KR101241447B1 - Lighting emitting diode package and Method for manufacturing the same - Google Patents

Abstract

The present invention is to provide a light emitting diode package and its manufacture to increase the reflection efficiency of the light emitted by forming a cover layer having a SUS (Stainless Use Steel) reflecting surface in the peripheral area around the mounting area of the LED chip A method comprising: a heat dissipation substrate; an insulating layer formed on the heat dissipation substrate except for a mounting area of a light emitting diode chip; a wiring pattern layer formed on the insulating layer; a light emitting diode having electrode pads and mounted in the mounting area A chip; a SUS (Stainless Use Steel) type cover layer formed to have an inclined surface as the opening width increases toward the outside of the LED chip mounting region, wherein the inclined surface of the SUS type cover layer is used as a reflective layer. .

Description

Light emitting diode package and method for manufacturing the same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to manufacturing a light emitting diode unit. Specifically, a cover layer is formed on a peripheral area centered on a mounting area of a light emitting diode chip to have a reflective use steel (SUS) type reflecting surface to improve reflection efficiency of light emitted. The present invention relates to a light emitting diode package and a method of manufacturing the same.

A light emitting diode is an electronic device that generates a small number of carriers (electrons or holes) injected using a p-n junction structure of a semiconductor, and emits light by recombination thereof.

Such light emitting diodes have been used in various fields, and recently, they have been spotlighted as a replacement device for fluorescent lamps because their lifetimes are semi-permanent and there are no harmful substances (RoHS, ELV, PFOS, etc.).

Typically, a single light emitting diode unit is packaged by bonding an LED chip with Ag, for example Ag, on a lead frame, wire bonding an N pad and a P pad of a semiconductor chip, and then epoxy molding.

The single light emitting diode package configured as described above is installed on a printed circuit board in a state where it is mounted on a heat sink for heat dissipation, or a heat sink in a state where the printed circuit board is mounted using, for example, surface mount technology (SMT). It is used attached to the phase.

In addition, for example, a light emitting diode array unit used in an LCD backlight or the like is provided with a plurality of single light emitting diode packages configured as described above in an array form on a printed circuit board using, for example, surface mount technology (SMT).

The LED array unit configured as described above is attached to a heat sink for heat dissipation.

As described above, in order to manufacture the light emitting diode unit, a manufacturing process having different characteristics such as lead frame manufacturing, heat sink manufacturing, light emitting diode package manufacturing, printed circuit board manufacturing, light emitting diode package mounting, and the like should be collected.

That is, it is difficult for one manufacturer to manufacture a light emitting diode unit alone, and it is possible to manufacture the light emitting diode unit through cooperation of different companies. For this reason, there is a problem that the manufacturing process of the light emitting diode unit is complicated and the manufacturing cost of the light emitting diode unit is increased.

In addition, in the related art, since the light emitting diode chip is mounted on a lead frame and packaged, and the light emitting diode package is mounted on a printed circuit board, the thickness of the light emitting diode unit is increased as a whole. There is a problem.

In particular, in the related art, in order to dissipate a light emitting diode, the LED chip is mounted on a lead frame and packaged, and then the LED package is installed on a printed circuit board via a heat sink, or the LED package is mounted on a printed circuit board. After that, the printed circuit board is bonded to the heat sink.

Therefore, there is a problem that the overall thickness of the light emitting diode unit becomes thick, and it becomes an obstacle to thinning of electronic products employing such a light emitting diode unit.

The light emitting diode unit of the prior art has a limit in improving the wavelength conversion efficiency of the emitted light, and thus it is difficult to increase the light output, brightness, and color rendering.

The present invention is to solve the problem of the conventional light emitting diode unit, the cover layer is formed to have a reflective surface of SUS (Stainless Use Steel) type in the peripheral area around the mounting area of the light emitting diode chip to emit light SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting diode package and a method of manufacturing the same.

SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting diode package and a method for manufacturing the same, which can greatly simplify the manufacturing process of the light emitting diode unit and significantly reduce the manufacturing cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting diode package and a method for manufacturing the same, which can simplify the structure and manufacturing process by mounting a light emitting diode chip directly on a heat dissipation substrate.

The present invention forms a recess having a first reflective surface on a heat dissipation substrate, mounts a light emitting diode chip in the recess, and covers a second cover layer of a SUS (Stainless Use Steel) type in a peripheral region around the recess. It is an object of the present invention to provide a light emitting diode package and a method for manufacturing the same, which are formed to have a reflective surface to enhance the reflection efficiency of light emitted.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a light emitting diode package including: a heat dissipation substrate; an insulating layer selectively formed on a mounting area of a light emitting diode chip on the heat dissipation substrate; a wiring pattern layer formed on the insulating layer; an electrode pad And a SUS (Stainless Use Steel) type cover layer having an inclined surface, the opening width of which is increased toward the outside of the LED chip mounting region, the SUS type covering layer having a sloped surface. The inclined surface of the cover layer is used as the reflective layer.

And a bonding wire electrically connecting the electrode pad and the wiring pattern layer of the light emitting diode chip.

And an epoxy molding layer formed in a lens shape around the light emitting diode chip mounted in the mounting region.

And it is characterized in that it further comprises a reflective layer formed by a nickel (aluminum or silver) plating process on the inclined surface of the SUS type cover layer.

The SUS type cover layer may include a cover layer frame having an upper opening having a width greater than a lower opening and a lower opening and having open areas having inclined surfaces between upper and lower openings so that the mounting area and the open area correspond to each other. Characterized in that formed.

And the cover layer frame is characterized in that the heat-radiating substrate and the cover layer frame is laminated by hot pressing (Hot Press) process or bolted.

The heat dissipation substrate is recessed with an inclination as the width of the opening increases toward the outside with respect to the flat bottom surface of the LED mounting area.

The inclined surface of the recessed area of the heat dissipation substrate is used as the first reflective layer, and the inclined surface of the SUS type cover layer stacked on the heat dissipation substrate is used as the second reflective layer.

The first and second reflective layers have the same inclination angle, and thus the inclined surfaces are positioned in a straight line.

In another aspect, a method of manufacturing a light emitting diode package according to the present invention may include forming an insulating layer on a heat dissipation substrate except for a mounting region, and forming a wiring pattern layer on the insulating layer; Forming an SUS (Stainless Use Steel) type cover layer formed on the substrate with an inclined surface as the opening width increases toward the outside toward the outside of the mounting area; mounting light emitting diode chips on the mounting area of the heat dissipation substrate; Wire bonding the electrode pads of the LED chips and the wiring pattern layer to be electrically connected to each other, and forming an epoxy molding layer in the form of a lens around the mounting region in which the LED chips are mounted. .

Here, the heat dissipation substrate is aluminum, the insulating layer is characterized in that the ceramic or aluminum oxide.

And plating the nickel on the inclined surface of the SUS type cover layer to form a reflective layer.

And stacking the SUS type cover layer with a cover layer frame having open regions having a wider opening than a lower opening and a lower opening and having open areas having inclined surfaces between upper and lower openings so that the mounting area and the open area correspond to each other. It characterized by forming.

And the cover layer frame is characterized in that the heat radiation substrate and the cover layer frame is laminated by hot pressing (Hot Press) process or bolted.

The cover layer frame may include forming an upper mask layer having a first width on an upper surface of the cover layer frame, and forming a lower mask layer having a second width smaller than a first width on a lower surface of the cover layer frame, and the upper and lower masks. Isotropically etching the opened cover layer frame using the layer to form an opening through which the upper and lower portions penetrate, and the upper surface opening of the cover layer frame is formed by the difference in the etching amount according to the width of the open area during the etching process. It is characterized by having an inclined surface larger than the opening.

And before forming the insulating layer on the heat dissipation substrate except the mounting region, forming a recessed area so that the opening width of the light emitting diode mounting region of the heat dissipation substrate toward the outside toward the outside to increase the width of the opening to be inclined Characterized in that the process proceeds.

The inclined surface of the recessed area of the heat dissipating substrate is used as the first reflective layer, and the heat dissipating substrate and the SUS type cover layer are laminated so that the inclined surface of the SUS type cover layer stacked on the heat dissipating substrate is used as the second reflective layer.

In addition, the step of forming the recessed area may be formed by bending, die-casting, or NC (Numerical Control) processing or etching by pressing.

Such a light emitting diode package and its manufacturing method according to the present invention has the following effects.

First, the cover layer may be formed to have a SUS (Stainless Use Steel) type reflective surface in a peripheral area around the mounting area of the LED chip, thereby improving light reflection efficiency.

Second, the manufacturing process of the light emitting diode unit can be significantly simplified and the manufacturing cost can be significantly reduced.

Third, by mounting the LED chip directly on the heat dissipation substrate, its structure and manufacturing process can be simplified, and the overall thickness can be significantly reduced, which can be suitably adopted for electronic devices requiring thinning.

Fourth, by having a first reflective surface on the heat dissipation substrate and a cover layer formed around the region on which the light emitting diode chip is mounted, a cover layer can be used to increase the reflection efficiency of the emitted light.

Fifth, by controlling the angles of formation of the reflective surface of the cover layer and the reflective surface of the heat dissipation substrate, the emission angle and the radiation intensity of the light emitted can be adjusted efficiently.

1A to 1G are cross-sectional views illustrating a process of manufacturing a light emitting diode package according to a first embodiment of the present invention.
2A to 2H are cross-sectional views illustrating a process of manufacturing a light emitting diode package according to a second embodiment of the present invention.
3A to 3E are cross-sectional views of a process for forming a mounting open region of a SUS type cover layer according to the present invention.

Hereinafter, a preferred embodiment of a light emitting diode package and a method of manufacturing the same according to the present invention will be described in detail.

Features and advantages of the LED package and the method of manufacturing the same according to the present invention will become apparent from the following detailed description of each embodiment.

1A to 1G are cross-sectional views illustrating a process of manufacturing a light emitting diode package according to a first embodiment of the present invention.

1A to 1F are cross-sectional views taken along the line E-E 'of FIG. 1G.

The present invention is to increase the reflection efficiency of the light emitted by forming a cover layer to have a SUS (Stainless Use Steel) reflecting surface in the peripheral area around the mounting area of the LED chip.

The light emitting diode package according to the first embodiment of the present invention has a heat dissipation substrate 10 made of a material having excellent thermal conductivity, except for the mounting region of the LED chip of the heat dissipation substrate 10, as shown in FIG. 1F. An insulating layer 11a made of ceramic or aluminum oxide formed on the heat dissipation substrate 10 and a wiring pattern layer 12a formed on the insulating layer 11a corresponding to the light emitting diode chip mounted in the mounting region. And at least one light emitting diode chip 14 mounted in the mounting region of the heat dissipation substrate 10 and having an N-type pad and a P-type pad, and the pad and the wiring pattern layer 12a of the light emitting diode chip. Bonding wires 15 connected to each other, a SUS (Stainless Use Steel) type cover layer 13 formed with an inclined surface as the width thereof increases toward the outside with respect to the LED chip mounting region, and the SUS type cover It includes a layer 13, epoxy molding layer 16 which comprises an inclined surface and around the light emitting diode chip 14 mounted on the LED chip mounting area is formed in a lens shape and configuration.

Here, the epoxy molding layer 16 fills the concave chip mounting region formed by the SUS type cover layer 13 and the insulating layer 11a and the wiring pattern layer 12a formed with the inclined surface, and the upper surface is convex. It is configured in the form of a lens.

The height of the upper portion of the epoxy molding layer 16 may vary depending on the emission angle and the radiation intensity of the emitted light. Preferably, the epoxy molding layer 16 protrudes higher than the upper height of the SUS type cover layer 13.

The inclined surface of the SUS type cover layer 13 may further form a reflective layer A by a process such as nickel plating.

The material for forming such a reflective layer is not limited to nickel, and can be formed by other materials and other processes.

The manufacturing process of the LED package according to the first embodiment of the present invention is as follows.

First, as shown in FIG. 1A, a heat dissipation substrate 10 made of, for example, aluminum is prepared as a metal material having excellent heat dissipation performance and excellent light reflectance, and ceramics on the heat dissipation substrate 10 as shown in FIG. 1B. Or an insulating material layer 11 made of an insulating material such as aluminum oxide.

In this case, the insulating material layer 11 is formed through a process such as plating or coating with ceramic or aluminum oxide, and is formed to have an appropriate thickness (3 μm to 50 μm) for light reflection and electrical insulation withstand voltage.

Subsequently, as illustrated in FIG. 1C, the insulating material layer 11 is selectively removed to pattern the mounting region in which the light emitting diode is mounted in the subsequent process.

A wiring pattern forming material layer made of a material such as Cu having excellent electrical conductivity is formed on the patterned insulating layer 11a, and then selectively patterned to form the wiring pattern layer 12a.

Subsequently, as shown in FIG. 1D, the SUS type cover layer 13 is formed on the heat dissipation substrate 10 on which the wiring pattern layer 12a is formed.

Here, the structure and manufacturing process of the SUS type cover layer 13 will be described in detail.

3A to 3E are cross-sectional views of a process for forming a mounting open area of a SUS type cover layer according to the present invention.

The SUS type cover layer 13 has a plurality of open areas opened in a frame made of SUS (Stainless Use Steel) material corresponding to the chip mounting area of the heat dissipation substrate 10, and the open areas are gradually moved from the lower surface to the upper surface. The open area is configured to be wider and has an inclined surface at the boundary of the open area.

That is, as shown in FIG. 3A, open areas are formed in the cover layer frame 31 to correspond to the plurality of chip mounting areas, and the open area is formed when the lower boundary 32c is smaller than the upper boundary 32a. An inclined surface 32b is provided between the boundary 32c and the upper surface boundary 32a.

Such cover layer frame 31 is manufactured by the following process.

3B to 3E are cross-sectional views taken along the line G-G 'of FIG. 3A.

First, as shown in FIG. 3B, the upper mask layer 34a and the lower mask layer 34b are formed on the upper and lower surfaces of the cover layer frame 31.

Here, the width of the open area of the upper mask layer 34a is made larger than the width of the open area of the lower mask layer 34b.

As shown in FIG. 3C, when an isotropic etching process is performed using the upper mask layer 34a and the lower mask layer 34b, the width difference between the open areas of the upper mask layer 34a and the lower mask layer 34b is different. As a result, the size of the etching region is different.

Subsequently, when etching continues as shown in FIG. 3D, a cover layer frame 31 having open areas having inclined surfaces 32b is formed between the lower boundary 32c and the upper boundary 32a as shown in FIG. 3E.

The cover layer frame 31 manufactured in such a process is laminated on the heat dissipation substrate 10 on which the wiring pattern layer 12a is formed. The lamination process is performed by a process such as hot press or bolt fastening using an adhesive. This is preferably done using a hot press process.

In addition, as shown in FIG. 1D, the inclined surface of the SUS type cover layer 13 may be formed by plating a metal material having excellent light reflectance such as nickel (aluminum or silver) to form the reflective layer A. FIG.

Subsequently, as shown in FIG. 1E, an adhesive layer (not shown) is applied to the center portion of the chip mounting region of the heat dissipation substrate 10 and the light emitting diode chip 14 is adhered.

An example of the light emitting diode chip 14 has a structure in which an N region and a P region are stacked on the sapphire substrate via an active region, an N type pad is formed on the N region, and a P type pad is formed on the P region. .

Subsequently, the electrode pad 12c of the LED chip 14 is wire-bonded to the wiring pattern layer 12a using the bonding wire 15 to electrically connect the electrode pad 12c and the wiring pattern layer 12a. do.

As shown in FIG. 1F, the epoxy molding layer 16 is formed in the form of a lens around the chip mounting region of the heat dissipation substrate 10.

Next, a light emitting diode package and a manufacturing process thereof according to the second embodiment of the present invention will be described.

2A to 2H are cross-sectional views illustrating a process of manufacturing a light emitting diode package according to a second embodiment of the present invention.

As shown in FIG. 2F, the LED package according to the second embodiment of the present invention is made of a material having excellent thermal conductivity, and the chip mounting area is recessed to a certain depth so that the bottom surface of the center is flat and the recessed area has an inclined surface. An insulating layer 21 made of ceramic or aluminum oxide formed on the heat dissipation substrate 20a except for the heat dissipation substrate 20a having the chip mounting region and the mounting area of the light emitting diode chip of the heat dissipation substrate 20a. ), A wiring pattern layer 22 formed on the insulating layer 21 corresponding to a light emitting diode chip mounted in the mounting region, and an N-type pad mounted on the chip mounting region of the heat dissipation substrate 20a. At least one light emitting diode chip 24 having a P-type pad, a bonding wire 25 electrically connecting the pad of the light emitting diode chip 24 and the wiring pattern layer 22, and the light emitting diode chip It includes a SUS (Stainless Use Steel) type cover layer 23 formed with an inclined surface as the width increases toward the outside toward the outside of the mounting area, and the inclined surface of the SUS type cover layer 23, and is mounted in the LED chip mounting area. And an epoxy molding layer 26 formed in the form of a lens around the light emitting diode chip 24.

Here, the inclined surface of the recessed area (chip mounting area) of the heat dissipation substrate 20a is the first reflective layer, and the inclined surface of the SUS (Stainless Use Steel) type cover layer 23 is the second reflective layer.

In addition, the insulating layer 21 preferably maintains an appropriate thickness (3 μm to 50 μm) for light reflection and electrical insulation withstand voltage.

The epoxy molding layer 26 fills the concave chip mounting region formed by the SUS type cover layer 23, the insulating layer 21, and the wiring pattern layer 22 having the second reflective surface. It is configured in the form of a convex lens.

The height of the upper portion of the epoxy molding layer 26 may vary depending on the emission angle and the radiation intensity of the emitted light, and is preferably formed to protrude higher than the upper height of the SUS type cover layer 23.

The reflective layer B may be further formed on the inclined surface of the SUS type cover layer 23 by a process such as nickel (aluminum or silver) plating.

The material for forming such a reflective layer is not limited to nickel, and can be formed by other materials and other processes.

The manufacturing process of the LED package according to the second embodiment of the present invention as follows.

First, as shown in FIG. 2A, a heat dissipation substrate 20 made of, for example, aluminum is prepared as a metal material having excellent heat dissipation performance and excellent light reflectance, and toward the outside with a flat bottom as shown in FIG. 1B. The heat radiation board | substrate 20a which has the recessed area | region (chip mounting area | region) in which opening width becomes large and inclined and is recessed is manufactured.

Here, the recessed region forming process of the heat dissipation substrate 20a may be formed by bending, die-casting, NC (Numerical Control), or etching by pressing.

Subsequently, as shown in FIG. 2C, an insulating material layer 21 made of an insulating material such as ceramic or aluminum oxide is formed on the heat dissipation substrate 20a having the recessed area (chip mounting area), and selectively removed, in a subsequent process. The mounting area in which the light emitting diode is mounted is patterned to be open.

Here, the insulating material layer 21 is preferably maintained at an appropriate thickness (3㎛ ~ 50㎛) for light reflection and electrical insulation breakdown voltage.

Subsequently, as shown in FIG. 2D, a wiring pattern forming material layer made of a material such as Cu having excellent electrical conductivity is formed on the patterned insulating layer 21, and selectively patterned to form the wiring pattern layer 22. do.

2E, the SUS type cover layer 23 is formed on the heat dissipation substrate 20a on which the wiring pattern layer 22 is formed.

Here, the structure and manufacturing process of the SUS type cover layer 23 are the same as in FIGS. 3A to 3E.

The SUS type cover layer 23 has a plurality of open areas open in a frame made of SUS (Stainless Use Steel) material corresponding to the chip mounting area of the heat dissipation substrate 20a. The open area is configured to be wider and has an inclined surface at the boundary of the open area.

That is, as shown in FIG. 3A, open areas are formed in the cover layer frame 31 to correspond to the plurality of chip mounting areas, and the open area is formed when the lower boundary 32c is smaller than the upper boundary 32a. An inclined surface 32b is provided between the boundary 32c and the upper surface boundary 32a.

The cover layer frame 31 manufactured in such a process is laminated on the heat dissipation substrate 20a on which the wiring pattern layer 22 is formed, and the lamination process is performed by a process such as hot pressing and bolt fastening using an adhesive. This is preferably done using a hot press process.

As shown in FIG. 2E, the LED package according to the second exemplary embodiment of the present invention includes a first reflective layer D formed on the inclined surface of the heat dissipation substrate 20a and a second reflective layer formed on the inclined surface of the SUS type cover layer 23. In addition, the inclination angles of the first and second reflective layers may be formed to have the same inclination angle as shown in (C) of FIG. 2E or to have different inclination angles for adjusting the emission angle and intensity of the emitted light.

In addition, the first reflective layer D formed on the inclined surface of the heat dissipation substrate 20a has a high reflectivity on the inclined surface of the heat dissipation substrate 20a by a mirror polishing process, so that the other reflective material is not directly laminated to the reflective layer. To use.

In addition, the second reflective layer formed on the inclined surface of the SUS type cover layer 23 may form a reflective layer B by plating a metal material having excellent light reflectance such as nickel.

Subsequently, as shown in FIG. 2F, an adhesive layer (not shown) is applied to the center portion of the chip mounting region of the heat dissipation substrate 20a and the light emitting diode chip 24 is bonded.

An example of the LED chip 24 has a structure in which an N region and a P region are stacked on an sapphire substrate via an active region, an N type pad is formed on the N region, and a P type pad is formed on the P region.

Subsequently, the electrode pad of the LED chip 24 is wire-bonded to the wiring pattern layer 22 using the bonding wire 25 to electrically connect the electrode pad and the wiring pattern layer 22.

As shown in FIG. 2G, the epoxy molding layer 26 is formed in the form of a lens around the chip mounting region of the heat dissipation substrate 20a.

Such a light emitting diode package according to the present invention is opened in a frame made of SUS (Stainless Use Steel) material corresponding to the chip mounting area of the heat dissipation substrate, and is formed in such a manner that the open area is widened from the lower surface to the upper surface of the open area. By laminating an SUS type cover layer having an inclined surface on the boundary on the heat dissipation substrate, the ease of the process can be ensured and the luminous efficiency can be improved.

Further, the SUS type cover layer is further laminated on a heat dissipation substrate having a recessed area (chip mounting area) in which the width of the opening is increased toward the outside toward the outside of the flat bottom surface to be inclined and recessed to further improve luminous efficiency. Can be.

It will be understood that the present invention is implemented in a modified form without departing from the essential features of the present invention as described above.

It is therefore to be understood that the specified embodiments are to be considered in an illustrative rather than a restrictive sense and that the scope of the invention is indicated by the appended claims rather than by the foregoing description and that all such differences falling within the scope of equivalents thereof are intended to be embraced therein It should be interpreted.

10. Heat dissipation board 11a. Insulating layer
12a. Wiring pattern layer 13.SUS type cover layer
14. LED chip 15. Bonding wire
16. Epoxy Molding Layer

Claims (18)

A heat dissipation substrate;
An insulating layer formed on the heat dissipation substrate except for a mounting region of the LED chip;
A wiring pattern layer formed on the insulating layer;
A light emitting diode chip having an electrode pad and mounted in the mounting area;
The light emitting diode chip mounting region is formed by stacking a cover layer frame having an upper opening having a lower opening and a larger opening than the lower opening and having open regions having inclined surfaces between upper and lower openings so that the mounting region and the open region correspond to each other. Includes; SUS (Stainless Use Steel) type cover layer formed with an inclined surface as the opening width increases toward the outside toward the center;
The inclined surface of the SUS type cover layer is used as a reflective layer. The light emitting diode package of claim 1, further comprising a bonding wire electrically connecting the electrode pad and the wiring pattern layer of the light emitting diode chip. The LED package of claim 1, further comprising an epoxy molding layer formed in a lens shape around the LED chip mounted in the mounting region. The light emitting diode package of claim 1, further comprising a reflective layer formed by a plating process on an inclined surface of the SUS type cover layer. delete The light emitting diode package of claim 1, wherein the cover layer frame is laminated with the heat dissipation substrate and the cover layer frame through a hot press process. The light emitting diode package of claim 1, wherein the heat dissipation substrate is recessed with an inclination as the width of the opening increases toward the outside with respect to the bottom surface where the light emitting diode mounting region is flat. 8. The light emitting diode package according to claim 7, wherein the inclined surface of the recessed area of the heat dissipation substrate is used as the first reflective layer, and the inclined surface of the SUS type cover layer stacked on the heat dissipation substrate is used as the second reflective layer. The light emitting diode package of claim 8, wherein the first and second reflective layers have the same inclination angle, so that the inclined surfaces are in a straight line. Selectively forming an insulating layer on the heat dissipation substrate, and forming a wiring pattern layer on the insulating layer;
The cover layer frame having open areas having a lower opening and an upper opening having a width larger than the lower opening and having an inclined surface between the upper and lower openings is laminated on the heat dissipation substrate on which the wiring pattern layer is formed. Forming a SUS (Stainless Use Steel) type cover layer formed with an inclined surface as the opening width increases toward the surface;
Mounting light emitting diode chips in a mounting area of the heat dissipation substrate;
Wire bonding the electrode pads of the light emitting diode chips and the wiring pattern layer to be electrically connected to each other, and forming an epoxy molding layer in the form of a lens around the mounting region in which the light emitting diode chips are mounted. Method of manufacturing a light emitting diode package. The method of claim 10, wherein the heat dissipation substrate is aluminum, and the insulating layer is ceramic or aluminum oxide. 11. The method of claim 10, further comprising the step of forming a reflective layer on the inclined surface of the SUS type cover layer by a plating process. delete The method of claim 10, wherein the cover layer frame is laminated on the heat dissipation substrate and the cover layer frame by a hot press process. The method of claim 10, wherein the cover layer frame,
Forming an upper mask layer having a first width on the upper surface of the cover layer frame, and forming a lower mask layer having a second width smaller than the first width on the lower surface;
And isotropically etching the opened cover layer frame using the upper and lower mask layers to form openings through which the upper and lower portions pass.
The method of manufacturing a light emitting diode package, characterized in that the upper surface opening of the cover layer frame is larger than the lower surface opening to have an inclined surface due to the difference in the etching amount according to the width of the open area during the etching process. The method of claim 10, before forming an insulating layer on the heat dissipation substrate except for the mounting region,
And forming a recessed area such that the opening width of the LED mounting area of the heat dissipation substrate is increased toward the outside toward the outside of the flat bottom surface so that the recessed area is inclined and recessed. 17. The heat dissipation substrate and the SUS type cover layer of claim 16, wherein the inclined surface of the recessed area of the heat dissipation substrate is used as the first reflective layer, and the inclined surface of the SUS type cover layer laminated on the heat dissipation substrate is used as the second reflective layer. Method of manufacturing a light emitting diode package, characterized in that. The light emitting method of claim 16, wherein the forming of the recessed area is performed by bending, die-casting, or NC (Numerical Control) processing, or etching by pressing. Method of manufacturing a diode package.

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