KR101505236B1 - Conductive resin composition - Google Patents

Abstract

An object of the present invention is to provide a conductive resin composition which can secure sufficient reliability in a reliability test even when a conductive powder having a low cost is used and which can be preferably used for a conductive adhesive and the like. The present invention relates to a conductive resin composition comprising the following components (A) to (D).
(A): Epoxy Compound
(B) Component: acid anhydride
(C) Component: An organometallic complex comprising titanium and / or zirconium
(D) Component: nickel powder and / or silver plating powder

Description

CONDUCTIVE RESIN COMPOSITION [0002]

The present invention relates to a heat-curable conductive resin which is resistant to a reliability test such as an anti-humidity test, a heat cycle test or a heat shock test by using a nickel powder or a silver plating powder at a low cost without using expensive silver powder ≪ / RTI >

The conductive resin composition having a conductive powder in an amount of 70 to 95 mass% and a resin component in an amount of 15 to 30 mass% is generally called a conductive adhesive, and a conductive powder such as silver powder is highly filled in order to exhibit conductivity. If the conductive powder is expensive, the cost tends to increase and the added value tends to be lowered. Therefore, nickel powder or various kinds of silver plating powder may be used for the purpose of cost reduction.

In recent years, demand for highly reliable in-vehicle electronic components has increased, and reliability of personal computers and cellular phones has been demanded. The conductive adhesive is often used in connection with these electronic parts, and accordingly, the reliability thereof is also required to be improved. Specific tests for confirming the reliability include an internal humidity test in which the test is performed under a high temperature and a high humidity condition (for example, 85 ° C. × 85% RH), a low temperature test and a high temperature test (for example, conversion between -40 ° C. and 80 ° C.) Changes in the conductivity (resistance value) and adhesive force of the conductive adhesive are confirmed by repeated heat cycle tests or heat shock tests in which the conversion conditions of the low temperature and the high temperature are higher than those of the heat cycle test. In the conductive powder such as nickel powder or various kinds of silver powder for the purpose of cost reduction, the oxidation of the powder surface is caused by moisture or heat in the humidity resistance test, the heat cycle test and the heat shock test, There is a problem that the reliability is deteriorated due to deterioration. If such a reliability deterioration occurs, for example, in a hard disk drive, there is a possibility that static electricity is charged to cause a head crash, and in the optical pickup, there is a problem in data reading due to noise. Here, reliability means tolerance to the humidity resistance test and the heat cycle test and / or the heat shock test.

Generally, when the nickel powder and the silver powder are added to the conductive adhesive, respectively, the surface of the nickel tends to be oxidized more easily than silver, so that there is a difference in the volume resistivity. When the silver powder is used, a volume resistivity of 10 ^-6 ? 占 m level is exhibited. However, when nickel powder is used, the conductivity is not good as compared with the case where silver powder is used at a level of 10 ^-3 to 10 ^-4 ? . As a characteristic common to conductive adhesives, when the initial conductivity is poor, there is a tendency that the deterioration of conductivity becomes worse when the reliability test is performed.

It is known that nickel powder and various silver plated powders generally use an antioxidant. For example, in the case of a conductive resin composition for sintering for burning a resin component at a high temperature as shown in Patent Documents 1 and 2, it is effective to use an antioxidant to prevent oxidation of nickel or aluminum. However, in the conductive resin composition used for the conductive adhesive or the like, since the curing is carried out in the range of 100 to 200 ° C, it is natural that the resin component is left in the range of about 15 to 35 mass%. In such a conductive resin composition, if a metal which is easily oxidized is used, even if an antioxidant is added, it is not effective and reliability is lowered in various reliability tests. In particular, when the antioxidant is not used, it is considered that maintaining the characteristics is difficult unless the resin is denatured as shown in Patent Document 3, for example.

Further, for the purpose of achieving both cost reduction and reliability, a method of plating a metal which is difficult to be oxidized using various inorganic materials or powders of a high-oxidation metal as a core material is also carried out. In the sense of preventing oxidation, gold plating, platinum plating and silver plating are realistic. However, gold plating and platinum plating are not suitable for cost reduction of a conductive resin composition which charges conductive powder such as a conductive adhesive. Even when silver plating is used, the reliability is extremely reduced if the silver plating layer is thinned. As shown in Patent Document 4, attempts have been made to suppress the deterioration of conductivity by studying the shape of the powder. However, since the conductive adhesive necessarily has a resin layer between the primary particles or the secondary particles of the powder, Even if the oxidation progresses slightly, the conductive deterioration rapidly progresses as a cured product of the conductive adhesive agent. Especially when the plated layer is thin.

Japanese Patent Laid-Open Publication No. 11-302705 Japanese Patent Application Laid-Open No. 2001-338529 Japanese Patent Application Laid-Open No. 9-255759 Japanese Patent Application Laid-Open No. 6-215631

In the prior art, it is difficult to secure sufficient reliability in a reliability test such as a humidity resistance test, a heat cycle test, or a heat shock test for a conductive adhesive using a nickel powder or a silver plating powder as a low-cost conductive powder. Therefore, an object of the present invention is to provide a conductive resin composition which can secure sufficient reliability in a reliability test even if a low-priced conductive powder is used, and which can be suitably used for a conductive adhesive or the like.

The present inventors have intensively studied in order to achieve the above object and as a result have found that even when a low-priced conductive powder such as a nickel powder or a silver plating powder is used, it is possible to suppress deterioration of conductivity in an humidity resistance test, a heat cycle test or a heat shock test The inventors of the present invention discovered a method for the conductive resin composition and completed the present invention.

The gist of the present invention will be described below.

The first invention of the present invention is a conductive resin composition comprising components (A) to (D), wherein component (B) is cured as a curing agent and component (C) And does not contain an amine-based curing accelerator.

(A): Epoxy Compound

(B) Component: acid anhydride

(C) Component: An organometallic complex comprising titanium and / or zirconium

(D) Component: nickel powder and / or silver plating powder

The second invention of the present invention is the conductive resin composition according to the first invention, wherein the component (B) is at least one acid anhydride in a liquid state at room temperature.

In a third aspect of the present invention, there is provided a third aspect of the present invention, wherein the component (D) is at least one selected from the group consisting of nickel powder, silver plated copper powder, silver plated aluminum powder, silver plated nickel powder, silver plated carbon powder, silver plated glass powder, Wherein the conductive resin composition is at least one selected from the group consisting of powders and silver-plated resin powders.

The fourth invention of the present invention is the conductive resin composition according to any one of the first to third aspects, wherein the component (A) is a rubber-modified epoxy compound having a rubber skeleton and having two or more epoxy groups in one molecule.

In the conductive resin composition of the present invention, by using an epoxy compound, an acid anhydride, and an organometallic complex of titanium and / or zirconium as a catalyst for curing them, low-cost conductive powder such as nickel powder or silver plating powder is used It is possible to suppress deterioration of conductivity in the humidity resistance test and the heat cycle test or the heat shock test.

The details of the present invention are described below.

As the component (A) of the present invention, an epoxy compound is used. The epoxy compound is not particularly limited as long as it is a compound having at least one epoxy group in one molecule, and various epoxy compounds can be used, but a polyfunctional epoxy compound having two or more epoxy groups in one molecule is preferable. It is also possible to use a mixture of this polyvalent epoxy compound and a monovalent epoxy compound having one epoxy group in one molecule.

Specific examples of the epoxy compound include bisphenol A-type, brominated bisphenol A-type, hydrogenated bisphenol A-type, bisphenol F-type, bisphenol S-type , Glycidyl ethers such as bisphenol AF type, biphenyl type, naphthalene type, fluorene type, novolac type, phenol novolac type, ortho-cresol novolac type, tris (hydroxyphenyl) methane type, And a diester-type epoxy resin. In addition, a glycidyl ester type epoxy resin obtained by condensation of epichlorohydrin with a carboxylic acid such as a phthalic acid derivative or a fatty acid, epichlorohydrin obtained by condensation of epichlorohydrin with amines, cyanuric acid, hydantoin Glycidylamine-type epoxy resins, and epoxy resins modified by various methods. However, the present invention is not limited thereto.

Specific examples of the unit cost epoxy compound include phenyl glycidyl ether, cresyl glycidyl ether, pt-butylphenyl glycidyl ether, butyl glycidyl ether, C12 to C14 alcohol glycidyl ether, butane diglycidyl Ether, hexane diglycidyl ether, cyclohexanedimethyl diglycidyl ether, or glycidyl ether based on polyethylene glycol or polypropylene glycol, but are not limited thereto.

As epoxy compounds having low moisture permeability, rubber-modified epoxy resins having a rubber skeleton such as polybutadiene, hydrogenated polybutadiene, polyisoprene, hydrogenated polyisoprene or styrene copolymers thereof are generally known. It is preferable to use these rubber-modified epoxy compounds unless there is no problem in compatibility between the component (B) and the component (C). Specific examples of the rubber-modified epoxy compound include KL-610, KL-630T and KL-613 manufactured by Kabushiki Kaisha Kuraray Co., Ltd. having an isoprene skeleton, Denarax R manufactured by Idemitsu Kosan Co., Ltd. having a butadiene skeleton -45 EPT, and BF-1000 manufactured by Asahi Denka Kogyo Co., Ltd., and the like.

The component (B) usable in the present invention is not particularly limited as long as it is an acid anhydride, and various ones can be suitably used. In the present invention, the acid anhydride functions as a curing agent for the epoxy compound of the component (A). When the epoxy compound is cured, an amine-based curing agent and / or an amine-based curing accelerator are generally used. However, amine compounds generally cause corrosion in many cases, so that it is not an exception to cause corrosion to the conductive powder. Further, since the organic material is moisture-permeable, it is presumed that the corrosion resistance is particularly accelerated in an immersion test in which moisture permeates the resin composition. Due to the penetration of moisture and the corrosiveness of the amine compound contained in the component, the surface of the silver powder is very likely to corrode. In the case of silver powder, even if the surface is corroded, the inside does not corrode and has little influence as a route through which electric current flows. However, in the case of nickel powder or silver plating powder of a metal or insulator firmly forming an oxide film, It is thought that the conductive adhesive becomes deteriorated and the conductivity tends to deteriorate. In the present invention, such an amine-based curing agent or an amine-based curing accelerator is not used.

Examples of the acid anhydride include dodecenylsuccinic anhydride, polyazelaic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone A cyclic acid anhydride such as tetracarboxylic acid anhydride, tetrabromophthalic anhydride, or anhydrous head acid is preferable. The acid anhydride may be in the form of a solid at room temperature or may be in a liquid state, but it is preferably liquid in view of workability in component mixing. Specifically, HN-2200, HN-2000, HN-5500 and MHAC-P manufactured by Hitachi Kasei Kogyo Co., Ltd., Ricaside TH, HT-1A, HH, MH-700 manufactured by Shin-Nippon Rika Kagaku Co., 100, TMEG-200, TMEG-500, TMEG-600, TMTA-C, TMA-15, DDSA, HF-08, SA, DSDA, TMEG-100, TDA-100 and BT-100, and EPICLONB-570, B-650 and B-4400 manufactured by Dainippon Ink and Chemicals, Incorporated, but are not limited thereto. Specific examples thereof include LIR-403 and LIR-410 manufactured by Kabushiki Kaisha Kuraray, VEMA manufactured by Daicel Chemical Industries, Ltd., and the like. Can be used.

When the acid anhydride is a liquid, it can be directly kneaded with the epoxy compound. When the acid anhydride is solid, it can be used by stirring with a stirrer or the like or by a ball mill or a Mitsumoto roll mill in order to disperse it in the epoxy compound . When the solid particles of the acid anhydride are very large, it is preferable that the particles have an average particle size of less than 20 占 퐉 after the grinding treatment. It is also possible to use a solid acid anhydride after dissolving it in a liquid acid anhydride. The amount of the component (B) to be added is preferably 40 to 120 parts by mass, more preferably 50 to 100 parts by mass, per 100 parts by mass of the epoxy compound. When the addition amount of the component (B) is within the above range, sufficient curability can be obtained, which is preferable.

The component (C) usable in the present invention is not particularly limited as long as it is an organometallic complex including titanium and / or zirconium, and various ones can be suitably used. Specific examples of the organic titanium complexes include tetraisopropyl titanate, tetranormal butyl titanate, butyl titanate dimer, tetraoctyl titanate, titanium acetylacetonate, titanium octylene glycolate, titanium tetraacetylacetonate, titanium ethylacetoacetate , Polyhydroxy titanium stearate, titanium lactate, and titanium triethanolaminate. Specific examples of the organic zirconium complexes include tetra n-propoxy zirconium, tetra n-butoxy zirconium, zirconium tetraacetylacetonate, zirconium monobutoxyacetylacetonate bis (ethylacetoacetate), zirconium dibutoxy bis (ethylacetoacetate) Tetraacetyl acetonate, and zirconium tributoxystearate.

Although the mechanism of curing reaction of the conductive resin composition of the present invention is not completely clarified, it is presumed that an organic complex containing titanium and / or zirconium becomes a catalyst for the curing reaction, and the acid anhydride is opened to react with the epoxy group to be polymerized . Since titanium is more reactive, it is preferable to use an organic complex of titanium. The amount of the component (C) to be added is preferably 0.1 to 10 parts by mass based on 100 parts by mass of the epoxy compound. When the addition amount of the component (C) is within the above range, sufficient curability can be obtained, which is preferable.

The component (D) usable in the present invention is not particularly limited as long as it is a nickel powder and / or a silver plating powder, and various ones can be suitably used. The shape of the nickel powder may be various shapes such as spherical shape, flake shape (scaly shape), irregular shape, and filament shape. The shape of the silver plated powder is generally a spherical shape, a flake shape (scaly shape), or an indefinite shape, but there is no particular limitation. The particle size of the nickel powder or silver plating powder is not particularly limited, but it is preferable that the secondary aggregation powder is 50 탆 or less in order to knead the powder with the resin component. The amount of the component (D) to be added is preferably 250 to 500 parts by mass per 100 parts by mass of the resin component (solid content) composed of the component (A), the component (B) and the component (C). When the addition amount of the component (D) is within the above range, sufficient conductivity can be obtained, which is preferable.

Specific examples of the nickel powder include a spherical powder manufactured by Mitsui Kinzoku Kogyo Kabushiki Kaisha, a spherical powder or flake powder manufactured by Culox Technologies, a spherical powder manufactured by Tohto Titanium Kabushiki Kaisha, a spherical powder or a filament phase powder manufactured by Inco Limited, Flake powder manufactured by NOVAMET, and the like.

As the silver plated powder, a silver plating powder obtained by silver plating a metal having an insulating metal oxide coating or a powder of an insulator can be preferably used. Here, a metal having an insulating metal oxide film is a metal that does not exhibit conductivity even when used in a conductive adhesive or the like due to a solid oxide film. Specifically, copper, aluminum, iron and the like, and alloys such as stainless steel are also included. Examples of silver plated products of these metal powders include silver plated copper powder of Mitsui Kinzoku Kogyo K.K., silver plated copper powder of DOWA Electronics Co., Ltd., and silver plated nickel powder of NOVAMET. Since these metal powders are inexpensive, powders obtained by silver plating the surfaces of these metal powders as a core are inexpensively distributed.

The insulator is a material generally used as a filler, such as alumina, silica, potassium titanate, glass, plastic (synthetic resin) and the like. Since these insulators are inexpensive, powders obtained by silver plating the surfaces of the powders of these insulators are cheaply distributed. As a specific example commercialized, silver plated glass powder produced by Potters Valotini Co., Ltd. can be mentioned.

In the silver plating powder used in the present invention, the effective content of silver is preferably 1 to 30% by mass in the total weight of the silver-plated powder. When the content of silver is 1% by mass or more, it is preferable that the conductivity is less likely to deteriorate due to deterioration of silver in the plating surface layer portion, thereby improving reliability. In addition, it is presumed that the cause of the deterioration of the conductivity is that the route of current flow exists only in the silver plating on the surface, because the background of the silver plating is a metal or an insulator having the insulating metal oxide coating. Further, if the content of silver is 30 mass% or less, the cost becomes significant.

The conductive resin composition of the present invention may contain additives such as coloring agents such as pigments and dyes, metal powders, calcium carbonate, talc, inorganic fillers such as silica, alumina and aluminum hydroxide, flame retardants, organic A surfactant, a filler, a plasticizer, an antioxidant, a defoaming agent, a silane coupling agent, a leveling agent, a rheology control agent, an aromatic solvent such as toluene or xylene, an ethylene glycol mono n-butyl ether, an ethylene glycol monomethyl ether, an ethylene glycol monoethyl ether acetate , And a solvent such as an ether-based solvent may be mixed in an appropriate amount. By the addition of them, a composition and a cured product thereof excellent in resin strength, adhesive strength, workability, storage stability, and the like can be obtained.

<Examples>

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples. Further, in these examples, "%" and "%" represent mass parts and mass%, respectively. The compositions of Examples 1 to 14 are shown in Table 1, and the compositions of Comparative Examples 1 to 8 are summarized in Table 2.

&Lt; Examples 1 to 14 >

To prepare the conductive resin composition, the following components were prepared.

(a) an epoxy compound

· Bisphenol A type liquid epoxy resin: "jER 827 (manufactured by Japan Epoxy Resin Co., Ltd.)" or

Rubber-modified epoxy resin: &quot; KL-610 (manufactured by Kabushiki Kaisha Kuraray Co., Ltd.) &quot;

(b) acid anhydride

A mixture of 3-methyl-hexahydrohumophthalate and 4-methyl-hexahydrophthalic anhydride: &quot; HN-5500 (manufactured by Hitachi Kasei Kogyo K.K.)] or

Mixture of 3-methyl-1,2,3,6-tetrahydrophthalic anhydride and 4-methyl-1,2,3,6-tetrahydrophthalic anhydride: "HN-2200 (Hitachi Kasei Kogyo Co., Ltd.)"

(c) an organometallic complex

Titanium tetraacetylacetonate: "Orgatics TC-401 (manufactured by Matsumoto Fine Chemical Co., Ltd.)" or

Zirconium tetraacetylacetonate: "Orgatics ZC-150 (manufactured by Matsumoto Fine Chemical Co., Ltd.)"

(d) nickel powder, silver plating powder

· Nickel powder on flakes: "HCA-1 (manufactured by Novamet)" or

The spherical shape is a plated copper powder: Ag / wet copper powder (manufactured by Mitsui Kinzoku Kogyo Kabushiki Kaisha) or

Spherical silver plated glass powder: &quot; S-3000-S2 (manufactured by Potters Valotini Co., Ltd.) &quot;

(e) Solvent

· Industrial xylene "xylol (manufactured by Nippon Alcohol Co., Ltd.)"

The above (a), (b), (c) and (e) were stirred for 10 minutes with a stirrer, followed by addition of (d) and further stirred for 30 minutes. When the HCA-1 or Ag / wet copper powder was used as the powder (d), it was passed through a Mitsumoto roll mill three times and kneaded so as not to leave the agglomerated powder. However, when S-3000-S2 was used, Mitsumoto roll mill was not used. Thus, a conductive resin composition having the composition shown in Table 1 was prepared.

&Lt; Comparative Examples 1 to 8 &

To prepare the conductive resin composition, the following (a) to (e) were prepared.

(a) an epoxy compound

· Bisphenol A type liquid epoxy resin: "jER 827 (manufactured by Japan Epoxy Resin Co., Ltd.)" or

Rubber-modified epoxy resin: &quot; KL-610 (manufactured by Kabushiki Kaisha Kuraray Co., Ltd.) &quot;

(b) acid anhydride

Mixture of 3-methyl-hexahydrohumophthalate and 4-methyl-hexahydrophthalic anhydride: "HN-5500" (manufactured by Hitachi Kasei Kogyo Co., Ltd.)

(b ') a liquid polyphenol compound

&Quot; MEH-8005 &quot; (manufactured by Meiwa Kasei Kabushiki Kaisha)

(c ') 1-benzyl-2-methylimidazole

&Quot; Cure Sol 1B2MZ (manufactured by Shikoku Kasei Kabushiki Kaisha) &quot;

(d) nickel powder, silver plating powder

· Nickel powder on flakes: "HCA-1 (manufactured by Novamet)" or

The spherical shape is a plated copper powder: Ag / wet copper powder (manufactured by Mitsui Kinzoku Kogyo Kabushiki Kaisha) or

Spherical silver plated glass powder: &quot; S-3000-S2 (manufactured by Potters Valotini Co., Ltd.) &quot;

(e) Solvent

· Industrial xylene "xylol (manufactured by Nippon Alcohol Co., Ltd.)"

The above (a), (b) or (b '), (c') and (e) were stirred for 10 minutes with a stirrer, followed by addition of (d) and further stirred for 30 minutes. In the case of using HCA-1 or Ag / wet copper powder as (d), it was passed through a Mitsumoto roll mill three times and kneaded so as not to leave aggregated powder. However, when S-3000-S2 was used, Mitsumoto roll mill was not used. Thus, a conductive resin composition having the composition shown in Table 2 was prepared.

Test pieces were produced as described below for the conductive resin compositions obtained in Examples 1 to 14 and Comparative Examples 1 to 8, and the volume resistivity thereof was confirmed. The test piece was subjected to a reliability test to confirm a change in the volume resistivity.

[Manufacture of test pieces]

The conductive resin compositions obtained in Examples 1 to 14 and Comparative Examples 1 to 8 were squeegeeed by masking on a glass plate having dimensions of 2.0 mm x 100 mm x 100 mm and having a width of 10 mm and a length of 90 to 100 mm . At this time, the surface of the coating film was flat and the masking width was parallel to the test plate, and the resin composition was careful not to contain bubbles. Finally, the masking was peeled off and the resin composition was cured by heating in a circulating hot-air drying furnace at 120 ° C for 1 hour to prepare a test piece.

[Reliability Test]

The test piece of the conductive resin composition was subjected to the humidity resistance test and the heat shock test under the following conditions. Then, the test piece after the humidity resistance test and the test piece after the heat shock test were subjected to measurement of the volume resistivity under the conditions described below.

· Humidity test

With respect to the test piece, the volume resistivity was measured at a temperature of 85 ° C and a relative humidity of 85% at each charging time. The test piece was taken out at each injection time, and the volume resistivity was measured at the step of returning to the room temperature. After the measurement, the humidity resistance test was continued again.

· Heat shock test

With respect to the test piece, the volume resistivity was measured for each cycle described in Table 4 under the conditions of -40 ° C on the low-temperature side and 85 ° C on the high-temperature side under the conditions of 1 cycle and 1 hour in which the holding time was 30 minutes.

[Measurement of volume resistivity]

Using a tester having a plate-shaped electrode, the resistance (R:?) At a distance of 50 mm between the electrodes was measured with the temperature of the test piece of the conductive resin composition at room temperature. Thereafter, the thickness (t: m) of the cured product was measured by the sum of the film thicknesses. Based on these two measurements, the volume resistivity was calculated by the following equation (1).

&Quot; (1) &quot;

In the equation (1), ρ is the volume resistivity, R is the resistance value between the electrodes (resistance R), A is the cross sectional area (width 10 mm × thickness t) with respect to the current direction and L is the length between the electrodes.

The results of the measurement of the volume resistivity of the test piece after the humidity resistance test are shown in Table 3. The results of the measurement of the volume resistivity of the test piece after the heat shock test are shown in Table 4. In Table 3 and Table 4, &quot; OL &quot; is an abbreviation of overload, which means a resistance value exceeding the measurement limit in the measurement of the resistance (R:?) By the tester.

In the comparative example, abrupt deterioration of conductivity was observed by the humidity resistance test, and a gradual deterioration was observed even in the heat shock test, and finally the resistance value was more than the resistance measurement limit. It is presumed that the penetration of water and / or the deterioration of the conductive powder due to heat have an influence as a cause thereof. On the other hand, in the case of the embodiment, although the resistance value slightly increased, the resistance value was stable even though it was a mild reliability test as compared with the comparative example and 1000 hours of the humidity resistance test and 1000 cycles of the heat shock test.

Although the present invention has been described in detail with reference to specific embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present invention. This application is based on Japanese Patent Application (Patent Application No. 2008-110143) filed on April 21, 2008, the contents of which are incorporated herein by reference.

&Lt; Industrial applicability >

In recent years, since the current gold price of precious metals fluctuates due to a change in the world situation, the precious metal used as the electrode forming metal is often changed to a nonmetal. The commonly used silver paste is also strongly influenced by price fluctuations of silver, so that the conductive resin composition having high reliability regardless of the use of the conductive powder of low price such as the conductive resin composition of the present invention, And it is highly likely that the field of use will be widened.

Claims (5)

A conductive resin composition comprising the following components (A) to (D), the component (B) as a curing agent and the component (C) as a catalyst for curing reaction, Conductive resin composition containing no promoter.
(A): Epoxy Compound
(B) Component: acid anhydride
(C) Component: An organometallic complex comprising titanium and / or zirconium
(D) Component: nickel powder and / or silver plating powder The conductive resin composition according to claim 1, wherein the component (B) is at least one acid anhydride in a liquid state at room temperature, and the content of the acid anhydride is 50 to 100 parts by mass relative to 100 parts by mass of the component (A) Composition. The method according to claim 1, wherein the component (D) is at least one selected from the group consisting of nickel powder, silver plated copper powder, silver plated aluminum powder, silver plated nickel powder, silver plated carbon powder, silver plated glass powder, silver plated alumina powder, Is at least one selected from the group consisting of plated resin powders. The method according to claim 2, wherein the component (D) is at least one selected from the group consisting of nickel powder, silver plated copper powder, silver plated aluminum powder, silver plated nickel powder, silver plated carbon powder, silver plated glass powder, silver plated alumina powder, Is at least one selected from the group consisting of plated resin powders. The conductive resin composition according to any one of claims 1 to 4, wherein the component (A) is a rubber-modified epoxy compound having a rubber skeleton and two or more epoxy groups in one molecule.