KR101367665B1 - Sealant curing apparatus and arrangement method of LED for sealant curing apparatus - Google Patents

Abstract

In the sealant curing apparatus according to the present invention, a substrate stage on which a sealant-coated substrate is seated, is spaced apart by a predetermined distance from an upper surface of the substrate stage, and an LED module including an LED element on the bottom is arranged in a plurality of rows. And an exposure part arranged adjacent to each other in parallel with each other among the plurality of rows, and a support part supporting the exposure part so that the exposure part is spaced apart from the upper surface of the substrate stage, and provides a highly efficient light source. In addition, there is an effect that the sealant is uniformly cured by irradiating light uniformly to the exposure target.

Description

Sealing curing apparatus and arrangement method of LED for sealant curing apparatus}

The present invention relates to an LED array structure for a sealant curing device and a sealant curing device, and more particularly, to an LED array structure for a sealant curing device and a sealant curing device using an ultraviolet LED element.

A flat panel display panel such as an LCD (Liquid Crystal Display), a Plasma Display Panel (PDP), or an organic light-emitting diode (OLED) is processed by two substrates forming an upper substrate and a lower substrate and then bonded together. Display device.

The method for bonding the upper substrate and the lower substrate consists of applying a sealant between the upper substrate and the lower substrate, compressing the two substrates, and curing the sealant by irradiating ultraviolet rays to a portion where the sealant is applied.

In this case, conventionally, halogen lamps have been mainly used as ultraviolet light sources for curing the sealant. However, since halogen lamps have various wavelength bands of emitted light, visible light is also emitted in addition to ultraviolet rays. As a result, light is emitted in all directions instead of being focused on a surface requiring exposure or curing.

The present invention is to solve the conventional problems as described above,

SUMMARY OF THE INVENTION An object of the present invention is to provide a sealant curing apparatus employing a LED (LED) as a light source, which is more efficient than a conventional halogen lamp, and at the same time, to provide a sealant curing apparatus in which an LED module is arranged so that energy is uniformly transmitted to an exposed surface. .

In the sealant curing apparatus according to the present invention, a substrate stage on which a sealant-coated substrate is seated, is spaced apart by a predetermined distance from an upper surface of the substrate stage, and an LED module including an LED element on the bottom is arranged in a plurality of rows. And a neighboring column of the plurality of columns, the exposure unit arranged to be parallel to each other and the support unit supporting the exposure unit such that the exposure unit is spaced apart from the upper surface of the substrate stage.

D만큼 이격되어 배열될 수 있다.The LED modules constituting the first column and the second column of the plurality of columns are arranged in the X direction while maintaining a spacing of D, and the LED module starting the second column is the LED module starting the first row. From the X direction

It can be arranged spaced apart by D.

Any three adjacent LED modules among the LED modules may have the same spacing from each other.

D만큼 이격되어 배열되고, 상기 제3열을 시작하는 상기 엘이디 모듈은 상기 제1열을 시작하는 상기 엘이디 모듈로부터 상기 X방향으로

D만큼 이격되어 배열될 수 있다.The LED modules constituting the first, second, and third columns of the plurality of columns are arranged in the X direction with a gap of D, and the LED modules starting the second row are arranged in the first row. Starting from the LED module in the X direction

The LED module spaced apart by D and starting the third row is in the X direction from the LED module starting the first row.

It can be arranged spaced apart by D.

The LED device may be an LED device emitting ultraviolet light.

The display unit may further include a driving unit which horizontally moves the support unit such that the exposure unit horizontally moves on the substrate stage.

In the LED array structure for the sealant curing apparatus according to the present invention, an LED module composed of LED elements is arranged in a plurality of rows, and neighboring rows are arranged to be displaced in parallel with each other.

D만큼 이격되어 배열될 수 있다.The LED modules constituting the first column and the second column of the plurality of columns are arranged in the X direction while maintaining a gap of D, and the LED module starting the second column includes the LEDs starting the first row. In the X direction from the module

It can be arranged spaced apart by D.

Any three adjacent LED modules among the LED modules may have the same spacing from each other.

D만큼 이격되어 배열되고, 상기 제3열을 시작하는 상기 엘이디 모듈은 상기 제1열을 시작하는 상기 엘이디 모듈로부터 상기 X방향으로

D만큼 이격되어 배열될 수 있다.
The LED modules constituting the first, second, and third columns of the plurality of columns are arranged in the X direction with a gap of D, and the LED modules starting the second row are arranged in the first row. Starting from the LED module in the X direction

The LED module spaced apart by D and starting the third row is in the X direction from the LED module starting the first row.

It can be arranged spaced apart by D.

According to the sealant curing device and the LED array structure for the sealant curing device according to the present invention, the gap between the exposed portion and the exposed surface can be kept close enough, whereby a sufficient exposure effect can be obtained even when the output of the LED element is relatively lowered. At the same time, it is possible to reduce power consumption, reduce heat generated in the LED device, and extend the life of the LED device.

1 is a schematic perspective view of a sealant curing apparatus according to the present invention;
2 is a perspective view of an exposure unit according to a first embodiment of the present invention;
3 is a bottom view of an exposure part according to a first embodiment of the present invention;
4 is a bottom view of an exposure unit according to a second exemplary embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the disclosed embodiments, but may be implemented in various forms, and the present embodiments are not intended to be exhaustive or to limit the scope of the invention to those skilled in the art. It is provided to let you know completely. The shape and the like of the elements in the drawings may be exaggerated for clarity, and the same reference numerals denote the same elements in the drawings.

1 is a schematic perspective view of a sealant curing apparatus 100 according to the present invention.

As shown in FIG. 1, the sealant curing apparatus 100 according to the present invention includes an exposure unit 110 and an exposure unit 110 on which a substrate stage 140 and an LED module 130 (see FIG. 2) are arranged. The driving unit 151 is driven along the surface of the substrate stage 140.

Guide bars 153 may be formed at both sides of the substrate stage 140 in parallel with the upper surface of the substrate stage 140. One or both guide bars 153 of the guide bar 153 may be provided with a driving unit 150 for moving the exposure unit 110 along the substrate (S) surface. In addition, the support 152 may be installed at the top or the side of the driving unit 151.

An exposure part 110 may be installed at an upper end or one side of the support part 152. In this case, the exposure unit 110 is such that the LED module 130 arranged in the exposure unit 110 faces the upper surface of the substrate stage 140 and is spaced a predetermined distance from the substrate S seated on the substrate stage 140. Is installed.

As the distance between the substrate S seated on the substrate stage 140 and the bottom of the exposure unit 110 gets closer, the degree of curing is improved, but experiments have shown that the interval is 30 mm or less under the same UV irradiation time. There was no significant difference in the degree of curing. Therefore, it is preferable that the distance between the substrate S mounted on the substrate stage 140 and the bottom surface of the exposure part 110 is about 30 mm or less.

1 illustrates a state in which the driving unit 151 and the supporting unit 152 are provided on the side of the substrate stage 140 in one embodiment of the present invention, but the driving unit 151 and the supporting unit 152 are the substrate stage 140. ) Can be installed separately. For example, the support part 152 is installed around the substrate stage 140 to support the exposure part 110, and the driving part 151 is provided to allow the exposure part 110 to move horizontally between both support parts 152. Alternatively, the exposure unit 110 and the support unit 152 may be provided to move horizontally integrally.

In addition, FIG. 1 illustrates a sealant curing apparatus 100 in which an exposure part 110 moves on a substrate S and is exposed as an embodiment of the present invention. However, the exposure part 110 is a substrate S. Referring to FIG. An area of the bottom surface of the exposure unit 110 and an area of the substrate S may be similarly formed so that the entire surface may be exposed at a time.

Hereinafter, the exposure unit 110 according to the present invention will be described in more detail.

2 is a perspective view of an exposure unit 110 according to a first embodiment of the present invention, FIG. 3 is a bottom view of the exposure unit 110 according to the first embodiment of the present invention, and FIG. A bottom view of the exposure unit 210 according to the second embodiment.

As shown in FIGS. 2, 3, and 4, the LED module 130 in which one or more LED elements 120 are arranged in a predetermined pattern is arranged in a plurality of rows on the bottom of the exposure unit 110, and neighboring columns are arranged in a plurality of rows. It may be arranged to be parallel to each other and shifted.

D만큼 이격되어 배치되고, 그 뒤를 이어 제2열을 구성하는 엘이디 모듈(132)은 서로 D만큼의 간격을 갖도록 배치될 수 있다. 이 경우 인접하는 3개의 엘이디 모듈(130)이 만드는 삼각형은 이등변삼각형이나 정삼각형일 수 있다.More specifically, as shown in FIG. 3, the distance between the LED modules 131a and 131b constituting the first column is referred to as D, and the direction in which the LED modules 131 in the first column are arranged is referred to as the X direction. In this case, the first LED module 132a of the second column adjacent to the first column is in the X direction than the first LED module 131a of the first column.

The LED modules 132 that are spaced apart by D and subsequent to the second column may be arranged to have a distance of D from each other. In this case, the triangles created by the three adjacent LED modules 130 may be an isosceles triangle or an equilateral triangle.

D만큼 밀려 배치되고, 제2열과 이웃하지만 제1열과 이웃하지 않는 제3열의 최초 엘이디 모듈(233a)은 제1열의 최초 엘이디 모듈(231a)보다

D만큼 밀려 배치되고, 제2열과 제3열의 최초 엘이디모듈(232a, 233a)에 이어 배치되는 엘이디 모듈(230)은 이웃하는 엘이디 모듈(230) 간에 D만큼의 간격을 갖도록 배치될 수 있다.Alternatively, as shown in FIG. 4, the first LED module 232a of the second column adjacent to the first column may be larger than the first LED module 231a of the first column.

The first LED module 233a of the third column, which is disposed to be pushed by D and adjacent to the second column but not adjacent to the first column, is larger than the first LED module 231a of the first column.

The LED module 230 disposed to be pushed by D and disposed after the first LED modules 232a and 233a in the second row and the third row may be disposed to have a distance of D between neighboring LED modules 230.

D만큼, 제3열은

D만큼, 제4열은

D만큼 밀려 배치될 수 있고 또는 n개의 열을 각각

D만큼 밀려 배치되도록 할 수 있다.In the same way, the second column

By D, the third column

By D, the fourth column

Placed by D or n columns each

Can be pushed back by D.

Since the light emitted from the LED element is linear, the ultraviolet ray may not reach the exposure surface corresponding to the portion where the LED module is not disposed (for example, the portion corresponding to the gap between neighboring LED modules).

In particular, in the case of an exposure apparatus in which the exposure unit moves along the surface of the substrate S and exposes the light, the neighboring LED modules are arranged in a square or rectangular shape so that the portions through which the LED modules pass and those that do not pass are distinguished. On the substrate S, a layer in which the ultraviolet light source is sufficiently reached and a layer not being formed are formed, and as a result, the curing state of the sealant is not uniform.

In order to prevent this, when the distance between the exposure unit and the exposure surface is far, the above problem can be compensated to some extent, but the energy reaching the exposure surface is sharply reduced as a whole.

Therefore, as shown in FIG. 3, when the LED module 130 is arranged, even if the distance between the exposure unit 110 and the exposure surface is sufficiently close, ultraviolet rays may be uniformly irradiated onto the exposure surface.

The LED module 130 is arranged as shown in FIG. 3, and the UV light reaching the exposure surface is measured by horizontally moving the exposure unit 110 having a width of 80 mm. As a result, the width of the exposure unit 110 is 80 mm. It was found that most of the energy measured at was uniform in the range of ± 5% based on the mean of the interval.

Therefore, according to the arrangement of the LED module 130 according to the present invention, even if the distance between the exposure unit 110 and the exposure surface is sufficiently close, energy is uniformly transferred to the exposure surface, and between the exposure unit 110 and the exposure surface. Since the distance is so close, even if the output of the exposure unit 110 is lowered than before, sufficient exposure effect can be obtained, and power consumption can be reduced. As a result, the heat generated by the LED element 120 may be reduced and the life of the LED element 120 may be extended.

Hereinafter, the operating state of the sealant curing apparatus 100 according to the present embodiment of the configuration as described above will be described.

The mask is brought into a chamber (not shown) provided with the sealant curing apparatus 100 and adsorbed onto an adsorption chuck (not shown) provided at the upper portion of the chamber. The mask allows ultraviolet light to reach only the part where the sealant is applied. Therefore, a window is formed in the mask in the pattern corresponding to the pattern to which the sealant was applied.

After the loading and adsorption of the mask is completed, the bonded substrate S is seated on the substrate stage 140 with the sealant applied therebetween. After the substrate S is bonded in the bonding apparatus, the substrate S may be brought into a chamber (not shown) equipped with the sealant curing apparatus 100 by a robot (not shown), or the bonding apparatus including the exposure unit 110 may be provided. After bonding in, it may be in a state seated on the substrate stage 140.

After the substrate S is seated on the substrate stage 140, the mask and the substrate S are aligned.

Thereafter, the LED module 130 arranged in the exposure unit 110 is turned on, and when the driving unit 151 moves along the guide bar 153, the exposure unit 110 is connected to the substrate S surface and the substrate stage ( The sealant is cured by irradiating with ultraviolet rays while moving on the mask along the plane of 140).

When the process as described above is completed, the hardened substrate S is carried out by a robot (not shown) to complete the hardening process.

One embodiment of the invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

100: sealant curing device
110, 210: exposed portion
120: LED element
130, 230: LED module
140: substrate stage
151: drive unit
152: support
153: guide part

Claims (10)

A substrate stage on which a sealant-coated substrate is seated;
The exposure unit is spaced apart from the upper surface of the substrate stage by a predetermined interval, and an LED module composed of LED elements is arranged in a plurality of rows, and adjacent columns among the plurality of rows are arranged to be displaced in parallel with each other. ;
A support part supporting the exposure part such that the exposure part is spaced apart from an upper surface of the substrate stage; And
A driving part horizontally moving the support part such that the exposure part horizontally moves on the substrate stage;
When the column direction in which the plurality of LED modules are arranged is referred to as the X direction, the LED modules of the plurality of rows along the X direction include a first row and a second row,
When the mutual spacing between the centers of the plurality of LED modules arranged in the first column and the second column is D, the second column is relative to the center of the LED module starting the first column along the X direction. The center of the LED module starting with the column

Sealant curing apparatus, characterized in that spaced apart by D.
delete The method of claim 1,
Sealant curing apparatus, characterized in that any of the three adjacent LED module of the LED module is equal to each other.
The method of claim 1,
When the column direction in which the plurality of LED modules are arranged is referred to as the X direction, the plurality of columns of the LED modules along the X direction include a first row, a second row, and a third row,
When the mutual spacing between the centers of the plurality of LED modules arranged in the first column, the second column and the third column is D,
The center of the LED module starting with the second column with respect to the center of the LED module starting the first column along the X direction is

Are spaced apart by D,
The center of the LED module starting with the third column with respect to the center of the LED module starting the first column along the X direction is

Sealant curing apparatus, characterized in that spaced apart by D.
The method of claim 1,
The LED device is a sealant curing apparatus, characterized in that the LED device for emitting ultraviolet light.
delete LED modules composed of LED elements spaced apart from each other and horizontally moved along the plate surface of the substrate are arranged in a plurality of rows, and neighboring columns are arranged to be displaced in parallel with each other,
When the column direction in which the plurality of LED modules are arranged is referred to as the X direction, the plurality of columns of the LED modules along the X direction include a first row and a second row,
When the mutual spacing between the centers of the plurality of LED modules arranged in the first column and the second column is D, the second column is relative to the center of the LED module starting the first column along the X direction. The center of the LED module starting with the column

LED array method for a sealant curing apparatus characterized in that spaced apart by D.
delete The method of claim 7, wherein
And any three adjacent LED modules adjacent to each other of the LED modules are equal to each other.
The method of claim 7, wherein
When the column direction in which the plurality of LED modules are arranged is referred to as the X direction, the plurality of columns of the LED modules along the X direction include a first row, a second row, and a third row,
When the mutual spacing between the centers of the plurality of LED modules arranged in the first column, the second column and the third column is D,
The center of the LED module starting with the second column with respect to the center of the LED module starting the first column along the X direction is

Are spaced apart by D,
The center of the LED module starting with the third column with respect to the center of the LED module starting the first column along the X direction is

LED array method for a sealant curing apparatus characterized in that spaced apart by D.

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