KR101558283B1 - Cluster equipment for treating substrate - Google Patents

Abstract

The present invention relates to a cluster facility for substrate processing. The cluster facility for processing a substrate according to an embodiment of the present invention includes a facility front end module having a plurality of load ports in which a cassette on which a substrate is loaded is located and a first substrate transfer robot for transferring the substrate; A plurality of load lock chambers connected via the gate valve to the plant front end module and having an internal pressure selectively switched between atmospheric pressure and vacuum pressure; A transfer chamber connected to the load lock chambers through a gate valve and having a second substrate transfer robot for transferring the substrate; Load lock chambers for the plurality of processing modules, which are connected via the gate valve to the transfer chamber and have a substrate loading unit in which the substrates are stacked; A plurality of process chambers disposed on top of the load lock chambers for the processing modules and processing the substrates loaded on the substrate loading unit; And controlling the operation of the cluster facility so that a process for processing the substrate is performed. When the processing of the substrate is completed, the dummy substrate is taken out from the process chamber to the vacuum maintained space, And controlling the transfer of the removed dummy substrate to the process chamber when the post-process is completed.

Description

[0001] CLUSTER EQUIPMENT FOR TREATING SUBSTRATE [0002]

The present invention relates to a substrate processing apparatus, a cluster facility for substrate processing, and a substrate processing method.

A batch type process that processes multiple wafers in a semiconductor process at the same time is more productive than a single type process that processes only one wafer at a time. When a batch type process is performed, when a part of a slot of a stacking unit on which a wafer is loaded is empty, the process is performed in a batch unit by filling the wafer with a dummy wafer.

Conventionally, when processing of a wafer in a process chamber is completed, the dummy wafer is taken out of the process chamber to a buffer for the dummy wafer, and then the process chamber is cleaned and then the dummy wafer is transferred into the process chamber. The cleaning operation was performed.

However, since the buffer stores the dummy wafer in a standby state, the process chamber or other wafers processed in the process chamber may be contaminated in the process of removing and reloading the dummy wafer. On the other hand, even if the cleaning operation is carried out while leaving the dummy wafer in the process chamber without being taken out to the buffer, the etching of the dummy wafer involved in the cleaning operation may cause particles to be blown into the process chamber and contaminate the chamber. Further, when the dummy wafer is etched during the cleaning operation, cracks may be generated in the dummy wafer, which may shorten the life span.

It is an object of the present invention to provide a substrate processing apparatus, a cluster facility for substrate processing, and a substrate processing method that prevent contamination of chambers and other wafers due to dummy wafers.

An object of the present invention is to provide a substrate processing apparatus, a cluster facility for substrate processing, and a substrate processing method that can prevent the dummy wafer from being damaged due to the cleaning process of the chamber, thereby increasing the life expectancy of the dummy wafer.

A substrate processing apparatus according to an embodiment of the present invention includes: a load port for receiving a cassette on which a substrate is loaded; A load lock chamber in which the internal pressure can be selectively switched between atmospheric pressure and vacuum pressure; A first substrate transfer robot for transferring the substrate between the load port and the load lock chamber; A process processing module having a process chamber for processing the substrate; A second substrate transfer robot for transferring the substrate between the load lock chamber and the process processing module; And controlling the operation of the substrate processing apparatus such that a process for processing the substrate is performed. When the processing of the substrate is completed, the dummy substrate is taken out of the process chamber to the vacuum maintained space, And a control unit for carrying out the process and controlling the carry-out dummy substrate to be brought into the process chamber when the post-process is completed.

The post-process may comprise a cleaning process.

Wherein the control unit is configured to: move the dummy substrate from the process chamber to the load lock chamber held at a vacuum pressure when the substrate processing is completed; and when the post-process is completed, remove the removed dummy substrate from the load lock chamber So as to be brought into the process chamber.

The load lock chamber may store the dummy substrate under vacuum during the post-process.

The substrate processing apparatus may further include a transfer chamber accommodating the second substrate transfer robot and capable of maintaining internal pressure at a vacuum pressure.

Wherein the controller transfers the dummy substrate to the transfer chamber after the second substrate transfer robot transfers the dummy substrate to the transfer chamber after the processing of the substrate is completed, And controls to carry the carried-out dummy substrate when the post-process is completed.

The control unit may control to transfer the processed substrate from the process chamber to the load port before the dummy substrate is unloaded.

The control unit may control to transfer the substrate to be newly processed from the load port to the process chamber after the dummy substrate is brought in.

The cluster facility for processing a substrate according to an embodiment of the present invention includes a facility front end module having a plurality of load ports on which a cassette on which a substrate is placed is placed and a first substrate transfer robot for transferring the substrate; A plurality of load lock chambers connected via the gate valve to the plant front end module and having an internal pressure selectively switched between atmospheric pressure and vacuum pressure; A transfer chamber connected to the load lock chambers through a gate valve and having a second substrate transfer robot for transferring the substrate; Load lock chambers for the plurality of processing modules, which are connected via the gate valve to the transfer chamber and have a substrate loading unit in which the substrates are stacked; A plurality of process chambers disposed on top of the load lock chambers for the processing modules and processing the substrates loaded on the substrate loading unit; And controlling the operation of the cluster facility so that a process for processing the substrate is performed. When the processing of the substrate is completed, the dummy substrate is taken out from the process chamber to the vacuum maintained space, And controlling the transfer of the dummy substrate to the process chamber when the post-process is completed.

The post-process may comprise a cleaning process.

Wherein the control unit is configured to: move the dummy substrate from the process chamber to a load lock chamber maintained at a vacuum pressure when processing of the substrate is completed; and when the post-process is completed, remove the dummy substrate from the load lock chamber And can be controlled to be brought into the process chamber.

The load lock chamber may store the dummy substrate under vacuum during the post-process.

Wherein the controller transfers the dummy substrate to the transfer chamber after the second substrate transfer robot transfers the dummy substrate to the transfer chamber after the processing of the substrate is completed, And controls to carry the carried-out dummy substrate when the post-process is completed.

The control unit may control to transfer the processed substrate from the process chamber to the load port before the dummy substrate is unloaded.

The control unit may control to transfer the substrate to be newly processed from the load port to the process chamber after the dummy substrate is brought in.

The control unit may control the dummy substrate to be taken out from the processed process chamber to a substrate loading unit of another process chamber which is empty when processing of the substrate in one process chamber is completed.

The control unit may control to transfer the removed dummy substrate from the substrate stacking unit to the post-process process chamber when the post-process is completed in the process chamber in which the process is completed.

The substrate processing method according to an embodiment of the present invention includes the steps of: after the processing of the substrate in the process chamber is completed, bringing the dummy substrate out of the process chamber into a vacuum maintained space; Performing a post-process on the process chamber; And, when the post-process is completed, bringing the carried dummy substrate into the process chamber.

The step of performing the post-process may include: cleaning the process chamber.

The step of removing the dummy substrate may include: transferring the dummy substrate from the process chamber to a load lock chamber maintained in a vacuum state.

The step of removing the dummy substrate includes: carrying the dummy substrate to a transfer chamber maintained in a vacuum state; And holding the transported dummy substrate in the transfer chamber by the substrate transfer robot.

The substrate processing method may further include transferring the processed substrate from the process chamber to the load port before the dummy substrate is taken out.

The substrate processing method may further include transferring the substrate to be newly processed from the load port to the process chamber after the dummy substrate is transferred.

The step of removing the dummy substrate may include: moving the dummy substrate from the process chamber to a substrate stacking unit of another process chamber which is empty.

The step of bringing the unloaded dummy substrate into the process chamber may include bringing the unloaded dummy substrate from the substrate stacking unit into the process chamber in which the post-process is completed.

The substrate processing method according to the embodiment of the present invention may be implemented as a computer-executable program and recorded on a computer-readable recording medium.

According to the embodiment of the present invention, contamination of the chambers and other wafers due to dummy wafers can be prevented, and the yield of products can be improved.

According to the embodiment of the present invention, it is possible to prevent the dummy wafer from being damaged due to the cleaning process and to extend the life expectancy of the dummy wafer.

According to the embodiment of the present invention, the process time can be shortened and the productivity can be improved as compared with the case where the dummy wafer is taken out to the buffer during the cleaning process of the chamber.

1 is a plan view showing a cluster facility for substrate processing according to an embodiment of the present invention.
2 is a side view of a cluster facility for substrate processing according to one embodiment of the present invention.
3 is a cross-sectional view illustrating a process chamber according to one embodiment of the present invention.
FIGS. 4 to 7 are views for explaining a post-process and a subsequent substrate carry-in and carry-out process according to an embodiment of the present invention.
FIG. 8 is a view for explaining a post-process and a subsequent substrate carry-in and carry-out process according to another embodiment of the present invention.
FIG. 9 is a view for explaining a post-process and a subsequent substrate carry-in and carry-out process according to another embodiment of the present invention.
10 is an exemplary flow chart for explaining a process of processing a substrate according to an embodiment of the present invention.
11 is an exemplary flowchart for explaining a substrate processing method according to an embodiment of the present invention.
12 is an exemplary flowchart for explaining a substrate processing method according to another embodiment of the present invention.
13 is an exemplary flowchart for explaining a substrate processing method according to another embodiment of the present invention.

Other advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

Unless defined otherwise, all terms (including technical or scientific terms) used herein have the same meaning as commonly accepted by the generic art in the prior art to which this invention belongs. Terms defined by generic dictionaries may be interpreted to have the same meaning as in the related art and / or in the text of this application, and may be conceptualized or overly formalized, even if not expressly defined herein I will not.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, the terms' comprise 'and / or various forms of use of the verb include, for example,' including, '' including, '' including, '' including, Steps, operations, and / or elements do not preclude the presence or addition of one or more other compositions, components, components, steps, operations, and / or components. The term 'and / or' as used herein refers to each of the listed configurations or various combinations thereof.

1 and 2 are a plan view and a side view, respectively, of a cluster facility for substrate processing according to an embodiment of the present invention.

1 and 2, a cluster facility 1 for substrate processing includes a facility front end module 900, a load lock chamber 200, a transfer chamber 300, and a process module 400.

An Equipment Front End Module (EFEM) 900 is disposed in front of the cluster facility 1. The facility front end module 900 is provided with a load port 910 through which the cassette C is loaded and unloaded and a first substrate transfer robot 930 through which the substrate is taken out from the cassette C, And an index chamber 920 for transferring the substrate between the transfer chamber C and the load lock chamber 200. Here, an ATM (Atmosphere) robot is used as the first substrate transfer robot 930.

The index chamber 920 is positioned between the load port 910 and the load lock chamber 200. The index chamber 920 has a rectangular parallelepiped shape including a front panel 922, a rear panel 924 and both side panels 926 and a first substrate transfer robot 930 for transferring the substrate is provided therein do. Although not shown, the index chamber 920 may include a controlled airflow system, such as vents, a laminar flow system, to prevent particulate contaminants from entering the interior space.

The index chamber 920 is opened and closed by a gate valve GV1 for passage of the wafer with the load lock chamber 200 to the rear panel 924 in contact with the load lock chamber 200. [

The load ports 910 are arranged in a line on the front panel 922 of the index chamber 920. The cassette C is loaded and unloaded to the load port 204. [ The cassette C may be a front open unified pod having a front opened body and a door opening and closing the front of the body.

A dummy substrate storage portion 940 is provided on both side panels 926 of the index chamber 920. The dummy substrate storage section 940 provides a dummy substrate storage container 942 in which the dummy substrate DW is stacked. The dummy substrate DW stored in the dummy substrate storage container 942 is used when the processing module 400 lacks a substrate.

Although not shown, the dummy substrate storage container 942 may be provided in a different chamber than the side of the index chamber. As an example, the dummy substrate storage container 942 may be installed in the transfer chamber 300.

The load lock chamber 200 is connected to the facility front end module 900 through the gate valve GV1. The load lock chamber 200 is disposed between the facility front end module 900 and the transfer chamber 300. Three load lock chambers 200 may be provided between the facility front end module 900 and the transfer chamber 300. The load lock chamber 200 is capable of selectively switching the internal space to atmospheric pressure and vacuum pressure. The load lock chamber 200 is provided with a loading container 210 on which a substrate is loaded.

The transfer chamber 300 is connected to the load lock chamber 200 through the gate valve GV2. The transfer chamber 300 is disposed between the load lock chamber 200 and the process processing module 400. The transfer chamber 300 has a box shape of a rectangular parallelepiped, and a second substrate transfer robot 330 for transferring the substrate is provided in the transfer chamber 300. The second substrate transfer robot 330 transfers the substrate between the load lock chamber 200 and the substrate stacking unit 130 provided in the load lock chamber 410 for the processing module of the process processing module 400. The second substrate transfer robot 330 may include an end effector capable of transporting one substrate or five substrates. Here, the second substrate transfer robot 330 uses a vacuum robot capable of transferring substrates in a vacuum environment.

A plurality of process modules 400 may be connected to the transfer chamber 300 through a gate valve GV3. For example, the three transfer modules 400 may be connected to the transfer chamber 300, but the number of the transfer modules is not limited thereto.

Referring to FIG. 2, the cluster facility 1 includes a vacuum exhaust unit 500 and a gas supply unit 600. The vacuum evacuation unit 500 is connected to each of the load lock chamber 200, the transfer chamber 300, the load lock chamber 410 for the processing module and the process chamber 100 to provide a vacuum line 510). The gas supply unit 600 includes a gas supply line 600 for supplying a gas to each chamber for forming a differential pressure between the load lock chamber 200, the transfer chamber 300, the load lock chamber 410 for the processing module, (610).

In addition, the index chamber 920 and the load lock chamber 200, the load lock chamber 200 and the transfer chamber 300, and the transfer chamber 300 and the load lock chamber 410 for the processing module are connected to the gate valves GV1, GV2, GV3), so that the respective chamber pressures can be independently controlled.

3 is a cross-sectional view showing a process chamber 100 according to an embodiment of the present invention.

Referring to Figures 1 to 3, the process processing module 400 includes a process chamber 100 and a load lock chamber 410 for a process module.

The load lock chamber 410 for the processing module is connected to the transfer chamber 300 via the gate valve GV3. The load lock chamber 410 for the processing module includes an elevating member 430 for loading / unloading the substrate stacking unit 130 in which the substrates are stacked in a batch, into the inner space of the process tube 110 of the process chamber 100, Is provided. As an example, the substrate loading unit 130 may include a boat with slots to allow loading of 25, 50 sheets of substrates. A process chamber 100 is disposed above the load lock chamber 410 for the processing module.

The process chamber 100 may include an apparatus for processing a substrate. In one example, the process chamber 100 includes a process tube 110, a heater assembly 120, a substrate loading unit 130, a side nozzle unit 140, a boat rotation unit 160, a control unit 170, . ≪ / RTI >

The process tube 110 includes an inner tube 112 in which the substrate stacking unit 130 is accommodated and an outer tube 114 surrounding the inner tube 112. The process tube 110 is loaded with the substrate stacking unit 130 on which the substrate is loaded to provide an internal space in which processing is performed on the substrate. The process tube 110 may be made of a material that can withstand high temperatures, such as quartz. The inner tube 112 and the outer tube 114 are formed in the shape of a circular tube with the upper portion closed. In particular, the inner tube 112 has a cutout 113 formed along one side thereof in the longitudinal direction (vertical direction). The cutout 113 is provided in the form of a slot. The cutout 113 is formed in a straight line with the planar nozzle 142.

The incision 113 may be provided in a shape of an inverted triangle having a wider width from the lower end to an upper end and a triangular shape having a narrower width from the lower end to the upper end. In addition, the cutout 113 may be provided in the form of a separate hole facing the spray hole of the planar nozzle 142. In addition, the cutouts 113 may be provided with the same width from the upper end to the lower end.

Referring again to FIGS. 1 to 3, the process tube 110 includes an exhaust port 119 for forcedly sucking and exhausting the inside air to reduce the pressure inside the flange 118, A nozzle port 118 for mounting a side nozzle portion 140 for injecting a process gas into the process tube 110 is provided. The exhaust port 119 is provided for discharging the air in the process tube 110 to the outside in the process. A vacuum exhaust device (not shown) is connected to the exhaust port 119, and the process gas supplied to the process tube 110 through the exhaust port 119 is exhausted and the internal pressure is reduced. The heater assembly 120 is installed to surround the process tube 110.

The substrate loading unit 130 may have slots into which a plurality of (for example, 50) substrates are inserted. The substrate stacking unit 130 is mounted on the seal cap 180 and the seal cap 180 is loaded into the process tube 110 by an elevator member 430 which is an elevator device or unloaded out of the process tube 110 do. When the substrate loading unit 130 is loaded into the process tube 110, the seal cap 180 engages the flange 111 of the process tube 110. On the other hand, a sealing member such as an O-ring for sealing is provided at a portion where the flange 111 of the process tube 110 and the seal cap 180 are in contact with each other, 110 and the seal cap 180. As shown in FIG.

On the other hand, the boat rotation unit 160 provides a rotational force for rotating the substrate loading unit 130. The boat rotation unit 160 may be a motor. The boat rotation part 160 is installed on the seal cap 180. The boat rotation unit 160 may be provided with a sensor for sensing the rotational speed of the substrate loading unit 130. The rotational speed of the substrate loading unit 130 sensed by the sensor may be provided to the controller 170. [

The control unit 170 controls the operation of the boat rotation unit 160. The control unit 170 controls the rotation speed of the boat rotation unit 160 according to the time of supplying the gas supplied through the nozzles of the side nozzle unit 140. In addition, the controller 170 may control the operation of the cluster facility 1 described above so that a process for processing the substrate is performed.

According to the embodiment of the present invention, when the processing of the substrate in the process chamber 100 is completed, the dummy substrate DW is taken out from the process chamber 100 to a vacuum space maintained in a vacuum state, A process may be performed for the process chamber 100. [ Then, when the post-process is completed, the transferred dummy substrate DW can be carried into the process chamber 100 again.

FIGS. 4 to 7 are views for explaining a post-process and a subsequent substrate carry-in and carry-out process according to an embodiment of the present invention.

As described above, the process module 400 includes a process chamber 100 in which a substrate processing process is performed, and the process chamber 100 can accommodate a plurality of substrates to perform a process in a batch mode . 3, the substrate accommodated in the process chamber 100 includes not only a substrate PW produced as a product through a processing process, but also a dummy substrate DW for filling vacant slots of the substrate stacking unit 130, . ≪ / RTI >

According to an embodiment of the present invention, when the substrate processing process in the process chamber 100 is completed, the processed substrate PW can be transferred from the process chamber 100 to the load port 910.

4, the processed PW may be first transferred from the process chamber 100 to the load lock chamber 200 (FIG. 4 (i)). The process of transferring the substrate PW to the load lock chamber 200 may be performed by the second substrate transfer robot 330.

Then, the substrate PW transferred to the load lock chamber 200 can be transferred to the load port 910 ((ii) of FIG. 4). The process of transferring the substrate PW to the load port 910 may be performed by the first substrate transfer robot 930.

Then, the dummy substrate DW can be taken out of the process chamber 100 to a space where vacuum pressure is maintained.

5, according to an embodiment of the present invention, the dummy substrate DW can be taken out of the process chamber 100 to the load lock chamber 200 maintained at the vacuum pressure (see FIG. 5 (iii). In other words, in this embodiment, the vacuum space in which the dummy substrate DW is taken out is the load lock chamber 200.

In this embodiment, the dummy substrate DW can be taken out to a load lock chamber different from the load lock chamber in which the processed PW is transferred.

4 and 5, in the case where there are a plurality of load lock chambers 200, the processed PWs are placed in any one of the plurality of load lock chambers 200 (for example, as shown in FIG. 4 To the left load lock chamber), and the dummy substrate DW can be taken out to the other (for example, the intermediate load lock chamber in Fig. 5). However, the substrate PW and the dummy substrate DW on which the processing has been completed may be transferred to the same load lock chamber. In particular, in the case where only one load lock chamber is provided, the substrate PW and the dummy substrate DW, And transferred to the lock chamber.

After the dummy substrate DW is transferred from the process chamber 100 to the vacuum chamber, the post-process is performed on the process chamber 100. According to one embodiment, the post-process may include, but is not limited to, a cleaning process.

Then, when the post-process is completed, the carried dummy substrate DW is carried into the process chamber 100 again. For example, as shown in FIG. 6, the dummy substrate DW taken out of the load lock chamber 200 can be reintroduced into the process chamber 100 after completion of the post-process.

After the dummy substrate DW is loaded, the substrate PW to be newly processed can be transferred from the load port 910 to the process chamber 100. [ 7, a new substrate PW loaded on the load port 910 is transferred to the load lock chamber 200 (FIG. 7 (v)) and transferred from the load lock chamber 200 to the process chamber 100 (Fig. 7 (vi)).

6 and 7, the substrate PW to be newly processed is transferred to a load lock chamber (for example, a load lock chamber in FIG. 6) different from the load lock chamber in which the dummy substrate DW is taken out 7 to the left load lock chamber), but may be transferred to the same load lock chamber without limitation thereto.

As described above, after the substrate processing process is completed, the dummy substrate DW is not transferred to a buffer (for example, dummy substrate storage unit 940) for storing the dummy substrate or left in the process chamber 100, The post-treatment process can be carried out after being taken out to the vacuum space maintained in the state, for example, the load lock chamber 200.

According to another embodiment of the present invention, the dummy substrate DW may be held by the second substrate transfer robot 330 during the post-process being carried out to the transfer chamber 300. In other words, in this embodiment, the vacuum space in which the dummy substrate DW is taken out is the transfer chamber 300, not the load lock chamber 200.

8, the dummy substrate DW is transferred to the transfer chamber 300 by the second substrate transfer robot 330 after completion of the substrate processing process ((iii) of FIG. 8) , And may be held by the second substrate transfer robot 330 in the transfer chamber 300 held at vacuum pressure during the post-process. Then, when the post-process is completed, the dummy substrate DW can be brought back into the process chamber 100 (FIG. 8 (iv)).

According to another embodiment of the present invention, the dummy substrate DW may be transferred to an empty process chamber among the plurality of process chambers. In other words, in this embodiment, the vacuum space from which the dummy substrate DW is taken out is the process chamber 100 other than the load lock chamber 200 or the transfer chamber 300.

For example, as shown in FIG. 9, when the cluster facility 1 includes a plurality of process processing modules 400, the substrate processing process in one process chamber (for example, the left process chamber in FIG. 9) The dummy substrate DW can be taken out of the process chamber from which the process has been completed to the substrate stacking unit 130 in another process chamber which is empty (for example, an intermediate process chamber in FIG. 9) iii)). Then, when the post-process is completed, the dummy substrate DW can be transferred again from the substrate stacking unit 130 to the post-process process chamber (for example, the left process chamber in FIG. 9) 9 (iv)).

The transfer of the processed substrate PW to the load lock chamber 300 (FIG. 4 (i)), the transfer of the processed substrate PW to the load port 910 (FIG. 4 (ii) The transfer of the substrate DW to the vacuum chamber (Figs. 5, 8, and 9 (iii)), the transfer of the dummy substrate DW to the process chamber 100 (Figs. 6, 8, (Fig. 7 (v)) of the substrate PW to be newly processed and the transfer to the process chamber 100 of the substrate PW to be newly processed ) May be performed sequentially, but the process order is not limited thereto.

For example, the dummy substrate DW may be first taken out to the vacuum space, and the transfer of the processed PW may be performed. Further, after the substrate PW to be newly processed is transferred to the process chamber 100, the dummy substrate DW may be transferred into the process chamber 100. [

4 (ii)) and the transfer of the dummy substrate DW to the vacuum space (the transfer of the processed substrate PW to the load port 910 (see (iii) in FIGS. 5, 8 and 9 ) May be performed simultaneously. 6, 8 and 9 (iv)) and the transfer of the substrate PW to be newly processed to the load lock chamber 200 (Fig. 7 (V) of FIG.

The process of removing and loading the dummy substrate DW has been described on the basis of the cluster facility 1 having a plurality of load ports 910, a load lock chamber 200, a process module 400, The dummy substrate DW loading and unloading process according to the embodiment of the present invention can also be applied to a substrate processing apparatus having only one load port, a load lock chamber, and a process module.

10 is an exemplary flow chart for explaining a process of processing a substrate according to an embodiment of the present invention.

10, a substrate processing method 700 according to an embodiment of the present invention is a method for processing a substrate from a process chamber 100 to a vacuum chamber (Step S710), a step S720 of performing a post-process on the process chamber 100 (S720), and a step of transferring the removed dummy substrate DW to the process chamber 100 (S730). ≪ / RTI >

The substrate processing method 700 may be performed in the cluster facility 1 according to the embodiment of the present invention described above. The controller 170 may generate and transmit a control signal at a predetermined timing to each part constituting the cluster facility so that the cluster facility 1 can operate according to the substrate processing method 700. [

Figure 11 is an exemplary flow chart for illustrating a substrate processing method 700 in accordance with an embodiment of the present invention.

11, the substrate processing method 700 includes the steps of transferring a processed substrate PW from the process chamber 100 to the load port 910 before the dummy substrate DW is taken out S701). The substrate processing method 700 further includes a step S740 of transferring the substrate PW to be newly processed from the load port 910 to the process chamber 100 after the dummy substrate DW is loaded . However, the transport of the processed substrate PW, the removal and transport of the dummy substrate DW, and the transport of the substrate PW to be newly processed are not limited to the order shown in Fig.

11, the dummy substrate DW is transferred to the vacuum chamber S710. The dummy substrate DW is transferred from the process chamber 100 to the load lock chamber 200 maintained at the vacuum pressure, As shown in FIG. In other words, in this embodiment, the vacuum space from which the dummy substrate DW is taken out is the load lock chamber.

12 is an exemplary flow chart for illustrating a substrate processing method 700 according to another embodiment of the present invention.

12, the step of transferring the dummy substrate DW to the vacuum space S710 includes the step of transferring the dummy substrate DW to the transfer chamber 300 in which the vacuum pressure is maintained (S712), and And the step (S713) of holding the dummy substrate DW in the transfer chamber 300 by the second substrate transfer robot 330. In other words, in this embodiment, the vacuum space in which the dummy substrate DW is taken out is the transfer chamber, and the dummy substrate DW can be held by the substrate transfer robot in the transfer chamber during the post-process.

13 is an exemplary flow chart for illustrating a substrate processing method 700 in accordance with another embodiment of the present invention.

Referring to FIG. 13, in step S710, the dummy substrate DW is transferred to a vacuum space. When a plurality of process chambers 100 are provided, and there is an empty idle process chamber therebetween (S714) (Step S715) of carrying out the dummy substrate DW from the process chamber in which the process has been completed to the substrate stacking unit 130 in another process chamber which is empty. In other words, in this embodiment, the vacuum space from which the dummy substrate DW is taken out is the substrate loading unit of the empty process chamber among the plurality of process chambers.

The step of transferring the dummy substrate DW to and from the process chamber 100 may be performed by transferring the dummy substrate DW from the substrate stacking unit 130 to the post- .

According to one embodiment, the step S720 of performing the post-process may include cleaning the process chamber 100, but the post-process is not limited thereto.

The recipe for performing the above-described substrate processing method 700 may be stored in a computer-readable recording medium that is manufactured as a program to be executed in a computer. The computer-readable recording medium includes all kinds of storage devices in which data that can be read by a computer system is stored. Examples of the computer-readable recording medium include ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage, and the like. The control unit 170 may transmit a control signal to each part of the cluster facility 1 to invoke and execute the program stored in the recording medium and perform the substrate processing method 700 according to the recipe.

The substrate processing apparatus, the cluster facility for substrate processing, and the substrate processing method for avoiding and storing the dummy substrate from the process chamber to the vacuum space after the completion of the process after the completion of the process process have been described.

According to the embodiment of the present invention described above, it is possible to prevent the dummy wafer from being exposed to the atmosphere or remaining in the chamber in the post-process to contaminate the chamber and other substrates. In addition, it is possible to prevent the dummy wafer from being damaged due to the post-process, thereby increasing the expected lifetime of the dummy wafer. Furthermore, the embodiment of the present invention can reduce the time taken to move the dummy wafer, thereby shortening the processing time and improving the productivity, as compared with a system in which the dummy wafer is taken out and carried into the buffer in the post-processing.

1: Cluster facility
100: Process chamber
200: load lock chamber
300: transfer chamber
330: second substrate transfer robot
400: process processing module
910: Load port
930: first substrate transfer robot
DW: dummy substrate

Claims (9)

CLAIMS What is claimed is: 1. A cluster facility for processing substrates,
An apparatus front end module having a plurality of load ports on which a cassette loaded with a substrate is placed, and a first substrate transfer robot for transferring the substrate;
A plurality of load lock chambers connected via the gate valve to the plant front end module and having an internal pressure selectively switched between atmospheric pressure and vacuum pressure;
A transfer chamber connected to the load lock chambers through a gate valve and having a second substrate transfer robot for transferring the substrate;
Load lock chambers for the plurality of processing modules, which are connected via the gate valve to the transfer chamber and have a substrate loading unit in which the substrates are stacked;
A plurality of process chambers disposed on top of the load lock chambers for the processing modules and processing the substrates loaded on the substrate loading unit; And
And controlling the operation of the cluster facility so that a process for processing the substrate is performed. When the processing of the substrate is completed, the dummy substrate is taken out of the process chamber into a space maintained at a vacuum pressure, And controlling the transfer of the dummy substrate to the process chamber when the post-process is completed;
The control unit includes:
The dummy substrate is taken out from the process chamber to a load lock chamber maintained at a vacuum pressure when the substrate processing is completed, and when the post-process is completed, the taken out dummy substrate is transferred from the load lock chamber to the process chamber Cluster facility. The method according to claim 1,
Wherein the post-process comprises a cleaning process. delete CLAIMS What is claimed is: 1. A cluster facility for processing substrates,
An apparatus front end module having a plurality of load ports on which a cassette loaded with a substrate is placed, and a first substrate transfer robot for transferring the substrate;
A plurality of load lock chambers connected via the gate valve to the plant front end module and having an internal pressure selectively switched between atmospheric pressure and vacuum pressure;
A transfer chamber connected to the load lock chambers through a gate valve and having a second substrate transfer robot for transferring the substrate;
Load lock chambers for the plurality of processing modules, which are connected via the gate valve to the transfer chamber and have a substrate loading unit in which the substrates are stacked;
A plurality of process chambers disposed on top of the load lock chambers for the processing modules and processing the substrates loaded on the substrate loading unit; And
And controlling the operation of the cluster facility so that a process for processing the substrate is performed. When the processing of the substrate is completed, the dummy substrate is taken out of the process chamber into a space maintained at a vacuum pressure, And controlling the transfer of the dummy substrate to the process chamber when the post-process is completed;
Wherein the load lock chamber stores the dummy substrate under vacuum during the post-process. CLAIMS What is claimed is: 1. A cluster facility for processing substrates,
An apparatus front end module having a plurality of load ports on which a cassette loaded with a substrate is placed, and a first substrate transfer robot for transferring the substrate;
A plurality of load lock chambers connected via the gate valve to the plant front end module and having an internal pressure selectively switched between atmospheric pressure and vacuum pressure;
A transfer chamber connected to the load lock chambers through a gate valve and having a second substrate transfer robot for transferring the substrate;
Load lock chambers for the plurality of processing modules, which are connected via the gate valve to the transfer chamber and have a substrate loading unit in which the substrates are stacked;
A plurality of process chambers disposed on top of the load lock chambers for the processing modules and processing the substrates loaded on the substrate loading unit; And
And controlling the operation of the cluster facility so that a process for processing the substrate is performed. When the processing of the substrate is completed, the dummy substrate is taken out of the process chamber into a space maintained at a vacuum pressure, And controlling the transfer of the dummy substrate to the process chamber when the post-process is completed;
The control unit includes:
The second substrate transfer robot transfers the dummy substrate to the transfer chamber and then transfers the transferred dummy substrate in the transfer chamber held in the vacuum pressure during the post- And when the post-process is completed, controls to carry out the carried-out dummy substrate. The method according to claim 1,
The control unit includes:
And transferring the processed substrate from the process chamber to the load port before transferring the dummy substrate. The method according to claim 1,
The control unit includes:
And after transfer of the dummy substrate, a substrate to be newly processed is transferred from the load port to the process chamber. CLAIMS What is claimed is: 1. A cluster facility for processing substrates,
An apparatus front end module having a plurality of load ports on which a cassette loaded with a substrate is placed, and a first substrate transfer robot for transferring the substrate;
A plurality of load lock chambers connected via the gate valve to the plant front end module and having an internal pressure selectively switched between atmospheric pressure and vacuum pressure;
A transfer chamber connected to the load lock chambers through a gate valve and having a second substrate transfer robot for transferring the substrate;
Load lock chambers for the plurality of processing modules, which are connected via the gate valve to the transfer chamber and have a substrate loading unit in which the substrates are stacked;
A plurality of process chambers disposed on top of the load lock chambers for the processing modules and processing the substrates loaded on the substrate loading unit; And
And controlling the operation of the cluster facility so that a process for processing the substrate is performed. When the processing of the substrate is completed, the dummy substrate is taken out of the process chamber into a space maintained at a vacuum pressure, And controlling the transfer of the dummy substrate to the process chamber when the post-process is completed;
The control unit includes:
And when the processing of the substrate in one process chamber is completed, transfers the dummy substrate from the processed process chamber to a substrate loading unit of another process chamber which is empty. 9. The method of claim 8,
The control unit includes:
And when the post-process is completed in the process chamber in which the process has been completed, controls to bring the carried-out dummy substrate from the substrate stacking unit to the post-process process chamber.

Images