and ZnO, and the second electrode may include Mg, Ca, Al, and Al having a low work function. It may include any one selected from the group consisting of alloy, Ag, Ag-alloy, Au and Au-alloy.

The organic layer 114 may be composed of a single layer made of a light emitting material, in order to increase the light emitting efficiency, a hole injection layer, a hole transporting layer, a light emitting material layer, It may be composed of multiple layers of an electron transporting layer and an electron injection layer.

An insulating layer 113 is formed between the first electrode 112 and the organic layer 114 to define the emission region by exposing the first electrode 112. The region where the first electrode 112 is exposed is a light emitting region, and the other regions are divided into non-light emitting regions, and the organic layer 114 is formed on the insulating layer 113 on which the first electrode 112 is exposed. Is formed.

The pinned layer 200 is formed on the first passivation layer 111 under the insulating layer 113. The pinned layer 200 may be formed on the first passivation layer 111 at a lower end of the insulating layer 113. In this case, the pinned layer 200 may prevent the first protective layer 111 and the end of the insulating layer 113 from directly contacting. That is, the pinned layer 200 may prevent the phenomenon of curling by improving the interfacial adhesion between the first protective layer 111 and the insulating layer 113.

The pinned layer 200 may be formed separately from the metal oxide layer, or may be formed of the same material on the same layer as the first electrode 112. The pinned layer 200 may be formed by extending the first electrode 112 to a lower region of the end portion of the insulating layer 113, and patterning the first electrode 112. The pinned layer 200 may be formed of any one selected from the group consisting of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), and ZnO among the metal oxide layers, and may be formed of the same material as the first electrode 112. Can be formed.

The pinned layer 200 is formed to be spaced apart from the first electrode 112. That is, the pinned layer 200 and the first electrode 112 may be formed on the first protective layer 111 in the same layer, but may be spaced apart from each other. In this case, the first passivation layer 111 and the insulating layer 113 may be formed to be in contact with each other between the first electrode 112 and the pinned layer 200. That is, at the end of the insulating layer 113, the first protective layer 111 and the insulating layer 113 are formed so as not to be in contact with each other due to the pinned layer 200, but the pinned layer 200 and the first electrode 112 are not in contact with each other. It may be formed to contact between.

A second passivation layer 116 is formed on the first passivation layer 111 on which the pinned layer 200, the insulating layer 113, and the organic light emitting diode are formed. The second protective layer 116 serves to protect the organic light emitting diode from moisture, gas, and the like. Because the pinned layer 200 prevents the curling of the insulating layer 113, the second protective layer 116 may also be formed without cracking.

A portion of the pinned layer 200 may be formed to overlap the insulating layer 113, and a portion of the pinned layer 200 may extend outwardly from the end of the insulating layer 113. That is, the pinned layer 200 may be formed inside or outside the end of the insulating layer 113 to be formed in the display area DA and the non-display area NA.

The organic layer 114 and the second electrode 115 may be formed only on the insulating layer 113. As a result, the pinned layer 200 formed under the insulating layer 113 may be formed to contact the second protective layer 116 when formed at the end of the insulating layer. An adhesive layer 117 is formed on the device substrate 100 including the second protective layer 116, and the encapsulation substrate 118 is bonded to the device substrate 100 with the adhesive layer 117 therebetween, thereby emitting organic light. The diode display is completed. The encapsulation substrate 118 may be insulating glass, metal, or plastic. In addition, the adhesive layer 117 may be a variety of adhesives, such as thermosetting adhesive, thermoplastic adhesive, ultraviolet curable adhesive, pressure-curable adhesive.

5 is a cross-sectional view of an organic light emitting diode display according to a second exemplary embodiment of the present invention. Compared with the first embodiment, the overlapping description can be omitted. Referring to FIG. 5, the organic light emitting diode display according to the second exemplary embodiment of the present invention includes a pinned layer 300 having an upper surface having an uneven structure. When the concave-convex structure is formed, the contact area between the pinned layer 300 and the insulating layer 113 is widened, thereby increasing the adhesive strength and maximizing the effect of preventing the rolling phenomenon. The concave-convex structure has a concave concave portion and a convex convex portion, and may have a structure including a plurality of slits.

The pinned layer 300 may be formed of the same material on the same layer as the first electrode 112. In this case, the pinned layer 300 and the first electrode 112 may be formed in the same process using the same mask. Referring to FIG. 4, the pinned layer 300 and the first electrode 112 are spaced apart from each other, but as shown in the following third embodiment, the pinned layer 300 and the first electrode 112 may be connected to each other. have.

6 is a cross-sectional view of an organic light emitting diode display according to a third exemplary embodiment of the present invention. Duplicate descriptions in comparison with the first embodiment can be omitted. Referring to FIG. 6, the pinned layer 400 of the organic light emitting diode display according to the third exemplary embodiment of the present invention may be connected to the first electrode 112. When the first electrode 112 is formed, the pinned layer 400 may be formed by extending the first electrode 112 to the end of the insulating layer 113 in the same process. That is, the pinned layer 400 is formed of the same material in the same layer in the same process as the first electrode 112. At this time, as in the second embodiment, the lower end of the insulating film 113 may be formed in an uneven structure.

7 is a cross-sectional view of an organic light emitting diode display according to a fourth exemplary embodiment of the present invention. Duplicate descriptions in comparison with the first embodiment can be omitted. Referring to FIG. 7, the pinned layer 500 of the organic light emitting diode display according to the fourth exemplary embodiment of the present invention may be formed only inside the end of the insulating layer 113. That is, the upper surface of the pinned layer 500 is formed so as not to overlap the second protective layer 116. In this case, the outer side surface of the pinned layer 500 may not overlap the insulating layer 113, and may be in contact with the second protective layer 116.

That is, when the region including the plurality of pixel regions, the region in which the insulating layer 113 is formed, is defined as a display region, and the region formed around the display region is defined as a non-display region, the fixed layer 500 is defined. May be formed only in the display area. In addition, as in the second and third embodiments, the pinned layer 500 may have an upper surface having a concave-convex structure, and the pinned layer may extend from the first electrode.

8 is a cross-sectional view of an organic light emitting diode display according to a fifth exemplary embodiment of the present invention. Duplicate descriptions in comparison with the first embodiment can be omitted. Referring to FIG. 8, the organic layer 214 of the organic light emitting diode display according to the fifth embodiment of the present invention is formed to extend to the side surface of the insulating layer 113. The organic layer 214 is formed inside and outside the end of the insulating layer 113.

The pinned layer 200 is formed below the end of the insulating layer 113. The pinned layer 200 is formed in direct contact with the insulating layer 113. In addition, the pinned layer 200 may extend from the lower end of the insulating layer 113 to the outer side of the insulating layer 113. That is, the pinned layer 200 may be formed inside or outside the end of the insulating layer 113.

As the organic layer 214 and the pinned layer 200 extend in and out of the insulating layer 113, the organic layer 214 and the pinned layer 200 may overlap each other in the non-display area. .

In addition, as in the second or third embodiment of the present invention, an upper surface may be formed in an uneven structure, and the pinned layer may extend from the first electrode.

9 is a cross-sectional view of an organic light emitting diode display according to a sixth exemplary embodiment of the present invention. Duplicate descriptions in comparison with the first embodiment can be omitted. Referring to FIG. 9, the second electrode 215 of the organic light emitting diode display according to the sixth embodiment of the present invention is formed to extend to the side surface of the insulating layer 113. The second electrode 215 is formed inside and outside the end of the insulating layer 113.

The pinned layer 200 is formed below the end of the insulating layer 113. The pinned layer 200 is formed in direct contact with the insulating layer 113. In addition, the pinned layer 200 may extend from the lower end of the insulating layer 113 to the outer side of the insulating layer 113. That is, the pinned layer 200 may be formed inside or outside the end of the insulating layer 113.

As the second electrode 215 and the pinned layer 200 are formed to extend into and out of the insulating layer 113, the second electrode 215 and the pinned layer 200 overlap each other in the non-display area. Can be.

10 is a plan view of an organic light emitting diode display according to a seventh exemplary embodiment of the present invention. Referring to FIG. 10, in the organic light emitting diode display of the present invention, the device substrate 100 and the encapsulation substrate 118 are bonded to each other with the adhesive layer 117 interposed therebetween. The device substrate 100 includes a plurality of pixel regions P, and a first insulating layer 213 is formed on the device substrate 100. The first insulating layer 213 may expose the organic light emitting diode first electrode to define a pixel area P. Referring to FIG.

An area including the plurality of pixel areas P and in which the first insulating layer 213 is formed is defined as a display area DA. Also, an area formed around the display area DA and defined as the non-display area NA is formed outside the display area DA.

The first pinned layer 600 is formed under the first insulating layer 213. The first pinned layer 600 is formed in direct contact with the first insulating layer 213. In addition, the first pinned layer 600 may be formed under the end of the first insulating layer 213. An end of the first insulating film 213 is a boundary between the display area DA and the non-display area NA. That is, the first pinned layer 600 formed under the end of the first insulating layer 213 may be formed in the form of a closed curve surrounding the display area DA.

In this case, a portion of the first pinned layer 600 may be formed to overlap the first insulating layer 213, and a portion of the first pinned layer 600 may be formed to extend outwardly of the first insulating layer 213. That is, the first pinned layer 600 may be formed inside or outside the end of the first insulating layer 213 to be formed in the display area DA and the non-display area NA.

In addition, a second insulating layer 313 is formed in the non-display area NA. The second insulating layer 313 may be formed to be spaced apart from the first insulating layer 213, and may be formed in a closed curve surrounding the first insulating layer 213. The second insulating layer 313 may be formed of the same material as the first insulating layer 213 in the same layer, and may be formed in the same process.

A second pinned layer 700 is formed below the second insulating layer 313. The second pinned layer 700 is formed in direct contact with the second insulating layer 313. In addition, the second pinned layer 700 may be formed under the end of the second insulating layer 313. An end of the second insulating layer 313 may be defined as a region where a side surface and a bottom surface of the second insulating layer 313 meet on a cross section. That is, an end of the second insulating layer 313 may be divided into an inner end and an outer end, and an end formed on the side of the first insulating layer 213 is defined as an inner end.

The second pinned layer 700 formed below the end of the second insulating layer 213 may be formed in the shape of a closed curve at the inner end and the outer end of the second insulating layer 213, respectively. In addition, the second pinned layer 700 formed at the inner end and the second pinned layer 700 formed at the outer end may be connected to each other and formed as one. In addition, a portion of the second pinned layer 700 may be formed to overlap the second insulating layer 313, and a portion of the second pinned layer 700 may be formed to extend to the outer side of the second insulating layer 313. That is, the second pinned layer 700 may be formed inside or outside the end of the second insulating layer 313.

The second passivation layer 116 is formed on the first insulating layer 213 and the second insulating layer 313 on which the first pinned layer 600 and the second pinned layer 700 are formed. The second passivation layer 116 is formed to extend, and may overlap the first pinned layer 600 and the second pinned layer 700. The organic light emitting diode display of the present invention will be described in detail with reference to the cross-sectional view.

11 is a cross-sectional view of an organic light emitting diode display according to a seventh exemplary embodiment of the present invention. Duplicate descriptions in comparison with the first embodiment can be omitted. Referring to FIG. 11, a first passivation layer 111 is formed on an element substrate 100 including a display area DA and a non-display area NA, which are divided into a plurality of pixel areas. An organic light emitting diode including a first electrode 112, an organic layer 114 including at least a light emitting layer, and a second electrode 115 is formed on the first protective layer 111.

A first insulating layer 213 is formed between the first electrode 112 and the organic layer 114 to define the emission region by exposing the first electrode 112. The region where the first electrode 112 is exposed is a light emitting region, and the other regions are divided into non-light emitting regions, and the organic layer 114 is disposed on the first insulating layer 213 on which the first electrode 112 is exposed. ) Is formed.

The second insulating layer 313 is formed in the non-display area NA. The second insulating layer 313 is spaced apart from the first insulating layer 213. The second insulating layer 313 may be formed of the same material as the first insulating layer 213 in the same layer, and may be formed in the same process.

A first pinned layer 600 is formed on the first passivation layer 111 under the first insulating layer 213. In addition, a second pinned layer 700 is formed under the second insulating layer 313. The first pinned layer 600 and the second pinned layer 700 may prevent the curling phenomenon by improving the interfacial adhesion between the first passivation layer 111, the first insulating layer 213, and the second insulating layer 313. .

The first pinned layer 600 and the second pinned layer 700 may be formed separately from a metal oxide film, or may be formed of the same material on the same layer as the first electrode 112. The first pinned layer 600 and the second pinned layer 700 may be formed of any one selected from the group consisting of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), and ZnO among metal oxide films. It may be formed of the same material as the first electrode 112.

A second passivation layer 116 is formed on the first passivation layer 111 on which the pinned layer 200, the insulating layer 113, and the organic light emitting diode are formed. The second protective layer 116 serves to protect the organic light emitting diode from moisture, gas, and the like. Because the pinned layer 200 prevents the curling of the insulating layer 113, the second protective layer 116 may also be formed without cracking.

The first pinned layer 600 and the second pinned layer 700 may be formed inside and outside the ends of the first and second insulating layers 213 and 313, respectively, to be in contact with the second protective layer 116. Can be.

In addition, the second pinned layer 700 formed below the end of the second insulating layer 213 may be formed in the form of a closed curve at the inner end and the outer end of the second insulating layer 213, respectively. In addition, the second pinned layer 700 formed at the inner end and the second pinned layer 700 formed at the outer end may be connected to each other and formed as one. In addition, various changes and modifications are possible with reference to the second to sixth embodiments.

12A to 12C illustrate a method of manufacturing a fixed layer of an organic light emitting diode display according to a first embodiment of the present invention. Referring to FIG. 12A, a first protective layer 111 for protecting a thin film transistor or the like is formed on the device substrate 100. The metal oxide layer 120 is formed on the first passivation layer 111 by using any one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and ZnO. The photoresist layer 130, which is a photosensitive material, is formed on the metal oxide layer 120. The photoresist layer 130 may be formed of a negative photoresist, and the negative photoresist is a photosensitive material which is a material that is cured when light is irradiated. However, the process may be performed using a positive photoresist, which is a material that softens when light is irradiated.

Referring to FIG. 12B, a mask including a blocking part and a transmitting part is covered on the photoresist layer 130, and a region where the pinned layer and the first electrode are to be formed corresponds to a transmitting part of the mask and irradiates light. Subsequently, when the ashing process is performed, photoresist patterns 130a and 130b are formed only on the region where the pinned layer and the first electrode are to be formed on the metal oxide layer 120.

Referring to FIG. 12C, when the metal oxide layer 120 is etched using the photoresist patterns 130a and 130b as a mask, the pinned layer 200 and the first electrode 112 are simultaneously formed of a metal oxide layer. The pinned layer 200 may prevent the curling phenomenon by improving the interfacial adhesion between the insulating film to be formed thereafter and the first protective layer. The pinned layer 200 is formed to be spaced apart from the first electrode 112.

13A to 13D illustrate a method of manufacturing a fixed layer of an organic light emitting diode display according to a second exemplary embodiment of the present invention. An upper surface of the pinned layer 300 of the organic light emitting diode display according to the second embodiment has an uneven structure.

Referring to FIG. 13A, a first protective layer 111 for protecting a thin film transistor or the like is formed on the device substrate 100 as in the first embodiment. A metal oxide layer 120 is formed on the first passivation layer 111 by using any one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), and ZnO. The photoresist layer 130, which is a photosensitive material, is formed on the oxide layer 120. The photoresist layer 130 may be formed of a negative photoresist, and the negative photoresist is a photosensitive material which is a material that is cured when light is irradiated. However, the process may be performed using a positive photoresist, which is a material that softens when light is irradiated.

Thereafter, the photoresist pattern is formed using the halftone mask 140 differently from the first embodiment. The halftone mask 140 includes a blocking part A, a transmitting part B, and a transflective part c. The transmitting part B transmits light as it is, and the transflective part C has different transmittances. By using a semi-transmissive material having a less light passing through than the transmission portion (B), the blocking portion (A) completely blocks the light. The transmissive part B corresponds to an area on which the half-tone mask 140 is to be formed, and the transmissive part B and the transflective part C alternately correspond to an area where the first electrode is to be formed, and light is alternately formed. Investigate.

Referring to FIG. 13B, in the region where the pinned layer is to be formed, the negative photoresist facing the transmissive portion B of the halftone mask 140 is irradiated and cured by light to have a high step height, and opposes the transflective portion C. Since the negative photoresist is semi-cured by the light transmitted through the transflective portion C, the step is low to form the photoresist pattern 130c. In addition, a photoresist pattern 130d having a high level of difference is formed in a region where the first electrode is to be formed. In addition, the negative photoresist facing the blocking portion A of the halftone mask 140 is removed to expose the metal oxide layer 120.

Referring to FIG. 13C, the exposed metal oxide layer 120 is patterned by etching the photoresist patterns 130c and 130d as a mask. The first electrode 112 is formed by the patterning process, and the pinned layer 200 is formed in the same shape as in the first embodiment. Subsequently, when the ashing process is performed on the photoresist patterns 130c and 130d, the photoresist pattern having a low step is removed, and only the photoresist patterns 130e and 130f having a high step are left. A portion of the pinned layer 200 is exposed.

Referring to FIG. 13D, when the partially exposed pinned layer 200 is etched using the photoresist pattern 130e as a mask and the remaining photoresist patterns 130e and 130f are removed, the pinned layer having the upper surface having an uneven structure. 300 can be formed. The upper surface of the pinned layer 300 is formed to have an uneven structure to improve adhesion to the insulating layer 113. When the uneven structure is formed, the contact area between the fixed layer 300 and the insulating layer 113 is widened so that the adhesive force is increased. This increases and can maximize the effect of preventing the jungle phenomenon. The pinned layer 300 is formed to be spaced apart from the first electrode 112.

14A and 14B illustrate a curling test result of an organic light emitting diode display and an organic light emitting diode display of the present invention.

Referring to FIG. 14A, it can be seen that in the conventional organic light emitting diode display, an insulation film is weakly bonded to the first protective layer on the device substrate, resulting in curling. As a result, curling and cracking occur in the second protective layer together with the insulating film, and the organic light emitting diode and other display devices are not sealed from moisture, gas, etc., and the panel reliability is low.

Referring to FIG. 14B, in the organic light emitting diode display of the present invention, a fixed layer is formed of a metal oxide film under the insulating film end to improve adhesion between the first protective layer and the insulating film, thereby preventing the insulating film from curling. In addition, as the phenomenon of curling of the insulating layer is prevented, cracking does not occur in the second passivation layer, thereby improving reliability of the organic light emitting diode display.

Therefore, the organic light emitting diode display and the manufacturing method thereof according to the present invention, by forming a fixed layer on the lower end of the insulating film on the first protective layer to prevent curling of the insulating film to prevent cracking of the second protective layer, It improves the contraction reliability of the light emitting diode display device, blocks the penetration path of external moisture and prevents the penetration of moisture into the display device.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

100: device substrate 115: second electrode
111: first protective layer 116: second protective layer
112: first electrode 117: adhesive layer
113: insulating film 118 sealing substrate
114: organic layer 200, 300, 400, 500, 600, 700: fixed layer

Claims (23)

An element substrate including a plurality of pixel regions;
A first protective layer formed on the device substrate;
An organic light emitting diode first electrode formed on the first protective layer, a first insulating film formed on the first electrode and defining a light emitting region, an organic film layer and an organic light emitting diode second electrode formed on the first insulating film An organic light emitting diode comprising a;
A first pinned layer formed on the first passivation layer at the end of the first insulating layer, to prevent direct contact between the end of the first insulating layer and the first passivation layer;
A second protective layer formed on the organic light emitting diode,
The first pinned layer is formed of a metal oxide film or the same material as the first electrode, an organic light emitting diode display device.
The method of claim 1,
And the first pinned layer extends from an end of the first insulating layer to be in contact with the second passivation layer.
The method of claim 1,
And the first protective layer and the first insulating layer are in contact between the first electrode and the first pinned layer.
The method of claim 1,
And the first pinned layer is formed only inside an end of the first insulating layer.
delete delete The method of claim 1,
The upper surface of the first pinned layer is formed with an uneven structure organic light emitting diode display device.
The method of claim 7, wherein
And an upper surface of the first pinned layer having a concave-convex structure including a plurality of slits.
The method of claim 1,
An organic light emitting diode display device, wherein a first pinned layer and an organic light emitting diode are formed between the first protective layer and the second protective layer.
The method of claim 1,
And the first electrode extends below the end of the insulating layer so that the first pinned layer and the first electrode are integrally formed.
The method of claim 1,
A second insulating film formed on the first protective layer, spaced apart from the first insulating film, outside the first insulating film;
An organic light emitting diode display further comprising a second pinned layer formed on the first passivation layer at the end of the second insulating layer to prevent direct contact between the end of the second insulating layer and the first passivation layer. Device.
The method of claim 11,
And the second insulating film surrounds the first insulating film and is formed in a closed curve shape.
The method of claim 11,
The first pinned layer and the second pinned layer are formed of the same material as the first electrode.
Forming a device substrate including a plurality of pixel regions;
Forming a first passivation layer on the device substrate;
Forming an organic light emitting diode first electrode on the first protective layer;
Forming a first pinned layer on the first protective layer;
Forming a first insulating film on the first electrode and the first pinned layer;
Forming an organic film layer formed on the first insulating film;
Forming an organic light emitting diode second electrode on the organic layer;
Forming a second protective layer on the substrate on which the second electrode is formed;
The first pinned layer is formed at the end of the first insulating layer, and prevents the end of the first insulating layer from directly contacting the first protective layer.
The first pinned layer is formed of a metal oxide film or the same material as the first electrode, characterized in that the organic light emitting diode display device manufacturing method.
The method of claim 14,
Forming the pinned layer,
A method of manufacturing an organic light emitting diode display device using a halftone mask to form an upper surface of the fixed layer in an uneven structure.
delete The method of claim 14,
And forming the first electrode and forming the pinned layer at the same time.
The method of claim 14,
Forming the pinned layer,
And forming the first electrode by patterning the organic light emitting diode.
The method of claim 14,
And the first electrode extends below the end of the insulating layer to form the fixed layer, and the first electrode and the fixed layer are integrally formed.
The method of claim 14,
In the step of forming a first pinned layer on the first protective layer, forming a second pinned layer together,
And forming a first insulating film together with a second insulating film on the second pinned layer, the first insulating film being spaced apart from the first insulating film outside the first insulating film.
The method of claim 20,
The first pinned layer and the second pinned layer are formed of the same material as the first electrode.
The method of claim 20,
And forming the first electrode and the forming the first pinned layer and the second pinned layer at the same time. A device substrate including a display area including a plurality of pixel areas and a non-display area surrounding the display area;
A first protective layer formed on the device substrate;
An organic light emitting diode first electrode formed on the first protective layer, a first insulating film formed on the first electrode and defining a light emitting region, an organic film layer formed on the first insulating film, and an organic light emitting diode second electrode An organic light emitting diode comprising a;
A first pinned layer formed on the first passivation layer at an end of the first insulating layer, which is a boundary between the display area and the non-display area, to prevent direct contact between the end of the first insulating layer and the first passivation layer; and;
And a second passivation layer formed on the organic light emitting diode.

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