KR102001468B1 - Apparatus for electrical contacting in semiconductor device testing - Google Patents

Abstract

An electrical connection apparatus for electrically connecting semiconductor elements for testing to a high-fix board, comprising: at least two semiconductor elements arranged in the same space for testing, A contact plate dividedly provided; And a contact cylinder connected to each of the contact plates to provide a pressure to each of the contact plates to press the semiconductor elements to electrically connect the semiconductor elements to the high-fix board.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to an electrical connection apparatus, and more particularly, to an electrical connection apparatus for electrically connecting semiconductor elements for testing to a high-fix board.

In the manufacture of electronic components such as integrated circuit devices, inspection is performed on packaged integrated circuit devices (hereinafter referred to as "semiconductor devices") such as electrical performance, thermal stress, and the like. In particular, a test handler is an example of an apparatus for electrically testing the semiconductor device mentioned above.

Inspection of a semiconductor device using an electrical connection device such as the above-mentioned test handler can be achieved mainly by electrically connecting semiconductor elements accommodated in a test tray to a test socket provided in a Hi-Fix board have.

Here, the connection between the semiconductor elements and the high-fix board can be achieved mainly by the contact plate. The contact plate mentioned above is driven and controlled by a screw jack type press mainly based on a drive motor. The above-mentioned conventional contact plates have a single structure.

As described above, since the conventional contact plate is driven by a motor and has a single structure, it is not easy to precisely cope with the test of recent semiconductor devices having fine pitches. That is, since the conventional electric connection apparatus is torque control by motor driving, fluctuations in the load amount are large, and the precision contact to the high-fix board side is not easy. As mentioned above, It is not easy to precisely cope with the test of the device.

In addition, since the force of connection between the semiconductor elements and the high-fix board is controlled by the spring of the pushing member when the semiconductor elements using the contact plate are connected to the high-fix board, Problems arise.

In addition, in the process of changing the torque due to the rotational motion of the motor to the force corresponding to the linear movement for connection between the semiconductor devices and the high-fix board, illegal synthesis may occur, and an increase .

It is an object of the present invention to provide an electrical connection device capable of softly controlling the connection of semiconductor elements and a high-fix board.

According to an aspect of the present invention, there is provided an electrical connection apparatus for electrically connecting semiconductor devices for testing to a high-fix board, the apparatus comprising: A contact plate divided into at least two portions in the same space so as to divide the semiconductor elements and press them, respectively; And a contact cylinder connected to each of the contact plates to provide a pressure to each of the contact plates to press the semiconductor elements to electrically connect the semiconductor elements to the high-fix board.

In the electrical connection apparatus according to an embodiment of the present invention, a drive motor is provided to drive the contact plates at a time to a position where the semiconductor elements can be pressed. And a potentiometer provided to control the speed of the contact cylinder when pressing the semiconductor elements.

The electrical connection apparatus according to the present invention includes a contact plate divided into at least two portions in the same space and a contact cylinder connected to each of the contact plates to provide a pressure capable of pressing the semiconductor elements to each of the contact plates. That is, the electrical connection apparatus of the present invention includes a contact plate and a contact cylinder which can be independently driven in the same space and can be driven by pneumatic or hydraulic pressure.

As described above, the electric connection apparatus of the present invention not only can precisely control the connection between the semiconductor elements and the high-fix board by applying the split servo control technique capable of independent driving and being driven by pneumatic or hydraulic pressure, The connection force can be implemented in a direct space within a narrow space, and thus the present invention can be more positively applied to the testing of recent semiconductor devices manufactured at fine pitches.

Particularly, the electric connection apparatus of the present invention can be applied to a simple structure in addition to the active correction capability for a large-area flatness, thereby making it possible to miniaturize the electric connection apparatus itself.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing an electrical connection apparatus according to an embodiment of the present invention; Fig.
Fig. 2 is a schematic diagram showing an electrical connection device according to another embodiment of the present invention.

While the present invention has been described in connection with certain exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term "comprises" or "comprising ", etc. is intended to specify that there is a stated feature, figure, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Example

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing an electrical connection apparatus according to an embodiment of the present invention; Fig.

Referring to FIG. 1, the electrical connection apparatus 100 of the present invention is for electrical connection between the semiconductor elements and the high-fix board 19, and may be provided with a member such as a test handler. The electrical connection apparatus 100 of the present invention may be provided in association with a test apparatus for accommodating semiconductor devices and a test apparatus in which the high-fix board 19 is located. In addition, in the test of the semiconductor device using the electrical connection device 100 of the present invention, which is interlocked with the test device in which the test tray and the high-fix board 19 are located, 13 and the high-fix board 19. By using the contact plate 13 and the contact cylinder 15 described later to press the semiconductor elements accommodated in the test tray, And the high-fix board 19 can be electrically connected.

The test tray is for transporting a plurality of semiconductor elements in a fixed state, and has a structure in which a plurality of inserts for fixing and releasing each semiconductor element are installed at regular intervals on a metal frame of a rectangular frame. In particular, each of the inserts described above has a structure that is coupled to the metal frame via an elastic member, and can be installed so as to be elastically movable with respect to the metal frame.

The test apparatus may be provided with a high-fix board 19 and a test socket 21 for conveying an electrical signal in a test handler. The high-fix board 19 is a member that is electrically connected to an external device to transmit an electrical signal to the semiconductor device, and the test socket 21 is a member that electrically connects directly to the semiconductor device. At this time, the electrical connection between the semiconductor element and the test socket 21 can be achieved mainly by the contact of the lead wire of the semiconductor element, the ball, and the connecting pin of the test socket. In particular, the high-fix board 19 may have a plurality of test sockets arranged at regular intervals. However, since the high-fix board 19 includes the test socket, it is described in the present invention that the high-fix board 19 is connected to the semiconductor element instead of the test socket.

The electrical connection device 100 for electrically connecting the semiconductor elements for testing of the present invention to the high-fix board 19 may include a contact plate 13 and a contact cylinder 15. [

The aforementioned contact plate 13 can be divided into at least two portions in the same space 11 so as to be able to divide and press the semiconductor elements disposed in the same space 11, i.e., the test chamber, for testing. That is, a plurality of contact plates 13 mentioned in the electrical connection device 100 of the present invention may be provided in the same space 11. In other words, the aforementioned contact plate 13 may be provided to have a divided structure rather than a single structure.

The aforementioned contact cylinder 15 is connected to each of the contact plates 13 to provide a pressure to each of the contact plates 13 so as to press the semiconductor elements to electrically connect the semiconductor elements to the high- . That is, the contact cylinder 15 referred to in the electric connection apparatus 100 of the present invention is provided so as to be connected to each of the contact plates 13 so that each of the contact plates 13 can be driven by hydraulic pressure or pneumatic pressure. The contact cylinders 15 may be provided in the same space 11 so as to have the same number as the number of the contact plates 13.

Therefore, in the test of the semiconductor device using the electrical connection device 100 having the contact plate 13 and the contact cylinder 15, the semiconductor devices and the n-th region (n is a natural number of 2 or more) ) May be connected to the high-fix board 19 by different contact plates 13 and contact cylinders 15.

As described above, the electric connection apparatus 100 according to the present invention includes the contact plate 13 and the contact cylinder 15 that can be independently driven, driven by hydraulic pressure or pneumatic pressure, and divided into the same space 11, It is possible to avoid spatial limitations due to the mechanism implementation and the large press construction, and as a result, the structure can be provided with a simple structure. In particular, it is possible to realize a soft connection between the semiconductor device and the high-fix board 19 because it can be driven independently and can provide a force for contact by pressure. This is because it is possible to provide an appropriate connection force individually depending on the state of the high-fix board 19 when the connection is made.

In addition, the electrical connection device 100 of the present invention may further include a potentiometer 17 to control the speed of the contact cylinder 15 when pressing semiconductor elements. As described above, the electric connection apparatus 100 of the present invention can control the pressing force of the contact plate 13 through the speed control of the contact cylinder 15 using the potentiometer 17, The position control according to the connection of the high-fix board 19 can be performed more easily.

As described above, the electrical connection apparatus 100 according to the present invention has the structure in which the contact plate 13 and the contact cylinder 15, which can be independently driven in the same space 11 and can be driven by pneumatic or hydraulic pressure, And it is possible to precisely control the connection between the semiconductor elements and the high-fix board 19 as well as to realize a connection force for connection in a linear space in a narrow space, It can be more positively applied to the testing of semiconductor devices.

Fig. 2 is a schematic diagram showing an electrical connection device according to another embodiment of the present invention.

First, since the electrical connection device 200 of FIG. 2 has a structure similar to that of the electrical connection device 100 of FIG. 1 except that it further includes a drive motor 25, the same reference numerals are used for the same members, A detailed description thereof will be omitted.

2, the electrical connection device 200 of the present invention includes contact plates 13, contacts 15, and potentiometers 17 in addition to the contact plate 13, contact cylinder 15 and potentiometer 17, And a drive motor 25 that can be driven at one time. That is, the electric connection device 200 of the present invention includes the drive motor 25 that can drive the contact plate 13 having a plurality of contacts at one time and arrange the same at the same position. In other words, each of the contact plates 13 is provided so as to independently and independently drive using the pneumatic or hydraulic pressure provided by the contact cylinder 15, but the entire contact plates provided in the same space 11 are driven by one drive motor (Not shown).

As described above, the electric connection device 200 of the present invention is provided with the drive motor 25 so that the entire plurality of contact plates 13 provided in the same space 11 can be pressed to a position where semiconductor elements can be pressed , The semiconductor elements can be pressed by independently driving each of the contact plates 13 using the contact cylinder 15.

Even in the case of the electrical connection device 200 of the present invention mentioned above, the contact plate 13 is driven by driving of the motor 25, but the pressurization for connection between the semiconductor element and the high-fix board 19 can be performed independently Since the contact plate 13 and the contact cylinder 15 are used, connection between the semiconductor elements and the high-fix board 19 can be precisely controlled.

Therefore, the electrical connection apparatus of the present invention not only can precisely control the connection between the semiconductor elements and the high-fix board by applying the split servo control technique capable of independent driving and being driven by pneumatic or hydraulic pressure, Can be implemented in a linear manner in a narrow space, it can be more positively applied to a test of a recent semiconductor device manufactured at a fine pitch, and as a result, it can be expected that the reliability of a product due to the recent manufacture of a semiconductor device can be improved .

In addition, since the electrical connection device according to the present invention can be applied to a simple structure in addition to the active correction capability for large-area flatness, it is possible to downsize the electrical connection device itself. Therefore, Can be secured.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

11: space 13: contact plate
15: contact cylinder 17: potentiometer
19: Hi-Fix Board 21: Test Socket
25: Driving motor
100, 200: electrical connection device

Claims (3)

An electrical connection apparatus for electrically connecting semiconductor elements for testing to a high-fix board,
A contact plate divided into at least two portions in the same space so as to be able to divide and press each of the semiconductor elements disposed in the same space for the test;
A contact cylinder connected to each of the contact plates to provide a pressure to each of the contact plates to press the semiconductor elements to electrically connect the semiconductor elements to the high-fix board; And
And a drive motor provided to drive the contact plates at a time to a position where the semiconductor elements can be pressed,
Driving the entire contact plate provided in the same space to a position where the semiconductor elements can be pressed by using the driving motor at a time, and then individually driving each of the contact plates using the contact cylinder And presses the semiconductor elements by means of a spring. The method according to claim 1,
Further comprising a potentiometer provided to control the speed of the contact cylinder when pressing the semiconductor elements. delete

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