KR101849126B1

KR101849126B1 - Light Emitting Device Package

Info

Publication number: KR101849126B1
Application number: KR1020110086547A
Authority: KR
Inventors: 안중인
Original assignee: 엘지이노텍 주식회사
Priority date: 2011-08-29
Filing date: 2011-08-29
Publication date: 2018-04-16
Also published as: KR20130025455A

Abstract

A light emitting device package according to an embodiment includes a body having a cavity formed therein, first and second lead frames disposed in a lower region of the body, a light emitting device electrically connected to the first and second lead frames, Wherein the lower region of the body and the first and second lead frames comprise a curvature formed in at least one region.

Description

[0001] Light Emitting Device Package [0002]

An embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts electrical signals into light by using the characteristics of compound semiconductors. It is widely used in household appliances, remote control, electric signboard, display, and various automation devices. There is a trend.

Open No. 10-2004-0044701 discloses a light emitting device package including a cup-shaped package structure and an electrode pattern. In such a light emitting device package, a gap may be generated between the package structure and the electrode pattern due to a difference in thermal expansion coefficient between the package structure and the electrode pattern, or lifting of the package may occur.

Embodiments provide a light emitting device package including a curved body and a lead frame to prevent a gap between a body and a lead frame and a floating phenomenon between a light emitting device package and a substrate on which the light emitting device package is mounted.

The light emitting device package according to the embodiment may include a body having a curvature and a lead frame to prevent gap between the body and the lead frame and lifting between the light emitting device package and the substrate on which the light emitting device package is mounted.

1 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
2 is a cross-sectional view illustrating a light emitting device package according to an embodiment,
3 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment,
4 is a cross-sectional view illustrating a lighting device including a light emitting device package according to an embodiment,
5 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment, and FIG.
6 is an exploded perspective view illustrating a liquid crystal display device including a light emitting device package according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

1 and 2 are cross-sectional views illustrating a light emitting device package according to an embodiment.

1 and 2, a light emitting device package 100 according to an embodiment includes a body 110 having a cavity 120 formed therein, first and second lead frames 140 and 150 mounted on the body 110, A light emitting element 130 electrically connected to the first and second lead frames 140 and 150 and a resin layer 160 formed in the cavity 120. The body 110 and the first and second lead frames 140 and 150, The two lead frames 140 and 150 may have a curvature.

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), and a printed circuit board (PCB). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

In addition, the body 110 may include a predetermined photocatalyst. For example, the photocatalyst may form the light generated in the light emitting device 130 as white light, and may be a predetermined pigment such as TiO ₂ .

A cavity 120 may be formed on the body 110, and an inner surface of the cavity 120 may be formed with an inclined surface. The reflection angle of the light emitted from the light emitting device 130 can be changed according to the angle of the inclined surface, and thus the directivity angle of the light emitted to the outside can be controlled.

Concentration of light emitted to the outside from the light emitting device 130 increases as the directional angle of light decreases. Conversely, as the directional angle of light increases, the concentration of light emitted from the light emitting device 130 to the outside decreases.

The shape of the cavity 120 formed in the body 110 may be circular, square, polygonal, elliptical, or the like, and may have a curved shape, but the present invention is not limited thereto.

The light emitting device 130 is electrically connected to the first and second lead frames 140 and 150. The light emitting device 130 may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In addition, one or more light emitting diodes may be mounted.

In addition, the light emitting diode is applicable to both a horizontal type in which all the electric terminals are formed on the upper surface, a vertical type formed in the upper and lower surfaces, or a flip chip .

The resin layer 160 may be filled in the cavity 120 so as to cover the light emitting device 130.

The resin layer 160 may be formed of silicon, epoxy, or other resin material. The resin layer 160 may be filled with a predetermined resin in the cavity 120, and then may be formed by UV or thermal curing.

The resin layer 160 may include a phosphor (not shown), and a phosphor (not shown) may be selected to a wavelength of light emitted from the light emitting device 130 so that the light emitting device package 100 realizes white light can do.

These phosphors (not shown) may emit red, green, and blue phosphors depending on the wavelength of light emitted from the light emitting device 130, such as a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, One of the luminescent phosphors can be applied.

That is, the phosphor (not shown) may be excited by the light having the first light emitted from the light emitting device 130 to generate the second light. For example, when the light emitting element 130 is a blue light emitting diode and the phosphor is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and blue light and blue light emitted from the blue light emitting diode As the excited yellow light is excited, the light emitting device package 100 can provide white light.

Similarly, when the light emitting device 130 is a green light emitting diode, a magenta fluorescent substance or a mixture of blue and red fluorescent materials is used. When the light emitting device 130 is a red light emitting diode, a cyan fluorescent material or a mixture of blue and green fluorescent materials For example.

Such a fluorescent material (not shown) may be a known fluorescent material such as YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate .

The first and second lead frames 140 and 150 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium , Hafnium (Hf), ruthenium (Ru), and iron (Fe). Also, the first and second lead frames 140 and 150 may have a single-layer structure or a multi-layer structure, but the present invention is not limited thereto.

The first and second lead frames 140 and 150 are separated from each other and electrically separated from each other. The light emitting device 130 is mounted on the first lead frame 140 and the first lead frame 140 can be electrically connected to the light emitting device 130 directly or through a conductive material . Also, the second lead frame 150 may be electrically connected to the light emitting device 130 by the wire 134, but is not limited thereto. Accordingly, when power is supplied to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130. Meanwhile, a plurality of lead frames (not shown) may be mounted in the body 110 and each lead frame (not shown) may be electrically connected to the light emitting device (not shown).

The body 110 and the first and second lead frames 140 and 150 may have curvature.

For example, the body 110 and the first and second lead frames 140 and 150 include an area A having a curvature as shown in FIGS. 1 and 2, and the area is formed at the bottom of the body 110 .

The light emitting device 130 can generate heat as well as light as power is applied. The light emitting device package 100 is thermally expanded due to heat generated in the light emitting device 130. Since the thermal expansion coefficients of the first and second lead frames 140 and 150 differ from the thermal expansion coefficient of the body 110 due to the heat of the first and second lead frames 140 and 150 and the body 110, The degrees of expansion may also be different. The body 110 and the first and second lead frames 140 and 150 are displaced relative to each other as the body 110 and the first and second lead frames 140 and 150 have different degrees of thermal expansion. . Therefore, for example, the gap between the body 110 and the first and second lead frames 140 and 150 may be spaced apart from each other. When the thermal expansion coefficient of the first and second lead frames 140 and 150 is larger than that of the body 110, the first and second lead frames 140 and 150 thermally expand more than the body 110. For example, when the first and second lead frames 140 and 150 are disposed at the lower portion of the body 110, the lower portion of the body 110 receives a tensile force and the upper portion of the body 110 relatively compresses (compressive force).

As the lower portion of the body 110 receives a tensile force and the upper portion receives a compressive force, the body 110 is bent and a curvature can be formed. Lifting of both ends of the body 110 may occur due to bending of the body 110. The light emitting device package 100 is mounted on a substrate and power can be supplied by connecting electrodes (not shown) of the substrate (not shown) and the first and second lead frames 140 and 150. The reliability of the connection between the first and second lead frames 140 and 150 and the electrodes (not shown) of the substrate (not shown) may be deteriorated as both ends of the body 110 are lifted.

The light emitting device package 100 includes the region A having the curvature so that the distance between the body 110 and the first and second lead frames 140 and 150 is different from that of the body 110 due to the difference in thermal expansion coefficient between the body 110 and the first and second lead frames 140 and 150. [ The occurrence of displacement between the bending and the body 110 and the first and second lead frames 140 and 150 can be suppressed. Therefore, generation of a gap due to displacement between the body 110 and the first and second lead frames 140 and 150 is suppressed, so that the reliability of the light emitting device package 100 can be improved.

In addition, since the bottom surface of the cavity 120 also has a curvature, the light generated in the light emitting device 130 can more easily proceed upward in the light emitting device package 100, The efficiency can be improved.

1, the curvature is formed in a lower region of the body 110 in which the lead frames 140 and 150 are disposed. However, the curvature may be formed in an arbitrary region, No.

In addition, as shown in FIG. 2, the curvatures of the respective regions may be different from each other. For example, the curvature of the region where the light emitting device 130 is mounted may have a smaller curvature than other regions. In addition, the body 110 and the first and second lead frames 140 and 150 may include a curved region A and a non-curved region B, but are not limited thereto.

On the other hand, when the curvature is formed in the body 110 and the first and second lead frames 140 and 150, if the curvature is excessively large, curvature formation is difficult and it is difficult to mount the light emitting device package 100 on a substrate . If the curvature is too small, it may be difficult to achieve the effect of suppressing the occurrence of displacement between the body 110 and the first and second lead frames 140 and 150. In addition, if the curvature is excessively large or small, the effect of suppressing the occurrence of displacement between the body 110 and the first and second lead frames 140 and 150 and the lifting effect of the light emitting device package 100 may not be achieved. The curvature of the body 110 and the first and second lead frames 140 and 150 is such that the step difference D between both ends of the body 110 and the lead frames 140 and 150 and the central region of the body is about 60 Lt; RTI ID = 0.0 > um. &Lt; / RTI >

FIG. 3 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 4 is a cross-sectional view illustrating a C-C 'cross section of the lighting device of FIG.

4 is a sectional view of the lighting device 400 of FIG. 4 cut in the longitudinal direction Z and the height direction X and viewed in the horizontal direction Y. As shown in FIG.

3 and 4, the lighting device 400 may include a body 410, a cover 430 coupled to the body 410, and a finishing cap 450 positioned at opposite ends of the body 410 have.

The light emitting device module 440 is coupled to a lower surface of the body 410. The body 410 is electrically connected to the light emitting device package 444 through a conductive material such that heat generated from the light emitting device package 444 can be emitted to the outside through the upper surface of the body 410. [ And may be formed of a metal material having excellent heat dissipation effect, but is not limited thereto.

The light emitting device package 444 may be mounted on the substrate 442 in a multi-color, multi-row manner to form a module. The light emitting device package 444 may be mounted at equal intervals or may be mounted with various spacings as needed. As such a substrate 442, MCPCB (Metal Core PCB) or FR4 PCB can be used.

The cover 430 may be formed in a circular shape so as to surround the lower surface of the body 410, but is not limited thereto.

The cover 430 protects the internal light emitting device module 440 from foreign substances or the like. The cover 430 may include diffusion particles to prevent glare of light generated in the light emitting device package 444 and uniformly emit light to the outside and may include at least one of an inner surface and an outer surface of the cover 430 A prism pattern or the like may be formed on one side. Further, the phosphor may be coated on at least one of the inner surface and the outer surface of the cover 430.

Since the light generated from the light emitting device package 444 is emitted to the outside through the cover 430, the cover 430 must have a high light transmittance and sufficient to withstand the heat generated from the light emitting device package 444. [ The cover 430 may be made of polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. It is preferable that it is formed of a material.

The finishing cap 450 is located at both ends of the body 410 and can be used for sealing the power supply unit (not shown). In addition, the fin 450 is formed on the finishing cap 450, so that the lighting device 400 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

5 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment.

5, the liquid crystal display device 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510 in an edge-light manner.

The liquid crystal display panel 510 can display an image using the light provided from the backlight unit 570. The liquid crystal display panel 510 may include a color filter substrate 512 and a thin film transistor substrate 514 facing each other with a liquid crystal therebetween.

The color filter substrate 512 can realize the color of an image to be displayed through the liquid crystal display panel 510.

The thin film transistor substrate 514 is electrically connected to a printed circuit board 518 on which a plurality of circuit components are mounted via a driving film 517. The thin film transistor substrate 514 may apply a driving voltage provided from the printed circuit board 518 to the liquid crystal in response to a driving signal provided from the printed circuit board 518. [

The thin film transistor substrate 514 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 570 includes a light emitting device module 520 that outputs light, a light guide plate 530 that changes the light provided from the light emitting device module 520 into a surface light source and provides the light to the liquid crystal display panel 510, A plurality of films 550, 566, and 564 that uniformly distribute the luminance of light provided from the light guide plate 530 and improve vertical incidence, and a reflective sheet (not shown) that reflects light emitted to the rear of the light guide plate 530 to the light guide plate 530 540).

The light emitting device module 520 may include a PCB substrate 522 to mount a plurality of light emitting device packages 524 and a plurality of light emitting device packages 524 to form a module.

The backlight unit 570 includes a diffusion film 566 for diffusing light incident from the light guide plate 530 toward the liquid crystal display panel 510 and a prism film 550 for enhancing vertical incidence by condensing the diffused light And may include a protective film 564 for protecting the prism film 550. [

6 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment. However, the parts shown and described in Fig. 5 are not repeatedly described in detail.

6, the liquid crystal display 600 may include a liquid crystal display panel 610 and a backlight unit 670 for providing light to the liquid crystal display panel 610 in a direct-down manner.

Since the liquid crystal display panel 610 is the same as that described with reference to FIG. 5, detailed description is omitted.

The backlight unit 670 includes a plurality of light emitting element modules 623, a reflective sheet 624, a lower chassis 630 in which the light emitting element module 623 and the reflective sheet 624 are accommodated, And a plurality of optical films 660 disposed on the diffuser plate 640.

The light emitting device module 623 may include a PCB substrate 621 to mount a plurality of light emitting device packages 622 and a plurality of light emitting device packages 622 to form a module.

The reflective sheet 624 reflects light generated from the light emitting device package 622 in a direction in which the liquid crystal display panel 610 is positioned, thereby improving light utilization efficiency.

The light emitted from the light emitting element module 623 is incident on the diffusion plate 640 and the optical film 660 is disposed on the diffusion plate 640. The optical film 660 is composed of a diffusion film 666, a prism film 650, and a protective film 664.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It should be understood that various modifications may be made by those skilled in the art without departing from the spirit and scope of the present invention.

110: body 120: cavity
130: light emitting element 140: first lead frame
150: second lead frame 160: resin layer
A: Curvature forming area

Claims

A body formed with a cavity;
First and second lead frames disposed in a lower region of the body;
A light emitting element electrically connected to the first and second lead frames; And
And a resin layer formed on the cavity,
The lower region of the body and the first and second lead frames include a curvature formed in at least one region,
The body and the first and second lead frames include a curved region A and a non-curved region B,
The region A is formed in an area where the first and second lead frames contact the body,
And the region B is formed on the first and second lead frames forming the bottom surface of the cavity.

The method according to claim 1,
The curvature,
And both ends of the body and the first and second lead frames are bent upward.

3. The method of claim 2,
Wherein the both side ends and the central region of the body have a step of 60 mu m to 140 mu m.

The method according to claim 1,
Wherein the body and the first and second lead frames are connected to each other,
And has a different curvature depending on each region.

The method according to claim 1,
Wherein the body and the side regions of the first and second lead frames have a curvature larger than a center region of the body and the first and second lead frames.

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