KR102019310B1 - Solar cell module and manufacturing method for same - Google Patents
Solar cell module and manufacturing method for same Download PDFInfo
- Publication number
- KR102019310B1 KR102019310B1 KR1020157003030A KR20157003030A KR102019310B1 KR 102019310 B1 KR102019310 B1 KR 102019310B1 KR 1020157003030 A KR1020157003030 A KR 1020157003030A KR 20157003030 A KR20157003030 A KR 20157003030A KR 102019310 B1 KR102019310 B1 KR 102019310B1
- Authority
- KR
- South Korea
- Prior art keywords
- solar cell
- conductor
- adhesive
- cell module
- tab wire
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000004020 conductor Substances 0.000 claims abstract description 117
- 239000000853 adhesive Substances 0.000 claims abstract description 116
- 230000001070 adhesive effect Effects 0.000 claims abstract description 64
- 239000010409 thin film Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 3
- 210000004027 cell Anatomy 0.000 description 157
- 238000000034 method Methods 0.000 description 20
- 239000002313 adhesive film Substances 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000010923 batch production Methods 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000010931 gold Substances 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 238000012935 Averaging Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- -1 acryloxyethyl Chemical group 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- YYJIYUNJTKCRHL-UHFFFAOYSA-N (2-hydroxy-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC(=O)C=C YYJIYUNJTKCRHL-UHFFFAOYSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- XWUNIDGEMNBBAQ-UHFFFAOYSA-N Bisphenol A ethoxylate diacrylate Chemical compound C=1C=C(OCCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCCOC(=O)C=C)C=C1 XWUNIDGEMNBBAQ-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RIUQHCOQTXZANT-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCCCO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCCCCO RIUQHCOQTXZANT-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- XBCFXELSWDAYIW-UHFFFAOYSA-N [4-[2-[4-(prop-2-enoyloxymethoxy)phenyl]propan-2-yl]phenoxy]methyl prop-2-enoate Chemical compound C=1C=C(OCOC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCOC(=O)C=C)C=C1 XBCFXELSWDAYIW-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- KQNZLOUWXSAZGD-UHFFFAOYSA-N benzylperoxymethylbenzene Chemical compound C=1C=CC=CC=1COOCC1=CC=CC=C1 KQNZLOUWXSAZGD-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/0201—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising specially adapted module bus-bar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
A solar cell having an electrode, a tab wire, and a first adhesive, wherein the electrode of the solar cell and the tab wire are connected via the first adhesive, and at least the electrode and the tab wire of the solar cell In the connection area | region which connects, it is a solar cell module in which the said tab wire has 2 or more conductors, and the said conductors are connected through the 2nd adhesive agent.
Description
The present invention relates to a solar cell module and a method of manufacturing the same.
Solar cells are expected to be a new energy source because they convert clean, inexhaustible solar light directly into electricity.
The said solar cell is used as a solar cell module which connected the some solar cell through the tab wire, for example.
In the conventional tab wire, the type which apply | coated solder to the copper wire surface was used. The electrodes and tab wires of the solar cell were connected via solder. However, since high temperature is required for solder connection, panel cracks and warpage of the light-receiving surface, shorts due to (leaked) solder pushed out of the tab wire, and the like have been caused.
Therefore, adhesives, such as a conductive adhesive and an insulating adhesive, have been used as a connection material which replaces solder. For example, the solar cell module in which the surface electrode and tab wire of the solar cell were connected through the conductive adhesive is proposed (for example, refer patent document 1).
However, in the technique of this proposal, the tab wire is peeled from the solar cell due to the cure shrinkage of the conductive adhesive due to heating and pressurization when the surface electrode of the solar cell is connected to the tab wire, and the stress concentration to the conductive adhesive. This leads to a problem that connection reliability is lowered. This problem becomes more remarkable when the tap line is thinned in order to increase the light receiving area for the purpose of higher photoelectric efficiency in recent years.
Therefore, it is a present situation that the provision of the solar cell module excellent in connection reliability and its manufacturing method is calculated | required.
This invention solves the said various problems in the past, and makes it a subject to achieve the following objectives. That is, an object of the present invention is to provide a solar cell module excellent in connection reliability and a manufacturing method thereof.
As a means for solving the said subject, it is as follows. In other words,
It has a solar cell which has a <1> electrode, a tab wire, and a 1st adhesive agent,
An electrode of the solar cell and the tab wire are connected via the first adhesive agent,
In at least the connection area | region where the electrode of the said solar cell and the said tab wire connect, the said tab wire has 2 or more conductors, and the said conductors are connected through the 2nd adhesive agent, The aspect characterized by the above-mentioned. It is a battery module.
The solar cell module as described in said <1> whose average thickness in the connection direction of a <2> conductor is 9 micrometers-200 micrometers.
The ratio (A / B) of the sum (A) of the average thickness (µm) of the connection direction of each conductor in the <3> tab wire to the average width (µm) (B) of the tab wire is 0.009 to 0.250. It is a solar cell module as described in 1> or <2>.
The <4> conductor is the solar cell module in any one of said <1> to <3> containing any one of copper and aluminum.
It is the solar cell module in any one of said <1> to <4> whose number of conductors in a <5> tab line is 2-5.
It is a solar cell module in any one of said <1> to <5> which is any one of a <6> crystalline solar cell module and a thin film solar cell module.
At least any one of a <7> 1st adhesive agent and a 2nd adhesive agent is a solar cell module in any one of said <1> to <6> which is either any of a conductive adhesive and an insulating adhesive agent.
An arrangement step of arranging at least a first adhesive agent, a first conductor, a second adhesive agent, and a second conductor in this order on an electrode of a <8> solar cell;
A covering step of covering the solar cell with a resin for sealing and further covering the sealing resin with any one of a moisture-proof back sheet and a glass plate;
A pressurizing step of pressing any one of the moisture-proof back sheet and the glass plate;
It is a manufacturing method of the solar cell module characterized by including the heating process of heating the heating stage in which the said solar cell was mounted.
According to the present invention, it is possible to solve the above-mentioned various problems in the prior art, to achieve the above object, and to provide a solar cell module excellent in connection reliability and a manufacturing method thereof.
1 is a schematic top view illustrating an example of a thin film solar cell module.
2 is an exploded perspective view showing an example of a crystalline solar cell module.
3 is a schematic cross-sectional view showing an example of a crystalline solar cell module.
4 is a schematic cross-sectional view of an example of a tab line used in the present invention.
5 is a schematic top view of a crystalline solar cell model.
6 is a cross-sectional photograph of a thin-film solar cell model (Example 2) in which tab lines are arranged.
(Solar cell module)
The solar cell module of this invention has at least a solar cell, a tab wire, and a 1st adhesive agent, and also has other members, such as sealing resin, a moisture proof back sheet, and a glass plate, as needed.
In the said solar cell module, the electrode of the said solar cell and the said tab wire are connected through the said 1st adhesive agent.
<Solar cell>
There is no restriction | limiting in particular as long as it has an electrode as said solar cell, According to the objective, it can select suitably, For example, it has at least a photoelectric conversion element as a photoelectric conversion part, a finger electrode, and a bus bar electrode, and if needed, It has more members.
As said solar cell, a thin-film solar cell, a crystalline solar cell, etc. are mentioned, for example. Examples of the thin-film solar cell include amorphous silicon solar cells, compound-based solar cells (CIS solar cells, CdS / CdTe solar cells), dye-sensitized solar cells, organic thin film solar cells, and microcrystalline silicon. And a solar cell (tandem solar cell). As said crystalline solar cell, a single crystal silicon solar cell, a polycrystalline silicon solar cell, etc. are mentioned, for example.
The solar cell may be a bus barless structure having no bus bar electrodes.
There is no restriction | limiting in particular as average thickness of the said solar cell, According to the objective, it can select suitably.
Finger electrode
The finger electrode is an electrode that collects electricity generated in the photoelectric conversion unit. The finger electrode is formed on the solar cell in a direction substantially perpendicular to the tab line.
There is no restriction | limiting in particular as a material of the said finger electrode, Although it can select suitably according to the objective, For example, silver, gold, copper, tin, nickel etc. are mentioned.
There is no restriction | limiting in particular as an average width of the said finger electrode, Although it can select suitably according to the objective, 20 micrometers-200 micrometers are preferable, and 20 micrometers-100 micrometers are more preferable.
The said average width can be calculated | required by measuring the width of the said finger electrode in arbitrary ten points of the said finger electrode, for example, and averaging the measured value.
There is no restriction | limiting in particular as a formation method of the said finger electrode, According to the objective, it can select suitably, For example, it can form by printing a silver paste on the said photoelectric conversion element so that the said finger electrode may have a desired pattern shape. As said printing method, screen printing etc. are mentioned, for example.
Bus Bar Electrode
The bus bar electrode is an electrode that further collects electricity collected by the finger electrode and transmits the electricity to the tab wire.
In addition, in the solar cell of the bus barless structure, electricity is transferred directly from the finger electrode to the tab wire.
There is no restriction | limiting in particular as a material of the said bus bar electrode, Although it can select suitably according to the objective, For example, silver, gold, copper, tin, nickel etc. are mentioned.
There is no restriction | limiting in particular as an average width of the said bus bar electrode, Although it can select suitably according to the objective, 500 micrometers-5,000 micrometers are preferable, and 800 micrometers-2,000 micrometers are more preferable.
The said average width can be calculated | required by measuring the width | variety of the said bus bar electrode in arbitrary ten points of the said bus bar electrode, and averaging the measured value, for example.
There is no restriction | limiting in particular as a formation method of the said bus bar electrode, According to the objective, it can select suitably, For example, it can form by printing a silver paste on the said photoelectric conversion element so that the said bus bar electrode may have a desired pattern shape. As said printing method, screen printing etc. are mentioned, for example.
The bus bar electrode and the finger electrode may be formed at the same time. For example, the bus bar electrode and the finger electrode can be simultaneously formed by screen printing silver paste on a photoelectric conversion element using a printing plate having a pattern shape capable of forming a desired bus bar electrode and a desired finger electrode.
<1st adhesive agent>
There is no restriction | limiting in particular as said 1st adhesive agent, According to the objective, it can select suitably, For example, a conductive adhesive, an insulating adhesive agent, etc. are mentioned.
Conductive Adhesive
There is no restriction | limiting in particular as said conductive adhesive, According to the objective, it can select suitably, For example, it contains an electroconductive particle at least, Preferably it contains film formation resin, curable resin, and a hardening | curing agent, As needed, Other components A conductive adhesive further containing the above may be mentioned.
--Conductive Particles--
There is no restriction | limiting in particular as said electroconductive particle, According to the objective, it can select suitably, For example, nickel particle, gold-coated nickel particle, the resin particle which coat | covered the resin core with Ni, the resin core was coat | covered with Ni, and the outermost surface was Au The coated resin particle etc. are mentioned.
--Film forming resin--
There is no restriction | limiting in particular as said film forming resin, According to the objective, it can select suitably, For example, a phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin Resin and the like. These may be used individually by 1 type and may use 2 or more types together. Among these, phenoxy resin is especially preferable.
--Curable resin--
There is no restriction | limiting in particular as said curable resin, According to the objective, it can select suitably, For example, an epoxy resin, an acrylate resin, etc. are mentioned.
In the said solar cell module, the said curable resin may be hardened independently, and may be hardened by the hardening | curing agent mentioned later.
--- Epoxy Resin ---
There is no restriction | limiting in particular as said epoxy resin, According to the objective, it can select suitably, For example, bisphenol-A epoxy resin, bisphenol F-type epoxy resin, novolak-type epoxy resin, those modified epoxy resins, alicyclic epoxy resin, etc. Can be mentioned. These may be used individually by 1 type and may use 2 or more types together.
--- Acrylic Resin ---
There is no restriction | limiting in particular as said acrylate resin, According to the objective, it can select suitably, For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, di Ethylene glycol diacrylate, trimethylol propane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis [4 -(Acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) iso Cyanurate, urethane acrylate, etc. are mentioned. These may be used individually by 1 type and may use 2 or more types together.
Moreover, what made the said acrylate the methacrylate is mentioned, These may be used individually by 1 type, and may use 2 or more types together.
--Hardeners--
It is preferable to use the said curable resin together with a hardening | curing agent. There is no restriction | limiting in particular as said hardening | curing agent, According to the objective, it can select suitably, For example, imidazole represented by 2-ethyl 4-methylimidazole; Organic peroxides such as lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, and benzoyl peroxide; Anionic curing agents such as organic amines; And cationic curing agents such as sulfonium salts, onium salts, and aluminum chelating agents.
Among these, the combination of an epoxy resin and imidazole, and the combination of an acrylate resin and an organic peroxide are especially preferable.
--Other ingredients--
There is no restriction | limiting in particular as said other components, According to the objective, it can select suitably, For example, a silane coupling agent, a filler, a softener, an accelerator, an antiaging agent, a coloring agent (pigment, dye), an organic solvent, an ion catcher, etc. are mentioned. Can be. There is no restriction | limiting in particular in the addition amount of the said other component, According to the objective, it can select suitably.
Insulation Adhesive
There is no restriction | limiting in particular as said insulating adhesive agent, According to the objective, it can select suitably, For example, the insulating adhesive agent etc. which contain film formation resin, curable resin, a hardening | curing agent, and further contain other components as needed are mentioned. have.
There is no restriction | limiting in particular as the said film formation resin, the said curable resin, the said hardening | curing agent, and the said other component in the said insulating adhesive agent, According to the objective, it can select suitably, For example, the said film illustrated in description of the said conductive adhesive agent Forming resin, the said curable resin, the said hardening | curing agent, and the said other component are mentioned, respectively.
The first adhesive may be used in the form of a liquid or in the form of a film when the solar cell module is manufactured.
<Tab line>
The tab wire has at least two conductors in a connection region where at least an electrode of the solar cell and the tab wire are connected. The said conductors are connected through the 2nd adhesive agent.
-Conductor-
There is no restriction | limiting in particular as a material of the said conductor, According to the objective, it can select suitably, For example, copper, aluminum, iron, gold, silver, nickel, palladium, chromium, molybdenum, these alloys, etc. are mentioned.
It is preferable that the said conductor contains either copper and aluminum.
There is no restriction | limiting in particular as a shape of the said conductor, According to the objective, it can select suitably, For example, flat form etc. are mentioned.
There is no restriction | limiting in particular as a structure of the said conductor, According to the objective, it can select suitably, A single layer structure may be sufficient and a laminated structure may be sufficient. As said single layer structure, the single layer structure which uses copper, aluminum, etc. as its material is mentioned, for example. As said laminated structure, the base material which consists of copper, aluminum, etc., a laminated structure which has a plating layer, etc. are mentioned, for example. As a material of the said plating layer, gold, silver, tin, solder, etc. are mentioned, for example.
There is no restriction | limiting in particular as an average thickness of the connection direction of the said conductor, Although it can select suitably according to the objective, 9 micrometers-200 micrometers are preferable, and 9 micrometers-150 micrometers are more preferable. If the said average thickness is less than 9 micrometers, the extraction efficiency of the electricity produced | generated by the solar cell may fall, and when it exceeds 200 micrometers, connection reliability may fall. It is advantageous at the point that connection reliability is more excellent in the said average thickness being in the said more preferable range.
The said average thickness can be calculated | required by measuring the thickness of the connection direction of the said conductor in arbitrary ten points of the said conductor, for example, and averaging the measured value.
The said connection direction can also be called the direction orthogonal to the solar cell surface.
There is no restriction | limiting in particular as number of the said conductors in the said tab line, Although it can select suitably according to the objective, 2-5 are preferable and 2-3 are more preferable. When the said number exceeds 5, the position shift of the said tab line may generate | occur | produce in the pressurization process at the time of manufacturing the said solar cell module, and the connection reliability may fall and connection defect may arise by this. It is advantageous at the point that connection reliability is more excellent in the said number being in the said more preferable range.
The material of each conductor of the two or more conductors in the tab line may be the same or different.
The average thickness in each connection direction of the said 2 or more conductor in the said tab line may be the same, and may differ.
As a structure of the said tab line, the structure etc. which were arranged as follows are mentioned, for example.
(1) conductor / second adhesive / conductor
(2) conductor / second adhesive / conductor / second adhesive / conductor
(3) conductor / second adhesive / conductor / second adhesive / conductor / second adhesive / conductor
(4) conductor / second adhesive / conductor / second adhesive / conductor / second adhesive / conductor / second adhesive / conductor
(5) conductor / second adhesive / conductor / second adhesive / conductor / second adhesive / conductor / second adhesive / conductor / second adhesive / conductor
In the case where an insulating adhesive is used for the first adhesive and the second adhesive, the conductor is protruded on its surface so that electrical connection with the electrodes of the solar cell and electrical connection with each other are easily performed. It is preferable to have a. There is no restriction | limiting in particular as a material, a shape, a size, and a structure of the said protrusion, According to the objective, it can select suitably. In addition, the thickness of the connection direction of the said conductor in the case where the said conductor has a protrusion on the surface is the thickness of the part remove | excluding the protrusion.
Second adhesive
There is no restriction | limiting in particular as said 2nd adhesive agent, According to the objective, it can select suitably, For example, the adhesive agent similar to the said 1st adhesive agent, etc. are mentioned. The component of the said 1st adhesive agent and the component of the said 2nd adhesive agent may be the same, and may differ.
When the number of the said conductors is 3 or more in the said tab line, the said 2nd adhesive agent is used in 2 or more places, but the components of the 2 or more said 2nd adhesive agents may be the same and may differ.
There is no restriction | limiting in particular as an average width of the said tab line, Although it can select suitably according to the objective, 500 micrometers-10,000 micrometers are preferable, and 800 micrometers-4,000 micrometers are more preferable.
The said average width can be calculated | required by measuring the width | variety of the said conductor in the said tab line in arbitrary ten points of the said tab line, for example, and averaging the measured value. The width of the conductor is a distance in a direction orthogonal to the connection direction in the conductor.
There is no restriction | limiting in particular as ratio (A / B) of the sum (A) of the average thickness (micrometer) of the connection direction of each conductor in the said tab wire, and the average width (micrometer) (B) of the said tab wire, Although it can select suitably according to the above, 0.009 to 0.250 is preferable and 0.009 to 0.150 is more preferable. If the said ratio (A / B) is less than 0.009, the extraction efficiency of the electricity produced | generated by a solar cell may fall, and when it exceeds 0.250, connection reliability may fall. It is advantageous at the point that connection reliability is more excellent in the said ratio (A / B) being in the said more preferable range.
<Resin for sealing>
There is no restriction | limiting in particular as said sealing resin, According to the objective, it can select suitably, For example, ethylene / vinyl acetate copolymer (EVA), ethylene / vinyl acetate / triallyl isocyanurate (EVAT), polyvinyl butyrate ( PVB), polyisobutylene (PIB), a silicone resin, a polyurethane resin, etc. are mentioned.
<Moisture-proof back sheet>
There is no restriction | limiting in particular as said moisture proof back sheet, According to the objective, it can select suitably, For example, a laminated body of polyethylene terephthalate (PET), aluminum (Al), PET, Al, and polyethylene (PE), etc. are mentioned.
<Glass plate>
There is no restriction | limiting in particular as said glass plate, According to the objective, it can select suitably, For example, a soda lime float glass plate etc. are mentioned.
The solar cell module may be a thin film solar cell module using the thin film solar cell, or may be a crystalline solar cell module using the crystalline solar cell.
An example of the solar cell module of this invention is demonstrated using drawing.
1 is a schematic top view illustrating an example of the thin film solar cell module 200. In the thin film type solar cell module 200 of FIG. 1, the thin film type solar cell 32 including a thin film type photoelectric conversion element is arranged in a plane direction on a substrate 38. A conductive adhesive layer (not shown) is provided on the surface electrode (not shown) of the thin film
2 is an exploded perspective view showing an example of a crystalline solar cell module. The crystalline solar cell module 1 has the strings 4 connected in series by the
As shown in FIG. 3, each of the crystalline
Then, the
4 is a schematic cross-sectional view showing an example of a tab line. The
(Method for Manufacturing Solar Cell Module)
The manufacturing method of the solar cell module of this invention contains a batch process, a coating process, a pressurization process, and a heating process at least, and also contains another process as needed.
The manufacturing method of the solar cell module of this invention can be used suitably for manufacture of the said solar cell module of this invention.
<Batch process>
There is no restriction | limiting in particular as said arrangement process, if it is a process which arrange | positions at least a 1st adhesive agent, a 1st conductor, a 2nd adhesive agent, and a 2nd conductor in this order on the electrode of a solar cell, According to the objective suitably You can choose.
The first conductor, the second adhesive, and the second conductor form a tab wire in the solar cell module of the present invention.
As said solar cell, the said solar cell etc. which were illustrated, for example in description of the said solar cell module of this invention are mentioned.
As said 1st adhesive agent and said 2nd adhesive agent, the said 1st adhesive agent and the said 2nd adhesive agent which were illustrated, for example in description of the said solar cell module of this invention are mentioned, respectively.
There is no restriction | limiting in particular as average thickness in the connection direction of a said 1st adhesive agent and a said 2nd adhesive agent, Although it can select suitably according to the objective, 3 micrometers-100 micrometers are preferable, 5 micrometers-50 micrometers are more preferable, 10 micrometers-35 micrometers are more preferable.
The said average thickness can be calculated | required by measuring the thickness of a connection direction in arbitrary ten points of a said 1st adhesive agent and a said 2nd adhesive agent, for example, and averaging the measured value.
As said 1st conductor and said 2nd conductor, the said conductor etc. which were illustrated, for example in description of the said solar cell module of this invention are mentioned.
An example of the said batch process is demonstrated.
On the bus bar electrode of the solar cell, a film-like conductive adhesive (conductive adhesive film, first adhesive) slit with the same width as the bus bar electrode is placed. Subsequently, a copper foil (first conductor) having the same width as that of the bus bar electrode is placed on the first adhesive. Subsequently, a film-like conductive adhesive (conductive adhesive film, second adhesive) slit with the same width as the bus bar electrode is placed on the first conductor. Subsequently, a copper foil (second conductor) having the same width as that of the bus bar electrode is placed on the second adhesive. By the above, a batch process can be performed.
Another example of the batch process will be described.
First, the two-layered body which mounted the film-form conductive adhesive (adhesive) on copper foil (conductor) is prepared. The width of the two-layered body is the same width as that of the bus bar electrode of the solar cell.
Subsequently, the two-layered body (first two-layered body) is placed on the bus bar electrode of the solar cell so that the adhesive (first adhesive) and the bus bar electrode come into contact with each other. Further, another two-layered body (second two-layered body) is placed on the laid two-layered body (first two-layered body), and the adhesive (the first conductor) of the first two-layered body and the adhesive agent of the second two-layered body ( Second adhesive). By the above, a batch process can be performed.
Another example of the batch process will be described.
First, the four-layer body which laminated | stacked the two-layered body which mounted the film-form conductive adhesive agent (adhesive agent) on copper foil (conductor) is prepared. The width of the four-layered body is set to the same width as the bus bar electrode of the solar cell.
Subsequently, the four-layered body is placed on the bus bar electrode of the solar cell such that the adhesive (first adhesive) and the bus bar electrode are in contact with each other. By the above, a batch process can be performed.
After the arrangement step, the electrodes of the first conductor, the second conductor, and the solar cell may or may not be electrically connected.
<Coating process>
The coating step is not particularly limited as long as it is a step of covering the solar cell with a resin for sealing and covering the resin for sealing with any one of a moisture-proof back sheet and a glass plate, and can be appropriately selected according to the purpose.
It is preferable to perform the said manufacturing method of the said solar cell module using a pressure reduction laminator. The method of using the said reduced pressure laminator can be performed with reference to the method of Unexamined-Japanese-Patent No. 2010-283059, for example.
There is no restriction | limiting in particular as said sealing resin, the said moisture proof back sheet, and the said glass plate, According to the objective, it can select suitably, For example, the said sealing resin illustrated in the description of the said solar cell module of this invention, and said moisture proof property A back sheet and the said glass plate are mentioned, respectively.
<Pressure Process and Heating Process>
There is no restriction | limiting in particular as it is a process of pressurizing any one of the said moisture proof back sheet and a glass plate as said pressurization process, According to the objective, it can select suitably. The pressure to press and time to press are arbitrary.
The heating step is not particularly limited as long as it is a step of heating the heating stage on which the solar cell is loaded, and can be appropriately selected according to the purpose. The sealing resin can be heated by heating the heating stage. In addition, the first adhesive and the second adhesive may be heated.
There is no restriction | limiting in particular as heating temperature in the said heating process, Although it can select suitably according to the objective, 50 to 250 degreeC is preferable and 100 to 200 degreeC is more preferable. When the said heating temperature is less than 50 degreeC, sealing may become inadequate, and when it exceeds 250 degreeC, the organic resin contained in an adhesive agent, sealing resin, etc. may thermally decompose. If the said heating temperature is in the said more preferable range, it is advantageous at the reliability of sealing.
There is no restriction | limiting in particular as heating time in the said heating process, Although it can select suitably according to the objective, 1 second-1 hour are preferable, 5 seconds-30 minutes are more preferable, 10 seconds-20 minutes are especially preferable. If the said heating time is less than 1 second, sealing may become inadequate. If the said heating time is in the said especially preferable range, it is advantageous at the point of reliability of sealing.
There is no restriction | limiting in particular as a procedure to start the said pressurization process and the said heating process, According to the objective, it can select suitably.
In the said arrangement process, when the electrode of the said 1st conductor, the said 2nd conductor, and the said solar cell is not electrically connected, the said 1st conductor by the said pressing process and the said heating process, the said It is also possible to electrically connect the second conductor and the electrode of the solar cell.
By the above, the solar cell module of this invention is manufactured.
For example, the solar cell module of this invention can also be manufactured by forming the matrix which further arranged the plurality of strings which directly connected plural solar cell cells, and sealing it.
Example
Hereinafter, although the Example of this invention is described, this invention is not limited to these Examples at all.
(Example 1)
<Production of Solar Module Model>
-Conductor-
As the conductor, copper foil (average thickness 9 µm) slit with an average width of 2,000 µm was used.
Conductive Adhesive Film
An electroconductive adhesive film (SP100 series, 25 micrometers in average thickness, product made from Sony Chemical & Information Device Co., Ltd.) was prepared, and it used it, being slit in average width of 2,000 micrometers.
Fabrication of Thin-film Solar Module Models
The glass substrate (100 mm in length x 100 mm in width x 0.7 mm in thickness) in which the silver electrode was formed in the whole surface was prepared. Let this be a thin-film solar cell model.
On the electrode of the thin-film solar cell model, a conductive adhesive film (first adhesive), a conductor (first conductor), a conductive adhesive film (second adhesive), and a conductor (second conductor) After arranging in this order, it was temporarily attached. The provisional conditions were made into the heating temperature of 70 degreeC, the pressure of 0.5 MPa, for 1 second, and it performed using the heating tool.
As mentioned above, the thin film type solar cell model with the tab wire with which the 1st adhesive agent and the tab line were laminated | stacked on the electrode of the thin film type solar cell model was obtained. The tab wire is a laminate in which a first conductor, a second adhesive agent, and a second conductor are laminated. Two laminates were disposed on the electrodes of the thin-film solar cell model at intervals of 8.0 cm.
Subsequently, the obtained thin film solar cell model with a tab wire was covered with a resin for sealing, and the sealing resin was covered with a moisture-proof back sheet. An 500-micrometer-thick ethylene / vinyl acetate copolymer was used for the said sealing resin. PET film was used for the back sheet.
And the sealing resin was sealed with the laminator. Specifically, after vacuuming at 100 ° C. for 5 minutes, the laminate was laminated at 0.1 MPa for 5 minutes of press time, and then cured at 155 ° C. for 45 minutes in an oven.
The thin-film solar cell module model was obtained by the above.
<Evaluation>
The thin film type solar cell module obtained above was used for the following evaluation. The results are shown in Table 1.
Connection reliability
The resistance value between two tab wires of the obtained thin-film solar cell module model was measured.
Initially, after TC200 and after TC400, resistance values were measured using a digital multimeter (Yokogawa Denki Co., Ltd., digital multimeter 7555), and the following evaluation criteria evaluated.
In addition, the said TC200 is temperature rising from -40 degreeC to 85 degreeC (heating rate 2 degree-C / min), hold for 35 minutes at 85 degreeC, temperature-fall from 85 degreeC to -40 degreeC (temperature-fall rate 2 degree-C / min), and -40 degreeC The test which makes hold for 1 minute and 35 cycles in 35 degreeC is shown. TC400 represents a test for 400 cycles of the cycle.
〔Evaluation standard〕
◎: less than 10mΩ
○: 10 mΩ or more less than 20 mΩ
△: 20 mΩ or more less than 100 mΩ
×: 100 mΩ or more
(Examples 2 to 8)
In Example 1, except that the material of the conductor, the average thickness of the conductor, and the average width of the tab wire were changed to the material of the conductor, the average thickness of the conductor, and the average width of the tab wire, respectively. In the same manner as in 1, a thin-film solar cell module model was produced and evaluated. The results are shown in Table 1.
In Example 7, the average width of the conductive adhesive film was 800 µm. In Example 8, the average width of the conductive adhesive film was 1,500 µm.
Here, FIG. 6 is a cross-sectional photograph of a thin film solar cell model (Example 2) in which tab lines are arranged. The tab wire formed by connecting the
(Example 9)
In Example 1, it carried out similarly to Example 1 except having arrange | positioned the electrically conductive adhesive film (third adhesive agent) and the conductor (third conductor) on this 2nd conductor in this order at the time of provisional attachment, and is a thin film The solar cell module model was produced and evaluated. The results are shown in Table 1.
(Example 10)
As a crystalline solar cell model, a glass substrate on which a
On the bus bar electrode of the obtained crystalline solar cell model, the conductive adhesive film (first adhesive) shown in Example 1, the conductor (first conductor) shown in Example 1, and the conductive adhesive shown in Example 1 The film (2nd adhesive agent) and the conductor (2nd conductor) shown in Example 1 were arrange | positioned in this order, and were temporarily attached. The provisional conditions were made into the heating temperature of 70 degreeC, the pressure of 0.5 MPa, for 1 second, and it performed using the heating tool.
As described above, the tab wire-mounted crystalline solar cell model in which the first adhesive and the tab wire were laminated on the bus bar electrode of the crystalline solar cell model was obtained. The tab wire is a laminate in which a first conductor, a second adhesive agent, and a second conductor are laminated.
In Example 1, except having used the tab line mounting crystalline solar cell model obtained above, it carried out similarly to Example 1, and produced the crystalline solar cell module model, and evaluated. The results are shown in Table 1.
(Examples 11 to 13)
In Example 1, the average thickness of a 1st conductor, the average thickness of a 2nd conductor, and the average width of a tab line were made into the average thickness of the 1st conductor, the average thickness of a 2nd conductor, and the average of a tap line | wire of a 2nd conductor. Except having changed into the width | variety, the thin film type solar cell module model was produced like Example 1, and it evaluated. The results are shown in Table 2.
(Example 14)
In Example 4, the thin film type solar cell module model was produced and evaluated in the same manner as in Example 4 except that the average thickness of the conductive adhesive film was changed to 10 µm. The results are shown in Table 2.
(Example 15)
In Example 4, the thin film type solar cell module model was produced and evaluated in the same manner as in Example 4 except that the average thickness of the conductive adhesive film was changed to 35 µm. The results are shown in Table 2.
(Comparative Example 1)
Fabrication of Solder Mounted Tab Wires
Copper foil with an average thickness of 400 micrometers was slit into 2 mm (2,000 micrometers) of average widths.
Sn (96.5 mass%) / Ag (3 mass%) / Cu (0.5 mass%) lead-free solder was plated on the slit copper foil, and the solder attachment tab wire was obtained.
Fabrication of Thin Film Solar Cell Models with Tab Wires
On the electrode of the thin-film solar cell model prepared in Example 1, the solder mounting tab wire obtained above was arranged so that the solder of the electrode and the solder mounting tab wire contacted. Two solder attachment tab wires were arranged, and the interval thereof was the same as in Example 1.
Then, using the soldering iron, it heated at the heating temperature of 240 degreeC, and obtained the thin film type solar cell model with a tap wire.
Fabrication of Thin-film Solar Module Models
Subsequently, the obtained thin film solar cell model with a tab wire was covered with a resin for sealing, and the sealing resin was covered with a moisture-proof back sheet. An 500-micrometer-thick ethylene / vinyl acetate copolymer was used for the said sealing resin. PET film was used for the back sheet.
And the sealing resin was sealed with the laminator. Specifically, after vacuuming at 100 ° C. for 5 minutes, the laminate was laminated at 0.1 MPa for 5 minutes of press time, and then cured at 155 ° C. for 45 minutes in an oven.
As mentioned above, the thin-film solar cell module model was obtained.
The thin film solar cell module model thus obtained was evaluated in the same manner as in Example 1. The results are shown in Table 2.
(Comparative Example 2)
In Example 1, the thin film solar cell module model was produced like Example 1 except having changed the average thickness of a 1st conductor into 400 micrometers, and not using a 2nd adhesive agent and a 2nd conductor. And evaluation was performed. The results are shown in Table 2.
(Comparative Example 3)
In Comparative Example 1, a thin film solar cell module was produced and evaluated in the same manner as in Comparative Example 1, except that the average thickness of the copper foil was changed to 200 µm. The results are shown in Table 2.
(Comparative Example 4)
In Comparative Example 2, a thin-film solar cell module was produced and evaluated in the same manner as in Comparative Example 2 except that the average thickness of the first conductor was changed to 200 µm. The results are shown in Table 2.
It was confirmed that the solar cell modules produced in Examples 1 to 15 were excellent in connection reliability.
As the average thickness of the conductor, since the conduction resistance was very excellent even after TC400, it was confirmed that 9 µm to 150 µm was very preferable (for example, see Examples 1 to 4 and Example 11). As the sum of the average thicknesses of the conductors in the tab wire, since the conduction resistance was very excellent even after TC400, it was confirmed that 18 µm to 300 µm was very preferable (for example, Examples 1 to 4 and Example 11). Reference).
As the ratio (A / B) of the total thickness (A) of the average thickness (µm) of each conductor in the tab wire and the average width (µm) (B) of the tab wire, the conduction resistance is very excellent even after TC400. It was confirmed that 0.009 to 0.150 is very preferred (see, for example, Examples 1 to 4, 8 to 9, 11).
As a material of a conductor, it was confirmed that either of copper and aluminum are excellent in connection reliability (for example, see Examples 4 and 6).
As a kind of solar cell module, it was confirmed that either of a thin film type solar cell module and a crystalline solar cell module is excellent in connection reliability (for example, see Example 4 and 10).
On the other hand, in Comparative Examples 1 and 2, conduction resistance became very large in TC200 and TC400, and connection reliability was not enough. In Comparative Examples 3 and 4, the conduction resistance was large in TC400, and connection reliability was not sufficient.
Industrial Applicability
Since the solar cell module of this invention is excellent in connection reliability, it can be used especially suitably for the solar cell module with a thin line of a tap line in order to increase the light receiving area for the purpose of high photoelectric efficiency.
1 crystalline solar cell module
2 crystalline solar cell
3 tab line
3a first conductor
3b second adhesive
3c second conductor
4 strings
5 matrix
6 sheets
7 surface cover
8 back sheet
9 metal frame
10 crystalline photoelectric conversion element
11 bus bar electrode
12 finger electrode
13 Al backside electrode
17 conductive adhesive film
32 thin film solar cell
32a thin film solar cell model
38 description
200 Thin Film Solar Cell Module
Claims (8)
An electrode of the solar cell and the tab wire are connected via the first adhesive agent,
At least in the connection area | region where the electrode of the said solar cell and the said tab wire connect, the said tab wire has 2 or more conductors, and the said conductors are connected through a 2nd adhesive agent,
The first adhesive is a conductive adhesive containing conductive particles,
The said 2nd adhesive agent is a conductive adhesive whose average thickness is 10 micrometers-35 micrometers containing electroconductive particle,
The ratio (A / B) of the sum (A) of the average thickness (µm) in the connection direction of the respective conductors in the tab wire to the average width (µm) (B) of the tab wire is 0.009 to 0.250. Solar module.
An arrangement step of arranging at least a first adhesive agent, a first conductor, a second adhesive agent, and a second conductor on the electrodes of the solar cell in this order;
A covering step of covering the solar cell with a resin for sealing and further covering the sealing resin with any one of a moisture-proof back sheet and a glass plate;
A pressurizing step of pressing any one of the moisture-proof back sheet and the glass plate;
And a heating step of heating the heating stage on which the solar cell is loaded.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2012-154583 | 2012-07-10 | ||
JP2012154583A JP5889738B2 (en) | 2012-07-10 | 2012-07-10 | Solar cell module and manufacturing method thereof |
PCT/JP2013/068258 WO2014010486A1 (en) | 2012-07-10 | 2013-07-03 | Solar cell module and manufacturing method for same |
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CN107170841B (en) * | 2017-06-07 | 2021-01-22 | 苏州携创新能源科技有限公司 | Solar cell photovoltaic module and solar cell photovoltaic module |
CN109346560A (en) * | 2018-11-27 | 2019-02-15 | 江苏拓正茂源新能源有限公司 | A kind of preparation method of solar battery core |
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JP2005252062A (en) * | 2004-03-05 | 2005-09-15 | Sanyo Electric Co Ltd | Solar cell device |
WO2009019929A1 (en) * | 2007-08-09 | 2009-02-12 | Mitsubishi Electric Corporation | Solar battery panel |
JP2009054981A (en) * | 2007-08-02 | 2009-03-12 | Sanyo Electric Co Ltd | Solar cell module and method for manufacturing the same |
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JP5446420B2 (en) | 2009-04-21 | 2014-03-19 | デクセリアルズ株式会社 | Solar cell module and manufacturing method thereof |
JP2011159725A (en) * | 2010-01-29 | 2011-08-18 | Toppan Printing Co Ltd | Base for solar cell module, method of manufacturing the same, and solar cell module |
JP2012038777A (en) * | 2010-08-03 | 2012-02-23 | Mitsubishi Electric Corp | Solar battery module and manufacturing method of solar battery module |
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JP2005252062A (en) * | 2004-03-05 | 2005-09-15 | Sanyo Electric Co Ltd | Solar cell device |
JP2009054981A (en) * | 2007-08-02 | 2009-03-12 | Sanyo Electric Co Ltd | Solar cell module and method for manufacturing the same |
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