KR101958694B1 - Ela 장치용 기판 지지모듈 - Google Patents
Ela 장치용 기판 지지모듈 Download PDFInfo
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- KR101958694B1 KR101958694B1 KR1020160025804A KR20160025804A KR101958694B1 KR 101958694 B1 KR101958694 B1 KR 101958694B1 KR 1020160025804 A KR1020160025804 A KR 1020160025804A KR 20160025804 A KR20160025804 A KR 20160025804A KR 101958694 B1 KR101958694 B1 KR 101958694B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 179
- 238000000034 method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 239000013013 elastic material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 description 12
- 238000000137 annealing Methods 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laser Beam Processing (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
도 2 - 본 발명에 따른 ELA 장치용 기판 지지모듈의 주요부에 대한 사시도.
도 3 - 본 발명에 따른 ELA 장치용 기판 지지모듈의 주요부에 대한 정면도.
도 4 - 종래 기술(a) 및 본 발명에 따른 ELA 장치용 기판 지지모듈(b)의 스테이지에 대한 모식도.
도 5 - 본 발명에 따른 ELA 장치용 기판 지지모듈의 지지대에 대한 모식도.
110 : 기판 120 : 스테이지
130 : 지지대 210 : 패턴
Claims (8)
- 기판이 안착되는 스테이지와, 상기 스테이지를 상하 방향으로 관통하도록 설치되어, 기판을 스테이지 상에 로딩 또는 언로딩시키는 지지대와, 상기 지지대를 승하강시키는 승하강구동부를 포함하여 구성되는 ELA 장치용 기판 지지모듈에 있어서,
상기 스테이지는 소정 구역으로 분할되어 각 구역은 서로 독립적인 진공흡입영역을 형성하되, 상기 진공흡입영역은 상기 스테이지의 중앙 부분부터 순차적으로 진공 흡입이 이루어지도록 형성되어 상기 기판의 중심부부터 순차적으로 상기 스테이지에 접촉되도록 형성되되,
상기 진공흡입영역은,
사각 형상으로 형성되며, 중앙 부분에 형성된 제1영역, 상기 제1영역의 대향되는 모서리 바깥쪽으로 각각 형성된 제2영역, 상기 제2영역 바깥쪽으로 각각 형성된 제3영역, 상기 제1영역의 대향되는 다른 모서리 바깥쪽으로 각각 형성된 제4영역, 상기 제2영역 및 제3영역 그리고 제4영역으로 둘러싸인 스테이지의 각 꼭지점 부분에 각각 형성된 제5영역으로 이루어지며, 제1영역에서 제5영역까지 순차적으로 진공 흡입이 이루어지도록 형성되고,
각 구역별로 상기 진공흡입영역의 작동을 제어하고, 각 구역별로 압력 체크를 통하여 기판의 워프 현상을 체크한 후 개별 제어를 통해 압력을 보정하는 진공제어부가 형성되며,
상기 스테이지는,
상부에 소정의 패턴이 격자 형태로 형성되며, 상기 패턴은 각 구역별로 독립적인 진공 흡입이 구현되도록 구획되어 형성되고,
상기 패턴은,
깊이 0.2mm~0.4mm, 폭 2.5mm~3.5mm, 간격 4.5mm~5.0mm의 오목한 홈으로, 그 길이방향에 대해 수직으로 절단한 단면이 직사각형 형태로 형성되며,
상기 지지대는,
하부는 경질의 재질로 형성되며, 상부는 탄성력이 있는 재질로 형성된 이중 구조로 형성된 것을 특징으로 하는 ELA 장치용 기판 지지모듈. - 삭제
- 삭제
- 삭제
- 삭제
- 제 1항에 있어서, 상기 패턴은,
상기 스테이지의 가장자리부까지 연장되어 형성되어, 상기 스테이지의 외곽부가 개방되도록 형성된 것을 특징으로 하는 ELA 장치용 기판 지지모듈. - 제 1항에 있어서, 상기 지지대는,
상기 스테이지의 전 영역에 대해 복수개로 배치되며,
상기 기판의 벤딩이 유도되도록 상기 스테이지의 중앙 부분에 있는 지지대의 높이가 스테이지의 외곽 부분에 있는 지지대의 높이보다 상대적으로 낮게 형성된 것을 특징으로 하는 ELA 장치용 기판 지지모듈. - 삭제
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020160025804A KR101958694B1 (ko) | 2016-03-03 | 2016-03-03 | Ela 장치용 기판 지지모듈 |
CN201710080337.1A CN107154368B (zh) | 2016-03-03 | 2017-02-15 | 准分子激光退火装置用基板支撑模块 |
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KR1020160025804A KR101958694B1 (ko) | 2016-03-03 | 2016-03-03 | Ela 장치용 기판 지지모듈 |
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CN111085954A (zh) * | 2019-12-24 | 2020-05-01 | 深圳市华星光电半导体显示技术有限公司 | 基板吸附装置 |
CN111430279B (zh) * | 2020-04-30 | 2023-09-01 | 瑞安市荣海机电有限公司 | 一种准分子激光退火设备用基板支撑装置 |
KR102435298B1 (ko) | 2020-07-07 | 2022-08-24 | 디앤에이 주식회사 | 기판 지지장치 |
CN113387132B (zh) * | 2021-05-12 | 2023-09-12 | 合肥欣奕华智能机器股份有限公司 | 一种基板作业平台及基板作业平台的控制方法 |
Citations (2)
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JP2011146663A (ja) * | 2009-04-06 | 2011-07-28 | Canon Inc | 基板保持装置、及びそれを用いたリソグラフィー装置、並びにデバイスの製造方法 |
WO2015169616A1 (en) * | 2014-05-06 | 2015-11-12 | Asml Netherlands B.V. | Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method |
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JP2990594B2 (ja) * | 1996-12-13 | 1999-12-13 | ニューストロング販売 株式会社 | 真空チャック |
EP1077393A2 (en) * | 1999-08-19 | 2001-02-21 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
US8198567B2 (en) * | 2008-01-15 | 2012-06-12 | Applied Materials, Inc. | High temperature vacuum chuck assembly |
KR101011932B1 (ko) | 2009-06-25 | 2011-02-08 | 에이피시스템 주식회사 | 대형 기판 안착장치 |
JP2012151407A (ja) * | 2011-01-21 | 2012-08-09 | Ushio Inc | ワークステージおよびこのワークステージを使った露光装置 |
AT511627B1 (de) * | 2011-07-01 | 2015-05-15 | Mechatronic Systemtechnik Gmbh | Vorrichtung zum halten eines flächigen substrats |
KR101368819B1 (ko) | 2011-12-20 | 2014-03-06 | 삼성디스플레이 주식회사 | 기판 이송장치 |
KR101432152B1 (ko) | 2012-11-13 | 2014-08-22 | 삼성디스플레이 주식회사 | 기판 지지 모듈 |
KR101821636B1 (ko) * | 2013-08-28 | 2018-03-08 | 에이피시스템 주식회사 | 기판 안착 장치 |
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JP2011146663A (ja) * | 2009-04-06 | 2011-07-28 | Canon Inc | 基板保持装置、及びそれを用いたリソグラフィー装置、並びにデバイスの製造方法 |
WO2015169616A1 (en) * | 2014-05-06 | 2015-11-12 | Asml Netherlands B.V. | Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method |
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CN107154368A (zh) | 2017-09-12 |
KR20170104040A (ko) | 2017-09-14 |
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