KR102042418B1

KR102042418B1 - Organic electronic device and method for preparing the same

Info

Publication number: KR102042418B1
Application number: KR1020150152543A
Authority: KR
Inventors: 김정두; 이연근; 이정형
Original assignee: 엘지디스플레이 주식회사
Priority date: 2015-10-30
Filing date: 2015-10-30
Publication date: 2019-11-08
Also published as: KR20170050687A

Abstract

The present application relates to an organic electronic device and a method for manufacturing the same, and provides an organic electronic device having a thin thickness and a small bezel while preventing a luminance unevenness due to voltage drop in forming a large area light source.

Description

Organic electronic device and manufacturing method thereof {ORGANIC ELECTRONIC DEVICE AND METHOD FOR PREPARING THE SAME}

The present application relates to an organic electronic device, a method of manufacturing the same, and an illumination and display device including the same.

An organic electronic device (OED) refers to a device including an organic material layer that generates an exchange of electric charge using holes and electrons. Examples of the organic electronic device include photovoltaic devices, rectifiers, Transmitters and organic light emitting diodes (OLEDs); and the like.

Among the organic electronic devices, organic light emitting diodes (OLEDs) have low power consumption, fast response speed, and are advantageous for thinning a display device or lighting, as compared with conventional light sources. In addition, OLED has excellent space utilization, and is expected to be applied in various fields including various portable devices, monitors, notebooks, and TVs.

On the other hand, organic light emitting diodes generally use indium tin oxide as an electrode. In the case of indium tin oxide, the light transmittance is good at 80 to 90% or more in the visible region, but the electrical resistivity is larger than 10 ^-4 Ωcm or more. Therefore, the voltage drop may occur as the distance from the electrode is applied. Accordingly, when manufacturing a large area light source, the organic electronic device has a problem of uneven brightness due to voltage drop. In order to reduce the unevenness of the brightness, in general, after forming the organic electronic device to form an equipotential. In the conventional method of forming an equipotential, an anisotropic conductive film (ACF) is bonded to an edge of a flexible printed circuit board (FPCB) so that current flows evenly in both edges of an organic electronic device. However, since FPCB basically has a predetermined thickness and a predetermined bezel space is required due to the ACF bonding at the edge, there is a limitation in manufacturing an organic electronic device having a thin thickness and a small bezel.

Korean Patent Publication No. 1998-0071030

The present application provides an organic electronic device having a thin thickness and a small bezel, while preventing luminance unevenness due to voltage drop in forming a large area surface light source.

The present application relates to an organic electronic device. Exemplary organic electronic devices include a base layer 101 as shown in FIG. 1; An element portion 105 formed on the base layer 101 and including a first electrode layer 102, an organic layer 103, and a second electrode layer 104 sequentially stacked; A metal cover film 106 formed on an upper portion of the device portion 105; A first electrode pad part 107 electrically connected to the first electrode layer 102 outside the device part 105; A second electrode pad part 108 electrically connected to the second electrode layer 104 outside the device part 105; A first conductive layer 109 electrically connected to the metal cover film 106 and the first electrode pad part 107 to form an equipotential; And a second conductive layer 110 electrically connected to the second electrode pad part 107 to form an equipotential.

As used herein, the term “outside of the element portion” means an edge portion other than an area in which the metal cover film formed on the upper portion of the organic electronic device to encapsulate the element portion. In addition, in this specification, the term "inside of an element part" means the inside of the area | region which the metal cover film formed in the upper part so that the element part of an organic electronic device may be sealed.

In addition, in the present specification, "electrically connected to form an equipotential" means that the same potential is formed over the entire area of the organic electronic device in order to prevent the voltage drop from moving away from the electrode to which the voltage is applied. It means to connect electrically.

In one example, the first electrode pad portion 107 and the second electrode pad portion may be formed to apply power in all directions outside the element portion 105. That is, the first electrode pad portion 107 electrically connected to the first electrode layer 102 and the second electrode pad portion 108 electrically connected to the second electrode layer 104 may form the element portion 105. It may be formed in the outward direction of the element portion 105 to surround. However, the pads 107 and 108 need not be formed on all the outer sides of the device unit 105, and the power supply may be formed on each side of the device unit 105. The material constituting the first electrode pad part 107 and the second electrode pad part 108 is not particularly limited, and materials known in the art may be used. In one example, the first or second electrode pad portion may include Cu, Al, Mo, Cr or Ag.

In one example, the first electrode layer or the second electrode layer may be, for example, an oxide electrode layer, the oxide electrode layer may be an indium tin oxide layer, but is not limited thereto. When the indium tin oxide layer is used as the electrode layer, the light transmittance in the visible light region is good at 80 to 90% or more, but has a disadvantage in that the electrical resistivity is 10 ⁻⁴ Ωcm or more. Therefore, in the case of using an electrode having a high resistivity, such as indium tin oxide, a voltage drop may occur as the distance from the applied electrode increases, and when a large area light source is manufactured, a problem of luminance unevenness due to the voltage drop may occur. . In order to reduce the unevenness of the brightness, in general, after forming the organic electronic device to form an equipotential. In the conventional method of forming an equipotential, an anisotropic conductive film (ACF) is bonded to an edge of a flexible printed circuit board (FPCB) so that current flows evenly in both edges of an organic electronic device. However, since FPCB basically has a predetermined thickness and a predetermined bezel space is required due to the ACF bonding at the edge, there is a limitation in manufacturing an organic electronic device having a thin thickness and a small bezel. The organic electronic device according to the present application may form an equipotential by forming first and second conductive layers instead of the flexible printed circuit board and the anisotropic conductive film. Accordingly, the present application provides an organic electronic device having a thin thickness and a small bezel.

In an embodiment of the present application, the first conductive layer 109 and the second conductive layer 110 have a resistivity of 10 ⁻⁷ to 10 ⁻⁴ Ωcm, 10 ⁻⁶ to 10 ⁻⁴ Ωcm, or 10 ⁻⁵ to 10 ^{− It} may be in the range of ⁴ Ωcm. Such first or second conductive layer can be used without limitation as long as it is a material containing silver (Ag), for example. The first conductive layer and the second conductive layer may be electrically connected to the first electrode pad part 107 and the second electrode pad part 108, respectively, to form an equipotential of the entire organic electronic device having a large area. In order to achieve the equipotential effect desired in the present application, the first conductive layer 109 has an area of 5 mm ^{2 in} contact with the first electrode pad portion 107 when observed in the normal direction of the base layer 101. To 100 mm ² , 5 mm ² To 80 mm ² Or 10 mm ² To 50 mm ² . In addition, the thickness of the first conductive layer 109 may be in the range of 0.1 μm to 10 μm, 0.5 μm to 8 μm, or 1 μm to 5 μm. The first conductive layer 109 satisfying the contact area or thickness range in the above range is electrically connected to the first electrode pad part 107 so that the power applied to the first electrode pad part 107 forms an equipotential. You can do that. In addition, the second conductive layer 110, when viewed from the normal direction of the substrate layer 101, the second electrode pad section area is 1 mm ² to 100mm ^2, 1 mm in contact with the 108 ² To 80 mm ² or 2 mm ² To 50 mm ² . In addition, the thickness of the second conductive layer 110 may be in the range of 0.1 μm to 10 μm, 0.5 μm to 8 μm, or 1 μm to 5 μm. The second conductive layer 110 that satisfies the contact area or the thickness range of the above range is electrically connected to the second electrode pad part 108 so that the power applied to the second electrode pad part 108 forms an equipotential. You can do that.

In addition, in the embodiment of the present application, the first conductive layer 109 or the second conductive layer 110 may be present inside the device portion 105. That is, the first conductive layer 109 and the second conductive layer 110 are formed to exist not only on the outside of the device 105 but also on the inside thereof, and in forming the equipotential, the outside of the device portion 105 is minimized. Can be. In the conventional equipotential forming method using the anisotropic conductive film (ACF), the bonding of the anisotropic conductive film had to occupy a part of the outside of the element portion 105. The predetermined portion corresponds to the bezel space when the organic electronic device is formed in a display form or the like. Therefore, the conventional method has been limited in manufacturing a display having a small bezel or the like. The organic electronic device according to the present application forms the first conductive layer 109 and the second conductive layer 110 to be present inside the device portion, and thus may be applied to a display or an illumination having a small bezel.

In one example, the first conductive layer 109 and the second conductive layer 110 may be electrically isolated. A first conductive layer connected to each of the first electrode pad portion 107 electrically connected to the first electrode layer 102 and the second electrode pad portion 108 electrically connected to the second electrode layer 104. Since the 109 and the second conductive layer 110 are respectively connected to the anode or the cathode, they must be electrically isolated. The method of electrically insulating is not particularly limited and can be isolated using the insulating layer 111.

In an embodiment of the present application, the organic electronic device further includes an insulating layer 111 that electrically isolates the first conductive layer 109 and the second conductive layer 110 while sealing the side surface of the device portion 105. It may include. The first conductive layer 109 or the second conductive layer 110 may be formed on the insulating layer 111. The insulating layer 111 may include a thermosetting resin or a photocuring resin. The insulating layer 111 is formed on the side surface of the device portion 105, and thus, not only serves to seal the step difference between the metal cover film 106 and the encapsulation layer 112, which will be described later. It can serve to block. The material constituting the insulating layer 111 is a non-conductive material, and may be a material known in the art.

In an embodiment of the present application, the organic electronic device may further include an encapsulation layer 112 between the device portion 105 and the metal cover film 106. The encapsulation layer 112 may be formed to cover the entire surface of the device portion 105. The encapsulation layer 112 can prevent penetration of moisture or oxygen into the element portion 105, and the material thereof is not particularly limited, and a known material can be used. In one example, the encapsulation layer 112 is an acrylic resin, epoxy resin, silicone resin, fluorine resin, styrene resin, polyolefin resin, thermoplastic elastomer, polyoxyalkylene resin, polyester resin, polyvinyl chloride resin, polycarbonate resin , Polyphenylene sulfide resins, polyamide resins, or mixtures thereof.

In one example, the metal cover film 106 may have a specific resistance in the range of 10 ⁻⁷ to 10 ⁻⁴ Ωcm. The metal cover film 106 may be electrically connected to the first conductive layer 109 or the second conductive layer 110 while encapsulating the device portion 105 to serve as a wiring electrode. Accordingly, the metal cover film 106 may form an equipotential over the entire area of the organic electronic device. Therefore, by using the metal cover film 106 of the above-described resistivity range, it is possible to implement the equipotential more effectively. The material constituting the metal cover film 106 is not particularly limited as long as the specific resistance range is satisfied, and may include Cu, Al, or Fe—Ni alloy.

In one example, the type of the base layer 101 of the organic electronic device is not particularly limited, and a suitable known material may be used. For example, when manufacturing a bottom emission type organic electronic device, a light transmissive substrate layer, for example, a substrate layer having a transmittance of 50% or more with respect to light in a visible region may be used. As a light transmissive base material layer, a glass base material layer or a transparent polymer base material layer can be illustrated. As the glass base layer, base layers such as soda lime glass, barium / strontium-containing glass, lead glass, aluminosilicate glass, borosilicate glass, barium borosilicate glass, or quartz can be exemplified, and as the polymer base layer, PC ( Examples include a base layer including polycarbonate, acrylic resin, polyethylene (poly (ethylene terephthatle) (PET), poly (ether sulfide) (PES), polyimide (PI), poly (ethylene naphthalate), or polysulfone (PS). It may be, but is not limited thereto. In addition, for example, in the case of providing a top emission type device, the base layer 101 does not necessarily need to be a transparent base layer, and if necessary, aluminum or the like is formed on the surface of the base layer 101. The reflective base layer in which the reflective layer using this is formed can also be used.

In addition, in the embodiment of the present application, the base layer 101 may be a flexible base layer. That is, the organic electronic device including the flexible substrate layer may be used to manufacture the flexible organic electronic device. As used herein, the term flexible may refer to a property of bending when an elastic body receives rotational force from the outside. Accordingly, the flexible base layer may mean a base layer having a bending property when applied to the outside.

In the organic electronic device of the present application, for example, the organic layer 103 including at least a light emitting layer may have a structure interposed between the hole injection electrode layer and the electron injection electrode layer. For example, when the electrode layer on the substrate is a hole injection electrode layer, the opposite electrode layer may be an electron injection electrode layer. On the contrary, when the electrode layer on the substrate is an electron injection electrode layer, the opposite electrode layer may be a hole injection electrode layer.

The organic layer 103 present between the electron and hole injection electrode layers may include at least one light emitting layer. The organic layer may include a plurality of light emitting layers of two or more layers. When two or more light emitting layers are included, the light emitting layers may have a structure divided by an intermediate electrode layer or a charge generating layer (CGL) having charge generation characteristics.

The light emitting layer can be formed using, for example, various fluorescent or phosphorescent organic materials known in the art. Examples of the material of the light emitting layer include tris (4-methyl-8-quinolinolate) aluminum (III) (tris (4-methyl-8-quinolinolate) aluminum (III)) (Alg3), 4-MAlq3 or Gaq3. Alq series materials, C-545T (C ₂₆ H ₂₆ N ₂ O ₂ S), DSA-amine, TBSA, BTP, PAP-NPA, Spiro-FPA, Ph ₃ Si (PhTDAOXD), PPCP (1,2,3 Cyclopenadiene derivatives such as, 4,5-pentaphenyl-1,3-cyclopentadiene), DPVBi (4,4'-bis (2,2'-diphenylyinyl) -1,1'-biphenyl), distyryl Benzene or derivatives thereof or DCJTB (4- (Dicyanomethylene) -2-tert-butyl-6- (1,1,7,7, tetramethyljulolidyl-9-enyl) -4H-pyran), DDP, AAAP, NPAMLI,; Or Firpic, m-Firpic, N-Firpic, bon ₂ Ir (acac), (C ₆ ) ₂ Ir (acac), bt ₂ Ir (acac), dp ₂ Ir (acac), bzq ₂ Ir (acac), bo _{2 Ir (acac), F 2} Ir (bpy), F 2 Ir (acac), op 2 Ir (acac), ppy 2 Ir (acac), tpy 2 Ir (acac), FIrppy (fac-tris [2- ( 4,5'-difluorophenyl) pyridine-C'2, N] iridium (III)) or Btp ₂ Ir (acac) (bis (2- (2'-benzo [4,5-a] thienyl) pyridinato-N, Phosphorescent materials such as C3 ') iridium (acetylactonate)) and the like can be exemplified, but is not limited thereto. The light emitting layer includes the material as a host, and further includes perylene, distyrylbiphenyl, DPT, quinacridone, rubrene, BTX, ABTX, or DCJTB. It may have a host-dopant system including a dopant.

The light emitting layer can also be formed by appropriately adopting a kind exhibiting light emission characteristics among the electron accepting organic compound or the electron donating organic compound.

The organic layer 103 may be formed in various structures further including other various functional layers known in the art, as long as it includes a light emitting layer. Examples of the layer that may be included in the organic layer 103 may include an electron injection layer, a hole blocking layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.

Various materials for forming a hole or electron injection electrode layer and an organic layer, for example, a light emitting layer, an electron injection or transport layer, a hole injection or transport layer, and a method of forming the same are known and can be used without limitation.

The present application also relates to a method for manufacturing the aforementioned organic electronic device. In the manufacturing method, the element portion 105 in which the first electrode layer 102, the organic layer 103, and the second electrode layer 104 are sequentially stacked is formed on the substrate layer 101, and the element portion 105 is formed. The metal cover film 106 is formed on the upper portion of the first electrode pad portion 107 and the metal cover film 106 which is electrically connected to the first electrode layer 102 at the outside of the device portion 105. ) And a second electrode pad electrically printed with the first conductive layer 109 which is electrically connected to form an equipotential, and electrically connected with the second electrode layer 104 outside the device portion 105. And printing the second conductive layer 110 that is electrically connected to form an equipotential with the portion 108.

In one example, the organic electronic device according to the present application may be a bottom emission type or a top emission type.

The present application also relates to an illumination including the aforementioned organic electronic device. In addition, the present application relates to a display device including the organic electronic device described above.

The organic electronic device according to the present application may have a thin thickness and a small bezel while forming a large area surface light source while preventing luminance unevenness due to voltage drop.

1 is a cross-sectional view of an organic electronic device according to the present application.

101: substrate layer
102: first electrode layer
103: organic layer
104: second electrode layer
105: element
106: metal cover film
107: first electrode pad portion
108: second electrode pad portion
109: first conductive layer
110: second conductive layer
111: insulation layer
112: encapsulation layer

Claims

Base layer; An element part formed on the substrate layer and including a first electrode layer, an organic layer, and a second electrode layer sequentially stacked; A metal cover film formed on an upper portion of the element portion to encapsulate the element portion; A first electrode pad part electrically connected to the first electrode layer outside the device part; A second electrode pad part electrically connected to the second electrode layer from the outside of the device part; A first conductive layer electrically connected to the metal cover film and the first electrode pad part outside the element part to form an equipotential with the metal cover film and the first electrode pad part; And a second conductive layer electrically connected to the second electrode pad portion outside the element portion to form an equipotential with the second electrode pad portion.

The organic electronic device of claim 1, wherein the first and second electrode pad parts are formed so that power can be applied in all directions outside the device part.

The organic electronic device of claim 1, wherein the first and second conductive layers have a specific resistance in a range of 10 ⁻⁷ to 10 ⁻⁴ Ωcm.

The method of claim 1, wherein the first conductive layer, the organic electronic device is in an area of from 5 mm ² to 100mm ² in contact with the first electrode pad portion when viewed from the normal direction of the substrate layer.

The organic electronic device of claim 1, wherein the thickness of the first conductive layer is in a range of 0.1 μm to 10 μm.

The method of claim 1 wherein the second conductive layer, the organic electronic device is in a range of 1 mm ² to 100mm ^2, the area in contact with the second electrode pad portion when viewed from the normal direction of the substrate layer.

The organic electronic device of claim 1, wherein the thickness of the second conductive layer is in a range of 0.1 μm to 10 μm.

The organic electronic device of claim 1, wherein the first conductive layer or the second conductive layer is further present inside the device portion.

The organic electronic device of claim 1, wherein the first conductive layer and the second conductive layer are electrically isolated from each other.

The organic electronic device of claim 1, wherein the first or second conductive layer comprises silver (Ag).

The organic electronic device according to claim 1, further comprising an insulating layer electrically insulating the first conductive layer and the second conductive layer while sealing the side surface of the element portion.

The organic electronic device of claim 11, wherein the first conductive layer or the second conductive layer is formed on the insulating layer.

The organic electronic device of claim 11, wherein the insulating layer comprises a thermosetting resin or a photocuring resin.

The organic electronic device of claim 1, further comprising an encapsulation layer between the device portion and the metal cover film.

The organic electronic device of claim 1, wherein the metal cover film has a specific resistance in a range of 10 ⁻⁷ to 10 ⁻⁴ Ωcm.

On the substrate layer, an element portion in which the first electrode layer, the organic layer, and the second electrode layer are sequentially stacked is formed, and a metal cover film is formed on the element portion to seal the element portion, and the first electrode layer is formed outside the element portion. Printing a first conductive layer on the outside of the device portion to be electrically connected to the first electrode pad portion and the metal cover film to form an equipotential with the first electrode pad portion and the metal cover film electrically connected to the first electrode pad portion. And a second conductive layer on the outer side of the element portion to be electrically connected to the second electrode pad portion to form an equipotential with the second electrode pad portion electrically connected to the second electrode layer on the outer side of the element portion. An organic electronic device manufacturing method comprising printing.

An illumination comprising the organic electronic device of claim 1.

A display device comprising the organic electronic device of claim 1.