KR101302280B1 - Lighting apparatus and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A light emitting diode (LED) lighting device and a manufacturing method thereof are provided to improve luminous efficiency by using aluminum having high electric conductivity. CONSTITUTION: An aluminum thin film is adhered to the upper surface of a lower flexible film. A first electrode of an LED chip is bonded to the upper surface of the aluminum thin film. An insulating film (160) exposes a second electrode of the LED chip. A copper wire (170) is bonded to the second electrode. An upper flexible film (180) is adhered to the insulating film with a double-sided adhesive.

Description

LED lighting device and manufacturing method thereof {Lighting apparatus and method for manufacturing the same}

The present invention relates to an LED lighting device and a manufacturing method thereof.

Light emitting diodes (hereinafter referred to as "LEDs") are two-terminal diode devices including compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaN, and AlGaInP.

The LED emits visible light as light energy generated when electrons and holes are coupled when power is applied to the first electrode terminal and the second electrode terminal.

LED's field of application has been expanded from indicators of electronic products to consumer goods, advertising panels, etc. Currently, LED lamps have increased in efficiency, such as street lamps, automobile head lamps, and fluorescent lamps. It replaces general lighting source.

In addition, high power and high brightness LEDs are being applied to various lighting fields, and research and technology development on the LED lighting have been continuously made in recent years.

The present invention can increase the degree of freedom of the shape of the product, can implement a thin and light illumination, can be driven at a low power by using aluminum with high electrical conductivity, by reflecting the light emitted from the LED chip in the aluminum thin film It provides a problem that can increase the light efficiency.
On the other hand, the conventional lighting device has a disadvantage that the thickness is thick and heavy due to the thickness and weight of the printed circuit board.
For example, as disclosed in the prior document (Korean Patent No. 1069878), the LED is attached to the upper surface of the printed circuit board, the lighting device having a structure in which the first reflecting sheet is attached to the remaining area except the LED attached area Although disclosed, a thick and heavy lighting device has been realized due to the thickness and weight of a printed circuit board.
Therefore, development of technology for realizing a thin and light lighting device is required.

According to the present invention,

A lower flexible film;

An aluminum thin film bonded to an upper surface of the lower flexible film with an insulating double-sided adhesive;

An LED chip bonded with a first paste formed on the upper surface of the aluminum thin film using silver paste;

An insulating film exposing the second electrode formed on the LED chip, covering the LED chip, and attached to the aluminum thin film;

A copper conductive wire bonded to the second electrode formed on the LED chip;

A flexible LED lighting device surrounding the copper wire and composed of an upper flexible film adhered to the insulating film with a double-sided adhesive is provided.

According to the present invention,

Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;

Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;

Exposing a second electrode formed on the LED chip, covering the LED chip, and attaching an insulating film to the aluminum thin film;

Bonding a copper conductor to a second electrode formed on the LED chip;

A method of manufacturing an LED lighting device surrounding the copper wire and including attaching the upper flexible film to the insulating film with a double-sided adhesive is provided.

According to the present invention,

Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;

Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;

Exposing the entire upper surface including the second electrode formed on the LED chip, surrounding the side surface of the LED chip, and forming an insulating layer on the aluminum thin film;

Bonding a copper conductor to a second electrode formed on the LED chip;

A method of manufacturing an LED lighting device surrounding the copper wire and including attaching the upper flexible film to the insulating layer using a double-sided adhesive is provided.

According to the present invention,

Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;

Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;

Exposing the entire upper surface including the second electrode formed on the LED chip, surrounding the side surface of the LED chip, and forming an insulating layer on the aluminum thin film;

Bonding a copper conductor to a second electrode formed on the LED chip;

Wrapping the copper wire and forming an insulating flat layer on the insulating layer;

Provided is a method of manufacturing an LED lighting device comprising adhering the upper flexible film to the insulating flat layer with a double-sided adhesive.

According to the present invention,

Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;

Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;

Exposing the entire upper surface including the second electrode formed on the LED chip, surrounding the side surface of the LED chip, and forming an insulating layer on the aluminum thin film;

A second electrode pad electrically connected to a first electrode pad formed on an upper surface of the upper flexible film and electrically bonded to a second electrode formed on an upper surface of the LED chip, and lower surface of the upper flexible film Provided is a method of manufacturing an LED lighting device comprising the step of adhering to the insulating layer with a double-sided adhesive.

The present invention can be applied to the flexible film and the thin film of aluminum, to increase the degree of freedom of the shape of the product, to implement a thin and light illumination, it can be driven at low power using aluminum with high electrical conductivity, LED The light emitted from the chip is reflected from the aluminum thin film to increase the light efficiency.

1A to 1E are schematic cross-sectional views for explaining a method of manufacturing the flexible LED lighting apparatus according to the first embodiment of the present invention.
2A to 2C are schematic cross-sectional views for explaining a method of manufacturing the flexible LED lighting apparatus according to the second embodiment of the present invention.
3A and 3B are schematic cross-sectional views for explaining a method of manufacturing the flexible LED lighting apparatus according to the third embodiment of the present invention.
4A to 4D are schematic cross-sectional views for explaining a method of manufacturing the flexible LED lighting apparatus according to the fourth embodiment of the present invention.
5A and 5B are schematic plan views for explaining the upper flexible substrate applied to the flexible LED lighting apparatus of the fourth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

In this process, the size or shape of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, terms specifically defined in consideration of the structure and operation of the present invention may vary depending on the intention or custom of the user, the operator. Definitions of these terms should be based on the content of this specification.

1A to 1E are schematic cross-sectional views for explaining a method of manufacturing the flexible LED lighting apparatus according to the first embodiment of the present invention.

In the method of manufacturing the flexible LED lighting apparatus of the first embodiment of the present invention, first, as shown in FIG. 1A, the aluminum thin film 120 is formed of an insulating double-sided adhesive 110 on an upper surface of the lower flexible film 100. Glue.

Next, the first electrode formed under the LED chip 150 on the upper surface of the aluminum thin film 120 is bonded with silver paste 140 (FIG. 1B).

Subsequently, the second electrode formed on the LED chip 150 is exposed, and the insulating film 160 is attached to the aluminum thin film 120 while enclosing the LED chip 150 (FIG. 1C).

Subsequently, the copper conductor 170 is bonded to the second electrode formed on the LED chip 150 (FIG. 1D).

Thereafter, the copper conductor wire 170 is wrapped, and the upper flexible film 180 is attached to the insulating film 160 with a double-sided adhesive 181. (FIG. 1E)

Therefore, when the above-described process is performed, the lower flexible film 100; An aluminum thin film 120 adhered to an upper surface of the lower flexible film 100 with an insulating double-sided adhesive 110; An LED chip 150 having a first electrode formed on the upper surface of the aluminum thin film 120 with a silver paste 140 bonded thereto; An insulating film 160 which exposes a second electrode formed on the LED chip 150, surrounds the LED chip 150, and is attached to the aluminum thin film 120; A copper conductor line 170 bonded to the second electrode formed on the LED chip 150; The flexible LED lighting apparatus of the first exemplary embodiment of the present invention, which includes the upper flexible film 180 wrapped around the copper wire 170 and adhered to the insulating film 160 by a double-sided adhesive 181, is manufactured.

Therefore, the present invention can apply the substrate as a flexible film and a thin film of aluminum, to increase the degree of freedom of the shape of the product, to implement a thin and light illumination, it can be driven at a low power using a high electrical conductivity aluminum In addition, the light emitted from the LED chip is reflected from the aluminum thin film, thereby increasing the light efficiency.

2A to 2C are schematic cross-sectional views illustrating a method of manufacturing the flexible LED lighting apparatus according to the second embodiment of the present invention.

In the method of manufacturing the flexible LED lighting apparatus according to the second embodiment of the present invention, a process of adhering the aluminum thin film 120 to the upper surface of the lower flexible film 100 with an insulating double-sided adhesive 110 is performed. Bonding the first electrode formed on the lower surface of the LED chip 150 on the upper surface of the thin film 120 with silver paste, and then as shown in Figure 2a, the second electrode formed on the LED chip 150 The entire upper surface is exposed, and the insulating layer 210 is formed on the aluminum thin film 120 while covering the side surface of the LED chip 150.

At this time, the upper surface of the insulating layer 210 is located on the same plane and substantially flat, the upper surface of the LED chip 150 is to be flat.

Thereafter, the copper conductor 170 is bonded to the second electrode formed on the LED chip 150 (FIG. 2B).

Subsequently, the copper flexible wire 170 is wrapped, and the upper flexible film 180 is attached to the insulating layer 210 with a double-sided adhesive 181. (FIG. 2C)

That is, in the method of manufacturing the flexible LED lighting apparatus of the second embodiment of the present invention, by forming an insulating layer flat with the LED chip 150, the subsequent process can be performed smoothly, and the adhesive force of the upper flexible film can be made uniform. It can be.

3A and 3B are schematic cross-sectional views for explaining a method of manufacturing the flexible LED lighting apparatus of the third embodiment of the present invention.

In the manufacturing method of the flexible LED lighting apparatus according to the third embodiment of the present invention, after the above-described process of FIG. 2B, the copper conductor wire 170 is wrapped, and an insulating flat layer 220 is formed on the insulating layer 210. 3a)

Subsequently, the upper flexible film 180 is attached to the insulating flat layer 220 with a double-sided adhesive 181 (FIG. 3B).

Therefore, the method of manufacturing the flexible LED lighting apparatus of the third embodiment of the present invention can further secure the flatness of the lighting apparatus with the insulating flat layer 220.

4A to 4D are schematic cross-sectional views illustrating a method of manufacturing the flexible LED lighting apparatus according to the fourth embodiment of the present invention, and FIGS. 5A and 5B are upper flexible parts applied to the flexible LED lighting apparatus according to the fourth embodiment of the present invention. A schematic plan view for explaining a substrate.

In the manufacturing method of the flexible LED lighting apparatus according to the fourth embodiment of the present invention, as shown in FIG. 4A, the aluminum thin film 120 is adhered to the upper surface of the lower flexible film 100 with an insulating double-sided adhesive 110.

Subsequently, the first electrode formed under the LED chip 150 on the upper surface of the aluminum thin film 120 is bonded with silver paste (FIG. 4B).

Subsequently, as shown in FIG. 2A, the entire upper surface including the second electrode formed on the LED chip 150 is exposed, and an insulating layer (not shown) is wrapped around the side surface of the LED chip 150. 210) (FIG. 4C).

Next, a second electrode pad 320 electrically connected to the first electrode pad 330 formed on the upper surface of the upper flexible film 180 and formed on the lower surface of the LED chip 150. The two electrodes are electrically bonded to each other, and the lower surface of the upper flexible film 180 is attached to the insulating layer 210 with a double-sided adhesive 181 (FIG. 4D).

As described above, the method of manufacturing the flexible LED lighting apparatus according to the fourth embodiment of the present invention includes: a first electrode pad formed on an upper surface thereof; One electrode terminal of the LED lighting apparatus is formed on the upper surface of the upper flexible film 180 by using the upper flexible film 180 having the second electrode pad electrically connected to the first electrode pad and formed on the lower surface. It is applied to the first electrode pad and another electrode terminal is applied to the upper surface of the aluminum thin film 120 exposed to the insulating layer 210, there is an advantage that can be easily connected to the external power supply.

That is, as shown in FIG. 5A, a second electrode pad 320 bonded to the second electrode on the LED chip 150 is formed on a lower surface of the upper flexible film 180, as shown in FIG. 5B. A first electrode pad 330 electrically connected to the second electrode pad 320 is formed on an upper surface of the upper flexible film 180.

In this case, the second electrode pad 320 may be electrically connected to the first electrode pad 330 through the electrode line 321 and the conductive via hole 322 formed on the lower surface of the upper flexible film 180. .

While the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the following claims.

Claims (5)

A lower flexible film;
An aluminum thin film bonded to an upper surface of the lower flexible film with an insulating double-sided adhesive;
An LED chip bonded with a first paste formed on the upper surface of the aluminum thin film using silver paste;
An insulating film exposing the second electrode formed on the LED chip, covering the LED chip, and attached to the aluminum thin film;
A copper conductive wire bonded to the second electrode formed on the LED chip;
A flexible LED lighting device surrounding the copper conductor and consisting of an upper flexible film bonded to the insulating film with a double-sided adhesive.
Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;
Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;
Exposing a second electrode formed on the LED chip, covering the LED chip, and attaching an insulating film to the aluminum thin film;
Bonding a copper conductor to a second electrode formed on the LED chip;
A method of manufacturing an LED lighting device surrounding the copper conductor and comprising attaching an upper flexible film to the insulating film using a double-sided adhesive.
Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;
Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;
Exposing the entire upper surface including the second electrode formed on the LED chip, surrounding the side surface of the LED chip, and forming an insulating layer on the aluminum thin film;
Bonding a copper conductor to a second electrode formed on the LED chip;
Wrapping the copper wire, the method of manufacturing an LED lighting device comprising the step of adhering the upper flexible film to the insulating layer with a double-sided adhesive.
Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;
Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;
Exposing the entire upper surface including the second electrode formed on the LED chip, surrounding the side surface of the LED chip, and forming an insulating layer on the aluminum thin film;
Bonding a copper conductor to a second electrode formed on the LED chip;
Wrapping the copper wire and forming an insulating flat layer on the insulating layer;
A method of manufacturing an LED lighting device comprising the step of adhering the upper flexible film to the insulating flat layer with a double-sided adhesive.
Bonding an aluminum thin film to an upper surface of a lower flexible film with an insulating double-sided adhesive;
Bonding a first electrode formed on the upper surface of the aluminum thin film to a lower portion of an LED chip with silver paste;
Exposing the entire upper surface including the second electrode formed on the LED chip, surrounding the side surface of the LED chip, and forming an insulating layer on the aluminum thin film;
A second electrode pad electrically connected to a first electrode pad formed on an upper surface of the upper flexible film and electrically bonded to a second electrode formed on an upper surface of the LED chip, and lower surface of the upper flexible film Method of manufacturing an LED lighting device comprising the step of adhering to the insulating layer with a double-sided adhesive.

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