KR101503501B1

KR101503501B1 - Light-emitting device

Info

Publication number: KR101503501B1
Application number: KR1020080060314A
Authority: KR
Inventors: 한정아; 소지섭
Original assignee: 서울반도체 주식회사
Priority date: 2008-06-25
Filing date: 2008-06-25
Publication date: 2015-03-18
Also published as: KR20100003324A

Abstract

The present invention relates to a light emitting device having a plurality of legs formed on a lead frame for electrical contacts of a light emitting device, thereby improving the compatibility with various substrates having different lead patterns. A package body having an opening through which light emitted from the light emitting chip is emitted; And a first lead frame and a second lead frame electrically connected to the light emitting chip at the inside of the opening and formed with at least two legs each forming an electrical contact to the outside of the package body. do.

Light emitting device, light emitting diode, side light emission, side view, dual

Description

[0001] LIGHT-EMITTING DEVICE [0002]

The present invention relates to a light emitting device, and more particularly, to a light emitting device in which a plurality of legs formed on a lead frame for electrical contacts of a light emitting device are formed to improve compatibility with a variety of substrates having different lead patterns .

2. Description of the Related Art Generally, various light emitting chips are used for a light emitting device. For example, a light emitting diode (Light) using a pn junction structure of semiconductors and a light emitting diode Emitting Diode, LED) is used. Examples of the light emitting diode include a red light emitting diode using GaAsP or the like, a green light emitting diode using GaP or the like, and a blue light emitting diode using an InGaN / AlGaN double hetero structure.

The light emitting device is manufactured in various forms depending on the type of chip, the shape of the package, or the direction of light emission. For example, a chip type, a lamp type, a topview type, a sideview type, and the like have been manufactured and used. In recent years, due to the slimming of the LCD (Liquid Crystal Display) A demand for a side view type light emitting device used as a backlight unit light source of an LCD is increasing.

1B is a perspective view showing a main part of a general light emitting device. As shown in the figure, a general side view light emitting device includes a package 11 composed of a housing 11 and a reflector 13 A first lead frame 20 and a second lead frame 20 mounted on the housing 11 and spaced apart from each other on the housing 11 and a second lead frame 30 mounted on the first lead frame 20, A light emitting chip 40 connected to the light emitting chip 40 by a wire 50 and a molding part 60 formed inside the reflector 13 to seal the light emitting chip 40. At this time, the first and second lead frames 20 and 30 are formed by bending legs 21 and 31, which are electrical contact portions, for mounting the light emitting device on a separate printed circuit board. In particular, a solder pattern is formed on a printed circuit board so that the light emitting device can be soldered and mounted. Therefore, the legs 21 and 31 should be formed at positions determined to correspond to the solder pattern. Therefore, a light emitting device manufactured to correspond to a solder pattern of a specific printed circuit board can be used only on the printed circuit board, but can not be used on other printed circuit boards at all.

Further, since the legs are bent in one direction of the package body, heat generated in the light emitting chip is concentrated only in one direction during operation of the light emitting device, thereby causing thermal damage to the light emitting device and the peripheral device.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a light emitting device having a plurality of types of legs formed on a lead frame and having improved compatibility with various printed circuit boards.

Another object of the present invention is to provide a light emitting device capable of improving heat radiation efficiency by dispersing heat generated from a light emitting chip by forming a plurality of legs formed in a lead frame.

According to an aspect of the present invention, there is provided a light emitting device including: a light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; And a first lead frame and a second lead frame electrically connected to the light emitting chip at the inside of the opening and formed with at least two legs each forming an electrical contact to the outside of the package body. do.

Each of the legs formed on the first and second lead frames includes an upper leg protruded to the upper portion of the package body and bent forward or backward, a lower leg protruding downward from the package body and bent forward or backward, And at least two of the side legs protruding from the side of the package main body and being firstly bent forward or backward and being secondarily bent upward or downward of the package main body.

In this case, the legs formed on the first and second lead frames are preferably formed at mutually plane-symmetrical positions.

The light emitting chip may further include a molding part molded in an opening of the package body to seal the light emitting chip.

The openings of the package body may be open toward the front of the package body, and each of the legs formed on the first and second lead frames may be formed in one or both directions of the package body. .

According to the present invention, by forming a plurality of legs for forming electrical contacts on the lead frame of the light emitting device, it is possible to obtain a compatible light emitting device which can be easily mounted on various printed circuit boards having different solder patterns.

In addition, the plurality of legs serve to disperse heat generated from the light emitting chip, thereby preventing thermal damage to the light emitting device and peripheral devices.

Hereinafter, a light emitting device according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2A is a perspective view showing a light emitting device according to a first embodiment of the present invention, and FIG. 2B is a perspective view showing a main part of a light emitting device according to the first embodiment of the present invention.

As shown in the drawing, the light emitting device according to the first embodiment of the present invention includes a light emitting chip 110; A package body (120) having an opening through which light emitted from the light emitting chip (110) is emitted; And a plurality of legs (131, 133, 141, 143) electrically connected to the light emitting chip (110) inside the opening and forming electrical contacts on the outside of the package body (120) And a second lead frame 130,140.

The light emitting chip 110 is a means for generating light by application of an external power source, and can be selectively adopted among chips that emit light in the ultraviolet region from the infrared region. For example, a vertical white light emitting diode may be used.

The package body 120 defines a housing 121 in which the first and second lead frames 130 and 140 are installed and a mounting region of the light emitting chip 110, And a reflector 123 having an opening to be determined. The reflector 123 is integrally or separately formed with the housing 121 and is coupled to one surface of the housing 121. Of course, the housing 121 and the reflector 123 can be manufactured variously according to the use of the light emitting device. Particularly, in this embodiment, the opening direction of the opening formed in the reflector 123 is formed in front of the package body 120. The term "forward" refers to the direction of light emission in the side view light emitting device, and refers to the Z direction shown in the figure. Hereinafter, in order to clarify the components to be described later, the X direction is the upper direction, the -X axis direction is the lower side, the Y axis direction and the -Y axis direction are the side parts, the Z axis direction is the forward direction, .

The package body 120 is formed with a molding part 160 formed at an opening formed in the reflector 123 and sealing a part of the light emitting chip 110 and the first and second lead frames 130 and 140 .

The molding part 160 is used for sealing and protecting a part of the light emitting chip 110 and the first and second lead frames 130 and 140. The forming method and shape can be variously implemented. Normally, the molding part 160 can be formed of a transparent silicone resin or an epoxy resin. However, the present invention is not limited thereto, and any material may be used as long as it is transparent enough to transmit light according to the use of the light emitting device. In addition, the phosphor may be mixed for the implementation of white light.

The first and second lead frames 130 and 140 are used to apply external power to the light emitting chip 110 as the light emitting chip 110 is mounted or electrically connected through the wire 150, And the reflector 123, or the coupling surface of the reflector. In this embodiment, the light emitting chip 110 is mounted on the first lead frame 130 and the wire 150 connected to the light emitting chip 110 is connected to the second lead frame 140.

In particular, each of the first and second lead frames 130 and 140 is electrically connected to an external power source, for example, at least two legs 131, 133, 141, and 143 forming contact points with patterned solder patterns on a printed circuit board .

The legs include upper legs 131 and 141 protruding from the upper portion of the package body 120 and bent forward or backward and lower legs 133 and 143 protruding downward from the package body 120 and bent forward or backward . The legs are not limited to the upper legs 131 and 141 and the lower legs 133 and 143. The legs may protrude from the side of the package body 120 and are primarily bent forward or backward. (235, 245 in Fig. 3B). At this time, it is preferable that the legs 131 and 133 protruding from one lead frame 130 are separated from each other to be insulated.

In the first embodiment, the upper and lower legs 130 and 140 have upper and lower legs 131 and 141, respectively, protruding upward from the outer side of the first and second lead frames 130 and 140, And lower legs 133 and 143 protruding downward from the outer side and bent forward. Therefore, either one of the upper legs 131, 141 formed on the upper portion of the package body 120 or the lower legs 133, 143 formed on the lower portion of the package body 120 in accordance with the solder pattern formed on the printed circuit board on which the light emitting device is mounted Can be selected and bonded.

In the present embodiment, the upper legs 131 and 141 and the lower legs 133 and 143 are formed at outer ends which are the same distance from the inside of the first and second lead frames 130 and 140, respectively. However, the forming positions and the bending directions of the upper legs 131 and 141 and the lower legs 133 and 143 are not limited to those shown in the drawings, but may be variously modified to correspond to the solder pattern of the printed circuit board. However, the formation positions and the bending directions of the legs 131, 133, 141 and 143 formed on the first and second lead frames 130 and 140 are different from each other with respect to the surfaces formed by the X axis and the Z axis for standardization of the light emitting device, It is preferable to be formed so as to be plane-symmetric. The upper and lower legs 130 and 140 may be formed irregularly without forming the upper legs 131 and 141 and the lower legs 133 and 143 in a plane-symmetric manner.

Meanwhile, the present invention can implement various embodiments by variously changing the legs formed on the first and second lead frames.

FIG. 3A is a perspective view showing a light emitting device according to a second embodiment of the present invention, and FIG. 3B is a perspective view showing a main part of a light emitting device according to a second embodiment of the present invention.

3A and 3B, the light emitting device according to the second embodiment of the present invention includes components similar to those of the first embodiment, and changes the shape of the legs formed on the first and second lead frames 230 and 240 . The description of the same configuration will be omitted, and the same reference numerals will be used for the same configurations and names.

The light emitting device according to the second embodiment as shown in the drawing is firstly bent forward of the package body 120 at the outer ends of the first and second lead frames 230 and 240, And lower legs 233 and 243 that are bent downward and protruded downward from the outer sides of the first and second lead frames 230 and 240, respectively. Therefore, either one of the side legs 235 and 245 formed on the upper portion of the package body 120 or the lower legs 233 and 243 formed on the lower portion of the package body 120 may be selected and joined according to the solder pattern formed on the printed circuit board . As in the first embodiment, the positions and bending directions of the side legs 235, 245 and the lower legs 233, 243 are not limited to those shown and can be variously changed to correspond to the solder pattern of the printed circuit board.

4A is a perspective view showing a light emitting device according to a third embodiment of the present invention, and FIG. 4B is a perspective view showing a main part of a light emitting device according to a third embodiment of the present invention.

4A and 4B, the light emitting device according to the third embodiment of the present invention includes components similar to those of the first embodiment and is formed on the first and second lead frames 330 and 340 And is implemented by changing the shape of the leg.

As shown in the figure, the light emitting device according to the third embodiment includes upper and lower legs 330 and 340 protruding from the outer side of each of the first and second lead frames 330 and 340 in the upper direction of the package body 120, 331a, 331b, 341a, and 341b are sequentially provided. Therefore, any one of the inner upper legs 331b and 341b or the outer upper legs 331a and 341a formed on the upper portion of the package body 120 may be selected and joined according to the solder pattern formed on the printed circuit board . As in the first embodiment, the positions and bending directions of the upper legs 331a, 331b, 341a, and 341b are not limited to those shown in the drawings, but may be variously modified to correspond to the solder pattern of the printed circuit board.

While the first and second lead frames 130, 140, 230, 240, 330 and 340 shown in the first to third embodiments are all formed of two legs, the present invention is not limited thereto and the positions of the upper leg, the lower leg, At least three or more of them may be formed by changing the direction.

As described above, at least two legs formed in the first and second lead frames 130, 140, 230, 340, 330 and 340 may be modified into various shapes as the first and second lead frames 130, 140, 230,

Also, the heat generated when the light emitting chip 110 emits light is dispersed and radiated according to the formation of a plurality of legs that extend and branch the first and second lead frames 130, 140, 230, 340, 330 and 340.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be understood that the invention may be modified and varied without departing from the scope of the invention.

1A is a perspective view showing a general light emitting device,

FIG. 1B is a perspective view showing a main part of a general light emitting device,

2A is a perspective view showing a light emitting device according to a first embodiment of the present invention,

2B is a perspective view showing a main part of the light emitting device according to the first embodiment of the present invention,

3A is a perspective view showing a light emitting device according to a second embodiment of the present invention,

3B is a perspective view showing a main part of the light emitting device according to the second embodiment of the present invention,

4A is a perspective view illustrating a light emitting device according to a third embodiment of the present invention,

4B is a perspective view showing a main part of a light emitting device according to a third embodiment of the present invention.

Description of the Related Art

110: light emitting chip 120: package body

130, 230, 330: first lead frame 140, 240, 340: second lead frame

131, 141, 331a, 331b, 341a, 341b:

133, 143, 233, 243:

135,

150: wire 160: molding part

Claims

Light emitting diodes;

A package body having an opening through which light emitted from the light emitting diode is emitted; And

And first and second lead frames which are spaced apart from each other and are electrically connected to the light emitting diode inside the opening,

Wherein the opening is opened toward an upper portion of the package body,

Wherein each of the first and second lead frames includes a first protrusion protruding from at least one side surface of the package body and including an upper leg bent upward in the package body and a lower leg bent in a downward direction of the package body, Device.

The method according to claim 1,

The upper legs of the first and second lead frames are exposed to one side of the package body,

Wherein the lower legs of the first and second lead frames protrude from one side of the package body opposite to the other side thereof.

The method according to claim 1,

Wherein the upper leg and the lower leg of each of the first and second lead frames are exposed to the same side of the package body.

The method according to any one of claims 1 to 3,

Wherein the upper leg and the lower leg of the first lead frame and the upper leg and the lower leg of the second lead frame are formed at mutually plane-symmetrical positions.

The method according to claim 1,

At least one of the upper and lower legs of each of the first and second lead frames further includes a side leg protruding from one side of the package body and being bent secondarily along the surface of the other side adjacent to the one side .