KR101276525B1 - Flooring material using polylactic acid resin with wood chip inraid and printing complex layer - Google Patents

Abstract

Disclosed is a PLA flooring having a wood chip inlay and printed composite structure that is environmentally friendly and improves the natural feeling using PLA resin.
The PLA flooring having a wood chip inlay and printed composite structure according to the present invention is a wood chip inlaid layer, a glass fiber (G / F) impregnated layer and a printed pattern formed on the upper surface from above. Including a back layer, wherein the wood chip inlay deude layer and one or more layers of the back layer is characterized in that it comprises a PLA (Polylactic acid) resin.

Description

PLA Flooring with Wood Chip Inlay and Printed Composite Structure {FLOORING MATERIAL USING POLYLACTIC ACID RESIN WITH WOOD CHIP INRAID AND PRINTING COMPLEX LAYER}

The present invention relates to a flooring having a laminated structure, and more specifically, by using a protective layer, a wood chip inlaid layer, a backing layer, etc. as a PLA resin (Polylactic acid resin) constituting the flooring can be implemented eco-friendly flooring, wood The present invention relates to a PLA flooring material having a wood chip inlay and a printed composite structure that can enhance the appearance reality of wood chip inlay through a chip inlay and a printed composite structure on the top.

BACKGROUND ART Floor materials using petroleum resins such as polyvinyl chloride (PVC) are widely used as flooring in buildings such as houses, mansions, apartments, offices and shops.

The flooring material as described above is manufactured by extrusion or car rendering method using a resin such as polyvinyl chloride (PVC). However, since the raw materials are obtained entirely from crude oil, which is a limited resource, it is expected that problems such as difficulty in supplying raw materials in the future will occur due to depletion of petroleum resources.

Further, polyvinyl chloride (PVC) -based flooring has a problem that it easily discharges harmful substances and burdens the environment even at the time of disposal even considering the recent interest in environmental problems.

An object of the present invention in the construction of wood chip inlay de flooring using PLA resin, by using a PLA resin to form a protective layer, wood chip inlay deucheung layer, upper layer, backing layer and the like to realize eco-friendly flooring, and also wood To provide a PLA flooring material having a wood chip inlay and printed composite structure that can enhance the appearance reality of the wood chip inlay through the chip inlay layer and the printed composite structure on the top.

The PLA flooring having a wood chip inlay and a printed composite structure according to an embodiment of the present invention for achieving the above object contains a wood chip, the wood chip inlaid is a printed pattern formed on the upper surface )layer; And a backing layer formed under the wood chip inlaid layer, wherein at least one of the wood chip inlaid layer and the backing layer includes a polylactic acid (PLA) resin.

According to another aspect of the present invention, a PLA flooring having a wood chip inlay and a printed composite structure includes a wood chip, and a wood chip inlay layer having a printed pattern formed thereon; A dimension stabilization layer formed under the wood chip inlaid layer; And a backing layer formed below the dimensionally stable layer, wherein at least one of the wood chip inlaid layer and the backing layer comprises a PLA resin.

According to another aspect of the present invention, a PLA flooring having a wood chip inlay and a printed composite structure includes a wood chip and a wood chip inlay layer having a printed pattern formed thereon; An upper layer formed below the wood chip inlaid layer; A dimensionally stable layer formed below the upper layer; And a backing layer formed below the dimensionally stable layer, wherein at least one of the wood chip inlaid layer, the top layer, and the backing layer includes a PLA resin.

According to another aspect of the present invention, a PLA flooring having a wood chip inlay and a printed composite structure includes: a wood chip inlay layer containing a wood chip; A back layer formed under the wood chip inlaid layer; And a protective layer formed on the wood chip inlaid layer, wherein at least one of the wood chip inlaid layer, the back layer, and the protective layer includes a PLA resin, and a bottom surface or an inside or the wood chip of the protective layer. The upper surface of the inlaid layer is characterized in that the printed pattern is formed.

According to another aspect of the present invention, a PLA flooring having a wood chip inlay and a printed composite structure includes: a wood chip inlay layer containing a wood chip; A dimension stabilization layer formed under the wood chip inlaid layer; A back layer formed below the dimensionally stable layer; And a protective layer formed on the wood chip inlaid layer, wherein at least one of the wood chip inlaid layer, the back layer, and the protective layer includes a PLA resin, and a bottom surface or an inside or the wood chip of the protective layer. The upper surface of the inlaid layer is characterized in that the printed pattern is formed.

According to another aspect of the present invention, a PLA flooring having a wood chip inlay and a printed composite structure includes: a wood chip inlay layer containing a wood chip; An upper layer formed below the wood chip inlaid layer; A dimensionally stable layer formed below the upper layer; A back layer formed below the dimensionally stable layer; And a protective layer formed on the wood chip inlaid layer, wherein at least one of the wood chip inlaid layer, an upper layer, a back layer, and a protective layer includes a PLA resin, and a lower surface or an inside or the bottom of the protective layer. The upper surface of the wood chip inlaid layer is characterized in that the printed pattern is formed.

The floorings presented in the above embodiments may further include a surface treatment layer on the surface of the flooring material, and may further include a backing fiber layer formed under the backing layer. In addition, the upper layer and the dimensionally stable layer may be formed of one layer.

PLA flooring having a wood chip inlay and printed composite structure according to the present invention is a wood chip inlay layer containing the wood chip and the printing of the upper portion is combined to combine the natural reality of the wood chip and various printing effects are important for interior materials There is an advantage of increasing the appearance diversity as an element.

In addition, the PLA flooring having a wood chip inlay and printed composite structure according to the present invention has an advantage that can be minimized by the temperature change of the PLA resin by introducing a glass fiber impregnated layer.

In addition, the PLA flooring having a wood chip inlay and printed composite structure according to the present invention can maximize the natural sense by forming a back fiber layer with jute or the like on the back of the floor, visual recognition by adding wood flour, chaff, rosin on the back layer Differentiated effects such as fragrance can be obtained.

PLA flooring having a wood chip inlay and printed composite structure according to the present invention in forming a wood chip inlay de flooring, by forming a protective layer, wood chip inlay deucheung layer, top layer, backing layer, etc. with a plant-based PLA resin There is an advantage to implement eco-friendly.

1 to 15 are cross-sectional views showing embodiments of the PLA flooring having a wood chip inlay and printed composite structure according to the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, with reference to the accompanying drawings it will be described in detail with respect to PLA flooring having a wood chip inlay and printed composite structure according to the present invention.

1 to 15 are cross-sectional views showing embodiments of the PLA flooring having a wood chip inlay and printed composite structure according to the present invention.

The basic structure of the PLA flooring having the wood chip inlay and printed composite structure according to the present invention is shown in FIG.

Referring to Figure 1, the basic structure of the flooring according to the present invention includes a back layer 110 and the wood chip inlay deucheung 120 from below.

At this time, in the present invention, at least one of the wood chip inlay deucheung layer 120 and the back layer 110 includes a polylactic acid (PLA) resin. In addition, a printed pattern is formed on the upper surface of the wood chip inlaid layer 120.

PLA resin is a thermoplastic polyester of lactide or lactic acid, and may be prepared by polymerizing lactic acid produced by fermenting starch extracted from renewable plant resources such as corn and potato. These PLA resins are environmentally friendly substances that can reduce the emission of environmentally harmful substances such as CO ₂ as compared with petroleum-based materials such as polyvinyl chloride (PVC) during use or disposal, .

The PLA resin can be divided into a crystalline PLA (c-PLA) resin and an amorphous PLA (a-PLA) resin. At this time, in the case of the crystalline PLA resin, it is preferable to use an amorphous PLA resin because a bleeding phenomenon in which the plasticizer flows out to the sheet surface may occur. When an amorphous PLA resin is used, there is an advantage that a compatibilizer which is essentially added to prevent bleeding phenomenon is not added. When an amorphous PLA resin is used, it is most preferable to use a 100% amorphous PLA resin as the PLA resin, and a PLA resin in which crystalline and amorphous coexist can be used, if necessary.

The PLA resin for forming the wood chip inlaid layer 120 or the back layer 110 may further include an acrylic copolymer as a nonphthalate plasticizer and a melt strength enhancer.

Eco-friendly non-phthalate plasticizer to soften the PLA resin to increase the thermoplasticity, such as to facilitate the molding process at high temperature, ATBC (Acetyl tributyl citrate) and the like.

The non-phthalate plasticizer is preferably used in the ratio of 5 to 60 parts by weight based on 100 parts by weight of the PLA chip inlaid layer 120 and the back layer 110 in common.

When the non-phthalate plasticizer is used in less than 5 parts by weight relative to 100 parts by weight of the PLA resin in each layer, the hardness of the PLA resin may be increased and workability may be reduced, and the non-phthalate plasticizer may be 100 parts by weight of the PLA resin in each layer. When it exceeds 60 parts by weight, physical properties such as workability due to a decrease in compatibility with other components forming each layer may be deteriorated.

Acrylic copolymers are used as melt strength enhancers. The PLA resin itself has poor melt strength or heat resistance, and the acrylic copolymer not only complements the above-mentioned disadvantages of the PLA resin, but also enables the car-rendering and press processing.

Also, the acrylic copolymer could be applied to the car-rendering and pressing of PLA resin.

The acrylic copolymer may be used in a ratio of 0.1 to 20 parts by weight based on 100 parts by weight of the PLA chip inlay deucheung layer 120, the back layer 110 in common. When the content of the acrylic copolymer is less than 0.1 part by weight, improvement of the melting efficiency and improvement of the melt strength of the PLA resin is insufficient, and when the content of the acrylic copolymer exceeds 20 parts by weight, the manufacturing cost of each layer constituting the bottom material increases , Compatibility with other materials constituting each layer, and the like, the overall physical properties of each layer may be deteriorated.

The weight average molecular weight (Mw) of the acrylic copolymer is not particularly limited, but from the viewpoint of improvement in melt strength during processing and compatibility with other materials, it is preferable to use one having a weight average molecular weight of 800,000 to 6,000,000.

The PLA resin may further include a lubricant to prevent the resin from adhering to the calender roll or the press during processing such as car rendering, pressing, and the like.

Although there are various types of such lubricants, the present invention uses higher fatty acids corresponding to environmentally friendly lubricants, and in particular, stearic acid, which is a saturated higher fatty acid having 18 carbon atoms, may be used.

The lubricant may be used in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the PLA chip inlaid layer 120 and the back layer 110 in common. If the amount of lubricant is less than 0.01 part by weight based on 100 parts by weight of the PLA resin, the effect of using lubricant is not obtained. If the amount of the lubricant is more than 10 parts by weight based on 100 parts by weight of the PLA resin, the impact resistance, heat resistance and gloss of the PLA resin are There is a problem that may degrade the degree.

In addition, in order to prevent mechanical properties such as impact resistance from being degraded through hydrolysis of the PLA resin, an anti-hydrolysis agent may be additionally added to the PLA resin. The hydrolysis agent can be used without limitation so long as it is usually used as a hydrolysis agent such as carbodiimide and oxazoline.

The hydrolysis agent is preferably added within the range of 10 parts by weight or less with respect to 100 parts by weight of the PLA chip inlay deucheung layer 120 and the back layer 110 in common. When the hydrolysis agent exceeds 10 parts by weight relative to 100 parts by weight of the PLA resin, molding processability may be reduced.

In addition, when the PLA resin is applied to the wood chip inlay deucheung layer 120 or the back layer 110, each layer of titanium dioxide (CaCO ₃ ), which is a reinforcing inorganic filler for the purpose of imparting aesthetics, such as titanium dioxide ( TiO ₂ ) may be added further.

In the case of calcium carbonate, the wood chip inlaid layer 120 may be used in an amount of 500 parts by weight or less relative to 100 parts by weight of the PLA resin, and the back layer 110 may be used in an amount of 1000 parts by weight or less based on 100 parts by weight of the PLA resin. In addition, in the case of titanium dioxide, the wood chip inlaid layer 120 is preferably used in an amount of 50 parts by weight or less based on 100 parts by weight of PLA resin, and 50 parts by weight or less in 100 parts by weight of PLA resin for the back layer 110, respectively. If calcium carbonate or titanium dioxide is used in excess of the above range, the bonding force of the other components may be lowered and the workability may be lowered.

In the present invention, the back layer 110 is the most basic layer of the flooring material, and supports the wood chip inlay deucheung 120 of the upper, and serves to absorb the impact of the upper or lower. The back layer 110 may be formed by stacking one layer or two or more layers in the form of a foamed layer or a non-foamed layer.

The back layer 110 is 100 parts by weight of PLA resin, 5 to 60 parts by weight of a non-phthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer, 0.01 to 10 parts by weight of a lubricant, and 10 parts by weight of a hydrolysis agent as a melt strength modifier. Or less than 1000 parts by weight of calcium carbonate (CaCO ₃ ), one or more of 200 parts by weight or less of wood flour and chaff, 50 parts by weight or less of titanium dioxide (TiO ₂ ), and 20 parts by weight or less of rosin. When wood flour, chaff, and rosin are included in the backing layer, it serves to improve the natural texture of the flooring material. If wood flour is added in excess of the above range, workability may be impaired. It is preferable.

The back layer 110 preferably has a thickness of 5.0 mm or less in terms of manufacturing cost.

The wood chip inlay deucheung 120 includes a wood chip having a marble, monochromatic or multi-colored appearance to give the appearance, texture and unique wood fragrance of natural wood. Such wood chips can be manufactured by drying and pulverizing plant materials, and are not limited to wood chips and the like, and can be used singly or mixed with chaff and bamboo chips. have.

The particle size of the wood chips is preferably 10 to 120 mesh. If the particle size of the wood chip is less than 10 mesh, the appearance characteristics are deteriorated, and if the particle size of the wood chip exceeds 120 mesh, the cost of manufacturing the wood chip is excessive.

The wood chip inlaid layer 120 may be manufactured by adding the wood chip to a raw material including PLA resin and processing the sheet chip into a sheet-like molded body by a calendering method or the like.

As such, the wood chip inlaid layer 120 serves to provide natural reality by the inserted wood chips.

The wood chip included in the wood chip inlaid layer 120 is preferably added in an amount of 200 parts by weight or less with respect to 100 parts by weight of the PLA resin. If the wood chip exceeds 200 parts by weight based on 100 parts by weight of the PLA resin, the moldability may be lowered due to the decrease in strength while reducing the natural reality.

The wood chip inlaid layer 120 is also 5 to 60 parts by weight of a non-phthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer as a melt strength modifier, 0.01 to 10 parts by weight of lubricant, and moisture resistance based on 100 parts by weight of PLA resin. It may include one or more additives of 10 parts by weight or less of release, 500 parts by weight or less of calcium carbonate (CaCO ₃ ), and 50 parts by weight or less of titanium dioxide (TiO ₂ ).

The wood chip inlaid layer 120 is preferably formed to a thickness of 0.1 ~ 1.0 mm. If the thickness of the wood chip inlay deucheung layer 120 is less than 0.1 mm, it is difficult to form, and if it exceeds 1.0 mm, the manufacturing cost is increased.

The printed pattern is formed on the upper surface of the wood chip inlaid layer 120 or the lower surface of the protective layer 180 or the protective layer 180 shown in FIG. 10 to be described later. Such printed pattern may be made in various ways such as transfer printing, gravure printing, screen printing, offset printing, rotary printing or flexographic printing, inkjet printing, and the like.

When the printed pattern is formed under the wood chip inlay deucheung 120, the wood chip inlay light layer 120 covers the printed pattern so that the overall color of the flooring depends on the wood chip inlay deucheung. Therefore, although the natural reality of the wood chip is excellent, there is a limit in implementing various effects other than the wood chip in appearance.

Therefore, the printed pattern is preferably formed on the upper side of the wood chip inlaid layer 120.

In the embodiment shown in FIG. 2, in the above basic structure, the surface treatment layer 130 is further included on the wood chip inlaid layer 120.

The surface treatment layer 130 is formed on the wood chip inlaid layer 120 for the purpose of improving surface quality such as scratch resistance and abrasion resistance of the flooring material, and improving cleaning resistance to facilitate cleaning. The surface treatment layer 130 may include polyurethane, urethane acrylate, wax, and the like.

The surface treatment layer 130 may be formed by various methods. For example, when urethane acrylate is used, the urethane acrylate UV curable composition may be coated on the wood chip inlay layer 120 and cured by ultraviolet irradiation. Further, a thermosetting wax may be applied on the wood chip inlay layer 120, and the mixture may be cured by passing through a hot air oven.

It is preferable that the surface treatment layer 130 has a thickness of 0.01 to 0.1 mm. When the surface treatment layer 130 is formed to a thickness of less than 0.01 mm, it is difficult to expect the effect of improving the physical properties such as scratch resistance, and when the surface treatment layer 130 exceeds 0.1 mm, excessive manufacture of the surface treatment layer Cost is required and there is a problem that may lower the appearance quality of the flooring.

3 illustrates that the dimension stabilization layer 140 is further included between the back layer 110 and the wood chip inlaid layer 120 in the structure illustrated in FIG. 2.

The dimensionally stable layer 140 serves to complement the dimensional stability of the sheet using the PLA resin, and the glass fiber (G / F) may be formed of at least one of acrylic resin, melamine resin and PLA resin As shown in FIG.

In the case of a floor material using a PLA resin, the dimension changes due to a change in temperature due to heating or the like, and consequently, a phenomenon such as a connection between the flooring materials may occur due to shrinkage. As a result, the dimensional stability layer (140) Thereby preventing the above-described phenomenon.

In this case, the glass fiber preferably has a mass per unit area of 30 ~ 150 g / m ² . If the mass per unit area of the glass fiber is less than 30 g / m ² , the effect of dimensional stability reinforcement may be insufficient. If the mass per unit area of the glass fiber exceeds 150 g / m ² , the wood chip inlay layer 120 layer and There is a problem that the adhesion between the dimensionally stable layer 140 or the adhesion between the dimensionally stable layer 140 and the back layer 110 may be lowered.

The dimensional stabilizer layer 140 is a non-phthalate plasticizer such as ATBC, a viscosity lowering agent, calcium carbonate, inorganic pigments for cost reduction, such as acrylic resins, etc. Or two or more kinds may be included.

In the non-phthalate plasticizer such as ATBC, the materials added to the dimensionally stable layer 140 are preferably added in an amount of 40 to 150 parts by weight based on 100 parts by weight of the resin, and in the case of a viscosity reducing agent, 30 parts by weight or less and calcium carbonate. In the case of 150 parts by weight or less, in the case of titanium dioxide it is preferably added to 20 parts by weight or less.

In the case of the non-phthalate plasticizer, when added in an amount of less than 40 parts by weight relative to 100 parts by weight of the resin, the hardness of the dimensional stabilization layer may increase, resulting in poor workability. Stability may be impaired. When the viscosity reducing agent is added in an amount exceeding 30 parts by weight based on 100 parts by weight of the acrylic resin, moldability may be deteriorated due to an excessive viscosity drop. In the case of calcium carbonate and titanium dioxide, when added in an amount exceeding the above range, the adhesive strength with other components may be lowered and the workability may be lowered.

The dimensionally stable layer 140 preferably has a thickness of 0.1 ~ 1.0 mm. In the present invention, when the thickness of the dimensionally stable layer 140 is less than 0.1 mm, the dimensional stability effect may be insufficient, and when the thickness of the dimensionally stable layer 140 exceeds 1.0 mm, only the thickness becomes thick without further dimensional stability effect. This results in an increase in the overall manufacturing cost of the flooring.

4 illustrates that the upper layer 150 is further included between the wood chip inlaid layer 120 and the dimensionally stable layer 140 in the structure shown in FIG. 3. In the embodiment shown in FIG. 4, at least one of the wood chip inlaid layer 120, the back layer 110, and the top layer 150 uses PLA resin.

The upper layer 150 is formed on the dimensionally stable layer 140 serves to give elasticity to the flooring. The upper layer 150 may be formed by laminating one or more layers in the form of a foam layer, a non-foamed layer, and a partially foamed layer.

The upper layer 150 may be formed using a PLA resin, and the additives shown in the back layer 110 such as a non-phthalate plasticizer and an acrylic copolymer may be further included.

The thickness of the upper layer 150 is preferably 0.05 ~ 1.0 mm. If the thickness of the upper layer 150 is less than 0.05 mm, it may be difficult to form, and if the thickness of the upper layer 150 exceeds 1.0 mm, the flooring cost may increase.

In the embodiment illustrated in FIG. 5, in the structure illustrated in FIG. 4, the upper layer 150 and the dimensionally stable layer 140 are formed in the form of one layer as the upper / dimension layer 145.

In this case, the top / dimension layer 145 serves to protect the back layer 110 and at the same time exert a dimensional stability effect.

As an example of such an upper / dimension layer 145, an upper layer may be formed using PLA resin, and the upper layer may be formed by impregnating glass fibers to obtain a dimensional stability effect.

In the embodiment shown in FIG. 6, in the structure shown in FIG. 5, the back fiber layer 160 is further included below the back layer 110. In the embodiment shown in FIG. 7, the structure shown in FIG. 4 is illustrated. In the lower portion of the back layer 110, the back fiber layer 160 is further included.

The back fiber layer 160 is located at the bottom of the back layer 110 in the flooring according to the present invention serves to improve the natural feeling. The back fiber layer 160 may be formed by using alone or two or more kinds of fibers such as jute, white horse, cotton, nylon, polyester, and the like.

The back fiber layer 160 is preferably formed to a thickness of 0.1 ~ 2.0 mm in consideration of the natural feeling improving side and manufacturing cost.

In the embodiment shown in FIG. 8, in the structure shown in FIG. 6, the adhesive layer 170 is further included between the back layer 110 and the back fiber layer 160. In the embodiment shown in FIG. In the structure shown in FIG. 6, the adhesive layer 170 is further included between the back layer 110 and the back fiber layer 160.

The adhesive layer 170 is formed at the bottom of the back layer 110 to attach the bottom back fiber layer 160. The adhesive layer 170 may be formed of a conventional adhesive composition or selected from acrylic resins, urethane resins, melamine resins, epoxy resins and vinyl acetate resins having excellent adhesion and formability, and the thickness thereof is 0.2 mm in terms of manufacturing cost. It is preferable that it is the following.

10 to 15 show that the protective layer 180 is formed on the wood chip inlaid layer 120, respectively. In the present exemplary embodiment, the printed pattern may be formed on the top surface of the wood chip inlay deucheung 120, and may also be formed on the bottom surface or inside of the protective layer 180 instead of the top surface of the wood chip inlay deucheung 120. . The printed pattern formed inside the protective layer 180 may be applied to the protective layer by laminating two or more sheets. The protective layer 180 may include a PLA resin.

The protective layer 180 protects the printed pattern formed on the upper surface of the wood chip inlaid layer 120 or the lower surface of the protective layer 180 and gives a three-dimensional impression.

The protective layer 180 is one of 5 to 50 parts by weight of the non-phthalate plasticizer, 0.1 to 20 parts by weight of the acrylic copolymer, 0.01 to 10 parts by weight of the lubricant and 10 parts by weight or less of the hydrolysis agent, based on 100 parts by weight of the PLA resin. It may be formed including the above.

It is preferable that the thickness of the protective layer 180 is 0.1 to 1.0 mm. If the thickness of the protective layer 180 is less than 0.1 mm, the printed pattern protection effect immediately below the protective layer is insufficient, and the thickness of the protective layer 180 is 1.0. Exceeding mm can lead to an increase in overall flooring costs.

In the present invention, a method for producing a back layer including PLA resin by applying a calendering method or the like is not particularly limited. For example, after mixing and kneading the respective raw materials including the above-described PLA resin, a desired sheet It may be produced through a process of calendering molding into a shape.

The mixing and kneading of the raw materials can be performed, for example, by using a super mixer, an extruder, a kneader, a double or triple roll, or the like in the form of a liquid or a powdery raw material. Further, in the mixing and kneading step of the raw materials, the blended raw materials are kneaded at a temperature of about 120 to 200 DEG C using a Banbury mixer or the like, and the kneaded raw materials are heated to about 120 to 200 DEG C The mixing and kneading steps may be repeatedly carried out in multiple stages as in the case of primary and secondary mixing using a two-roll mill or the like at a temperature of 50 to 100 ° C.

On the other hand, the method of manufacturing the sheet-like back layer by applying the mixed raw materials as described above to the calendering method is not particularly limited, for example, to be prepared using a conventional apparatus such as an inverted L four-roll roll calender. Can be.

The car rendering processing conditions described above can be appropriately selected in consideration of the composition of the resin composition to be used, and the car rendering processing can be performed within a processing temperature range of about 120 to 200 ° C.

As described above, the PLA flooring having a wood chip inlay and printed composite structure according to the present invention can implement an eco-friendly flooring by forming a wood chip inlay or backing layer with a PLA resin based on plant resources, glass fiber impregnated layer By introducing this has the advantage of minimizing the dimensional change according to the temperature change of the PLA resin.

In addition, the wood chip inlay de flooring using the PLA resin according to the present invention has the advantage of increasing the natural reality by applying the wood chip inlay and printed composite structure, to maximize the natural feeling by forming the back fiber layer with jute on the back In addition, by adding wood flour, rice hull, and rosin to the back layer, differentiating effects such as visual perception and fragrance can be obtained.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. . Accordingly, the true scope of the present invention should be determined by the following claims.

110: back layer
120: Wood Chip Inlay Floor
130: surface treatment layer
140: dimensionally stable layer
145: top / dimension layer
150: upper layer
160: back side fiber layer
170: Adhesive layer
180: protective layer

Claims (34)

A wood chip inlaid layer containing wood chips and having a printed pattern formed thereon; And
A backing layer formed under the wood chip inlaid layer,
At least one of the wood chip inlaid layer and the back layer includes an amorphous PLA (Polylactic acid) resin, the wood chip inlaid layer is based on 100 parts by weight of PLA resin, 5 to 60 parts by weight of a non-phthalate plasticizer, a melt strength reinforcing agent 0.1-20 parts by weight of acrylic copolymer, 0.01-10 parts by weight of lubricant, 10 parts by weight or less of anti-hydrolysis agent, 500 parts by weight or less of calcium carbonate (CaCO3) and 50 parts by weight or less of titanium dioxide (TiO2) PLA flooring having a wood chip inlay and printed composite structure comprising at least one of.
A wood chip inlaid layer containing wood chips and having a printed pattern formed thereon;
A dimension stabilization layer formed under the wood chip inlaid layer; And
A back layer formed below the dimensionally stable layer,
At least one of the wood chip inlaid layer and the back layer comprises an amorphous PLA resin, the wood chip inlaid layer is based on 100 parts by weight of the PLA resin, 5 to 60 parts by weight of the non-phthalate plasticizer, acrylic copolymer as a melt strength enhancer 0.1 to 20 parts by weight, lubricating agent 0.01 to 10 parts by weight, 10 parts by weight or less of the anti-hydrolysis agent, 500 parts by weight or less of calcium carbonate (CaCO3) and 50 parts by weight or less of titanium dioxide (TiO2) PLA flooring having a wood chip inlay and printed composite structure comprising a.
A wood chip inlaid layer containing wood chips and having a printed pattern formed thereon;
An upper layer formed below the wood chip inlaid layer;
A dimensionally stable layer formed below the upper layer; And
Includes; the back layer is formed below the dimensionally stable layer,
At least one of the wood chip inlaid layer, the top layer and the back layer comprises an amorphous PLA resin, the wood chip inlaid layer is 5 to 60 parts by weight of a non-phthalate plasticizer, based on 100 parts by weight of the PLA resin, acrylic-based as a melt strength reinforcement 0.1 to 20 parts by weight of copolymer, 0.01 to 10 parts by weight of lubricant, 10 parts by weight or less of anti-hydrolysis agent, 500 parts by weight or less of calcium carbonate (CaCO3) and 50 parts by weight or less of titanium dioxide (TiO2) PLA flooring having a wood chip inlay and printed composite structure comprising the above.
A wood chip inlaid layer containing wood chips;
A back layer formed under the wood chip inlaid layer; And
And a protective layer formed on the wood chip inlaid layer.
At least one of the wood chip inlaid layer, backing layer, and protective layer is amorphous. Includes PLA (Polylactic acid) resin,
A printed pattern is formed on the lower surface or the inner surface of the protective layer or the upper surface of the wood chip inlaid layer, and the wood chip inlaid layer is 5 to 60 parts by weight of a non-phthalate plasticizer, based on 100 parts by weight of the PLA resin. 0.1 to 20 parts by weight of acrylic copolymer, 0.01 to 10 parts by weight of lubricant, 10 parts by weight or less of anti-hydrolysis agent, 500 parts by weight or less of calcium carbonate (CaCO3) and 50 parts of titanium dioxide (TiO2) as strength reinforcing agents PLA flooring having a wood chip inlay and printed composite structure comprising at least one part.
A wood chip inlaid layer containing wood chips;
A dimension stabilization layer formed under the wood chip inlaid layer;
A back layer formed below the dimensionally stable layer; And
And a protective layer formed on the wood chip inlaid layer.
At least one of the wood chip inlaid layer, backing layer and protective layer comprises an amorphous PLA resin,
A printed pattern is formed on the lower surface or the inner surface of the protective layer or the upper surface of the wood chip inlaid layer, and the wood chip inlaid layer is 5 to 60 parts by weight of a non-phthalate plasticizer, based on 100 parts by weight of the PLA resin. 0.1 to 20 parts by weight of acrylic copolymer, 0.01 to 10 parts by weight of lubricant, 10 parts by weight or less of anti-hydrolysis agent, 500 parts by weight or less of calcium carbonate (CaCO3) and 50 parts of titanium dioxide (TiO2) as strength reinforcing agents PLA flooring having a wood chip inlay and printed composite structure comprising at least one part.
A wood chip inlaid layer containing wood chips;
An upper layer formed below the wood chip inlaid layer;
A dimensionally stable layer formed below the upper layer;
A back layer formed below the dimensionally stable layer; And
And a protective layer formed on the wood chip inlaid layer.
At least one of the wood chip inlaid layer, top layer, back layer, and protective layer comprises an amorphous PLA resin,
A printed pattern is formed on the lower surface or the inner surface of the protective layer or the upper surface of the wood chip inlaid layer, and the wood chip inlaid layer is 5 to 60 parts by weight of a nonphthalate plasticizer, based on 100 parts by weight of the PLA resin. 0.1 to 20 parts by weight of acrylic copolymer, 0.01 to 10 parts by weight of lubricant, 10 parts by weight or less of anti-hydrolysis agent, 500 parts by weight or less of calcium carbonate (CaCO3) and 50 parts of titanium dioxide (TiO2) as strength reinforcing agents PLA flooring having a wood chip inlay and printed composite structure comprising at least one part.
7. The method according to any one of claims 1 to 6,
The PLA flooring having a wood chip inlay and printed composite structure further comprising a surface treatment layer formed on the top surface of the flooring.
7. The method according to any one of claims 1 to 6,
Wood chip inlay and PLA flooring having a printed composite structure further comprising a back fiber layer formed on the bottom of the back layer.
The method according to claim 3 or 6,
The top layer and the dimensionally stable layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that formed in one layer.
7. The method according to any one of claims 1 to 6,
The PLA resin layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that the PLA resin further comprises an acrylic copolymer as a non-phthalate plasticizer and a melt strength enhancer.
The method of claim 10,
Wherein the plasticizer is ATBC (acetyl tributyl citrate) Wood chip inlay and PLA flooring having a printed composite structure.
The method of claim 10,
The layer comprising the PLA resin is PLA flooring having a wood chip inlay and printed composite structure further comprises at least one of a hydrolysis agent and a lubricant in the PLA resin.
delete 7. The method according to any one of claims 1 to 6,
The wood chip inlaid layer PLA flooring having a wood chip inlay and printed composite structure, characterized in that it comprises a wood chip selected from one or more of the wood chips, chaff and porridge chips.
15. The method of claim 14,
The wood chip PLA flooring having a wood chip inlay and printed composite structure, characterized in that included in 200 parts by weight or less, based on 100 parts by weight of PLA resin.
15. The method of claim 14,
Particle size of the wood chip PLA flooring having a wood chip inlay and printed composite structure, characterized in that 10 ~ 120 mesh.
delete 7. The method according to any one of claims 1 to 6,
The wood chip inlaid layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a thickness of 0.1 ~ 1.0 mm.
7. The method according to any one of claims 1 to 6,
The back layer is based on 100 parts by weight of PLA resin, 5 to 60 parts by weight of a non-phthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer as a melt strength reinforcing agent, 0.01 to 10 parts by weight of one or more of the lubricant, hydrolysis agent 10 Wood chip inlaid comprising at least one by weight, at least one of wood flour and chaff at least 200 parts by weight, at least 1,000 parts by weight of calcium carbonate, at most 50 parts by weight of titanium dioxide and at most 20 parts by weight of rosin. PLA flooring with printed composite structure.
7. The method according to any one of claims 1 to 6,
The back layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a thickness of less than 5.0mm.
The method according to any one of claims 2, 3, 5 and 6,
The dimensional stability layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that glass fiber (G / F) is impregnated with at least one resin of acrylic resin, melamine resin and PLA resin.
The method of claim 21,
The glass fiber is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a unit mass per area of 30 ~ 150 g / m ² .
The method of claim 21,
The dimensionally stable layer is 40 to 150 parts by weight of non-phthalate plasticizer, 30 parts by weight or less of viscosity reducing agent, 150 parts by weight or less of calcium carbonate and titanium dioxide based on 100 parts by weight of one or more resins of acrylic resin, melamine resin and PLA resin. TiO ₂ ) PLA flooring having a wood chip inlay and printed composite structure comprising at least one of 20 parts by weight or less.
The method according to any one of claims 2, 3, 5 and 6,
The dimensional stability layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a thickness of 0.10 ~ 1.0 mm.
The method according to claim 3 or 6,
The upper layer is 5 to 60 parts by weight of a non-phthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer and 0.01 to 10 parts by weight of a lubricant as a melt strength reinforcement, based on 100 parts by weight of the PLA resin PLA flooring with wood chip inlay and printed composite structure.
The method according to claim 3 or 6,
The top layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a thickness of 0.05 ~ 1.0 mm.
The method according to any one of claims 4 to 6,
The protective layer may contain at least one of 5 to 50 parts by weight of a nonphthalate plasticizer, 0.1 to 20 parts by weight of an acrylic copolymer, 0.01 to 10 parts by weight of a lubricant, and 10 parts by weight or less of a hydrolysis agent based on 100 parts by weight of the PLA resin. PLA flooring having a wood chip inlay and printed composite structure comprising a.
The method according to any one of claims 4 to 6,
The protective layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a thickness of 0.1 ~ 1.0 mm.
The method of claim 7, wherein
The surface treatment layer PLA flooring having a wood chip inlay and printed composite structure, characterized in that it comprises at least one of polyurethane, urethane acrylate and wax.
The method of claim 7, wherein
The surface treatment layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a thickness of 0.01 ~ 0.1 mm.
9. The method of claim 8,
The back fiber layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that formed of one or more fibers of jute, white horse, cotton, nylon and polyester.
9. The method of claim 8,
The back fiber layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that having a thickness of 0.1 ~ 2.0 mm or less.
9. The method of claim 8,
The back fiber layer is PLA flooring having a wood chip inlaid and printed composite structure, characterized in that the adhesive layer formed on the lower back layer bonded to the.
34. The method of claim 33,
The adhesive layer is PLA flooring having a wood chip inlay and printed composite structure, characterized in that selected from acrylic resin, urethane resin, melamine resin, epoxy resin and vinyl acetate resin.

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