KR101229786B1 - Heterodyne interference lithography apparatus, method for drawing pattern using the same device, wafer, and semiconductor device - Google Patents
Heterodyne interference lithography apparatus, method for drawing pattern using the same device, wafer, and semiconductor device Download PDFInfo
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- KR101229786B1 KR101229786B1 KR1020110084000A KR20110084000A KR101229786B1 KR 101229786 B1 KR101229786 B1 KR 101229786B1 KR 1020110084000 A KR1020110084000 A KR 1020110084000A KR 20110084000 A KR20110084000 A KR 20110084000A KR 101229786 B1 KR101229786 B1 KR 101229786B1
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- pattern
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
- H01L21/0275—Photolithographic processes using lasers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention relates to a heterodyne interference lithography apparatus and a method for forming a micropattern using the apparatus. The present invention relates to an interference lithography apparatus and a pattern forming method capable of forming an indirect phenomenon using a laser capable of generating two or more different wavelengths to form a nanopattern, and simultaneously forming a micropattern by a beat phenomenon. To this end, the multi-laser light source unit 100 for generating laser beams having different wavelengths; A polarized beam splitter 200 for transmitting or reflecting a laser beam; A spatial beam separator (300) for spatially separating the transmitted laser beams having different wavelengths; A beam expander 400 for expanding the inverted laser beam; And forming a first pattern by causing interference with each other by reflection of the extended laser beam and the extended laser beam, and generating a second composite pattern by generating a new synthesized wave by interference of waves caused by different wavelengths. Disclosed is a heterodyne interference lithographic apparatus comprising a portion 500.
Description
The present invention relates to a heterodyne interference lithography apparatus and a method for forming a micropattern using the apparatus. More specifically, an interference lithography apparatus and a pattern forming method capable of forming an indirect phenomenon using a laser capable of generating two or more different wavelengths to form a nanopattern, and simultaneously forming a micropattern by a beat phenomenon. It is about.
Recently, there is an increasing demand for miniaturization and high performance of products in the mining, display, semiconductor and bio industries. In order to meet such demands, it is necessary to economically and easily manufacture a micropattern (nanoscale or microscale pattern shape).
Conventionally, a method of forming a fine pattern is E-beam lithography (E-beam lithogrephy). This method focuses electron beams to form nanometer-level patterns. Such a method can produce a variety of fine patterns, but there is a problem in that the manufacturing of a large area is limited because it takes a lot of time.
In addition, in order to solve these problems, a single stamp is made through a photo process using the principle of laser interference lithography, and photolithography is replaced with nanoimprint lithography to mass produce micropatterns having a nanometer line width through an etching process. Can be.
Laser interference lithography is also called holographic lithography, which, unlike photolithography, has continued to expand its field of application because of the advantage that large structures of uniform shape can be produced without the use of photo masks. . The shape of the nanostructures fabricated on the photoresist using holographic lithography is influenced by the light intensity or exposure energy and development time to expose the photoresist. Macroscopic modeling techniques have been studied by FH Dill in 1975. have.
Holographic lithography is a technique for fabricating nanostructures on photoresist by using interference of two light incident on the photoresist in different directions. In this case, the intensity of light at an arbitrary point on the photoresist film is expressed by
Where I 1 and I 2 represent the intensity of light incident from each direction, k 0 represents the propagation constant, θ represents the angle of incidence, and Φ 1 and Φ 2 represent the angle of light incident from each direction. As can be seen from the above equation, when the light intensity is the same (I 1 = I 2 = I 0 ), the intensity of the interference on the plane is theoretically determined by the cosine term from the minimum I min = 0 to the maximum I max = 4I 0 . Has In addition, the period P of the light intensity due to the interference of the two lights is arranged as follows.
Where λ represents the wavelength of light used. Such an interference lithography method has an advantage of rapidly forming a fine pattern with exposure of several to several tens of seconds, but generates many basic patterns such as lines or dots, and uniformly produces a wide range of limitations in forming various patterns. There is. In addition, there is a disadvantage that the size and spacing of the pattern that can be realized by the incident angle and wavelength is determined.
Therefore, the present invention was created in order to solve the problems of the prior patent document as described above, the nano-pattern which can adjust the intensity for each beam without any loss in the intensity of the beam when separating beams of different wavelengths Its object is to provide an invention that can simultaneously form a micro pattern.
However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.
An object of the present invention described above, the multi-laser
In addition, the first pattern is characterized in that the nanoscale pattern by the interference fringe.
The synthesized wave may include a high frequency component and a low frequency component, and the second pattern may be a micro pattern formed by the low frequency component.
In addition, the different wavelengths are characterized in that the wavelength for generating the interference frequency.
In addition, the
In addition, the
In addition, the
On the other hand, an object of the present invention is the multi-laser
In addition, the first pattern is characterized in that the nanoscale pattern by the interference fringe.
The synthesized wave may include a high frequency component and a low frequency component, and the second pattern may be a micro pattern formed by the low frequency component.
In addition, the different wavelengths are characterized in that the wavelength for generating the interference frequency.
On the other hand, the object of the present invention can be achieved by providing a semiconductor wafer manufactured using a heterodyne interference lithography apparatus.
According to the present invention as described above there is an effect that can simultaneously form a nano-pattern and a micro-pattern capable of controlling the intensity for each beam without any loss in the beam intensity when separating beams of different wavelengths.
The following drawings, which are attached to this specification, illustrate one preferred embodiment of the present invention, and together with the detailed description thereof, serve to further understand the technical spirit of the present invention. It should not be construed as limited.
1 is a diagram of a wavelength-specific transmittance data sheet of a dichroic mirror used in a conventional heterodyne interference lithography apparatus.
2 is a block diagram showing the configuration of a heterodyne interference lithographic apparatus according to the present invention;
3 and 4 is a view showing the beat phenomenon according to the present invention,
5 is a graph of simulation results of interference intensity caused by single exposure according to the present invention;
FIG. 6 is a graph showing a result of simulating interference intensity when the specimen is rotated by 90 ° by the rotating part after one exposure according to FIG. 5,
FIG. 7 is a view of a fine pattern formed on a specimen according to the grating pattern of FIG. 5,
FIG. 8 is a view of a fine pattern formed on a specimen according to the grating pattern of FIG. 6,
9 is a flow chart sequentially showing a pattern forming method according to the present invention.
Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention. In addition, the embodiment described below does not unduly limit the content of the present invention described in the claims, and the entire structure described in this embodiment is not necessarily essential as the solution means of the present invention.
Heterodyne interference Lithography Configuration of the device>
As shown in FIG. 2, the heterodyne interference lithography apparatus according to the present invention has a multi-laser
The multi-laser
The heterodyne method does not use a single wavelength light source, but uses a light source of different wavelengths to cause a beat phenomenon to form various interference fringe patterns.
As illustrated in FIG. 3, the beat phenomenon is a phenomenon in which two waves having similar frequencies interfere with each other to create a new synthesized wave. The interference of the two waves is shown in Equation 3 below.
(Where f 1 and f 2 are the frequencies of the two waves)
If the frequencies of the two waves are similar, the synthesized wave has the term having the median value of the two waves as the dominant wave component, and the term with the relatively slow period becomes the term that modulates the amplitude.
The beat frequency as shown in FIG. 4 is generated by different frequencies (frequency) f 1 and f 2 of FIG. 3, and the beat frequency is generated as the frequency of the low frequency component and the frequency of the high frequency component, respectively.
At this time, the beat phenomenon is a phenomenon over time, the present invention uses the beat phenomenon spatially. In other words, the beat amplitude over time varies with time as shown in FIG. Do. That is, the frequency amplitudes at different points are different, but the frequency amplitude at any point does not change with time. In the present invention, a frequency generated by using the beat phenomenon spatially will be referred to as a frequency caused by double interference.
Therefore, the heterodyne interference lithography apparatus according to the present invention may form a first fine pattern (nano pattern) by causing interference between a laser beam that is directly incident on a specimen and a laser beam that is reflected and incident, and has a laser having different wavelengths. The second fine pattern (micro pattern) may be formed by the bi-interference low frequency component generated by the beam. At this time, it is preferable that the first fine pattern is a pattern of approximately nano size, and the second fine pattern is a pattern of approximately micro size.
The above-described multi-laser
The reflecting means 10 according to the present invention comprises a first reflecting means 11 and a second reflecting
The
Advantages of the configuration of the polarization beam splitter-based light quantity control system compared to the dichroic mirror-based system configuration used in the above-mentioned prior art of the present invention are as follows.
In the case of a dichroic mirror based system, a principle similar to that of the high frequency filter is used as shown in FIG. 1. In other words, the two beams having different wavelengths are separated using the principle of transmitting high frequency beams and blocking low frequency beams, so that it is difficult to obtain sufficient intensity and to separate the two beams.
Because the ideal high frequency filter does not incline the pass band and the non-pass band, it can separate the different frequencies accurately, but the general high frequency filter has the
In the
The
In detail, the
The P-polarized laser beam split into two paths becomes parallel light by passing through the
The laser beam of 363.8 nm according to an embodiment of the present invention has a
In FIG. 2, for convenience, a beam of 363.8 nm is incident toward the third reflecting means 350, and a beam of 351.1 nm is reflected in a direction reflecting from the third reflecting means 350. Of course, nm beams are incident and reflected at the same time, respectively.
Here, the half-
The 363.8 nm laser beam that has passed through the half-
In conclusion, the P-polarized beam emitted from the
In the
In addition, the
Alignment lens 50 is a collimation lens (collimation lens) so that the laser beam, the amount of light controlled by the
The
The
Therefore, it is difficult to form a pattern of two scales at a time with a single wavelength process, so that the formation of a nano-micro composite pattern array, which has to be performed twice or three times, can be realized by a single process.
In addition, it is possible to vary the value of the beat frequency by changing the frequency of the heterogeneous signal causing the beat or by changing the number of frequencies causing the interference. In addition, by changing the amplitude (intensity of the laser beam) of each frequency it is possible to vary the pattern shape of the nano and micro scale formed.
5 illustrates a graph of simulation results of interference intensity caused by one-time exposure according to one embodiment of the present invention. As shown in FIG. 5, the interference intensity is in the form of a line. 6 shows a graph of simulation results of the interference intensity when the
FIG. 7 illustrates a micro pattern formed on the specimen according to the grating pattern of FIG. 5, and FIG. 8 illustrates a micro pattern formed on the specimen according to the grating pattern of FIG. 6. It can be seen that the shape of the micropatterns formed in FIGS. 7 and 8 is formed in the same pattern as the grating pattern, which is the interference intensity distribution (FIGS. 5 and 6). In addition, it can be seen from FIG. 7 and FIG. 8 that a nano pattern array using an interference fringe and a micro pattern array due to beat generation are formed at the same time.
As a result, the shape of the fine pattern is determined according to the shape of the grating pattern which is the interference intensity distribution. When more wavelengths overlap (using the multi-laser
<Fine Pattern Formation Method>
9 is a flowchart sequentially illustrating a pattern forming method using a heterodyne interference lithography apparatus according to the present invention. An embodiment of a pattern forming method that can be performed by a heterodyne interference lithography apparatus having the above-described configuration is shown in FIG. 9. Hereinafter, a pattern forming method using a heterodyne interference lithography apparatus according to the present invention will be described in detail with reference to FIG. 9.
First, the multi-laser
Next, the
Next, the
Of the two light sources traveling side by side, the P-polarized laser beam of 363.8 nm is the
By passing through the half-
The laser beam aligned by the S-polarized light by the half-
Next, the
Next, a step of reflecting in the 90 ° direction by the fourth reflecting means 20 and sorting from S polarization to P polarization again by the
Next, the
Next, the laser beam extended by the
Finally, the first pattern is formed on the
<Semiconductor Wafer and Semiconductor Device>
By using the heterodyne interference lithography apparatus according to the present invention, nano- and micro-sized micropatterns can be formed on the specimen. Wafers made by this pattern can produce more efficient wafers.
This is because a single wavelength micropattern process cannot form patterns of two scales at a time. The wafer according to the present invention can form a pattern of two scales at a time to increase the wafer mass production efficiency.
On the other hand, such a wafer can be produced and mass produced semiconductor devices used in various applications.
As mentioned above, although demonstrated with reference to one Embodiment of this invention, this invention is not limited to this, A various deformation | transformation and an application are possible. In other words, those skilled in the art can easily understand that many variations are possible without departing from the gist of the present invention.
10: reflecting means
11: first reflecting means
13: second reflecting means
20: fourth reflecting means
30: half-wave plate
40: aperture
50: alignment lens
60: Lloyd Interferometer
61a, 61b: base portion
63: Psalms
65 reflector
70: slope
100: multi laser light source
200: polarized beam separator
300: space type beam separator
310: first prism
320: second prism
330a, 330b: half-wave plate
340: 4-wavelength plate
350: third reflecting means
400: beam expander
410: Focus Lens
420: pinhole
500: pattern generator
Claims (13)
A polarized beam splitter (200) for transmitting or reflecting the laser beam;
A spatial beam separator (300) for separating optical paths of the laser beams having different wavelengths transmitted;
A beam expander 400 for expanding the inverted laser beam; And
The first pattern is formed by causing interference with each other by the reflection of the extended laser beam and the extended laser beam, and the second pattern is formed by generating a new composite wave by the interference of the waves caused by the different wavelengths. Heterodyne interference lithography apparatus comprising a; generator 500.
And wherein the first pattern is a nano-sized pattern by an interference fringe.
The synthesized wave includes a high frequency component and a low frequency component,
And the second pattern is a micro pattern formed by the low frequency component.
Wherein said different wavelengths are wavelengths that allow for the generation of a double interference frequency.
The polarization beam splitter 200,
A heterodyne interference lithographic apparatus characterized by transmitting a beam of P-polarized light and reflecting a beam of S-polarized light.
The polarization beam splitter 200,
And reflect the inverted laser beam.
The spatial beam separator 300,
And adjusting the intensities of the laser beams having different wavelengths to form various interference fringes according to the adjusted intensities.
The spatial beam separator 300,
Heterodyne interference lithography apparatus, characterized in that for inverting the polarization component of the transmitted laser beam.
Polarizing beam splitter (200) transmitting the laser beam (S620);
Inverting the polarization component of the laser beam transmitted through the spatial beam splitter 300 (S630);
Reflecting the inverted laser beam by the polarization beam splitter (200) (S640); And
The beam expander 400 extends the reflected laser beam (S650);
Forming a first pattern by causing interference with each other by the reflection of the extended laser beam and the extended laser beam, and forming a second pattern by generating a new composite wave by the interference of the waves by the different wavelengths. A pattern forming method using a heterodyne interference lithography apparatus.
The first pattern is a pattern forming method using a heterodyne interference lithography apparatus, characterized in that the nanoscale pattern by the interference fringe.
The synthesized wave includes a high frequency component and a low frequency component,
And the second pattern is a micro pattern formed by the low frequency component.
Wherein the different wavelengths are wavelengths for generating a double interference frequency.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020110084000A KR101229786B1 (en) | 2011-08-23 | 2011-08-23 | Heterodyne interference lithography apparatus, method for drawing pattern using the same device, wafer, and semiconductor device |
PCT/KR2011/009928 WO2013027900A1 (en) | 2011-08-23 | 2011-12-21 | Heterodyne interference lithography apparatus, and method for forming micro-patterns, wafer, and semiconductor device using the apparatus |
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KR1020110084000A KR101229786B1 (en) | 2011-08-23 | 2011-08-23 | Heterodyne interference lithography apparatus, method for drawing pattern using the same device, wafer, and semiconductor device |
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KR1020110084000A KR101229786B1 (en) | 2011-08-23 | 2011-08-23 | Heterodyne interference lithography apparatus, method for drawing pattern using the same device, wafer, and semiconductor device |
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WO (1) | WO2013027900A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101753355B1 (en) | 2016-07-20 | 2017-07-06 | 서울대학교산학협력단 | Laser holographic lithography device and method of manufacturing for pattern |
KR101834917B1 (en) | 2016-09-12 | 2018-03-08 | 한국과학기술원 | Method of Fabricating Nano Dot Pattern and SERS Plate using 4-Beam Laser Interference Lithography |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000111311A (en) | 1998-10-07 | 2000-04-18 | Nikon Corp | Photo-interference length-measuring device and exposing device using the device |
JP2001507870A (en) | 1997-01-21 | 2001-06-12 | ザ ユニバーシティ オブ ニュー メキシコ | Method and apparatus for integrating optical and interference lithography to generate complex patterns |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10281715A (en) * | 1997-04-07 | 1998-10-23 | Nikon Corp | Laser interferometer and stage device |
EP1324136A1 (en) * | 2001-12-28 | 2003-07-02 | ASML Netherlands B.V. | Lithographic projection apparatus and device manufacturing method |
US7791727B2 (en) * | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
-
2011
- 2011-08-23 KR KR1020110084000A patent/KR101229786B1/en not_active IP Right Cessation
- 2011-12-21 WO PCT/KR2011/009928 patent/WO2013027900A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001507870A (en) | 1997-01-21 | 2001-06-12 | ザ ユニバーシティ オブ ニュー メキシコ | Method and apparatus for integrating optical and interference lithography to generate complex patterns |
JP2000111311A (en) | 1998-10-07 | 2000-04-18 | Nikon Corp | Photo-interference length-measuring device and exposing device using the device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101753355B1 (en) | 2016-07-20 | 2017-07-06 | 서울대학교산학협력단 | Laser holographic lithography device and method of manufacturing for pattern |
KR101834917B1 (en) | 2016-09-12 | 2018-03-08 | 한국과학기술원 | Method of Fabricating Nano Dot Pattern and SERS Plate using 4-Beam Laser Interference Lithography |
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