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KR101421548B1 - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
KR101421548B1
KR101421548B1 KR1020130042276A KR20130042276A KR101421548B1 KR 101421548 B1 KR101421548 B1 KR 101421548B1 KR 1020130042276 A KR1020130042276 A KR 1020130042276A KR 20130042276 A KR20130042276 A KR 20130042276A KR 101421548 B1 KR101421548 B1 KR 101421548B1
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KR
South Korea
Prior art keywords
unit
substrate
processing
space
cassette
Prior art date
Application number
KR1020130042276A
Other languages
Korean (ko)
Inventor
이승훈
박지호
모성원
정석준
최문섭
김태훈
이전근
이현재
장항
임율규
김혜진
송진영
Original Assignee
주식회사 제우스
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Priority to KR1020130042276A priority Critical patent/KR101421548B1/en
Application granted granted Critical
Publication of KR101421548B1 publication Critical patent/KR101421548B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67793—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with orientating and positioning by means of a vibratory bowl or track

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Robotics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A substrate processing device is disclosed. The disclosed substrate processing device comprises a cassette unit having a cassette part which a substrate is separated from and stacked on; and a transfer unit to transfer the substrate or the cassette unit; and a processing unit to process the substrate. The processing unit includes a processing chamber unit having a processing space in which the substrate is accommodated; a nozzle chamber unit in which an accommodation space communicated with the processing space is included; a communication unit in which a communication space for communicating the processing space with the accommodation space; and a communication opening/closing unit for opening/closing the communication space; a processing transfer unit formed in the processing space to slide or rotate the substrate; and a cluster generation unit formed in the accommodation space to convert a process gas into a gas cluster type to be supplied.

Description

[0001] SUBSTRATE PROCESSING DEVICE [0002]

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of minimizing the contact of a processing surface of a substrate during transfer of a substrate and shortening a processing time of the substrate.

2. Description of the Related Art [0002] In recent years, various flat panel display devices (FPD, Flat Panel Display) such as a liquid crystal device (LCD) and a plasma display panel (PDP) Display) is made by attaching two glass substrates together.

Flat panel displays have been continuously studied, and some have already been used as display devices in various devices. Among these display devices, LCDs are mostly used in place of CRTs (Cathode Ray Tube) for the purpose of a portable type image display device because of their excellent image quality, light weight, thinness and low power consumption. And a monitor for receiving and displaying a broadcast signal and a monitor for a computer.

Here, as the display device, the work of raising the quality of the image has many aspects that are arranged with the above-described features and advantages. Therefore, in order for a liquid crystal display device to be used in various parts as a general screen display device, it can be said that the key to development is how much high-quality images such as high brightness and large area can be realized while maintaining the features of light weight, thinness and low power consumption have.

A related prior art is Korean Registered Patent No. 10-0687460 (registered on Feb. 21, 2007, entitled "Vacuum Sealer for Flat Panel Display Manufacturing Equipment").

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus capable of minimizing the contact of the processing surface of the substrate during the transfer of the substrate and shortening the processing time of the substrate.

A substrate processing apparatus according to the present invention includes: a cassette unit having a cassette unit on which a substrate is stacked; A transfer unit for transferring the substrate or the cassette part; And a processing unit for processing the substrate; Wherein the processing unit includes: a processing chamber portion including a processing space in which the substrate is accommodated; A nozzle chamber portion including a receiving space communicating with the processing space; A communication portion including a communication space for communicating the processing space and the accommodation space; A communication opening / closing unit for opening / closing the communication space; A processing unit provided in the processing space to slide the substrate or rotate the substrate; And a cluster generating unit provided in the accommodating space to convert the process gas into a gas cluster form and supply the gas cluster form; And a control unit.

Here, the processing chamber portion may include: a processing opening through which the substrate is transferred; And a process opening / closing unit for opening / closing the process opening; Is included.

Here, the processing transfer unit may include: a carrier unit for holding the substrate; A support bracket portion coupled to the carrier portion; And a rotation driving unit for rotating the support bracket unit; And a control unit.

Here, the processing transfer unit may include: a carrier unit for holding the substrate; A support bracket portion coupled to the carrier portion; And a sliding driving unit for slidingly moving the supporting bracket unit; And a control unit.

Here, the cluster generating unit may include: a process pumping unit for supplying the process gas; A process line unit connected to the process pumping unit to form a path for moving the process gas; And a nozzle unit connected to the process pumping unit to convert the process gas into a gas cluster form and discharge the gas cluster form; And a control unit.

Here, the cluster generating unit may include: a discharge reciprocating unit reciprocating the nozzle unit; And further comprising:

A decompression unit configured to decompress at least one of the processing space and the accommodation space; And further comprising:

Here, the depressurization portion may include at least one depressurization pumping portion for generating a suction force; A decompression line unit connecting at least one of the processing space and the accommodation space to the decompression pumping unit; And a decompression opening / closing unit for opening / closing the decompression line unit; And a control unit.

Here, the inversion unit inverts the substrate or the cassette unit; Further comprising:

Here, the transfer unit may include: a first transfer unit for transferring the substrate or the cassette unit stacked on the cassette unit; And a second transfer unit for transferring the substrate between the inverting unit and the processing unit; And a control unit.

The substrate processing apparatus according to the present invention minimizes the contact of the processing surface of the substrate during the transfer of the substrate and shortens the processing time of the substrate.

Further, the present invention can suppress or prevent line twist of the connection line passing through the inversion shaft portion when the substrate is inverted.

Further, the present invention can stably support and hold the substrate, and smoothly transfer or reverse the attracted substrate.

Further, the present invention can prevent the pattern printed on the substrate from being broken or deformed when the substrate is attracted and supported.

Further, the present invention improves the attraction force of the substrate, prevents the substrate from being separated in the process of transferring or reversing the substrate, and prevents breakage of the substrate.

Further, the present invention can stably maintain the flatness of the substrate when the substrate is transported or inverted.

Further, the present invention can prevent the outer shape of the substrate from being deformed when the substrate is sucked, and prevent the generation of unevenness (mura) on the surface of the substrate.

Further, the present invention facilitates the inversion of the substrate, prevents the protrusion of the substrate (oscillation of the substrate) transmitted to the inversion unit, and prevents breakage of the substrate due to the protrusion of the substrate.

Further, the present invention can prevent the twist of the connection line for connection with the inversion unit in the inversion operation of the substrate through the inversion unit.

Further, the present invention can prevent the detachment, detachment, separation, slacking, disconnection, peeling of the cover and the like of the connection line and prolong the service life of the connection line.

In addition, the present invention can solve the problem of cable breakage and prevent the detachment of the connection line from the cable bear.

1 is a view illustrating a substrate according to an embodiment of the present invention.
2 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention.
3 is a diagram illustrating a first modification of the inversion unit according to an embodiment of the present invention.
4 is a diagram illustrating a second modification of the inversion unit according to an embodiment of the present invention.
5 is a view showing a third modification of the inversion unit according to an embodiment of the present invention.
6 is a view showing a fourth modification of the inversion unit according to the embodiment of the present invention.
7 is a view showing a twist unit in an embodiment of the present invention.
8 is a view showing a modification of the twist unit in an embodiment of the present invention.
FIG. 9 is an exploded view showing the state of engagement of the torsional fixing unit in FIG.
10 is a perspective view showing a torsional socket unit according to an embodiment of the present invention.
11 is a diagram showing a processing unit according to an embodiment of the present invention.
12 is a view showing another feeding state of the substrate in the processing unit according to the embodiment of the present invention.
13 is a diagram showing a configuration of a carrier unit in a processing unit according to an embodiment of the present invention.

Hereinafter, an embodiment of a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation.

In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

Referring to FIG. 1, a substrate S is a plate processed in a substrate processing apparatus according to an embodiment of the present invention. The substrate S is a wafer or a glass substrate Lt; / RTI > Here, the processing surface S1 of the substrate S is processed in the substrate processing apparatus as one of both surfaces of the substrate S is formed into the processing surface S1.

The substrate processing apparatus according to an embodiment of the present invention may remove foreign matter from the processing surface S1 of the substrate S. In other words, the processing surface S1 of the substrate S can be cleaned.

2, a substrate processing apparatus according to an embodiment of the present invention includes a cassette unit 100, a transfer unit 200, And a processing unit 500, and may further include an inversion unit 300.

The substrate processing apparatus according to the embodiment of the present invention is configured such that a separate buffer section is omitted according to the configuration of the processing unit 500 and the processing time of the substrate S is reduced as the decompression space for processing the substrate S is reduced The processing state of the substrate S is improved, and the processing capability of the substrate S is increased, so that a large amount of the substrates S can be processed in a short time.

The cassette unit 100 is stacked with the substrates S spaced apart from each other.

The cassette unit 100 may include a cassette unit 120 and a cradle 110.

The cassette portion 120 is stacked with the substrate S being spaced apart. The holder 110 may have at least one cassette part 120 disposed therein. Here, the structure of the cassette part 120 is not limited, and the slot (the same configuration as the slot 322 of the inverted support part 320) spaced apart from each other so as to separate the substrate S through various known shapes (The same configuration as the seating groove portion 551-4 of the carrier portion 551) into which the edge of the substrate S is inserted can be formed.

A state in which the substrate S is loaded on the cassette unit 120 is referred to as a loading cassette unit 120 and a state in which the substrate S is not loaded on the cassette unit 120 is referred to as a raw cassette unit 120 .

The state in which the processing surface S1 of the substrate S is not processed by the processing unit 500 is represented by the raw substrate S and the processing surface S1 of the substrate S is processed by the processing unit 500. [ The state treated by the processing substrate S will be referred to as the processing substrate S. [

The transfer unit 200 carries the substrate S or the cassette part 120.

Here, the transfer unit 200 includes a first transfer unit 201 for transferring the substrate S or the cassette unit 120 between the cassette unit 100 and the reversal unit 300, a reversal unit 300, And a second transfer unit 202 for transferring the substrate S between the units 500. [

In the operation of the transfer unit 200 for processing the substrate S, the first transfer unit 201 carries a loading cassette part 120 on which a raw substrate or a raw substrate is loaded, and the second transfer unit 202 The raw substrate can be transported to the processing unit. At this time, the first transfer unit 201 can carry the raw cassette part to load the processing substrate.

In the operation of the transfer unit 200 for transferring the processed substrate, the first transfer unit 201 carries the process cassette unit 120 on which the process substrate S or the process substrate S is loaded, 2 transfer unit 202 can transfer the process substrate S to the inversion unit.

The transfer unit 200 may include an index arm 220 and a transfer driver 210.

The index arm 220 is supported by the substrate S to carry the substrate S. Here, the index arm 220 does not limit the support of the substrate S, but may hold the edge of the substrate S through various known types, support the lower side of the substrate S, And the substrate S is also attracted and supported.

The feed drive unit 210 can lift or move the index arm 220 horizontally. Here, the structure of the feed driving unit 210 is not limited, and the index arm 220 can be moved up or down horizontally through various known methods.

The inversion unit 300 inverts the substrate S or the cassette unit 120. [

FIG. 3 is a diagram illustrating a first modification of the inversion unit according to an embodiment of the present invention, and FIG. 4 is a diagram illustrating a second modification of the inversion unit according to an embodiment of the present invention.

Referring to FIGS. 3 and 4, the inversion unit 300 may reverse the cassette unit 120 in which a plurality of stacked substrates S or substrates S are stacked.

The inversion unit 300 includes an inversion support part 320 in which the substrate S is stacked or the cassette part 120 is held, an inversion axis part 330 fixed to the inversion support part 320, And an inversion driving unit 340 that rotates in at least one of the directions of the first and second directions.

The substrate S is laminated on the inversion support part 320 according to the first modification and the inversion support part 320 according to the second modification grasps the cassette part 120. [

A slot 322 in which the substrate S is seated is formed on the inverting support 320 so that the substrate S may be laminated. Here, a slot 322 in which the substrate S is mounted is provided with a reverse protrusion 321 or a groove into which the edge of the substrate S is inserted (the same configuration as the seating groove portion 551-4 of the carrier portion 551) Can be formed.

The reversal unit 300 can invert the substrate S by reversing the loaded substrate S or reversing the cassette unit 120. [

The inversion driving unit 340 rotates the inversion axis unit 330 in at least one of the forward direction and the reverse direction. The inverting driver 340 may be coupled to the inverting shaft 330 to rotate the inverting shaft 330.

The inversion driving part 340 may rotate the inversion shaft part 330 or the inversion supporting part 320 intermittently according to the rotation angle set for the inversion of the substrate S. [

For example, the inversion driving unit 340 may rotate the inversion axis unit 330 or the inversion support unit 320 by 90 degrees or 180 degrees. In addition, the inversion driving unit 340 may rotate the inversion axis unit 330 or the inversion support unit 320 by 90 degrees or 180 degrees in the forward and reverse directions, respectively.

Here, the inversion unit 300 may further include a substrate lifting unit 380.

The substrate lift portion 380 may be provided on the reverse support portion 320 to lift the substrate S stacked on the substrate S or the cassette portion 120 stacked on the reverse support portion 320.

The substrate lifting portion 380 includes a substrate supporting bracket portion 381 slidably coupled to the inversion supporting portion 320 and a substrate driving portion 382 for slidingly moving the substrate supporting bracket portion 381, And a substrate lifting protrusion 383 provided on the bracket portion 381 and on which the substrate S is mounted.

The substrate lifting protrusion 383 may be formed with a reversing protrusion 321 or a groove into which the edge of the substrate S is inserted (the same configuration as the seating groove 551-4 of the carrier 551).

As the substrate lifting unit 380 is driven, the substrate lifting and lowering protrusion 383 is raised and lowered to move the substrate S in the slot 322 formed in the inverting support unit 320 or in the slot 322 formed in the cassette unit 120 It is possible to prevent the substrate S from flowing in the process of reversing.

In addition, the inversion unit 300 may further include a substrate sliding portion 390. [

The substrate sliding part 390 is provided at one side of the inverting shaft part 330 to slide the inverting supporting part 320 in the longitudinal direction of the inverting shaft part 330. Then, the inverting support part 320 can stably grip the cassette part 120 to be transported.

FIG. 5 is a diagram illustrating a third modification of the inversion unit according to an embodiment of the present invention, and FIG. 6 is a diagram illustrating a fourth modification of the inversion unit according to an embodiment of the present invention.

Referring to FIGS. 5 and 6, the inversion unit 300 according to the third or fourth modification may invert the substrate into a sheet.

The inversion unit 300 can reverse the substrate S transferred through the transfer unit 200. [

The inversion unit 300 is connected to the inversion body 320 through the operation of the inversion driving unit 340 in a state where the inversion support unit 320 is rotatably coupled to the inversion body unit 310 and the inversion support unit 320 supports the substrate S, The substrate S may be reversed by rotating the substrate S in the forward and reverse directions.

Here, the inverting body part 310 supports the inverting shaft part 330, so that the inverting supporting part 320 can be rotatably coupled.

The inversion unit 300 includes an inversion support unit 320, an inversion axis unit 330 and an inversion drive unit 340 and includes a substrate alignment unit 350, an inversion confirmation unit 360, ). ≪ / RTI >

The inverting support 320 supports the substrate S. The inverted support portion 320 is provided with the inverted protruding portion 321 to minimize the contact area with the substrate S so that the substrate S can be supported.

When the substrate S is seated on the inverted protrusion 321 as the inverted protrusion 321 protrudes from the inverted supporter 320, the transfer unit 200 is stabilized between the inverted supporter 320 and the substrate S To be inserted.

For example, the inverted protrusion 321 can support the substrate in a state in which one side of the substrate S is in point contact or line contact.

As another example, the inverted protrusion 321 can hold the substrate S by suction. Here, the configuration of the inverted protrusion 321 is not limited, and the substrate S can be sucked and supported through various known types.

The inverting shaft portion 330 is fixed to the inverting support portion 320. The inverting shaft part 330 may be fixed to the lower part of the inverting supporting part 320 to indicate the center of rotation of the inverting supporting part 320.

The inversion driving unit 340 rotates the inversion axis unit 330 in at least one of the forward direction and the reverse direction. The inverting driver 340 may be coupled to the inverting shaft 330 to rotate the inverting shaft 330.

The inversion driving part 340 may rotate the inversion shaft part 330 or the inversion supporting part 320 intermittently according to the rotation angle set for the inversion of the substrate S. [

For example, the inversion driving unit 340 may rotate the inversion axis unit 330 or the inversion support unit 320 by 90 degrees or 180 degrees. In addition, the inversion driving unit 340 may rotate the inversion axis unit 330 or the inversion support unit 320 by 90 degrees or 180 degrees in the forward and reverse directions, respectively.

The substrate alignment unit 350 can position the substrate S at the inverting support 320 when the substrate S is mounted on the inverting support 320. [

The substrate alignment unit 350 can position the substrate S through various known three-axis motions. For example, the substrate alignment unit 350 can position the substrate S by moving the substrate S in three axial directions or adjusting the inclination of the substrate S.

The reversing unit 300 may include a displacement sensor 351 to sense the position of the substrate S in accordance with the operation of the substrate aligning unit 350 and to control the operation of the substrate aligning unit 350.

The reversal confirmation unit 360 can confirm or select the reversal state of the substrate S or the reversal support 320. [ For example, the reversal confirmation unit 360 may be a contact or non-contact type sensor for sensing the position of the reversal support 320, or may be a switch for selecting whether the reversal driver 340 operates.

The substrate S supported on the inverting support portion 320 can be stably inverted in accordance with the operation of the inverting confirmation portion 360 and the horizontal state of the substrate S can be maintained or confirmed before and after the substrate S is inverted .

Although not shown, the inverting unit 300 may further include an inverting elevating part (not shown) for moving the inverting supporting part 320 up and down. The inverting and elevating portion (not shown) can adjust the transfer position of the substrate S by moving the inverting support portion 320 up and down.

The eccentric support portion (370) supports the substrate (S) seated on the inverting support portion (320). The oscillating support unit 370 can prevent the oscillation of the substrate S transferred to the inverting support unit 320 by supporting the substrate S mounted on the inverting support unit 320. [

For example, when the substrate S supported on the transfer unit 200 is transferred to the transfer support 320, the transfer substrate 200 supports the substrate S placed on the transfer support 320, The substrate S can be prevented from swinging in the substrate holder 320 and the substrate S can be stably attracted and supported by the substrate holder 320. [

As another example, when transferring the inverted substrate S to the transfer unit 200, by supporting the substrate S that is seated on the inverting support portion 320, the oscillation of the substrate S separated from the inverting support portion 320 can be suppressed And the substrate S can be stably separated from the inversion support portion 320 and transferred to the transfer unit 200. [

The yaw support portion 370 includes a swing support portion 371 and a swing drive portion 373 and may further include at least one of a swing support protrusion 372 and a swing bracket portion 375. [

The swing supporting portion 371 is provided to face the inverting supporting portion 320 about the substrate S mounted on the inverting supporting portion 320. The swing support portion 371 is spaced apart from the inverting support portion 320 and is reciprocally movable toward the inverting support portion 320.

The swing drive unit 373 can reciprocate the swing support 371 toward the inverting support unit 320. [

The swing drive portion 373 may include a swing piston portion 374 and a swing reciprocating portion 376.

The swing piston portion 374 is engaged with the swing support portion 371, and the swing reciprocating portion 376 reciprocates the swing piston portion 374.

The swing support protrusion 372 is formed on the swing support 371 so as to support the substrate S to minimize the contact area with the substrate, thereby supporting the substrate.

When the substrate S is seated on the swing supporting protrusion 372 as the swing supporting protrusion 372 is protruded from the swing supporting portion 371, the transfer unit 200 is moved between the swing supporting portion 371 and the substrate S So that it can be stably inserted.

For example, the swing support protrusion 372 can support the substrate S in a state where one side of the substrate S is in point contact or line contact.

As another example, the swing support protrusion 372 can hold the substrate S by suction. Here, the structure of the swing supporting protrusion 372 is not limited, and the substrate S can be sucked and supported through various known shapes.

The swing bracket portion 375 supports the swing support portion 371 in a reciprocating manner. The swing bracket portion 375 connects the swing support portion 320 and the swing support portion 371 so that the swing support portion 371 is spaced from the inverting support portion 320 and the swing piston portion 374 can be coupled have.

The swing bracket part 375 may be provided with an inverting shaft part 330.

FIG. 7 is a view showing a twist unit in an embodiment of the present invention, FIG. 8 is a view showing a modification of the twist unit in an embodiment of the present invention, and FIG. 9 is a cross- FIG. 10 is a perspective view showing a torsional socket unit according to an embodiment of the present invention. FIG.

Referring to FIGS. 7 to 10, the twist unit 400 is provided in the inversion unit 300 to fix the connection line 450 for connection with the inversion unit 300. Here, the connection line 450 may include at least one of a cable for electrical connection and a fluid line for fluid movement.

The torsion unit 400 may suppress or prevent line twist of the connection line 450 and may omit the installation of cable bails for unifying the connection lines 450, The connection line 450 can be prevented from being detached or damaged by the cable bare.

The torsion unit 400 may further include a torsional penetration portion 410 and a torsional fixation portion 420 and may further include at least a torsion support portion 423 among the torsion support portion 423 and the torsion socket portion 425 .

The torsional penetration portion 410 is provided in the reversing unit 300 so that the connection line 450 is passed.

The torsional penetration portion 410 may include a first bracket portion 411, a second bracket portion 412, and a torsion bearing portion 413.

The first bracket part 411 forms a center of rotation when the substrate S supported by the inverting support part 320 is reversed. The first bracket part 411 is formed as a hollow body so that the connection line 450 is passed therethrough.

The second bracket part 412 is rotatably coupled to the first bracket part 411 according to the operation of the reversing unit 300. The second bracket portion 412 is formed as a hollow body so that the connection line 450 is passed therethrough.

Here, it is advantageous that the first bracket part 411 and the second bracket part 412 are formed to overlap each other.

The torsion bearing portion 413 rotatably supports the second bracket portion 412 between the first bracket portion 411 and the second bracket portion 412.

It is possible to prevent the connection line 450 from interfering with the inversion unit 300 when the substrate S is inverted according to the configuration of the twist unit 400. [

For example, the first bracket part 411 may be provided in the inverting shaft part 330 or the swing bracket part 375 in the reversing unit 300 and may be rotated in accordance with the reversing operation of the substrate S, The first bracket portion 412 does not interfere with the rotation of the first bracket portion 411.

The second bracket portion 412 may be provided in the inverting shaft portion 330 or the swing bracket portion 375 of the reversing unit 300 so as to be rotated in accordance with the reversing operation of the substrate S, The first bracket portion 412 does not interfere with the rotation of the first bracket portion 411.

The torsional fixing portions 420 are spaced apart from each other in the torsional penetration portion 410 to fix the connection line 450.

The torsional fixing part 420 includes a first fixing part 401 spaced apart from the torsional penetrating part 410 and fixing the connection line 450 at the side of the inverting unit 300, And a second fixing part 402 for fixing the connection line 450 at a position facing the first fixing part 401.

The first fixing part 401 may be fixed to the inverting support part 320 or the inverting shaft part 330 of the reversing unit 300 and the second fixing part 402 may be fixed to the reversing supporting part 320 320 or an inverting body part 310 for rotatably supporting the inverting shaft part 330. [

The connection line 450 may include a 180 degree or 360 degree twist between the first fixing part 401 and the second fixing part 402 in accordance with the normal rotation angle of the reversing unit 300 for reversing the substrate S. [ .

The connecting line 450 may be formed by twisting the first and second fixing units 401 and 402 in opposite directions from each other in accordance with the forward and reverse rotation angles of the reversing unit 300 for reversing the substrate S. [ .

Accordingly, the torsion of the connection line 450 becomes 180 degrees or 360 degrees, which is the normal and reverse rotation angles of the inversion unit 300, to a maximum of half such as 90 degrees or 180 degrees, so that the stress applied to the connection line 450 And extend the lifetime of the connection line 450. [0054]

For example, if the normal rotation angle of the reversing unit 300 is 180 degrees, the connection lines 450 may be linearly connected to the first fixing portion 401 and the second fixing portion 402 without twisting the connection line 450, And then operating the inversion unit 300, the connection line 450 can be twisted 180 degrees.

In this case, the twist angle of the connection line 450 may be twisted within a range of 0 to 180 degrees.

The connecting line 450 may have a center or torsional penetration portion 410 between the first fixing portion 401 and the second fixing portion 402 as a reference The connection line 450 is twisted by 90 degrees and fixed on the first fixing part 401 side and the connection line 450 is fixed by twisting by 90 degrees on the second fixing part 402 side, So that they are twisted in the directions opposite to each other on the side of the fixing portion 401 and the side of the second fixing portion 402. Accordingly, when the inversion unit 300 is operated, the connection line can be twisted within a range of 90 degrees in the forward direction from 90 degrees in the reverse direction.

In this case, the twist angle of the connection line 450 is reduced on the basis of the linear 0 degree of the connection line 450, thereby reducing the stress applied to the connection line 450 and extending the life of the connection line 450 .

The torsional fixation portion 420 may include a torsion collecting portion 421 and a torsional coupling portion 422.

The torsion collecting portion 421 combines the connecting lines 450 into a bundle. Here, the structure of the twist-gathering unit 421 is not limited, and the connecting lines 450 may be integrated into a bundle through various known structures.

The torsional coupling portion 422 fixes the torsion collecting portion 421. The torsional coupling portion 422 can fix the torsional combining portion 421 in the first fixing portion 401 to the inversion shaft portion 330 or the swing bracket portion 375 of the reversing unit 300. [ In addition, the twist coupling portion 422 can fix the twist-gathering portion 421 in the second fixing portion 402 so as to face the first fixing portion 401. The torsional coupling part 422 can fix the torsion collecting part 421 to the reversing body part 310 of the reversing unit 300 at the second fixing part 402. [

The torsion support portion 423 is provided in at least one of the torsional penetration portion 410 and the torsional fixing portion 420. The torsion support portion 423 may be provided with a torsion hole portion 424 into which the connection line 450 is inserted.

The torsion support portion 423 can prevent interference between the connection lines 450 and prevent mutual tangling of the connection lines 450 when the connection lines 450 are fixed, Can be easily found and the twist state of the connection line 450 can be easily confirmed.

The torsion socket portion 425 is inserted and supported by the connection line 450. The torsion socket portion 425 is inserted into the torsion hole portion 424, so that the connection line 450 can be stably supported. The torsion socket portion 425 can be stably inserted into the torsion hole portion 424 as the torsion support portion 423 is fixed to the torsion collecting portion 421 or the torsional penetration portion 410 and the connection line 450 Can be stabilized.

The torsion socket portion 425 may include a torsion body portion 426 and a torsion insertion portion 427 and may further include a torsional incision portion 428.

The torsion body portion 426 is inserted into the torsion hole portion 424.

The torsion inserting portion 427 is formed through the torsion body portion 426 and the connecting line 450 is inserted. The torsion inserting portion 427 may be formed in the longitudinal direction of the torsion body portion 426.

Here, the circumferential surface of the torsion body portion 426 is tapered so that the outer diameter thereof is reduced or increased. Therefore, when the torsion body portion 426 is inserted into the torsion hole portion 424, the diameter of the torsion insertion portion 427 is reduced And it is possible to prevent the connection line 450 from flowing in the torsion insertion portion 427.

At this time, the torsion hole portion 424 may be tapered corresponding to the circumferential surface of the torsion body portion 426.

The torsion cut portion 428 defines the torsion body portion 426 so that the circumferential surface of the torsion body portion 426 and the torsion insertion portion 427 communicate with each other. The torsional cut portion 428 may be formed to extend from the torsional insert portion 427 to the circumferential surface of the torsional body portion 426 to define the torsional body portion 426.

The torsion cutout portion 428 expands according to the insertion or detachment of the connection line 450 in which the connection is completed, so that the connection line 450 can be smoothly installed.

Although not shown, the torsional incision 428 is formed from the torsion hole portion 424 of the torsion support portion 423 toward the periphery of the torsion support portion 423 to facilitate the insertion of the connection line 450, ).

A plurality of inverting units 300 may be provided in the inverting body 310 along the elevation direction of the substrate S or the horizontal moving direction of the substrate S. [

For example, the reversal unit 300 includes a first reversal unit 301 for reversing the cassette unit 120 supplied from the cassette unit 100 or the substrate S supplied from the cassette unit 100, And a second inverting unit 302 for inverting the cassette unit 120 on which the substrate S discharged from the processing unit 500 or the substrate S discharged from the processing unit 500 is loaded.

The processing unit 500 processes the substrate S inverted through the inversion unit 300. At this time, the processing unit 500 can process the processing surface S1 of the substrate S as the processing gas is converted into a gas cluster form and supplied to the processing surface S1 of the substrate S.

The processing unit 500 may include a plurality of the processing units 500 and may simultaneously process a single raw substrate S to be transferred.

FIG. 11 is a view showing a processing unit according to an embodiment of the present invention, FIG. 12 is a view showing another transfer state of a substrate in a processing unit according to an embodiment of the present invention, and FIG. 1 is a diagram showing a configuration of a carrier portion in a processing unit according to an embodiment.

11 to 13, a processing unit 500 according to an embodiment of the present invention includes a processing chamber unit 510, a nozzle chamber unit 530, a communication unit 520, a communication switching unit 540 A processing transfer unit 550, and a cluster generating unit 560. [

The processing chamber portion 510 includes a processing space 511 for processing the substrate S. [

In the processing space 511, the substrate S can be horizontally received with respect to the bottom surface. At this time, the substrate S may be rotated or slid in the processing space 511.

Here, the processing chamber portion 510 may include the processing opening 512 and the processing opening / closing portion 513. [

The processing openings 512 allow the substrate S to enter and exit. The processing opening 512 is communicated with the processing space 511.

The processing openings 512 are not limited to the positions of the processing openings 512 so that the processing openings 512 are communicated with the processing space 511 from at least one of the side surface, the front surface, the back surface, .

The processing opening / closing unit 513 opens / closes the processing opening 512. When the processing opening portion 512 is closed by the processing opening / closing portion 513, the processing space 511 can be sealed.

The processing opening / closing unit 513 can open / close the processing opening 512 by various known sliding doors or hiding mechanisms.

The processing space 511 can receive the substrate S vertically with respect to the bottom surface. Further, the processing space 511 can move the accommodated substrate S in the height direction or rotate.

The nozzle chamber part 530 includes a receiving space 531 communicating with the processing space 511 via the communication part 520.

The accommodating space 531 accommodates the nozzle portion 563 of the cluster generating portion 560. One side of the nozzle chamber part 530 can be opened to allow the processing space 511 and the accommodation space 531 to communicate with each other.

The communication part 520 includes a communication space 521 for communicating the processing space 511 with the accommodation space 531. The communication space 521 forms a movement path of the process gas for processing the substrate S.

The communication part 520 is provided at least one of the front surface and the back surface of the processing chamber part 510 corresponding to the position of the nozzle chamber part 530 and is connected to the processing space 511 through the communication space 521, And the accommodation space 531 can communicate with each other.

Here, when the communication part 520 is provided so as to communicate with the processing space 511 at the front and back sides of the processing chamber part 510 and the nozzle chamber part 530 is provided in the communication part 520, Both sides of the substrate S can be processed simultaneously when the substrate S accommodated in the substrate 511 is moved. The nozzle chamber part 530 can be installed to face the processing chamber part 510 in correspondence with the processing surface S1 of the substrate S.

The communication opening / closing unit 540 opens / closes the communication space 521. The communication opening / closing part 540 can open / close the communication space 521 between the processing chamber part 510 and the nozzle chamber part 530. The processing space 511 and the accommodation space 531 can be sealed according to the closing operation of the communication opening / closing unit 540.

The communication opening and closing unit 540 can open and close the communication space 521 as sliding movement is performed in conjunction with the operation of the rotation driving unit 553 or the sliding driving unit 555 or the cluster generating unit 560.

For example, the communication switching unit 540 can be slidably moved between the processing chamber unit 510 and the nozzle chamber unit 530, and the communication switching unit 540 can be constructed of various known types of slot valves.

The processing transfer unit 550 may be provided in the processing space 511 to slide the substrate S or rotate the substrate S. [

For example, the processing transfer section 550 may include a carrier section 551, a support bracket section 552, and a rotation drive section 553. [

The carrier portion 551 holds the substrate S vertically or horizontally with respect to the bottom surface. Although not shown, a separate driving unit (not shown) for moving the substrate S may be provided in the carrier unit 551. [

The carrier part 551 can grip the substrate S with respect to the bottom surface through the substrate suction method, the substrate insertion method, the substrate clamping method, and the hybrid method.

The carrier part 551 according to the substrate adsorption system includes a clamping body part 551-1 corresponding to the substrate S and a suction part 551-2 provided on the clamping body part 551-1 to provide an attraction force, . ≪ / RTI > Here, the sucking portion 551-2 can elastically support the substrate S.

Then, the substrate S is attracted to and supported by the attracting portion 551-2, so that the substrate S can be stably fixed to the clamping body portion 551-1.

The carrier part 551 according to the substrate fitting type includes a clamping body part 551-1 corresponding to the substrate S and a seating part provided on the clamping body part 551-1, And a groove portion 551-4.

Then, the substrate S can be stably fixed to the clamping body portion 551-1 by fitting the substrate S into the seating groove portion 551-4.

The carrier portion 551 according to the substrate clamping method includes a clamping body portion 551-1 corresponding to the substrate S, a rotary shaft 551-6 provided on the clamping body portion 551-1, And a support rotation unit 551-8 rotatably mounted on the support shaft.

At this time, at least one of the clamping body portion 551-1 and the support rotation portion 551-8 may have a support pin portion 551-5 protruding to reduce the contact area with the substrate S. Here, the support pin portion 551-5 can elastically support the substrate S.

Then the substrate S is supplied to the clamping body portion 551-1 and then the substrate S is supported by the rotation of the support turning portion 551-8 so that the substrate S is clamped to the clamping body portion 551- 551-1.

The carrier part 551 according to the hybrid system has a suction part 551-2, a seating groove part 551-4, a rotation shaft 551-6, and a suction part 551-2 in a clamping body part 551-1 corresponding to the substrate S, At least two of the support rotating parts 551-8 may be included.

Then, the substrate S is supported according to the combined method, whereby the substrate S can be more stably fixed to the clamping body portion 551-1.

The support bracket portion 552 is engaged with the carrier portion 551. The support bracket portion 552 can be rotatably coupled to the processing chamber portion 510.

Here, the support bracket portion 552 is prevented from interfering with the closed state of the processing space 511 as it is rotated. At this time, the support bracket portion 552 is provided with the rotary airtight portion 554, so that the closed state of the processing space 511 can be stably maintained.

The rotation drive unit 553 rotates the support bracket unit 552.

The carrier S holding the substrate S is rotated by the operation of the rotation driving unit 553 so that the substrate S can be rotated in processing the substrate S. [

As another example, the processing transfer portion 550 may include a carrier portion 551, a support bracket portion 552, and a sliding drive portion 555.

The carrier portion 551 holds the substrate S and has the same configuration as that of the carrier portion 551 of one example, and a description thereof will be omitted.

The support bracket portion 552 is engaged with the carrier portion 551. The support bracket part 552 can be vertically coupled to the processing chamber part 510.

The support bracket portion 552 includes a first support bracket portion 552-1 coupled to the carrier portion 551 and a second support bracket portion 552-2 connected to the first support bracket portion 552-1 and passing through the process chamber portion 510 A second support bracket portion 552-22 slidably coupled to the process chamber portion 510 and a third support bracket portion 552-22 connecting the second support bracket portion 552-2 and the sliding drive portion 555 552-3).

Here, the second support bracket portion 552-2 is prevented from interfering with the closed state of the processing space 511 as the slide is moved.

The sliding driving unit 555 slides the supporting bracket unit 552. The sliding driving unit 555 can slide the support bracket unit 552 through various known driving units such as a motor, a cylinder, a pneumatic or hydraulic system, or the like.

The third supporting bracket part 552-3 of the supporting bracket part 552 may be coupled to the sliding driving part 555. [ The process transfer unit 550 in another example may further include a transfer bellows unit 556. [

The transfer bellows portion 556 is retractably coupled to the support bracket portion 552.

When the second support bracket portion 552-2 of the support bracket portion 552 is lifted and moved according to the operation of the sliding drive portion 555, the transfer bellows portion 556 moves the process chamber portion 510 and the second support bracket portion 552-2, It is possible to prevent the sealing force of the processing space 511 from being lowered by sealing between the portions 552-2.

In addition, the transfer bellows part 556 can stably maintain the reduced pressure state of the processing space 511 during the processing of the substrate S.

The cluster generating unit 560 is provided in the accommodating space 531 to convert the process gas into a gas cluster form and supply it.

The cluster generating unit 560 may include a process pumping unit 561, a process line unit 562, and a nozzle unit 563.

The process pumping section 561 supplies a process gas for processing the substrate S.

The process line portion 562 is connected to the process pumping portion 561 to form a path for the flow of the process gas.

The nozzle unit 563 is connected to the process line unit 562 to convert the process gas into a gas cluster form and discharge it.

The process pressure of the process gas discharged from the nozzle unit 563 can be set to be greater than 0.01 mTorr and less than 50 Torr.

Accordingly, the process gas discharged from the nozzle unit 563 can be easily supplied to the substrate S which is converted into the gas cluster form and moved up and down, and the surface of the substrate S can be stably treated.

However, when the process pressure is 0.01 mTorr or less, the process gas is difficult to be converted into the form of a complete gas cluster, and the process gas may be increased in speed and the processing operation of the substrate may become poor.

Also, if the process pressure is greater than 50 torr, the process gas may not be fully converted into a gas cluster form, excessive process gas input may result in damage to the pumping portion, and the effectiveness of substrate cleaning may be reduced.

Then, the process gas is supplied to the nozzle unit 563 via the process line unit 562 according to the operation of the process pumping unit 561, and is converted into a gas cluster form at the nozzle unit 563 and discharged.

The cluster generating unit 560 may further include at least one of the discharge reciprocating unit 564 and the heat exchanging unit 565.

The discharge reciprocating portion 564 reciprocates the nozzle portion 563.

The discharge reciprocating portion 564 includes a connecting line portion 564-1 and an outlet opening portion 564-2 and at least one of the discharge bellows portion 564-3 and the discharge bracket portion 564-4 As shown in FIG.

The connection line portion 564-1 connects the nozzle portion 563 and the process line portion 562 so that the process gas can move.

The connection line portion 564-1 may be formed through the nozzle chamber portion 530. [ The connecting line portion 564-1 can be reciprocated in the nozzle chamber portion 530 according to the operation of the outlet opening portion 564-2. Here, the connection line portion 564-1 is reciprocally moved so as not to interfere with the closed state of the accommodation space 531.

The outlet opening 564-2 reciprocates at least one of the connection line portion 564-1 and the nozzle portion 563. [

Then, the process gas is stably supplied to the nozzle unit 563, and at least one of the connecting line unit 564-1 and the nozzle unit 563 is reciprocally moved through the outlet driving unit 564-2, So that the transfer chamber 563 can be reciprocated toward the processing space 511 side.

The process gas can be stably supplied to the substrate in accordance with the reciprocating movement of the nozzle portion 563, and leakage of the process gas can be prevented.

The discharge bellows portion 564-3 is elastically coupled to the connection line portion 564-1.

The discharge bellows portion 564-3 is disposed between the nozzle chamber portion 530 and the connecting line portion 564-1 when the connecting line portion 564-1 reciprocates according to the operation of the discharging opening portion 564-2. It is possible to prevent the sealing force of the accommodation space 531 from being lowered.

In addition, the discharge bellows portion 564-3 can stably maintain the reduced pressure state of the accommodation space 531 during the processing of the substrate S.

The discharge bracket portion 564-4 fixes the discharge opening portion 564-2 to the nozzle chamber portion 530. [ The discharge bracket portion 564-4 can stabilize the operation of the discharge port portion 564-2 by fixing the discharge port portion 564-2.

The heat exchanging part 565 regulates the temperature of at least one of the accommodation space 531 and the nozzle part 563.

Particularly, the heat exchanging part 565 can adjust the temperature of at least one of the accommodation space 531 and the nozzle part 563 within a temperature range of minus 100 degrees or more and 25 degrees or less.

In addition, the heat exchanging unit 565 can adjust the temperature of at least one of the accommodation space 531 and the nozzle unit 563 within a temperature range of minus 75 degrees or more and 0 degrees or less.

Accordingly, the process gas can be stably converted into a gas cluster shape in the nozzle unit 563, and the distance between the nozzle unit 563 and the substrate S that is moved up and down can be easily adjusted.

However, when the adjustment temperature range is larger than the upper limit value, the process gas is hardly completely converted into the form of a gas cluster, the process pressure of the process gas in the nozzle portion 563 is increased with the expansion of the process gas, And the substrate S to be moved up and down.

Further, when the adjustment temperature range is lower than the lower limit value, the process gas is difficult to be completely converted into the form of a gas cluster, the process pressure of the process gas must be increased along with the condensation of the process gas, It is difficult to adjust the distance between the nozzle portion 563 and the nozzle portion 563 and the nozzle portion 563 may be freezing in the accommodation space 531 and the nozzle portion 563 may be clogged or broken by freezing.

For example, the heat exchanging part 565 may be constituted by a low temperature chiller. The heat exchanging part 565 adjusts the temperature of at least one of the accommodation space 531 and the nozzle part 563 so that the process gas in the form of a gas cluster can be stably discharged from the nozzle part 563. When carbon dioxide (CO2) is used as the process gas, the heat exchanging unit 565 can keep at least one of the accommodation space 531 and the nozzle unit 563 at minus 50 degrees.

The substrate processing apparatus according to an embodiment of the present invention may further include at least one of an airflow generating unit 570 and a depressurizing unit 580.

The airflow generating unit 570 supplies airflow gas to at least one of the processing space 511 and the accommodation space 531.

The airflow generating portion 570 may include an airflow pumping portion 571, an airflow line portion 572, and a diffuser portion 573.

The airflow pumping section 571 supplies the airflow gas to at least one of the processing space 511 and the accommodation space 531.

The airflow line portion 572 is connected to the airflow pumping portion 571 to form a flow path of the airflow gas.

The air flow line portion 572 may be formed through at least one of the processing chamber portion 510 and the nozzle chamber portion 530.

The diffuser portion 573 is connected to the airflow line portion 572 to discharge the airflow gas into at least one of the processing space 511 and the accommodation space 531.

The airflow is supplied to the diffuser portion 573 through the airflow line portion 572 in accordance with the operation of the airflow pumping portion 571. The airflow is supplied from the diffuser portion 573 to the processing space 511 It is possible to form an air flow in at least one of the receiving spaces 531.

Accordingly, by forming an airflow in at least one of the processing space 511 and the accommodating space 531 by the airflow generating unit 570, the residues generated in accordance with the processing of the substrate S in the processing space 511 It is possible to prevent the residues from adhering to the substrate S as well as to drop easily.

In addition, in the accommodation space 531, residues introduced from the process space 511 or foreign substances generated in the accommodation space 531 are easily dropped, and residue or foreign matter adheres to the nozzle unit 563 .

The decompression unit 580 decompresses at least one of the processing space 511 and the accommodation space 531. The processing conditions of the substrate S can be satisfied by forming a clean room in at least one of the processing space 511 and the accommodating space 531 according to the depressurizing operation of the depressurizing unit 580. [

The depressurizing portion 580 may include a depressurizing pumping portion 581, a depressurizing line portion 582, and a depressurizing opening / closing portion 583.

At least one of the reduced pressure pumping portions 581 generates a suction force.

The decompression line unit 582 connects at least one of the processing space 511 and the accommodation space 531 with the decompression pumping unit 581. The depressurizing line portion 582 can form a path of fluid movement by the suction force.

The decompression opening / closing unit 583 opens and closes the decompression line unit 582.

At least one of the processing space 511 and the accommodation space 531 can be depressurized by the suction force according to the operation of the reduced pressure pumping portion 581 and the suction force can be adjusted or adjusted through the opening and closing operation of the reduced pressure opening / The pressure reducing state of at least one of the space 511 and the accommodation space 531 can be adjusted.

For example, the depressurizing portion 580 can process the substrate S through the processing gas in the processing space 511 by depressurizing the processing space 511. The depressurizing portion 580 can be adjusted to the same or similar depressurized state corresponding to the processing space 511 by depressurizing the accommodating space 531 and discharged from the nozzle portion 563 accommodated in the accommodating space 531 It is possible to prevent foreign matter from being mixed into the process gas.

A clean room is formed in at least one of the processing space 511 and the accommodating space 531 in accordance with the depressurizing operation of the decompression unit 580 so that the residue or foreign matter Can be removed from the processing space 511 or the receiving space 531. [

The pressure of the processing space 511 can be adjusted through the linkage of the airflow generating unit 570 and the decompression unit 580 and the problems caused by the pressure difference can be prevented when the processing opening 512 is opened .

The processing body portion includes a processing chamber portion 510, a nozzle chamber portion 530, a communication portion 520, a communication opening and closing portion 540, a process transfer portion 550, and a cluster generating portion 560 in a fixed position .

For example, the treatment body portion may consist of a frame arranged longitudinally and laterally, so that each component can be stably placed and fixed in place.

In an embodiment of the present invention, the process gas may be composed of carbon dioxide (CO 2) as a gas for processing the substrate S, but the present invention is not limited thereto, and may include a nozzle unit 563 for processing the substrate S, In the form of a gas cluster.

The airflow gas is a gas supplied to at least one of the processing space 511 and the accommodation space 531. The airflow can form an air flow or drop a residue or a foreign matter and is composed of an inert gas such as nitrogen But it is not limited thereto and may be supplied to at least one of the processing space 511 and the accommodation space 531 to form an airflow or to drop residues or foreign matter.

When the cassette unit 120 is supplied to the cassette unit 100 in a state where the raw substrate S is loaded on the cassette unit 120, The raw substrate S or the loading cassette unit 120 is carried to the inversion unit 300 (which may be constituted by the first inversion unit 301).

In the reversing unit 300 (which may be constituted by the first reversing unit 301), the original substrate S or the stacking cassette unit 120 is reversed and the original substrate S is reversed through the second conveying unit 202, To the processing unit (500). Here, the first transfer unit 201 can transfer the original cassette unit 120 to the inversion unit 300 (which may be constituted by the second inversion unit 302).

After the processing surface S1 of the substrate S is processed in the processing unit 500, the second transfer unit 202 transfers the processed substrate S to the inversion unit 300 (constituted by the second inversion unit 302) ). ≪ / RTI >

In the reversing unit 300 (which may be constituted by the second reversing unit 302), the processing cassette unit 120 on which the processing substrate S or the processing substrate S is loaded is reversed and the first transfer unit 201 To the cassette unit 100, the processing of the substrate S can be completed.

According to the above-described substrate processing apparatus, it is possible to minimize the contact between the processing surface S1 of the substrate S and the processing time of the substrate S in the process of transferring the substrate S.

Further, the present invention can suppress or prevent line twist of the connection line 450 passing through the inversion shaft portion 330 when the substrate S is reversed.

Further, the present invention can stably support and hold the substrate (S), and smoothly transfer or invert the substrate (S) that has been attracted.

Further, the present invention can prevent the pattern printed on the substrate (S) from being damaged or deformed when the substrate (S) is attracted and supported.

In addition, the present invention improves the attraction force of the substrate S, prevents the substrate S from being separated in the process of transferring or reversing the substrate S, and prevents the substrate S from being damaged.

Further, the present invention can stably maintain the flatness of the substrate S when the substrate S is transferred or inverted.

Further, the present invention can prevent the outer shape of the substrate S from being deformed when the substrate S is adsorbed, and prevent the occurrence of unevenness (mura) on the surface of the substrate S.

The present invention also facilitates the inversion of the substrate S and prevents the protrusion of the substrate S (oscillation of the substrate S) transmitted to the inversion unit 300, It is possible to prevent the substrate S from being damaged by the substrate W.

In addition, the present invention can prevent the twist of the connection line 450 for connection with the inversion unit 300 in the inversion operation of the substrate S through the inversion unit 300.

In addition, the present invention can prevent detachment, separation, separation, sagging, disconnection, peeling of coating and the like of the connection line 450 and prolong the service life of the connection line 450.

In addition, the present invention solves the problem of cable breakage and prevents the connection line 450 from being detached from the cable bear.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. I will understand.

Accordingly, the true scope of protection of the present invention should be defined by the claims.

S: Substrate S1: Processed surface
100: cassette unit 110: cradle
120: cassette unit 200: conveying unit
201: first transfer unit 202: second transfer unit
210: feed drive unit 220: index arm
300: inverting unit 301: first inverting unit
302: second inversion unit 310: inverted body part
320: inverting support portion 321: inverted projection portion
322: Slot 330:
340: inverting driver 350: substrate aligning part
351: displacement sensor 360:
370: yaw divergent part 371: swing support part
372: a rocking support projection part 373: a rocking drive part
374: swing piston part 375: swing bracket part
376: oscillation reciprocating unit 380: substrate elevating unit
381: substrate supporting bracket part 382: substrate driving part
383: substrate lifting projection 390: substrate sliding portion
400: Torsion unit 410: Torsion penetration part
411: first bracket part 412: second bracket part
413: Torsion bearing part 420: Torsion fixing part
401: first fixing portion 402: second fixing portion
421: torsion collecting portion 422:
423: Torsion support portion 424:
425: Torsion socket portion 426: Torsion body portion
427: Torsion insertion part 428: Torsion incision part
450: connection line 500: processing unit
510: Processing chamber part 511: Processing space
512: process opening 513: process opening /
520: communication part 5212: communication space
530: nozzle chamber part 531: accommodation space
540: communication opening / closing unit 550:
551: Carrier part 551-1: Clamping body part
551-2: suction portion 551-4:
551-5: support pin portion 551-6:
551-8: support rotation part 552: support bracket part
522-1: first support bracket part 522-2: second support bracket part
522-3: third support bracket part 553: rotation drive part
554: rotating airtight portion 555: sliding driving portion
556: Feed bellows part 560: Cluster generating part
561: Process pumping section 562: Process line section
563: Nozzle part 564: Discharge reciprocating part
564-1: connection line portion 564-2:
564-3: Discharge bellows part 564-4: Discharge bracket part
565: heat exchanger 570: air flow generator
571: Air flow pumping section 572: Air flow line section
573: diffuser portion 580: pressure reducing portion
581: Reduced pressure pumping section 582: Reduced pressure line section
583: Decompression opening /

Claims (10)

A cassette unit having a cassette unit in which the substrates are stacked on each other;
A transfer unit for transferring the substrate or the cassette part; And
A processing unit for processing the substrate; / RTI >
The processing unit includes:
A processing chamber portion including a processing space in which the substrate is accommodated;
A nozzle chamber portion including a receiving space communicating with the processing space;
A communication portion including a communication space for communicating the processing space and the accommodation space;
A communication opening / closing unit for opening / closing the communication space;
A processing unit provided in the processing space to slide the substrate or rotate the substrate; And
A cluster generating unit provided in the accommodating space to convert the process gas into a gas cluster form and supply the process gas; The substrate processing apparatus comprising:
The method according to claim 1,
In the processing chamber portion,
A processing opening through which the substrate is transferred; And
A process opening / closing unit for opening / closing the process opening; The substrate processing apparatus comprising:
The method according to claim 1,
The processing-
A carrier portion holding the substrate;
A support bracket portion coupled to the carrier portion; And
A rotation driving unit for rotating the support bracket unit; The substrate processing apparatus comprising:
The method according to claim 1,
The processing-
A carrier portion holding the substrate;
A support bracket portion coupled to the carrier portion; And
A sliding driving unit for slidingly moving the supporting bracket unit; The substrate processing apparatus comprising:
The method according to claim 1,
Wherein the cluster generating unit comprises:
A process pumping unit for supplying the process gas;
A process line unit connected to the process pumping unit to form a path for moving the process gas; And
A nozzle unit connected to the process pumping unit to convert the process gas into a gas cluster form and discharge the process gas; The substrate processing apparatus comprising:
6. The method of claim 5,
Wherein the cluster generating unit comprises:
A discharge reciprocating unit reciprocating the nozzle unit; Wherein the substrate processing apparatus further comprises:
7. The method according to any one of claims 1 to 6,
A decompression unit that decompresses at least one of the processing space and the accommodation space; Wherein the substrate processing apparatus further comprises:
8. The method of claim 7,
The pressure-
At least one pressure reducing pumping unit generating a suction force;
A decompression line unit connecting at least one of the processing space and the accommodation space to the decompression pumping unit; And
A decompression opening / closing unit for opening / closing the decompression line unit; The substrate processing apparatus comprising:
7. The method according to any one of claims 1 to 6,
An inverting unit for inverting the substrate or the cassette unit; The substrate processing apparatus further comprising:
10. The method of claim 9,
The transfer unit
A first transfer unit for transferring the substrate or the cassette unit stacked on the cassette unit; And
A second transfer unit for transferring the substrate between the reversal unit and the processing unit; And the substrate processing apparatus further comprises:
KR1020130042276A 2013-04-17 2013-04-17 Substrate processing device KR101421548B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114007330A (en) * 2021-10-11 2022-02-01 星源电子科技(深圳)有限公司 Flexible printing device for flexible miniLED backlight module

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Publication number Priority date Publication date Assignee Title
KR20080061289A (en) * 2006-12-27 2008-07-02 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate processing method
JP2010255852A (en) 2009-04-18 2010-11-11 Igus Gmbh Multiaxial joint particularly for robot engineering, joint assembly, and kit for robot engineering
KR20120120975A (en) * 2010-03-09 2012-11-02 이와타니 산교 가부시키가이샤 Method for cleaning a substrate, and semiconductor manufacturing device

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Publication number Priority date Publication date Assignee Title
KR20080061289A (en) * 2006-12-27 2008-07-02 다이닛뽕스크린 세이조오 가부시키가이샤 Substrate processing apparatus and substrate processing method
JP2010255852A (en) 2009-04-18 2010-11-11 Igus Gmbh Multiaxial joint particularly for robot engineering, joint assembly, and kit for robot engineering
KR20120120975A (en) * 2010-03-09 2012-11-02 이와타니 산교 가부시키가이샤 Method for cleaning a substrate, and semiconductor manufacturing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114007330A (en) * 2021-10-11 2022-02-01 星源电子科技(深圳)有限公司 Flexible printing device for flexible miniLED backlight module
CN114007330B (en) * 2021-10-11 2024-01-05 星源电子科技(深圳)有限公司 Flexible printing device for flexible miniLED backlight module

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