KR101944794B1 - Light emitting device package and lighting systme having thereof - Google Patents

Abstract

An embodiment relates to a light emitting device package.
A light emitting device package according to an embodiment includes a body having an upper opened cavity; A first lead frame disposed in the cavity and adjacent a first side of the body; A second lead frame disposed in the cavity and adjacent the second side of the body; A light emitting chip on at least one of the first lead frame and the second lead frame disposed in the cavity; A molding member in the cavity; A gap portion disposed between the first lead frame and the second lead frame; And a first protective portion extending from the gap portion between the first lead frame and a third side surface of the body.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package,

Embodiments relate to a light emitting device package and an illumination system having the same.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode has been increasingly used as a light source for various lamps used in indoor / outdoor, a liquid crystal display, a display board, and a streetlight.

The embodiment provides a light emitting device package of a new structure.

Embodiments provide a light emitting device package wherein a gap portion disposed between adjacent lead frames further extends between a side surface of at least one lead frame and a side surface of the body.

A light emitting device package according to an embodiment includes a body having an upper opened cavity; A first lead frame disposed in the cavity and adjacent a first side of the body; A second lead frame disposed in the cavity and adjacent the second side of the body; A light emitting chip on at least one of the first lead frame and the second lead frame disposed in the cavity; A molding member in the cavity; A gap portion disposed between the first lead frame and the second lead frame; And a first protective portion extending from the gap portion between the first lead frame and a third side surface of the body.

An illumination system according to an embodiment includes the light emitting device package described above.

The embodiment can prevent a package failure due to a gap portion between a plurality of lead frames.

The embodiment can improve the yield of the light emitting device package.

The embodiment can improve the reliability of the light emitting device package.

The embodiment can improve the reliability of the light emitting chip.

The embodiment can improve the reliability of the light emitting device package and the light unit having the light emitting device package.

1 is a side sectional view of a light emitting device package according to the first embodiment.
2 is a rear view of the light emitting device package of FIG.
3 is a plan view of the light emitting device package of FIG.
4 to 9 are views illustrating a manufacturing process of the light emitting device package of FIG.
10 is a side sectional view of the light emitting device package according to the second embodiment.
11 is a perspective view showing an example of a display device according to the embodiment.
12 is a perspective view showing another example of the display device according to the embodiment.
13 is a view showing a lighting device according to an embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under"Quot; on "and" under "as used herein are intended to refer to all that is" directly "or" indirectly " . In addition, standards for top, bottom, and bottom of each layer or each structure are described with reference to drawings. In the drawings, thicknesses and sizes of respective layers or structures are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

Hereinafter, a light emitting device package according to a first embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a side sectional view of a light emitting device package according to a first embodiment, FIG. 2 is a rear view of the light emitting device package of FIG. 1, and FIG. 3 is a plan view of the light emitting device package of FIG.

1 to 3, a light emitting device package 100 includes a body 11, a gap 15, first and second lead frames 21 and 31, a light emitting chip 41, and a molding member 51).

The body 11 may be formed of a material having a reflectivity higher than that of the light emitted by the light emitting chip 41, for example, a material having a reflectance of 70% or more. The body 11 may be defined as a non-transparent material when the reflectance is 70% or more.

The body 11 may be formed of a thermosetting resin including a silicon-based, epoxy-based, or plastic material, or a material having high heat resistance and high light resistance. The above-mentioned silicon includes a white-based resin. Such thermosetting resin or high heat-resistant material can be formed through a transfer molding process. The body 11 may be made of a resin-based insulating material such as polyphthalamide (PPA), but is not limited thereto.

In the body 11, an acid anhydride, an antioxidant, a release agent, a light reflector, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added. . The body 11 may be formed of at least one member selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin comprising triglycidylisocyanurate, hydrogenated bisphenol A diglycidyl ether and the like and an acid comprising hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride and the like DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator in an epoxy resin, ethylene glycol, titanium oxide pigment and glass fiber as a cocatalyst were added, A solid epoxy resin composition that has been cured and B-staged can be used. However, the present invention is not limited thereto.

In addition, a light shielding material or a diffusing agent may be mixed in the body 11 to reduce the transmitted light. In order to have a predetermined function, the body 11 may be formed by appropriately mixing at least one member selected from the group consisting of a diffusing agent, a pigment, a fluorescent substance, a reflective substance, a light shielding substance, a light stabilizer and a lubricant in a thermosetting resin .

The body 11 may be formed of a translucent material or a translucent material having a conversion material for converting the wavelength of incident light.

A cathode mark may be formed on the upper side of the body 11. The cathode mark separates the first lead frame 21 or the second lead frame 31 of the light emitting device package 100 so that the direction of the polarity of the first and second lead frames 21 and 31 Confusion can be prevented.

A cavity 12 is formed in the body 11, and the cavity 12 has a concave shape with an open top. The cavity 12 may be formed in a circular shape, an elliptical shape, or a polygonal shape when viewed from the device top side, but the present invention is not limited thereto. A plurality of lead frames 21 and 31 are disposed on the bottom of the cavity 12, and the plurality of lead frames 21 and 31 are disposed to be electrically separated from each other.

The peripheral surface of the cavity 12 may be curved or angled and may be inclined or perpendicular to the bottom of the cavity 12.

2, the distance between the first side surface S1 and the second side surface S2 of the body 11 is a first width of the body 11, and the third side surface S3 and the fourth side surface (S4) may be a second width (W1) of the body (11).

The width of the first lead frame 21 and the second lead frame 31 may be the same width as the width W1 of the body 11. The lower surface of the first lead frame 21 and the lower surface of the second lead frame 31 may have a substantially flat shape or a bent portion.

The plurality of lead frames 21 and 31 may be formed of a metal plate having a predetermined thickness and another metal layer may be plated on the surface of the metal plate. The plurality of lead frames 21 and 31 are made of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), and phosphorous (P). The first and second lead frames 21 and 31 may have a multi-layer structure, but the present invention is not limited thereto. The thickness of the first and second lead frames 21 and 31 may be 0.3 mm to 1.5 mm, for example, 0.3 mm to 0.8 mm.

The first lead frame 21 is disposed adjacent to the first side S1 of the body 11 in the lower first region of the body 11 and the cavity 12. [ The second lead frame 31 is disposed adjacent to the second side S2 of the body 11 in a second region of the lower portion of the body 11 and the cavity 12. [

The body (11) includes a gap portion (15). The gap portion 15 is disposed between the first lead frame 21 and the second lead frame 31 and physically separates the first lead frame 21 and the second lead frame 31 . The gap 14 may be formed of the same material as the body 11.

And a first protection part 16 and a second protection part 17 extending from the gap part 14 below the body 11. The first protection portion 16 extends from the gap portion 14 to a region between the first lead frame 21 and the third side S3 of the body 11 and the second protection portion 17 Extends from the clearance portion 14 to a region between the second lead frame 31 and the fourth side surface S4 of the body 11. [ The first protector 16 and the second protector 17 protrude from the body 11 and may be formed of a material of the body.

The first protection portion 16 is disposed between the first lead frame 21 and the third side S3 and the second protection portion 17 is disposed between the second lead frame 31 and the fourth side (S4). The length D3 of the first protection portion 16 may be shorter than the length D4 of the second protection portion 17 and the length D3 and the length D4 may be different from each other.

The first protection part 16 extends in the direction of the first lead frame 21 and the length D3 of the first protection part 16 is longer than the length D1 of the first lead frame 21. [ And may be formed in a short length.

The second protective portion 17 extends in the direction of the second lead frame 31 and the length D4 of the second protective portion 17 is longer than the length D2 of the second lead frame 31 And may be formed in a short length.

The first angle? 1, which is an internal angle between the gap portion 15 and the first protection portion 16, can be bent to a range of 10 degrees or more, for example, 80 to 90 degrees. 2, which is the internal angle between the second protective portions 17, can be bent in the range of 10 degrees or more, for example, in the range of 80-90 degrees.

The outer surface of the first protective portion 16 is exposed to the third side surface S3 of the body 11 and the outer surface of the second protective portion 17 is exposed to the fourth side surface of the body 11 S4.

The lower surfaces of the first protection portion 16 and the second protection portion 17 may be disposed on the same plane as the lower surfaces of the first and second lead frames 21 and 31 and are not limited thereto.

The third protective portion 18 is further protruded below the body 11 and the third protective portion 18 is formed between the fourth side surface S4 of the body 11 and the first lead frame 21 . The third protective portion 18 is spaced apart from the end of the second gap portion 15 by a predetermined distance D5.

A fourth protection portion 19 is further protruded under the body 11 and the fourth protection portion 19 is formed between the third side S3 of the body 11 and the second lead frame 31 . The fourth protective portion 19 is spaced from the end of the second gap portion 15 by a predetermined distance.

A part of the first lead frame 21 disposed on the lower surface of the body 11 is disposed between the first protection part 16 and the third protection part 18, And a part of the area is disposed between the second protection part 17 and the fourth protection part 19. [

The first protective portion 16 and the third protective portion 18 are disposed on the opposite sides of the body 11 and are spaced apart from the first side surface S1 and the second side surface S2 of the body 11. [ The second protective portion 17 and the fourth protective portion 19 are disposed on the opposite sides of the body 11 and are spaced from the first side surface S1 and the second side surface S2 of the body 11. [

A portion 13A, 13B, 14A, 14B of the body 11 may be disposed in a corner region of the lower surface region of the body 11, but the present invention is not limited thereto. When the parts 13A, 13B, 14A and 14B of the body 11 and the first to fourth protective parts 16, 17, 18 and 19 are cut in units of the light emitting device package, , 31) can be reduced.

1 and 3, a light emitting chip 41 is disposed on at least one of the first lead frame 21 and the second lead frame 31 disposed at the bottom of the cavity 12, The light source 41 may be a diode that emits light in a visible light band or an ultraviolet band that emits light such as red, green, blue, and white light, but the present invention is not limited thereto.

The light emitting chip 41 is mounted on the second lead frame 31 and is electrically connected to the second lead frame 21 and is electrically connected to the first lead frame 21 and the connecting member 43, Lt; / RTI > The connecting member 43 includes a wire.

The light emitting chip 41 may be implemented as a horizontal chip having two electrodes arranged in parallel to each other or a vertical chip having two electrodes disposed on opposite sides of the chip, but the invention is not limited thereto. The horizontal chip may be connected to at least two wires, and the vertical chip may be connected to at least one wire. Alternatively, the light emitting chip 41 may be mounted in a flip manner, but the invention is not limited thereto.

The lower surfaces of the first and second lead frames 21 and 31 are disposed on the same plane as the lower surface of the body 11 so that the heat generated from the light emitting chip 41 can be effectively dissipated .

The cavity 12 is formed with a molding member 51, and the molding member 51 may include a transparent resin material such as epoxy or silicone. In addition, the phosphor or the diffusing agent may be optionally added to the molding member 51, but the present invention is not limited thereto. The fluorescent material may include, for example, a YAG-based, a silicate-based, or a TAG-based fluorescent material. A lens may be formed on the molding member 51. The lens may have a concave lens shape, a convex lens shape, or a lens having a concave portion and convex portions.

4 to 9 are views illustrating a manufacturing process of the light emitting device package of FIG.

Referring to Figs. 4 and 5, a plurality of gap regions 15A and a plurality of separation regions A3 are arranged in a flat disk-like lead frame 20. [ The gap region 15A is disposed at the central portion of each package region A1 as shown in the plan view of FIG. 5 and the separation region A3 is disposed between the package rows and columns to reduce the cutting process of the package unit T1. .

In each package area A1, a gap area 15A and a first protection area 16A and a second protection area 17A are formed in a hole shape on both sides thereof. The gap region 15A is disposed between the first and second lead frames 21 and 31. The first protection region 16A and the second protection region 17A are located at both ends of the gap region 15A . That is, the first protection area 16A and the second protection area 17A are disposed on the opposite sides, and are not connected to each other.

6 is a partial enlargement of FIG. 5. Referring to FIG. 6, the cutting line L1 between the package regions A1 is divided into a first protection region 16A extending from the gap region 15A and a second protection region 16A extending from the gap region 15A. 17A. The first protection region 16A is disposed between the adjacent package regions A1 and the second protection region 17A is disposed between the adjacent package regions A1. A part of the first protection area 16A is a third protection area of another package area and a part of the second protection area 16A is a fourth protection area of another package area.

Fig. 7 is a view showing an example of forming a body, and Fig. 8 is a plan view showing a partially enlarged view of Fig.

7 and 8, a body material is injected onto the lead frame 20 to form a body 11, a cavity 12 is disposed in the body 11, The first and second lead frames 21 and 31 and the gap portion 15 are disposed on the bottom of the first lead frame 12. 6, when the body 11 is formed, a part of the body 11 is formed in the gap region 15 and the first and second protection regions 16A and 17A, .

Here, by separating the gap region 15A of each package region A1 shown in FIG. 6 from the adjacent package regions, the body material injected into the gap region 15A is separated into individual package units A1 do. The gap area 15A and the first and second protection areas 16A and 17A in each package area A1 can be prevented from being deformed in the boundary area of each package when the body 11 is molded have. That is, since the existing gap region is connected to the first and second protection regions 16A and 17A in the region between the adjacent package regions, that is, the L1 region, the gap between the package internal region and the package boundary region Therefore, when the body material is injected, the lead frames in the boundary region of the package are twisted. Conventionally, the first and second protection regions 16A and 17A disposed in the boundary region L1 of each package region are connected to each other, which makes it difficult to perform injection molding. In the embodiment, the first and second protection regions 16A and 17A disposed in the boundary region between the packages are arranged separately from each other, so that the outer frame portion of the lead frame is deformed by the injected body material, .

9, the light emitting chip 41 is disposed on the second lead frame 31 disposed at the bottom of the cavity 12, and connected to the first lead frame 21 by the connecting member 43 give.

A molding member 51 is formed on the cavity 12, and the molding member 51 may be formed by dispensing or squeezing. The material of the molding member 51 may be formed of a light-transmitting material, and a phosphor may be added thereto. A lens may be further formed on the molding member 51, but the present invention is not limited thereto.

Then, the light emitting device package is cut in units of individual packages to produce a light emitting device package as shown in FIG.

10 is a side sectional view showing a light emitting device package according to the second embodiment.

Referring to FIG. 10, in the light emitting device package, the gap 15B between the first lead frame 21 and the second lead frame 31 may have a wide bottom and a narrow top. The end portions of the first lead frame 21 and the second lead frame 31 may be formed in a stepped structure and the gap portion 15B may be formed between the first lead frame 21 and the second lead frame 31 ). Accordingly, moisture penetration can be improved by the gap portion 15B.

In the embodiment, the end portions of the first lead frame 21 or the second lead frame 31 corresponding to the first to fourth protective portions 16, 17, 18, and 19 shown in FIG. The width of the lower portion of the first to fourth protective portions 16, 17, 18, and 19 may be wider than the width of the upper portion, but the present invention is not limited thereto.

The light emitting device package according to the embodiment can be applied to a light unit. The light unit includes a structure in which a plurality of light emitting device packages are arrayed and includes the display device shown in Figs. 11 and 12, the lighting device shown in Fig. 13, and includes a lighting lamp, a traffic light, a vehicle headlight, Can be applied to the same unit.

11 is an exploded perspective view of a display device according to an embodiment.

11, a display device 1000 includes a light guide plate 1041, a light emitting module 1031 for providing light to the light guide plate 1041, a reflection member 1022 under the light guide plate 1041, An optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, and a bottom cover 1011 for storing the light guide plate 1041, the light emitting module 1031 and the reflecting member 1022 , But is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 diffuses the light from the light emitting module 1031 to convert the light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >

The light emitting module 1031 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041 and ultimately to serve as a light source of the display device.

At least one light emitting module 1031 may be disposed in the bottom cover 1011 and may directly or indirectly provide light from one side of the light guide plate 1041. The light emitting module 1031 includes a substrate 1033 and a light emitting device package 100 according to the embodiment described above and the light emitting device package 100 may be arrayed on the substrate 1033 at predetermined intervals. have. The substrate may be, but is not limited to, a printed circuit board. The substrate 1033 may include a metal core PCB (MCPCB), a flexible PCB (FPCB), or the like, but is not limited thereto. When the light emitting device package 100 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the substrate 1033 can be removed. A part of the heat radiation plate may be in contact with the upper surface of the bottom cover 1011. Accordingly, heat generated in the light emitting device package 100 can be emitted to the bottom cover 1011 via the heat dissipation plate.

The plurality of light emitting device packages 100 may be mounted on the substrate 1033 such that the light emitting surface of the light emitting device package 100 is spaced apart from the light guiding plate 1041 by a predetermined distance. The light emitting device package 100 may directly or indirectly provide light to the light-incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and supplies the reflected light to the display panel 1061 to improve the brightness of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 transmits or blocks light provided from the light emitting module 1031 to display information. The display device 1000 can be applied to video display devices such as portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet concentrates incident light on the display panel 1061. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

The optical path of the light emitting module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the present invention is not limited thereto.

12 is a view illustrating a display device having a light emitting device package according to an embodiment.

12, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the above-described light emitting device package 100 is arrayed, an optical member 1154, and a display panel 1155 .

The substrate 1120 and the light emitting device package 100 may be defined as a light emitting module 1160. The bottom cover 1152, the at least one light emitting module 1160, and the optical member 1154 may be defined as a light unit 1150.

The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto.

The optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methy methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses the incident light, and the horizontal and vertical prism sheets condense the incident light onto the display panel 1155. The brightness enhancing sheet reuses the lost light to improve the brightness .

The optical member 1154 is disposed on the light emitting module 1160 and performs surface light source, diffusion, and light condensation of the light emitted from the light emitting module 1160.

13 is a perspective view of a lighting apparatus according to an embodiment.

13, the lighting apparatus 1500 includes a case 1510, a light emitting module 1530 installed in the case 1510, a connection terminal (not shown) installed in the case 1510 and supplied with power from an external power source 1520).

The case 1510 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal material or a resin material.

The light emitting module 1530 may include a substrate 1532 and a light emitting device package 100 mounted on the substrate 1532. A plurality of the light emitting device packages 100 may be arrayed in a matrix or at a predetermined interval.

The substrate 1532 may be a circuit pattern printed on an insulator. For example, the substrate 1532 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, FR-4 substrate, and the like.

In addition, the substrate 1532 may be formed of a material that efficiently reflects light, or may be a coating layer such as a white color, a silver color, or the like whose surface is efficiently reflected by light.

At least one light emitting device package 100 may be mounted on the substrate 1532. Each of the light emitting device packages 100 may include at least one LED (Light Emitting Diode) chip. The LED chip may include a light emitting diode in a visible light band such as red, green, blue or white, or a UV light emitting diode that emits ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting device packages 100 to obtain color and brightness. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be arranged in combination in order to secure a high color rendering index (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is connected to the external power source by being inserted in a socket manner, but the present invention is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source through wiring.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

The light emitting device package according to any one of claims 1 to 3,

Claims (17)

A body having an upper opened cavity;
A first lead frame disposed in the cavity and adjacent a first side of the body;
A second lead frame disposed in the cavity and adjacent the second side of the body;
A light emitting chip on at least one of the first lead frame and the second lead frame disposed in the cavity;
A molding member in the cavity;
A gap portion disposed between the first lead frame and the second lead frame;
A first protective portion extending from one end of the gap portion toward the first side surface of the body and disposed between the first lead frame and the third side surface of the body;
A second protective portion extending from the other end of the gap portion toward the second side surface of the body and disposed between the second lead frame and the fourth side surface of the body;
A third protector disposed between the first lead frame and the fourth side surface of the body and facing the first protector, the third protector being spaced apart from the gap and the second protector; And
And a fourth protection portion disposed between the second lead frame and a third side surface of the body and facing the second protection portion and spaced apart from the gap portion and the first protection portion,
Wherein the gap portion includes the same material as the body. delete delete delete The light emitting device package according to claim 1, wherein the gap portion and the first to fourth protective portions comprise the same material. The light emitting device package according to claim 1, wherein the gap portion and the first to fourth protective portions are disposed in the same plane as the lower surfaces of the first and second lead frames. The light emitting device package according to claim 1, wherein the first protective portion and the second protective portion have different lengths from the gap portion. delete The light emitting device package according to claim 1, wherein the first protection portion is bent at least 10 degrees from the gap portion, and the second protection portion is bent at 10 degrees or more from the gap portion. delete The light emitting device package according to claim 1, wherein the gap width of the gap portion is larger than the width of the upper portion. The light emitting device package according to claim 1, wherein a width of a lower portion of the first to fourth protective portions is larger than an upper width. The light emitting device package according to claim 1, wherein the body comprises a thermosetting resin. 14. The light emitting device package according to claim 13, wherein the thermosetting resin comprises an epoxy series or a silicon series. An illumination system comprising at least one light emitting device package of claim 1. The light emitting device package according to claim 1, wherein the side surfaces of the first protective portion, the fourth protective portion, the first lead frame, and the second lead frame are disposed in the same plane. The light emitting device package according to claim 1, wherein the side surfaces of the second protective portion, the third protective portion, the first lead frame, and the second lead frame are disposed in the same plane.

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