KR101759465B1 - Soldering device for printed circuit board - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a soldering apparatus for soldering electronic components on a PCB substrate or a soldering apparatus for reworking an electronic component due to defective electronic components. More particularly, By applying ultrasonic vibration to the soldering position of the substrate, it is possible to prevent the occurrence of solder voids (durability of the solder due to pores inside the solder, which reduces various reliability such as resistance value of the electronic device, vibration crack, etc.) The present invention relates to a soldering apparatus for mounting a PCB substrate on which an electronic component is mounted, a heating means for soldering the electronic component by melting the solder of the PCB substrate, And an ultrasonic wave generation means positioned below the PCB substrate to generate ultrasonic vibration And it provides a soldering apparatus for the ultrasonic vibration generated by the ultrasonic generation means further comprises a vibration transmitting means for transmitting to the PCB substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to a soldering apparatus for a void-free printed circuit board,

The present invention relates to a soldering apparatus for a PCB substrate for performing soldering of electronic components on a PCB substrate in a surface mount technology (SMT) or reworking due to defective electronic components, and more particularly, When soldering with electronic parts mounted on PCB board, ultrasonic vibration is applied to the soldering position of the PCB substrate, and the solder durability due to pores in the solder due to pores inside the solder causes various reliability such as resistance value of electronic device, vibration crack, To a soldering apparatus for a void prevention type printed circuit board which is excellent in soldering quality.

In general, various electronic components are mounted on a printed circuit board (PCB) widely used in electronic, electric, and automotive products to realize functions of each product.

The electronic component mounting of the PCB substrate is mainly using the soldering method, such as SMD, wave soldering, dipping soldering, and selective soldering.

In the surface mount technology (SMT), a circuit pattern is printed on a PCB substrate, an electronic component is mounted on the electronic component mounting position of the circuit pattern, soldering is performed by melting and cooling the solder, I will.

Ag / Cu / Sn / Ag / Sn / Cu / Sn / Ag / Cu / In instead of lead, which is a heavy metal, Bi, etc., and are used in the forms of Bar Solder, Wire Solder, Solder Paste, Solder Ball and Solder Preforms.

However, in the soldering technology of the conventional PCB substrate, when the solder of the PCB substrate is melted, flux is activated at the time of melting the solder, and gas is generated. This gas remains in the solder to generate a void, There is a problem to form.

In particular, recently, there is a problem that more voids are generated by using a solder paste in paste form (paste shape) by mixing flux into solder powder in a PCB substrate.

As described above, the voids generated in the solder during the soldering process of the electronic component have a problem that not only the reliability of the product is lowered but also the product is defective.

In addition, the bonding strength of the electronic component is lowered and the durability of the electronic component is deteriorated.

Meanwhile, in order to solve the problem of defective PCB substrate caused by defective parts or other problems of the PCB substrate, a device for removing defective parts of the PCB substrate and mounting the new electronic parts again is referred to as a rework device. The solder of the defective part mounted on the PCB substrate is melted and removed and the new electronic part is soldered again, resulting in troublesome work and uneconomical problems.

In addition, during reworking of the PCB substrate, there is a problem that the voids of the solder are re-generated as described above in the process of re-mounting the new electronic components, thereby failing to solve the problem of defective electronic components.

Patent Document 1: Patent Registration No. 10-1488618 Patent Document 2: Utility Model Registration No. 20-0158883

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made to solve the above problems of the prior art, and it is an object of the present invention to provide a soldering apparatus, The solder durability of the solder due to the pores inside the solder resistance of the electronic device, vibration cracks, etc., which reduces the reliability of various phenomena), so that the purpose is to provide excellent soldering quality.

In particular, the present invention provides a mechanism capable of locally transmitting ultrasonic vibrations over the entire area of an electronic component mounted on a PCB substrate, thereby providing a soldering apparatus capable of concentrically applying ultrasonic vibration only to electronic parts to be soldered The purpose is to provide.

In addition, the present invention provides a mechanism capable of aligning the heating means to each soldering operation position while allowing a plurality of electronic components to be supplied to the PCB substrate and transmitting the ultrasonic vibration to each electronic component, It is an object of the present invention to provide a soldering apparatus capable of performing continuous soldering work without supplying electronic components and rearranging PCB boards.

According to another aspect of the present invention, there is provided a soldering apparatus for soldering an electronic component by melting a solder of a PCB substrate, And a vibration transmitting unit for transmitting the ultrasonic vibration generated by the ultrasonic wave generating unit to the PCB substrate. The ultrasonic vibration generating unit may be disposed on the lower surface of the PCB to generate ultrasonic vibration.

The vibration transmitting means may include a vibration base connected to the ultrasonic wave generating means and disposed at the bottom of the PCB substrate, and at least one vibration pin coupled to the vibration substrate and contacting the PCB substrate.

In addition, the vibrating pin directly contacts the lower portion of the PCB substrate, and can partially apply ultrasonic vibration to the contacted PCB substrate.

The vibrating pin is coupled to the vibration base so as to be disposed over the entire area of the electronic component to be soldered, so that the ultrasonic vibration can be concentrated only on the electronic component to be soldered.

Meanwhile, the vibration base of the vibration transmitting means may be provided with a plurality of coupling grooves for coupling the vibration pins.

Further, the present invention further includes alignment means for aligning the heating means to the soldering operation position, wherein the aligning means includes a guide rail, a moving base slidably coupled to the guide rail, and a guide rail And a telescopically mounted extension to cross the direction of movement of the heating means.

In addition, the end of the heating portion may be provided with an adapter that is replaceably mounted so as to correspond to the size of the electronic component to be soldered.

A coupling protrusion coupled to the ultrasonic generator is protruded from the vibration base of the vibration transmitting unit. The coupling protrusion is rotatably supported on the ultrasonic generator to rotate the vibration base in a horizontal position.

Further, the apparatus may further include a substrate moving means for moving the mounting means to adjust to correspond to the size of the PCB substrate.

The substrate moving unit includes a first moving unit and a second moving unit. The first moving unit includes a first guide arranged in one direction and a first moving frame moved along the first guide. The apparatus may further include a second guide arranged in a direction intersecting the direction in which the first guide is laid, and a second movable frame moved along the second guide.

As described above, the soldering apparatus of the anti-void type printed circuit board according to the present invention improves the spreadability, wettability and bonding strength of the solder by applying ultrasonic vibration to the soldering joint region, thereby improving the durability of the PCB substrate.

In addition, the present invention solves the problems caused by voids in the solder while performing re-soldering without replacing defective parts by applying ultrasonic vibration to the defective parts together with melting of the solder during reworking of the PCB substrate, Efficiency, and economy.

In order to apply ultrasonic vibration locally to an electronic component, the vibration pin is coupled to the vibration base in a range corresponding to the size of the electronic component mounted on the PCB substrate, so that the electronic component to be soldered The ultrasonic vibration can be intensively transmitted only in a short time, and the influence of quality due to the ultrasonic vibration at the adjacent positions can be minimized.

In the meantime, according to the present invention, it is possible to move only the heating means to each soldering operation position by the aligning means without rearranging the PCB substrate, and in particular, the vibrating pin is provided so as to apply the ultrasonic vibration to each soldering operation position, A plurality of electronic parts are continuously soldered without supplying the electronic parts or moving the ultrasonic generating means to the initial position while rearranging the PCB substrate in the soldering operation while supplying a plurality of electronic parts to the respective soldering operation positions So that the working time is significantly shortened.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic view showing the overall configuration of a soldering apparatus for a void-free printed circuit board according to the present invention; FIG.
FIG. 2 is a side view of a soldering apparatus of a non-void type printed circuit board according to the present invention.
3 is a partial perspective view showing in detail a part of a soldering apparatus of a void prevention type printed circuit board according to the present invention.
4 is a partial perspective view illustrating the heating unit of the soldering apparatus of the anti-void type printed circuit board according to the present invention.
FIG. 5 is a top plan view of a soldering apparatus of the anti-void type printed circuit board according to the present invention. FIG.
6 is a plan view of the soldering apparatus of the anti-void type printed circuit board according to the present invention, as viewed from above.
7 is a side view showing a soldering process of the soldering apparatus of the anti-void type printed circuit board according to the present invention.

Brief Description of the Drawings The advantages and features of the present invention, and how to accomplish them, will be more apparent from the following detailed description taken in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Hereinafter, the technical features of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a soldering apparatus for solderless printed circuit board according to the present invention; FIG.

The soldering apparatus for solderless printed circuit board according to the present invention is configured to solder an electronic component to a PCB substrate or perform a defective part rework operation of the PCB substrate. The soldering apparatus includes a PCB substrate 2 on which the electronic component 3 can be mounted, A heating means 20 for melting the solder of the PCB substrate 2 to solder the electronic component 3 to the PCB substrate and a heating means 20 for positioning the PCB substrate 2 under the ultrasonic vibration And an ultrasonic generator 30 for generating ultrasonic waves.

Here, the soldering apparatus of the anti-void type printed circuit board according to the present invention further comprises a vibration transmitting means 40 for transmitting the ultrasonic vibration generated in the ultrasonic wave generating means 30 to the PCB substrate 2. The vibration transmission means 40 has a vibration base 41 as a space for performing a soldering operation.

The mounting means 10 is for mounting the PCB substrate 2 and can be applied in various ways to fix the PCB substrate 2. The mounting means 10 may be mounted on the PCB substrate 2 as shown in Figures 2 and 3, And a substrate fixture 11 for fixing the PCB substrate 2 by clamping upper and lower portions thereof.

Although not shown in the drawing, the mounting means 10 may be formed as an alternative embodiment, in which both sides of the PCB substrate 2 are opposed to each other by a separate operating cylinder, and the amount of the PCB substrate 2 Or may be provided in a manner that the side is pressed and fixed.

The substrate fixture 11 includes one or a pair of fixing pieces 12 to be operated up and down and an adjusting member 13 for adjusting the fixing member 12, The adjusting member 13 can be operated to fix the upper surface and the lower surface of the PCB substrate 2 in a state where the fixing member 12 is fixed.

According to an embodiment, the substrate fixture 11 is provided with a bolt 13 as shown in the figure and screwed by a bolt 13 to adjust the fixing piece 12, Or by fastening the upper and lower parts of the PCB substrate 2 by simultaneously moving the lower fixing pieces 12 or both of them. Alternatively, the adjuster 13 may be provided with a separate operation cylinder (not shown) and operated, so that the operation of the operation cylinder moves the fixing piece 12 to tighten the PCB substrate 2. [

According to the embodiment of the present invention, the mounting means 10 includes the substrate fixtures 11 arranged on both sides of the PCB substrate 2 for fixing the PCB substrate 2 on both sides, It is preferable that the substrate 2 is stably mounted. More preferably, it is preferable to arrange the PCB substrate 2 in a total of four locations by having two pairs of substrate fixtures 11.

The heating means 20 performs a soldering operation for melting the solder of the PCB substrate 2 to fix the electronic component 3 to the PCB substrate 2 and includes a heating portion 21 for applying heat, 21) for raising and lowering the soldering operation height on the PCB substrate (2).

The heating means 20 moves the heating portion 21 vertically up and down along the lifting rail 23 by means of a separate lifting and lowering operation portion to move the heating portion 21 to a position for soldering work, . ≪ / RTI >

The heating unit 21 may be equipped with a hot air heater or a heater. The heating unit 21 may be constituted as a plurality of units as shown in the drawing, and the soldering operation can be performed at the same time.

The heating unit 20 may be provided with an adapter 22 capable of selectively controlling the size of the hot air discharge port of the heating unit 21 according to the size of the electronic component 3 mounted on the PCB substrate 2 , The adapter 22 formed in a size corresponding to the size of the small-sized electronic component 3 on the right side is fitted to the discharge port side of the heating portion 21, as shown in Fig. Therefore, heat can be concentratedly applied only to the electronic part 3 to be processed, thereby solving the problem of quality irregularity due to the soldering temperature deviation.

The ultrasonic wave generating means 30 is for applying ultrasonic vibration to the PCB substrate 2. The ultrasonic wave generating means 30 may include an ultrasonic wave generator 31, an ultrasonic generator 33, and an up / down operation portion 35. It is preferable that the ultrasonic wave generating means 30 is provided under the PCB substrate 2 due to the heating means 20 for performing the soldering operation at the upper portion of the PCB substrate 2, 31 are located at the bottom of the PCB substrate 2. [

The ultrasonic wave generator 31 generates ultrasonic vibration and may be configured to control the output or the like by the ultrasonic generator 33 according to the size of the electronic component.

The ultrasonic wave generator 31 may be provided with a probe tip 32 to be connected to a vibration base 41 to be described later and a probe tip 32 extending from the upper portion of the ultrasonic wave generator 31.

The raising and lowering operation portion 35 is provided to raise and lower the ultrasonic wave generating portion 31 toward and away from the PCB substrate 2. The raising and lowering operation portion 35 can be applied to hydraulic pressure or a pneumatic cylinder or a support jack. And is disposed below the ultrasonic wave generator 31. [

The vibration transmitting means 40 is for transmitting the ultrasonic vibration generated in the ultrasonic wave generating means 30 to the PCB substrate 2 and may include a vibration base 41 and a vibration pin 43.

The vibrating base 41 is installed on the bottom of the PCB 2 while being connected to the upper end of the ultrasonic generator 31 of the ultrasonic generator 30, (31) move up and down as they move up and down. Here, the vibration base 41 may be formed in a rectangular shape, and may be formed into a square shape or a circular or elliptical shape as shown.

The vibration base 41 vibrates the PCB substrate 2 as a whole due to the ultrasonic vibration generated by the ultrasonic wave generating means 30.

At this time, the vibration transmission means 40 may be arranged such that the vibration base 41 is disposed adjacent to the bottom of the PCB substrate 2 or in contact with the PCB substrate 2.

The vibrating pin 43 is for transmitting the ultrasonic vibration to the PCB substrate 2. The vibrating pin 43 is coupled to the upper side of the vibration base 41 and directly contacts the bottom of the PCB substrate 2 and is generated in the ultrasonic wave generator 30 The ultrasonic vibration is directly transmitted to the PCB substrate 2 due to the vibration of the vibration base 41 due to the ultrasonic vibration.

At this time, when the vibrating pin 43 is in contact with the PCB substrate 2, it can be directly contacted with the PCB substrate 2 in the form of point contact or surface contact, Will vary. That is, the vibration pin 43 may be formed as a circular rod pin or a square pin pin as a whole, and the upper end thereof may be formed in the form of a plane or a hemisphere. When the vibration pin 43 is in contact with the PCB substrate 2 in point contact, the ultrasonic vibration can be applied more intensively. If the vibration pin 43 is in surface contact, ultrasound vibration can be applied in a wider range than in the case of point contact Which can be applied differently depending on the size of the vibration pin 43 or the soldered area.

Here, the vibrating pin 43 can be disposed at a soldering operation position, that is, at a position corresponding to the electronic part 3 positioned on the PCB substrate 2, and preferably corresponds to the size of the electronic part 3 To the vibration base 41 by a range located over the entire area of the electronic component 3. [

3, when the size of the electronic component 3 is small, one or a small number of vibration pins 43 are selected and coupled to the vibration base 41, The number of the electronic parts 3 is larger than the number of the electronic parts 3, and the number of the electronic parts 3 can be coupled to the vibration base 41 such that the electronic parts 3 can be located within a corresponding range.

The vibrating pin 43 may be coupled to the vibration base 41 in various ways. According to the present invention, the vibration base 41 is provided with a coupling groove 45 for coupling the vibration pin 43 .

The coupling grooves 45 are formed in the form of grooves or holes so that the vibration pins 43 can be engaged. As shown in the figure, a plurality of the vibration grooves 45 can be arranged in a lattice form on the vibration base 41, So that the pin 43 can be selectively coupled to the defect groove 45. Particularly, a part of the vibration pin 43 is inserted into the coupling groove 45, so that the vibration pin 43 can be stably supported.

Further, the vibration base 41 can be configured to be rotatable in the horizontal direction. 2, the vibration base 41 includes a connection protrusion 47 extending downward from the bottom of the vibration base 41 and connected to the upper end of the ultrasonic wave generator 31, that is, the probe tip 32.

The connection protrusion 47 may be rotatably connected to the upper end of the probe tip 32 in a horizontal direction. For this purpose, a rotary body 49 may be formed at an end of the connection protrusion 47.

The rotating body 49 is formed in a flange shape at the end of the connecting protrusion 47 and is coupled to the probe tip 32 so as to be supported at the upper end of the probe tip 32, So that it is possible to prevent the shaft from being twisted when the vibration base 41 is rotated, to secure the position of the shaft, and to support the rotation shaft to reduce the frictional resistance.

That is, the vibration base 41 can be rotated in the horizontal direction on the ultrasonic wave generator 31, so that the vibration base 41 can correspond to the PCB substrate 2 of various shapes, (43).

The soldering apparatus for a printed circuit board (PCB) according to the present invention includes a plurality of soldering units 10 for moving a mounting unit 10 according to the sizes of various PCBs 2, Means 50 may be provided. Referring to Figures 3, 5 and 6, this substrate moving means 50 is shown in more detail.

The substrate moving means 50 includes a first moving portion 51 for moving the substrate clamping tool 11 in the first direction and a second moving portion 51 for moving the substrate clamping tool 11 in the second direction And a second moving unit 52.

5 or 6, the first direction refers to the transverse direction of the vibration base 41, that is, the X-axis direction, and the second direction refers to the longitudinal direction of the vibration base 41, that is, Y Axis direction.

The first moving part 51 includes a first guide 53 installed along the first direction and a first moving frame 55 slidably coupled to the first guide 53.

The first guide 53 is provided with a pair of members parallel to the fixed frame 5 provided on the base 4 of the apparatus as shown in the drawing and the first guide 53 is provided with a pair of first And the first moving part 51 reciprocates the first moving frame 55 along the first guide 53. The first moving part 55 is provided with a moving frame 55,

The second moving part 52 is connected to the first moving part 51. The second moving part 52 includes a second guide 54 installed along the second direction and a second guide 54, And a second moving frame 56 slidably coupled to the second moving frame. The second guide 54 is connected to the first moving frame 55 and the second moving part 52 reciprocates the second moving frame 56 along the second guide 54. [

Here, the substrate fixture 11 of the mounting means 10 is connected to the second moving frame 56 of the second moving part 52. [

That is, the second moving frame 56 is connected to the substrate fixture 11, which is positioned on both sides of the PCB substrate 2, and the substrate moving means 50 moves the first moving unit 51 in the first direction , The second moving part (52) configured to be connected to the first moving frame (55) moves the second moving frame (56) along the second direction, and the second moving frame And the substrate fixture 11 connected to the moving part 52 moves along them.

Therefore, the mounting means 10 connected to the substrate moving means 50 moves the substrate fixing port 11 in the first direction or the second direction by the movement of the first and second moving portions 52, The PCB substrate 2 can be stably mounted irrespective of the shape or size of the PCB substrate 2.

At this time, the first and second moving parts 52 may be configured to be moved by an actuator such as an actuating cylinder or a driving motor.

The soldering apparatus of the anti-void type printed circuit board according to the present invention may further comprise alignment means (60) for aligning the aforementioned heating means (20) to respective soldering operation positions.

The alignment means 60 aligns the heating means 20 to the soldering operation position. The aligning means 60 includes a guide rail 61, a moving base 63 slidably engaged with the guide rail 61, (65) which is mounted to extend at an end of the guide rail (63) so as to extend in the direction intersecting the longitudinal direction of the guide rail (61).

This alignment means 60 is shown in more detail in Figures 5 and 6, in conjunction with Figure 1.

The guide rails 61 are disposed in the horizontal direction so as to cross the vertical rails 23 in the vertical direction. In the embodiment of the present invention, the guide rails 61 may be provided in the same direction as the first direction described above. And can be moved up and down along the lifting rails 23 and horizontally extended along the first direction.

The moving base 63 is coupled to the guide rail 61 so as to be slidable.

The extension 65 is mounted so as to be telescopic on the end of the moving table 63 so as to be movable in a direction intersecting the longitudinal direction of the guide rail 61, that is, in the same direction as the above-described second direction . A heating portion (21) is connected to an end of the extension base (65).

Here, the movable stand 63 is preferably extended and protruded in the same second direction as the extended stand 65, as shown in the figure, so that the telescopic structure of the extended stand 65 can be stably supported.

The aligning means 60 can move the heating portion 21 of the heating means 20 in the first direction or the second direction and perform the soldering operation among the electronic parts 3 placed on the PCB substrate 2 It becomes possible to selectively move to the position of the electronic part 3 to be implemented, so that the soldering temperature deviation can be solved together with the adapter 22. [

In addition, although the present invention is not shown in detail in the drawings, it is possible to supply component supplying means, for example, the electronic component 3 for automatically supplying the electronic component 3 to the upper portion of the PCB substrate 2, The electronic component mounting position of the PCB substrate 2 can be automatically supplied and supplied.

Hereinafter, the operation and operation of the present invention configured as described above will be described with reference to FIGS. 1 to 7. FIG.

First, the PCB substrate 2 on which the electronic component 3 is to be mounted is placed on the mounting means 10.

In this state, the substrate fixing means 11 of the mounting means 10 is moved to a position corresponding to the size of the PCB substrate 2 by the substrate moving means 50.

That is, the first moving frame 55 is moved by the first moving unit 51 along the first guide 53 to be adjusted to the length along the first direction of the PCB substrate 2, The second moving frame 56 is moved along the second guide 54 by the portion 52 to be adjusted to fit the length along the second direction of the PCB substrate 2, The connected substrate fixture 11 is moved and positioned on both sides of the PCB substrate 2.

When the substrate fixture 11 is positioned on both sides of the PCB substrate 2 as described above, a pair of fixing pieces 12 are tightened to grip the upper and lower surfaces of the PCB substrate 2, The PCB substrate 2 is clamped by being pressed and fixed in close contact with the upper and lower surfaces of the PCB substrate 2. Referring to FIGS. 5 and 6, the substrate clamping unit 11 is moved by the substrate moving unit 50 according to the size of the PCB substrate 2, and it can be seen how the respective substrates are gripped.

In this state, the electronic part 3 is put up and supplied to the electronic part mounting position on the upper part of the PCB substrate 2.

The electronic component 3 may be manually handled, and the electronic component 3 may be sucked by a component supply means, such as a suction unit, though not shown in detail in the figure, Left and right, up and down, and can be placed and supplied.

When the electronic component 3 is supplied to the PCB substrate 2, the heating unit 21 of the heating means 20 is moved upward and downward by the lifting and lowering operation unit from above the PCB substrate 2, Down.

At this time, the vibration pin (43) is coupled to the vibration base (41) located at the lower part of the PCB substrate (2). Here, at least one vibration pin 43 is coupled to a mounting position of the electronic component, that is, a position corresponding to the electronic component 3, of the PCB substrate 2 described above. When a plurality of electronic components 3 are mounted on the upper portion of the PCB substrate 2, the vibration pins 43 are coupled to the corresponding positions of the respective electronic components 3, So that the vibration pins 43 can be positioned within a range corresponding to the size of the vibration pins 43. [

The ultrasonic generator 31 is raised by the lifting and lowering operation part 35 from the lower part of the PCB substrate 2 and the vibration pin 43 coupled to the vibration base 41 is lifted up by the electronic part 3, that is, the soldering work position.

Here, the heating portion 21 can be provided at a fixed position, but can be moved to the respective soldering work position by the alignment means 60 and is moved to the selected soldering work position.

7, hot air is blown from the nozzles of the heating unit 21 to fix the solder of the PCB substrate 2 while fixing the electronic part 3 in a fixed manner.

At the same time, ultrasonic vibration is generated in the ultrasonic wave generator 31 at the lower part of the PCB substrate 2, and ultrasonic vibration is transmitted to the lower part of the PCB substrate 2 by the vibration transmission unit 40, So that the generation of voids in the solder can be prevented.

The ultrasonic vibration generated in the ultrasonic wave generator 31 is transmitted to the soldering operation position where the electronic component 3 is located in the lower portion of the PCB substrate 2 through the vibration pin 43 coupled to the vibration base 41 The ultrasonic vibration is applied and the work can be performed if the vibration fin 43 is in the soldering operation position even if the position of the PCB substrate 2 or the ultrasonic wave generator 31 is not changed. It is possible to perform the soldering operation of all the electronic parts 3 mounted on the PCB substrate 2 only through the movement of the electronic part 3 to the PCB substrate 2, The soldering operation can be performed continuously without performing the reordering process of the PCB substrate 2, thereby significantly shortening the working time.

The vibrating pin 43 is selectively coupled to the vibration base 41 within a range corresponding to the size of the electronic component 3 so that the vibrating pin 43 is adjacent to the electronic component 3 mounted on the PCB substrate 2 It is possible to concentrate the ultrasonic vibrations locally only by the size corresponding to the size of the electronic part 3 to be soldered, avoiding the position of the arranged electronic part 3.

When the electronic part 3 of the PCB substrate 2 is soldered in this way, the heating part 21 can be moved to the next selected soldering position, and the next soldering operation can be performed.

In addition, the vibration pin 43 is coupled to the ultrasonic transducer so as to locally transmit the ultrasonic vibration to an area or a range corresponding to the size of the electronic component 3 mounted on the PCB substrate 2, The ultrasonic vibration can be applied only to the electronic part 3 that is to be operated only during the reworking operation. Therefore, the ultrasonic vibration can be applied to the adjacent electronic part 3, It is possible to minimize the influence of the quality of the image.

At this time, in the soldering apparatus of the anti-void type printed circuit board according to the present invention, the vibration pins 43 are coupled for each soldering position in a state where the electronic parts 3 to be soldered are arranged on the PCB substrate 2 in advance And the heating unit 21 of the heating unit 20 can be moved over the entire surface of the vibration base 41 by the aligning unit 60 so that the heating unit 21 can also move to each soldering position , The PCB unit 2 is reassembled into the soldering operation position in a state where the heating unit 21 and the ultrasonic wave generating unit 31 are returned to their original positions upward and downward each time the soldering operation is performed, Unlike the case where the process of supplying and soldering has been repeated, the present invention is merely a process of moving the heating portion 21 of the heating means 20 to the soldering operation position without moving the PCB substrate 2, Successively According to city, the effect of being able to significantly shorten the working time. That is, there is an advantage that a continuous soldering operation can be performed in a state where a large number of electronic parts 3 are supplied to the PCB substrate 2.

In other words, the present invention can move the heating portion 21 of the heating means 20 to the respective soldering operation position by the alignment means 60 without rearranging the PCB substrate 2, It is possible to perform the soldering operation continuously in a state in which the vibration pins 3 are provided so as to apply ultrasonic vibrations to the electronic parts 3 so that a plurality of electronic parts 3 other than one electronic part 3 are supplied to the respective soldering operation positions In addition, when the soldering operation is performed, a plurality of electronic parts 3 are continuously soldered without re-arranging the PCB substrate 2 and supplying the electronic parts 3 or moving the ultrasonic generating means 30 to the initial position So that the working time is significantly shortened.

The foregoing description is merely illustrative of the technical idea of the present invention and various changes and modifications may be made without departing from the essential characteristics of the present invention by those skilled in the art. Therefore, the embodiments disclosed in the present invention are for illustrative purposes only and are not intended to limit the scope of the present invention, and the scope of the present invention is not limited by these embodiments.

Therefore, the scope of the present invention should be construed as being covered by the following claims rather than being limited by the above embodiments, and all technical ideas within the scope of the claims should be construed as being included in the scope of the present invention.

2: PCB substrate 3: Electronic parts
10: mounting means 11: substrate fixing means
20: Heating means 21:
30: Ultrasonic wave generating means 31: Ultrasonic wave generating unit
32: probe tip 40: vibration transmitting means
41: Vibration base 43: Vibration pin
45: engaging groove portion 47:
50: substrate moving means 60: alignment means
61: guide rail 63: movable base
65: Extension stand

Claims (8)

A mounting means for mounting the PCB substrate on which the electronic component is mounted;
Heating means for melting the solder of the PCB substrate to solder the electronic component; And
And an ultrasonic wave generation unit positioned below the PCB substrate to generate ultrasonic vibration,
Further comprising a vibration transmitting means for transmitting the ultrasonic vibration generated in the ultrasonic wave generating means to the PCB substrate,
Wherein the vibration transmitting means includes a vibrating base connected to the ultrasonic wave generating means and disposed at the bottom of the PCB substrate and at least one vibrating pin coupled to the vibrating base and contacting the PCB substrate, Lt; / RTI >
delete The method according to claim 1,
Wherein the vibrating pin is in direct contact with a lower portion of the PCB substrate and applies ultrasonic vibration partially to the contacted PCB substrate.
The method of claim 3,
Wherein a plurality of coupling grooves are formed in the vibration base so that the vibration pins are arranged so as to correspond to the area of the electronic component to be soldered,
Wherein the vibrating pin is inserted into and coupled to the coupling groove to concentrate ultrasound vibration only on the electronic component.
The method according to claim 1,
Further comprising alignment means for aligning the heating means to a soldering operation position,
The aligning means includes a guide rail, a moving bar slidably coupled to the guide rail, and an extension rod telescopably mounted at the end of the moving bar so as to intersect the longitudinal direction of the guide rail, A soldering device for a void-free printed circuit board to be moved.
The method according to claim 1,
Wherein an end of the heating means is provided with an adapter that is replaceably mounted so as to correspond to a size of an electronic component to be soldered.
The method according to claim 1,
Further comprising substrate moving means for moving the mounting means to adjust the size of the mounting means to correspond to the size of the PCB substrate.
The method of claim 7,
Wherein the substrate moving means comprises a first moving unit and a second moving unit,
Wherein the first moving part includes a first guide arranged in one direction and a first moving frame moved along the first guide,
Wherein the second moving part includes a second guide arranged in a direction crossing the direction in which the first guide is laid and a second moving frame moved along the second guide.

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