KR101814998B1 - Adhesive tapes and display devices - Google Patents

Abstract

The adhesive tape comprises a thermally conductive base layer, a first heat-dissipative adhesive layer laminated on one surface of the thermally conductive base layer, the first heat-radiating adhesive layer including heat radiation particles inside and embossed patterns formed thereon, And a second heat-dissipative adhesive layer included in the second heat-dissipative adhesive layer. The adhesive tape has improved heat dissipation characteristics and impact resistance.

Description

[0001] ADHESIVE TAPES AND DISPLAY DEVICES [0002]

The present invention relates to an adhesive tape and a display device. More particularly, the present invention relates to a pressure-sensitive adhesive tape having a multi-layer structure and a display device to which the pressure-sensitive adhesive tape is applied.

BACKGROUND ART [0002] Recently, in electronic devices such as mobile phones, displays, touch screen panels (TSP), and the like, adhesive tapes including pressure sensitive adhesive (PSA) are applied for bonding or laminating components.

When the adhesive tape is used in the electronic device, it can be designed in a multi-layer structure so as to give various physical properties with improved adhesion.

For example, Patent Document 1 discloses a double-sided tape including a PSA-based adhesive layer.

1. Korean Patent Publication No. 10-2010-0004869 (Aug. 27, 2012)

An object of the present invention is to provide a pressure-sensitive adhesive tape having improved heat radiation characteristics.

An object of the present invention is to provide a display device to which an adhesive tape having improved heat radiation characteristics is applied.

According to an exemplary embodiment of the present invention, there is provided an adhesive tape comprising a thermally conductive base layer, a thermally conductive base layer laminated on one surface of the thermally conductive base layer, And a second heat-radiating adhesive layer laminated on the other surface of the thermally-conductive base layer and containing the heat-radiating particles therein.

According to exemplary embodiments, the thermally conductive substrate layer may comprise a metal foil.

According to exemplary embodiments, the heat radiating particles may include boron nitride (BN), graphine, carbon nanotube (CNT), and / or graphite.

According to exemplary embodiments, the first heat radiation adhesive layer and the second heat radiation adhesive layer may include Pressure Sensitive Adhesives (PSA) in which the heat radiation particles are dispersed.

According to exemplary embodiments, a heat dissipation channel may be defined between the emboss patterns.

According to exemplary embodiments, a passivation layer may be further formed between the thermally conductive base layer and the first heat-radiating adhesive layer, and / or between the thermally conductive base layer and the second heat-radiating adhesive layer.

According to exemplary embodiments, the passivation layer may comprise a more chemically stable metal than the thermally conductive substrate layer.

According to exemplary embodiments, the thermally conductive substrate layer comprises copper (Cu), and the passivation layer may comprise nickel (Ni).

According to exemplary embodiments, the passivation layer may comprise graphite.

According to exemplary embodiments, an embossed paper may be attached on the exposed surface of the first heat-dissipative adhesive layer.

According to an exemplary embodiment of the present invention, a display device includes a display panel, an adhesive tape, and a cover member sequentially stacked. Wherein the adhesive tape is laminated on one surface of the display panel and includes a thermally conductive base layer, a first heat-radiating adhesive layer laminated on one surface of the thermally conductive base layer and including heat radiation particles therein and embossed patterns formed thereon, And a second heat-radiating adhesive layer laminated on the other surface of the conductive substrate layer and including the heat-radiating particles therein.

According to exemplary embodiments, the emboss pattern of the first heat-radiating adhesive layer may be attached on the one surface of the display panel.

According to exemplary embodiments, a conductive foam layer may be adhered to the second heat radiation adhesive layer.

According to exemplary embodiments, the conductive foam layer may comprise an organic binder layer and conductive foam particles dispersed in the organic binder layer. The conductive foam particles may include a thermally expandable micropearl formed with a conductive coating layer.

According to exemplary embodiments, the adhesive tape further comprises a passivation layer formed on at least one of the thermally conductive base layer and the first heat-radiating adhesive layer, and between the thermally conductive base layer and the second heat- can do. The passivation layer may comprise nickel or graphite.

As described above, according to the exemplary embodiments of the present invention, the adhesive tape can be composed of layers having substantially heat radiation characteristics. The heat-sensitive adhesive layer of the adhesive tape may include an emboss pattern together with the heat-radiating particles. Therefore, for example, it can be attached to a component of an electronic device to simultaneously realize a heat insulating property and an impact resistance together with a predetermined adhesive force.

It should be understood, however, that the present invention is not limited to the above-described embodiments, and various changes and modifications may be made without departing from the spirit and scope of the invention.

1 is a cross-sectional view showing an adhesive tape according to exemplary embodiments;
2 is a cross-sectional view showing an adhesive tape according to exemplary embodiments;
3 is a flowchart for explaining a method of manufacturing an adhesive tape according to exemplary embodiments.
4 is a schematic diagram showing an application example of an adhesive tape to an electronic apparatus according to exemplary embodiments.
5 is a schematic diagram showing an application example of an adhesive tape to an electronic apparatus according to exemplary embodiments.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises ", or" having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, or combinations thereof, , Steps, operations, elements, or combinations thereof, as a matter of principle, without departing from the spirit and scope of the invention.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a cross-sectional view showing an adhesive tape according to exemplary embodiments;

Referring to FIG. 1, the adhesive tape 50 may include a first heat dissipation adhesive layer 130 and a second heat dissipation adhesive layer 140 formed on upper and lower sides of the heat conductive base layer 100, respectively. In some embodiments, a passivation layer 110 may be formed between the thermally conductive substrate layer 100 and the first heat-radiating adhesive layer 130. An embossed release paper 150 may be attached to the bottom of the first heat-dissipative adhesive layer 130. The release layer 160 may be adhered on the upper surface of the second heat-dissipative adhesive layer 140.

The thermally conductive base layer 100 may be provided as a supporting layer of the adhesive tape 50. [

In exemplary embodiments, the thermally conductive substrate layer 100 may comprise a metal foil. For example, a copper (Cu) foil or an aluminum (Al) foil may be utilized as the thermally conductive base layer 100.

The first and second heat-radiating adhesive layers 130 and 140 may include a pressure-sensitive adhesive in which heat spreading particles are dispersed. Accordingly, a predetermined adhesive strength of the adhesive tape 50 is imparted through the heat-dissipative adhesive layers, and the heat radiation characteristics of the adhesive tape 50 can be enhanced by the heat dissipation particles.

The heat radiation particles may include, for example, boron nitride (BN), graphine, carbon nanotube (CNT), or graphite. These may be used alone or in combination of two or more.

The pressure-sensitive adhesive may include, for example, an acrylic or silicone pressure-sensitive adhesive. For example, the pressure sensitive adhesive may comprise Pressure Sensitive Adhesives (PSA) comprising an acrylic copolymer.

According to exemplary embodiments, the first heat-radiating adhesive layer 130 may include emboss patterns 135. The embossed paper 150 is attached on the bottom surface of the first heat-dissipative adhesive layer 130 and the embossed patterns 135 transferred from the embossed paper 150 are formed on the bottom surface of the first heat- .

A channel 137 may be defined between the adjacent emboss patterns 135 of the first heat-dissipative adhesive layer 130. When the embossed paper 150 is peeled off and the first heat-dissipating adhesive layer 130 is adhered to the object, a path through which heat is released from the object through the channel 137 can be secured. In addition, bubble formation can be prevented when the adhesive tape 50 is attached through the channel 137. [

In some exemplary embodiments, a passivation layer 110 may be formed between the thermally conductive substrate layer 100 and the first heat dissipation adhesive layer 130. The passivation layer 110 may comprise, for example, a metal that is chemically more stable than the metal contained in the thermally conductive substrate layer 100. Accordingly, it is possible to prevent denaturation of the thermally conductive base layer 100 due to oxidation or contact with the first heat-dissipative adhesive layer 130. In some embodiments, the passivation layer 110 may comprise nickel (Ni).

In some embodiments, the passivation layer 110 may comprise a carbon-based material such as graphite.

As described above, since the passivation layer 110 also includes a thermally conductive material such as nickel or graphite, the adhesive tape 50 can be provided with heat radiation characteristics.

In some embodiments, the passivation layer 110 may be formed between the second heat dissipative adhesive layer 140 and the thermally conductive substrate layer 100. [

The release layer 160 may be adhered to the second heat-dissipative adhesive layer 140. As the release layer 160, a silicone-based, polyethylene-based, PET-based, or paper-based film can be used.

After the embossed paper 150 is peeled off, the side of the first heat-dissipation adhesive layer 130 of the adhesive tape 50 may be attached on the object. Further, after the release layer 160 is peeled, an additional object or tape structure may be attached to the second heat-dissipative adhesive layer 140 side. Accordingly, the adhesive tape 50 can be provided as a double-sided tape.

According to the exemplary embodiments described above, the adhesive tape 50 may include, for example, a thermally conductive substrate layer 100 comprising a copper foil, a passivation layer 110 comprising graphite or nickel, And a laminated structure of the heat-dissipative adhesive layers 130 and 140 dispersed therein. Since each layer of the adhesive tape 50 includes a material having a heat dissipation property, the heat generated from the object can be absorbed and effectively transmitted or emitted to the outside.

The first heat-dissipation / adhesive layer 130 is provided as an adhesive member of the adhesive tape 50 and includes the emboss patterns 135 as described above, so that the impact applied to the object can be absorbed. Further, an additional heat-dissipating passage can be secured through the channel 137. [

In some exemplary embodiments, the release layer 160 may also have a structure that is substantially the same as or similar to the embossed area 150. In this case, the second heat-radiating adhesive layer 140 may also include an emboss pattern and a channel.

2 is a cross-sectional view showing an adhesive tape according to exemplary embodiments; A detailed description of the substantially same or similar constitution and / or material of the adhesive tape 50 described with reference to Fig. 1 is omitted.

Referring to FIG. 2, the adhesive tape 60 may include a first passivation layer 110a and a second passivation layer 110b.

According to exemplary embodiments, the first passivation layer 110a may be disposed between the first heat dissipation adhesive layer 130 and the thermally conductive substrate layer 100. [ The second passivation layer 110b may be disposed between the thermally conductive base layer 100 and the second heat dissipation adhesive layer 140. [

As described above, the first and second passivation layers 110a and 110b may comprise a chemically stable metal, such as nickel, or a carbon-based material such as graphite.

As shown in FIG. 2, the thermally conductive base layer 100 of the adhesive tape 60 may be sandwiched between the passivation layers 110a, 110b. Therefore, oxidation and / or denaturation of both surfaces of the thermally conductive base layer 100 can be all prevented. The passivation layers 110a and 110b may be provided as a buffer layer for heat transfer between the heat conductive base layer 100 and the heat dissipation adhesive layers 130 and 140 so that the heat radiation performance of the adhesive tape 60 may be further enhanced have.

3 is a flowchart for explaining a method of manufacturing an adhesive tape according to exemplary embodiments. Hereinafter, a method for producing the pressure-sensitive adhesive tape will be described with reference to FIGS. 1 and 2. FIG.

Referring to FIG. 3, for example, in step S10, a thermally conductive substrate layer 100 may be prepared.

According to exemplary embodiments, the thermally conductive substrate layer 100 may be fabricated from a metal foil. For example, the thermally conductive substrate layer 100 can be made by cutting a copper foil or an aluminum foil.

For example, in step S12, a passivation layer may be formed on the thermally conductive substrate layer 100. [

1, the passivation layer 110 may be formed on one surface (e.g., a bottom surface) of the thermally conductive substrate layer 100 by a sputtering process, for example, Or by depositing a metal such as nickel. In some embodiments, the passivation layer 110 may be formed by applying graphite on one side of the thermally conductive substrate layer 100.

In some embodiments, a first passivation layer 110a and a second passivation layer 110b may be formed on the bottom and top surfaces of the thermally conductive substrate layer 100, respectively, as shown in FIG.

For example, adhesive layers may be formed on the passivation layer 110 and the thermally conductive base layer 100 in step S14. The first heat radiation adhesive layer 130 and the second heat radiation adhesive layer 140 may be formed on the bottom surface of the passivation layer 110 and the top surface of the thermally conductive substrate layer 100, .

According to exemplary embodiments, a pressure-sensitive adhesive composition comprising an acrylate-based compound, acrylic acid, and a solvent such as acetone or toluene can be prepared. The heat radiation adhesive composition can be produced by uniformly dispersing the heat radiation particles in the pressure-sensitive adhesive composition.

Thereafter, the heat-radiating adhesive composition is applied to the bottom surface of the passivation layer 110 and the top surface of the thermally conductive substrate layer 100, respectively, and the first heat-dissipating adhesive layer 130 and the second heat- A layer 140 may be formed. Accordingly, the first heat-radiating adhesive layer 130 and the second heat-radiating adhesive layer 140 may be provided as a PSA layer containing an acrylic copolymer.

For example, in step S16, the embossed-release paper 150 can be prepared.

In some embodiments, a mold can be fabricated that includes protruding patterns to be transferred into the emboss patterns 135 shown in FIG. For example, the mold can be produced by wet etching or etching the metal film to remove the portion to be transferred to the channel 137.

The transfer pattern of the template may be printed on the release paper by laminating the release paper to the template. Accordingly, the embossed release paper 150 including the reversed phase pattern of the transfer pattern can be manufactured.

For example, in step S18, the embossed paper 150 can be attached on at least one heat-radiating adhesive layer.

According to exemplary embodiments, after the embossed paper 150 is attached on the bottom surface of the first heat-dissipative adhesive layer 130, the protruding pattern is thermally bonded to the first heat-dissipative adhesive layer 130 It can be transcribed. Accordingly, as shown in FIG. 1, the first heat-radiating adhesive layer 130 may include an emboss pattern 135 to which the protrusion pattern is transferred, and a channel 137 to which the reversed-phase pattern is transferred.

In some embodiments, the release layer 160 may be adhered to the second heat-dissipative adhesive layer 140.

In some embodiments, the embossed paper may also be attached to the second heat-dissipative adhesive layer 140 in consideration of the structure attached on the second heat-dissipative adhesive layer 140. [ In this case, the second heat-radiating adhesive layer 140 may also be formed to include an emboss pattern and a channel thereon.

4 is a schematic diagram showing an application example of an adhesive tape to an electronic apparatus according to exemplary embodiments. For example, FIG. 4 illustrates an application of an adhesive tape according to exemplary embodiments to a display device or a smartphone.

Referring to FIG. 4, the adhesive tape 220 according to exemplary embodiments may be attached on one side of the display panel 210. The display panel 210 may comprise, for example, an active organic light emitting diode (AMOLED) panel. The display panel 210 may further include a touch screen panel (TSP). A cover glass 200 may be provided on the other surface of the display panel 210.

The adhesive tape 220 may include substantially the same or similar lamination structure as described with reference to FIG. 1 or FIG.

According to exemplary embodiments, the adhesive tape 220 is bonded to the first heat dissipation adhesive layer 130, the passivation layer 110, and the thermally conductive base layer 100 and the second heat dissipation adhesive layer 140). In some embodiments, as shown in FIG. 2, the thermally conductive substrate layer 100 may be sandwiched by the first and second passivation layers 110a, 110b.

The first heat dissipation adhesive layer 130 on which the emboss pattern 135 is formed may be attached to the display panel 210 side after the embossed release sheet 150 is peeled off from the adhesive tape 220 . The emboss pattern 135 is provided as an impact resistant member of the display panel 210, and heat emitted from the display panel 210 through the channel 137 can be discharged.

The heat generated from the display panel 210 can be absorbed through the adhesive tape 220 and released to the outside.

The display device or the cover member 230 of the smartphone may be attached to the side of the second heat radiation adhesive layer 140 after the release layer 160 is peeled from the adhesive tape 220. [

In some embodiments, the second heat-radiating adhesive layer 140 has a higher adhesive force than the first heat-radiating adhesive layer 130 and can support the cover member 230.

The cover member 230 includes a plastic material and may include, for example, a front cover, a back cover and / or a battery cover of the smartphone.

5 is a schematic diagram showing an application example of an adhesive tape to an electronic apparatus according to exemplary embodiments. A detailed description of the substantially same or similar structure and / or structure as described with reference to Fig. 4 is omitted.

Referring to FIG. 5, a conductive foam layer 225 may be further disposed between the adhesive tape 220 and the cover member 230. According to exemplary embodiments, the conductive foam layer 225 may comprise an organic binder layer in which the conductive foam particles 227 are dispersed.

The conductive foam particles 227 may comprise an organic polymeric micro pearl comprising a conductive coating layer. In some embodiments, the conductive foam particles 227 include a hollow therein, and the hollow may be surrounded by a polymer coating layer, such as, for example, an acrylonitrile copolymer. A conductive coating layer may be formed on the outer surface of the polymer coating layer. The conductive coating layer may include a metal material such as silver, nickel, copper, or the like.

The conductive foam particles 227 are thermally expandable by the hollow and the polymer coating layer, and can have a predetermined electrical conductivity by the conductive coating layer.

The organic binder layer may include acryl-based, urethane-based, epoxy-based, rubber-based, and silicone-based binders. These may be used alone or in combination of two or more.

In some embodiments, a linker formulation may be dispersed within the organic binder layer. For example, the linker preparation may comprise a carbon-based material such as carbon nanotubes. By the linker preparation, the conductive foam particles 227 are connected to each other, so that the horizontal electric resistance of the conductive foam layer 225 can be reduced.

Since the conductive foam layer 225 includes the conductive foam particles 227, it has a reduced electrical resistance, and the impact resistance of the electronic device can be further improved. Further, the heat dissipation characteristics and / or electromagnetic wave shielding characteristics generated from the electronic device can be improved by the conductive foam layer 225.

A cover member 230 may be attached on the conductive foam layer 225.

The adhesive tapes according to the above-described exemplary embodiments are applied to display devices such as mobile phones, OLED devices, or LCD devices, and adhesive components of various components included in TSPs and the like, Can be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the following claims. It can be understood that it is possible.

50, 60, 220: adhesive tape 100: thermally conductive base layer
110: passivation layer 110a: first passivation layer
110b: second passivation layer 130: first heat-dissipating adhesive layer
135: Embo pattern 137: Channel
140: second heat dissipation / adhesive layer 150: embossed paper
160: release layer 200: cover glass
210: display panel 225: conductive foam layer
227: conductive foam particle 230: cover member

Claims (15)

A thermally conductive substrate layer comprising copper or aluminum;
A first heat dissipation adhesive layer formed on one surface of the thermally conductive substrate layer and including emissive particles dispersed in a pressure sensitive adhesive and formed with emboss patterns;
A second heat dissipation adhesive layer laminated on the other surface of the thermally conductive substrate layer and including heat dissipation particles dispersed in an adhesive; And
And a passivation layer disposed on at least one of the thermally conductive base layer and the first heat-radiating adhesive layer and between the thermally conductive base layer and the second heat-radiating adhesive layer, the passivation layer including nickel. The adhesive tape according to claim 1, wherein the thermally conductive base layer comprises a foil of copper or aluminum. The adhesive tape according to claim 1, wherein the heat radiation particles comprise at least one selected from the group consisting of boron nitride (BN), graphine, carbon nanotube (CNT), and graphite. delete The adhesive tape according to claim 1, wherein a heat dissipating channel is defined between the embossed patterns. delete delete delete delete The adhesive tape according to claim 1, further comprising an embossed release sheet adhered on the exposed surface of the first heat-dissipative adhesive layer. Display panel;
A display panel,
A thermally conductive substrate layer comprising copper or aluminum;
A first heat dissipation adhesive layer formed on one surface of the thermally conductive substrate layer and including emissive particles dispersed in a pressure sensitive adhesive and formed with emboss patterns;
A second heat dissipation adhesive layer laminated on the other surface of the thermally conductive substrate layer and including heat dissipation particles dispersed in an adhesive; And
An adhesive tape disposed on at least one of the thermally conductive base layer and the first heat-radiating adhesive layer and between the thermally conductive base layer and the second heat-radiating adhesive layer, the adhesive tape comprising a passivation layer containing nickel; And
And a cover member laminated on the adhesive tape. The display device according to claim 11, wherein the emboss pattern of the first heat-dissipative adhesive layer is adhered on the one surface of the display panel. The display device according to claim 12, further comprising a conductive foam layer adhered to the second heat-dissipative adhesive layer. 14. The method of claim 13, wherein the conductive foam layer comprises:
An organic binder layer; And
Conductive foam particles dispersed in the organic binder layer,
Wherein the conductive foam particles comprise a thermally expandable micropearl formed with a conductive coating layer. delete

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