KR101420309B1 - apparatus for inspecting printed circuit board - Google Patents

Abstract

In order to provide a printed circuit board inspection apparatus for automatically inspecting a board to be inspected, the present invention provides a printed circuit board inspection apparatus for automatically inspecting a board to be inspected, comprising: a loading and unloading unit for loading and unloading a board to be inspected from a magazine; A first substrate transferring unit for transferring the inspection target substrate, which has been brought into the one end portion by the carrying-in and carrying-out unit, to the other end; A second substrate transfer unit arranged in parallel with the side of the transfer unit for transferring the substrate to be inspected to the other end by the transfer unit and the transfer unit to the other end; A first color imaging unit for color-scanning each of the substrates to be inspected, the first substrate being moved horizontally selectively to an upper portion of one of the transfer unit and the second substrate, And a first mono imaging unit for carrying the monochromatic scanning while transferring the color-scanned inspected substrate by transferring the first substrate and the second substrate from the transfer unit, wherein the first mono imaging unit includes a first substrate transfer unit, The transfer unit is disposed in parallel to each other to transfer the inspection target substrate alternately and the first color image sensing unit is selectively arranged so as to pick up each inspection target substrate that has been conveyed by the first substrate and the second substrate, The present invention also provides a printed circuit board inspecting apparatus comprising:

Description

[0001] Apparatus for inspecting printed circuit boards [

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board inspection apparatus, and more particularly, to a printed circuit board inspection apparatus for automatically inspecting a substrate to be inspected.

BACKGROUND ART In general, a printed circuit board (PCB) is a device for arranging electronic components such as semiconductor chips, resistors, capacitors, and the like and electrically connecting electronic components disposed through a wiring pattern of a predetermined shape having conductivity, , And wiring for electrically connecting the board for arranging the electronic components and the electronic components disposed thereon.

The construction and production process of the printed circuit board will be described in more detail. In order to increase the adhesion of a copper clad laminate (CCL) to a resin on one side or both sides of a thin substrate made of an insulator synthetic resin, The copper foil chemically reacts with the resin to form a predetermined depth into the resin.

Thereafter, the copper-clad laminate is cut into a panel size that is a size for practical use, and beveling is performed to soften the edges of the cut-out copper-clad laminate.

Scrubbing is performed to remove the fingerprints, dust, and the like on the copper foil laminates of the copper clad laminate, or to increase the adhesion of the dry film to the surface of the copper foil in a lamination process to be described later.

After the face treatment as described above is performed, a dry film made of a photosensitive material in the form of a film, a mylar film and a cover film for imparting stretchability is coated on the copper foil to form a wiring pattern on the printed circuit board .

Thereafter, an artwork film on which a wiring pattern is formed is closely adhered to a substrate coated with a dry film, and ultraviolet rays are irradiated to expose a portion of the photosensitive material, which reacts with light, to cure, .

Then, a developing process of forming a wiring pattern on the copper foil side of the copper-clad laminate by performing a developing process is performed by leaving a corrosion resist, which is a cured portion, exposed to ultraviolet rays by using a predetermined developer, and dissolving and removing the remaining portions.

As described above, after the wiring pattern is formed on the copper foil surface, the etching solution is sprayed to remove the copper foil in the area protected by the corrosion resist, that is, the area other than the wiring pattern, And finally the process of forming the wiring pattern of the copper foil is repeated to form the final printed circuit board.

That is, as described above, the manufacturing process of the printed circuit board is a repetitive operation of stacking, etching, and cleaning of the copper foil. As a result, contamination sources such as dust and fingerprints remain in the work process, oxidation and discoloration of a predetermined wiring pattern Defects may occur in relation to the surface conditions of the printed circuit board.

Particularly, when oxidation occurs in a bonding pad portion of a printed circuit board interconnected with a semiconductor chip, a ball attach or a wire attach is performed due to the oxygen content of the metal surface of the printed circuit board And the bonding strength is significantly lower than that of a general printed circuit board even if the bonding is performed.

As a method of observing the state of a metal surface of a printed circuit board which causes such a problem, there has been proposed a method of sensing a light reflected by a light provided on the upper side in a process of loading and transferring a printed circuit board, And image matching, if the error exceeds the set value, it is judged as a defect.

To this end, the structure of the inspection apparatus of the printed circuit board includes an image pickup section for analyzing the reflected illumination values of the control section and the printed circuit board and transferring the reflected illumination values to the control section, a transfer section for carrying in and out the printed circuit board to the image pickup section, A marking unit for marking and marking whether the printed circuit board is normal or not, and a marking unit for marking a defect in the printed circuit board, which is drawn into the printed circuit board marked by the marking unit, And an elevating / withdrawing portion for taking out the printed circuit boards separately.

Since the control unit, the imaging unit, the jig unit, the marking unit, and the elevation takeout unit are connected to each other by a single body, the space efficiency of the installation place in a small space is improved , It is possible to automatically check whether or not the program recorded on the printed circuit board by each of the constituent elements is normal, thereby improving work efficiency.

However, when inspecting the printed circuit board through image matching by designing a circuit design pattern by imaging the light reflected by the illumination provided on the upper side in the process of loading and transporting the printed circuit board as described above, As the circuit of the substrate becomes more complex and highly integrated, the time and cost of inspecting the printed circuit board increases due to the inspection delay due to the inspection operation speed.

In order to accurately analyze the cause of the defect of the printed circuit board, accurate data is required. However, in the conventional PCB inspection apparatus, only the color of the substrate scanned by the image pickup unit is analyzed to determine the type of the substrate, such as SR foreign matter, SR discoloration, SR aggregation (Solder Resist) defects, and there is a limitation on the feedback data due to the color color scanned in the database.

Therefore, in order to accurately inspect the SR defect, the user has to manually perform a task of designating the circuit pattern inspection apparatus to the circuit pattern data corresponding to the setting time inspection target substrate and database.

That is, due to the characteristics of the present production line, it is necessary to change a lot of substrates, the apparatus to be inspected is frequently changed, and the operation method of the new printed circuit inspection apparatus must be reset every time. Therefore, the production process becomes complicated, Is lowered.

Korean Patent Publication No. 10-2011-0086222

In order to solve the above problems, the present invention provides a printed circuit board inspection apparatus for automatically inspecting a board to be inspected.

According to an aspect of the present invention, there is provided a method of inspecting a substrate to be inspected, comprising: loading and unloading portions for loading and unloading a substrate to be inspected from a magazine; A first substrate transferring unit for transferring the inspection target substrate, which has been brought into the one end portion by the carrying-in and carrying-out unit, to the other end; A second substrate transfer unit arranged in parallel with the side of the transfer unit for transferring the substrate to be inspected to the other end by the transfer unit and the transfer unit to the other end; A first color imaging unit for color-scanning each of the substrates to be inspected, the first substrate being moved horizontally selectively to an upper portion of one of the transfer unit and the second substrate, And a first mono imaging unit for carrying the monochromatic scanning while transferring the color-scanned inspected substrate by transferring the first substrate and the second substrate from the transfer unit, wherein the first mono imaging unit includes a first substrate transfer unit, The transfer unit is disposed in parallel to each other to transfer the inspection target substrate alternately and the first color image sensing unit is selectively arranged so as to pick up each inspection target substrate that has been conveyed by the first substrate and the second substrate, The present invention also provides a printed circuit board inspecting apparatus comprising:

Here, it is preferable that the first color imaging unit is provided with a plurality of imaging devices according to the set illumination, and each of the imaging devices is disposed along the longitudinal direction of the transmitting unit.

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A third substrate transfer section for transferring the inspection target substrate inverted in the inverting device inverting the mono-scanned substrate to be inspected through the first mono imaging section to the other end in a straight line, and the third substrate transferring section A fourth substrate transferring portion which is arranged side by side in the inverting device and transfers the inspection target substrate brought into the one end portion to the other end in a straight line, and the fourth substrate transfer portion, A second color imaging unit for color-scanning each of the circuit boards to be inspected which is horizontally moved by being selectively horizontally moved to an upper portion of the inspection target substrate, And a second mono image pickup unit for carrying out the mono scanning while being transported in a straight line.

Through the above solution, the printed circuit board inspection apparatus of the present invention provides the following effects.

First, since the first substrate and the second substrate are arranged in parallel, the scanning is continuously performed while the substrate is carried in or out by alternately transferring the substrate. Therefore, The time required for carrying in and out can be shortened, and the time for delaying the process can be minimized. As a result, the inspection time of the substrate to be inspected is remarkably shortened, and the inspection of a plurality of the printed circuit boards can be continuously performed, so that the inspection work of the printed circuit board can be performed quickly and economically.

Secondly, each of the substrates is transferred in parallel and arranged in parallel, and the color imaging unit horizontally moves the respective substrates toward the sending unit in accordance with the carry-in of the substrate to be inspected, thereby simplifying the structure of the printed circuit board inspecting apparatus The inspection speed of the printed circuit board is remarkably increased, and the effect of contributing effectively to the automation work can be expected.

Third, since the first color image pickup unit and the first mono image pickup unit are provided as a single device and the color scanning and the mono scanning are continuously performed, it is possible to simplify the process, thereby enabling economical and efficient grasping of defect information . In addition, the substrate to be inspected can be inspected both in two-dimensional and three-dimensional defects of the pad portion detected only by using color scanning, and in transparent SR (solder resist) defects detected only by using monoscopic scanning The inspection accuracy of the printed circuit board is remarkably improved and the inspection accuracy is improved, so that an accurate inspection can be expected.

1 is a plan view of a printed circuit board inspection apparatus according to an embodiment of the present invention;
2 is a block diagram illustrating a system of an apparatus for inspecting a printed circuit board according to an embodiment of the present invention.
3 is a flowchart illustrating an inspection method using an image pickup unit of a PCB inspection apparatus according to an embodiment of the present invention.
4 is a schematic diagram illustrating a mono data conversion process of a PCB inspection apparatus according to an embodiment of the present invention.
FIG. 5 is a flowchart showing a failure example acquisition process through the eyedropper technique experiment according to an embodiment of the present invention; FIG.
6 is a flowchart illustrating a comparison region division setting and an inspection method using a plurality of image sensing units in a PCB inspection apparatus according to another embodiment of the present invention.
7A is a front view of a first vision unit according to an embodiment of the present invention;
7B is a front view of a second vision unit according to an embodiment of the present invention.

Hereinafter, an apparatus for inspecting a printed circuit board according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Here, the substrate to be inspected refers to a printed circuit board (PCB) or the like, and is used as a substrate for signal processing by printing a circuit pattern having electrical conductivity on an insulating synthetic resin. The substrate to be inspected is representative of electrical parts used in a computer. However, the substrate to be inspected according to the present invention is not limited to the printed circuit board, but is defined as a concept including various electrical signal processing substrates.

FIG. 1 is a plan view of a printed circuit board inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic block diagram of a printed circuit board inspection apparatus according to an embodiment of the present invention.

1 and 2, a PCB inspection apparatus 1 according to the present invention includes a loading / unloading unit 10, a first substrate transferring unit 21, a second substrate transferring unit 22, 1 color imaging section 30, and a first mono imaging section 40.

The loading and unloading unit 10 includes a magazine 11, a magazine supply unit 12, a vertical transfer unit 13, a cleaning device (not shown) 14, and a transverse hanging part 15, and the like. In detail, it is preferable that the loading and unloading unit 10 continuously loads and unloads the inspection target boards loaded in the magazine 11 into the respective conveyance units through the signal of the operation control unit 50.

At this time, a plurality of pre-processed substrates to be inspected manufactured in the previous process are stacked in a multi-stage inside the magazine 11. To this end, the magazine 11 may include a magazine mounting portion 11a on which the substrate to be inspected is mounted, and a magazine side plate 11b on front and rear sides of the mounting portion. Accordingly, it is preferable that the magazine 11 can safely load and store the substrate to be inspected, and can continuously supply the magazine to the magazine supply unit 12.

Here, the magazine supply unit 12 is configured to carry the substrate to be inspected loaded on the magazine 11 and continuously supply the substrate to the vertical transfer unit 13. At this time, the magazine supply unit 12 may include a plurality of rollers provided with a frame installed in the magazine supply unit body, and various driving devices driven in a belt manner. That is, the magazine supply unit 12 is driven by a plurality of rollers and a belt type so that the inspection target substrate is continuously supplied from the magazine 11 to the vertical transfer unit 13. At this time, the magazine supply unit 12 may receive power through various power transmission methods including a cylinder type or a ball screw type.

In this manner, the substrate to be inspected is continuously supplied to the vertical transfer unit 13 using the magazine supply unit 12 and is transferred in the vertical direction. Here, the vertical transfer unit 13 may be transferred to the inspection target substrate by an attraction transfer method in order to effectively support the inspection target substrate. That is, the vertical transfer unit 13 can form a vacuum suction unit for supporting the substrate on the edge support portion and the center support portion of the inspection target substrate, thereby effectively supporting the inspection target substrate.

In addition, the vertical transfer unit 13 may be provided with a substrate holding unit configured to be adjustable so as to be variously supported according to the size of the substrate. Therefore, it is preferable that the substrate to be inspected is continuously carried in and out of the vertical conveying unit 13 through the magazine supplying unit 12. [

However, when the foreign object on the surface of the substrate to be inspected is used without being removed, the bonding rate of the substrate to be inspected rises, complicated auxiliary equipment is required for maintenance of the substrate to be inspected, Thereby causing a disadvantage of raising the manufacturing cost of the substrate to be inspected as necessary.

Therefore, it is preferable that the PCB inspection apparatus 1 is equipped with a cleaning device 14 in order to remove foreign substances generated on the surface of the PCB to be inspected.

That is, the substrate to be inspected generates neutralized +, - ions through the ionizing air nozzle of the cleaning device 14 to completely remove the static electricity in the air blowing system and attach it to the package through air injection and pumping The resin of the substrate to be inspected and external foreign substances are effectively forcibly discharged, thereby improving the yield in the process of inspecting the printed circuit.

In this manner, the substrate to be inspected is removed from the surface through the cleaning device 14, and is transferred to the transverse suspension conveying device 15. Here, the transverse hanging conveyor 15 may include a hanging part 15a and a substrate fixing part 15b. That is, the substrate to be inspected is transversely transferred using the suspension transfer unit 15a, and the substrate to be inspected is fixed through the substrate fixing unit 15b. At this time, the transverse hanging conveyor 15 may be provided in plurality according to the inspection process of the printed circuit board.

Therefore, the substrate to be inspected is carried in and out of the magazine 11 of the loading and unloading section 10 and supplied to the vertical transfer section 13 from the magazine supplying section 12, It is preferable that the first substrate is selectively carried in and out of the transfer unit 21 or the second transfer unit 22 using the transverse suspending unit 15 after removing the surface foreign matter of the substrate to be inspected Do.

 Here, the first substrate transfer section 21 is configured to transfer the inspection target substrate, which has been brought into one end of the first color imaging section by the carrying-in / out section 10, to the other end of the first color imaging section desirable. In detail, the first substrate transfer unit 21 is configured to continuously and continuously transfer the substrate to be inspected carried in the transverse suspending unit 15 of the carry-in and carry-out unit 10 in the longitudinal direction.

In this case, the first color imaging unit collects and analyzes various data on the appearance of the substrate to be inspected using an optical method, and can automatically check the presence or absence of defects in the substrate to be inspected.

The first substrate transfer unit 21 may include a first substrate conveyor belt unit 21a, a first substrate conveyor belt drive unit 21b, and the like. Here, the first substrate conveyor belt portion 21a is configured to effectively fix the substrate to be inspected using the transversal suspension transport device 15 of the carry-in and carry-out portion 10. In addition, the first substrate conveyor belt portion 21a is provided to include a chain or a belt on which a plurality of rollers are mounted on a conveyor conveyance line arranged in a circular shape or a straight line, .

The chain and the belt are rotationally driven by the motor of the first substrate conveyor belt driving unit 21b so that the inspection target substrate carried in the carrying-in and carrying-out unit 10 can be sequentially and linearly transported. Here, the first substrate conveyor belt driving unit 21b may be a conventional motor.

Therefore, the inspection target board, which is carried in and fixed to the first substrate conveyor belt portion 21a, is carried into one end of the first color image sensing unit 300 using the first substrate conveyor belt driving unit 21b, And the substrate to be inspected is linearly transferred to the other end of the first color imaging unit.

In detail, it is preferable that the substrate to be inspected is carried into the first substrate transfer unit 21 and transferred straight across the other end of the first color imaging unit 300. The first substrate conveyor belt driving unit 21b of the first substrate transfer unit 21 may be provided with a first color image pickup unit 300 for effective color scanning of the inspection target substrate in the first color image sensing unit 300, ) To the distal end of the forward movement.

It is preferable that the first substrate transfer unit 21 and the second substrate transfer unit 22 are arranged in parallel to transfer the inspection target substrate to the first color imaging unit 300 alternately.

The second substrate transfer section 22 includes a second substrate conveyor belt section 22a and a second substrate conveyor belt drive section 22b and the like. In the present embodiment, 21, the detailed description of the structure of the second substrate transfer section 22 will be omitted.

In detail, the substrate to be inspected is alternately transported to the distal end of the first color imaging unit 300 using the first substrate 20 and the second substrate 30, which are arranged in parallel, The substrate to be inspected is preferably collected and analyzed in the first color imaging unit 300 to automatically check the presence or absence of defects in the substrate to be inspected.

In this manner, it is preferable that a plurality of the inspection target substrates are continuously supplied to the first color imaging unit 300 by arranging the first substrate transfer unit 21 and the second substrate transfer unit 22 in parallel.

That is, while the substrate to be inspected is transferred from the transfer unit 21 to the first color image pickup unit 300 and color scanned, the transfer and transfer unit 10 transfers the second substrate to the transfer unit 22, The first color image pickup unit 300 continuously supplies the substrate to be inspected and shortens the time required for carrying in and out, thereby minimizing the delay time of the process have. As a result, the inspection time of the substrate to be inspected is remarkably shortened, and the inspection of a plurality of the printed circuit boards can be continuously performed, so that the inspection work of the printed circuit board can be performed quickly and economically.

Therefore, in the PCB inspection apparatus according to the present invention, a plurality of substrates to be inspected may be continuously supplied to the first color image sensing unit 300 by being arranged in parallel with a plurality of transfer units.

Here, the first color image pickup unit 300 is a color scanning unit for scanning the color of each substrate to be inspected to be linearly transported along any one of the first substrate transfer unit 21 and the second substrate transfer unit 22, It is preferable to horizontally move.

In detail, in the first color imaging unit 300, after the first substrate is transferred from the transfer unit 21 to the inspected substrate and color-scanned, the first substrate transfer unit 21 transfers the transferred substrates to the transfer and transfer unit 10, The second substrate is horizontally moved to the transfer path 22 to perform color scanning.

The first color image pickup unit 300 includes a first vision unit 31, a second vision unit 32, a main body frame 33, and a second vision unit 33 for horizontally moving the respective substrates to perform color scanning. And a left and right conveying means 34. [

More specifically, the first color image pickup unit 300 is provided with a left and right conveying means 34 at an upper portion of the main body frame 33. The first color image pickup unit 300 is driven by the first color image pickup unit 300 in accordance with a command from the arithmetic control unit 50 It may be automatically horizontally moved continuously.

Accordingly, the first color image pickup unit 300 scans the respective substrates horizontally and color-scanned according to the carry-in of the substrate to be inspected, thereby simplifying the structure of the PCB inspection apparatus, And it is possible to expect an effect that contributes to the automation work effectively.

In addition, the first color image pickup unit 300 is provided with respective image pickup devices for illuminating the lower part of the main body frame 33 so as to be different from each other, . And various data can be collected and analyzed.

In detail, each image pickup apparatus image pickup apparatus may be configured so as to include the first vision unit 31 and the second vision unit 32, with illumination set differently from each other in the first color image pickup unit 300.

Here, it is preferable that a plurality of the image pickup devices of the first color image pickup section 300 are arranged, and the image pickup apparatus is disposed along the longitudinal direction of each substrate. Accordingly, it is preferable that the inspection target board having various standards is inspected without any additional facility.

 In detail, the first color image pickup unit 300 can inspect the inspection target board of various standards without changing the mechanism, hardware, or the like, so that the additional cost due to the increase in efficiency does not occur and the productivity improvement effect can be expected have.

The first vision unit 31 is provided with five rows of red, green, and blue lights so as to emit bright light with a coaxial structure to check whether the ball-pad and bonding-pad portions in the substrate to be inspected are bonded. In detail, the first vision unit 31 is an EL illumination using area illumination, and it is inspected whether a two-dimensional defect exists on the pattern of the inspection target substrate.

The second vision unit 32 is provided with three rows of red, green, and blue lights. The second vision unit 32 further includes side illumination. The second vision unit 32 uses the light of the light- Is detected. At this time, the second vision unit 32 irradiates the substrate to be inspected at an inclination angle and a front angle of the ELTI illumination using EL illumination using 3D illumination to obtain a three-dimensional stereoscopic image of the substrate pattern, Whether it will be checked.

Therefore, in the printed-circuit board inspection apparatus 1 according to the present invention, a plurality of lights whose illumination is set differently are set in the first color imaging section 300, and each of the boards is moved along the longitudinal direction of the transmission section, By arranging a plurality of apparatuses, various substrates to be inspected can be accurately and quickly inspected, and the effect of contributing to the quality improvement of the substrate to be inspected can be expected.

The inspected substrate is inspected for defects in the first color imaging unit 300 and then transferred to the first mono imaging unit 400 through the carrying-in / out unit 10 It is preferable that mono scanning is performed.

The first mono imaging unit 400 includes a third vision unit 43 and a fourth vision unit 44. The first substrate transfer unit 21 and the second substrate transfer unit 22 The inspection target substrate may be inspected for defects.

The first mono imaging unit 400 includes a first substrate transfer unit 21 and a second substrate transfer unit 22 disposed at extension portions or sides of the transfer unit 22 to transfer the inspection target substrate to the first color imaging unit 300 ), And then the respective substrates are brought in from the sending unit, and the substrate to be inspected can be continuously mono-scanned.

In this way, the first mono image pickup unit 400 is disposed at the extended portion or the side portion of the first substrate transfer portion 21 and the second substrate transfer portion 22 to check whether the substrate to be inspected is defective or not desirable.

Therefore, the printed circuit board inspection apparatus 1 according to the present invention includes the first color imaging section 300 and the first mono imaging section 400, so that the color scanning and the mono scanning of the inspection target board can be performed simultaneously It is preferable to be configured to be inspected.

More specifically, the first color image pickup unit 300 and the first mono image pickup unit 400 are integrated into one apparatus, and the color scanning and the mono scanning are continuously performed, thereby simplifying the process and thereby obtaining economical and efficient defect information Can be expected. In addition, the substrate to be inspected can be inspected both in two-dimensional and three-dimensional defects of the pad portion detected only by using color scanning, and in transparent SR (solder resist) defects detected only by using monoscopic scanning The inspection accuracy of the printed circuit board is remarkably improved and the inspection accuracy is improved, so that an accurate inspection can be expected.

Meanwhile, in the PCB inspection apparatus according to the present invention, it is preferable that the substrate to be inspected is reversed with the conveyance by using the reversing device (60) and both sides are inspected.

Here, the inverting apparatus 60 may be configured such that the substrate to be inspected is carried in the carry-in and carry-out unit 10 and inverted, and then the third substrate is selectively transferred to the transfer unit 23 and the fourth substrate transfer unit 24 It is preferable to carry it in.

At this time, the third substrate transfer section 23 and the fourth substrate transfer section 24 are connected to the third substrate conveyor belt section 23a, the third substrate conveyor belt drive section 23b, the fourth substrate conveyor belt section 24a and a fourth substrate conveyor belt driving unit 24b. In the present embodiment, the first substrate has the same structure as that of the transmitting unit 21, and the third substrate includes the transmitting unit 23 and the fourth substrate conveyor belt driving unit 24b. The detailed description of the structure and function of the four-substrate transfer unit 24 will be omitted.

The third substrate transfer section 23 and the fourth substrate transfer section 24 are arranged in parallel, and the inverted inspection target substrate is transferred to the first color imaging section 300 alternately.

In detail, the inverted substrate to be inspected is alternately transported to the distal end of the second color imaging unit 310 using the third substrate transferring unit 23 and the fourth substrate transferring unit 24 arranged in parallel , The substrate to be inspected is collected and analyzed in the second color imaging unit 310 to automatically check the presence or absence of defects in the substrate to be inspected.

Here, the second color image sensing unit 310 includes a fifth vision unit 35, a sixth vision unit 36, a body frame 37, and a right and left transfer unit 38. The structure and function of the second color image sensing unit 310 will not be described in detail with the same structure as that of the first color sensing unit 300 described above.

In addition, it is preferable that the inverted substrate to be inspected is mono-scanned using the second mono image pickup unit 410. In detail, it is preferable that the second color imaging unit 310 inspects the substrate to be inspected for defects and then is transferred to the second mono imaging unit 410 through the loading / unloading unit 10 to be mono-scanned Do.

The second mono image pickup unit 410 includes a seventh vision unit 47 and an eighth vision unit 48. The second mono image pickup unit 410 includes the seventh vision unit 47 and the eighth vision unit 48, A detailed description of the structure and function of the second mono image pickup unit 410 will be omitted.

Therefore, the printed circuit board inspection apparatus 1 according to the present invention includes the first color imaging section 300, the first mono imaging section 400, and the reversing device 60, Is scanned simultaneously by color scanning and mono scanning.

As a result, it is possible to perform double-side inspection of the substrate to be inspected without any additional equipment, and it is possible to accurately inspect the substrate to be inspected, smooth connection between the respective processes, and a significant increase in workability and productivity can be expected have.

Hereinafter, a printed circuit board inspection apparatus according to an embodiment of the present invention compares each data collected by scanning a substrate to be inspected using the respective color imaging units and the mono imaging units with previously stored circuit patterns, Will be described in detail.

FIG. 3 is a flowchart illustrating an inspection method using an imaging unit of a PCB inspection apparatus according to an embodiment of the present invention. FIG. 4 is a flowchart illustrating a mono data conversion process of the PCB inspection apparatus according to an exemplary embodiment of the present invention. And FIG. 5 is a flowchart illustrating a defect example acquisition procedure through a puncture technique test according to an embodiment of the present invention.

As shown in FIGS. 3 to 5, the printed circuit board inspection apparatus 1 scans the inspection target board using the color imaging units and the mono imaging units (s10). That is, the substrate to be inspected is selectively carried in the transfer unit 21 and the transfer unit 22 through the transfer unit 10, and then transferred to the transfer units 22, The substrate to be inspected is scanned while being inspected in the illumination of each of the imaging units while being linearly transferred across the other end of the first color imaging unit 300.

Accordingly, the printed circuit board inspection apparatus 1 according to the present invention is preferably provided with the color imaging unit and the mono imaging unit, so that the inspection target board is preferably performed simultaneously with color scanning and monoscopic scanning (s10).

As described above, since the first color image sensing unit 300 and the first mono image sensing unit 400 are formed in one device and the color scanning and mono scanning are continuously performed, the process is simplified, It is possible to expect an effect that grasp becomes possible. In addition, the substrate to be inspected can be inspected both in two-dimensional and three-dimensional defects of the pad portion detected only by using color scanning, and in transparent SR (solder resist) defects detected only by using monoscopic scanning The inspection accuracy of the printed circuit board is remarkably improved and the inspection accuracy is improved, so that an accurate inspection can be expected.

In addition, by extracting necessary data according to the type of defects of the inspection target board using the plurality of imaging units, the unnecessary process steps can be reduced and the productivity and productivity can be expected to be increased . That is, it is preferable that the color data and the monochrome data are selectively extracted and inspected according to the kind of defect.

As described above, it is preferable that color data and mono data of the inspection target substrate collected by each imaging unit are transmitted to the operation control unit 50 (s20). At this time, the color data of the inspection target substrate It is preferable that the data is converted into monoized data after decomposition by red, green, and blue in the operation control unit 50 (s30).

4, it is preferable that the color data of the inspection target substrate is color-scanned and the color data of the inspection substrate is divided into red, green, and blue, respectively, and then divided and extracted as data of each color (s30a) . To this end, the color data of the substrate to be inspected is color-scanned and collected in the first color image pickup unit 300, and then is stored in each of the image pickup units. The color data stored in each of the image pickup units is transmitted to the arithmetic and control unit 50. The arithmetic and control unit 50 controls the color data stored in the respective image pickup units to be classified into red, desirable.

Here, the color data transmitted to and separated from the operation control unit 50 can be weighted according to the ratio of red, green, and blue (s30b). In this case, the weight setting is preferably weighted through an average value analysis of data that can effectively indicate whether a defect of the inspection target substrate is defective through an image test.

As described above, the color data divided and extracted for each color are summed after the weights are set, and converted into monaural data (s30c).

Accordingly, the color data scanned in the first color image sensing unit is transmitted to the arithmetic and control unit 50 and classified into the red, green and blue colors. It is preferable to adjust the color and convert it into monaural data while maintaining the brightness and saturation of the applied color data.

Thus, the color data and the mono-data obtained from the inspection target substrate are compared with one pre-stored circuit pattern data so that the inspection process can be performed uniformly and continuously, thereby simplifying the data amount reduction and comparison operation process. It is possible to efficiently perform the arithmetic processing process.

Here, the printed circuit board inspecting apparatus 1 according to the present invention compares each of the mono data and the mono-enumerated data collected by each of the image pickup units with pre-stored circuit pattern data to check whether the matching rate is not less than a preset range And the presence or absence of defects in the inspection target substrate can be confirmed (s40).

In detail, the comparison region is divided and extracted from each of the mono data and mono-data collected by each of the image pickup units, and the decomposed data and the mono data generated by decomposing by the red, green, It is preferable to sequentially perform the comparison process of each cycle with respect to the subordinate comparison region after one cycle with the corresponding region of the previously stored circuit pattern data.

The apparatus for inspecting a printed circuit board according to the present invention includes a step of extracting a comparison area from each of mono data and mono-data collected by each of the image pickup units and comparing the comparison area with previously stored circuit pattern data in one cycle, By sequentially performing the comparison operation on the comparison area, the unnecessary process steps of the printed circuit board inspection apparatus are reduced, and the effect of remarkably improving the operation control speed and the processing speed can be expected.

Accordingly, the substrate to be inspected compares the mono data and mono-data obtained by the first color image pickup unit 300 and the first mono image pickup unit 400 and converted with the pre-stored circuit pattern, It is preferable to confirm whether or not it is less than a predetermined range.

Here, it is preferable that the mono data and mono-data of the substrate to be inspected are discriminated as defects and extracted when the coincidence rate with the pre-stored circuit pattern data is less than a preset range (s50). It is preferable that the operation control unit 50 displays a defect on the inspection target substrate (s60). In addition, it is preferable that the mono data and the mono data of the inspection target board, which are marked as defective, are stored and classified in the operation control unit 50 (s70).

5, the circuit pattern of the inspection target board extracted by the defect is acquired and classified by the operation control unit 50 and is stored and classified in the operation control unit 50 to check whether the inspection target substrate is defective .

Here, it is preferable that the sparkle of the substrate to be inspected is acquired and accumulated through the eyedropper technique (s100). More specifically, the inspection target substrate is compared with pre-stored circuit patterns of the arithmetic and control unit 50, and the mono data and the mono data are collected and converted by the respective image pickup units. When the matching rate is less than a predetermined range, And extracted. At this time, if each of the mono data and the mono data of the inspection target substrate extracted as defects is judged to be defective by the arithmetic and control unit 50, it is classified and stored as defective.

At this time, the collected data may be utilized to identify the types of defects of the inspection target substrate and locations where the defects are frequently generated.

In detail, the data collected by each of the imaging units is used to identify a defect type and a frequently occurring position of the substrate to be inspected, and the type of defect and the defect position are obtained through an eyedrop technique test, It is determined that the circuit pattern is defective.

Here, it is preferable that the acquired examples of the circuit pattern defects are displayed as red, green, and blue information (S110). In addition, it is preferable that weights are set according to the ratio of the red, green and blue information (s120). In this case, the weight setting is preferably weighted through an average value analysis of data that can effectively indicate whether a defect of the inspection target substrate is defective through an image test.

In this manner, the color data divided and extracted for each color is added to the weight data and converted into monaural data. In detail, each of the red, green, and blue information is preferably weighted and averaged based on conventional mono data.

As described above, it is preferable that the red, green, and blue information is converted into monaural data after weight setting and stored and classified as circuit pattern data in the arithmetic and control unit 50 (S130).

Therefore, it is preferable that the arithmetic and control unit 50 constructs a circuit pattern of the substrate to be inspected extracted by the defect, and uses the database to track the cause of the defect.

FIG. 6 is a flowchart illustrating a comparison area division setting and an inspection method using a plurality of image sensing units of a PCB inspection apparatus according to another embodiment of the present invention. FIG. 7A is a front view of a first vision unit according to an embodiment of the present invention And FIG. 7B is a front view of a second vision unit according to an embodiment of the present invention.

6 to 7B, the printed circuit board inspecting apparatus 1 includes a color image pickup unit and a mono image pickup unit in which a plurality of lights are differently fired, The state of the product can be checked by comparing the data with the pre-stored circuit pattern.

Here, the substrate to be inspected may be simultaneously subjected to a plurality of scanning operations in the first color imaging unit 300 and the first mono imaging unit 400 in which a plurality of lights are set differently (s210).

In detail, the first color image pickup unit 300 and the first mono image pickup unit 400 include a first vision unit 31, a second vision unit 32, a third vision unit 33, (34).

At this time, the first vision unit 31 is provided with five rows of red, green, and blue lights to emit bright light with a coaxial structure to check whether the ball-pad and bonding-pad portions in the inspection target substrate are bonded. In detail, the first vision unit 31 is an EL illumination using area illumination, and it is inspected whether a two-dimensional defect exists on the pattern of the inspection target substrate.

The second vision unit 32 is provided with three rows of red, green, and blue lights. The second vision unit 32 further includes side illumination, Is detected. At this time, the second vision unit 32 irradiates the substrate to be inspected at an inclination angle and a front angle of the ELTI illumination using EL illumination using 3D illumination to obtain a three-dimensional stereoscopic image of the substrate pattern, Whether it will be checked.

In addition, the third vision unit 33 prevents the over-detection of the substrate to be inspected by the non-conductive foreign matter in the solder resist by the infrared ray illumination and is detected as a defect by the internal non-conductive foreign substance. Detection is prevented.

That is, the infrared illumination of the third vision unit 40a uses electromagnetic waves having a long wavelength to detect the SR of the inspection target substrate and the defective portion of the SR underlying pattern that is difficult to distinguish from the visual inspection due to high transparency and sensitivity .

Further, the UV whitening illumination of the fourth vision unit 40b is composed of a semi-cone structure and an illumination with an acute-light area structure, and the substrate to be inspected is inspected for yielding and genuine foreign matter-related yielding.

That is, the fourth vision 40b is a dome-shaped coaxial illumination type, and is used for checking the yield of the substrate to be inspected and the yield of the foreign matter related to the intrinsic foreign object by using a characteristic having a high resolution with a short wavelength.

Accordingly, the inspection target substrate is simultaneously subjected to a plurality of scanning operations in the first color imaging unit 300 and the first mono imaging unit 400, in which a plurality of lights are set differently, Accordingly, various kinds of illumination can be scanned, and defects of various types of inspection target substrates can be detected more precisely.

In detail, the inspection object board is inspected for the appearance of the inspection target substrate using each of the plurality of imaging units, thereby extracting the defect kind of various substrates as efficiently as possible. The defect inspection of the defective marks on the inspection target substrate, It is possible to accurately inspect various defects of the inspection target substrate such as defective SR (Solder Resist) such as SR discoloration and SR clustering. As a result, the substrate to be inspected can be expected to have a remarkably reduced Miss Defecting effect.

As described above, it is preferable that color data and mono data of the inspection target substrate collected by each of the image pickup units are transmitted to the operation control unit 50 (S220). At this time, (S230), which is decomposed and converted into monoized data by red, green, and blue in the arithmetic and control unit 50.

Here, the process of converting the color data into the monaural data in the arithmetic and control unit 50 is the same as that of FIG. 4 described in the present embodiment, and a description of the process of converting the color data into monaural data It will be omitted.

The mono data and the mono data of the inspection target substrate classified by the operation and control unit 50 are preferably divided into a comparison area (s240).

In detail, the comparison area is divided so that the mono data and the mono-data of the inspection target substrate classified by the operation control unit 50 are sequentially compared and analyzed with the corresponding area of the pre-stored circuit pattern.

Therefore, the inspection target substrate is sequentially checked by the arithmetic and control unit 50 for each of the divided comparison regions and pre-stored circuit pattern data, and it is checked whether the match rate is equal to or more than a preset range. (S250).

In detail, the apparatus for inspecting a printed circuit board (1) according to the present invention divides and extracts a comparison region from each data of the respective image sensing regions, And comparing the mono data with the corresponding area of the pre-stored circuit pattern data as one cycle, and then sequentially comparing the cycle of each cycle with respect to the succeeding comparison area.

Thus, by extracting the comparison area from each of the mono data and the mono-data which are collected by each imaging section in which the plurality of lights are set differently, and comparing the comparison area with the previously stored circuit pattern data in one cycle, An unnecessary process of the process is reduced, and an effect of remarkably improving the operation control speed and the processing speed can be expected.

Here, it is preferable that the divided comparison regions of the substrate to be inspected are discriminated as defects and extracted when the coincidence rate with the pre-stored circuit pattern data is less than a predetermined range (s260)

In detail, the substrate to be inspected includes the first color imaging unit 300 configured to have a plurality of lights different from each other, and the mono data and mono-rendered data converted by color scanning and mono scanning in the first mono imaging unit 400 Is compared with the pre-stored circuit pattern, and it is preferable that whether or not the matching rate is not less than a predetermined range is confirmed.

Here, it is preferable that the mono data and the mono-data of the substrate to be inspected are discriminated and extracted as a defect when the coincidence rate with the pre-stored circuit pattern data is less than a preset range (s260). It is preferable that the operation control unit 50 displays a defect on the inspection target board (s270). In addition, it is preferable that the mono data and the mono-data of the substrate to be inspected indicated as defective are stored and classified in the arithmetic and control unit 50 (s280).

In this case, the process of acquiring the circuit pattern of the substrate to be inspected extracted as the defective by the arithmetic and control unit 50 as a defective example, and storing and classifying the circuit pattern in the arithmetic and control unit 50 is the same as that of FIG. And a detailed description of the failure detection process through the eyedropper technique will be omitted.

Therefore, it is preferable that the arithmetic and control unit 50 constructs a circuit pattern of the substrate to be inspected extracted by the defect, and uses the database to track the cause of the defect.

As described above, the present invention is not limited to the above-described embodiments, and variations and modifications may be made by those skilled in the art without departing from the scope of the present invention. And such modifications are within the scope of the present invention.

10: Loading and unloading unit 50: Operation control unit
11: magazine 60: reversing device
11a: Magazine loading section 300: First color imaging section
11b: magazine side plate 31: first vision part
12: magazine supply unit 32: second vision unit
13: vertical transfer unit 33: first color imaging unit main frame
14: Cleaning device 34: First color imaging section right /
15: Horizontal suspension conveying device 310: Second color imaging section
15a: Suspension transmission 35: Fifth vision part
15b: substrate fixing section 36: sixth vision section
21: first substrate transfer unit 37: second color imaging unit main frame
21a: first substrate conveyor belt section 38: second color imaging section right /
21b: first substrate conveyor belt driving unit 400: first mono imaging unit
22a: second substrate conveyor belt portion 40a: third vision portion
22b: second substrate conveyor belt driving unit 40b: fourth vision unit
23a: third substrate conveyor belt section 410: second mono imaging section
23b: third substrate conveyor belt driving unit 41a: seventh vision unit
24b: fourth substrate conveyor belt driving unit 42b: eighth vision unit

Claims (5)

A loading and unloading unit for loading and unloading the substrate to be inspected from the magazine;
A first substrate transferring unit for transferring the inspection target substrate, which has been brought into the one end portion by the carrying-in and carrying-out unit, to the other end in a straight line;
A second substrate transfer unit arranged in parallel with the side of the transfer unit for transferring the substrate to be inspected to the other end by the transfer unit and the transfer unit to the other end;
A first color imaging unit for color-scanning each of the substrates to be inspected, the first substrate being moved horizontally selectively to an upper portion of one of the transfer unit and the second substrate,
And a first mono imaging unit for carrying the first substrate transferred and the second substrate transferred from the transfer unit to carry out the color scanning of the substrate to be inspected,
The first substrate transferring unit and the second substrate transferring unit are disposed in parallel to each other to alternately transfer the inspection target substrates. The first substrate transfer unit and the second substrate transfer unit Further comprising a left and right conveying means for selectively moving the first color image pickup unit horizontally to pick up an image. delete delete The method according to claim 1,
Wherein the first color image sensing unit is provided as a plurality of image sensing units in accordance with the set illumination, wherein each of the image sensing units is disposed along the longitudinal direction of the transfer unit. The method according to claim 1,
A third substrate transferring unit for transferring the inspection target substrate inverted by the inverting unit for inverting the mono-scanned inspection target substrate through the first mono imaging unit to the other end,
A fourth substrate transferring portion that is disposed in parallel with the side portion of the transfer portion and transfers the inspection target substrate inverted by the reversing device and transferred to the one end portion to the other end,
A second color image pickup unit for color-scanning each of the circuit boards to be inspected, which is horizontally moved selectively to the upper portion of one of the third substrate and the fourth substrate,
Further comprising a second monochromatic imaging unit for carrying the monochromatic scanning while transferring the color-scanned substrate to be inspected, the third substrate being transferred and the fourth substrate being transferred from the transfer unit.

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