KR101457900B1 - film for display using stacked silicon and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a film for a display using silicon lamination and to a method for producing the same. More specifically, two kinds of silicon having different hardness levels are laminated so that the film for a display using silicon lamination is produced, wherein the film for a display using silicon lamination can replace a glass panel, has high hardness, and is flexible. Moreover, the method of the present invention comprises a first silicon layer producing step of producing a first silicon layer having a film shape through first silicon; and a second silicon layer producing step of coating second silicon which is more flexible than the first silicon layer on one surface of the first silicon layer so as to produce a second silicon layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a film for display using silicon lamination,

The present invention relates to a display film using a silicon laminate and a manufacturing method thereof, and more particularly, to a display film using a silicon laminate with high hardness and capable of replacing a glass panel by stacking two kinds of silicones having different hardness And a method for producing the same.

In general, a transparent and conductive film is used for the light-emitting surface electrode or panel of the flat display including the LCD.

The transparent conductive film may be formed by coating indium tin oxide (ITO) with indium oxide or indium oxide by using a deposition method such as a sputtering target, or by coating ITO on a transparent film such as polyethylene. Alternatively, a transparent conductive film is produced by dissolving ITO in a spray form on a glass plate, or precipitating a glass plate in an ITO solution.

Korean Patent No. 10-1173394 'ITO film for a touch screen panel and a method for manufacturing a touch screen panel using the ITO film' manufactured by the above-described method, and the conventional ITO film shown in FIG. 1 include a polyethylene or polyurethane The ITO coating layer 3 is formed on one side of the film 6 such as a glass substrate and the glass panel 80 is attached to one side in order to use in a market situation requiring a thinner panel. There was a heavy problem due to the use of glass.

More specifically, as a thinner and lighter panel is required, the ITO film entering the panel also requires a thinner thickness, and it is required to have a high hardness which is thin and strong against the external environment.

In addition, with the introduction of flexible displays having flexibility, ITO films are required to have flexibility in addition to hardness hard to external environment.

Therefore, there has been a problem that it is difficult to satisfy both the hardness and the flexibility due to the use of the glass having high hardness in the conventional film production method in order to have high flexibility while having a strong hardness in the external environment.

Korean Patent No. 10-1173394

DISCLOSURE OF THE INVENTION An object of the present invention is to provide a display film using a flexible silicon laminate having high hardness and capable of replacing a glass panel, and a method of manufacturing the same.

In order to accomplish the above object, a display film using a silicon laminate according to the present invention and a method of manufacturing the same includes a first silicon layer forming step of forming a film-shaped first silicon layer with a first silicon, And a second silicon layer forming step of forming a film-shaped second silicon layer by coating a second silicon which is more flexible than the first silicon layer.

And forming a first silicon layer and a second silicon layer on one surface of the silicon film composed of the first silicon layer and the second silicon layer after the second silicon layer formation step, And a lamination step of repeating the layer forming step.

The method may further include forming a first silicon layer having a film shape on the first surface of the transparent polyimide film and a second silicon layer on the first surface of the first silicon layer, And a second silicon layer forming step of forming a film-shaped second silicon layer.

Further, a film-like first film composed of transparent silicon, a film-like second film composed of transparent silicon more flexible than the first film, and a first film and a second film are cross-laminated at least once to form a silicon film And a silicon film forming step of forming a silicon film.

The method may further include at least one drying step for dry-curing the silicon before or after the silicon film forming step.

In addition, the method further includes an ITO coating step of forming an ITO coating layer by coating ITO on one surface of the silicon film after the silicon film forming step.

A second silicon layer in the form of a film composed of a first silicon layer in the form of a film made of transparent first silicon and a second silicon layer that is more flexible than the first silicon and a second silicon layer in the form of a film, And a cross-laminated silicon film.

Further, a film-shaped second silicon layer composed of a film-shaped transparent polyimide film and a transparent first silicon and a film-shaped first silicon layer composed of a transparent second silicon and a second silicon film more flexible than the first silicon, And a silicon film in which the first silicon layer is attached and the first silicon layer and the second silicon layer are alternately laminated at least one time on the other surface.

A second silicon layer that is more flexible than the first silicon layer formed on one surface of the first silicon sculpture layer; and a second silicon layer formed on the first silicon sculpture layer, And a silicon film in which the first silicon layer and the second silicon layer are cross-laminated at least once.

In addition, the present invention is further characterized by an ITO coating layer formed by coating ITO on one surface of the silicon film.

In addition, the first silicon constituting the first silicon layer has a higher hardness than the second silicon, the second silicon constituting the second silicon layer has higher flexibility than the first silicon, and the silicon film has different flexibility And the first silicon layer and the second silicon layer having hardness are cross-laminated at least once to have the hardness of the first silicon and the flexibility of the second silicon.

The first silicon layer and the second silicon layer each have a thickness of 1 to 300 탆.

Further, the silicon film has a thickness of 2 to 600 mu m.

As described above, according to the display film and the manufacturing method using the silicon laminate according to the present invention, it is possible to replace the glass panel with the high hardness and flexible characteristics.

1 is a sectional view showing a conventional ITO film.
FIG. 2 is a flowchart showing steps of a method of manufacturing a display film using a silicon laminate according to the present invention.
3 is a view showing Embodiment 1 of a method of manufacturing a display film using a silicon laminate according to the present invention.
Fig. 4 is a view showing the second embodiment and the third embodiment of the drying method for the display film using the silicon lamination according to the present invention. Fig.
5 is a view showing a method of manufacturing a first film and a second film in another embodiment 4 of the method for producing a display film using a silicon laminate according to the present invention.
6 is a view showing a method of laminating a first film and a second film according to another embodiment 4 and embodiment 5 of the method for producing a display film using a silicon laminate according to the present invention.
7 is a cross-sectional view of a display film using a silicon laminate according to the present invention.
8 is a view showing Example 6 using a polyimide film in a method of manufacturing a display film using a silicon laminate according to the present invention.
9 is a view showing another embodiment 7 using a polyimide film in a manufacturing method of a display film using a silicon laminate according to the present invention.
10 is a cross-sectional view showing another embodiment of a film for display using a silicon laminate according to the present invention.
11 is a view showing still another embodiment of a film for display using a silicon laminate according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 2 is a flow chart showing steps of a method of manufacturing a display film using a silicon laminate according to the present invention, and FIG. 3 is a view showing a first embodiment of a method of manufacturing a display film using a silicon laminate according to the present invention And FIG. 4 is a view showing the second embodiment and the third embodiment of drying the method for producing a display film using the silicon lamination according to the present invention, and FIG. 5 is a cross- FIG. 6 is a sectional view showing another embodiment 4 of the manufacturing method of the display film using the silicon laminate according to the present invention and the embodiment 7 is a cross-sectional view showing a display film using a silicon laminate according to the present invention, and Fig. 8 is a cross- FIG. 9 is a view showing a method of manufacturing a display film using a polyimide film according to a preferred embodiment of the present invention. FIG. FIG. 10 is a cross-sectional view showing another embodiment of a display film using a silicon laminate according to the present invention, and FIG. 11 is a cross-sectional view showing a display film using a silicon laminate according to the present invention Fig.

As shown in FIG. 2, a method of manufacturing a display film using a silicon laminate according to the present invention includes a first silicon layer forming step (201) for forming a film-like first silicon layer with a first silicon S1), and a second silicon layer forming step (S2) of forming a film-shaped second silicon layer by coating a first silicon layer with a second silicon layer that is more flexible than the first silicon layer.

The display film using the silicon laminate manufactured through the above-described manufacturing process is manufactured by laminating the second silicon which is more flexible than the first silicon layer and the first silicon having a hardness higher than that of the second silicon layer, Flexible with high hardness that can be used for flexible displays.

The ITO coating layer (S4) may further include an ITO coating step (S4) of forming an ITO coating layer by coating ITO on one surface of a display film (silicon film composed of the first silicon layer and the second silicon layer) It is also possible to produce a film formed integrally or further to attach individual ITO films.

In addition, as shown in 202, after the silicon film forming step (S2), the first silicon layer and the second silicon layer are alternately stacked on one surface of the silicon film composed of the first silicon layer and the second silicon layer, (S3) for repeating the layer forming step (S1) and the second silicon layer forming step (S2).

For example, after a first silicon layer is coated with a second silicon layer, another first silicon layer is laminated on one side of the second silicon layer, and another second silicon layer is formed on one side of the other first silicon layer (S3) in which a plurality of first silicon layers and a second silicon layer are stacked so as to be laminated in a stacking manner.

In a preferred embodiment, the first silicon has a higher hardness than the second silicon, the second silicon is more flexible than the first silicon layer, and the first silicon layer further includes the laminating step (S3) And the second silicon layer are cross-laminated is most preferable because a film having higher hardness and flexibility can be obtained.

For example, the first silicon may be silicon having a high hardness of 7H to 9H, and the second silicon may have a Shore A hardness of 50 to 90, a tensile strength of 4 to 8 MPa, and an elongation of 200 to 500% Flexible silicon can be used because the physical properties of the first silicon and the second silicon differ from each other in that the measurement method is different.

Further, the method further includes a drying step (not shown) for performing forced drying such as thermal curing or UV curing after at least one of the first silicon layer forming step, the second silicon layer forming step, the laminating step, and the ITO coating step You may.

For example, it may further include a drying step after the first silicon layer forming step, or may further include a drying step after the second silicon layer forming step, and may further include a drying step after the ITO coating step.

In addition, after the first silicon layer forming step, the second silicon layer forming step, the laminating step, and the ITO coating step, each of the drying steps may further include a drying step, a first drying step, a second drying step, , A fourth drying step, and the like may further include a plurality of drying steps.

(S1), a second silicon layer formation step (S2), a lamination step (S3), an ITO coating step (S2) (S4) may further include a rolling step.

More specifically, the first silicon layer, the silicon film, the ITO coating layer, and the like are individually rolled through different rolling rollers, or rolled at one time after the film is produced, by pressing both sides through a press or rolling roller to reduce the thickness It is possible.

In addition, the first silicon layer forming step is eliminated by a method of supplying a film made of the first silicon and a film made of the second silicon in advance, and the film made of the first silicon and the film made of the second silicon May be laminated to form a silicon film.

For example, a film-like first film made of transparent first silicon and a film-shaped second film made of a transparent second silicon having a more flexible property than the first film are cross- A silicon film may be produced through a silicon film forming step of forming a film, and the lamination of the first film and the second film is laminated (adhered) through an adhesive or a primer.

In addition, the manufacturing steps may be changed according to the stacking order.

For example, the ITO coating layer may be first formed through the ITO coating step S4, and then a second silicon layer forming step S2 may be performed to form a second silicon layer on the ITO coating layer. A first silicon layer formation step (S1) may be performed to form a first silicon layer on the upper surface of the substrate.

As a method of forming the first silicon layer, the second silicon layer and the ITO coating layer, other methods such as a comma coater, a lip coater, a microgravure, a slot die, a hole coating, Method may be used.

As described above, the display film using the silicon laminate according to the present invention and the manufacturing method thereof are used for manufacturing a flexible film having high hardness for replacing a glass panel, and the formation of an ITO coating layer or an ITO film However, the formation of the ITO coating layer or the adhesion of the ITO film may be omitted if necessary, although it will be described below as including ITO.

FIG. 3 illustrates a first embodiment of a method of manufacturing a display film using a silicon laminate according to the present invention. The method includes forming a first silicon layer (S1), a second silicon layer (S2) S4 are performed once.

In the following description (Examples 1 to 7), the first silicon 11 of liquid phase is directly sprayed onto the upper portion of the conveyor 50 for the production and transport of the film through the first injection nozzle 21 Although it has been described that the first silicon layer is formed, the conveyor 50 may further include release paper such as PI, PP, PE, or PET on the top.

As described above, when the release paper is further included, the first silicon layer, the second silicon layer, and the ITO coating layer are laminated on the top surface of the release paper, and after the manufacture of the display film using the silicon lamination is completed, Or may be removed immediately before use (adhesion) of a display film using a silicon laminate.

Further, since the first silicon layer, the second silicon layer, and the ITO coating layer formed on the top surface of the release paper do not directly contact the conveyor 50, a higher quality silicon film can be produced.

Embodiment 1 will be described in more detail. A first silicon layer 11 of liquid phase is injected onto a conveyor 50 for manufacturing and transporting a film through a first injection nozzle 21 to form a first silicon layer And the first silicon layer is continuously formed while being conveyed by the conveyor 50. [

The upper portion of the first silicon layer is scratched through the first coater 31 so that the first silicon layer has a predetermined thickness, and the first silicon layer is scraped off through the first rolling roller 51, The first and second silicon layers may have a thickness of 1 to 300 탆, but preferably have a thickness of 1 to 50 탆 in order to cross-laminate the first and second silicon layers.

As described above, when the formation of the first silicon layer is completed, the second silicon layer 12 is sprayed onto the first silicon layer through the second injection nozzle 22 to form the second silicon layer, And the second silicon layer is continuously formed while being conveyed by the conveyor 50. [

The second silicon layer is scraped off through the second coater 32 so that the second silicon layer has a predetermined thickness and the second silicon layer is scraped off through the second rolling roller 52. [ And the second silicon layer may have a thickness of 1 to 300 mu m, but it is preferable that the second silicon layer has a thickness of 1 to 50 mu m for cross-lamination.

The silicon film composed of the first silicon layer and the second silicon layer may have a thickness of 2 to 600 탆, but it is preferable that the silicon film has a thickness of 2 to 50 탆 in order to produce a thin ITO film .

As described above, the ITO coating layer is formed by spraying the liquid ITO solution 13 onto the upper part of the second silicon layer formed through the third injection nozzle 23, and the ITO coating layer is formed by the conveyor 50 It is continuously formed as it is transferred.

The upper portion of the ITO coating layer is scratched (scratched) through the third coater 33 so that the ITO coating layer has a predetermined thickness. The ITO coating layer is thinned through the third rolling roller 53, The ITO coating layer may have a thickness of 1 to 300 mu m, but preferably has a thickness of 1 to 50 mu m for cross-lamination.

After the formation of the ITO coating layer is completed, the display film 60 using the silicon layered structure composed of the first silicon layer, the second silicon layer, and the ITO coating layer is peeled from the conveyor 50, . ≪ / RTI >

The plurality of coaters 31, 32, 33 and the rolling rollers 51, 52, 53 may be eliminated during the manufacturing process, or only a part of the coaters 31, 32, 33 and the rolling rollers may be applied.

In addition, the above-described first embodiment can be summarized as follows. The following 2-1, 2-1, 3, and 3-1 may be deleted or partially applied during the manufacturing process.

- Example 1

1. A first silicon layer 11 is formed by spraying a liquid first silicon 11 through a first injection nozzle 21 onto the top of a conveyor 50 for the production and transport of a film.

1-1. The thickness of the first silicon layer is adjusted through the first coater 31 and the first rolling roller 51.

2. A second silicon layer is formed by spraying a liquid second silicon 12 through a second spray nozzle 22 on top of the first silicon layer.

2-1. And adjusts the thickness of the second silicon layer through the second coater 32 and the second rolling roller 52.

3. An ITO coating layer is formed by spraying a liquid ITO solution 13 onto the upper portion of the second silicon layer through the third injection nozzle 23.

3-1. The thickness of the ITO coating layer is adjusted through the third coater 33 and the third rolling roller 53.

4. Peeling the display film 60 using the silicon lamination from the conveyor.

FIG. 4 illustrates Example 2 (401) and Example 3 (402) for drying a method for producing a display film using a silicon laminate according to the present invention. A plurality of drying steps (first drying step, second drying step) for performing forced drying by a plurality of dryers 41, 42, and 43, respectively, after the ITO coating step S4 including after the second silicon layer forming step S2 Drying step, and third drying step), or a drying step of performing forced drying through one fourth dryer 44 only after the ITO coating step (S4).

More specifically, the first to third drying steps are further included in the same manufacturing method as that of the first embodiment described above with reference to FIG. 3, and a first injection nozzle is provided on the conveyor 50 for manufacturing and transporting the film A first silicon layer formed by spraying a first silicon liquid including a first drier (41) after a first silicon layer forming step (S1) for forming a first silicon layer by spraying a first silicon liquid through the first silicon layer And cured.

In addition, after the second silicon layer formation step (S2) in which the second silicon layer is formed by spraying the liquid second silicon through the second spray nozzle onto the first silicon layer having been dried, the second drier (42) And the second silicon layer formed by spraying the liquid second silicon layer is cured.

In addition, after the ITO coating layer forming step (S4) in which the ITO coating layer is formed by spraying the liquid ITO solution onto the upper part of the dried second silicon layer through the third spray nozzle, the third drier (43) ITO solution is sprayed to cure the formed ITO coating layer.

The first dryer, the second dryer, and the third dryer may use a thermal drying method for applying predetermined heat for a predetermined time or a drying method using UV, and may use either a thermal drying method or a UV drying method Or may be dried using both the thermal drying method and the UV drying method.

In addition, the drying temperature is preferably gradually increased from a normal temperature, so that cracks do not occur due to a rapid temperature change.

For example, it may be dried at room temperature for 5 minutes, dried at 50 ° C for 10 minutes, and then dried at 90 ° C for 5 minutes.

In addition, it is preferable to dry at a temperature within a range of from room temperature to a maximum temperature of 20 minutes, but the temperature and time may vary depending on the thickness and viscosity of the product.

The above-described embodiment 2 can be summarized as follows, and 1-2, 2-2, and 3-2 may be dried at different temperatures or at different times.

- Example 2

1. Formation of a first silicon layer (S1) by spraying a liquid first silicon through a first injection nozzle onto the top of a conveyor (50) for the production and transport of the film.

1-1. And adjusting the thickness of the first silicon layer through the first coater and the first rolling roller.

1-2. And curing the first silicon layer through a first drier (41).

2. The second silicon layer is formed by spraying a second silicon liquid in a liquid state onto the first silicon layer through a second injection nozzle (S2).

2-1. And adjusting the thickness of the second silicon layer through the second coater and the second rolling roller.

2-2. And curing the second silicon layer through a second drier (42).

3. An ITO coating layer is formed by spraying a liquid ITO solution onto the second silicon layer through a third injection nozzle.

3-1. The thickness of the ITO coating layer is controlled through the third coater and the third rolling roller.

3-2. The ITO coating layer is cured through a third drier (43).

4. Separation of display film using silicon lamination from conveyor.

In addition, the first to third drying steps may be integrated into one drying step, and the first to third drying steps may be integrated into one drying step, Step < / RTI >

(If the ITO coating step is not included, forced drying is performed through one fourth dryer 44 after the silicon film forming step S2)

More specifically, the drying method of the present invention further includes a drying step of performing forced drying through one fourth dryer (44) in the same manufacturing method as the first embodiment described above with reference to FIG. 3, The first drier (44) is further provided after the ITO coating layer forming step (S4) in which the ITO coating layer is formed by spraying the liquid ITO solution onto the upper part of the silicon layer through the third injection nozzle so that the liquid first silicon is sprayed The first silicon layer formed, the second silicon layer formed by spraying the liquid second silicon, and the ITO coating layer formed by spraying the liquid ITO solution are cured at one time.

In addition, the fourth dryer 44 may be a thermal drying method for applying a predetermined heat for a predetermined time or a drying method using UV, and drying may be performed through any one of a thermal drying method and a UV drying method , Drying may be performed using both the thermal drying method and the UV drying method.

In addition, the drying temperature is preferably gradually increased from a normal temperature, so that cracks do not occur due to a rapid temperature change.

For example, it may be dried at room temperature for 5 minutes, dried at 50 ° C for 10 minutes, and then dried at 90 ° C for 10 minutes.

In addition, it is preferable to dry at a temperature within a range of from room temperature to a maximum of 200 degrees for 30 minutes, but the temperature and time may vary depending on the thickness and viscosity of the product.

In addition, the above-described third embodiment will be summarized as follows.

- Example 3

1. Formation of a first silicon layer (S1) by spraying a liquid first silicon through a first injection nozzle onto the top of a conveyor (50) for the production and transport of the film.

1-1. And adjusting the thickness of the first silicon layer through the first coater and the first rolling roller.

2. The second silicon layer is formed by spraying a second silicon liquid in a liquid state onto the first silicon layer through a second injection nozzle (S2).

2-1. And adjusting the thickness of the second silicon layer through the second coater and the second rolling roller.

3. An ITO coating layer is formed by spraying a liquid ITO solution onto the second silicon layer through a third injection nozzle (S4).

3-1. The thickness of the ITO coating layer is controlled through the third coater and the third rolling roller.

3-2. The first silicon layer, the second silicon layer, and the ITO coating layer are cured through the fourth drier (44).

4. Peeling the display film 60 using the silicon lamination from the conveyor 50. [

5 shows a method of manufacturing the first film 61 and the second film 62 of another embodiment 4 of the method for producing a display film using the silicon lamination according to the present invention, ) And the second film 62 may be laminated or cross-laminated, and a coating layer may be formed to produce a display film using a silicon laminate.

The first film 61 and the second film 62 are similar to the first silicon layer forming step S1 described above except that the first film 61 is formed of the first silicon 11, To the conveyor 50 and the second film 62 emits the second silicon 12 onto the conveyor 50.

Therefore, the method of forming the first film 61 shown in 501 and the method of forming the second film 62 shown in 502 are not greatly different from each other in the drawing.

The method of manufacturing the first film 61 and the method of manufacturing the second film 62 may be the same or different depending on the thickness of the first film 61 or the second film 62 or the thickness of the first silicon 11 or the second silicon 12 The drying times 41 and 42 and the pressing forces of the rolling rollers 51 and 52 may be different depending on the physical properties such as the viscosity and the density of the rollers 51 and 52, ) May be added or deleted.

6 is a view showing a laminate of a first film 61 and a second film 62 according to another embodiment 4 (601) and the embodiment 5 (602) of the method for producing a display film using a silicon laminate according to the present invention (Silicon film forming step), and Example 4 (601) or Example 5 (602) shows a method of forming a silicon film through the first film 61 and the second film 62 to form a display film 60 using a silicon laminate.

More specifically, the first film 61 made of the first silicon previously produced and the second film 62 made of the second silicon are pressed through the fourth rolling roller 54 and joined together with one silicon film do.

The first film 61 and the second film 62 are sprayed with an adhesive 14 or a primer through the fourth injection nozzle 24 between the first film 61 and the second film 62, The first film 61 and the second film 62 may be laminated or a plurality of the first films 61 and the second films 62 may be cross- It is possible.

For example, a second film 62 is laminated on the lower surface of one first film 61, and another second film is laminated on the upper surface of the first film 61, A plurality of first films and a plurality of second films may be laminated in such a manner that another first film is laminated on the upper surface of the second film to form a single silicon film.

As described above, the ITO coating layer may be formed by spraying the liquid ITO solution 13 onto the upper part of the silicon film produced by stacking the plurality of first films and the second film, through the third injection nozzle 23, The upper surface of the ITO coating layer is scratched by a coater (not shown) so that the ITO coating layer has a predetermined thickness, or the upper and lower surfaces are pressed through a rolling roller (not shown) so that the ITO coating layer becomes thinner It is possible.

After the formation of the ITO coating layer is completed, the production of the display film 60 using the silicon lamination is completed, or forced drying is performed through the fifth drier 45 after the ITO coating layer is formed as shown in 602 It is possible.

However, in Embodiment 5 shown in Examples 4 and 602 shown in 601, there is no difference in the process except for the presence or absence of the drying step.

In other words, the fourth embodiment shown in FIG. 5 and FIG. 6, 601, is the same as the first film formed through the first film forming step described with reference to 501 of FIG. 5 and the second film forming step described with reference to FIG. An ITO coating step (optional) in which a silicon film is formed through a step of forming a silicon film by cross-laminating the second film at least once or more, or an ITO coating layer is formed on one surface of the silicon film .

5 and 602 in FIG. 5, the first film produced through the first film forming step described with reference to 501 of FIG. 5 and the second film forming step described with reference to FIG. 5 An ITO coating step (optional) for forming an ITO coating layer on one side of the silicon film, and a step of forming a second film on the first side of the ITO coating step And a drying step of performing forced drying through the dryer (45).

In addition, the fifth dryer 45 may be a thermal drying method for applying a predetermined heat for a predetermined time or a drying method using UV, and drying may be performed through one of a thermal drying method and a UV drying method , Drying may be performed using both the thermal drying method and the UV drying method.

In addition, the drying temperature is preferably gradually increased from a normal temperature, so that cracks do not occur due to a rapid temperature change.

For example, it may be dried at room temperature for 5 minutes, dried at 50 ° C for 3 minutes, and then dried at 90 ° C for 7 minutes.

In addition, it is preferable to dry at a temperature within a range of from room temperature to a temperature within a maximum of 10 minutes, but the temperature and time may vary depending on the thickness of the product.

In addition, the fourth embodiment or the fifth embodiment described above is summarized as follows, and it is divided into the embodiment 4 and the embodiment 5 according to the operation (4-1) of the drying step.

However, the first film and the second film use a previously produced film, and the manufacturing method thereof may be different.

- Example 4 or Example 5

1. A first film is formed by spraying a liquid first silicone through a first injection nozzle on top of a conveyor (50) for the production and transport of a film.

2. A second film of liquid is formed by spraying a liquid second silicone through a second spray nozzle onto the top of a conveyor 50 for the production and transport of the film.

3. An adhesive (14) is applied between the first film and the second film and laminated with one silicone film.

4. An ITO coating layer is formed by spraying a liquid ITO solution 13 onto the silicon film through a third injection nozzle 23.

4-1. The adhesive disposed between the first film and the second film and the ITO coating layer are cured through a fifth dryer (45).

In addition, the manufacturing method according to the above-described first to fifth embodiments is characterized in that each layer is formed so that a plurality of first silicon layers (first film) and a second silicon layer (second film) It may be repeated.

For example, 1 to 2-1 sections may be repeated in the first embodiment.

Example of cross-lamination of Example 1

1. A first silicon layer is formed by spraying a liquid first silicone through a first injection nozzle on top of a conveyor 50 for the production and transport of a film.

1-1. And adjusting the thickness of the first silicon layer through the first coater and the first rolling roller.

2. A second silicon layer is formed by spraying a second silicon liquid in the form of a liquid onto a top of the first silicon layer through a second injection nozzle.

2-1. And adjusting the thickness of the second silicon layer through the second coater and the second rolling roller.

3. Repeat steps 1 to 2-1 5 times to form a silicon film.

4. An ITO coating layer is formed by spraying a liquid ITO solution 13 onto the silicon film through a third injection nozzle 23.

7 shows a display film using a silicon laminate according to the present invention, and is a cross section of a display film using a silicon laminate manufactured by the manufacturing method according to the above-described first to fifth embodiments.

More specifically, as shown in 701, a film for display using a silicon lamination layer comprises a first silicon layer 1 made of a first silicon, a second silicon layer 2 made of a second silicon, In other words, it may be expressed as a silicon film (3) composed of the first silicon layer (1) and the second silicon layer (2).

Further, it may further comprise an ITO coating layer 4 composed of ITO.

Also, as shown in 702, the display film using the silicon lamination may have a structure in which a plurality of first silicon layers 1 and second silicon layers 2 are cross-laminated, or an ITO coating layer 4 made of ITO is formed on one surface, May be further included.

As a preferred embodiment, a plurality of first silicon layers (1) and second silicon layers (1) and (2) are stacked as compared to a silicon film (a film for display using a silicon laminate) in which one first silicon layer A silicon film (a film for display using a silicon laminate) further comprising a silicon film 3 in which the silicon layer 2 is cross-laminated or an ITO coating layer 4 composed of ITO on one surface thereof is formed of a plurality of first silicon films And the second silicon are cross-laminated, it is preferable to have the highest hardness and flexibility.

More specifically, it may not be broken by the flexible silicon having one side in contact with the silicon having the high hardness, and the display film using the silicon lamination by the silicon having the high hardness may have high hardness.

That is, the brittleness of silicon having a high hardness can be complemented by the ductility of the flexible silicone tangent to one side.

The order of the first silicon layer, the second silicon layer, and the ITO coating layer may be changed, but the first silicon layer and the second silicon layer are alternately laminated.

8 shows a sixth embodiment using a polyimide film in a manufacturing method of a display film using a silicon laminate according to the present invention. A first silicon layer is formed on one surface of a polyimide film 65, The mid-film 65 is reversed and then a plurality of first silicon layers and second silicon layers are alternately laminated on the other surface of the polyimide film 65, or an ITO coating layer is formed on one surface thereof, The film 60 for use can be produced.

Further, this embodiment is similar to the above-described first embodiment, except that the polyimide film 65 is further included, and the formation of the first silicon layer proceeds once more.

More specifically, the first silicon layer forming step S1 forms a first silicon layer by spraying a liquid first silicon 11 on one side of the polyimide film 65 through the first injection nozzle 2a, The first silicon layer is scraped off by the first coater 31 so that the first silicon layer has a predetermined thickness and the first silicon layer is scraped off by the first rollers The upper surface and the lower surface are pressed so that the layer becomes thinner.

The first silicon 11 of liquid phase is injected onto the other surface of the polyimide film 65 after the first polyimide film 65 having the first silicon layer formed on the first surface thereof is turned over 81, The first silicon layer is scratched by the first coater 31 so that the first silicon layer has a predetermined thickness, and the first silicon layer is scratched by the first roller 31 The first silicon layer is pressed to the upper surface and the lower surface through a thinner thickness.

After the first silicon layer forming step S1 is completed, the silicon film forming step S2 and the ITO coating step S4 are the same as those of the first embodiment.

Further, as in the first embodiment, the plurality of coaters 31, 32, and 33 and the rolling roller (not shown) may be eliminated during the manufacturing process, or only a part (one or more of the plurality of coaters and rolling rollers) have.

The drying step may be performed in the same manner as in Example 2 or Example 3, but the drying temperature, drying time, and the like may be different.

The sixth embodiment described above is summarized as follows.

- Example 6

1. The first silicon layer 11 is sprayed on one surface of the polyimide film 65 through the first spray nozzle 21 to form a first silicon layer and then inverted.

2. A first silicon layer 11 of liquid phase is sprayed on the other surface of the polyimide film 65 through the first injection nozzle 21 to form a first silicon layer.

3. The second silicon layer 12 is formed by spraying the second silicon 12 in the form of liquid through the second injection nozzle 22 onto the first silicon layer.

4. An ITO coating layer is formed by spraying a liquid ITO solution (13) onto the second silicon layer through the third spray nozzle (23).

9 shows another embodiment 7 using a polyimide film in a method of manufacturing a display film using a silicon laminate according to the present invention. The first film 61 previously formed on one surface of the polyimide film 65, And a plurality of first films 61 and second films 62 previously formed on the other surface of the polyimide film 65 are cross-laminated and joined together to form a display film 60 using silicon lamination. . ≪ / RTI >

In addition, this embodiment is similar to the above-described Embodiment 4 or Embodiment 5 except that the first film, the second film and the ITO coating layer are laminated on the other surface of the polyimide film having the first film on one surface thereof.

More specifically, the first film 61 made of the first silicone, previously prepared on both sides of the polyimide film 65, is pressed and lipped through the fifth rolling roller 55, and then the first film 61, A second film 62 composed of a second silicon previously formed on the upper surface of the first roll 62 is pressed through a sixth rolling roller 56 to be joined to a single silicon film and a polyimide film 65 and a first The first film 61 made of silicon and the second film 62 made of the second silicon may be pressed together through one rolling roller so as to form one silicon film at a time.

Further, an adhesive or a primer is sprayed between the first polyimide film 65 and the first film including the first polyimide film 65 and the second film through the fourth injection nozzle 24, The first film 61 and the second film 62 may be laminated or a plurality of first films and second films may be laminated alternately.

For example, a first film 61 is attached to both sides of one polyimide film 65, one second film 62 is laminated on one of the first films 61, The other first film is laminated on the upper surface of one second film 62 and the other second film is laminated on the upper surface of the other one of the first films 62, A plurality of first films and second films may be laminated to form a single silicon film.

Alternatively, after the first film is attached to one side of the polyimide film 65, the first film and the second film may be cross-laminated on the other side of the polyimide film 65.

As described above, the ITO coating layer may be formed by spraying the liquid ITO solution 13 on the upper surface of the stacked silicon film through the third injection nozzle 23, or an ITO film (not shown) may be attached.

Further, as in Example 4 or Example 5, it may further include a dryer (drying step) including a coater (not shown) and a rolling roller (not shown).

However, the pressing force, the drying time, and the drying temperature of the rolling roller including the position of the coater may be different.

The above-described seventh embodiment will be summarized as follows.

However, the first film 61 and the second film 62 use a previously produced film, and the manufacturing method thereof may be different.

- Example 7

1. A first film is formed by spraying a liquid first silicone through a first injection nozzle on top of a conveyor (50) for the production and transport of a film.

2. A second film of liquid is formed by spraying a liquid second silicone through a second spray nozzle onto the top of a conveyor 50 for the production and transport of the film.

3. The first film is attached to one side of the polyimide film using an adhesive, and then pressed through a rolling roller.

4. The first film and the second film are alternately laminated on the other surface of the polyimide film using an adhesive, and then pressed together through a rolling roller to form a single silicone film.

5. An ITO coating layer is formed by spraying a liquid ITO solution onto the silicon film through a third injection nozzle.

10 is a view showing another embodiment of a display film using a silicon laminate according to the present invention and shows a cross section of a display film using the silicon laminate manufactured by the manufacturing method according to the above described sixth embodiment or seventh embodiment to be.

More specifically, as shown in 1001, a first silicon layer 1 made of a first silicon is disposed on both sides of a polyimide film 65 and the polyimide film 65, and the first silicon layer 1 Or a second silicon layer 2 composed of a second silicon is formed on the upper surface of the first silicon layer 2 or an ITO coating layer 4 composed of ITO.

In other words, it may be expressed as one silicon film 3 composed of the polyimide film 65, the first silicon layer 1, and the second silicon layer 2.

In addition, as shown in 1002, a display film using a silicon lamination layer is formed by forming a first silicon layer 1 on one surface of one polyimide film 65 and then a plurality of first silicon layers 1 and The second silicon layer 2 may be alternately layered or the ITO coating layer 4 may be composed of ITO after the first silicon layer 1 and the second silicon layer 2 are cross- have.

As a preferred embodiment, the polyimide film 65 uses a highly transparent polyimide film for use in a display device, and after forming the first silicon layer 1 on one side of one polyimide film 65, The first silicon layer 1 and the second silicon layer 1 are cross-deposited on the first silicon layer 1 and then an ITO coating layer 4 composed of ITO is formed on one surface thereof.

Therefore, the display film using the silicon laminate as described above has a plurality of first silicon layers 1 and second silicon layers 2 having different characteristics and is further stacked, and further includes the polyimide film 65 The first silicon layer (1) and the second silicon layer (2), which have different characteristics, have a greater effect of being flexible with high hardness.

The order of the polyimide film, the first silicon layer, the second silicon layer, and the ITO coating layer may be changed, but the first silicon layer and the second silicon layer are alternately laminated.

11 shows another embodiment of a film for display using a silicon laminate according to the present invention, wherein a second silicon layer 2 is first formed and then a first silicon A second silicon layer 2 is formed on the upper surface of the ITO coating layer 4 and a plurality of pieces of the silicon oxide layer 4 are formed on the ITO coating layer 4 when the layer (hereinafter referred to as the first silicon engraving layer 5) (Hereinafter referred to as a first silicon engraving layer 5) may be formed.

A plurality of divided first silicon engraving layers 5 formed on one surface of the second silicon layer 2 has a predetermined size (length B of one side) and has a plurality of They are arranged in the form of rows and columns.

In addition, the predetermined size (B) above will be described as a length of one side in the following description method of the size.

Although it is possible to form the second silicon layer on the upper surface of the first silicon layer in the same manner as the above-described manufacturing method and the embodiment described above, the first silicon sculpture layer 5 may be formed in the form of covering the two silicon layers 2 It is preferable to form the first silicon engraving layer 5 more than the two silicon layers 2 when the first silicon layer is formed of the plurality of first silicon engraving layers 5. [

The shape of the plurality of second silicon layers 2 may be circular, polygonal, or other shapes other than the illustrated square, or may be coated using a mask having a plurality of holes formed in a desired shape, or a method of coating another portion But it is most preferable to use a mask.

Also, in the case of a method of producing a silicon film by laminating the first film and the second film on the above, in order to manufacture the first silicon, the first silicon is arranged in a form having a predetermined gap A at a predetermined size (B) 1 film is preferably made in such a form that the second silicon covers the first silicon engraving layer 5 having a predetermined gap A with a predetermined size B. [

As described above, when a plurality of first silicon engraving layers 5 having a predetermined shape and spaced apart from each other by a predetermined distance are provided, a plurality of first silicon engraving layers 5 having a length B of 1 to 2000 μm, A plurality of first silicon engraving layers 5 having a length B of 1 to 500 mu m may be arranged at a distance of 1 to 200 mu m apart from the silicon engraving layer 5, And the distance A of 50 mu m is arranged in a spaced apart form is most preferable because it can have the most efficient hardness and flexibility.

Also, as shown in 1102, one second silicon layer 2 is formed on one surface of one first silicon piece layer 5 to form a silicon film, or a silicon film including the ITO coating layer 4 Lt; / RTI >

The first silicon piece layer 5a is formed on one surface of the second silicon layer 2a as shown in 1103 and then the second silicon layer 2a and the first silicon piece layer 5a are formed on the other surface of the second silicon layer 2a, A plurality of first silicon engraving layers 5a, 5b, and 5c are stacked in the form of covering the silicon layer 2b and the other first silicon engraving layer 5b is formed on the upper surface of the other second silicon layer 2b, 5c, 5d, ... and a plurality of second silicon layers 2a, 2b, 2c, 2d,.

Further, the silicon film composed of the first silicon engraved layer and the second silicon layer shown in 1102 or 1103 may further include an ITO coating layer 4 on one side or an ITO coating film.

The silicon film having the first silicon engraving layer 2 in the form of a plurality of pieces as described above may have a void space between a plurality of pieces or a more flexible characteristic through a flexible second silicon layer between a plurality of pieces Lt; / RTI >

In addition, the order of the first silicon layer, the second silicon layer, and the ITO coating layer may be changed, but the first silicon layer and the second silicon layer are alternately stacked.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art without departing from the scope of the present invention. The scope of the invention should therefore be construed in light of the claims set forth to cover many of such variations.

1: first silicon layer 2: second silicon layer
3: Silicon film 4: ITO coating layer
6: Film
11: first silicon 12: second silicon
13: ITO solution 14: Adhesive
21: first injection nozzle 22: second injection nozzle
23: third injection nozzle 24: fourth injection nozzle
31: first coater 32: second coater
33: Third Coater
41: first dryer 42: second dryer
43: Third dryer 44: Fourth dryer
45: the fifth dryer
51: first rolling roller 52: second rolling roller
53: third rolling roller 54: fourth rolling roller
55: fifth rolling roller 56: sixth rolling roller
60: Display film using silicone lamination
65: polyimide film
80: glass panel

Claims (14)

A first silicon layer forming step of forming a film-like first silicon layer with the first silicon;
A second silicon layer forming step of forming a film-shaped second silicon layer on one side of the first silicon layer by coating a second silicon having a lower hardness and a higher flexibility than the first silicon layer,
Wherein the first silicon layer is a silicon layer having a hardness of a pencil hardness of 7H to 9H,
Wherein the second silicon layer is a silicon layer having a Shore hardness of 50 to 90, a tensile strength of 4 to 8 Mpa, and an elongation of 200 to 500%
The forming of the first silicon layer is performed by injecting a first silicon liquid in the form of liquid through a first injection nozzle on the conveyor, adjusting the thickness of the first silicon layer through the first coater and the first rolling roller,
The second silicon layer forming step may include forming a second silicon layer on the one surface of the first silicon layer by spraying the second silicon through a second spray nozzle, Is adjusted
(Method for manufacturing display film using silicon lamination).
The method according to claim 1,
Forming a first silicon layer and a second silicon layer such that a first silicon layer and a second silicon layer are alternately stacked on one side of the silicon film composed of the first silicon layer and the second silicon layer after the second silicon layer forming step Further comprising the step of repeating the steps
(Method for manufacturing display film using silicon lamination).
A first silicon layer forming step of forming a film-like first silicon layer on the first surface of the transparent polyimide film with the first silicon;
A second silicon layer forming step of forming a film-shaped second silicon layer on one side of the first silicon layer by coating a second silicon having a lower hardness and a higher flexibility than the first silicon layer,
Wherein the first silicon layer is a silicon layer having a hardness of a pencil hardness of 7H to 9H,
Wherein the second silicon layer is a silicon layer having a Shore hardness of 50 to 90, a tensile strength of 4 to 8 Mpa, and an elongation of 200 to 500%
The forming of the first silicon layer is performed by injecting a first silicon liquid in the form of liquid through a first injection nozzle on the conveyor, adjusting the thickness of the first silicon layer through the first coater and the first rolling roller,
The second silicon layer forming step may include forming a second silicon layer on the one surface of the first silicon layer by spraying the second silicon through a second spray nozzle, Is adjusted
(Method for manufacturing display film using silicon lamination).
delete 4. The method according to any one of claims 1 to 3,
Further comprising at least one or more times of a drying step of dry-curing the silicon before or after the step of forming the second silicon layer
(Method for manufacturing display film using silicon lamination).
4. The method according to any one of claims 1 to 3,
And an ITO coating step of forming an ITO coating layer by coating ITO on one side of the silicon film after the second silicon layer forming step
(Method for manufacturing display film using silicon lamination).
A first silicon layer in the form of a film made of transparent first silicon;
A second silicon layer in the form of a film composed of a second silicon having a lower hardness and a higher flexibility than the first silicon;
And a silicon film in which the first silicon layer and the second silicon layer are cross-laminated at least once,
Wherein the first silicon layer is a silicon layer having a hardness of a pencil hardness of 7H to 9H,
Wherein the second silicon layer is a silicon layer having a Shore hardness of 50 to 90, a tensile strength of 4 to 8 Mpa, and an elongation of 200 to 500%
Wherein the first silicon layer has a thickness of 1 to 300 mu m through the first coater and the first rolling roller,
And the second silicon layer has a thickness of 1 to 300 mu m through the second coater and the second rolling roller
Display film using silicon lamination.
A film-shaped transparent polyimide film;
A first silicon layer in the form of a film made of transparent first silicon;
A second silicon layer in the form of a film composed of a second silicon having a lower hardness and a higher flexibility than the first silicon;
And a silicon film in which the first silicon layer is coated on one side of the polyimide film and the first silicon layer and the second silicon layer are alternately laminated at least one time on the other side,
Wherein the first silicon layer is a silicon layer having a hardness of a pencil hardness of 7H to 9H,
Wherein the second silicon layer is a silicon layer having a Shore hardness of 50 to 90, a tensile strength of 4 to 8 Mpa, and an elongation of 200 to 500%
Wherein the first silicon layer has a thickness of 1 to 300 mu m through the first coater and the first rolling roller,
And the second silicon layer has a thickness of 1 to 300 mu m through the second coater and the second rolling roller
Display film using silicon lamination.
delete delete A first silicon sculpture layer in which a plurality of first silicon pieces composed of transparent first silicon are arranged in a predetermined size and in a predetermined interval;
A second silicon layer made of a second silicon having a lower hardness and a higher flexibility than a first silicon formed on one surface of the first silicon chip layer;
And a silicon film in which the first silicon engraving layer and the second silicon layer are cross-laminated at least once
Display film using silicon lamination.
The method of claim 7, 8, or 11,
And an ITO coating layer formed by coating ITO on one surface of the silicon film
Display film using silicon lamination.
12. The method of claim 11,
Wherein the first silicon engraving layer has a length of 1 to 500 탆 and is arranged at an interval of 1 to 50 탆
Display film using silicon lamination.
The method of claim 7, 8, or 11,
Wherein the silicon film has a thickness of 2 to 600 mu m
Display film using silicon lamination.

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