KR101543843B1 - Apparatus for bonding a die on a substrate - Google Patents

Abstract

A die bonding apparatus includes an indexer for transferring a substrate and providing a bonding area, a stage disposed adjacent to the indexer for supporting a wafer divided into a plurality of die, a stage moving between the stage and the indexer, An imaging unit for imaging a lower portion of the die picked up by the bonding head and disposed so as to be away from the conveying path of the bonding head while facing the side of the indexer; And a reflection part for transmitting an image of the die picked up to the bonding head to the image pickup part.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a die bonding apparatus,

Embodiments of the present invention relate to a die bonding apparatus. And more particularly, to a die bonding apparatus for picking up a die attached to a dicing tape and bonding the die to a substrate.

Generally, in the die bonding process, a pick-up unit that picks up and transports the dies from a wafer to bond individualized dies to the substrate through a sawing process can be used. The pick-up unit may include a pick-up body to which the collet is coupled and a pick-up body to which the pick-up head is mounted, the collet for picking up the die using the vacuum. The pick-up unit may be mounted so as to be resiliently supported in a direction perpendicular to the die transferring portion for transferring the die.

And the pick-up unit picks up the die and directly bonds the substrate to the substrate. In the direct bonding method, a vision process for recognizing the position of the die in a state in which the pick-up unit picks up the die may be required in order to secure more improved positional accuracy. A camera may be added to perform the vision process. As the camera is fixed between the wafer stage and the indexer, the moving path of the pick-up unit moving from the pick-up position to the bonding position via the vision position becomes longer, which may lead to a problem that the bonding efficiency deteriorates.

It is an object of the present invention to provide a die bonding apparatus capable of ensuring improved positional accuracy and bonding efficiency.

According to an aspect of the present invention, there is provided a die bonding apparatus comprising: an indexer for transferring a substrate and providing a bonding area; a stage disposed adjacent to the indexer for supporting a wafer divided into a plurality of dies; A bonding head which moves between the stage and the indexer and which picks up a die from the stage and bonds the substrate to the substrate in the bonding area, the bonding head being disposed so as to face the side of the indexer and away from the conveying path of the bonding head, An imaging section for imaging a lower portion of the die picked up at the head and a reflection section disposed at a side of the indexer and for transmitting an image of the die picked up to the bonding head to the imaging section. Here, the reflective portion may have an inclined exposure surface with respect to the wafer, and the exposed surface may be parallel to the conveyance path of the bonding head. In addition, the reflective portion may include a mirror or a prism structure.

In an embodiment of the present invention, the indexer includes first and second guide rails extending in parallel to each other, and one of the first and second guide rails adjacent to the imaging portion has an inclined side surface . Here, the reflective portion may have a plate shape fixed to the inclined side surface.

According to the embodiments of the present invention as described above, the imaging section is disposed so as to face the side of the indexer and away from the conveyance path of the bonding head, and the lower part of the die picked up in the bonding head is imaged through the reflection section, It is possible not only to secure an improved positional accuracy by acquiring an image but also to shorten the moving path of the bonding head to secure bonding efficiency.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a block diagram illustrating a die bonding apparatus according to an embodiment of the present invention; FIG.
Fig. 2 is a schematic diagram for explaining the stage, the bonding head and the indexer shown in Fig. 1; Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

1 illustrates a die bonding apparatus according to an embodiment of the present invention may be used to bond a plurality of dies 20 onto a substrate 50 such as a lead frame or a printed circuit board. Further, the wafer 10 may be provided in a state of being divided into a plurality of dies 20 through a dicing process. Particularly, the wafer 10 can be attached to the dicing tape 30 in a completely cut or half-cut state in the dicing step, and the dicing tape 30 can be attached to the mounting frame 40 in the form of a circular ring Can be mounted.

The die bonding apparatus 100 includes an indexer 110 for transferring a substrate and providing a bonding region, a stage 120 for supporting a wafer, a bonding head 130, an imaging section 140, and a reflection section 145 do.

The indexer 110 may include first and second transfer rails 111 and 112 and a gripper 114 for gripping the substrate. The first and second transfer rails 111 and 112 extend parallel to each other in the first direction. The distance between the first and second transfer rails 111 and 112 may be adjustable according to the width of the substrate 50. The indexer 110 may further include a gripper transfer unit (not shown) that moves the gripper along the first and second transfer rails 111 and 112.

On both sides of the indexer 110, a loader 192 in which a first magazine 190 housing the substrates 50 to be subjected to a die bonding process is disposed and substrates 50 on which the die bonding process is completed are housed An unloader 197 may be provided in which the second magazine 195 is disposed.

That is, the indexer may be used to transfer the substrate 50 from the first magazine 190 to the second magazine 195 via the bonding area 117.

Although not shown, the die bonding apparatus 100 may include a load port for supporting the cassette 60 in which the wafers 10 are housed, and the wafer 10 may be transferred through a separate wafer transfer mechanism And may be moved onto the stage 120.

A clamp 122 for holding the mounting frame 40 may be provided on the stage 120. The dicing tape 30 may be mounted on the stage 120 by an extension ring 124 provided on the stage 120 Can be supported. In particular, the extension ring 124 can support the edge portion of the dicing tape 30, and the clamp 122 can support the mounting frame 40 downward .

Although not shown in detail, the stage 120 may be provided with a clamp driving unit (not shown) for moving the clamp 122 in the vertical direction, and by the extension of the dicing tape 30, The gap between the first and second electrodes 20 can be sufficiently secured.

A lower portion of the stage 120 may be provided with a die ejector 126 for selectively lifting the dies 20 to separate the dies 20 from the dicing tape 30, The die 20 lifted by the die ejector 126 can be picked up by the bonding head 130 and then transported. The stage 120 may have an opening for lifting and lowering the die ejector 126.

The bonding head 130 is movably provided between the stage 120 and the indexer 110. The bonding head 130 picks up a die separated from the dicing tape 30 to move the die to the bonding area and then bonds the die to the substrate in the bonding area.

Although not shown in detail, the bonding head 130 may include a die picker for picking up the die 20 by a vacuum suction method, and a linear driver for moving the die picker. As an example, the bonding head 130 may move the picked-up die 20 in the vertical and horizontal directions by a driving unit in the form of a rectangular coordinate robot. Further, the bonding head 130 may further include a rotation driving unit for providing a rotational force for rotating.

The imaging unit 140 is disposed to face the side of the indexer 111. That is, the image sensing unit 140 is disposed to face the side of the first conveyance rail 111. The imaging unit 140 is disposed to be away from the conveying path of the bonding head 130. Therefore, the imaging unit 140 is disposed so as not to interfere with the conveyance path of the bonding head 130. Therefore, the conveyance path of the bonding head 130 due to the additional arrangement of the imaging unit 140 is suppressed.

 The imaging unit 140 captures an image of the lower surface of the die 20 picked up by the bonding head 130 to obtain an image of the die 20. Thus, alignment or visual inspection of the die 20 can be performed using the acquired image. Thus, the bonding head 130 may be configured to be rotatable and configured to be movable in the vertical and horizontal directions for transport of the die 20.

The image sensing unit 140 may include, for example, a CCD camera. In this case, the lens of the imaging unit 140 may be disposed to face the side of the indexer 110.

The reflector 145 is disposed on the side of the indexer 110. The reflection unit 145 transmits the image of the die 20 picked up to the bonding head 130 to the image sensing unit 140. Thus, the imaging portion disposed to face the side of the indexer can obtain an image for the picked-up die via the reflector. Examples of the reflective portion may include a mirror or a prism structure.

In one embodiment of the present invention, the reflective portion 145 has an exposed surface tilted with respect to the wafer. The exposed surface of the reflective portion 145 may be partially parallel to the transport path of the bonding head 130. For example, the exposed surface of the reflective portion 145 and the transport path for transporting the die 20 toward the bonding region 117 after the bonding head 130 picks up the die 20 is parallel The imaging unit 140 can more easily acquire an image of the die 20.

In an embodiment of the present invention, the first guide rail 111 facing the image sensing unit 140 has a slanted side surface. As the reflective portion 145 is attached to the inclined side surface, the reflective portion 145 may have an exposed surface tilted with respect to the wafer 10.

The bonding head 130 may move the die 20 from the stage 120 to the bonding region 117 and the bonding region 117 may be provided with the substrate 50 ) To a predetermined temperature may be provided. Thus, the heat plate 118 can facilitate bonding of the die 20 by preheating the substrate 50.

In an embodiment of the present invention, a loader 192 is disposed on both sides of the indexer 110, in which a first magazine 190 accommodating substrates 50 to be subjected to a die bonding process is disposed, An unloader 197 may be provided in which the second magazine 195 in which the completed substrates 50 are housed is disposed.

The operation of the die bonding apparatus will now be described.

The indexer 110 transfers the substrate 50 to the bonding area 117. Meanwhile, the stage 120 supports the wafer 10, and the bonding head 130 picks up the die 20 from the stage 120. Thereafter, the imaging unit 140 acquires the image of the picked-up die through the reflective part 145 while the bonding head 130 is transporting the picked-up die toward the bonding area 117. [ Thereby securing the position data of the picked-up die so that the bonding head 130 can perform position alignment with respect to the die. After the bonding head 130 performs alignment with respect to the die, the die 20 is transferred to the bonding region 117 and then the die 20 is bonded to the substrate 50 . The indexer 110 then transfers the substrate 50, including the bonded die 20, to the unloader. Thus, the die bonding apparatus can complete the bonding process.

Although the indexer 110, the stage 120, the bonding head 130, the image sensing unit 140, and the reflection unit 145 have been described above as examples, the structure and arrangement of the components may be variously changed Therefore, the scope of the present invention is not limited by the detailed structure and arrangement relationship of the components.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: wafer 20: die
30: die attach film 50: substrate
100: Electrical inspection module 110: Indexer
117: bonding area 120: stage
130: bonding head 140:
145:

Claims (5)

An indexer for transferring the substrate and providing a bonding area;
A stage disposed adjacent to the indexer and supporting a wafer divided into a plurality of dies;
A bonding head that moves between the stage and the indexer, picks up a die from the stage and bonds the substrate to the substrate in the bonding region;
An imaging unit disposed to face a side of the indexer and away from a conveying path of the bonding head, the imaging unit capturing an image of a lower portion of the die picked up by the bonding head; And
And a reflector disposed at a side of the indexer and transmitting an image of the die picked up to the bonding head to the image pickup unit,
Wherein the reflective portion has an exposed surface tilted with respect to the wafer and the exposed surface is parallel to the transport path of the bonding head. delete 2. The die bonding apparatus according to claim 1, wherein the reflective portion includes a mirror or a prism structure. An indexer for transferring the substrate and providing a bonding area;
A stage disposed adjacent to the indexer and supporting a wafer divided into a plurality of dies;
A bonding head that moves between the stage and the indexer, picks up a die from the stage and bonds the substrate to the substrate in the bonding region;
An imaging unit disposed to face a side of the indexer and away from a conveying path of the bonding head, the imaging unit capturing an image of a lower portion of the die picked up by the bonding head; And
And a reflector disposed at a side of the indexer and transmitting an image of the die picked up to the bonding head to the image pickup unit,
Wherein the indexer includes first and second guide rails extending parallel to each other, and one of the first and second guide rails adjacent to the imaging unit has a tilted side surface. The die bonding apparatus according to claim 4, wherein the reflective portion has a plate shape fixed to the inclined side surface.

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