KR102040468B1

KR102040468B1 - Method for manufacturing optical element

Info

Publication number: KR102040468B1
Application number: KR1020160009154A
Authority: KR
Inventors: 김진홍; 유정선; 오동현; 민성준; 김정운; 임은정
Original assignee: 주식회사 엘지화학
Priority date: 2016-01-26
Filing date: 2016-01-26
Publication date: 2019-11-05
Also published as: KR20170089136A

Abstract

The present application relates to a method for manufacturing an optical element, an optical element and the use of the optical element. In the method of manufacturing the optical device of the present application, since the optical device is manufactured by a process of bonding the upper substrate and the mold substrate to each other in the presence of the optical functional layer using an adhesive, a constant cell gap can be maintained. The optical device manufactured by the manufacturing method may be applied to a large area film cell, may be implemented as a flexible device, and may be advantageously applied to a roll-to-roll process after manufacturing. Such an optical element may be applied to various display devices such as an LCD.

Description

Method for manufacturing optical element {Method for manufacturing optical element}

The present application relates to a method for manufacturing an optical element, an optical element and the use of the optical element.

Recently, display devices such as LCDs are being developed as flexible devices due to light weight, design convenience, and damage prevention, and are being considered for roll-to-roll process, which is advantageous for low-cost mass production. The use of a film-based flexible substrate is essential for the implementation of the flexible device and the application of a roll-to-roll process. In order to apply the flexible substrate to display devices such as LCDs, the cell gap of the upper and lower substrates may be maintained to prevent the liquidity of liquid crystals. Adhesion is an important factor.

In one of these methods, Non-Patent Document 1 forms a mold layer patterned in a columnar shape on one substrate, stamps an adhesive on the upper surface of the columnar shape, and then adheres to the opposite substrate to form a cell, and between the two substrates. The manufacturing method of the liquid crystal cell which injects a liquid crystal into this is disclosed. However, when manufacturing a film cell by the same method as in Non-Patent Document 1, since the liquid crystal is injected after completion of the cell, it is not easy to maintain a constant cell gap for reasons such as flexibility of the substrate, and in particular, to apply to a large area film cell. Is not easy.

"Tight Bonding of Two Plastic Substrates for Flexible LCDs", SID Symposium Digest, 38, pp. 653-656 (2007)

The present application provides a method of manufacturing an optical element, an optical element and the use of the optical element.

The present application relates to a method of manufacturing an optical device. In one example, the present application includes bonding a mold substrate including an upper substrate and a lower substrate on which a mold layer patterned in a pillar shape is formed, and the bonding process includes applying an adhesive formed on an upper surface portion of the pillar shape. It is performed by attaching to a board | substrate and relates to the manufacturing method of the optical element performed in the state in which an optical functional layer exists between an upper board | substrate and a mold board | substrate.

1 exemplarily shows a method of manufacturing the optical element. As shown in FIG. 1, the manufacturing method includes bonding a mold substrate including an upper substrate 104 and a lower substrate 101 on which a mold layer 102 patterned in a pillar shape is formed. The process may be performed by attaching the adhesive 103 formed on the upper surface of the columnar shape to the upper substrate 101, and may be performed in a state in which the optical functional layer 105 exists between the upper substrate 104 and the mold substrate. .

According to the manufacturing method of the optical device of the present application, the process of bonding the upper substrate and the mold substrate in the state in which the optical functional layer is present, it is possible to effectively maintain a constant cell gap even when using a flexible substrate.

In the manufacturing method, the upper substrate or lower substrate may comprise a base film. As the base film, a material of a known base film can be used without particular limitation. For example, an inorganic film such as a glass film, a crystalline or amorphous silicon film, a quartz or an indium tin oxide (ITO) film, a plastic film, or the like may be used, and a plastic film may be used in terms of a flexible device implementation.

Examples of the plastic film include triacetyl cellulose (TAC); COP (cyclo olefin copolymer) such as norbornene derivatives; Poly (methyl methacrylate); PC (polycarbonate); PE (polyethylene); PP (polypropylene); PVA (polyvinyl alcohol); DAC (diacetyl cellulose); Pac (Polyacrylate); PES (poly ether sulfone); PEEK (polyetheretherketon Polyphenylsulfone (PPS), polyetherimide (PEI); polyethylenemaphthatlate (PEN); polyethyleneterephtalate (PET); polyimide (PI); polysulfone (PSF); polyarylate (PAR) or amorphous fluorocarbon resin, but is not limited thereto. no.

On one surface of the base film, a coating layer of a silicon compound such as gold, silver, silicon dioxide or silicon monoxide, or a coating layer such as an antireflection layer may be present if necessary.

In the manufacturing method, the upper substrate or lower substrate may further comprise an electrode layer. In one example, the electrode layer may be present on one surface of the base film.

For example, the electrode layer may be formed by depositing a conductive polymer, a conductive metal, a conductive nanowire, or a metal oxide such as indium tin oxide (ITO). The electrode layer may be formed to have transparency. In this field, various materials and forming methods capable of forming a transparent electrode layer are known, and all of these methods can be applied. If necessary, the lower electrode layer may be suitably patterned.

In one example, the lower substrate may include the lower base film and the lower electrode layer on one surface of the lower base film. In another example, the lower electrode layer may be formed on the side of the optical functional layer. In addition, in the manufacturing method, the upper substrate may include an upper base film and an upper electrode layer on one surface of the upper base film. In one example, the upper electrode layer may be formed on the side of the optical functional layer. 2 exemplarily shows an optical element that can be manufactured from a lower and an upper substrate as in the above example.

In the manufacturing method, the process of bonding the upper substrate and the mold substrate may be performed by an adhesive formed on the upper surface portion of the pillar shape. In one example, the bonding process may be performed by attaching a columnar upper surface portion to the upper substrate through the adhesive.

Each region of the mold layer patterned in the shape of a column in the present specification may be referred to as the term top, side and bottom. 3 is a schematic view of a mold substrate showing the top surface portion H, the side surface portion S, and the bottom surface portion L of the patterned mold layer 102 formed on the lower substrate 101. FIG. 3A is a schematic diagram of the front face of the mold substrate, FIG. 3B is a schematic diagram of the upper surface of the mold substrate, and FIG. 3C is a schematic diagram of the side surfaces of the mold substrate. That is, the pillar shape of the mold layer patterned in the columnar shape can be seen as consisting of the upper surface portion (H) and the side surface portion (S), the area other than the columnar shape, for example, the bottom surface of the mold layer is the bottom surface portion ( L), and the bottom portion L may or may not be formed according to a method of forming a patterned mold layer.

The patterned mold layer may comprise a curable resin. As curable resin, a well-known curable resin can be used without a restriction | limiting in particular. For example, a thermosetting resin or a photocurable resin may be used as the curable resin, but is not limited thereto. As the photocurable resin, for example, an ultraviolet curable resin may be used, but is not limited thereto. As the thermosetting resin, for example, silicone resin, silicon resin, fran resin, polyurethane resin, epoxy resin, amino resin, phenol resin, urea resin, polyester resin, melamine resin, etc. may be used, but is not limited thereto. . UV curable resins typically include acrylic polymers such as polyester acrylate polymers, polystyrene acrylate polymers, epoxy acrylate polymers, polyurethane acrylate polymers or polybutadiene acrylate polymers, silicone acrylate polymers or alkyl acrylates. Polymers and the like may be used, but are not limited thereto.

The pillar shape of the patterned mold layer is present between the lower substrate and the upper substrate, and serves to maintain a gap between the upper substrate and the lower substrate. The shape of the pillar pattern of the patterned mold layer is not particularly limited as long as it is formed to maintain a proper gap between the lower substrate and the upper substrate.

That is, the height of the side portion of the pillar pattern of the patterned mold layer, the area of the upper surface portion, the spacing of the pillar pattern, the shape, the arrangement method and the like are not particularly limited and may be appropriately adjusted within a range that does not impair the object of the present application. Can be.

In one example, the mold layer may be patterned such that one or more pillar shapes are spaced apart from each other, or the partition layer pillars may be patterned to form a partition, but is not limited thereto.

In addition, the cross-sectional shape of columnar shape is not specifically limited, For example, a columnar shape with a circular column, an elliptical column, or another polygonal cross section can be applied without a restriction | limiting. In addition, the shape of the partition formed by the partition column may be applied without limitation so as to have a polygonal, ellipse or other polygonal shape.

According to the exemplary embodiment of the present application, the mold layer may be patterned such that two or more pillar shapes are spaced apart from each other while having a stripe shape extending in the same direction. 3 exemplarily shows a mold layer of the above embodiment.

The height of the columnar side portion of the mold layer may be appropriately adjusted within a range similar to the gap in consideration of the gap between the desired upper substrate and the lower substrate. In addition, the area ratio of the upper surface portion of the columnar shape of the mold layer is related to the adhesive force between the upper substrate and the lower substrate, and may be appropriately adjusted in consideration of the adhesive force between the desired upper substrate and the lower substrate.

According to one embodiment of the present application, as shown in FIG. 3, when the mold layer has a stripe-shaped pillar pattern, the pillar height may be about 10 μm to 15 μm, and the length of the stripe pattern may be about 180 μm to 220 μm. The stripe spacing may be between 420 μm and 460 μm. However, the height, length and spacing of the pillar pattern are not limited thereto, and may be appropriately adjusted as necessary.

The method for forming the patterned mold layer in the manufacturing method is not particularly limited, and may be formed by applying a patterning method known in the art. For example, the patterning of the mold layer may be performed by one or more of photolithography, imprinting, coating and printing, but is not limited thereto. Hereinafter, the patterning method of the said mold layer is demonstrated concretely.

In one example, as exemplarily shown in FIG. 4, the mold layer may be patterned by photolithography. Specifically, in the photolithography method, the mold layer composition 201 is applied onto the lower substrate 101, the pattern mask 202 having the pattern of the desired mold layer is placed on the mold layer composition, and then ultraviolet light is emitted. This can be done by way of investigation. The method of applying the mold layer composition in the above is not particularly limited, for example, it may be formed by coating in a conventional coating method such as roll coating, bar coating, comma coating, inkjet coating or spin coating, but is not limited thereto. It is not. Moreover, in the photolithography system, the composition containing the curable resin mentioned above can be used as said mold layer composition. Specific matters about the curable resin may be equally applicable to the above description. In this manner, the area irradiated with ultraviolet rays of the curable composition may be cured and remain in a columnar shape, and the area not irradiated with ultraviolet rays by the pattern mask may remain in a liquid state and be removed through a washing process. The mold layer can be prepared. As a method of cleaning the mold layer composition, a method known in the art can be applied without particular limitation, and can be cleaned using, for example, IPA or DI Water. In the photolithography method, in order to easily separate the mold layer and the pattern mask after curing, a release treatment may be performed on the pattern mask, or the release paper may be placed between the mask and the layer of the mold layer composition.

In another example, as shown in FIG. 5, the mold layer may be patterned by an imprinting method. Specifically, in the imprinting method, an imprinting mold 203 having a pattern capable of applying the mold layer composition 201 on the lower substrate 101 and transferring the pattern of the desired mold layer on the mold layer composition. ) May be carried out by contacting and then removing. As the imprinting mold, an imprinting mold known in the art may be used without limitation, and for example, a soft mold may be used. As the material of the soft mold, a material of a soft mold known in the art may be applied, and for example, a flexible adhesive resin or a polydimethylsiloxane (PDMS) may be used. It is not. In the imprinting manner, a curing process for curing the mold layer composition is further performed, for example, by applying an appropriate energy for curing the mold layer composition, for example, irradiation of heat and / or light. Can be. The energy for curing can be ultraviolet light, for example. The conditions for applying the energy for curing are not particularly limited as long as the mold layer composition is carried out so that it can be cured appropriately. Irradiation of energy for curing may be performed, for example, before, simultaneously or after contacting the imprinting mold with the mold layer composition. In addition, even in the imprinting method, a mold release process may be performed on the mold for imprinting in order to easily separate the mold layer composition and / or the mold layer and the imprinting mold.

In another example, as shown in FIG. 6, the mold layer may be patterned by simultaneously applying an imprinting method and a photolithography method. In this case, the contents described in the items of the imprinting method and the photolithography method may be applied in the same manner, and for example, the pattern mask may be positioned so that the pattern mask may be masked other than the part where the pattern is formed through the imprinting mold. Can be.

In another example, as shown in FIG. 7, the mold layer may be patterned by coating or printing. Specifically, after coating or printing the mold layer composition 201 on the lower substrate 101 in a desired pillar pattern, the mold layer composition may be cured. Curing of the mold layer composition may be performed by applying appropriate energy for curing, as described above. The coating or printing method is not particularly limited and a coating or printing method known in the art may be applied. For example, inkjet coating, screen printing, etc. may be applied, but is not limited thereto.

In one example, the manufacturing method may further include forming an alignment layer. The alignment layer may be formed, for example, on a mold layer of the mold substrate, on an electrode layer of the upper substrate, or on both the mold layer of the mold substrate and the electrode layer of the upper substrate.

As the alignment layer, an alignment layer known to be capable of exhibiting an orientation characteristic by a non-contact method such as irradiation of linearly polarized light including a contact alignment layer or a photoalignment layer compound such as a rubbing alignment layer may be used. It doesn't happen.

As the alignment layer, a vertical alignment layer or a horizontal alignment layer may be used. Since the alignment film has alignment performance with respect to adjacent liquid crystals, as described below, when the optical functional layer includes a liquid crystal, the vertical alignment film or the horizontal alignment film may be selected and used in consideration of the initial alignment state of the liquid crystal. In the manufacturing method, the adhesive may be formed on the columnar upper surface portion of the mold layer patterned by the transfer process. In one example, the adhesive transfer process may be performed by a process of stamping a columnar upper surface portion onto the adhesive layer. As used herein, the term "stamping" means pressing a mold having an uneven shape against a predetermined material to form a pattern therein. The mold having the concave-convex shape may mean a patterned mold layer, and the predetermined material may mean an adhesive layer. In another example, the adhesive may be formed on the upper surface of the columnar shape by a gravure coating method, but is not limited thereto.

As used herein, the term "Adhesvie" may refer to materials used to bond objects together. The adhesive can be broadly divided into a structural adhesive and a pressure sensitive adhesive. As used herein, the term "structural adhesive" may refer to an adhesive that needs to be hardened by evaporation of a solvent, ultraviolet radiation reaction, chemical reaction, or cooling in order to create continuous adhesion. As used herein, the term "pressure sensitive adhesive" may refer to an adhesive which can be adhered using only a light pressure for attaching the adhesive to the adhesive surface without using water, solvent heat, or the like, and such adhesive may be referred to as a pressure-sensitive adhesive. Can be. As the adhesive in the above production method, a structural adhesive or a pressure-sensitive adhesive may be used without limitation. As the adhesive, for example, a known adhesive such as an acrylic adhesive, a silicone adhesive, a rubber adhesive, or a urethane adhesive can be used without particular limitation.

In one example, the adhesive may be an optically clear adhesive. As a specific example, the adhesive may be an OCR (Optically Clear Resin) adhesive or an OCA (Optically Clear Adhesive) adhesive. The OCR adhesive may correspond to the structural adhesive, and the OCA adhesive may correspond to the pressure sensitive adhesive. The OCR adhesive may be provided, for example, in a liquid state, and the OCA adhesive may be provided, for example, in a solid, semi-solid or elastic state.

The thickness of the adhesive can be appropriately adjusted within a range that does not impair the purpose of the present application. In one example, the adhesive may have a thickness of 1 μm to 3 μm. More specifically, the upper limit of the thickness of the adhesive may be, for example, 3 μm or less, 2.75 μm or less, 2.5 μm or less, 2.25 μm or less, or 2 μm or less. In addition, the lower limit of the thickness of the pressure-sensitive adhesive may be, for example, 1 µm or more, 1.25 µm or more, 1.5 µm or more, or 1.75 µm or more. When the thickness of the adhesive is within the above range, immiscibility with the material of the optical functional layer and adhesion with the patterned mold layer can be properly maintained. Moreover, when the thickness of an adhesive agent exists in the said range, an adhesive agent can be uniformly transferred to the upper surface part of a mold layer.

As one specific example, the adhesive may use an OCR adhesive. The OCR adhesive may exhibit adhesive force, for example, by bonding the adhesive object through the adhesive and curing the adhesive. As one specific example, in the manufacturing method, the bonding force may be exhibited by curing the OCR adhesive after bonding the upper substrate and the mold substrate together.

8 exemplarily shows a method of manufacturing an optical element using an OCR adhesive. In the manufacturing method of FIG. 8, the stamping process 8A, the bonding process 8B, and the adhesive curing process 8C may be sequentially performed. Specifically, first, patterning is performed by stamping the lower substrate 101 on which the patterned mold layer 102 is formed on the adhesive layer 103 in the pre-cured state formed on the substrate 1031 as shown in FIG. 8A. The adhesive 103 in the state before curing is transferred to the columnar upper surface portion of the molded mold layer 102. Next, as shown in FIG. 8B, the mold substrate to which the adhesive is transferred and the upper substrate 104 are bonded to each other in the state in which the optical functional layer 105 is present. Next, as shown in FIG. 8C, a curing process of the adhesive is performed so that the adhesive 103 can exhibit adhesive force.

Since the OCR adhesive is brought into contact with the optical functional layer before curing, the OCR adhesive may properly control the physical properties of the OCR adhesive. In one example, the OCR adhesive should not be mixed with the material of the optically functional layer or swept by the material of the optically functional layer, and should also be able to maintain adequate adhesion with the patterned mold layer.

The physical properties required for the OCR adhesive can be obtained by appropriately adjusting the viscosity of the adhesive. In one example, the viscosity of the OCR adhesive may be in the range of 5000 cp to 7000 cp. More specifically, the lower limit of the viscosity of the OCR adhesive is 5000 cp or more, 5100 cp or more, 5200 cp or more, 5300 cp or more, 5400 cp or more, 5500 cp or more, 5600 cp or more, 5700 cp or more, 5800 cp or more, 5900 cp or more Or 6000 cp or more. In addition, the upper limit of the viscosity of the adhesive of OCR type is 7000 cp or less, 6900 cp or less, 6800 cp or less, 6700 cp or less, 6600 cp or less, 6500 cp or less, 6400 cp or less, 6300 cp or less, 6200 cp or less, 6100 cp or less Or 6000 cp or less. When the viscosity of the OCR adhesive is within the above range, immiscibility with the material of the optical functional layer and adhesion with the patterned mold layer can be properly maintained.

As another specific example, the adhesive may use an OCA adhesive. The OCA adhesive may exhibit adhesive force, for example, by curing before bonding the adhesive object through the adhesive. As one specific example, in the manufacturing method, the adhesive force may be exhibited by curing the OCA adhesive before bonding the upper substrate and the mold substrate to each other. As one specific example, after forming the OCA adhesive in the pre-cured state on the columnar upper surface, the adhesive may be cured before the bonding process. As another specific example, the cured OCA adhesive may be formed on the upper surface of the columnar shape. In this case, a curing process of the adhesive may be performed before the transfer process of the adhesive, for example, a stamping process.

9 shows one such specific example of a method of manufacturing an optical element using an OCA adhesive. In the manufacturing method of FIG. 9, the stamping process 9A, the adhesive curing process 9B, and the bonding process 9C may be sequentially performed. Specifically, first, by performing a process of stamping the lower substrate 101, the patterned mold layer 102 is formed on the adhesive layer 103 formed on the substrate 1031 as shown in Figure 9A ( The adhesive 103 is transferred to the upper surface of the columnar shape of 102. Next, as shown in FIG. 9B, a curing process is performed such that the adhesive 103 may exhibit adhesive force. Next, the mold substrate and the upper substrate 104 on which the adhesive 103 is cured as shown in FIG. 9C are bonded to each other in the state in which the optical functional layer 105 is present.

10 shows another example of the above-mentioned specific example of the method of manufacturing the optical element using the OCA adhesive. In the manufacturing method of FIG. 10, the adhesive curing step 10A, the stamping step 10B, and the bonding step 10C may be sequentially performed. Specifically, first, as shown in FIG. 10A, a hardening process is performed on the adhesive layer 103 formed on the substrate 1031 to give an adhesive force. Next, as shown in FIG. 10B, a pillar shape of the patterned mold layer 102 is formed by performing a process of stamping the lower substrate 101 on which the patterned mold layer 102 is formed on the cured adhesive layer 103. The hardened adhesive 103 is transferred to the upper surface portion of the. Next, as shown in FIG. 10C, the mold substrate and the upper substrate 104 on which the adhesive 103 is cured are bonded to each other in the state in which the optical functional layer 105 is present.

Since the OCA adhesive is cured and then comes into contact with the optical functional layer, there is no problem of mixing with the material of the optical functional layer or being swept by the material of the optical functional layer. However, since the bonding process of the upper substrate and the mold substrate is performed in a state where the optical functional layer is present between the upper substrate and the mold substrate, the decrease in adhesion force due to contamination due to the material of the optical functional layer at the interface with the upper substrate is minimized. It is necessary to do

The above properties required for the OCA adhesive can be obtained by appropriately adjusting the surface energy of the adhesive.

In one example, the surface energy of the OCA adhesive may be lower than the surface energy of the optically functional layer. According to one embodiment of the present application, a liquid crystal layer may be used as the optical functional layer, in which case the surface energy of the OCA adhesive may be about 5 mN / m to 38 mN / m or less. More specifically, the upper limit of the surface energy of the OCA adhesive may be 35 mN / m or less, 30 mN / m or less, 25 mN / m or less, 20 mN / m or less, 15 mN / m or less or 10 mN / m or less. . In addition, the lower limit of the surface energy of the OCA adhesive may be, for example, 5 mN / m or more, mN / m or more, 6 mN / m or more, 7 mN / m or more or 8 mN / m or more. The surface energy of the OCA adhesive may be prepared by preparing a mold substrate on which the OCA adhesive is transferred as a sample, and measured by Owens-Wendt method through static contact angle measurement using a droplet analyzer (DSA 100, KRUSS). When the surface energy of the OCA adhesive is within the above range, it is possible to minimize the decrease in adhesion due to contamination due to the material of the optical functional layer at the interface with the upper substrate.

In the above production method, for example, a curable adhesive may be used as the adhesive. In one example, the adhesive may be a curable adhesive known in the art to be used as an OCR or OCA adhesive. As used herein, the term “curing” may refer to a process in which the composition expresses adhesiveness or tackiness through physical or chemical action or reaction of components contained in the curable composition. As the curable adhesive, a heat curable adhesive or a photocurable adhesive may be used.

In one example, the curable adhesive can include a curable compound. As used herein, the term "curable compound" may mean a compound having one or more curable functional groups. The curable adhesive may include, for example, a thermosetting compound, a photocurable compound, or both a thermosetting compound and a photocurable compound, and the curable adhesive may be cured to express adhesiveness or adhesiveness.

In the above, the thermosetting compound or the photocurable compound means a compound in which curing is induced by application of appropriate heat or irradiation of light, respectively. In the above-mentioned "light" category, microwaves, infrared (IR), ultraviolet (UV), X-rays and gamma rays, as well as alpha-particle beam, proton beam, Neutron beam Particle beams, such as (neutron beam) or electron beam (electron beam) may be included, typically ultraviolet rays or electron beams and the like can be used. In one example, as the curable compound, an acrylic monomer, a silicone monomer, or the like may be used, but is not limited thereto, and a known monomer component known to form an adhesive may be used.

According to one embodiment of the present application, a curable OCR adhesive including an acrylic monomer may be used as the adhesive. When using a curable OCR adhesive as the adhesive, the adhesive can be cured through ultraviolet irradiation after the OCR adhesive composition is applied onto a suitable substrate. As a base material with which the said adhesive composition is apply | coated, a fluorine-type release film can be used, for example.

The ultraviolet irradiation may be performed by, for example, irradiating ultraviolet rays having an intensity of 700 mJ / cm ² to 1300 mJ / cm ² at a speed of 1 m / min to 5 m / min. More specifically, the UV irradiation is 750 mJ / cm ² to 1250 mJ / cm ² , 800 mJ / cm ² to 1200 mJ / cm ² , 850 mJ / cm ² to 1150 mJ / cm ² , 900 mJ / cm ² to UV light having an intensity of 1100 mJ / cm ² or 950 mJ / cm ² to 1050 mJ / cm ² is 1 m / min to 4 m / min, 2 m / min to 5 m / min or 2 m / min to 4 m can be performed at a rate of / min. When ultraviolet irradiation is performed at the strength and speed, the curable OCR adhesive may be appropriately cured to exhibit adhesiveness.

In addition, if desired, the thermal drying may be performed after applying the adhesive composition and before irradiating ultraviolet rays. The thermal drying may be performed, for example, at 90 ° C. to 150 ° C. for 3 minutes to 7 minutes. When thermal drying is performed at the temperature and time, the OCR curable adhesive may be appropriately cured so as to exhibit adhesiveness.

According to another embodiment of the present application, as the adhesive, a curable OCA adhesive including a silicone monomer may be used. When using a curable OCA adhesive as the adhesive, the OCA adhesive composition can be applied onto a suitable substrate and the adhesive cured through thermal curing. As a base material with which the said adhesive composition is apply | coated, a fluorine-type release film can be used, for example.

The thermal curing may be performed, for example, at 100 ° C. to 160 ° C. for 1 minute to 5 minutes. More specifically, the thermal curing is, for example, at a temperature of 105 ℃ to 155 ℃, 110 ℃ to 150 ℃, 115 ℃ to 145 ℃, 120 ℃ to 140 or 125 ℃ to 135 ℃, 1 minute to 4 minutes, It may be performed for 2 to 5 minutes or for 2 to 4 minutes. When the thermal curing is performed at the temperature and time, the curable OCA adhesive may be appropriately cured so as to exhibit adhesiveness.

In the above production method, the optical functional layer may be present between the upper substrate and the mold substrate. As one specific example, the optical functional layer may be present on the mold substrate before the bonding process of the upper substrate and the mold substrate. In this case, the optical functional layer may be formed by a process such as coating on the mold substrate before the bonding process of the upper substrate and the mold substrate. As another specific example, the optical functional layer and the upper substrate may be bonded together on a mold substrate. In this case, the optical functional layer and the upper substrate may be bonded onto the mold substrate by a process such as squeegee laminating.

As used herein, the term "optical functional layer" may mean a layer positioned between the upper portion of the optical element and the mold substrate and formed to transmit or block light or emit light depending on whether external action is applied. have.

As used herein, the term "external action" may mean any factor external to that may affect the behavior of a material included in the optical functional layer, for example, a light modulating material or a light emitting material, for example, an external voltage. Can be. Therefore, the state without external action may mean a state without application of an external voltage.

The optical functional layer and the material included therein may vary in specific types depending on the driving mode and the principle of the display device. In one example, the optical functional layer may be a light modulation layer comprising a light modulating material or a light emitting layer comprising a light emitting material.

In one example, the optical functional layer can be a light modulation layer. As used herein, the term "light modulation layer" may refer to a layer including a light modulation material capable of transmitting or blocking light depending on whether external action is applied. In one example, the light modulation layer may be a liquid crystal layer, an electrochromic material layer, a photochromic material layer, an electrophoretic material layer or a dispersed particle alignment layer, but is not limited thereto. Hereinafter, a specific example will be described for the above-described light modulation layer, but the configuration of the light modulation layer is not limited to the following, and the contents known in the art with respect to the light modulation layer may be applied without limitation to the present application. Can be.

The liquid crystal layer is a layer containing a liquid crystal compound. The liquid crystal compound may be present in the liquid crystal layer so that the alignment direction is changed depending on whether external action is applied. As the liquid crystal compound, any kind of liquid crystal compound can be used as long as its orientation can be changed by the application of an external action. For example, a smectic liquid crystal compound, a nematic liquid crystal compound, or a cholesteric liquid crystal compound may be used as the liquid crystal compound. In addition, the liquid crystal compound may be, for example, a compound having no polymerizable group or a crosslinkable group so that the orientation direction thereof can be changed by application of external action. The driving mode of the liquid crystal layer includes, for example, a dynamic scattering (DS) mode, an in-plane switching (IPS) mode, a vertical alignment (VA) mode, a twisted nematic (TN) mode, and a super twisted nematic (STN) mode. The driving mode of the known liquid crystal panel can be applied.

In one example, the liquid crystal layer may be a polymer network liquid crystal layer. The polymer network liquid crystal layer is a higher concept including a polymer dispersed liquid crystal layer, a polymer stabilized liquid crystal layer, and the like. The polymer network liquid crystal layer may include, for example, a liquid crystal region including a polymer network and a liquid crystal compound dispersed in a phase separated state from the polymer network. The liquid crystal compound may be present in the polymer network such that the orientation is switchable. The polymer network may be a polymer network of precursors including a polymerizable or crosslinkable compound, and the polymerizable or crosslinkable compound may form a polymer network in a polymerized state or in a crosslinked state. As the polymerizable or crosslinkable compound, for example, a compound having a methacryloyl group may be used, but is not limited thereto.

In another example, the liquid crystal layer may be a pixel isolated liquid crystal layer (PILC). The pixel-isolated liquid crystal layer refers to a liquid crystal layer in which a partition structure for maintaining a gap of a cell is introduced for each pixel. The pixel-isolated liquid crystal layer may include a liquid crystal compound whose alignment direction may be changed by a signal applied from the outside. The pixel isolated liquid crystal layer can also adjust the light transmittance by using the alignment state of such a liquid crystal compound.

The electrochromic material layer uses a phenomenon in which the light transmittance of the electrochromic material is changed by, for example, an electrochemical redox reaction. The electrochromic material may be colored in the state in which the electrical signal is applied, and may be colored in the state in which the electrical signal is applied, thereby adjusting the light transmittance.

The photochromic material layer may vary the light transmittance by using a phenomenon in which the binding state of the photochromic material is changed and the color is reversibly changed when light of a specific wavelength is irradiated. In general, the photochromic material is colored when exposed to ultraviolet rays and becomes inherently pale when irradiated with visible light, but is not limited thereto.

The layer of electrophoretic material may vary the light transmittance, for example, by the combination of the medium liquid and the electrophoretic material. In one example, as the electrophoretic material, particles having a positive (+) or negative (-) charge and having a color may be used, and are applied to two electrodes located above and below the layer of the electrophoretic material. Electrophoretic particles may be rotated according to the voltage, or the light transmittance may be adjusted in a manner of moving closer to the electrode having different polarities, but the present invention is not limited thereto.

The dispersed particle alignment layer includes, for example, a structure in which a thin film laminate of nano-sized rod-shaped particles is suspended in a liquid crystal. The dispersed particle alignment layer may, for example, exist in a state in which floating particles are not aligned in the state in which no external signal is applied, thereby blocking and absorbing light, and aligning the floating particles in the state in which the external signal is applied to pass the light. However, the present invention is not limited thereto.

The light modulating layer may further include a dichroic dye in terms of adjusting light transmittance variable characteristics. As used herein, the term "dye" may mean a material capable of intensively absorbing and / or modifying light in at least part or the entire range within a visible light region, for example, in the wavelength range of 400 nm to 700 nm, The term “dichroic dye” may refer to a material capable of anisotropic absorption of light in at least part or the entire range of the visible light region. As a dichroic dye, black dye can be used, for example. Such dyes are known, for example, but not limited to azo dyes, anthraquinone dyes, and the like.

For example, when the liquid crystal layer includes a dichroic dye, the light modulating layer may be appropriately selected within a range that does not impair the purpose of the present application. For example, the dichroic dye with respect to 100 parts by weight of the liquid crystal layer may be included in a ratio of 0.1 parts by weight to 3 parts by weight. More specifically, the upper limit of the ratio of the dichroic dye to 100 parts by weight of the liquid crystal layer is, for example, 3.0 parts by weight or less, 2.8 parts by weight or less, 2.6 parts by weight or less, 2.4 parts by weight or less, 2.2 parts by weight or less, and 2 parts by weight. Or less than 1.8 parts by weight or less than 1.6 parts by weight. The lower limit of the dichroic dye to 100 parts by weight of the liquid crystal layer is, for example, 0.3 parts by weight or more, 0.5 parts by weight or more, 0.7 parts by weight or more, 0.9 parts by weight or more, 1.1 parts by weight or more, 1.3 parts by weight or more. It may be 1.5 parts by weight or more. However, the content ratio of the dichroic dye is not limited to the above, and may be appropriately adjusted in consideration of the desired permeability variable properties.

According to an embodiment of the present application, the optical functional layer may be a liquid crystal layer driven in a dynamic scattering mode. The dynamic scattering mode may refer to a liquid crystal mode inducing an electro hydro dynamic instability (EHDI). In general, the dynamic scattering mode liquid crystal layer includes a liquid crystal and an additive that induces EHDI on a nematic or smetic phase. When an electric field is applied to the liquid crystal layer, convection occurs by EHDI, and when the electric field increases, a new convection structure is formed. Is transformed into the final turbulence, which strongly scatters the light for optical anisotropy and fluid motion of the liquid crystal.

Examples of the additive that causes the EHDI may include, for example, an ionic impurity, an ionic liquid, a salt, a monomer or an initiator having a reactive functional group, and the like. For example, 2,2,6,6-Tetramethylpiperidine-1-Oxyl free radical may be used as the ionic impurity, and for example, TMA-PF6 (Trimethylaluminum-Hexafluorophosphate) or BMIN-BF4 ( [1-butyl-3-methylimideazolium] BF4) can be used, and as a salt, for example, CTAB (Cetrimonium bromide), CTAI (Cetrimonium Iodide), CTAI3 (Cetrimonium triiodide) can be used, and a monomer having a reactive functional group. For example, a reactive mesogen having a mesogen functional group having good compatibility with liquid crystal may be used. For example, TPO may be used as an initiator, but is not limited thereto.

When the additive is included in the liquid crystal layer, the content of the liquid crystal and the additive in the liquid crystal layer may be appropriately adjusted within a range that does not impair the purpose of the present application. For example, the liquid crystal layer may be included in a ratio of 70 to 90 parts by weight of the liquid crystal and 10 to 30 parts by weight of the additive, more specifically 75 to 90 parts by weight of the liquid crystal and 10 to 25 parts by weight of the additive, relative to 100 parts by weight of the liquid crystal layer. However, the content ratio of the liquid crystal and the additive is not limited to the above, and may be appropriately adjusted in consideration of the performance of the dynamic scattering mode to be implemented.

The dynamic scattering mode liquid crystal layer may switch between a haze mode and a haze mode by adjusting an initial alignment state of the liquid crystal compound and applying an external action such as a voltage. For example, when the liquid crystal compounds are present in an aligned state, the liquid crystal layer may exhibit a haze mode, and when the liquid crystal compounds are present in an irregularly arranged state, the liquid crystal layer may exhibit a haze mode.

As used herein, the term "haze mode" may refer to a mode in which the liquid crystal layer exhibits a predetermined level or more of haze, and the term "behaze mode" may refer to a state in which light can be transmitted or a mode indicating a haze of a predetermined level or less. have.

For example, in the haze mode, the liquid crystal layer has a haze of 10% or more, 15% or more, 20% or more, 25% or more, 30% or more, 35% or more, 40% or more, 45% or more, 50% or more, 55 Or at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, or at least 95%. In the haze mode, the liquid crystal layer may have, for example, a haze of less than 10%, 8% or less, 6% or less, or 5% or less. The haze may be a percentage of the transmittance of the diffused light to the transmittance of the total transmitted light passing through the measurement object. The haze can be evaluated using a haze meter (NDH-5000SP). Haze can be evaluated in the following manner using the haze meter. That is, light is made to pass through the measurement object and to enter the integrating sphere. In this process, light is divided into diffused light (DT) and parallel light (PT) by a measurement object, and the light is reflected in an integrating sphere and collected by a light receiving element, and the haze can be measured through the light. Do. That is, the total transmitted light TT is the sum of the diffused light DT and the parallel light PT (DT + PT), and the haze is the percentage of diffused light with respect to the total transmitted light (Haze (%) = 100). X DT / TT).

The present application also relates to an optical element. In one example, the present application is an optical device manufactured by the above manufacturing method, the upper substrate; A lower substrate disposed to face the upper substrate; An optical functional layer existing between the upper substrate and the lower substrate; And a mold layer patterned in a pillar shape to maintain a gap between the upper substrate and the lower substrate, wherein the columnar upper surface portion and the upper substrate of the patterned mold layer are attached to an optical element attached by an adhesive. will be.

Details of the upper substrate, the lower substrate, the optical functional layer, the patterned mold layer, and the adhesive in the optical device may be the same as described in the method of manufacturing the optical device. In addition, the contents described in the method of manufacturing the optical element may be equally applied to additional configurations other than the above configurations.

Since the optical device of the present application is manufactured by a process of bonding the upper substrate and the mold substrate in the state in which the optical functional layer is present using an adhesive, it is possible to maintain a constant cell gap well. Such an optical device may be applied to a large area film cell, may be implemented as a flexible device, and may be advantageously applied to a roll-to-roll process after manufacture.

Such an optical element may be included and used in various display devices. The display device may be, for example, an electroluminescence display (ELD), a liquid crystal display (LCD), an electrochromic display (ECD), or a photochromic display. A PCD), an electrophoretic image display (EPD), and a suspended particle display (SPD). The method of configuring the display device is not particularly limited, and a conventional method may be applied as long as the optical element is used.

In the method of manufacturing the optical device of the present application, since the optical device is manufactured by a process of bonding the upper substrate and the mold substrate to each other in the presence of the optical functional layer using an adhesive, a constant cell gap can be maintained. The optical device manufactured by the manufacturing method may be applied to a large area film cell, may be implemented as a flexible device, and may be advantageously applied to a roll-to-roll process after manufacturing. Such an optical element may be applied to various display devices such as an LCD.

1 is a schematic diagram of a manufacturing method of an optical element of the present application.
2 is a schematic view of an optical device manufactured by the method of the present application.
3: is a schematic diagram of the front surface A, top surface B, and side surface C of a mold layer.
4-7 is a schematic diagram of the manufacturing method of a patterned mold layer.
8 is a schematic view of a method of manufacturing the optical element of the first embodiment.
9 is a schematic view of a method of manufacturing the optical element of the second embodiment.
10 is a schematic view of a method of manufacturing the optical element of the third embodiment.
11 is a graph illustrating the results of evaluation of transmittance according to the voltage of Example 1 and Comparative Example.
12 is a graph of haze evaluation results according to the voltages of Example 1 and Comparative Example.
13 is an image of the voltage OFF state (0V) and the drive state 40V of Example 1 and the comparative example.
14 is a graph illustrating results of evaluation of transmittance according to voltages of Examples 2 to 3 and Comparative Examples.
15 is a graph of haze evaluation results according to voltages of Examples 2 to 3 and Comparative Examples.
FIG. 16 is an image of the voltage OFF state (0V) and the driving state (40V) of Examples 2-3 and Comparative Example, and the mold and release paper images of Examples 2-3.

Hereinafter, the method of manufacturing the optical device will be described in more detail with reference to examples according to the present application, but the scope of the present application is not limited to the examples given below.

Measurement example 1. Viscosity Measurement

The mold substrate to which the adhesive was transferred in Example 1 was prepared as a sample, and the viscosity of the adhesive was measured at about 25 ° C. using a viscosity measuring equipment (DV-III Ultra Programmable Rheometer, Brookfield).

Measurement example 2. Surface energy measurement

The mold substrate to which the adhesive was transferred in Examples 2 to 3 was prepared as a sample, and the surface energy of the adhesive was measured by Owens-Wendt method through static contact angle measurement using a droplet type analyzer (DSA 100, KRUSS).

Specifically, the surface energy is obtained by dropping the deionized water having a known surface tension on the target sample to be measured and obtaining the contact angle of the sample five times, and obtaining the average value of the five contact angle values obtained. For example, the procedure of dropping diiodomethane, which has a known surface tension, and determining its contact angle is repeated five times to obtain an average value of five obtained contact angle values. Subsequently, the surface energy is obtained by substituting the numerical value (Strom value) of the surface tension of the solvent by the Owens-Wendt-Rabel-Kaelble method using the average value of the contact angles with deionized water and diiomethane.

The surface energy (γ ^surface ) of the sample can be calculated by considering the dispersion force between nonpolar molecules and the interaction force between polar molecules (γ ^surface = γ ^dispersion + γ ^polar ), and the polar term (γ ^polar ) at the surface energy γ ^surface The ratio of can be defined as the polarity of the surface.

Example One

An optical device was manufactured by applying the process schematic diagram of FIG. 8.

[Stamping process-8A]

After coating an OCR adhesive composition (3193HS, ShinEtsu Co., Ltd.) containing an acrylic monomer on the fluorine-based (F-based) release film to a thickness of about 3 μm, the adhesive layer 103 was thermally dried at 120 ° C. for 5 minutes. Was prepared. In addition, imprinting after applying a curable resin composition on top of a polyethylene terephthalate (PET) film (width x length = 100 nm x 100 nm) (hereinafter, the lower substrate 101) on which an indium tin oxide (ITO) layer is deposited By the process, a mold layer 102 patterned with a stripe pillar as shown in FIG. 3 was formed to prepare a mold substrate. As the curable resin, a polyester acrylate polymer was used. The height of the stripe pillar is about 10 μm, the length of the stripe pillar is about 200 μm, and the spacing of the stripe pillars is about 460 μm. After the vertical alignment layer was formed on the manufactured mold substrate, the adhesive was transferred onto the upper surface of the stripe pillar by stamping the adhesive layer 103. The thickness of the transferred adhesive is about 3 μm and the viscosity at about 25 ° C. is about 6000 cps.

[Adhesion Process-8B]

Next, an upper substrate 104 on which an indium tin oxide (ITO) layer and a vertical alignment layer were sequentially formed on a polyethylene terephthalate (PET) film (width x length = 100 nm x 100 nm) was prepared. The mold substrate and the upper substrate were bonded by squeezing and laminating a DSM (Dynamic Scattering Mode) liquid crystal composition of the optical functional layer 105 between the mold substrate and the upper substrate. The DSM liquid crystal composition of the optical functional layer 105 is a liquid crystal compound (LC7262, HCCH Co., Ltd.), an additive (HCM-021, HCCH Co., Ltd.) and an anisotropic dye (X12, BASF Co., Ltd.) LC7262: HCM-021: X 12 = 90 A dye-liquid crystal composition mixed in a weight ratio of 10: 1 was used.

Curing Process-8C

Next, the optical element 1 was manufactured by irradiating the ultraviolet-ray which has the intensity of 1000 mJ / cm <^2> at the speed | rate of 3 m / min to the upper substrate side, and hardening an adhesive agent.

Example 2

An optical device was manufactured by applying the process schematic diagram of FIG. 9.

Stamping Process-9A

An adhesive layer 103 was prepared by coating an OCA adhesive composition (SG6500A, KCC Co., Ltd.) on a fluorine-based (F-based) release film to a thickness of about 3 μm. In addition, a mold substrate was manufactured in the same manner as in Example 1. The adhesive was transferred onto the upper surface of the stripe pillar by stamping the manufactured mold substrate on the adhesive layer 103. The thickness of the transferred adhesive was about 1.8 μm.

Curing Process-9B

The adhesive was then cured by performing thermal curing of the adhesive transferred mold substrate at a temperature of about 130 ° C. for about 3 minutes. The surface energy of the adhesive after curing was 8.5 mN / m.

[Adhesion Process-9C]

Next, an optical device was manufactured by bonding the mold substrate and the upper substrate in the same manner as in Example 1.

Example 3

An optical device was manufactured by applying the process schematic diagram of FIG. 10.

Curing Process-10A

An OCA adhesive composition (SG6500A, KCC Co., Ltd.) was coated on the fluorine-based (F-based) release film to a thickness of about 3 μm to prepare an adhesive layer 103. The adhesive was then cured by thermally curing the adhesive layer at a temperature of about 130 ° C. for about 3 minutes. The surface energy of the adhesive after curing was 8.5 mN / m.

[Stamping Process-10B]

Next, a mold substrate was manufactured in the same manner as in Example 1. The adhesive was transferred to the columnar upper surface part by stamping the manufactured mold substrate on the cured adhesive layer 103. The thickness of the transferred adhesive was about 1.8 μm.

[Adhesion Process-10C]

Comparative example

An optical device was manufactured in the same manner as in Example 1, except that no adhesive was formed on the upper surface of the stripe pillar of the molded substrate.

Specifically, after applying a curable resin composition on top of a polyethylene terephthalate (PET) film (width x length = 100 nm x 100 nm) (hereinafter, the lower substrate 101) on which an indium tin oxide (ITO) layer is deposited A mold substrate was formed by forming a mold layer 102 patterned into a stripe pillar shape by a printing process, and a vertical alignment layer was formed on the mold substrate. As the curable resin, a polyester acrylate polymer was used. The height of the stripe pillar is about 10 μm, the length of the stripe pillar is about 200 μm, and the spacing of the stripe pillars is about 460 μm.

Next, an upper substrate on which an indium tin oxide (ITO) layer and a vertical alignment layer were sequentially formed on a polyethylene terephthalate (PET) film (width x length = 100 nm x 100 nm) was prepared. The mold substrate and the upper substrate were bonded by squeezing and laminating a DSM (Dynamic Scattering Mode) liquid crystal composition of the optical functional layer 105 between the mold substrate and the upper substrate. The DSM liquid crystal composition of the optical functional layer 105 is a liquid crystal compound (LC7262, HCCH Co., Ltd.), an additive (HCM-021, HCCH Co., Ltd.) and an anisotropic dye (X12, BASF Co., Ltd.) LC7262: HCM-021: X 12 = 90 A dye-liquid crystal composition mixed in a weight ratio of 10: 1 was used.

Evaluation example 1: transmittance according to voltage and Haze evaluation

Transmittance and haze according to voltage were evaluated for the optical devices manufactured in Examples and Comparative Examples. Specifically, the transmittance and haze according to the applied voltage were measured by using a haze meter (NDH-5000SP) while connecting and driving an AC power source to the upper and lower ITO layers of the optical element.

Evaluation example 2: evaluation of adhesion

Adhesion was evaluated for the optical devices prepared in Examples and Comparative Examples. Specifically, the adhesive force was evaluated by measuring a 90 degree peel force of the mold substrate and the upper substrate using a Texture Analyzer.

The transmittance and haze evaluation results and the adhesion evaluation results according to the voltages are shown in Table 1 below.

T _off T _on △ T H _off H _on △ H Peel force Example 1 69.7 40.0 29.7 12.4 46.5 34.1 0.07 Example 2 66.6 37.2 29.5 5.2 37.7 32.5 0.06 Example 3 64.2 33.2 31.0 10.0 42.4 32.4 0.06 Comparative example 72.0 43.4 28.6 3.5 42.9 39.4 - T _off : Transmittance (%) of voltage off state (0 V) T _on : Transmittance (%) at voltage 40 V ΔT: Difference between T _off and T _on (%) H _off : Voltage Off state (0 V) Haze (%) H _on : Haze (%) at 40 V ΔH: Difference between H _off and H _on (%) Peel force: unit N / cm

11 and 12 are graphs of transmittance and haze evaluation results according to voltages of Example 1 and Comparative Example, respectively. FIG. 13 is an image of the voltage off state (0 V) and the driving state (40 V) of the optical elements of Example 1 and Comparative Example observed from an upper surface. The dark portion in the 40 V image is the dynamic scattering mode (DSM) liquid crystal region, and the bright portion is the mold region. It can be seen that the liquid crystal region, which was transparent by the vertical alignment before voltage application, was driven in the DS mode by voltage application to show black due to scattering and absorption by dyes. In addition, in Example 1, interference of the liquid crystal region does not occur compared to the comparative example, and it can be confirmed that the adhesive is well transferred to the upper surface of the pillar by the stamping.

14 and 15 are graphs of transmittance and haze evaluation results according to voltages of Examples 2 to 3 and Comparative Examples, respectively. FIG. 16 is an image of the voltage off state (0 V) and the driving state (40 V) of the optical elements of Examples 2 to 3 and Comparative Example observed from an upper surface, and FIG. 16 is a diagram showing the transfer of the adhesive in Examples 2 to 3; It is the image which observed the mold release film after the image which observed the later mold layer, and the adhesive agent. Observation images of the mold layer and the release film show that the adhesive on the release film was well transferred to the upper surface of the mold layer (the blue area of the release film is the area where the adhesive has not been transferred).

101: lower substrate
1011: lower base film
1012: upper electrode layer
102: mold layer
H: Top part, S: Side part, L: Bottom part
103: adhesive
1031: description
104: upper substrate
1041: top substrate film
1042: upper electrode layer
105: optical functional layer
201: mold layer composition
202: pattern mask
203: imprinting mold

Claims

Bonding a mold substrate including an upper substrate and a lower substrate on which a mold layer patterned in a pillar shape is formed, wherein the bonding process is performed by attaching an adhesive formed on an upper surface portion of a column shape to an upper substrate, And a step of forming an alignment film on the mold layer of the mold substrate before the bonding step, wherein the optical functional layer is present between the substrate and the mold substrate.

The method of claim 1,
The upper substrate or the lower substrate is a method of manufacturing an optical element comprising a base film and an electrode layer on one surface of the base film.

The method of claim 1,
The mold layer is a manufacturing method of the optical element containing curable resin.

The method of claim 1,
The mold layer is a method of manufacturing an optical element patterned so that two or more pillar shapes are spaced apart while having a stripe shape extending in the same direction.

The method of claim 1,
The adhesive is a manufacturing method of the optical element formed in the columnar upper surface part by the transfer process.

The method of claim 5,
The transfer process of an adhesive is a manufacturing method of the optical element performed by the process of stamping a columnar upper surface part to an adhesive bond layer.

The method of claim 1,
The adhesive is an optically clear resin (OCR) adhesive or an optically clear adhesive (OCA) adhesive.

The method of claim 1,
The adhesive has a thickness of 1 μm to 3 μm.

The method of claim 7, wherein
The adhesive is an OCR adhesive, and the viscosity of the OCR adhesive is 5000 cp to 7000 cp.

The method of claim 7, wherein
The adhesive is an OCR adhesive, wherein the OCR adhesive is cured after bonding of the upper substrate and the mold substrate.

The method of claim 7, wherein
The adhesive is an OCA adhesive, and the surface energy of the OCA adhesive is lower than the surface energy of the optical functional layer.

The method of claim 7, wherein
The adhesive is an OCA adhesive, and the method for producing an optical element for curing the OCA adhesive before bonding the upper substrate and the mold substrate.

The method of claim 7, wherein
A method of manufacturing an optical element wherein the adhesive is cured after the adhesive in the cured state is formed on the upper surface of the columnar shape or the adhesive in the state before curing is formed on the upper surface of the columnar shape.

The method according to claim 10 or 12,
Curing is a method for producing an optical element which is photocuring or thermal curing.

The method of claim 14,
Thermal curing is performed for 1 minute to 5 minutes at 100 ℃ to 160 ℃.

The method of claim 1,
The optical functional layer is a manufacturing method of the optical element which is a light modulation layer or a light emitting layer.

The method of claim 16,
The light modulation layer is a liquid crystal layer, an electrochromic material layer, a photochromic material layer, an electrophoretic material layer or a dispersion particle alignment layer.

The method of claim 16,
The optical modulation layer is one selected from the group consisting of a liquid crystal layer of DS (Dynamic Scattering) mode, IPS (In-Plane Switching) mode, VA (Vertical Alignment) mode, TN (Twisted Nematic) mode and STN (Super Twisted Nematic) mode The manufacturing method of the optical element which is a liquid crystal layer of.

An optical device manufactured by the manufacturing method of claim 1,
An upper substrate; A lower substrate disposed to face the upper substrate; An optical functional layer existing between the upper substrate and the lower substrate; A mold layer patterned in a pillar shape to maintain a gap between the upper substrate and the lower substrate; And an alignment film formed on the mold layer, wherein the columnar upper surface portion and the upper substrate of the patterned mold layer are attached by an adhesive.

20. A display device comprising the optical element of claim 19.