KR101643296B1 - Method for manufacturing touch screen panel - Google Patents

Abstract

A method of manufacturing a touch screen panel includes forming a transparent electrode layer on a top surface and a bottom surface of a substrate and a metal layer for forming an outer electrode wiring electrically connected to the transparent electrode layer Forming a transparent electrode pattern, an upper outer electrode wiring, a lower outer electrode wiring, and an upper dummy electrode wiring by performing a photoresist process on the upper and lower surfaces of the substrate, A step of attaching a protective film to the upper and lower surfaces of the substrate so as to expose a portion of the lower surface of the substrate where the lower outer electrode wirings are formed and a step of performing a plating process so that both ends of the lower outer electrode wiring and the upper dummy electrode wiring are both Forming a through hole, forming upper dummy electrode wiring and lower outer electrode wiring, Performing an electroless plating process on the upper surface portion of the substrate exposed by the protective film and the lower surface portion of the substrate and the side surface of the substrate so as to connect the upper dummy electrode wiring and the lower outer electrode wiring to each other, And bonding the flexible printed circuit board to the upper surface of the substrate so as to contact the upper outer electrode wiring and the upper dummy electrode wiring, wherein the thickness of the touch screen panel is minimized, the alignment accuracy is increased, Productivity can be improved by automating equipment process.

Description

METHOD FOR MANUFACTURING TOUCH SCREEN PANEL [0002]

The present invention relates to a method of manufacturing a touch screen panel, and more particularly, to a method of connecting a flexible printed circuit board (FPCB) to a substrate.

Recently, touch screen panels have been widely used, which provide a convenient input and an intuitive user interface (UI) as mobile phone specifications are advanced and functions close to a PC are required. The touch display module to which such a touch screen panel is applied is generally composed of element parts such as a display panel (TFT-LCD, OLED, etc.), a touch screen panel, and a cover glass.

One of the components that occupies the largest volume and weight in a mobile terminal such as a mobile phone is the touch display module, and the touch display module has a decisive influence on the shape and the weight of the terminal. For this reason, in order to make the mobile terminal slimmer, the slimness of the touch display module is actively progressing.

The touch screen panel according to the related art will be described in more detail. The touch screen panel includes a transparent electrode pattern for touch recognition, a wiring for transmitting a signal generated from the transparent electrode pattern to a control unit, And a flexible printed circuit board (FPCB) on which an IC chip or the like is mounted.

Reference is made to FIGS. 1A to 1D to describe the structure of a conventional touch screen panel for explaining a concrete connection structure of a flexible printed circuit board and wiring.

1A to 1D are views illustrating a conventional method of manufacturing a touch screen panel. FIGS. 1A and 1B are a plan view and a side view for explaining the state of the touch screen panel before the flexible printed circuit board 170 is adhered. FIGS. 1C and 1D illustrate a state of the touch screen panel after adhering the flexible printed circuit board 170, And a plan view and a side view for explaining the state of the panel. In Figs. 1A to 1D, only the edge portion of the substrate 110 is shown for convenience of explanation.

In a conventional touch screen panel, a wiring for transmitting a signal from a transparent electrode pattern (not shown) disposed in a touch sensing area located at a central portion of the substrate 110 is formed on the upper and lower sides of the substrate 110, May be disposed on the top and bottom of the substrate 110 according to the arrangement. Specifically, the upper outer electrode wiring line 120 is disposed on the substrate 110, and the lower outer electrode wiring line 130 is disposed on the lower side of the substrate 110. When the upper outer electrode wire 120 and the lower outer electrode wire 130 are disposed as described above, the flexible printed circuit board 170 must contact both the upper outer electrode wire 120 and the lower outer electrode wire 130 , And both sides of the substrate 110.

However, in the process of bonding the flexible printed circuit board 170 to the upper surface and the lower surface of the substrate 110, it is difficult to align the flexible printed circuit board 170 with the upper and lower outer electrode wires 120 and 130 The touch screen panel can not perform its function in case of an alignment defect. Further, as the flexible printed circuit board 170 is disposed on both the upper and lower surfaces of the substrate 110, there arises a problem that the thickness of the touch screen panel increases. In order to solve the problems of the related art as described above, a touch screen panel of the type shown in FIG. 1E has also been proposed.

1E is a cross-sectional view of a conventional touch screen panel.

1E, an upper dummy electrode wiring 121 is formed on the upper surface of the substrate 111, and a lower outer electrode wiring 131 is formed on the lower surface of the substrate 111. In the conventional touch screen panel, a contact hole is formed in the substrate 111 to connect the upper dummy electrode wiring 121 and the lower outer electrode wiring 131, and a conductive connection part 150 is used to connect the upper dummy electrode wiring 121, (121) and the lower outer electrode wiring (131). After the lower outer electrode wiring 131 and the upper dummy electrode wiring 121 are electrically connected in this manner, the flexible printed circuit board 171 is bonded only on the upper surface of the substrate 111. However, in such a conventional touch screen panel, there is a possibility that a crack due to a temperature change and / or an external impact may occur in the process of depositing the connection part 150 in the contact hole. In the process of depositing the connection part 150, If all are not filled, the upper dummy electrode wiring 121 and the lower outer electrode wiring 131 are not electrically connected and the production efficiency is not high.

Accordingly, there is an effort to improve the productivity of the touch screen panel while reducing the thickness of the touch screen panel.

Korean Patent Publication No. 10-2010-0095989 "Method of manufacturing capacitive touch screen panel" (2010.09.01)

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of manufacturing a touch screen panel in which a two-sided adhesive bonding process between a substrate and a flexible printed circuit board can be changed to a bonding process.

Another problem to be solved by the present invention is to provide a method of manufacturing a touch screen panel in which accuracy of alignment is increased and productivity is improved through automation of a bonding facility process.

A further object of the present invention is to provide a method of manufacturing a touch screen panel capable of manufacturing a slimmer touch screen panel.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a method of manufacturing a touch screen panel, including forming a metal layer for forming an outer electrode wiring electrically connected to a transparent electrode layer and a transparent electrode layer on a top surface and a bottom surface of a substrate, Forming a transparent electrode pattern, an upper outer electrode wiring, a lower outer electrode wiring, and an upper dummy electrode wiring by performing a photoresist process on the upper and lower surfaces of the substrate, A step of attaching a protective film to the upper and lower surfaces of the substrate so that a portion where the lower outer electrode wiring is formed is exposed, Performing an electroless plating process on the upper surface portion of the substrate and the lower surface portion of the substrate and the side surface of the substrate, Removing the plating portion except for a region where the dummy electrode wiring and the lower outer electrode wiring are electrically connected, and bonding the flexible printed circuit board to the upper surface of the substrate so as to contact the upper outer electrode wiring and the upper dummy electrode wiring.

According to another aspect of the present invention, there is provided a method of manufacturing a touch screen, including the step of forming a hole penetrating both the distal end of the lower outer electrode wire and the distal end of the upper dummy electrode wire before performing the electroless plating process .

The details of other embodiments are included in the detailed description and drawings.

The embodiments of the present invention have at least the following effects.

That is, it is possible to provide a method of manufacturing a touch screen panel capable of changing the two-sided adhesive process between the substrate and the flexible printed circuit board to the one-sided adhesive process.

Further, it is possible to provide a manufacturing method of a touch screen panel in which accuracy of alignment is increased and productivity is improved through automation of a bonding facility process.

It is also possible to provide a manufacturing method of a touch screen panel capable of manufacturing a slimmer touch screen panel.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

FIGS. 1A to 1D are views illustrating a conventional method of manufacturing a touch screen panel.
1E is a cross-sectional view of a conventional touch screen panel.
FIGS. 2A to 2D illustrate a method of manufacturing a touch screen panel according to an exemplary embodiment of the present invention. Referring to FIGS. 2A to 2D, a method of manufacturing a touch screen panel includes forming an upper outer electrode wire, And the like.
FIGS. 3A to 3D are views for explaining a method of manufacturing a touch screen panel according to an embodiment of the present invention, illustrating steps of performing an electroless plating process and removing a plating portion. FIG.
FIGS. 4A to 4D are views for explaining a method of manufacturing a touch screen panel according to an embodiment of the present invention.
FIGS. 5A and 5B are views for explaining a method of manufacturing a touch screen panel according to an embodiment of the present invention, and illustrating a step of bonding a flexible printed circuit board to an upper surface of a substrate.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

It is to be understood that elements or layers are referred to as being " on "other elements or layers, including both on or directly in between other layers or intervening layers of other elements. Like reference numerals refer to like elements throughout the specification.

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Hereinafter, a method of manufacturing a touch panel according to the present invention will be described with reference to the accompanying drawings.

FIGS. 2A to 2D illustrate a method of manufacturing a touch screen panel according to an exemplary embodiment of the present invention. Referring to FIGS. 2A to 2D, a method of manufacturing a touch screen panel includes forming an upper outer electrode wire, And the like. 2A is a plan view illustrating a method of manufacturing a touch screen panel according to an embodiment of the present invention, and FIG. 2B is a side view illustrating a method of manufacturing a touch screen panel according to an exemplary embodiment of the present invention . 2C is an enlarged view of the X region of FIG. 2A. FIG. 2D is a cross-sectional view illustrating a method of manufacturing a touch screen panel according to an exemplary embodiment of the present invention. Referring to FIG.

First, a transparent electrode film and a metal layer for forming an outer electrode wiring electrically connected to the transparent electrode film are formed on the upper and lower surfaces of the substrate.

2A to 2D, a metal layer for forming a transparent electrode film and an outer electrode wiring is formed, and then a photoresist process is performed on the upper and lower surfaces of the substrate 210 to form a transparent electrode pattern (not shown) An outer electrode wiring 220, a lower outer electrode wiring 230, and an upper dummy electrode wiring 240 are formed.

Although not shown in FIGS. 2A to 2D, the transparent electrode pattern is formed at a central portion of the substrate 210 to receive a touch input from a user and transmit a signal corresponding to the touch input to the upper outer electrode wiring 220 and the lower outer electrode To the electrode wiring 230.

The upper outer electrode wiring 220 is electrically connected to the transparent electrode pattern formed on the upper surface of the substrate 210 and the lower outer electrode wiring 120 is connected to the wiring 210 electrically connected to the transparent electrode pattern formed on the lower surface of the substrate 210. [ to be. The upper dummy electrode wiring 240 is formed on the upper surface of the substrate 210 so as to correspond to the position where the lower outer electrode wiring 230 is formed. The upper dummy electrode wiring 240 may be formed of the same material as the upper outer electrode wiring 220 at the same time.

Subsequently, the upper surface and the lower surface of the substrate 210 are protected so that a portion where the upper dummy electrode wiring 220 is formed and a portion of the lower surface of the substrate 210 where the lower outer electrode wiring 230 is formed are exposed, The film 280 is attached. By attaching the protective film 280 to the area of the substrate 210 as described above, the non-plating area can be protected during the electroless plating process described later.

The upper surface portion of the substrate 210 exposed by the protective film 280 and the lower surface portion of the substrate 210 are electrically connected to each other so that the upper dummy electrode wiring 240 and the lower outer electrode wiring 230, And an electroless plating process is performed on the side surface of the substrate 210.

The electroless plating process is a plating process that does not use electricity, and a reducing agent serving as an electricity is included in the plating solution, and the plating is more smooth than the electroplating. In the electroless plating process, the lower outer electrode wiring 130 and the upper dummy electrode wiring 140 are connected to each other so that a signal can pass therethrough. The plating solution used in the electroless plating process is CuSO4, HCHO, NaOH and other stabilizers or a combination of these materials. The thickness of the plating portion 360 is 2 占 퐉 or more.

FIGS. 3A to 3D are views for explaining a method of manufacturing a touch screen panel according to an embodiment of the present invention, and illustrate a step of performing an electroless plating process and a step of removing a plating part. 3A is a plan view for explaining a manufacturing method of a touch screen panel according to an embodiment of the present invention, and FIG. 3B is a side view for explaining a method of manufacturing a touch screen panel according to an embodiment of the present invention . FIG. 3C is an enlarged view of the Y area in FIG. 3A. 3D is a cross-sectional view illustrating a method of manufacturing a touch screen panel according to an embodiment of the present invention.

Referring to FIGS. 3A to 3D, plating portions except the region where the upper dummy electrode wiring 230 and the lower outer electrode wiring 240 are electrically connected to each other are removed. Thus, a plating unit 360 for connecting the upper dummy electrode wiring 230 and the lower outer electrode wiring 240, which correspond to each other, is formed. The thickness of the plating portion 360 is 2 占 퐉 or more.

FIGS. 4A to 4D are views for explaining a method of manufacturing a touch screen panel according to an embodiment of the present invention. 4A is a plan view illustrating a method of manufacturing a touch screen panel according to an embodiment of the present invention, and FIG. 4B is a side view illustrating a method of manufacturing a touch screen panel according to an exemplary embodiment of the present invention . 4C is an enlarged view of the Z area in Fig. 4A. Fig. 4D is a cross-sectional view illustrating a method of manufacturing a touch screen panel according to an exemplary embodiment of the present invention.

4A to 4D, in an embodiment of the present invention, before performing the above-described electroless plating process, both ends of the lower outer electrode wiring line 430 and the upper end portion of the upper dummy electrode wiring line 440 are passed through Holes may be formed.

A plating portion 460 for connecting the upper dummy electrode wiring 440 and the lower outer electrode wiring 430 to the region where the holes are formed is formed through electroless plating and the upper dummy electrode wiring 440 The electrical connection with the lower outer electrode wiring 430 can be further improved.

In some embodiments, the holes may be triangular, square, semicircular, etc., and may preferably be semicircular.

In some embodiments, if the diameter of the hole is 0.15 mm or more, a hole may be formed using a drill or a laser hole process, and if the diameter of the hole is less than 0.15 mm, a hole may be formed using a laser hole process.

FIGS. 5A and 5B are views for explaining a method of manufacturing a touch screen panel according to an embodiment of the present invention, and illustrating a step of bonding a flexible printed circuit board to an upper surface of a substrate. 5A is a plan view illustrating a method of manufacturing a touch screen panel according to an exemplary embodiment of the present invention, and FIG. 5B is a cross-sectional view illustrating a method of manufacturing a touch screen panel according to another exemplary embodiment of the present invention . 5A and 5B, it is assumed that additional steps are performed in the embodiment of Figs. 4A to 4D in which the holes are formed.

5A and 5B, the flexible printed circuit board 570 is bonded to the upper surface of the substrate 210 so as to be in contact with the upper outer electrode wiring 220 and the upper dummy electrode wiring 440.

In the method of manufacturing a touch screen according to an embodiment of the present invention, the upper dummy electrode wiring 440 and the lower outer electrode wiring 220 can be electrically connected to each other without any defects or productivity deterioration, The substrate 210 and the flexible printed circuit board 570 can be bonded only by a single bonding process through the upper surface of the substrate 210 differently from the manufacturing method.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

110, 210, 410: substrate
120, 220: upper outer electrode wiring
130, 131, 230, 430: Lower outer electrode wiring
121, 240, and 440: upper dummy electrode wiring
150:
360, 460: plated film
170, 171, 570: flexible printed circuit board
280, 480: protective film

Claims (3)

Forming a metal layer for forming an outer electrode wiring on the top and bottom surfaces of the substrate;
Performing a photoresist process to form an upper outer electrode wiring and an upper dummy electrode wiring on an upper surface of the substrate, and forming a lower outer electrode wiring on a lower surface of the substrate;
Attaching a protective film to the upper and lower surfaces of the substrate such that a portion of the upper surface of the substrate where the upper dummy electrode wiring is formed and a portion of the lower surface of the substrate where the lower outer electrode wiring is formed are exposed;
An electroless plating process is performed on the upper surface portion of the substrate and the lower surface portion of the substrate exposed by the protective film and the side surface of the substrate so that the upper dummy electrode wiring corresponding to each other and the lower outer electrode wiring are electrically connected to each other ;
Removing the plating portion except for a region where the upper dummy electrode wiring and the lower outer electrode wiring are electrically connected; And
And bonding the flexible printed circuit board to the upper surface of the substrate so as to contact the upper outer electrode wiring and the upper dummy electrode wiring. The method according to claim 1,
Further comprising the step of forming a hole penetrating both the end portion of the lower outer electrode wiring and the end portion of the upper dummy electrode wiring before performing the electroless plating process, . 3. The method of claim 2,
Wherein the hole is semicircular in shape.

Images