KR101973700B1 - Manganese aminoamide amide precursors, preparation method thereof and process for the formation of thin film using the same - Google Patents
Manganese aminoamide amide precursors, preparation method thereof and process for the formation of thin film using the same Download PDFInfo
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- KR101973700B1 KR101973700B1 KR1020160155182A KR20160155182A KR101973700B1 KR 101973700 B1 KR101973700 B1 KR 101973700B1 KR 1020160155182 A KR1020160155182 A KR 1020160155182A KR 20160155182 A KR20160155182 A KR 20160155182A KR 101973700 B1 KR101973700 B1 KR 101973700B1
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- 239000002243 precursor Substances 0.000 title claims abstract description 56
- 239000010409 thin film Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 28
- -1 Manganese aminoamide amide Chemical class 0.000 title claims description 36
- 230000008569 process Effects 0.000 title claims description 8
- 238000002360 preparation method Methods 0.000 title description 2
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000011572 manganese Substances 0.000 claims abstract description 62
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 50
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 238000000231 atomic layer deposition Methods 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000005229 chemical vapour deposition Methods 0.000 claims description 12
- XPXMKIXDFWLRAA-UHFFFAOYSA-N hydrazinide Chemical compound [NH-]N XPXMKIXDFWLRAA-UHFFFAOYSA-N 0.000 claims description 8
- 125000005103 alkyl silyl group Chemical group 0.000 claims description 7
- 150000001408 amides Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000000427 thin-film deposition Methods 0.000 claims description 6
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 150000002697 manganese compounds Chemical class 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L manganese oxide Inorganic materials [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 14
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- RRZKHZBOZDIQJG-UHFFFAOYSA-N azane;manganese Chemical compound N.[Mn] RRZKHZBOZDIQJG-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 7
- 0 C[C@](C*)[C@@]1CC(C)NCC1 Chemical compound C[C@](C*)[C@@]1CC(C)NCC1 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 4
- 239000003446 ligand Substances 0.000 description 4
- 239000000376 reactant Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 238000002411 thermogravimetry Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229960004132 diethyl ether Drugs 0.000 description 2
- 239000011151 fibre-reinforced plastic Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- PPNAOCWZXJOHFK-UHFFFAOYSA-N manganese(2+);oxygen(2-) Chemical class [O-2].[Mn+2] PPNAOCWZXJOHFK-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 229910000914 Mn alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical group [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- XGIUDIMNNMKGDE-UHFFFAOYSA-N bis(trimethylsilyl)azanide Chemical compound C[Si](C)(C)[N-][Si](C)(C)C XGIUDIMNNMKGDE-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 229910002102 lithium manganese oxide Inorganic materials 0.000 description 1
- AHNJTQYTRPXLLG-UHFFFAOYSA-N lithium;diethylazanide Chemical compound [Li+].CC[N-]CC AHNJTQYTRPXLLG-UHFFFAOYSA-N 0.000 description 1
- VLXXBCXTUVRROQ-UHFFFAOYSA-N lithium;oxido-oxo-(oxomanganiooxy)manganese Chemical compound [Li+].[O-][Mn](=O)O[Mn]=O VLXXBCXTUVRROQ-UHFFFAOYSA-N 0.000 description 1
- BITPAXWTJXOWKL-UHFFFAOYSA-N lithium;oxolane Chemical compound [Li].C1CCOC1 BITPAXWTJXOWKL-UHFFFAOYSA-N 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- RGVLTEMOWXGQOS-UHFFFAOYSA-L manganese(2+);oxalate Chemical compound [Mn+2].[O-]C(=O)C([O-])=O RGVLTEMOWXGQOS-UHFFFAOYSA-L 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F13/00—Compounds containing elements of Groups 7 or 17 of the Periodic Table
- C07F13/005—Compounds without a metal-carbon linkage
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
본 발명은 열적 안정성과 휘발성이 개선된 신규한 망간 전구체에 관한 것으로, 상기 망간 전구체를 이용하여 낮은 온도에서 우수한 성장 속도로, 쉽게 양질의 망간 함유 박막을 제조하는 방법 및 이를 통해 제조된 박막을 제공할 수 있다.The present invention relates to a novel manganese precursor having improved thermal stability and volatility, and a method for easily producing a high-quality manganese-containing thin film at an excellent growth rate at a low temperature by using the manganese precursor and a thin film produced thereby can do.
Description
본 발명은 신규한 망간 전구체에 관한 것으로서, 보다 상세하게는 열적 안정성과 휘발성이 개선되고 낮은 온도에서 쉽게 양질의 망간 함유 박막의 제조가 가능한 망간 아미노아미드 아미드 전구체 및 이의 제조방법, 그리고 이를 이용하여 박막을 제조하는 방법 및 제조된 박막에 관한 것이다.More particularly, the present invention relates to a manganese aminoamide amide precursor having improved thermal stability and volatility and capable of easily producing a high quality manganese-containing thin film at a low temperature, a method for producing the same, And a thin film produced therefrom.
실리콘은 물성 특성, 수명, 성능 안정성 측면에서 장점이 있는 반면, 박막을 형성하기 위해서 진공 증착과 어닐링 공정 등이 요구되며, 이를 위한 고가의 장비가 디스플레이 제작 원가를 상승시키고 있다. 이러한 관점에서 최근 금속 산화물 물질을 반도체 채널층으로 사용하는 노력이 이루어지고 있는데 금속 산화물은 투명한 소자로의 가능성을 갖고 있다.Silicon is advantageous in terms of physical properties, lifetime, and performance stability, but vacuum deposition and annealing are required to form a thin film. Costly display equipment is costly. In this regard, efforts are recently being made to use a metal oxide material as a semiconductor channel layer, which metal oxide has the potential of being a transparent element.
MnO, Mn3O4, Mn2O3, MnO2 등 다양한 형태로 존재하는 망간 산화물은 전극 물질(electrode materials), 전기 화학적 축전지(electrochemical capacitors), 연 자성 물질(soft magnetic materials)의 제조에 이용될 수 있다. 그리고 망간 산화물은 거대 자기저항(colossal magnetoresistance)과 금속 절연체 전이(metal-insulator transitions)와 같은 다양한 전기적 자기적 성질을 가지는 금속 산화물 페로브스카이트(magnetic oxide perovskite) 화합물을 합성하는데 기판으로 사용된다. 특히 MnO2는 전기 변색(electrochromic) 성질을 나타내며, 탄화수소의 산화, 질소 산화물의 산화 및 환원, 오존의 분해 촉매로 이용되며, 무엇보다도 전지에 주로 이용된다.Manganese oxides present in various forms such as MnO, Mn 3 O 4 , Mn 2 O 3 and MnO 2 are used for the production of electrode materials, electrochemical capacitors and soft magnetic materials . The manganese oxide is used as a substrate to synthesize a metal oxide perovskite compound having various electrical and magnetic properties such as colossal magnetoresistance and metal-insulator transitions. In particular, MnO 2 exhibits electrochromic properties and is used as a catalyst for oxidation of hydrocarbons, oxidation and reduction of nitrogen oxides, and decomposition of ozone.
망간 또는 망간 질화물(MnNx) 박막은 반도체의 전극물질 또는 확산 방지막 등으로 이용될 수 있다. 특히 망간 박막은 유기반도체 전극 및 강자성(ferromagnetic) 전극으로 사용이 가능하며, 망간 질화물 박막은 반도체 소자의 배선의 백엔드(back-end-of-line) 구리 연결재들에서 구리의 확산 방지막 및 구리의 접착층(adhesion layer)으로 이용될 것으로 예상되는 차세대 물질이다. The manganese or manganese nitride (MnN x ) thin film can be used as an electrode material of a semiconductor or a diffusion barrier film. Particularly, the manganese thin film can be used as an organic semiconductor electrode and a ferromagnetic electrode. The manganese nitride thin film can be used as a diffusion barrier film of copper and an adhesive layer of copper in the back-end-of- which is expected to be used as an adhesion layer.
망간 함유 박막을 제조하기 위한 방법으로는 음극 산화(anodic oxidation), 전기도금(electrodeposition), 전기분해 증착, 열분사(spray-pyrolysis) 등과 같은 용액 상 화학 공정 및 전자 빔 증발(electorn beam evaporation), 화학 기상 증착 (chemical vapor deposition, CVD), 스퍼터링(sputtering), 분자 빔 에피텍시(molecular beam epitaxy), 펄스 레이저 증착(pulsed laser deposition)등에 의해 주로 제조되고 있으며, 현재 원자층 증착(atomic layer deposition, ALD)에 의해서도 제조되고 있다.Methods for preparing manganese-containing thin films include solution chemical processes such as anodic oxidation, electrodeposition, electrolytic deposition, spray-pyrolysis, and electorn beam evaporation, And is mainly manufactured by chemical vapor deposition (CVD), sputtering, molecular beam epitaxy, pulsed laser deposition, and the like. Currently, atomic layer deposition , ALD).
망간, 망간 질화물, 망간 산화물 등의 망간 함유 박막을 제조하기 위해서 사용된 선구 물질에는 Mn(thd)3, (thd = 2,2,6,6,-tetramethyl-3,5-heptanedionate), 망간 옥살레이트 (manganese oxalate), 망간 비스시클로펜타디에닐 (MnCp2, Mn(Me4Cp)2, Mn(EtCp)2), Mn(btsa)2 (btsa = bis(trimethylsilyl)amide), 비스(아미드아미노알칸)망간 등의 호모렙틱(Homoleptic) 망간 전구체들이 알려져 있다. 이러한 선구 물질을 사용할 경우 기체 상에서 원하지 않는 반응이 진행되거나, 탄소나 할로겐에 의한 오염, 낮은 열 안정성, 낮은 증기압, 고온에서만 증착이 일어나거나 증착한 막의 순도가 낮고 표면의 고르기가 좋지 않은 등 여러 문제점이 있다.The precursors used for preparing manganese-containing thin films such as manganese, manganese nitride and manganese oxide include Mn (thd) 3 , (thd = 2,2,6,6, -tetramethyl-3,5-heptanedionate) rate (manganese oxalate), manganese bis-cyclopentadienyl (MnCp 2, Mn (Me 4 Cp) 2, Mn (EtCp) 2), Mn (btsa) 2 (btsa = bis (trimethylsilyl) amide), bis (amide amino Homoleptic manganese precursors such as alkane and manganese are known. These precursors can lead to undesirable reactions on the gas, contamination by carbon or halogen, low thermal stability, low vapor pressure, deposition only at high temperatures, poor purity of the deposited film and poor surface roughness .
망간은 주기율표의 제7열의 원소로서, 망간 함유 박막의 증착은 망간 공급원의 낮은 열적 안정성 때문에 여전히 곤란하였다. 결과적으로, CVD 또는 ALD 공정에 이용가능한 열적으로 안정하고 휘발성인 망간 전구체는 거의 없다.Manganese is an element in column 7 of the periodic table and the deposition of the manganese-containing thin film was still difficult due to the low thermal stability of the manganese source. As a result, there are few thermally stable, volatile manganese precursors available for CVD or ALD processes.
따라서, CVD 또는 ALD 공정에 의하여 망간 함유 박막을 제조하는 경우, 사용되는 망간 전구체의 특성에 따라서 증착 정도, 증착 제어 특성, 형성되는 박막의 결정화도, 순도 등에 차이가 생기기 때문에, 열적 안정성, 화학적 반응성, 휘발성 등에 있어서 우수한 특성을 갖는 망간 전구체의 개발이 필요하다. Therefore, when the manganese-containing thin film is produced by the CVD or ALD process, the degree of deposition, the control of the deposition, the crystallinity and the purity of the thin film to be formed are different depending on the characteristics of the manganese precursor used. It is necessary to develop a manganese precursor having excellent properties in terms of volatility and the like.
본 발명은 상기와 같은 문제점을 해결하기 위한 것으로서,SUMMARY OF THE INVENTION The present invention has been made to solve the above problems,
열적 안정성과 휘발성이 개선되고, 낮은 온도에서 쉽게 양질의 망간 함유 박막의 제조가 가능한 신규한 망간 전구체를 제공하는 것을 목적으로 한다.It is an object of the present invention to provide a novel manganese precursor which is improved in thermal stability and volatility and which is capable of easily producing a high quality manganese-containing thin film at a low temperature.
또한, 본 발명은 상기 망간 전구체를 제조하는 신규의 방법을 제공한다.The present invention also provides a novel process for preparing the manganese precursor.
또한, 본 발명은 상기 망간 전구체를 포함하는 망간 함유 박막증착용 조성물을 제공한다.The present invention also provides a manganese-containing thin film deposition composition comprising the manganese precursor.
또한, 본 발명은 상기 망간 전구체를 이용하여 망간 함유 박막을 제조하는 방법 및 이로부터 제조된 망간 함유 박막을 제공하는 것을 목적으로 한다.The present invention also provides a method for producing a manganese-containing thin film using the manganese precursor and a manganese-containing thin film prepared from the method.
상기 목적을 달성하기 위하여, 본 발명은 신규 망간 전구체로, 하기 화학식 1로 표시되는 망간 아미노아미드 아미드 전구체를 제공한다.In order to achieve the above object, the present invention provides a manganese aminoamide amide precursor represented by the following formula (1) as a novel manganese precursor.
[화학식 1][Chemical Formula 1]
상기 화학식 1에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이며; n은 1 또는 2의 정수이다In Formula 1, R 1 to R 5 are each independently a C1 to a linear or branched alkyl group of C10, R 6 and R 7 are independently selected from C1 to C10 linear or branched alkyl group or tri (C1-C10) of each Alkylsilyl group; n is an integer of 1 or 2
또한, 본 발명은 하기 화학식 4의 망간 화합물을 화학식 5의 금속 아미노아미드 및 화학식 6의 금속 아미드와 반응시켜 상기 화학식 1의 망간 아미노아미드 아미드 전구체를 제조하는 방법을 제공한다.The present invention also provides a method for preparing a manganese aminoamide amide precursor of Formula 1 by reacting a manganese compound of Formula 4 with a metal aminoamide of Formula 5 and a metal amide of Formula 6.
[화학식 4][Chemical Formula 4]
[화학식 5[Chemical Formula 5
[화학식 6][Chemical Formula 6]
상기 화학식 4 내지 6에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이며, X1 및 X2는 할로겐이고, M1 및 M2는 각각 독립적으로 알칼리 금속이다.In Formula 4 to 6, R 1 to R 5 are each independently a C1 to C10 linear or branched alkyl group, R 6 and R 7 are each independently a C1 to C10 linear or branched alkyl group or tri (C1- of C10) alkyl silyl group, X 1 and X 2 is a halogen, M 1 and M 2 are each independently an alkali metal.
또한, 본 발명은 상기 화학식 1의 망간 아미노아미드 아미드 전구체를 포함하는 박막증착용 조성물을 제공한다.The present invention also provides a composition for thin film deposition comprising the manganese aminoamide amide precursor of Formula 1 above.
또한, 본 발명은 상기 화학식 1의 망간 아미노아미드 아미드 전구체를 이용하여 망간 함유 박막을 성장시키는 방법 및 이로부터 제조된 망간 함유 박막을 제공한다.Also, the present invention provides a method for growing a manganese-containing thin film using the manganese aminoamide amide precursor of the above formula (1) and a manganese-containing thin film prepared therefrom.
본 발명의 망간 전구체는 아미노아미드 및 아미드의 2종의 리간드로 이루어진 헤테로렙틱 다이머 형태로, 기존 호모렙틱 망간 전구체에 비해 독성이 낮고 열적 안정성과 휘발성이 우수한 특성을 가지며, 지속적인 가온 공정 중에도 물성이 변화되지 않는 높은 열적 안정성을 가지기 때문에 이를 이용하여 쉽게 양질의 망간 함유 박막, 특히 망간 박막, 망간 질화물 박막 또는 망간 산화물 박막을 제조할 수 있다.The manganese precursor of the present invention is in the form of a heteroleptic dimer composed of two kinds of ligands of aminoamide and amide. It has lower toxicity than conventional homoleptic manganese precursor, and has properties of excellent thermal stability and volatility. A high-quality manganese-containing thin film, particularly a manganese thin film, a manganese nitride thin film or a manganese oxide thin film can be easily produced by using the same.
본 발명의 망간 전구체는 산소가 없는 전구체로, 반도체의 전극물질 또는 확산 방지막 등으로 사용가능한 망간 금속 및 망간 질화물 박막을 제조할 수 있다. 또한, 본 발명의 망간 전구체는 쉽게 물(H2O) 또는 산소(O2) 등과 반응하여 리튬 이온 전지의 전극, 자성물질, 촉매 등의 원료물질로 사용 가능한 망간 산화물을 형성할 수 있다.The manganese precursor of the present invention is an oxygen-free precursor, and can produce a manganese metal and a manganese nitride thin film which can be used as an electrode material of a semiconductor or a diffusion barrier film. In addition, the manganese precursor of the present invention can easily react with water (H 2 O), oxygen (O 2 ) or the like to form manganese oxides usable as raw materials for electrodes, magnetic materials, catalysts and the like of lithium ion batteries.
즉, 본 발명에 따른 망간 아미노아미드 아미드 전구체는 망간, 망간 질화물 및 망간 산화물 박막을 위한 선구 물질 및 나노 크기의 망간, 망간 질화물 및 망간 산화물 입자 제조를 위한 선구 물질, 그리고 LiAlMnO4, LiCoMnO4 (리튬 2차 전지용 리튬-망간 산화물), LaxCayMnO3 (자기 냉각 기관 개발), Mn/Ga alloy (자기-광학 메모리) 등 망간을 포함하는 합금 및 나노물질 제조를 위한 선구 물질로서 유용하다.That is, the manganese aminoamide amide precursor according to the present invention is a precursor for manganese, manganese nitride, and manganese oxide thin films, a precursor for producing nano-sized manganese, manganese nitride and manganese oxide particles, and a precursor for producing LiAlMnO 4 , LiCoMnO 4 Lithium-manganese oxide for secondary battery), La x Ca y MnO 3 (Self-cooling engine development), Mn / Ga alloy (magnetic-optical memory), and the like.
도 1은 실시예 1의 [Mn(etmpda)(diethylamino)]2의 TGA data이다.1 is TGA data of [Mn (etmpda) (diethylamino)] 2 of Example 1. Fig.
이하, 본 발명에 대하여 보다 구체적으로 설명한다. 이 때 사용되는 기술 용어 및 과학 용어에 있어서 다른 정의가 없다면, 이 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 통상적으로 이해하고 있는 의미를 가지며, 하기의 설명에서 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 기능 및 구성에 대한 설명은 생략한다.Hereinafter, the present invention will be described in more detail. Unless otherwise defined, technical terms and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In the following description, And a description of the known function and configuration will be omitted.
본 발명은 반응성이 상이한 2종의 리간드가 결합된 헤테로렙틱(heteroleptic) 망간 전구체에 관한 것으로, 보다 상세하게는 하기 화학식 1로 표시되는 망간 아미노아미드 아미드 전구체에 관한 것이다.The present invention relates to a heteroleptic manganese precursor to which two kinds of ligands having different reactivity are bonded, and more particularly to a manganese aminoamide amide precursor represented by the following formula (1).
[화학식 1][Chemical Formula 1]
상기 화학식 1에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이며; n은 1 또는 2의 정수이다.In Formula 1, R 1 to R 5 are each independently a C1 to a linear or branched alkyl group of C10, R 6 and R 7 are independently selected from C1 to C10 linear or branched alkyl group or tri (C1-C10) of each Alkylsilyl group; n is an integer of 1 or 2;
본 발명의 망간 아미노아미드 아미드 전구체는 신규한 화합물로서, 망간을 중심원자로 하여 서로 상이한 2개의 리간드 즉, 아미노아미드와 아미드 리간드를 가짐으로써, 보다 향상된 휘발특성을 가질 수 있으며, 특히 향상된 열적 안정성을 가질 수 있다. 또한 상온에서 고체 상태로 존재하여 취급성이 용이할 뿐 아니라 우수한 보관 안정성을 가진다는 장점을 가진다. 또한, 이를 이용하여 박막을 제조할 경우 박막의 성장 속도(growth rate)가 우수하고, 비교적 낮은 온도에서 박막을 제조할 수 있다. The manganese aminoamide amide precursor of the present invention is a novel compound having manganese as a central atom and having two ligands different from each other, that is, an aminoamide and an amide ligand, can have more improved volatility characteristics, . In addition, it has a merit of being in a solid state at room temperature and being easy to handle and having excellent storage stability. In addition, when a thin film is manufactured using the same, the growth rate of the thin film is excellent and a thin film can be manufactured at a relatively low temperature.
본 발명의 일 실시예에 있어서, 상기 망간 아미노아미드 아미드 전구체는 하기 화학식 2 또는 3으로 표시될 수 있다.In one embodiment of the present invention, the manganese aminoamide amide precursor may be represented by the following general formula (2) or (3).
[화학식 2](2)
[화학식 3](3)
상기 화학식 2 및 3에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이다.In Formula 2 and 3, R 1 to R 5 are each independently a C1 to C10 linear or branched alkyl group, R 6 and R 7 are each independently a C1 to C10 linear or branched alkyl group or tri (C1- of C10) alkylsilyl group.
본 발명의 일 실시예에 있어서, 바람직하게, 상기 R1 내지 R7는 각각 독립적으로 C1 내지 C7의 선형 또는 분지형 알킬기일 수 있고, 보다 바람직하게 R1 내지 R7는 각각 독립적으로 C1 내지 C4의 선형 또는 분지형 알킬기일 수 있다.In one embodiment of the present invention, preferably, R 1 to R 7 each independently may be a linear or branched alkyl group having 1 to 7 carbon atoms, more preferably, R 1 to R 7 are each independently C1 to C4 Of a linear or branched alkyl group.
본 발명의 일 실시예에 있어서, 상기 R1 내지 R7는 각각 독립적으로 메틸(methyl), 에틸(ethyl), 프로필(propyl), 이소프로필(iso-propyl), 부틸(butyl), 이소부틸(iso-butyl) 또는 tert-부틸(tert-butyl)일 수 있고, 보다 바람직하게 R1 내지 R4는 각각 독립적으로 메틸이고, R5 내지 R7는 각각 독립적으로 에틸, 프로필, 이소프로필, 부틸, 이소부틸 또는 tert-부틸일 수 있다.In one embodiment of the present invention, R 1 to R 7 are each independently selected from the group consisting of methyl, ethyl, propyl, iso-propyl, butyl, isobutyl iso-butyl or tert-butyl, more preferably R 1 to R 4 are each independently methyl, R 5 to R 7 are each independently ethyl, propyl, isopropyl, butyl, Isobutyl or tert-butyl.
또한, 본 발명은 상기 화학식 1의 망간 아미노아미드 아미드 전구체를 제조하는 방법을 제공한다.The present invention also provides a method for preparing the manganese aminoamide amide precursor of the above formula (1).
상기 화학식 1의 망간 아미노아미드 아미드 전구체는 하기 화학식 4로 표시되는 망간 화합물을 화학식 5로 표시되는 금속 아미노아미드 및 화학식 6으로 표시되는 금속 아미드와 반응시켜 제조될 수 있다.The manganese aminoamide amide precursor of Formula 1 may be prepared by reacting a manganese compound represented by Formula 4 with a metal aminoamide represented by Formula 5 and a metal amide represented by Formula 6.
[화학식 4][Chemical Formula 4]
[화학식 5[Chemical Formula 5
[화학식 6][Chemical Formula 6]
상기 화학식 4 내지 6에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이며, X1 및 X2는 할로겐이고, M1 및 M2는 각각 독립적으로 알칼리 금속이다.In Formula 4 to 6, R 1 to R 5 are each independently a C1 to C10 linear or branched alkyl group, R 6 and R 7 are each independently a C1 to C10 linear or branched alkyl group or tri (C1- of C10) alkyl silyl group, X 1 and X 2 is a halogen, M 1 and M 2 are each independently an alkali metal.
본 발명의 일 실시예에 있어서, 상기 반응은 유기 용매 내에서 수행될 수 있으며, 사용 가능한 유기 용매는 한정되지는 않지만, 상기 반응물들에 대하여 높은 용해도를 가지는 유기 용매를 사용하는 것이 바람직하며, 보다 바람직하게는 헥산(Hexane), 디에틸에테르(diethylether), 톨루엔(toluene), 테트라하이드로퓨란(THF) 등을 사용할 수 있으며, 더욱더 바람직하게는 테트라하이드로퓨란을 사용할 수 있다. In one embodiment of the present invention, the reaction can be carried out in an organic solvent. Although the organic solvent usable is not limited, it is preferable to use an organic solvent having a high solubility with respect to the reactants, Preferably, hexane, diethylether, toluene, tetrahydrofuran (THF) and the like can be used, and more preferably tetrahydrofuran can be used.
상기 화학식 5의 금속 아미노아미드는 공지의 방법으로 제조할 수 있으며, 일례로 하기 화학식 7의 다이아미노에탄을 하기 화학식 8의 알킬금속 화합물과 반응시켜 제조할 수 있다.The metal aminoamide of Formula 5 may be prepared by a known method. For example, the metal aminoamide of Formula 5 may be prepared by reacting diaminoethane of Formula 7 with an alkyl metal compound of Formula 8 below.
[화학식 7](7)
[화학식 8][Chemical Formula 8]
상기 화학식 7 및 8에서, R1 내지 R5 및 R'는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, M1는 알킬리 금속이다.In the above formulas (7) and (8), R 1 to R 5 and R 'are each independently a C 1 to C 10 linear or branched alkyl group, and M 1 is an alkylid metal.
상기 화학식 6의 금속 아미드는 공지의 방법으로 제조하여 사용하거나, 판매중인 시약을 사용할 수 있다. The metal amide of formula (6) may be prepared by using a known method or may be a commercially available reagent.
본 발명의 망간 아미노아미드 아미드 전구체를 제조하기 위한 방법은 하기 반응식 1로 나타낼 수 있다.The method for preparing the manganese aminoamide amide precursor of the present invention can be represented by the following reaction formula (1).
[반응식 1][Reaction Scheme 1]
상기 반응식 1에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이며, X1 및 X2는 할로겐이고, M1 및 M2는 각각 독립적으로 알칼리 금속이고, n은 1 또는 2의 정수이다.In the above scheme 1, R 1 to R 5 are each independently a C1 to a linear or branched alkyl group of C10, R 6 and R 7 are independently selected from C1 to C10 linear or branched alkyl group or tri (C1-C10) of each X 1 and X 2 are halogen, M 1 and M 2 are each independently an alkali metal, and n is an integer of 1 or 2.
상기 반응식 1에 따르면, 헥산, 디에틸에테르, 톨루엔 또는 테트라하이드로퓨란과 같은 용매 하에서, 화학식 4의 망간 화합물과 화학식 5의 금속 아미노아미드를 상온(room temperature, rt)에서 5 내지 10시간 동안 반응시킨 후 이어서 화학식 6의 금속 아미드를 가하여 5 내지 15 시간 동안 반응시킬 수 있다. 이를 통해 상기 화학식 1의 망간 아미노아미드 아미드 전구체를 얻을 수 있다. According to Reaction Scheme 1, the manganese compound of Chemical Formula 4 and the metal aminoamide of Chemical Formula 5 are allowed to react at room temperature (rt) for 5 to 10 hours in a solvent such as hexane, diethyl ether, toluene or tetrahydrofuran Followed by addition of the metal amide of formula (VI) and the reaction may be carried out for 5 to 15 hours. Thus, the manganese aminoamide amide precursor of Formula 1 can be obtained.
상기 반응에서 반응물들은 화학양론적 당량비로 사용될 수 있다.Reactants in this reaction can be used in stoichiometric equivalents.
본 발명의 망간 아미노아미드 아미드 전구체는 열적으로 안정하고 좋은 휘발성 및 높은 반응성을 가지므로, 낮은 온도에서 쉽게 박막을 제조할 수 있으며, 성장속도(Growth rate)가 좋은 장점이 있다.Since the manganese aminoamide amide precursor of the present invention is thermally stable, has good volatility and high reactivity, it can easily form a thin film at a low temperature and has a good growth rate.
또한, 본 발명은 상기 화학식 1의 망간 아미노아미드 아미드 전구체를 포함하는 박막증착용 조성물을 제공한다.The present invention also provides a composition for thin film deposition comprising the manganese aminoamide amide precursor of Formula 1 above.
본 발명의 망간 아미노아미드 아미드 전구체를 이용하여 망간 함유 박막을 제조할 수 경우 높은 증기압 및 반응성을 가지고, 지속적인 가온 공정 시에도 자발적으로 분해되거나 다른 물질과 반응하는 등의 부반응을 일으키지 않아 용이하게 양질의 망간 함유 박막을 제조할 수 있다.When the manganese aminoamide amide precursor of the present invention can be used to produce a manganese-containing thin film, it has a high vapor pressure and reactivity and does not cause side reactions such as spontaneous decomposition or reaction with other materials even during continuous heating, A manganese-containing thin film can be produced.
본 발명의 박막증착용 조성물은 상기 망간 아미노아미드 아미드 전구체를 포함하며, 본 발명의 박막증착용 조성물 내 망간 아미노아미드 아미드 전구체의 함량은 박막의 성막조건 또는 박막의 두께 및 특성 등을 고려하여 당업자가 인식할 수 있는 범위 내로 포함될 수 있다.The composition of the thin film deposition composition of the present invention includes the manganese aminoamide amide precursor, and the content of the manganese aminoamide amide precursor in the thin film deposition composition of the present invention may vary depending on the deposition conditions of the thin film, It can be included within a recognizable range.
또한, 본 발명은 상기 화학식 1의 망간 아미노아미드 아미드 전구체를 이용하여 망간 함유 박막을 성장시키는 방법 및 이로부터 제조된 망간 함유 박막을 제공한다.Also, the present invention provides a method for growing a manganese-containing thin film using the manganese aminoamide amide precursor of the above formula (1) and a manganese-containing thin film prepared therefrom.
본 발명의 망간 아미노아미드 아미드 전구체는 공지의 증착방법, 예를 들면 화학 기상 증착 (chemical vapor deposition, CVD), 플라즈마 강화 화학 기상 증착 (PECVD), 원자층 증착(atomic layer deposition, ALD) 등을 이용하여 망간 함유 박막을 제조할 수 있으며, 특히 바람직하게는 화학기상증착법(CVD) 또는 원자층증착법(ALD), 보다 바람직하게는 원자층증착법(ALD)을 사용하는 공정에 적용될 수 있다.The manganese aminoamide amide precursor of the present invention can be produced by a known deposition method such as chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD) Containing thin film can be produced by a known method such as a chemical vapor deposition (CVD) method or an atomic layer deposition (ALD) method, and more preferably, an atomic layer deposition (ALD) method.
상기 망간 함유 박막은 망간 박막, 망간 질화물 박막 또는 망간 산화물 박막을 나타낸다.The manganese-containing thin film is a manganese thin film, a manganese nitride thin film, or a manganese oxide thin film.
예컨대 화학기상증착법(CVD)을 사용하는 경우, 본 발명의 망간 아미노아미드 아미드 전구체를 포함하는 반응물 및 유기물 등을 반응기에 공급함으로써 다양한 기재 위에 망간 함유 박막을 형성할 수 있다. 본 발명의 신규한 망간 아미노아미드 아미드 전구체는 열적으로 안정하고 좋은 휘발성을 가지고 있기 때문에 다양한 조건에서 박막을 제조하는 것이 가능하고 또한 낮은 온도에서도 양질의 박막을 제조할 수 있다.For example, in the case of using chemical vapor deposition (CVD), a manganese-containing thin film can be formed on various substrates by supplying reactants and organic materials including the manganese aminoamide amide precursor of the present invention to the reactor. Since the novel manganese aminoamide amide precursor of the present invention is thermally stable and has good volatility, a thin film can be produced under various conditions and a thin film of good quality can be produced even at a low temperature.
또한, 예컨대 원자층증착법(ALD)를 사용하는 경우, 본 발명의 망간 아미노아미드 아미드 전구체를 이용하여 ALD 공정에 의해 망간 함유 박막을 제조할 수 있다. ALD 공정에서 본 발명의 망간 아미노아미드 아미드 전구체를 포함하는 반응물은 증착 챔버(chamber)에 펄스 형태로 공급되며, 상기 펄스가 웨이퍼 표면과 화학적 반응을 일으키면서 정밀한 단층 막 성장이 이루어진다. 본 발명의 망간 아미노아미드 아미드 전구체는 열적으로 안정하고 좋은 휘발성을 가지고 있기 때문에 ALD 공정에 의해 쉽게 양질의 망간 함유 박막을 제조할 수 있다.Further, in the case of using atomic layer deposition (ALD), for example, a manganese-containing thin film can be produced by the ALD process using the manganese aminoamide amide precursor of the present invention. In the ALD process, the reactants containing the manganese aminoamide amide precursor of the present invention are supplied to the deposition chamber in the form of pulses, and the pulses are chemically reacted with the wafer surface to achieve precise monolayer growth. Since the manganese aminoamide amide precursor of the present invention is thermally stable and has good volatility, a high quality manganese-containing thin film can be easily produced by the ALD process.
본 발명의 망간 아미노아미드 아미드 전구체는 헤테로렙틱 형태로, ALD 공정에 더욱 적합하다.The manganese aminoamide amide precursors of the present invention are in a heteroleptic form and are more suitable for ALD processes.
본 발명의 일 실시예에 따른 상기 박막의 제조는 100 내지 400 ℃의 온도범위에서 수행될 경우, 매끄럽고 균일한 박막을 제조할 수 있어 바람직하나 이에 한정되는 것은 아니다. The preparation of the thin film according to an embodiment of the present invention is preferably performed because it can produce a smooth and uniform thin film when the thin film is performed at a temperature ranging from 100 to 400 ° C.
본 발명은 상기 방법으로 제조된 박막을 제공하며, 상기 박막은 다양한 기재 위에 형성될 수 있다. 이때, 상기 기재는 금속기재, 무기기재, 유-무기 하이브리드 기재 등을 사용할 수 있으며 이에 제한되는 것은 아니다. 상기 금속기재의 비한정적인 일예로는 호일(foil), 시트(sheet), 필름(film) 등의 형상일 수 있으며, 구리(Cu), 알루미늄(Al), 철(Fe), 은(Ag), 팔라듐(Pd), 니켈(Ni), 크롬(Cr), 몰리브덴(Mo), 텅스텐(W), 스테인리스 스틸 또는 이들의 합금으로 이루어진 군에서 선택된 금속기재일 수 있으며, 상기 무기기재의 비한정적인 일예로는 그라파이트 시트(graphite sheet), 카본 패브릭(carbon fabric), 글라스 패브릭(glass fabric), 글라스 페이퍼(glass paper), 세라믹 페이퍼(ceramic paper), 글라스 시트(glass sheet) 등일 수 있으며, 상기 유-무기 하이브리드 기재의 비한정적인 일예로는 무기입자를 포함하는 고분자 필름, 유리섬유 또는 카본섬유에 레진(resin)을 함침시켜 제조된 FRP(Fiber Reinforced Plastic) 등일 수 있다.The present invention provides a thin film produced by the above method, wherein the thin film can be formed on various substrates. At this time, the substrate may be a metal substrate, an inorganic substrate, or an organic-inorganic hybrid substrate, but is not limited thereto. A non-limiting example of the metal substrate may be a foil, a sheet, a film or the like and may be formed of copper (Cu), aluminum (Al), iron (Fe), silver (Ag) (Pd), nickel (Ni), chromium (Cr), molybdenum (Mo), tungsten (W), stainless steel or alloys thereof, For example, it may be a graphite sheet, a carbon fabric, a glass fabric, a glass paper, a ceramic paper, a glass sheet, - Non-limiting example of the inorganic hybrid substrate may be a polymer film containing inorganic particles, FRP (Fiber Reinforced Plastic) produced by impregnating a glass fiber or carbon fiber with a resin, and the like.
본 발명은 하기의 실시예에 의하여 보다 더 잘 이해될 수 있으며, 하기의 실시예는 본 발명의 예시 목적을 위한 것이며 첨부된 특허청구범위에 의하여 한정되는 보호범위를 제한하고자 하는 것은 아니다.The present invention may be better understood by the following examples, which are for the purpose of illustrating the invention and are not intended to limit the scope of protection defined by the appended claims.
실시예Example 1. [Mn( 1. [Mn ( etmpdaactive )() ( diethylaminodiethylamino )])] 22 의 제조Manufacturing
슈렝크 플라스크에 MnCl2 (0.50 g, 4.0 mmol, 1 eq)를 테트라하이드로퓨란에 녹인 후 Lithium (2-(diethylamino)-2-methylpropyl)-2-ehtylamide (0.60 g, 4.0 mmol, 1 eq)를 상온에서 6시간 동안 교반한 후 Lithium diethylamide (0.31 g, 4.0 mmol, 1 eq)를 첨가한 후, 상온에서 12시간 동안 교반하였다. 반응물을 여과하여 얻은 용액을 감압증류하여 용매를 제거하고 헥산으로 추출하여 갈색 고체 화합물을 얻었다(0.6 g, 60%). Dissolve the shoe Lenk MnCl 2 (0.50 g, 4.0 mmol , 1 eq) to the flask in tetrahydrofuran Lithium (2- (diethylamino) -2- methylpropyl) for -2-ehtylamide (0.60 g, 4.0 mmol, 1 eq) After stirring at room temperature for 6 hours, lithium diethylamide (0.31 g, 4.0 mmol, 1 eq) was added and stirred at room temperature for 12 hours. The reaction mixture was filtered, and the solvent was distilled off under reduced pressure. The solvent was extracted with hexane to obtain a brown solid compound (0.6 g, 60%).
FT-IR (cm-1): 2955(s), 2926(s), 2874(s), 2828(s), 2664(m), 2565(w), 1591(w), 1456(m), 1404(w), 1381(w), 1362(s), 1345(s), 1331(w), 1304(w), 1276(m), 1232(w), 1191(w), 1174(w), 1137(s), 1106(w), 1080(w), 1035(m), 1009(s), 990(s), 973(w), 949(m), 910(m), 875(m), 846(m), 837(m), 791(m), 776(m), 598(w), 538(s), 477(w). FT-IR (cm -1 ): 2955 (s), 2926 (s), 2874 (s), 2828 (s), 2664 (m), 2565 (w), 1381 (w), 1362 (s), 1345 (s), 1331 (w), 1304 (w), 1276 (m), 1232 (s), 1106 (w), 1080 (w), 1035 (m), 1009 (s), 990 (s), 973 (m), 837 (m), 791 (m), 776 (m), 598 (w), 538 (s), 477 (w).
Anal. Calcd for C24H58Mn2N6ㆍ2H2O: C, 49.99; H, 10.84; N, 14.57. Found: C, 49.57; H, 10.84; N; 14.81.Anal. Calcd for C 24 H 58 Mn 2 N 6 .2H 2 O: C, 49.99; H, 10.84; N, 14.57. Found: C, 49.57; H, 10.84; N; 14.81.
실험예Experimental Example 1. 망간 전구체 물질의 분석 1. Analysis of manganese precursor materials
상기 실시예 1의 [Mn(etmpda)(diethylamino)]2의 열적 안정성 및 휘발성과 분해 온도를 알아보기 위해, 열무게 분석(thermogravimetric analysis, TGA)법을 이용하였다. 상기 TGA 방법은 생성물을 10 ℃/분의 속도로 900 ℃까지 가온 시키면서, 1.5 bar/분의 압력으로 아르곤 가스를 주입하였다. Thermogravimetric analysis (TGA) was used to determine the thermal stability, volatility and decomposition temperature of [Mn (etmpda) (diethylamino)] 2 in Example 1 above. In the TGA method, argon gas was introduced at a pressure of 1.5 bar / min while heating the product to 900 ° C at a rate of 10 ° C / minute.
실시예 1의 [Mn(etmpda)(diethylamino)]2은 상온부터 질량 감소가 일어났으며, 400 ℃에서 50 % 이상의 질량 감소가 일어나는 것을 관찰하였다[도 1].It was observed that the [Mn (etmpda) (diethylamino)] 2 of Example 1 had a mass loss from room temperature and a mass loss of more than 50% occurred at 400 ° C (FIG.
Claims (9)
[화학식 3]
상기 화학식 3에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이다.A manganese aminoamide amide precursor represented by the following formula (3).
(3)
In Formula 3, R 1 to R 5 are each independently a C1 to a linear or branched alkyl group of C10, R 6 and R 7 are independently selected from C1 to C10 linear or branched alkyl group or tri (C1-C10) of each Alkylsilyl group.
상기 R1 내지 R7는 각각 독립적으로 C1 내지 C7의 선형 또는 분지형 알킬기인 망간 아미노아미드 아미드 전구체.3. The method of claim 2,
Wherein R 1 to R 7 are each independently a C1 to C7 linear or branched alkyl group.
상기 R1 내지 R7는 각각 독립적으로 메틸(methyl), 에틸(ethyl), 프로필(propyl), 이소프로필(iso-propyl), 부틸(butyl), 이소부틸(iso-butyl) 또는 tert-부틸(tert-butyl)인 망간 아미노아미드 아미드 전구체.3. The method of claim 2,
R 1 to R 7 are each independently selected from the group consisting of methyl, ethyl, propyl, iso-propyl, butyl, iso-butyl or tert- tert-butyl) manganese aminoamide amide precursor.
[화학식 1]
[화학식 4]
[화학식 5
[화학식 6]
상기 화학식 1 및 4 내지 6에서, R1 내지 R5는 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기이고, R6 및 R7은 각각 독립적으로 C1 내지 C10의 선형 또는 분지형 알킬기 또는 트리(C1-C10)알킬실릴기이며, X1 및 X2는 할로겐이고, M1 및 M2는 각각 독립적으로 알칼리 금속이고, n은 2의 정수이다.Reacting a manganese compound represented by the following formula (4) with a metal aminoamide represented by the formula (5) and a metal amide represented by the formula (6) to prepare a manganese aminoamide amide precursor represented by the following formula (1).
[Chemical Formula 1]
[Chemical Formula 4]
[Chemical Formula 5
[Chemical Formula 6]
In formula (I) and 4 to 6, R 1 to R 5 are each independently a C1 to a linear or branched alkyl group of C10, R 6 and R 7 are each independently a linear or branched alkyl group or tri C1 to C10 ( C 1 -C 10) alkylsilyl group, X 1 and X 2 are halogen, M 1 and M 2 are each independently an alkali metal, and n is an integer of 2.
상기 박막 성장 공정이 화학기상증착법(CVD) 또는 원자층증착법(ALD)에 의해 수행되는 것인 방법.8. The method of claim 7,
Wherein the thin film growth process is performed by chemical vapor deposition (CVD) or atomic layer deposition (ALD).
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