KR101946599B1 - Polishing apparatus - Google Patents
Polishing apparatus Download PDFInfo
- Publication number
- KR101946599B1 KR101946599B1 KR1020150161979A KR20150161979A KR101946599B1 KR 101946599 B1 KR101946599 B1 KR 101946599B1 KR 1020150161979 A KR1020150161979 A KR 1020150161979A KR 20150161979 A KR20150161979 A KR 20150161979A KR 101946599 B1 KR101946599 B1 KR 101946599B1
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- KR
- South Korea
- Prior art keywords
- polishing
- axis
- polished
- unit
- axis variable
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/0031—Machines having several working posts; Feeding and manipulating devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
- B24B13/0031—Machines having several working posts; Feeding and manipulating devices
- B24B13/0037—Machines having several working posts; Feeding and manipulating devices the lenses being worked by different tools, e.g. for rough-grinding, fine-grinding, polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention provides a polishing apparatus capable of cross-polishing. The cross-polishable polishing apparatus includes a body portion, a seating portion provided on the body portion, on which the object to be polished is seated; A polishing unit installed on the main body so as to be positioned above the seating unit, the polishing unit polishing the object to be polished; And a cross polishing unit installed in the main body to vary the polishing position for the object to be polished along different axes.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus capable of cross-polishing, and more particularly, to a polishing apparatus capable of cross-polishing capable of increasing an amount of grinding by polishing an object to be polished while being moved along an axis forming an orthogonal direction.
Generally, processing of a material to be polished such as a lens or a cover glass is composed of a device for transferring a material to be polished, a device for fixing the material to be polished, and a device for polishing the material to be polished.
Conventionally, a material to be polished, which has a hemispherical shape or a right angle and has grooves, is polished and processed into a predetermined shape through a polishing apparatus to be molded.
Normally, an abrasive member included in a polishing apparatus for polishing is rotated by itself and guided by a linear guide to polish a material to be polished.
As a result, the polishing rate at the portion to be polished may be lowered and the uniformity of the polished surface may be lowered.
In other words, conventionally, there is a problem that the abrasive material is not polished while the abrasive material flows along an axis forming the orthogonal direction, and the amount of grinding is remarkably lowered.
A prior art document related to the present invention is Korean Patent Registration No. 10-0778806 (registered on November 16, 2007).
An object of the present invention is to provide a polishing apparatus capable of cross-polishing capable of increasing an amount of grinding by polishing an object to be polished while flowing along an axis forming an orthogonal direction.
In a preferred aspect, the present invention provides a polishing apparatus capable of cross-polishing.
The cross-polishable polishing apparatus includes a body portion, a seating portion provided on the body portion, on which the object to be polished is seated; A polishing unit installed on the main body so as to be positioned above the seating unit, the polishing unit polishing the object to be polished; And a cross polishing unit installed in the main body to vary the polishing position for the object to be polished along different axes.
It is preferable that the cross polishing section controls the polishing section so as to be movable along the X axis and the Y axis.
Wherein the cross polishing section comprises: an X-axis variable section disposed in the seating section for varying the polishing section along the X axis; a Y-axis varying section for varying the X-axis varying section along the Y-axis; And a control unit for controlling the driving of the shaft variable portion.
Preferably, the control unit independently drives the X-axis variable unit and the Y-axis variable unit, and controls the reciprocating movement within a set movement interval.
The polishing unit includes a polishing head provided on the X-axis variable portion and having a rotary motor rotated by receiving a control signal from the control unit; and a polishing head mounted on the polishing head, rotated by driving the rotary motor, And a polishing member for polishing the wafer.
Preferably, the object to be polished is formed with a groove at a central portion thereof as the object is polished, and a polishing region comprising a rim constituting an outer edge of the groove.
The control unit preferably simultaneously reciprocates the X-axis varying unit and the Y-axis varying unit such that the polishing member is simultaneously cross-polished along different axes at a position where the abrasive member forms an edge with the frame in the groove .
It is preferable that the polishing section is lifted by the lifting section.
It is preferable that the polishing head is provided with a distance sensor for measuring a distance value to a polishing region formed on the object to be polished and transmitting the measured distance value to the control unit.
The control unit preferably sets a reference distance value up to the polishing area.
The control unit preferably controls driving of the elevation unit, the X-axis variable unit, and the Y-axis variable unit such that the measured distance value reaches the reference distance value.
And a rotating portion is further provided between the X-axis varying portion and the Y-axis varying portion.
Preferably, the rotation unit receives the control signal from the control unit and horizontally rotates the X-axis variable unit at an angle set to make an acute angle or an obtuse angle with respect to the Y-axis moving path of the Y-axis varying unit.
It is preferable that the polishing member is detachable from the polishing head.
The present invention has an effect that the polishing rate per unit time or the amount of grinding can be relatively improved since the polishing object can be polished while moving the polishing member in an ascending and descending direction and in a direction intersecting with the XY axis.
Further, the present invention has the effect of increasing the polishing progression rate of the object to be polished.
Further, it is an object of the present invention to solve the problem of non-polishing (phenomenon of less polishing) occurring in a corner area of a groove forming a polishing area when a target such as a cover glass is polished, Effect.
BRIEF DESCRIPTION OF DRAWINGS FIG. 1A is a view showing a polishing apparatus capable of cross-polishing according to the present invention. FIG.
1B is a view showing a configuration of a polishing portion according to the present invention.
FIG. 2 is a schematic diagram showing the driving of the X-axis variable part and the Y-axis variable part of the present invention.
3 is a view showing a relationship between a polishing part and an object to be polished according to the present invention.
4 is a view showing an object to be polished according to the present invention.
5 is a view showing an example in which an abrasive section according to the present invention is reciprocated and driven along an intersecting axis.
6 is a view showing a process of polishing the edges of the object to be polished.
7 is a flow chart showing the polishing action of the polishing apparatus of the present invention.
8 is a view showing an example in which the X-axis variable portion according to the present invention is rotatable.
9 is a diagram showing an example in which the crossing angles of the X and Y-axis varying parts are variable.
10 is a view showing an example in which a silicon layer is formed at the lower end of the abrasive member according to the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a polishing apparatus capable of cross-polishing of the present invention will be described with reference to the accompanying drawings.
FIG. 1A is a view showing a polishing apparatus capable of cross-polishing according to the present invention, FIG. 1B is a view showing a configuration of a polishing unit according to the present invention, FIG. 2 is a schematic FIG. 3 is a view showing a relationship between a polishing part and an object to be polished according to the present invention. FIG.
First, the configuration of the polishing apparatus of the present invention will be described with reference to Figs. 1A to 3.
The polishing apparatus of the present invention mainly comprises a
In the
The
The object to be polished 10 is seated and fixed to an upper end of the
In the
The
The
The
Referring to FIGS. 1A and 1B, the
The rotating
Accordingly, the
A plurality of first fastening holes (H1) are formed on the rim of the fixing bracket (330).
A plurality of second fastening holes (H2) are formed on the upper outer peripheral portion of the abrasive member (320).
The plurality of first and second fasteners H1 and H2 are fixed by a plurality of fastening bolts B, respectively.
Therefore, the object to be polished can be fixedly installed as the first and second fasteners are fastened by the fastening bolts in a state of being fitted in the fastening bracket.
Although not shown in the drawing, a metal may be fixed to the upper end of the
The electromagnet may be magnetized as a current is supplied from the current supplier, and may be attached with a metal and a magnetic force of the abrasive member, so that the abrasive member can be fixed or released to be replaceable.
Here, the current supplier is driven by receiving a control signal from the control unit.
According to the present invention, as described above, the polishing
The cross-
The
The X-axis
The first moving
Here, the polishing
An
The Y-
The Y-
The Y-
The upper ends of the plurality of
The upper ends of the plurality of
The second moving
Accordingly, the polishing
The Y-
The elevating
The elevating
The elevating
Accordingly, the elevating
In addition, the
4 is a view showing an object to be polished according to the present invention.
4, the
The abraded object to be polished may be a cover glass having a right-
5 is a view showing an example in which an abrasive section according to the present invention is reciprocated and driven along an intersecting axis.
5, the
Therefore, the grinding amount can be increased by cross-flowing along the crossing axis at one position to perform polishing.
3, in the polishing
A reference distance value up to the polishing
The
Next, the operation of the polishing apparatus of the present invention having the above-described structure will be described.
FIG. 6 is a view showing a process of polishing an edge of an object to be polished, and FIG. 7 is a flowchart showing a polishing action of the polishing apparatus of the present invention.
In addition, the construction of the polishing apparatus of the present invention will be described with reference to Figs. 1 to 6.
An object to be polished (10) is seated on a seat (200) according to the present invention.
The
The X and Y
The
In this case, the
For example, the depth and the area of the polishing
Next, the
That is, the
At this time, the elevating
At the same time, the
That is, the first moving
Accordingly, as shown in FIG. 5, the polishing
Accordingly, the polishing rate or the amount of grinding per unit time can be increased.
According to the above driving, the polishing
According to the present invention, it is possible to judge whether or not polishing at the corner portion in the
The
The
The
For example, when the measured distance value Lm does not reach the reference distance value L0, the
Of course, if the polishing
Therefore, the polishing
Therefore, according to the present invention, it is possible to improve the quality of a product to be produced by further performing polishing on an abnormally polished edge portion in the
8 is a view showing an example in which the X-axis variable portion according to the present invention is rotatable.
Referring to FIG. 8, a rotation part may be further provided between the X-axis
The rotation unit includes first and
Here, the plurality of
The
The lower end of the
The first and
The centers of the first and
The
Therefore, in the present invention, the crossing angle [theta] between the axes of the
In addition, the intersection angle [theta] between the intersecting axes can be preset in the control unit and can control the driving of the
10 is a view showing an example in which a silicon layer is formed at the lower end of the abrasive member according to the present invention.
Referring to FIG. 10, a
The
In addition, the
For example, although not shown in the drawing, a metal case capable of bolt fastening is further provided at the lower end of the
Therefore, when replacing the silicon layer with another, the case may be removed from the lower end of the abrasive member and the other case having another silicon layer may be re-attached to the lower end of the abrasive member.
Meanwhile, although not shown in the drawing, a rotating rotation axis to be rotated may be formed on one side of the polishing
In this case, a plurality of connecting rods extending in the radial direction are formed on the rotation shaft.
The alternate rotary shaft is rotationally driven by the alternate rotary motor, whereby the rotational positions of the plurality of connecting rods can be varied.
And an abrasive member having a different shape may be mounted on each end of each of the plurality of connecting rods. Of course, the abrasive member may be detachably installed at the end of each connecting rod in the same manner as described above.
However, the connection rods are provided with
Therefore, when the
Through the above-described structure and action, the embodiment according to the present invention can polish an object to be polished while lifting the polishing member and moving it in a direction crossing along the XY axis, so that the polishing rate or the amount of grinding per unit time Can be relatively improved.
Further, the embodiment according to the present invention can increase the polishing progression amount of the object to be polished.
In addition, the embodiment according to the present invention solves the problem that unpolished (phenomenon of less polishing) occurs in the edge area of the groove forming the polishing area when the object such as the cover glass is polished to improve the quality of the product .
Although the present invention has been described with respect to specific embodiments of the polishing apparatus capable of cross-polishing, it is apparent that various modifications are possible within the scope of the present invention.
Therefore, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the scope of the appended claims and equivalents thereof.
It is to be understood that the foregoing embodiments are illustrative and not restrictive in all respects and that the scope of the present invention is indicated by the appended claims rather than the foregoing description, It is intended that all changes and modifications derived from the equivalent concept be included within the scope of the present invention.
10: object to be polished
100:
200:
300:
310: Polishing head
320: abrasive member
400: cross-polished portion
410: X-axis variable section
411: X-axis rail
420: Y-axis variable section
421: Y-axis rail
430:
500:
600: silicon layer
Claims (9)
A seating part installed on the main body part and on which an object to be polished is seated;
A polishing unit installed on the main body so as to be positioned above the seating unit, the polishing unit polishing the object to be polished; And
And a cross polishing unit installed on the main body to vary the polishing position for the object to be polished along different axes,
The cross-
The polishing unit is controlled to be movable along the X axis and the Y axis,
The cross-
An X-axis variable portion disposed in the seating portion, the X-axis variable portion changing the polishing portion along the X-
A Y-axis variable portion for varying the X-axis variable portion along the Y-axis,
And a control unit for controlling driving of the X-axis variable unit and the Y-axis variable unit,
Wherein,
The X-axis variable section and the Y-axis variable section are independently driven, and the control is performed so as to reciprocate within the set movement interval,
The polishing unit includes:
A polishing head provided on the X-axis variable section and having a rotary motor rotated by receiving a control signal from the control section;
And a polishing member provided on the polishing head and rotated by driving of the rotation motor to polish the object to be polished,
The object to be polished,
A groove is formed at the central portion as the polishing is performed, and a polishing region comprising a rim constituting the outer periphery of the groove is formed,
Wherein,
The X-axis variable portion and the Y-axis varying portion are simultaneously reciprocated so that, during polishing, the abrasive member is simultaneously cross-polished along different axes at a position where the edge of the abutment with the rim is in the groove,
Wherein the polishing member is detachable from the polishing head,
A silicon layer having a predetermined thickness that is detachable is formed on a lower end of the polishing member,
A metal case capable of being bolt-fastened is further provided at a lower end of the abrasive member, another silicon layer is formed on an outer surface of the case,
A rotating rotation axis is formed on one side of the polishing head,
A plurality of connection rods extending in a radial direction are formed on the rotation shaft,
Wherein the rotation shaft is rotatably driven by a rotation motor, the rotation positions of the plurality of connection rods are variable,
And an abrasive member having a different shape is mounted on an end of each of the plurality of connecting rods.
The polishing section is lifted and lowered by the lifting section,
In the polishing head,
There is provided a distance sensor for measuring a distance value to a polishing region formed on the object to be polished and transmitting the measured distance value to the control unit,
In the control unit,
A reference distance value up to the polishing area is preset,
Wherein,
Axis variable portion and the Y-axis variable portion so that the measured distance value reaches the reference distance value.
A rotating portion is further provided between the X-axis variable portion and the Y-axis variable portion,
Wherein the rotary section receives the control signal from the control section and horizontally rotates the X-axis variable section at an angle set to make an acute angle or an obtuse angle with respect to the Y-axis moving path of the Y-axis varying section. .
Priority Applications (1)
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KR1020150161979A KR101946599B1 (en) | 2015-11-18 | 2015-11-18 | Polishing apparatus |
Applications Claiming Priority (1)
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KR1020150161979A KR101946599B1 (en) | 2015-11-18 | 2015-11-18 | Polishing apparatus |
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KR20170058143A KR20170058143A (en) | 2017-05-26 |
KR101946599B1 true KR101946599B1 (en) | 2019-02-11 |
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KR1020150161979A KR101946599B1 (en) | 2015-11-18 | 2015-11-18 | Polishing apparatus |
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100745407B1 (en) | 2006-06-20 | 2007-08-02 | 전자부품연구원 | Apparatus and method for polishing a partial section of optical wave guide in optical printed circuit board |
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Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100745407B1 (en) | 2006-06-20 | 2007-08-02 | 전자부품연구원 | Apparatus and method for polishing a partial section of optical wave guide in optical printed circuit board |
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