KR102012238B1 - Method of manufacturing stretchable device using transfer process - Google Patents

Abstract

One embodiment of the present invention provides a method for manufacturing a stretchable device using a transfer process capable of mass-producing a device that can be bent as well as stretchable in the longitudinal direction and the width direction, and a stretchable device manufactured thereby. Here, the stretchable device manufacturing method using a transfer process is formed by forming an element on the upper portion of the base substrate having a first elastic modulus, attaching the transfer film to the lower portion of the base substrate, and cutting the base substrate to correspond to the element A device module having a base substrate and a device is provided, a wiring is provided on an upper portion of the target substrate having a second elastic modulus lower than the first elastic modulus, the element is disposed to face the upper portion of the target substrate, and the corresponding wiring to be connected Positioning each device module at a corresponding position, transferring the device module to an upper portion of the target substrate so that the device is electrically connected to a corresponding wiring, and peeling the transfer film from the device module.

Description

Method for manufacturing stretchable device using transfer process {METHOD OF MANUFACTURING STRETCHABLE DEVICE USING TRANSFER PROCESS}

The present invention relates to a method for manufacturing a stretchable device using a transfer process, and a stretchable device manufactured by the transfer process, and more particularly, to a transfer process capable of producing a large amount of devices that can be stretched and stretched in a longitudinal direction and a width direction. It relates to a method for manufacturing a stretchable device using and a stretchable device manufactured thereby.

BACKGROUND With the development of electronic technology, various display devices such as TVs, notebook PCs, tablet PCs, mobile phones, and the like have become common.

Recently, there has been a growing interest in flexing electronic devices, that is, flexible electronic devices. Flexible electronics (flexible electronics) is a technology that implements an electronic circuit / device that can bend or fold by mounting an electronic device on a flexible substrate such as plastic. In particular, flexible electronics are attracting attention as a next generation technology in the display field.

Along with flexible electronics, there is a need for an increasing number of electronic devices, that is, stretchable electronic devices. A flexible electronic device is a device that bends while maintaining its entire length, while a flexible electronic device is a device that not only bends but also increases in length.

Stretchable electronics are expected to enable new applications in electronics. Potential applications include electronic skins and skin sensors for moving robotic devices, wearable electronics, and bio-integrated devices. In addition, the stretchable device may be usefully used in various fields including a display or a sensor array.

A manufacturing method for mass production of such a flexible device has not been developed yet.

Republic of Korea Patent Publication No. 2016-0088489 (published Jul. 26, 2016)

In order to solve the above problems, the technical problem to be achieved by the present invention is a flexible device manufacturing method using a transfer process capable of producing a large amount of devices that can be stretched in the longitudinal direction and width direction as well as the manufacturing method and thereby It is to provide a flexible device.

The technical problem to be achieved by the present invention is not limited to the technical problem mentioned above, and other technical problems not mentioned above may be clearly understood by those skilled in the art from the following description. There will be.

In order to achieve the above technical problem, an embodiment of the present invention comprises a device forming step of forming a device on top of the base substrate having a first elastic modulus; A transfer film attaching step of attaching a transfer film to a lower portion of the base substrate; A device module preparation step of cutting the base substrate so as to correspond to the device, and preparing a device module having the cut base substrate and the device; A wiring preparation step of providing wiring on an upper portion of the target substrate having a second elastic modulus lower than the first elastic modulus; Positioning the device so as to face the upper portion of the target substrate, and positioning the device module in a target area between corresponding wires to be connected; A device module transfer step of transferring the device module to the target area on the target substrate so that the device is electrically connected to the corresponding wiring; And it provides a stretchable device manufacturing method using a transfer process comprising a transfer film peeling step of peeling the transfer film from the device module.

In an embodiment of the present disclosure, in the positioning step, the transfer module may be extended to position the device module in the target area.

In the exemplary embodiment of the present invention, in the positioning step, only the device modules to be transferred to the target area are separated by separating the device modules from the transfer film, which are not transferred to the target area, from the device modules attached to the transfer film. It may be positioned at a position corresponding to the target area.

In an embodiment of the present invention, before or after the wiring preparation step or after the device module transfer step, heat or light is applied to the target area so that the target area has a third elastic modulus higher than the second elastic modulus. It may further comprise a changing step of changing.

In an embodiment of the present disclosure, the method may further include a surface treatment step of surface treating the wires and the device modules with plasma to increase adhesion between the device modules and the wires before the device module transfer step.

In an embodiment of the present disclosure, the method may further include a conductive material preparing step of preparing a conductive adhesive material between the first electrode of the device module and the second electrode of the wiring before the device module transferring step.

In an embodiment of the present invention, after the device module transfer step, or after the transfer film peeling step, may further comprise a reflow step of curing the conductive adhesive material.

In an embodiment of the present invention, after the conductive material preparing step, further comprising a non-conductive material preparing step of providing a non-conductive adhesive material between the first electrode and the second electrode so that the conductive adhesive material is included inside. can do.

In an embodiment of the present invention, after the device module transfer step, or after the transfer film peeling step, may further comprise a reflow step of curing the conductive adhesive material and the non-conductive adhesive material.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention provides a stretchable device manufactured by a stretchable device manufacturing method using a transfer process.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention provides a base layer having a first elastic modulus on top of the base substrate, the device forming step of forming a device on the base layer; A device module preparation step of cutting the base layer so as to correspond to the device and providing a device module having the cut base layer and the device; A device module peeling step of attaching a transfer film to the upper portion of the device module to separate the device module from the base substrate; Positioning the base layer so as to face an upper portion of a target substrate having a second elastic modulus lower than the first elastic modulus, and positioning the device module in a corresponding transfer region to be transferred; A device module transfer step of transferring the device module to the transfer area; A transfer film peeling step of peeling the transfer film from the device module; And it provides a stretchable device manufacturing method using a transfer process comprising a wiring preparation step of connecting the element and the target substrate by wiring.

In an embodiment of the present invention, before the wiring preparation step, the insulating layer preparation step of providing an insulating layer having a height corresponding to the base layer on the target substrate may be further included.

In an embodiment of the present invention, in the wiring preparation step, the wiring may be provided on the base layer and the insulating layer.

In the embodiment of the present invention, in the positioning step, it is possible to extend the transfer film to position the device module in the transfer area.

In the exemplary embodiment of the present invention, in the positioning step, only the device modules corresponding to the corresponding transfer area may be separated from the transfer film by separating the device modules which do not correspond to the corresponding transfer area among the device modules attached to the transfer film. I can leave it.

In an embodiment of the present invention, before or after the positioning step or the device module transfer step, heat or light is applied to the transfer area to change the transfer area to have a third elastic modulus higher than the second elastic modulus. It may further comprise a step.

In an exemplary embodiment of the present disclosure, the method may further include a surface treatment step of surface treating the device module with plasma so as to increase the adhesion between the device module and the wire before the wiring preparation step.

In an embodiment of the present invention, in the wiring preparation step, a conductive adhesive material may be further provided between the first electrode of the device module and the second electrode of the wiring.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention provides a stretchable device manufactured by a stretchable device manufacturing method using a transfer process.

According to the embodiment of the present invention, since the device module is adhered to the stretchable transfer film, even if the device module in the state before being transferred to the target substrate does not match the position to be transferred to the target substrate, the transfer film is stretched or the target is not. By extending the substrate or selectively transferring the device module to position the device module to the position to be transferred to the target substrate, through this, the transfer process of the device module can be easily carried out, and a large number of stretchable devices Can produce.

In addition, according to the embodiment of the present invention, since the device module is transferred to the target substrate in a state in which the base substrate is directed upward, the device module can be protected from external impact. In addition, since the elastic modulus of the base substrate is higher than the elastic modulus of the target substrate, the strain applied to the device module when the target substrate is stretched and contracted can be reduced, thereby preventing damage to the device module.

It is to be understood that the effects of the present invention are not limited to the above effects, and include all effects deduced from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a flowchart illustrating a method of manufacturing a stretchable device using a transfer process according to a first embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing a stretchable device using a transfer process according to a first exemplary embodiment of the present invention.
3 is an exemplary view showing an example of a method of manufacturing a stretchable device using a transfer process according to the first embodiment of the present invention.
4 is an exemplary view showing another example of a method for manufacturing a stretchable device using a transfer process according to the first embodiment of the present invention.
5 is an enlarged view illustrating part A and B of FIG. 2.
6 is a flowchart illustrating a method of manufacturing a stretchable device using a transfer process according to a second exemplary embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a stretchable device using a transfer process according to a second exemplary embodiment of the present invention.
8 is an exemplary view showing an example of a method of manufacturing a stretchable device using a transfer process according to a second embodiment of the present invention.
9 is an exemplary view showing another example of a method for manufacturing a stretchable device using a transfer process according to a second embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is said to be "connected (connected, contacted, coupled)" with another part, it is not only "directly connected" but also "indirectly connected" with another member in between. Also includes the case where In addition, when a part is said to "include" a certain component, this means that unless otherwise stated, it may further include other components rather than excluding the other components.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, the terms “comprise” or “have” are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing a stretchable device using a transfer process according to a first embodiment of the present invention, and FIG. 2 is a process diagram illustrating a method of manufacturing a stretchable device using a transfer process according to a first embodiment of the present invention. 3 is an exemplary view showing an example of a method of manufacturing a stretchable device using a transfer process according to a first embodiment of the present invention, and FIG. 4 is a stretchable device using a transfer process according to a first embodiment of the present invention. 5 is an enlarged view illustrating another example of the manufacturing method, and FIG. 5 is an enlarged view of part A and B of FIG. 2.

First, as shown in FIGS. 1 and 2, a method of manufacturing a stretchable device using a transfer process includes a device forming step (S110), a transfer film attaching step (S120), a device module preparing step (S130), and a wire preparing step (S140). ), A positioning step S150, a device module transfer step S160, and a transfer film peeling step S170.

The device herein may include display devices, electronic skins, sensor arrays, and the like.

The device forming step S110 may be a step of forming the device 220 on the base substrate 210 having the first elastic modulus.

The base substrate 210 may have transparency, and various glass substrates such as a soda lime glass substrate, an alkali free glass substrate, or a tempered glass substrate may be applied. Further, the base substrate 210 may be made of sapphire, transparent resin material.

The base substrate 210 is sufficient to have transparency enough to confirm the position of the wiring 260 and the target region 251 of the target substrate 250 to be described later in the positioning step (S150). When the base substrate 210 has transparency, the target substrate 250 described later may have opacity.

Base substrate 210 may have a thickness of 20 ~ 30㎛. The base substrate 210 may have a first elastic modulus.

In addition, the device 220 may be a light emitting device, and may be, for example, an OLED or a micro LED, but is not limited thereto.

The device 220 may be provided together with the thin film transistor (TFT) 221. For example, the thin film transistor 221 may be provided on the base substrate 210, and the device 220 may be provided on the thin film transistor 221.

Transfer film attachment step (S120) may be a step of attaching the transfer film 230 to the lower portion of the base substrate 210.

The device module preparation step (S130) may be a step of preparing a device module 240 having the cut base substrate 211 and the device 220 by cutting the base substrate 210 so as to correspond to the device 220.

Here, although the device module 240 has been described as having a cut base substrate 211 and the device 220, the device module 240 may further include a thin film transistor 221.

The base substrate 210 may be cut by laser cutting, die sawing, or the like, and through this, the device 220 may be isolated.

The transfer film 230 may have elasticity. Therefore, the transfer film 230 may be stretched in the longitudinal direction and the width direction.

The wiring preparation step S140 may be a step of providing the wiring 260 on the target substrate 250 having a second elastic modulus lower than the first elastic modulus of the base substrate 210.

The target substrate 250 may have elasticity, and may have greater elasticity than the base substrate 210. The target substrate 250 may be stretched in the longitudinal direction and the width direction. In addition, the target substrate 250 may have transparency.

The wiring 260 may be a metal electrode, and may be provided at a position where the device module 240 is to be transferred on the target substrate 250.

The wiring 260 may have elasticity, and thus, the target substrate 250 may be expanded and contracted when the target substrate 250 is stretched.

When the wiring 260 is provided in the contracted state of the target substrate 250, the wiring 260 may also be provided in the contracted state. On the other hand, when the wiring 260 is provided in a state where the target substrate 250 is extended, the wiring 260 is also preferably provided in an extended state, whereby, when the target substrate 250 is stretched, 260 may be safely stretched in response to the stretching of the target substrate 250 while the disconnection is prevented.

Positioning step (S150) may be a step of placing the device 220 facing the upper portion of the target substrate 250, and positioning the device module 240 in the target area 251 between the corresponding wiring 260 to be connected, respectively have.

In the positioning step S150, the device module 240 may be positioned vertically above the corresponding wiring 260, more specifically, vertically above the target region 251 formed between the wirings 260.

In the present embodiment, the device module 240 may be positioned so that the device 220 faces the target substrate 250, more specifically, the target region 251 formed between the corresponding wirings 260. . That is, the process may proceed to a face-down process.

The device module transfer step S160 may be a step of transferring the device module 240 to the target area 251 on the target substrate 250 so that the device 220 is electrically connected to the corresponding wiring 260.

The device module 240 may be transferred to the target area 251 on the target substrate 250 and may be electrically connected to the wiring 260 at the same time. That is, the transfer process and the connection process of the device module 240 may be performed together.

The transfer film peeling step S170 may be a step of peeling the transfer film 230 from the device module 240.

The adhesive force between the transfer film 230 and the device module 240 may be smaller than the coupling force between the target substrate 250 and the device module 240, and thus, the device module 240 is coupled to the target substrate 250. In the transfer film 230 may be peeled from the device module 240.

According to the present invention, since the target substrate 250 has a lower elastic modulus than the base substrate 210, the extent to which the target substrate 250 is stretched may be greater than the extent to which the base substrate 210 is stretched.

Therefore, when the target substrate 250 is stretched, the wiring 260 may also be correspondingly stretched. Since the wiring 260 may adhere to the target substrate 250 as a whole, the target substrate 250 may be stretched when the target substrate 250 is stretched. Almost all of the wiring 260 can be extended.

On the other hand, the device 220, one surface may be adhered to the target substrate 250, the other surface is adhered to the thin film transistor 221 adhered to the base substrate 210. However, since the first elastic modulus of the base substrate 210 is higher than the second elastic modulus of the target substrate 250, the base substrate 210 is extended to a degree smaller than the extent to which the target substrate 250 is extended.

In particular, when the base substrate 210 is a glass substrate, the base substrate 210 may be hardly stretched. Therefore, even when the target substrate 250 is stretched, the device 220 may not adhere to the base substrate 210 and thus may not be stretched. As a result, the strain applied to the device 220 may be reduced, so that the device 220 may be reduced. Breakage can be prevented.

In addition, the base substrate 210 may protect the device 220 from external impact.

When the device 220 is a light emitting device, the light emitted from the device 220 may be emitted through the base substrate 210. The thin film transistor 221 may have a hollow shape so that light emitted from the device 220 is not blocked.

In addition, the stretchable device manufacturing method using the transfer process may further include a passivation step (S180).

The passivation step S180 may be a passivation of a surface or a junction of the stretchable device.

Meanwhile, as shown in FIG. 3, in the positioning step S150, the device module 240 may be positioned as the target region 251 to be stretched and connected to the transfer film 230.

That is, when the second interval D2 between the device modules 240 is smaller than the first interval D1 between the corresponding target regions 251 provided on the target substrate 250, the tensile force ( The transfer film 230 may be extended by pulling the transfer film 230 to both sides by operating F). In addition, by extending the transfer film 230, the second gap D2 between the device modules 240 may be equal to the first gap D1 between the target areas 251. In this state, the device module 240 may be transferred to the target area 251 by transferring the device module 240 to the target area 251.

On the other hand, although not shown, if the distance between the device module is wider than the distance between the corresponding target area provided on the target substrate, the target substrate can be extended by pulling the target substrate to both sides by applying a tensile force on the side of the target substrate. have. By extending the target substrate, the distance between the target areas can be widened so that the distance between the target areas is equal to the distance between the device modules. In this state, the device module is transferred to the target area so that the device module can be transferred to the target area.

In addition, as shown in FIG. 4, in the positioning step S150, the device module 240a that is not transferred to the target region 251 among the device modules attached to the transfer film 230 is separated from the transfer film 230. Accordingly, only the device module 240b to be transferred to the target area 251 may be left at a position corresponding to the target area 251. In this state, the device module 240b may be transferred to the target area 251 so that the device module 240b may be transferred to the target area 251.

In addition, the stretchable device manufacturing method using the transfer process according to the first embodiment of the present invention is a change step (S190), surface treatment step (S191), conductive material preparation step (S192), non-conductive material preparation step (S193) And it may further include a reflow step (S194).

The changing step S190 may be a step of changing the target region 251 to have a third elastic modulus higher than the second elastic modulus by applying heat or light to the target region 251. Accordingly, when the stretchable device is stretched, the strain acting on the device module 240 can be reduced, whereby the device 220 can be more securely protected.

The change step S190 may be performed before or after the wiring preparation step S140 or after the device module transfer step S160.

The surface treatment step S191 may be a step of surface treating the wiring 260 and the device module 240 with the plasma P so that the adhesion between the device module 240 and the wiring 260 is increased.

Plasma P surface treatment may be performed on a surface in which the wiring 260 and the device module 240 face each other. The surface treatment step S191 may be performed before the device module transfer step S160. In FIG. 2, only a portion of the device module 240 and the wiring 260 is shown in the plasma (P) process, but this is for illustrative purposes, and the plasma (P) process is the whole of the device module 240 and the wiring 260 where the transfer is performed. Can be applied to

The conductive material preparing step S192 may be a step of preparing a conductive adhesive material 262 between the first electrode 222 of the device module 240 and the second electrode 261 of the wiring 260.

Through this, adhesion between the first electrode 222 and the second electrode 261 may be improved, and mechanical and electrical reliability may be secured. The conductive adhesive material 262 may be, for example, a solder bump, a solder paste, an anisotropic conductive paste (ACP), an anisotropic conductive film (ACF), or the like.

The conductive material preparing step (S192) may be performed before the device module transfer step (S160).

In the non-conductive material preparing step S193, after the conductive material preparing step S192, the non-conductive adhesive material 263 is disposed between the first electrode 222 and the second electrode 261 such that the conductive adhesive material 262 is included therein. May be prepared.

The nonconductive adhesive material 263 may be, for example, a nonconductive film (NCF) or the like. By further providing the non-conductive adhesive material 263, the adhesive force between the first electrode 222 and the second electrode 261 may be improved, and mechanical and electrical reliability may be improved.

The reflow step S194 may be performed after the device module transfer step S160 or after the transfer film peeling step S170.

When only the conductive material preparing step (S192) is performed, the conductive adhesive material 262 may be cured through a reflow process. In addition, when the non-conductive material preparing step (S193) is also performed after the conductive material preparing step (S192), both the conductive adhesive material 262 and the non-conductive adhesive material 263 may be cured through a reflow process. Through this, the mechanical reliability and electrical reliability of the first electrode 222 and the second electrode 261 may be improved.

6 is a flowchart illustrating a method of manufacturing a stretchable device using a transfer process according to a second embodiment of the present invention, and FIG. 7 is a flowchart illustrating a method of manufacturing a stretchable device using a transfer process according to a second embodiment of the present invention. 8 is an exemplary view showing an example of a method of manufacturing a stretchable device using a transfer process according to a second embodiment of the present invention, and FIG. 9 is a stretchable device using a transfer process according to a second embodiment of the present invention. It is an illustrative figure which shows the other example of a manufacturing method.

First, as shown in FIGS. 6 and 7, a method of manufacturing a stretchable device using a transfer process may include a device forming step (S310), a device module preparing step (S320), a device module peeling step (S330), and a positioning step (S340). It may include a device module transfer step (S350), the transfer film peeling step (S360) and the wiring preparation step (S370).

The device forming step S310 may be a step of forming a base layer 420 having a first elastic modulus on the base substrate 410 and forming an element 430 on the base layer 420.

The base substrate 410 may have transparency, and various glass substrates such as a soda lime glass substrate, an alkali free glass substrate, or a tempered glass substrate may be applied. Further, the base substrate 410 may be made of sapphire, transparent resin material. Alternatively, the base substrate 410 may have opacity.

The base layer 420 may be provided on the base substrate 410 and may be made of a polymer material. The base layer 420 may be formed on the base substrate 410 by spin coating, bar coating, blade coating, or the like.

The base layer 420 may have a first elastic modulus. The base layer 420 may have greater elasticity than the base substrate 210 (refer to FIG. 2) described in the first embodiment, and thus may be stretched in the longitudinal direction and the width direction, but the stretching ratio is the target substrate 460 which will be described later. May be less than the rate of expansion.

The device 430 may be a light emitting device, and may be, for example, an OLED or a micro LED, but is not limited thereto.

The device 430 may be provided together with the thin film transistor 431. For example, the thin film transistor 431 may be provided on the base layer 420, and the device 430 may be provided on the thin film transistor 431.

The device module preparation step S320 may be a step of preparing the device module 440 having the cut base layer 421 and the device 430 by cutting the base layer 420 to correspond to the device 430.

Here, although the device module 440 has been described as having the cut base layer 421 and the device 430, the device module 440 may further include a thin film transistor 431.

The base layer 420 may be cut by laser cutting, mechanical sawing, or the like, and through this, the device 430 may be isolated.

The device module peeling step (S330) may be a step of peeling the device module 440 from the base substrate 410 by attaching the transfer film 450 to the top of the device module 440.

The transfer film 450 may have elasticity. Therefore, the transfer film 450 may be stretched in the longitudinal direction and the width direction.

Various methods may be used to peel the device module 440 from the base substrate 410. For example, a laser lift off (LLO) 10 method may be used. After the photo-insulating layer removal 10 process is applied, the bonding force between the base substrate 410 and the device module 440 may be smaller than the adhesive force between the transfer film 450 and the device module 440, and thus, the device module 440. The device module 440 may be peeled from the base substrate 410 in the state in which the) is adhered to the transfer film 450.

In the positioning step S340, the base layer 421 may be disposed to face the upper portion of the target substrate 460, and the device module 440 may be positioned in the corresponding transfer area 461 to be transferred.

The target substrate 460 may have a second elastic modulus lower than the first elastic modulus of the base layer 421. Therefore, the target substrate 460 may have elasticity and may have a greater elasticity than the base layer 420. The target substrate 460 may be stretched in the longitudinal direction and the width direction.

An upper portion of the target substrate 460 may have a transfer region 461 to which the device module is to be transferred. Here, the transfer area 461 may be marked on the target substrate 460, or may not be displayed on the target substrate 460, but may be used to position the device module 440 on the target substrate 460. The image may be displayed on a screen, or may be an image projected on the target substrate 460, and may be implemented in various forms.

In the positioning step S340, the device module 440 may be positioned vertically above the transfer area 461.

In this embodiment, the device module 440 may be positioned such that the base layer 421 faces the upper surface of the target substrate 460. That is, the process may proceed to a face-up process.

The device module transfer step S350 may be a step of transferring the device module 440 to the transfer area 461.

In addition, the transfer film peeling step S360 may be a step of peeling the transfer film 450 from the device module 440.

The adhesive force between the transfer film 450 and the device module 440 may be smaller than the coupling force between the target substrate 460 and the device module 440. Accordingly, the device module 440 is coupled to the target substrate 460. The transfer film 450 may be peeled from the device module 440.

The wiring preparation step S370 may be a step of connecting the device 430 and the target substrate 460 to the wiring 470. Of course, the wiring 470 may be connected to any one or more of the device 430 and the thin film transistor 431. That is, the wiring 470 may electrically connect the target substrate 460 and the device module 440. The wiring 470 may be a metal electrode.

The wiring 470 may be elastic, and thus, the target substrate 460 may be stretched and correspondingly stretched.

When the wiring 470 is provided in the contracted state of the target substrate 460, the wiring 470 may be provided in the contracted state. On the other hand, when the wiring 470 is provided in a state where the target substrate 460 is extended, the wiring 470 is also preferably provided in an extended state, and through this, when the target substrate 460 is stretched, 470 may be safely stretched in response to the stretching of the target substrate 460 while the disconnection is prevented.

In addition, the stretchable device manufacturing method using the transfer process may further include an insulating layer preparation step (S365).

The insulating layer preparing step S365 may be a step of preparing an insulating layer 480 having a height corresponding to the base layer 420 on the target substrate 460. The insulating layer preparing step S365 may be omitted when the height of the device module 440 is very low. However, when the insulating layer preparation step S365 is required, the insulating layer preparation step S365 may be performed before the wiring preparation step S370, and the wiring 470 may be the base layer 420 and the insulating layer 480. It may be provided at the top of the.

The insulating layer 480 may be stretched, and thus, when the target substrate 460 is stretched, it may be stretched correspondingly.

In this embodiment, the element 430 is adhered to the base layer 421. However, since the first elastic modulus of the base layer 421 is higher than the second elastic modulus of the target substrate 460, the base layer 421 is extended to a degree smaller than the extent to which the target substrate 460 is extended. In particular, the degree of elongation of the base layer 421 preferably has an elongation rate such that the element 220 does not break even when the base layer 421 is elongated to the maximum. Through this, even if the target substrate 460 is extended, breakage of the element 430 may be prevented.

In addition, a passivation process may be added after the wiring preparation step (S370).

Meanwhile, as shown in FIG. 8, in the positioning step S340, the transfer film 450 may be extended to place the device module 440 in the transfer area 461.

That is, when the second interval D2 between the device modules 440 is narrower than the first interval D1 between the transfer regions 461 of the target substrate 460, the tensile force F is applied at the side of the transfer film 450. By acting, the transfer film 450 may be stretched by pulling the transfer film 450 to both sides. By extending the transfer film 450, the second gap D2 between the device modules 440 may be equal to the first gap D1 between the transfer regions 461. In this state, the device module 440 may be transferred to the target substrate 460 so that the device module 440 may be transferred to the corresponding transfer area 461.

In addition, although not shown, when the spacing between the device modules is wider than the spacing between the corresponding transfer regions provided on the target substrate, the target substrate can be stretched by pulling the target substrate to both sides by applying a tensile force on the side of the target substrate. have. By extending the target substrate, the distance between the transfer regions can be widened so that the distance between the transfer regions is equal to the distance between the device modules. In this state, the device module can be transferred to the transfer area so that the device module can be transferred to the transfer area.

In addition, as shown in FIG. 9, in the positioning step S340, the device module 440 that does not correspond to the transfer area 461 among the device modules attached to the transfer film 450 is separated from the transfer film 450. Therefore, only the device module 440 corresponding to the transfer region 461 may be left. In this state, the device module 440 may be transferred to the target substrate 460 so that the device module 440 may be transferred to the corresponding transfer area 461.

In addition, the stretchable device manufacturing method using the transfer process according to the second embodiment of the present invention may further include a change step (S390), a surface treatment step (S391) and a reflow step (S380).

The changing step S390 may be a step of changing the transfer region 461 to have a third elastic modulus higher than the second elastic modulus by applying heat or light to the transfer region 461. Accordingly, when the stretchable device is stretched, the strain acting on the device module 440 is reduced, thereby allowing the device 430 to be more securely protected.

The change step S390 may be performed before the positioning step S340 or after the device module transfer step S350.

The surface treatment step S391 may be a step of surface treating the device module 440 with plasma P so that the adhesion between the device module 440 and the wiring 470 is increased. Although only a portion of the plasma P process is illustrated in FIG. 7, this is for illustrative purposes, and the plasma P process may be applied to the entire device module 440 on which the wiring 470 is to be provided. The plasma P surface treatment may be performed before the wiring preparation step S370.

In the wiring preparation step (S370), a conductive adhesive material (not shown) may be further provided between the first electrode (not shown) of the device module 440 and the second electrode (not shown) of the wiring 470. . Here, the conductive adhesive material may be the same as the conductive adhesive material 262 described in the first embodiment, or may be an amorphous metal. The conductive adhesive material may be provided by a plating process, a photolithography process, a conductive material printing process, or the like.

The first electrode and the second electrode may be the same as the first electrode 222 and the second electrode 261 described in the first embodiment.

Meanwhile, a stretchable device may be manufactured by the stretchable device manufacturing method using the transfer process of the present invention, and the stretchable device may include a display device, electronic skins, a sensor array, and the like.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the invention is indicated by the following claims, and it should be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the invention.

210,211: base substrate
220,430: device
221,431: thin film transistor
230,450: transfer film
240,440: device module
250,460: target substrate
251: target area
260,470: wiring
410: basic substrate
420,421: base layer
461: transcription area
480: insulation layer

Claims (19)

An element forming step of forming an element on the base substrate having a first elastic modulus;
A transfer film attaching step of attaching a transfer film to a lower portion of the base substrate;
A device module preparation step of cutting the base substrate so as to correspond to the device, and preparing a device module having the cut base substrate and the device;
A wiring preparation step of providing a wiring on an upper portion of the target substrate having a second elastic modulus lower than the first elastic modulus;
Positioning the device so as to face the upper portion of the target substrate, and positioning the device module in a target area between corresponding wires to be connected;
A device module transfer step of transferring the device module to the target area on the target substrate so that the device is electrically connected to the corresponding wiring; And
A stretchable device manufacturing method using a transfer process comprising a transfer film peeling step of peeling the transfer film from the device module. The method of claim 1,
And in the positioning step, stretch the transfer film to position the device module in the target region. The method of claim 1,
In the positioning step, by separating the device module that is not to be transferred to the target area of the device module attached to the transfer film from the transfer film, leaving only the device module to be transferred to the target area corresponding to the target area A method of manufacturing a stretchable device using a transfer process, characterized in that the position. The method of claim 1,
The method may further include changing the target region to have a third elastic modulus higher than the second elastic modulus by applying heat or light to the target region before, after the wiring preparation step or after the device module transfer step. A stretchable device manufacturing method using a transfer process, characterized in that. The method of claim 1,
Before the device module transfer step, further comprising a surface treatment step of surface-treating the wiring and the device module with a plasma so that the adhesion between the device module and the wiring is increased. . The method of claim 1,
Before the device module transfer step, manufacturing a stretchable device using a transfer process further comprising the step of preparing a conductive material for providing a conductive adhesive material between the first electrode of the device module and the second electrode of the wiring. Way. The method of claim 6,
After the device module transfer step, or after the transfer film peeling step, a flexible device manufacturing method using a transfer process further comprising a reflow step of curing the conductive adhesive material. The method of claim 6,
After the conductive material preparing step, the non-conductive material preparing step of providing a non-conductive adhesive material between the first electrode and the second electrode so that the conductive adhesive material is included in the transfer process further comprising a Flexible device manufacturing method using. The method of claim 8,
After the device module transfer step, or after the transfer film peeling step, a reflow step of hardening the conductive adhesive material and the non-conductive adhesive material further comprising the step of manufacturing a stretchable device using a transfer process. delete An element forming step of providing a base layer having a first elastic modulus on the base substrate and forming an element on the base layer;
A device module preparation step of cutting the base layer so as to correspond to the device and providing a device module having the cut base layer and the device;
A device module peeling step of attaching a transfer film to the upper portion of the device module to separate the device module from the base substrate;
Positioning the base layer so as to face an upper portion of a target substrate having a second elastic modulus lower than the first elastic modulus, and positioning the device module in a corresponding transfer region to be transferred;
A device module transfer step of transferring the device module to the transfer area;
A transfer film peeling step of peeling the transfer film from the device module; And
A method of manufacturing a stretchable device using a transfer process comprising a wiring preparation step of connecting the device and the target substrate by wiring. The method of claim 11,
And an insulation layer preparation step of preparing an insulation layer having a height corresponding to the base layer on the target substrate, before the wiring preparation step. The method of claim 12,
In the wiring preparation step, the wiring is a stretchable device manufacturing method using a transfer process, characterized in that provided on top of the base layer and the insulating layer. The method of claim 11,
And in the positioning step, stretch the transfer film to position the device module in the transfer area. The method of claim 11,
In the positioning step, a transfer process, characterized in that the device module attached to the transfer film, which does not correspond to the transfer area, is separated from the transfer film, leaving only the device module corresponding to the transfer area. Flexible device manufacturing method using. The method of claim 11,
Before the positioning step or after the device module transfer step, by applying heat or light to the transfer region, characterized in that it further comprises a change step of changing the transfer region to have a third elastic modulus higher than the second elastic modulus A stretchable device manufacturing method using a transfer process. The method of claim 11,
And a surface treatment step of surface-treating the device module with plasma so as to increase the adhesion between the device module and the wiring before the wiring preparation step. The method of claim 11,
In the wiring preparation step, a flexible adhesive manufacturing method using a transfer process, characterized in that further providing a conductive adhesive material between the first electrode of the device module and the second electrode of the wiring. delete

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